Paper tray bottom foot gluing quality detection method and device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of paperboard processing, in particular to a paper tray bottom foot gluing quality detection method and device, electronic equipment and a storage medium. The method comprises the steps that firstly, bottom feet, flowing out of a first station, of the paper tray are grabbed, and the first station is a bottom foot bonding station; then the paper tray is moved away from the supporting face with the bottom feet as force bearing points and moved to a second station in a vibrating mode, and the procedure corresponding to the second station is the procedure immediately after the procedure corresponding to the first station; meanwhile, a bottom foot gluing state image in the moving process is obtained; and finally, the cementing quality is judged according to the cementing state image. According to the process, the carrying action of the paper tray and the glue joint quality detection are fused, the hidden glue joint defect between the bottom foot and the panel is dominated by means of vibration, an additional detection procedure is not needed, the production process is not interrupted, and the detection efficiency of the paper tray bottom foot bonding quality is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of paperboard processing, and in particular to a paper tray foot bonding quality detection method and device, an electronic device and a storage medium. BACKGROUND

[0002] As an environmentally friendly bearing device with recycled paper as the core raw material, the paper tray is formed by bonding the face plate and multiple feet with adhesive. The face plate and the feet are usually corrugated paperboard or honeycomb paperboard, and the bearing capacity of the paper tray depends on the uniform distribution of the feet to disperse the weight of the goods into multiple independent support points to reduce the stress intensity of the individual feet. The structural reliability of the paper tray depends on the bonding quality of the feet and the face plate.

[0003] In the production process, factors such as the uniformity of the foot coating, the thickness of the adhesive layer, the pressing pressure during bonding, and the curing time may cause fluctuations in the bonding strength. If the feet and the face plate are not firmly bonded, it is easy to cause some feet to separate or tilt, causing the force transmission path to break, concentrating the load on the remaining feet, and easily causing the bearing to collapse.

[0004] Therefore, after the paper tray is assembled, the bonding reliability of the feet and the face plate needs to be confirmed by quality inspection. The existing detection methods are mostly additional processes independent of the production process. Common methods include manual sampling inspection and additional detection equipment. Manual sampling inspection tests the peel strength of the feet manually by a tensile tester, which is low in efficiency. Special detection equipment needs to transfer the paper tray to a special station, apply force by a mechanical arm, and record the deformation data, which is high in cost.

[0005] Therefore, how to improve the detection efficiency of the bonding quality of the paper tray feet is a technical problem to be solved. SUMMARY

[0006] To overcome the problems in the related art, the present application provides a paper tray foot bonding quality detection method, device, electronic device and storage medium, which solves the technical problem of how to improve the detection efficiency of the bonding quality of the paper tray feet in the prior art.

[0007] The first aspect of the present application provides a paper tray foot bonding quality detection method, comprising: S1: grabbing the feet of the paper tray flowing out of a first station, the first station being a foot bonding station; S2: moving the paper tray away from the support surface with the feet as the force point and vibrating to the second station, the second station corresponding to the next process of the process corresponding to the first station; S3: obtaining a foot bonding state image during movement; S4: determining the bonding quality according to the bonding state image.

[0008] In the method of the first possible implementation of the first aspect, the number of the feet grabbed in S1 is N, 1≤N≤M, and M is the total number of the feet of the paper tray.

[0009] In the method of the second possible implementation of the first aspect, in combination with the method of the first possible implementation of the first aspect, when N<M, S2 further includes: S21: during the vibrating movement, when the vibrating duration reaches the preset duration T, other feet are grabbed to replace one or more of the N feet until all the M feet are grabbed.

[0010] In the method of the third possible implementation of the first aspect, in combination with the method of the first possible implementation of the first aspect and the method of the second possible implementation of the first aspect, the N feet are symmetrically distributed or diagonally distributed.

[0011] In the method of the fourth possible implementation of the first aspect, in combination with the method of the first aspect, the method of the first possible implementation of the first aspect, and the method of the second possible implementation of the first aspect, the vibrating amplitude and the vibrating frequency in the vibrating movement are determined according to the number of the grabbed feet.

