Airflow testing equipment for high and low temperature reliability of chip

Abstract

The invention relates to the technical field of electronic component testing devices, in particular to chip high and low temperature reliability airflow testing equipment which comprises a testing seat, a bearing plate and an overturning seat. The two test cavities comprise a first test cavity made of a high-temperature-resistant material and a second test cavity made of a low-temperature-resistant material which are oppositely arranged in a first direction; the bearing plate is movably arranged at the bottom of the test seat along a first direction, and the bearing plate is provided with a bearing surface for fixing a chip; the turnover seat is arranged at the top of the test seat in a turnover mode. According to the invention, the chip can be quickly transferred between the high-temperature test space and the low-temperature test space by controlling the overturning action of the overturning seat, so that the manufacturing cost of the test space is reduced, the service life of the test space is prolonged, and the accuracy and efficiency of instantaneous test of the temperature of the chip are effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component testing devices, and particularly to a chip high-low temperature reliability airflow testing device. BACKGROUND

[0002] To ensure the quality of chips before they are shipped, high-low temperature tests need to be performed before they are shipped. Currently, hot flow meters or high-low temperature chambers are mainly used to achieve this. Such devices all need to build a test space to accommodate chips for testing. In the chip temperature transient test (performance under rapid temperature change), rapid temperature changes are easy to damage the test space, so the test space is usually made of high and low temperature resistant materials. However, such materials are rare, high in manufacturing cost and expensive, and their high-temperature resistance is often not as good as that of traditional single high-temperature resistant materials, and their low-temperature resistance is often lower than that of traditional single low-temperature resistant materials. Therefore, some existing high-low temperature testing devices use two independent test space designs: one uses high-temperature resistant materials, and the other uses low-temperature resistant materials to reduce manufacturing costs and extend service life. However, because two independent spaces are set up, the chip needs to be transferred during temperature transient testing; and to ensure test stability, the chip is usually fixed in the test space, so the transfer process involves repeated fixing and unfixing of the chip, resulting in slow chip transfer speed, inability to immediately perform low-temperature testing after high-temperature testing, and thus affecting the accuracy and efficiency of the test results. To address the above problems, the present application provides a chip high-low temperature reliability airflow testing device. SUMMARY

[0003] The present application aims to overcome the defects of the prior art and provide a chip high-low temperature reliability airflow testing device that can improve the accuracy and efficiency of temperature transient testing while reducing the manufacturing cost of the test space and extending its service life.

[0004] The present application is achieved by the following technical solutions:

[0005] A chip high-low temperature reliability airflow testing device, comprising:

[0006] A test seat having two test cavities formed with openings at the top and bottom thereof, the two test cavities including a first test cavity made of high-temperature resistant material and a second test cavity made of low-temperature resistant material arranged opposite in a first direction;

[0007] A carrier plate movably arranged at the bottom of the test seat in the first direction, the carrier plate having a carrier surface for fixing the chip; and

[0008] The flip seat is arranged on the top of the test seat in a flip manner, so that the flip seat has a first state and a second state on the test seat, and the flip seat is linked with the carrier plate through a transmission structure, wherein when the flip seat is in the first state, the flip seat, the first test cavity and the carrier surface of the carrier plate form a high-temperature test space, and when the flip seat is in the second state, the flip seat, the second test cavity and the carrier surface of the carrier plate form a low-temperature test space.

[0009] Optionally, the test seat is further provided with a pick-and-place cavity with openings formed on the top and bottom thereof, the pick-and-place cavity is located between the first test cavity and the second test cavity, and the flip seat further has a third state between the first state and the second state on the test seat, and when the flip seat is in the third state, the chips on the carrier surface of the carrier plate are located in the pick-and-place cavity.

[0010] Optionally, the transmission structure comprises a first gear, a second gear and a rack structure, the first gear is fixed on the flip seat, the first gear and the flip seat rotate around the same rotation center, the second gear is mounted on the test seat, and the rack structure is fixed on the carrier plate, the first gear is engaged with the second gear, and the second gear is engaged with the rack structure.

[0011] Optionally, the chip high-low temperature reliability airflow test equipment further comprises a high-low temperature airflow device for blowing hot air into the high-temperature test space and blowing cold air into the low-temperature test space.

[0012] Optionally, the flip seat has a first side wall and a second side wall, the first side wall is used to form the high-temperature test space with the first test cavity and the carrier surface of the carrier plate, and the second side wall is used to form the high-temperature test space with the second test cavity and the carrier surface of the carrier plate; the high-low temperature airflow device comprises a hot airflow channel arranged on the first side wall and a cold airflow channel arranged on the second side wall.

