Test fixture and test system for semiconductor laser

Abstract

The invention relates to a test fixture and a test system for a semiconductor laser, and is applied to the field of laser testing. The device comprises a heat dissipation assembly and a test assembly, the heat dissipation assembly comprises a heat conduction piece and a refrigeration piece, the refrigeration piece comprises a refrigeration sheet and a heat dissipation part, and the refrigeration sheet is connected between the heat conduction piece and the heat dissipation part; the testing assembly comprises a shell connected to the heat dissipation assembly and a testing socket used for installing the semiconductor laser, an installing groove is formed in the shell in a penetrating mode, and the testing socket is installed in the installing groove in a sliding mode so that the semiconductor laser can make contact with the heat conduction piece. According to the invention, the heat conduction member is in direct contact with the laser housing, so that base suspension thermal resistance caused by pin bending is eliminated; a complex water cooling system is replaced by solid active refrigeration through a refrigeration piece integrating a refrigeration sheet and a heat dissipation part; and finally, the insertion depth of the laser is adaptively adjusted through a sliding mounting structure of the test socket in the mounting groove, so that the shell is tightly attached to the heat conduction piece, and the high-reliability test of the semiconductor laser is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser testing, and particularly relates to a test fixture for semiconductor lasers and a test system. BACKGROUND

[0002] Semiconductor lasers have the advantages of small size, high efficiency, fast response speed and long service life, and are widely used in the fields of laser display, industrial processing and data storage. With the increasing demand of the industry for high-quality laser manufacturing, semiconductor lasers are developing towards higher power density and lower energy consumption.

[0003] With the increase of the power of semiconductor lasers, the heat effect of the devices is more serious, and the heat dissipation capacity and reliability also need to be continuously improved. In the related technology, the high-power TO packaged semiconductor laser is mainly tested by the water cooling heat dissipation mode. A water flow channel is designed on the TO packaging base to take away the heat of the chip.

[0004] The above water cooling structure has greatly improved compared with natural convection heat dissipation, but still has the disadvantages of uneven temperature distribution and complex test system. SUMMARY

[0005] Therefore, it is necessary to provide a test fixture for semiconductor lasers and a test system to solve the problems of uneven heat dissipation and complex test system of the semiconductor lasers.

[0006] In a first aspect, the present application provides a test fixture for semiconductor lasers, which adopts the following technical scheme:

[0007] The test fixture for semiconductor lasers comprises a heat dissipation assembly and a test assembly. The heat dissipation assembly comprises a heat conduction piece and a refrigeration piece. The heat conduction piece is used to contact the shell of the semiconductor laser, and the refrigeration piece is used to cool the heat conduction piece. The refrigeration piece comprises a refrigeration sheet and a heat dissipation part. In a first direction, the refrigeration sheet is connected between the heat conduction piece and the heat dissipation part. The test assembly comprises a shell and a test socket. The shell is connected to the heat dissipation assembly, and the test socket is used to mount the semiconductor laser. In the first direction, a mounting groove is provided through the shell, and the test socket is slidingly mounted in the mounting groove, so that the semiconductor laser can be in contact with the heat conduction piece.

[0008] In one of the embodiments, each refrigeration piece comprises a plurality of refrigeration sheets. All the refrigeration sheets are arranged in an array and are clamped between the heat conduction piece and the heat dissipation part.

[0009] In one of the embodiments, the surface of the refrigeration sheet is coated with a heat-conducting silicone grease.

[0010] In one of the embodiments, the refrigerating members are arranged in two and are spaced apart along the second direction, and the refrigerating members and the heat conducting member define a receiving space therebetween, and the test assembly is capable of being inserted into the receiving space along the first direction; and the second direction is perpendicular to the first direction.

[0011] In one of the embodiments, the test fixture further comprises a fixing member connected between the test assembly and the heat dissipating assembly along the second direction, for detachably mounting the test assembly to the heat dissipating assembly.

[0012] In one of the embodiments, the heat conducting member is provided with an insertion groove on the side close to the receiving space, the insertion groove is used for accommodating the semiconductor laser, and the inner wall of the insertion groove is capable of contacting the surface of the housing of the semiconductor laser.