[0012] In the method of the fifth possible implementation of the first aspect, in combination with the method of the first aspect, the method of the first possible implementation of the first aspect, and the method of the second possible implementation of the first aspect, the grabbing manner includes vacuum-sucking the bottom surface of the feet or clamping the peripheral surface of the feet.

[0013] In the method of the sixth possible implementation of the first aspect, in combination with the method of the first aspect, the method of the first possible implementation of the first aspect, and the method of the second possible implementation of the first aspect, S4 includes: S41: identifying the relative displacement amount between the feet and the panel or the crack width of the glue layer in the gluing state image; S42: if the relative displacement amount or the crack width of the glue layer exceeds a preset threshold, determining that the gluing is failed, otherwise, determining that the gluing is qualified.

[0014] The second aspect of the present application provides a paper tray foot gluing quality detection device for implementing any one of the paper tray foot gluing quality detection methods of claims 1-7, which includes: a grabbing component for grabbing the feet; a vibrating movement component for moving the paper tray from the first station to the second station in a suspended manner and vibrating the paper tray in the process; an image acquisition component for acquiring the foot gluing state image in the movement process; an information processing component for analyzing and processing the foot gluing state image.

[0015] The third aspect of the present application provides an electronic device, comprising: a processor; and a memory having stored thereon an executable code which, when executed by the processor, causes the processor to perform the paper tray foot bonding quality detection method according to any one of claims 1-7.

[0016] The fourth aspect of the present application provides a non-transitory machine-readable storage medium having stored thereon an executable code which, when executed by a processor of an electronic device, causes the processor to perform the paper tray foot bonding quality detection method according to any one of claims 1-7.

[0017] The technical solution provided by the present application can include the following beneficial effects: The present application firstly grasps the foot of the paper tray flowing out from the first station, wherein the first station is a foot bonding station; then moves the paper tray away from the support surface with the foot as the force point and vibrates to move to the second station, wherein the second station corresponds to the next process of the process corresponding to the first station; at the same time, the foot bonding state image in the moving process is obtained; finally, the bonding quality is determined according to the bonding state image. The process integrates the moving operation of the paper tray with the bonding quality detection, and makes the implicit bonding defects between the foot and the panel explicit by means of vibration, which does not need additional detection process and does not interrupt the production process, and effectively improves the detection efficiency of the paper tray foot bonding quality.

[0018] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which like reference characters refer to like parts throughout the several views, and in which:

[0020] Figure 1 is a flow diagram of a paper tray foot bonding quality detection method according to an embodiment of the present application; Figure 2 is another flow diagram of a paper tray foot bonding quality detection method according to an embodiment of the present application; Figure 3 is another flow diagram of a paper tray foot bonding quality detection method according to an embodiment of the present application; Figure 4 is a structural diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present application will be described in more detail with reference to the drawings. Although the preferred embodiments of the present application are shown in the drawings, it is understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0022] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "and / or," as used herein, refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0023] It should be understood that, although the terms "first," "second," "third," etc. can be employed in this application to describe various information, these information should not be limited to these terms. These terms are only used to differentiate one piece of information from another piece of information. For example, a first information can also be referred to as a second information, and similarly, a second information can also be referred to as a first information, without departing from the scope of the present application. Therefore, the features defined with "first," "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited. Embodiments

[0024] The quality of the adhesion of the paper tray foot to the panel can cause the foot to detach or tilt, leading to force collapse, so it is necessary to confirm the reliability of the adhesion. However, the detection methods in the prior art are mostly manual detection or additional processes independent of the production process, which are low in efficiency or high in cost. Therefore, how to improve the detection efficiency of the adhesion quality of the paper tray foot is a technical problem to be solved.

[0025] To solve the above problems, the present embodiment provides a paper tray foot bonding quality detection method.

[0026] The technical solutions of the embodiments of the present application will be described in detail below with reference to the drawings.