[0013] Optionally, the high-low temperature airflow device further comprises a main air inlet, a semiconductor refrigeration sheet and an airflow switching assembly, the hot end of the semiconductor refrigeration sheet corresponds to the hot airflow channel, the cold end of the semiconductor refrigeration sheet corresponds to the cold airflow channel, and the airflow switching assembly is arranged between the main air inlet, the hot airflow channel and the cold airflow channel, and is used to selectively connect the main air inlet with the hot airflow channel or the cold airflow channel according to the state of the flip seat.

[0014] Optionally, a connecting channel is formed in the turnover seat, the middle part of the connecting channel has a larger diameter than the two ends, the first end and the second end of the connecting channel extend to the first side wall and the second side wall respectively, the main air inlet is in communication with the middle part of the connecting channel, the hot air flow channel and the cold air flow channel are in communication with the first end and the second end of the connecting channel respectively, and the airflow switching assembly comprises sealing plates, a first elastic element and ejector pins, two sealing plates are arranged in the middle part of the connecting channel, the first elastic element is located between the two sealing plates, and one ejector pin is fixed at a position corresponding to the first end and the second end of the connecting channel on the test seat.

[0015] Optionally, the high and low temperature airflow device further comprises an exhaust channel, when the turnover seat is in the first position, the exhaust channel is in communication with the high temperature test space and the external environment, and when the turnover seat is in the second position, the exhaust channel is in communication with the low temperature test space and the hot air flow channel.

[0016] Optionally, a placing groove for accommodating the chip is formed in the bearing surface of the bearing plate, the chip is elastically arranged in the placing groove in the second direction by a second elastic element, and a pressure relief hole and an exhaust hole in communication with the placing groove are further arranged on the bearing plate, the pressure relief hole is used to keep the pressure in the placing groove constant when the chip moves in the second direction in the placing groove, and the exhaust hole is used to relieve pressure when the air pressure in the high temperature test space or the low temperature test space exceeds a set value.

[0017] Optionally, a test socket is elastically arranged in the placing groove by the second elastic element, the test socket has probes corresponding to the pins of the chip, and the test socket is electrically connected with an ATE test machine.

[0018] Compared with the prior art, the chip high and low temperature reliability airflow test equipment provided by the application has the following beneficial effects:

[0019] 1. The high temperature test space and the low temperature test space are two spaces arranged independently, the high temperature test space adopts a material with low cost and better high temperature resistance performance, and the low temperature test space adopts a material with low cost and better low temperature resistance performance. Based on this structure, the rapid transfer of the chip between the high temperature test space and the low temperature test space can be realized by controlling the turnover action of the turnover seat, thereby effectively improving the accuracy and efficiency of the chip temperature instantaneous test while reducing the manufacturing cost of the test space and prolonging the service life of the test space.

[0020] 2. The application can not only conveniently introduce high-temperature airflow into the high-temperature test space and low-temperature airflow into the low-temperature test space, but also quickly switch the high-temperature and low-temperature airflow according to the state of the turnover seat by setting the main air inlet, the semiconductor refrigeration sheet and the airflow switching assembly in cooperation with the hot airflow channel, the cold airflow channel and the turnover seat.

[0021] 3. The application can automatically realize the selective communication of the main air inlet with the hot airflow channel / cold airflow channel or realize the closing of the main air inlet without additional configuration of independent control devices (such as electromagnetic valves) when the turnover seat switches back and forth among the three states (i.e. the first state, the second state and the third state) by setting the connecting channel and the airflow switching assembly.

[0022] 4. The application can not only make the high-temperature test space communicate with the external environment to keep the air pressure in the high-temperature test space constant and ensure the continuous introduction of high-temperature airflow into the high-temperature test space when performing the chip high-temperature test, but also make the low-temperature test space communicate with the hot airflow channel to make the low-temperature airflow flow into the hot airflow channel to dissipate the heat of the hot end of the semiconductor refrigeration sheet after the low-temperature test, so that the hot end of the semiconductor refrigeration sheet does not need to be additionally introduced into the radiator, thereby reducing the energy consumption of the chip test and achieving the energy-saving effect.

[0023] 5. The application can firmly fix the chip on the bearing plate by using the air pressure, and the dismounting process is very convenient. Specifically, when performing the chip high-temperature test or low-temperature test, the chip moves towards the bottom of the placing groove under the action of the air pressure as the air pressure in the test space gradually increases, and the chip is tightly fixed in the placing groove under the action of the air pressure. The exhaust hole gradually exposes as the chip moves, and the exhaust hole can play a role in pressure relief when the air pressure in the test space exceeds the set value. After the high-temperature and low-temperature tests of the chip are completed, the fixation of the chip is released as the air pressure in the test space decreases. Compared with the fixing method of the traditional clamp, the chip can be conveniently dismounted on the bearing plate. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic view of the overall structure of the chip high-temperature and low-temperature reliability airflow test equipment.