[0013] In one of the embodiments, the heat conducting member is provided with a light emitting channel penetrating through the heat conducting member along the first direction, and the light emitting channel is communicated with the insertion groove.

[0014] In one of the embodiments, the test socket comprises a seat body and an electric connecting member, the seat body is provided with a socket for accommodating the pins of the semiconductor laser, the electric connecting member comprises an electrode and a plurality of conductive springs, the electrode is mounted on the seat body and is used for externally connecting a power supply, and the conductive springs are arranged in the socket and are electrically connected to the electrode; wherein, from the top end to the bottom end of the socket, the spacing between the conductive springs gradually decreases, for collectively clamping the pins of the semiconductor laser.

[0015] In one of the embodiments, the test assembly further comprises a damping guide rail arranged in the mounting groove, the damping guide rail extends along the first direction, and the test socket is slidingly connected to the housing by means of the damping guide rail.

[0016] In the second aspect, the application provides a test system, which adopts the following technical scheme:

[0017] A test system comprises a power supply and the test fixture for semiconductor laser as described above, and the power supply is capable of being electrically connected to the test socket of the test fixture and supplying power to the test fixture.

[0018] The test fixture for semiconductor laser described above directly contacts the laser shell through the heat conduction member, eliminates the base overhanging thermal resistance caused by the pin bending; secondly, the refrigeration member of the integrated refrigeration sheet and the heat dissipation part is used to replace the complex water cooling system with solid active refrigeration; finally, through the sliding installation structure of the test socket in the installation groove, the laser insertion depth is self-adaptively adjusted, the shell and the heat conduction member are tightly attached, the heat dissipation thermal resistance is reduced, the temperature uniformity is improved, the system volume is reduced, and the high-reliability test of the semiconductor laser is realized. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a perspective structural schematic view of the test fixture in an embodiment of the present application.

[0020] Figure 2 It is a perspective structural view of the heat dissipation assembly in an embodiment of the present application.

[0021] Figure 3 It is a cross-sectional schematic view of the heat dissipation assembly in an embodiment of the present application.

[0022] Figure 4 It is an assembly schematic view of the test assembly and the semiconductor laser in an embodiment of the present application.

[0023] Figure 5 It is a partial cross-sectional view of the test assembly in an embodiment of the present application.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1, heat dissipation assembly; 11, heat conduction member; 111, fitting groove; 112, light outlet channel; 12, refrigeration member; 121, refrigeration sheet; 122, heat dissipation part; 2, test assembly; 21, shell; 211, installation groove; 22, test socket; 221, seat body; 2211, insertion hole; 222, electric connection member; 2221, electrode; 2222, conductive spring piece; 23, damping guide rail; 3, containing interval; 4, fixing member; 5, semiconductor laser; F1, first direction; F2, second direction. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the application, it should be understood that, if there are these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0028] In addition, if there are these terms "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this application, unless otherwise explicitly specified and limited, if there are terms such as "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0030] In this application, unless otherwise explicitly specified and limited, if there are similar descriptions such as "first feature on or under second feature", the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0031] It is to be noted that if an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or there can be an intervening element. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used herein are used only for the purpose of illustration and do not indicate the only possible orientation.

[0032] With the increase of the power of semiconductor lasers, the thermal effect of the device is more serious, and higher requirements are put forward for its heat dissipation capacity and reliability. At present, the high-power TO packaged semiconductor laser is mainly tested by water cooling heat dissipation. The water flow channel is designed on the TO package base to take away the heat of the chip. Compared with natural convection heat dissipation, this water cooling structure has greatly improved, but it still has the disadvantages of uneven temperature distribution and complex test system.

[0033] In addition, due to the slender TO pin, it is not easy to align and insert into the small-aperture TO socket for power-on test, and the TO pin is prone to bending or even breaking after multiple tests. For the photoelectric test problem of high-power TO packaged semiconductor lasers, the problems of device heat dissipation and electrical connection stability need to be solved.