[0027] Referring to Figure 1 The present embodiment provides a paper tray foot bonding quality detection method, comprising: S1: grabbing the foot of the paper tray flowing out from the first station, the first station being a foot adhesion station; It should be noted that the bottom foot bonding quality detection method of the embodiment is embedded in the production line, that is, the quality detection is carried out in the process from the first station to the second station, and the quality detection is carried out in the process of moving the paper tray, so that the detection efficiency is improved.

[0028] Specifically, the bottom foot of the paper tray flowing out of the first station is grabbed. The first station is a station on the paper tray production line where the bottom foot is glued to the panel. A pressing device and a curing preliminary processing assembly are usually configured. The bottom foot is attached to the panel through the adhesive layer, and is temporarily fixed after short-time pressing and preliminary curing, but the adhesive layer is not completely cured. Selecting this station as the detection node has two aspects. On the one hand, most of the bonding quality problems have appeared at this stage. On the other hand, since the adhesive layer is not completely cured, if the quality problem is detected, it can be compensated through subsequent trimming process, thereby reducing the scrap rate.

[0029] The bottom foot grabbing refers to an operation of applying a controllable external force to the bottom foot by a mechanical device to separate the bottom foot from the conveying surface and keep it in a stable state. Unlike the prior art, the paper tray is generally grabbed by the panel to move the paper tray, and the embodiment is grabbed by the bottom foot to move the paper tray, and the bonding quality of the bottom foot and the panel is detected during moving away, integrating the moving and detection processes. It should be noted that the bottom foot grabbing process cannot damage the bottom foot result, nor can it interfere with the glued surface. Specifically, in order to make the bottom foot grabbing position more accurate, the position of the bottom foot can be obtained by an infrared detector or an image detection device, and a rectangular coordinate system is established with the geometric center of the paper tray as the origin. The position of the bottom foot is converted into coordinates to control the grabbing device to grab the bottom foot more accurately.

[0030] Preferably, in the actual operation process, since the bottom foot is usually made of corrugated paper, its material has weak tear resistance and the surface has natural concave-convex structure due to the corrugated structure, so that the bottom foot structure is easily damaged when the clamping force is too large during grabbing, and the surface unevenness will cause unstable grabbing positioning, thereby affecting the stability of the subsequent detection or transfer process. In order to solve this problem, in the preferred scheme of the embodiment, the grabbing method includes vacuum suction of the bottom surface of the bottom foot or clamping of the peripheral surface of the bottom foot. It should be noted that the vacuum suction of the bottom surface of the bottom foot refers to the suction of the non-glued surface of the bottom foot by a negative pressure suction cup, and the atmospheric pressure is used to realize stable grabbing. This method has no mechanical contact pressure, and can avoid deformation caused by clamping stress around the bottom foot. The clamping of the peripheral surface of the bottom foot refers to the application of symmetrical pressure to the bottom foot from the side surface by one or more pairs of clamping jaws, and the bottom foot is fixed by using friction. This method is suitable for the case where the bottom surface of the bottom foot is uneven, or the weight of the bottom foot is large.

[0031] Preferably, in actual operation, if a suction cup or a gripper is configured for each foot, the hardware cost of the grabbing device will increase significantly; and paper tray carrying practice shows that stable carrying can be achieved by grabbing a few points, and independent grabbing of all feet is not necessary. Therefore, how to optimize the configuration mode of the grabbing assembly to reduce the cost of the detection equipment is a technical problem to be solved. In order to solve the technical problem, the number of feet grabbed in the embodiment S1 is N, 1≤N≤M, and M is the total number of feet of the paper tray. It should be noted that N is the grabbing number, which refers to the number of feet selected and grabbed from all the feet of the paper tray, and its value range is 1≤N≤M, wherein 1 is the minimum detection unit, because at least one foot needs to be grabbed to carry the weight of the tray and implement vibration, and M is the maximum value, i.e. grabbing all feet. M is determined by the rules of the paper tray, for example, M=4 for light trays, M=6 for medium trays, and M=8 for heavy trays.