[0025] Figure 2 It is a schematic view of the structure of the chip high-temperature and low-temperature reliability airflow test equipment without a workbench and a driving device.

[0026] Figure 3 It is another schematic view of the shaft side. Figure 2 ​

[0027] Figure 4 Fig. 1 is a schematic view of an explosion structure of the test seat; Figure 2

[0028] Figure 5 Fig. 2 is a schematic view of a structure of the test seat;

[0029] Figure 6 Fig. 3 is another schematic view of the explosion structure of the test seat; Figure 5

[0030] Figure 7 Fig. 4 is a schematic view of a structure of the bearing plate;

[0031] Figure 8 Fig. 5 is a schematic view of an explosion structure of the turnover seat;

[0032] Figure 9 Fig. 6 is a schematic view of a structure of the turnover seat in a third state;

[0033] Figure 10 Fig. 7 is a schematic view of a structure of the turnover seat in a first state;

[0034] Figure 11 Fig. 8 is a schematic view of a structure of the turnover seat in a second state.

[0035] In the drawings: 100, test seat; 110, first test cavity; 120, second test cavity; 130, taking and placing cavity; 140, slide rail; 200, bearing plate; 210, bearing surface; 220, sliding block; 230, placing groove; 240, pressure relief hole; 250, second elastic element; 260, test socket; 261, probe; 270, chip; 300, turnover seat; 310, first side wall; 311, first groove; 312, first cover plate; 313, first air hole; 320, second side wall; 321, second groove; 322, second cover plate; 323, second air hole; 330, main air inlet; 340, semiconductor refrigeration sheet; 350, left sealing plate; 351, right sealing plate; 352, left side thimble; 353, right side thimble; 354, first elastic element; 360, connecting channel; 370, first through hole; 380, second through hole; 390, connecting shaft; 400, rotating shaft; 500, air cylinder; 510, workbench; 600, high-temperature test space; 610, low-temperature test space; 700, transmission structure; 710, first gear; 720, second gear; 730, rack structure; 800, first air duct; 810, second air duct; 820, third air duct; 830, fourth air duct; 840, air gap. DETAILED DESCRIPTION

[0036] ​​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0037] As described in the background, some existing high-low temperature test equipment adopts a design of two independent test spaces: one uses high-temperature-resistant material, and the other uses low-temperature-resistant material, so as to reduce manufacturing cost and prolong service life. However, due to the setting of two independent spaces, the chip needs to be transferred in temperature transient test; and in order to ensure test stability, the chip usually needs to be fixed in the test space, so the transfer process involves repeated fixing and releasing of the chip, which leads to slow chip transfer speed, and the low-temperature-resistant test cannot be immediately performed after the high-temperature-resistant test is completed, thereby affecting the accuracy and efficiency of the test results.

[0038] To solve the above problems, please refer to Figures 1 to 11 According to the embodiments of the present application, a chip high-low temperature reliability airflow test equipment can include a test seat 100, a bearing plate 200, and a turnover seat 300. The test seat 100 has two test cavities with openings formed at the top and bottom thereof. The two test cavities include a first test cavity 110 made of high-temperature-resistant material and a second test cavity 120 made of low-temperature-resistant material, which are oppositely arranged in a first direction. In an example, the first direction is the left-right direction, the first test cavity 110 is nested with an inner liner made of high-temperature-resistant material, and the second test cavity 120 is nested with an inner liner made of low-temperature-resistant material. The high-temperature-resistant material can be stainless steel or ceramic, and the low-temperature-resistant material can be inert metal coating or polytetrafluoroethylene. Figures 9 to 10 The bearing plate 200 is movably arranged at the bottom of the test seat 100 along the first direction. The bearing plate 200 has a bearing surface 210 for fixing a chip 270. In an example, as shown in Figure 4 The two sides of the bearing plate 200 protrude with sliding blocks 220, and the test seat 100 is provided with sliding rails 140 in sliding cooperation with the sliding blocks 220. The bearing plate 200 is movably arranged at the bottom of the test seat 100 along the first direction through the cooperation of the sliding blocks 220 and the sliding rails 140. Figures 1 to 4As shown, the turnover seat 300 is rotationally connected with the test seat 100 through the rotating shaft 400. The turnover seat 300 is linked with the bearing plate 200 through the transmission structure 700, wherein, when the turnover seat 300 is in the first state, the turnover seat 300, the first test cavity 110 and the bearing surface 210 of the bearing plate 200 enclose the high-temperature test space 600, and when the turnover seat 300 is in the second state, the turnover seat 300, the second test cavity 120 and the bearing surface 210 of the bearing plate 200 enclose the low-temperature test space 610.