[0034] Therefore, the application provides a test fixture and a test system for semiconductor lasers. The following will be described in detail with reference to the accompanying drawings. Figures 1-4 The embodiments of the application will be described in detail. Among them, Figure 1 As shown in the figure, the "first direction" is defined as the up-down direction of the test fixture, and the "second direction" is defined as the left-right direction of the test fixture, and the second direction is perpendicular to the first direction. Figure 1

[0035] Referring to Figure 1 , Figure 1 The application provides a test fixture for semiconductor lasers, specifically a test fixture for high-power TO (Transistor Outline) packaged semiconductor lasers. The test fixture includes a heat dissipation assembly 1 and a test assembly 2 that are embedded in each other along a first direction F1.

[0036] The test assembly 2 is used to mount the semiconductor laser 5. After the heat dissipation assembly 1 and the test assembly 2 are embedded in each other, the semiconductor laser 5 can be in contact with the heat dissipation assembly 1 under the driving of the test assembly 2, so as to realize the cooling operation of the semiconductor laser 5.

[0037] Combined with Figure 2 , Figure 2 ​A perspective view of a heat dissipation assembly in an embodiment of the present application is shown. The heat dissipation assembly 1 includes a heat conducting member 11 and a refrigeration member 12 arranged in sequence from top to bottom along a first direction F1. The heat conducting member 11 is a heat conducting plate for contacting the shell of the semiconductor laser 5. The refrigeration member 12 includes a refrigeration sheet 121 and a heat dissipation part 122. Along the first direction F1, the refrigeration sheet 121 is connected between the heat conducting member 11 and the heat dissipation part 122.

[0038] In an embodiment of the present application, the refrigeration sheet 121 is specifically a semiconductor refrigerator TEC (Thermoelectric cooler) configured in a sheet shape. Along the first direction F1, the refrigeration sheet 121 includes oppositely arranged cold and hot surfaces. The cold surface is used to conform to the end surface of the heat conducting member 11 to continuously cool the heat conducting member 11. The hot surface is used to conform to the end surface of the heat dissipation part 122 and dissipate heat through the heat dissipation part 122.

[0039] In actual testing, the heat generated by the semiconductor laser 5 is transmitted to the refrigeration sheet 121 through the heat conducting member 11. The cold surface of the refrigeration sheet 121 conforms to the end surface of the heat conducting member 11 and absorbs heat to cool the semiconductor laser 5. The hot surface of the refrigeration sheet 121 conforms to the end surface of the heat dissipation part 122 and accelerates heat dissipation through the heat dissipation part 122. In actual testing, the heat generated by the semiconductor laser 5 during testing is conducted from the heat conducting member 11 to the heat dissipation part 122. The refrigeration amount can be changed simply by controlling the positive and negative input currents of the refrigeration sheet 121. In an embodiment of the present application, the heat dissipation part 122 can be specifically a copper block.

[0040] In other embodiments, each refrigeration member 12 includes a plurality of refrigeration sheets 121. All the refrigeration sheets 121 are arranged in an array and clamped between the heat conducting member 11 and the heat dissipation part 122. In actual testing, at least a part of the refrigeration sheets 121 is selected to start according to actual testing requirements to meet the actual cooling requirements of the semiconductor laser 5 and save energy. The array arrangement of the plurality of refrigeration sheets 121 shown in the present application can enhance the temperature control performance of the overall test fixture and replace the complex water cooling system with solid-state active refrigeration, so that the overall system has a small volume and is easy to integrate.

[0041] In some embodiments, the cold and hot surfaces of the refrigeration sheet 121 are uniformly coated with a heat-conducting silicone grease to eliminate the micro air gap between the cold surface of the refrigeration sheet 121 and the end surface of the heat conducting member 11 and between the hot surface of the refrigeration sheet 121 and the end surface of the heat dissipation part 122, establish an efficient heat conduction path, and thus improve the heat conduction efficiency.