[0032] S2: carrying the paper tray away from the support surface with the feet as the force point, and vibrating to the second station, the second station corresponding to the next process of the process corresponding to the first station; It should be noted that in order to realize the integration of detection and carrying process and ensure the sufficiency of detection, the paper tray needs to be carried away from the support surface with the feet as the force point, and vibrated to the second station. Among them, the feet as the force point means that the contact point between the grabbing assembly and the feet is selected as the force point, and the upward force is applied by the grabbing assembly to make the tray separate from the support surface. It is worth noting that the feet are selected instead of the panel as the force point in order to simulate the stress state of the feet under external force, expose potential bonding defects, and make the detection result more consistent with the actual use scenario. The support surface is the conveying table surface of the first station, such as a belt conveyor, a metal tray, etc., which is used to carry the paper tray to be detected.

[0033] The vibration movement refers to that after the tray is separated from the supporting surface, a periodic external force is applied through the vibration device while maintaining the translational movement to the second station, so that the paper tray generates controllable vibration. The alternating stress generated by vibration can make the virtual bonding between the bottom foot and the panel and the thin glue layer become explicit, thereby ensuring the detection sufficiency. Specifically, the vibration movement includes horizontal and vertical vibration, which can be performed in sequence or simultaneously as compound vibration. The horizontal vibration can simulate the lateral force received by the paper tray during the handling process to detect the bonding stability of the bottom foot and the panel under the action of shear stress. The vertical vibration simulates the vertical impact force during loading to test the anti-peeling ability of the bonding surface. Through bidirectional vibration, potential bonding defects are exposed from two dimensions of horizontal and vertical directions. The vibration parameters include vibration frequency and vibration amplitude. The specific vibration frequency and vibration amplitude are determined according to actual requirements. For example, the vibration amplitude and vibration frequency can be determined according to the size and load-bearing requirement of the paper tray. For small and light trays, a vibration frequency of 10-20 Hz and a vibration amplitude of 0.5-1 mm can be used. For large and heavy trays, the frequency needs to be increased to 30-50 Hz and the amplitude needs to be increased to 2-3 mm.

[0034] The second station is a station immediately after the first station in the production process, including a production process connection station and a rework station. For the paper tray that passes the detection, it is usually a glue curing station or an appearance finishing station, so as to realize direct entering into the next production link after detection. For the paper tray that is determined to be unqualified, the second station further includes a rework station, such as a disassembly station for separating virtual bonding or offset bottom foot, a secondary pressure station for re-pressing after glue supplementing, etc. The differential diversion ensures that the unqualified products are reworked in time, avoids flowing into the subsequent process, and maintains the continuity of the production process.

[0035] Preferably, in the actual operation process, in the paper tray bottom foot bonding quality detection, if full-point independent grabbing detection is used, although the quality of all bottom feet can be screened, the hardware cost is significantly increased. If only a few point positions are used for grabbing detection, it is difficult to cover all bottom feet, potential bonding defects may be missed, and the detection comprehensiveness and the quality of the final product are affected. Therefore, referring to Figure 2In the preferred embodiment of the present embodiment, when N < M, S2 further comprises: S21: during the vibration movement, when the vibration duration reaches the preset duration T, the other feet are grabbed to replace one or more of the N feet until all M feet are grabbed. It should be noted that the preset duration T refers to the time during which a single grabbing combination remains in the grabbing state during the vibration movement, and needs to ensure that the N feet being grabbed experience sufficient vibration cycles to expose defects. The value of T is positively correlated with the vibration frequency, for example, when the qualified vibration cycle is 10 times, T = 10 / f, f is the vibration frequency, when f = 3Hz, T = 3.3s. Replacement refers to removing one or more from the N feet that have been grabbed during the vibration movement, while grabbing the undetected feet, for example, when M = 4, N = 2, feet 1 and 3 are grabbed for the first time, and feet 2 and 4 are replaced after T time to ensure that all feet are detected. It should be noted that the replacement process is not simultaneous replacement, when there are multiple replacements, multiple feet can be replaced in sequence to keep the paper tray stable during the detection and removal process. In addition, when N = 1, only one foot is detected at a time, and if only the grabbing device used for detection is used to remove the paper tray, it will cause the single stress point and cannot be replaced. Therefore, the paper tray needs to be stabilized by an auxiliary removal device, which can use a method of clamping the edge of the panel or adsorbing the non-glued area of the panel to assist in removing the paper tray.