[0039] With the above technical solution, the high-temperature test space 600 and the low-temperature test space 610 are two spaces independently arranged, and the high-temperature test space 600 can use a material with low cost and better high-temperature resistance performance, and the low-temperature test space 610 can use a material with low cost and better low-temperature resistance performance. Based on this structure, the rapid transfer of the chip 270 between the high-temperature test space 600 and the low-temperature test space 610 can be realized by controlling the turnover action of the turnover seat 300, thereby reducing the manufacturing cost of the test space, prolonging the service life of the test space, and effectively improving the accuracy and efficiency of the temperature instantaneous test of the chip 270. In specific operation, the chip 270 to be tested can be fixed on the bearing surface 210 of the bearing plate 200 by using a clamp or other fixing method, and then the turnover seat 300 is manually or controlled by a driving device to be turned over. When the turnover plate is turned over, the bearing plate 200 can be driven by the transmission structure 700 to move synchronously in the first direction (left or right). For example, when the temperature instantaneous test of the chip 270 is needed, the turnover plate can be first turned over to the left to drive the bearing plate 200 to move synchronously to the left. When the top opening of the first test cavity 110 is covered by the turnover seat 300, the turnover seat 300 is in the first state. At this time, the turnover seat 300, the first test cavity 110 and the bearing surface 210 of the bearing plate 200 enclose the high-temperature test space 600, and the chip 270 is synchronously placed in the high-temperature test space 600 with the movement of the bearing plate 200. The high-temperature (such as 125℃) air can be introduced to perform the high-temperature resistance test of the chip 270. After the high-temperature resistance test is completed, the turnover plate is quickly turned over to the right to drive the bearing plate 200 to move synchronously to the right. When the top opening of the second test cavity 120 is covered by the turnover seat 300, the turnover seat 300 is in the second state. At this time, the turnover seat 300, the second test cavity 120 and the bearing surface 210 of the bearing plate 200 enclose the low-temperature test space 610, and the chip 270 is synchronously placed in the low-temperature test space 610 with the movement of the bearing plate 200. The low-temperature (such as-40℃) air can be introduced to perform the low-temperature resistance test of the chip 270. The above process of changing from high-temperature resistance test to low-temperature resistance test is the temperature instantaneous test of the chip 270. In this process, the chip 270 on the bearing plate 200 does not need to be disassembled, and only the turnover seat 300 needs to be simply turned over, which can effectively improve the accuracy and efficiency of the temperature instantaneous test of the chip 270.

[0040] As Figure 1 shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test device for the chip 270 further comprises a driving device for driving the carrier plate 200 to move in the first direction. In one embodiment, the test seat 100 is fixed on a workbench 510, and the driving device is a pneumatic cylinder 500 mounted on the workbench 510, the output shaft of the pneumatic cylinder 500 is connected with the carrier plate 200, and the pneumatic cylinder 500 is extended and retracted to drive the carrier plate 200 to move in the first direction. In another embodiment, the driving device is a motor, which is used to drive the carrier plate 200 to flip.

[0041] As Figure 9 shown in the above embodiments, in some embodiments, the test seat 100 is further provided with a taking and placing cavity 130 with openings at the top and bottom thereof, the taking and placing cavity 130 is located between the first test cavity 110 and the second test cavity 120, and the turnover seat 300 has a third state between the first state and the second state, and when the turnover seat 300 is in the third state, the chip 270 on the carrier surface 210 of the carrier plate 200 is located in the taking and placing cavity 130. By providing the taking and placing cavity 130, the taking and placing operation of the chip 270 on the carrier surface 210 can be facilitated, and specifically, when the chip 270 to be tested needs to be placed on the carrier surface 210 of the carrier plate 200 or the chip 270 after testing needs to be taken away from the carrier surface 210 of the carrier plate 200, the turnover seat 300 can be flipped to the third state, so that the taking and placing operation of the chip 270 on the carrier surface 210 can be conveniently performed through the taking and placing cavity 130.

[0042] As Figures 9 to 11 shown in the above embodiments, in some embodiments, the transmission structure 700 comprises a first gear 710, a second gear 720 and a rack structure 730, the first gear 710 is fixed on the turnover seat 300, the first gear 710 and the turnover seat 300 rotate around the same rotation center, the second gear 720 is mounted on the test seat 100, and the rack structure 730 is fixed on the carrier plate 200, the first gear 710 is engaged with the second gear 720, and the second gear 720 is engaged with the rack structure 730. By providing the transmission structure 700, the linkage between the turnover seat 300 and the carrier plate 200 can be stably achieved, and of course, as long as the linkage between the turnover seat 300 and the carrier plate 200 can be achieved, the specific structure of the transmission structure 700 is not particularly limited in the present application.