[0042] Specifically, the heat-conducting silicone grease coated on the cold surface is used to accelerate the heat transfer of the semiconductor laser 5 to the cold surface of the cooling fin 121, so as to avoid the heat accumulation leading to the temperature rise of the semiconductor laser 5 out of control; the heat-conducting silicone grease coated on the hot surface is used to promote the waste heat generated by the cooling fin 121 to be quickly introduced into the heat dissipation part 122, so as to prevent the cooling fin 121 from being damaged due to overheating.

[0043] Referring to Figure 1 and Figure 3 , it is shown that Figure 3 a cross-sectional view of a heat dissipation assembly in an embodiment of the present application is shown. In some embodiments, the cooling part 12 is provided with two cooling parts 12 and is arranged at intervals along the second direction F2, and the two cooling parts 12 and the heat-conducting part 11 define a containing interval 3 for containing the test assembly 2. The test assembly 2 can be fitted into the containing interval 3 along the first direction F1 to realize the assembly operation with the heat dissipation assembly 1.

[0044] In the embodiment of the present application, on the one hand, the provision of the two cooling parts 12 helps to improve the heat dissipation efficiency of the heat dissipation assembly 1, thereby improving the cooling effect on the semiconductor laser 5. On the other hand, the containing interval 3 for containing the test assembly 2 is defined between the two cooling parts 12, which can also realize the limitation of the position of the test assembly 2 in the second direction F2, so as to avoid the abnormal movement of the semiconductor laser 5 during the test process.

[0045] In other embodiments, the heat-conducting part 11 is provided with a fitting groove 111 on the side close to the containing interval 3, the fitting groove 111 is used to contain the semiconductor laser 5, and the inner wall of the fitting groove 111 can be in contact with the surface of the shell of the semiconductor laser 5, preferably abutting each other. Specifically, the fitting groove 111 is an inner recessed stepped groove, and the fitting groove 111 designed with the inner recess for the shell 21 of the semiconductor laser 5 makes the top and side wall of the shell 21 of the semiconductor laser 5 closely contact with the heat-conducting part 11, so as to increase the contact area between the heat-conducting part 11 and the semiconductor laser 5, thereby improving the heat-conducting and heat-dissipating effect.

[0046] Continuing to refer to Figure 1 and Figure 3 , in some embodiments, the heat-conducting part 11 also has a light emitting passage 112, the light emitting passage 112 can penetrate through the heat-conducting part 11 along the first direction F1 and is communicated with the above-mentioned fitting groove 111. As shown in the present application, the light emitting passage 112 is provided corresponding to the laser emitting port of the semiconductor laser 5. During actual test, the semiconductor laser 5 is installed on the test assembly 2 and closely contacts with the heat-conducting part 11 to realize the cooling and heat-dissipating operation of the semiconductor laser 5, and the laser is emitted from the light emitting passage 112 of the heat-conducting part 11.

[0047] Referring to Figure 1As shown, further, in some embodiments, the test fixture further comprises a fixing member 4, which is sequentially arranged between the heat dissipation assembly 1 and the test assembly 2 along the second direction F2, so as to detachably mount the test assembly 2 on the heat dissipation assembly 1, to fix the relative position of the test assembly 2 and the heat dissipation assembly 1 in the first direction F1, to avoid the test assembly 2 from being pulled out of the accommodating interval 3 during the test, and to improve the test stability.

[0048] In the embodiments of the present application, the fixing member 4 can be specifically any one of a hand screw, a pin, or a fixing bolt, and is preferably a hand screw arranged between the test assembly 2 and the heat dissipation assembly 1. Figure 1 and Figure 2 As an example, the heat dissipation part 122 is provided with a threaded hole (not labeled) for the fixing member 4 to pass through along the second direction F2, and the threaded end of the fixing member 4 can pass through the heat dissipation part 122 through the threaded hole and abut against the test assembly 2, to fix the position of the test assembly 2 in the first direction F1.