[0036] Preferably, in actual operation, when the area of the paper tray is large, the grabbing position has a greater impact on the overall center distribution and force balance. If the grabbing position deviates to one side, it will destroy the force balance of the paper tray, causing it to tilt to one side during the removal of the support surface and the vibration movement. The tilting process may cause the feet and the panel to separate due to the oblique pulling force on the glued surface between the feet and the panel. In order to solve this technical problem, the preferred embodiment provided by the present embodiment is that the N feet are symmetrically distributed or diagonally distributed. It should be noted that symmetric distribution means that the N feet grabbed are symmetrically arranged with the geometric center of the paper tray as the symmetric point, for example: when M = 6, N = 4, the 6 feet are arranged in a 2*3 rectangular distribution, and (1,1) and (1,3), (3,1) and (3,3) are grabbed, forming 2 pairs of symmetric feet. Diagonal distribution means that the N feet grabbed are located on the two diagonals of the paper tray, forming a cross support structure. For example, when M = 8, N = 4, (1,1), (1,4), (2,1), and (2,4) are grabbed. It should be noted that symmetric distribution and diagonal distribution are not mutually exclusive, and when the grabbed feet start to be replaced during the detection process, the two can be replaced to preferentially grab the undetected feet as the target.

[0037] Preferably, in actual operation, when the number of grabbed bottom feet is small, the overall hanging stability of the paper tray is weak, and if the vibration amplitude is too large or the frequency is too high, the paper tray is prone to falling off from the grabbing assembly due to unbalanced inertial force, which not only interrupts the detection process, but also may cause damage to the paper tray; when the number of grabbed bottom feet is large, the paper tray can be stably hung, but if the vibration amplitude is too small or the frequency is too low, it is difficult to simulate the stress impact in actual loading, and it is difficult to fully expose the potential defects of the weakly bonded part, resulting in distorted detection results. In order to solve the technical problem, the embodiment provides a preferred solution, and the vibration amplitude and vibration frequency in the vibration movement process are determined according to the number of grabbed bottom feet. It should be noted that: the vibration amplitude refers to the maximum distance of the bottom feet from the balance position in the vibration movement process of the paper tray. The vibration frequency refers to the number of cycles per unit time. Specifically, first, the number N of grabbing is obtained; then the vibration parameters are matched according to the number N of grabbing, and the matching mode can be to retrieve from a preset parameter library or to calculate through a large model; then the vibration parameters are dynamically corrected; finally, the vibration duration is adjusted through the vibration parameters. By controlling the vibration parameters through the number of grabbing, the paper tray will not fall off due to vibration during the detection and moving process, and will not be detected insufficiently due to insufficient vibration.

[0038] S3: Obtain a bottom foot bonding state image in the movement process; It should be noted that: this step captures the dynamic changes of the bonding surface in real time in the vibration movement process, and converts the quality defects into quantifiable information. The bottom foot bonding state image refers to the visual information captured by the image acquisition device reflecting the state of the bonding interface between the bottom foot and the panel.

[0039] The acquisition in the movement process refers to the synchronous acquisition of the image in the vibration movement process of the paper tray from the first station to the second station. It is worth noting that the process of acquiring the image is dynamic and continuous, and the image of the bottom foot bonding state is continuously acquired from the moment the paper tray leaves the support surface. Since vibration is accompanied in the movement process, the tray movement speed and vibration parameters need to be matched during acquisition to ensure that the image is clear and free of motion blur.

[0040] Specifically, the step of acquiring the image is, first, arranging the image acquisition points, which can be set along the movement path, or a stabilizer can be provided on the grabbing device to follow the grabbing, and the acquisition direction is inclined to align with the bonding layer to ensure that images of the bonding layer in multiple directions can be acquired; then the device parameters are adjusted according to the movement speed and vibration parameters, and acquisition is performed; then the acquired images are only pre-processed, corrected and denoised; finally, the acquired images are stored and transmitted.