[0043] As Figure 9As shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized.

[0044] As shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized. Figures 9 to 11 As shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized.

[0045] As shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized. Figure 9 As shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized.

[0046] By setting the above high and low temperature airflow device, as shown in the above embodiments, in some embodiments, the high and low temperature reliability airflow test equipment for the chip 270 further comprises a high and low temperature airflow device for blowing hot air into the high temperature test space 600 and blowing cold air into the low temperature test space 610. By blowing hot air into the high temperature test space 600 through the high and low temperature airflow device, high temperature resistance test of the chip 270 can be realized. By blowing cold air into the low temperature test space 610 through the high and low temperature airflow device, low temperature resistance test of the chip 270 can be realized. Figure 10As shown, when the flip holder 300 is in the first state, a high-temperature test space 600 is formed between the first sidewall 310 of the flip holder 300, the first test cavity 110, and the bearing surface 210 of the bearing plate 200. High-temperature airflow can then enter the high-temperature test space 600 through the hot airflow channel on the first sidewall 310 to perform high-temperature resistance testing on the chip 270. Figure 11 As shown, when the flip holder 300 is in the second state, the second side wall 320 of the flip holder 300, the second test cavity 120 and the bearing surface 210 of the bearing plate 200 will form a low temperature test space 610. Low temperature airflow can enter the low temperature test space 610 through the cold airflow channel on the second side wall 320 to perform low temperature resistance test on the chip 270.

[0047] like Figures 9 to 11 As shown, based on the above embodiments, in some embodiments, the high and low temperature airflow device further includes a main air inlet 330, a semiconductor cooling chip 340, and an airflow switching component. The hot end of the semiconductor cooling chip 340 corresponds to the hot airflow channel, and the cold end of the semiconductor cooling chip 340 corresponds to the cold airflow channel. The airflow switching component is disposed between the main air inlet 330, the hot airflow channel, and the cold airflow channel, and is used to selectively connect the main air inlet 330 to the hot airflow channel or the cold airflow channel according to the state of the flip base 300. By setting the main air inlet 330, the semiconductor cooling chip 340, and the airflow switching component to cooperate with the hot airflow channel, the cold airflow channel, and the flip base 300, it is not only convenient to introduce high temperature airflow into the high temperature test space 600 and low temperature airflow into the low temperature test space 610, but also to achieve rapid switching between high and low temperature airflows according to the state of the flip base 300. In practical operation, the main air inlet 330 can be connected to an external air intake device, such as a blower. Pressurized air enters from the main air inlet 330. When the flip seat 300 is in the first state, the airflow switching component connects the main air inlet 330 to the hot airflow channel. The air entering from the main air inlet 330 will enter the hot airflow channel, be heated by the hot end of the semiconductor cooling chip 340, and then enter the high-temperature test space 600. When the flip seat 300 is in the second state, the airflow switching component connects the main air inlet 330 to the cold airflow channel. The air entering from the main air inlet 330 will enter the cold airflow channel, be cooled by the cold end of the semiconductor cooling chip 340, and then enter the low-temperature test space 610.

[0048] like Figures 9 to 11As shown, based on the above embodiments, in some embodiments, the flip seat 300 is provided with a connecting channel 360. The diameter of the middle part of the connecting channel 360 is larger than the diameter of its two ends. The first end and the second end of the connecting channel 360 extend to the first sidewall 310 and the second sidewall 320, respectively. The main air inlet 330 communicates with the middle part of the connecting channel 360. The hot airflow channel and the cold airflow channel communicate with the first end and the second end of the connecting channel 360, respectively. Specifically, the hot airflow channel communicates with the first end of the connecting channel 360 through the first through hole 370, and the cold airflow channel communicates with the second end of the connecting channel 360 through the second through hole 380. The airflow switching assembly includes a sealing plate, a first elastic element 354, and a pin. The two sealing plates are disposed in the middle of the connecting channel 360. The sealing plate near the first end of the connecting channel 360 is the left sealing plate 350, and the sealing plate near the second end of the connecting channel 360 is the right sealing plate 351. The first elastic element 354 is located between the two sealing plates. The first elastic element 354 can be a compression spring. Under the elastic force of the first elastic element 354, the left sealing plate 350 blocks the communication between the first end of the connecting channel 360 and the middle part of the connecting channel 360, and the right sealing plate 351 blocks the communication between the second end of the connecting channel 360 and the middle part of the connecting channel 360. A pin is fixed on the test base 100 at the positions corresponding to the first end and the second end of the connecting channel 360. The pin located on the left side of the test base 100 is the left pin 352, and the pin located on the right side of the test base 100 is the right pin 353.