[0049] In combination with Figure 1 and Figure 4 As shown, Figure 4 An assembly schematic diagram of the test assembly and the semiconductor laser in an embodiment of the present application is shown. In some embodiments, the test assembly 2 comprises a housing 21 and a test socket 22, wherein the housing 21 can be inserted into the above-mentioned accommodating interval 3 along the first direction F1 and used to connect the heat dissipation assembly 1, and the test socket 22 is used to mount the semiconductor laser 5. Along the first direction F1, the housing 21 is provided with a mounting groove 211 penetrating one side wall thereof, and the test socket 22 is slidingly mounted in the mounting groove 211, so that after the semiconductor laser 5 is assembled to the test socket 22, the semiconductor laser 5 can be moved along the first direction F1 under the driving of the test socket 22 until the semiconductor laser 5 is adaptively fitted into the fitting groove 111, to adaptively adjust the insertion depth of the semiconductor laser 5, to realize the close fitting between the housing of the semiconductor laser 5 and the heat conduction member 11, and thus to cool the semiconductor laser 5 by means of the heat dissipation assembly 1.

[0050] In some embodiments, the test assembly 2 further comprises a damping guide rail 23 arranged in the mounting groove 211 and extending along the first direction F1, and the side wall of the above-mentioned test socket 22 is provided with a slot opening adapted to the damping guide rail 23, so that the test socket 22 can be slidingly connected to the housing 21 by means of the damping guide rail 23 along the first direction F1, to realize the relative fixation of the test socket 22 and the housing 21 in the second direction F2.

[0051] In this embodiment, the damping guide rail 23 specifically refers to a common damping guide rail, such as the lifting guide rail shown in CN221686448U, which can drive the test socket 22 to move up and down along the first direction F1, which is the prior art.

[0052] The test socket 22 has multiple hovering positions (not shown) spaced apart in the first direction F1. Depending on the height of the pins of different types of semiconductor lasers 5, the test socket 22 can move along the first direction F1 to the corresponding hovering position and hover, so that the housing of the semiconductor laser 5 and the heat-conducting component 11 always maintain close contact during the test, eliminating the thermal resistance of the base being suspended due to pin bending.

[0053] In some other embodiments, each test component 2 includes two damping guide rails 23 extending along a first direction F1. The two damping guide rails 23 are respectively disposed on opposite side walls of the mounting groove 211 along a second direction F2. The test socket 22 can also achieve a sliding connection with the housing 21 by means of the damping guide rails 23. In this embodiment, the arrangement of the two damping guide rails 23 helps to improve the smoothness of the sliding of the test socket 22 during movement and the stability during the hovering process.

[0054] In the above embodiment, both the housing 21 and the heat dissipation part 122 are constructed as square block structures. After the housing 21 is assembled into the receiving section 3, the outer wall of the housing 21 and the side wall of the heat dissipation part 122 fit together, thereby restricting the rotation of the housing 21, so that the housing 21 can only move in the first direction F1 within the receiving section 3.

[0055] Combination Figure 4 and Figure 5 As shown, Figure 5 A partial cross-sectional view of a test assembly according to one embodiment of this application is shown. In some embodiments, the test socket 22 includes a base 221 and an electrical connector 222. The base 221 has a socket 2211 for inserting pins of a semiconductor laser 5. The electrical connector 222 includes electrodes 2221 and a plurality of conductive springs 2222. The electrodes 2221 are mounted on the base 221 and are used for external power supply. The conductive springs 2222 are mounted in the socket 2211 and electrically connected to the electrodes 2221 to apply bias to the semiconductor laser 5 during testing.

[0056] In the embodiments of the present application, the spacing between the conductive elastic sheets 2222 gradually decreases from the top end to the bottom end of the insertion hole 2211, so as to jointly clamp the pins of the semiconductor laser 5, thereby achieving clamping and fixing of the pins of the semiconductor laser 5. In the embodiments of the present application, only one pair of conductive elastic sheets 2222 is arranged in each insertion hole 2211, and the two conductive elastic sheets 2222 are made of a metal with certain elasticity and conductivity, which are used for guiding and fixing the pins of the semiconductor laser 5 inserted into the insertion hole 2211, and the pins of the semiconductor laser 5 can move up and down in the insertion hole 2211 along the first direction F1 to adapt to the assembly requirements of semiconductor laser 5 pins of different lengths.