[0041] S4: Determine the bonding quality according to the bonding state image.

[0042] It should be noted that: the step of determining the bonding quality according to the bonding state image, and the visual information in the bonding state image is converted into a quantifiable quality conclusion. Among them, the bonding quality judgment refers to the process of judging whether the foot and the panel are qualified by analyzing the characteristic parameters in the bonding state image and comparing with the preset standard, and the judgment result is divided into two kinds: "bonding qualified" and "bonding failure".

[0043] Specifically, the step of determining the bonding quality according to the bonding state image includes: first, extracting image features from the bonding state image, for example, using machine vision algorithm to extract core features, including: geometric features, such as the relative displacement amount of the foot and the panel; structural features, such as the crack situation and bubble situation of the glue layer; texture features, such as the uniformity of the glue layer distribution, whether there is a local defect area; then match the extracted image features with the preset threshold, the preset threshold is set according to the type of tray, the threshold value can be obtained through the test database, or it can be calculated by algorithm, for example, the quality threshold of light tray is displacement ≤0.3mm, crack ≤0.1mm, bubble ratio ≤8%; then the quality is judged by comparing the image features and the threshold matching, when all the features are ≤ the corresponding threshold, it is judged as bonding qualified; if any feature is > threshold, it is judged as bonding failure, and the failure reason is marked. Finally, according to the judgment result, it is transmitted to the production line control system in real time, the qualified paper tray flows into the next process, and the failure tray triggers the diversion.

[0044] Preferably, in the actual operation process, the stress scene of the paper tray mainly includes two types: in the process of carrying, mainly bearing the transverse shear force, which is easy to cause the slip or tilt between the foot and the panel along the bonding surface; in the process of bearing, mainly bearing the vertical pressure, which is easy to cause the peeling of the bonding surface or the structural deformation of the foot. Therefore, referring to Figure 3 , in the preferred scheme provided by the embodiment, S4 includes: S41: identifying the relative displacement amount between the foot and the panel or the crack width of the glue layer in the bonding state image; It should be noted that: the relative displacement amount refers to the position displacement amount of the foot and the panel at the junction, which is measured based on the alignment line of the foot edge and the foot position, including the transverse displacement along the length direction of the tray and the longitudinal displacement along the width direction of the tray, and the maximum value is taken as the judgment basis. For example: the right edge of the foot is offset to the left by 0.25mm relative to the reference alignment line, that is, the transverse displacement is 0.25mm. The crack width of the glue layer refers to the maximum transverse size of the gap formed by the crack of the glue layer at the bonding interface, which is used to evaluate the integrity of the glue layer structure. In the measurement process, the interference such as the wrinkle on the surface of the glue layer, the edge of the bubble and the like is discharged, and only the area where the glue layer is completely separated is measured, including the edge crack and the middle crack.

[0045] S42: if the relative displacement amount or the crack width of the glue layer exceeds the preset threshold, it is judged as bonding failure, otherwise it is judged as bonding qualified.

[0046] It should be noted that the preset threshold refers to the critical value of the preset relative displacement and the crack width of the glue layer, which is the standard for judging the bonding quality. The preset threshold is generally determined according to the type of the paper tray. With the increase of the load and transportation weight, the preset threshold will also be higher. For example, when the paper tray is a light tray, the preset standard is a relative displacement threshold of 0.3mm and a crack width threshold of the glue layer of 0.1mm; for a medium tray, the relative displacement threshold is 0.2mm and the crack width threshold of the glue layer is 0.08mm; for a heavy tray, the relative displacement threshold is 0.1mm and the crack width threshold of the glue layer is 0.05mm. The bonding aging refers to the bonding quality of the foot and the panel not meeting the preset standard, which has risks in subsequent use. The bonding qualified refers to the bonding quality of the foot and the panel meeting the preset standard, which can meet the requirements of subsequent use.