[0049] By setting up the connection channel 360 and airflow switching component, when the flip seat 300 switches back and forth between three states (i.e., the first state, the second state, and the third state), it can automatically achieve selective connection between the main air inlet 330 and the hot airflow channel / cold airflow channel, or achieve the closure of the main air inlet 330, without the need for additional independent control devices (such as solenoid valves).

[0050] Specifically: such as Figure 10 As shown, when the flip seat 300 is in the first state, the left ejector pin 352 is inserted from the first end of the connecting channel 360 and pushes the left sealing plate 350 towards the second end of the connecting channel 360. At this time, the first elastic element 354 is compressed and stored, the right sealing plate 351 is further pressed, and the sealing performance of the connection position between the main air inlet 330 and the second end of the connecting channel 360 is further improved. The main air inlet 330 is connected to the middle part of the connecting channel 360 and the first end of the connecting channel 360, thereby realizing the connection between the main air inlet 330 and the hot air flow channel, so that the compressed gas at the main air inlet 330 can be smoothly discharged into the hot air flow channel. Figure 11As shown, when the turnover seat 300 is in the second state, the right needle 353 is inserted from the second end of the connecting channel 360 and pushes the right sealing plate 351 to move towards the first end of the connecting channel 360, at this time, the first elastic element 354 is also compressed and stored, the left sealing plate 350 is further compressed, the main air inlet 330 and the sealing position of the communication position of the first end of the connecting channel 360 are further improved, the main air inlet 330 is in communication with the middle part of the connecting channel 360 and the second end of the connecting channel 360, so as to realize the communication of the main air inlet 330 and the cold air flow channel, so that the compressed gas at the main air inlet 330 can be smoothly discharged into the cold air flow channel. As shown, Figure 9 As shown, when the turnover seat 300 is in the third state, the left sealing plate 350 and the right sealing plate 351 are respectively abutted at the positions of the middle part of the connecting channel 360 under the double actions of the first elastic element 354 and the gas pressure at the main air inlet 330, so as to cut off the communication of the main air inlet 330 and the connecting channel 360 at both ends, so as to avoid wasting compressed gas.

[0051] In the above scheme, since the semiconductor refrigeration sheet 340 is used, the hot end of the semiconductor refrigeration sheet 340 generally needs to be provided with a heat dissipation device containing a fan during refrigeration to prevent heat accumulation at the hot end. However, since an additional heat dissipation device needs to be introduced, this will further increase energy consumption and the energy saving effect is not good. In order to solve this problem, as shown, Figures 9 to 11 As shown, on the basis of the above embodiment, in some embodiments, the high and low temperature airflow device further comprises an exhaust channel, when the turnover seat 300 is in the first position, the exhaust channel communicates the high temperature test space 600 with the external environment, when the turnover seat 300 is in the second position, the exhaust channel communicates the low temperature test space 610 with the hot air flow channel. Specifically, as shown, Figure 8 As shown, the first cover plate 312 and the second cover plate 322 are fixedly connected through a plurality of connecting shafts 390, the connecting shafts 390 are arranged movably through the turnover seat 300, the exhaust channel comprises a first air duct 800, a second air duct 810, a third air duct 820, a fourth air duct 830 and an air gap 840, the first air duct 800 is arranged on the bearing plate 200, the second air duct 810 and the third air duct 820 are arranged on the test seat 100, the fourth air duct 830 is arranged on the turnover seat 300, the fourth air duct 830 forms an opening on the contact surface of the first cover plate 312 and the turnover seat 300, and the first cover plate 312 forms the air gap 840 between the turnover seat 300 when the turnover seat 300 is in the second state. As shown, Figure 10As shown, when the turnover seat 300 is in the first state, the first air passage 800 and the second air passage 810 are in communication with each other to form a gas flow discharge channel that connects the high-temperature test space 600 with the external environment, at the same time, the first cover plate 312 is in close contact with the first side wall 310 of the turnover seat 300, the ventilation gap 840 disappears, and the fourth air passage 830 is closed by the opening formed on the contact surface between the first cover plate 312 and the turnover seat 300, so that the hot gas in the hot gas flow channel can be prevented from flowing out of the fourth air passage 830. As shown in Figure 11 As shown, when the turnover seat 300 is in the second state, the ventilation gap 840 is formed between the first cover plate 312 and the turnover seat 300, and the first air passage 800, the third air passage 820, the fourth air passage 830, and the ventilation gap 840 are in communication with each other to form a return gas channel that connects the low-temperature test space 610 with the hot gas flow channel.