[0057] It can be understood that in other embodiments, in order to further improve the clamping stability, a plurality of conductive elastic sheets 2222 can also be arranged in each insertion hole 2211, and all the conductive elastic sheets 2222 are uniformly distributed along the circumference of the insertion hole 2211, and the bottom ends of the conductive elastic sheets 2222 are gathered towards the center axis of the insertion hole 2211, and jointly clamp the pins of the semiconductor laser 5, so as to further improve the electrical connection stability of the pins of the semiconductor laser 5.

[0058] In some embodiments, the present application also provides a test system, which at least includes a power supply (not shown) and a test fixture for semiconductor laser as shown in any of the above embodiments, and the power supply can be electrically connected to the test socket 22 of the test fixture, and is used for supplying power to the test fixture as a whole.

[0059] The technical features of the above-mentioned embodiments can be combined in any way. In order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0060] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A test fixture for a semiconductor laser, characterized by, The test fixture comprises: a heat dissipation assembly comprising a heat conducting member and a refrigeration member, the heat conducting member being configured to contact a housing of the semiconductor laser, the refrigeration member being configured to cool the heat conducting member; the refrigeration member comprising a refrigeration sheet and a heat dissipation portion, the refrigeration sheet being connected between the heat conducting member and the heat dissipation portion along a first direction; and a test assembly comprising a housing and a test socket, the housing being connected to the heat dissipation assembly, the test socket being configured to mount the semiconductor laser, the housing being provided with a mounting slot extending therethrough along the first direction, the test socket being slidingly mounted in the mounting slot so that the semiconductor laser can contact the heat conducting member.

2. The test fixture for semiconductor lasers according to claim 1, characterized by Each of the refrigeration members comprises a plurality of refrigeration sheets, all of the refrigeration sheets being arranged in an array and clamped between the heat conducting member and the heat dissipation portion.

3. The test fixture for semiconductor lasers according to any one of claims 1-2, wherein The refrigeration sheets are coated with a heat-conducting silicone grease on surfaces thereof.

4. The test fixture for semiconductor lasers according to any one of claims 1 to 2, characterized in that The refrigeration members are provided in two and spaced apart along a second direction, two of the refrigeration members and the heat conducting member defining a receiving space therebetween, the test assembly being capable of being fitted into the receiving space along the first direction. The second direction is perpendicular to the first direction.

5. The test fixture for semiconductor lasers according to claim 4, wherein The test fixture further comprises a fixing member connected between the test assembly and the heat dissipation assembly along the second direction, for detachably mounting the test assembly to the heat dissipation assembly.

6. The test fixture for semiconductor lasers according to claim 4, wherein The heat conducting member is provided with a fitting slot on a side close to the receiving space, the fitting slot being configured to accommodate the semiconductor laser, and an inner wall of the fitting slot being capable of contacting a surface of the housing of the semiconductor laser.

7. The test fixture for semiconductor lasers according to claim 6, wherein The heat conducting member has a light outlet channel extending therethrough along the first direction, the light outlet channel being in communication with the fitting slot.

8. The test fixture for semiconductor lasers of claim 1, wherein The test socket comprises a seat body and an electrical connecting member, the seat body having a socket for receiving pins of the semiconductor laser, the electrical connecting member comprising an electrode and a plurality of conductive springs, the electrode being mounted to the seat body and configured to be externally connected to a power supply, the conductive springs being provided in the socket and electrically connected to the electrode. The distance between the conductive springs gradually decreases from a top end to a bottom end of the socket, for collectively clamping the pins of the semiconductor laser.

9. The test fixture for semiconductor lasers of claim 1, wherein The test assembly further comprises a damping guide rail provided in the mounting slot, the damping guide rail extending along the first direction, the test socket being slidingly connected to the housing by means of the damping guide rail.

10. A test system, characterized by The test system at least comprises: the test fixture for semiconductor laser as claimed in any one of claims 1-9; and a power supply capable of being electrically connected to the test socket of the test fixture and supplying power to the test fixture.

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