[0047] The beneficial effects of the embodiment are: The embodiment first grasps the foot of the paper tray flowing out of the first station, wherein the first station is a foot bonding station. Then the foot is used as a force point to move the paper tray away from the support surface and vibrate to the second station, wherein the second station corresponds to the next process of the process corresponding to the first station. At the same time, the foot bonding state image in the moving process is obtained. Finally, the bonding quality is determined according to the bonding state image. This process integrates the moving process of the paper tray with the bonding quality detection, and makes the implicit bonding defects between the foot and the panel explicit by means of vibration. It does not need additional detection process and does not interrupt the production process, and effectively improves the detection efficiency of the paper tray foot bonding quality. Embodiment

[0048] The embodiment provides a paper tray foot bonding quality detection device for implementing the paper tray foot bonding quality detection method provided in the foregoing embodiment, which comprises: A grabbing component is used to grab the foot. Specifically, the grabbing component comprises a driving module, an execution module and a sensing module. The driving module comprises a servo motor and a ball screw. The execution module can be a vacuum chuck group or a pneumatic jaw group according to different grabbing modes. The sensing module comprises multiple position sensors.

[0049] A vibration moving component is used to move the paper tray from the first station to the second station in a suspended manner and drive the paper tray to vibrate in the process. Specifically, the vibration moving component comprises a lifting module, a vibration module, a translation module and a balancing module.

[0050] An image acquisition component is used to acquire the foot bonding state image in the moving process. Specifically, the image acquisition component comprises an industrial camera, a light source, a lens and a synchronous controller. The core function is to collect clear bonding state images in the vibration moving process.

[0051] The information processing component is used to analyze and process images of the bonding status of the base plates. Specifically, the information processing component includes an image processing module, a judgment module, a storage module, and a linkage module. Example

[0052] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated further here.

[0053] Figure 4 This is a schematic diagram of the structure of an electronic device shown in an embodiment of this application.

[0054] See Figure 4 The electronic device 1000 includes a memory 1010 and a processor 1020.

[0055] The processor 1020 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0056] The memory 1010 can include various types of storage units such as a system memory, a read-only memory (ROM), and a permanent storage device. Among them, the ROM can store static data or instructions required by the processor 1020 or other modules of the computer. The permanent storage device can be a rewritable storage device. The permanent storage device can be a non-volatile storage device that does not lose stored instructions and data even after the computer is powered off. In some embodiments, the permanent storage device uses a mass storage device (such as a magnetic or optical disk, a flash memory) as a permanent storage device. In some other embodiments, the permanent storage device can be a removable storage device (such as a floppy disk, an optical drive). The system memory can be a readable and writable storage device or a volatile readable and writable storage device, such as a dynamic random access memory. The system memory can store some or all instructions and data required by the processor during runtime. In addition, the memory 1010 can include a combination of any computer readable storage media, including various types of semiconductor storage chips (DRAM, SRAM, SDRAM, flash memory, programmable read-only memory), magnetic disks and / or optical disks. In some embodiments, the memory 1010 can include a readable and / or writable removable storage device, such as a compact disc (CD), a read-only digital versatile disc (such as DVD-ROM, double-layer DVD-ROM), a read-only Blu-ray disc, an ultra-density optical disc, a flash memory card (such as an SD card, a min SD card, a Micro-SD card, etc.), a magnetic floppy disk, etc. The computer readable storage medium does not include a carrier wave and a transient electronic signal transmitted through wireless or wired transmission.

[0057] The memory 1010 stores executable code, which, when processed by the processor 1020, can cause the processor 1020 to perform part or all of the above-mentioned methods.

[0058] The solutions of the present application have been described in detail above with reference to the accompanying drawings. In the above-described embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments. It should also be appreciated by those skilled in the art that the actions and modules involved in the specification are not necessarily required by the present application. In addition, it can be understood that the steps in the method embodiments of the present application can be adjusted, combined and reduced in sequence according to actual needs, and the modules in the device embodiments of the present application can be combined, divided and reduced according to actual needs.