[0052] By setting the above-mentioned exhaust channel, on the one hand, when the chip 270 is subjected to high-temperature resistance test, the high-temperature test space 600 can be connected with the external environment to keep the air pressure in the high-temperature test space 600 constant, so as to ensure that the high-temperature gas flow can be continuously introduced into the high-temperature test space 600. On the other hand, when the chip 270 is subjected to low-temperature resistance test, the low-temperature test space 610 can be connected with the hot gas flow channel, and after the low-temperature gas flow enters the low-temperature test space 610 to perform low-temperature test on the chip 270, the low-temperature gas flow can flow into the hot gas flow channel to dissipate heat for the hot end of the semiconductor refrigeration piece 340 in the hot gas flow channel. In this way, the hot end of the semiconductor refrigeration piece 340 does not need to be additionally introduced into a heat sink, the energy consumption of the chip 270 test is reduced, and the energy-saving effect is achieved.

[0053] In the above-mentioned scheme, if it is necessary to fix the chip 270 on the carrier plate 200, the traditional method is to open a fixing groove on the carrier plate 200 that is adapted to the shape of the chip 270, or to fix the chip 270 by using an existing chip 270 clamp. Although the fixing groove fixing method is relatively simple, the fixing is not firm enough. Although the fixing method by using the clamp can be fixed firmly, it is troublesome to disassemble and assemble the chip 270. In order to solve this problem, as shown in Figures 9 to 11 On the basis of the above-mentioned embodiments, in some embodiments, the carrier plate 200 is provided with a placing groove 230 on the carrier surface 210 for accommodating the chip 270, and the chip 270 is elastically arranged in the placing groove 230 in the second direction by the second elastic element 250. In Figures 9 to 10 the second direction is the up-down direction. The carrier plate 200 is further provided with a pressure relief hole 240 and an exhaust hole in communication with the placing groove 230, the pressure relief hole 240 is used to keep the pressure in the placing groove 230 constant when the chip 270 moves in the second direction in the placing groove 230, and the exhaust hole is used to relieve pressure when the air pressure in the high-temperature test space 600 or the low-temperature test space 610 exceeds a set value. For example, Figure 7As shown, the pressure relief hole 240 can be arranged at the bottom of the placement groove 230, the first air passage 800 can be used as the exhaust hole, and the second elastic element 250 can be a compression spring. In this way, the chip 270 can be firmly fixed on the carrier plate 200 by air pressure, and the disassembly process is very convenient. Specifically, before the chip 270 is tested, the chip 270 is placed in the placement groove 230, and the elastic element supports the chip 270, so that the chip 270 is located at the top opening position of the placement groove 230, and the exhaust hole is located below the chip 270. At this time, the exhaust hole is separated from the chip 270 and does not communicate with the test space (high-temperature test space 600 or low-temperature test space 610). As shown in Figure 10 and Figure 11 As shown, when the high-temperature resistance test or low-temperature resistance test of the chip 270 is to be performed, the air pressure in the test space gradually increases, and the chip 270 moves towards the bottom of the placement groove 230 under the action of the air pressure. The second elastic element 250 is compressed and stored, and the chip 270 is tightly fixed in the placement groove 230 under the action of the air pressure. With the movement of the chip 270, the exhaust hole gradually emerges, and when the air pressure in the test space exceeds the set value, the exhaust hole can play a pressure relief role. After the high-temperature and low-temperature tests of the chip 270 are completed, the fixation of the chip 270 is released with the decrease of the air pressure in the test space. Compared with the fixation mode of the conventional clamp, the disassembly and assembly of the chip 270 on the carrier plate 200 can be easily completed.

[0054] As shown in Figure 7 On the basis of the above embodiment, in some embodiments, the placement groove 230 is elastically provided with a test socket 260 by the second elastic element 250, the test socket 260 has a probe 261 corresponding to the pin of the chip 270, and the test socket 260 is electrically connected with the ATE tester. The test socket 260 and the ATE tester can both use the prior art. When the chip 270 is fixed under the action of the air pressure, the pin of the chip 270 and the probe 261 of the test socket 260 can also be firmly attached together under the action of the air pressure. In this way, the effect of fixing the chip 270 can be achieved, and the stability of the electrical connection between the chip 270 and the test socket 260 can be improved.