[0059] In addition, the method according to the present application can also be implemented as a computer program or a computer program product, which includes computer program code instructions for performing part or all of the steps of the above-mentioned methods of the present application.

[0060] Alternatively, the application can also be implemented as a non-transitory machine readable storage medium (or computer readable storage medium, or machine readable storage medium) on which an executable code (or computer program, or computer instruction code) is stored, and when the executable code (or computer program, or computer instruction code) is executed by a processor of an electronic device (or electronic device, server, etc.), the processor is caused to perform part or all of the steps of the above method according to the application.

[0061] Those skilled in the art will further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the present disclosure can be implemented as electronic hardware, computer software, or combinations of both.

[0062] The flow diagrams and block diagrams in the drawings are presented to illustrate the architecture, functionality, and operations of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in the flow diagrams and block diagrams can represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently or the blocks may be executed in the reverse order, depending on the functionality involved. It will also be noted that each block of the block diagrams and / or flowchart illustrations, and combinations thereof, can be implemented by special purpose hardware-based systems that perform the specified functions or operations, or combinations of special purpose hardware and computer instructions.

[0063] The embodiments of the present application have been described above, the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles, practical applications, or improvements to the technology in the market of the embodiments, or to enable other ordinary skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method for inspecting the bonding quality of paper pallet bottom feet, characterized in that, include: S1: Grab the bottom of the paper tray flowing out from the first station, which is the bottom bonding station; S2: Using the base as the force point, move the paper tray away from the support surface and vibrate it to the second station. The process corresponding to the second station is the immediate successor of the process corresponding to the first station. S3: Acquire an image of the adhesive bonding status of the base during the movement; S4: Determine the bonding quality based on the bonding status image.

2. The method for detecting the bonding quality of the bottom edge of a paper pallet according to claim 1, characterized in that: The number of feet grasped in S1 is N, 1≤N≤M, where M is the total number of feet on the paper tray.

3. The method for detecting the bonding quality of the bottom edge of a paper pallet according to claim 2, characterized in that, When N < M, S2 also includes: S21: During the vibration movement, when the vibration duration reaches the preset duration T, other feet are grabbed to replace one or more of the N feet, until all M feet have been grabbed.

4. A method for detecting the bonding quality of the bottom edge of a paper pallet according to claim 2 or 3, characterized in that: The N bases are distributed symmetrically or diagonally.

5. A method for detecting the bonding quality of the bottom edge of a paper pallet according to any one of claims 1 to 3, characterized in that: The vibration amplitude and frequency during the vibration movement process are determined based on the number of feet being gripped.

6. A method for detecting the bonding quality of the bottom edge of a paper pallet according to any one of claims 1 to 3, characterized in that: The gripping methods include vacuum adsorption of the bottom surface of the foot or clamping the circumference of the foot.

7. A method for detecting the bonding quality of paper pallet bottoms according to any one of claims 1 to 3, characterized in that, S4 include: S41: Identify the relative displacement between the base and the panel or the width of the adhesive layer crack in the adhesive bonding state image; S42: If the relative displacement or the width of the adhesive layer crack exceeds a preset threshold, the bonding is deemed to have failed; otherwise, the bonding is deemed to have passed.

8. A device for detecting the bonding quality of paper pallet bases, characterized in that, A method for detecting the bonding quality of the bottom edge of a paper pallet as described in any one of claims 1-7 includes: The grabbing component is used to grab the bottom feet; A vibrating moving component is used to move the paper pallet from the first station to the second station in a suspended manner, and to drive the paper pallet to vibrate during the process. Image acquisition component, used to acquire images of the bonding status of the base during the movement process; Information processing component for analyzing and processing images of the base bonding status.

9. An electronic device, characterized in that, include: processor; as well as A memory having executable code stored thereon, which, when executed by the processor, causes the processor to perform the paper pallet bottom adhesive bonding quality detection method as described in any one of claims 1-7.

10. A non-transitory machine-readable storage medium having executable code stored thereon, which, when executed by a processor of an electronic device, causes the processor to perform the paper pallet bottom adhesive bonding quality inspection method as described in any one of claims 1-7.

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