[0055] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip high-low temperature reliability airflow test device, characterized in that, include: The test chamber (100) has two test chambers with openings formed at its top and bottom, the two test chambers including a first test chamber (110) made of high temperature resistant material and a second test chamber (120) made of low temperature resistant material arranged opposite to each other in a first direction; A carrier plate (200) is movably disposed at the bottom of the test holder (100) along the first direction, the carrier plate (200) having a bearing surface (210) for fixing the chip (270); and A flip-up seat (300) is disposed on top of the test seat (100) in a flip-up manner, so that the flip-up seat (300) has a first state and a second state on the test seat (100). The flip-up seat (300) is linked with the support plate (200) through a transmission structure (700). When the flip-up seat (300) is in the first state, the flip-up seat (300), the first test cavity (110) and the support surface (210) of the support plate (200) form a high-temperature test space (600). When the flip-up seat (300) is in the second state, the flip-up seat (300), the second test cavity (120) and the support surface (210) of the support plate (200) form a low-temperature test space (610).

2. The chip high-low temperature reliability airflow test apparatus according to claim 1, characterized in that: The test holder (100) is also provided with a pick-and-place cavity (130) with openings at its top and bottom. The pick-and-place cavity (130) is located between the first test cavity (110) and the second test cavity (120). The flip holder (300) also has a third state on the test holder (100) between the first state and the second state. When the flip holder (300) is in the third state, the chip (270) on the bearing surface (210) of the carrier plate (200) is located in the pick-and-place cavity (130).

3. The chip high-low temperature reliability airflow test apparatus of claim 1, wherein: The transmission structure (700) includes a first gear (710), a second gear (720), and a rack structure (730). The first gear (710) is fixed on the flipping seat (300), and the first gear (710) and the flipping seat (300) rotate around the same rotation center. The second gear (720) is mounted on the test seat (100), and the rack structure (730) is fixed on the support plate (200). The first gear (710) meshes with the second gear (720), and the second gear (720) meshes with the rack structure (730).

4. The chip high-low temperature reliability airflow test apparatus according to any one of claims 1 to 3, characterized by: It also includes a high and low temperature airflow device that blows hot air into the high temperature test space (600) and cold air into the low temperature test space (610).

5. The chip high-low temperature reliability airflow test apparatus of claim 4, wherein: The turnover seat (300) has a first side wall (310) and a second side wall (320), the first side wall (310) is used to enclose the high-temperature test space (600) with the first test cavity (110) and the bearing surface (210) of the bearing plate (200), and the second side wall (320) is used to enclose the high-temperature test space (600) with the second test cavity (120) and the bearing surface (210) of the bearing plate (200); the high-low temperature airflow device comprises a hot airflow channel arranged on the first side wall (310) and a cold airflow channel arranged on the second side wall (320).

6. The chip high-low temperature reliability airflow test apparatus of claim 5, wherein: The high-low temperature airflow device further comprises a main air inlet (330), a semiconductor refrigeration sheet (340) and an airflow switching assembly, the hot end of the semiconductor refrigeration sheet (340) is arranged corresponding to the hot airflow channel, the cold end of the semiconductor refrigeration sheet (340) is arranged corresponding to the cold airflow channel, and the airflow switching assembly is arranged between the main air inlet (330), the hot airflow channel and the cold airflow channel, and is used to selectively connect the main air inlet (330) to the hot airflow channel or the cold airflow channel according to the state of the turnover seat (300).

7. The chip high-low temperature reliability airflow test apparatus of claim 6, wherein: A connecting channel (360) is arranged on the turnover seat (300), the middle part of the connecting channel (360) has a larger diameter than the two ends, the first end and the second end of the connecting channel (360) extend to the first side wall (310) and the second side wall (320) respectively, the main air inlet (330) is in communication with the middle part of the connecting channel (360), the hot airflow channel and the cold airflow channel are in communication with the first end and the second end of the connecting channel (360) respectively, and the airflow switching assembly comprises a sealing plate, a first elastic element (354) and a thimble, two sealing plates are arranged in the middle part of the connecting channel (360), the first elastic element (354) is located between the two sealing plates, and one thimble is fixed at a position corresponding to the first end and the second end of the connecting channel (360) on the test seat (100).

8. The chip high-low temperature reliability airflow test apparatus according to claim 6 or 7, characterized by: The high-low temperature airflow device further comprises an exhaust channel, when the turnover seat (300) is in the first position, the exhaust channel is in communication with the high-temperature test space (600) and the external environment, and when the turnover seat (300) is in the second position, the exhaust channel is in communication with the low-temperature test space (610) and the hot airflow channel.

9. The chip high-low temperature reliability airflow test apparatus of claim 1, wherein: The carrying surface (210) of the carrying plate (200) is provided with a placing groove (230) for accommodating the chip (270), the chip (270) is elastically arranged in the placing groove (230) in a second direction by a second elastic element (250), the carrying plate (200) is further provided with a pressure relief hole (240) and an exhaust hole in communication with the placing groove (230), the pressure relief hole (240) is used for keeping the pressure in the placing groove (230) constant when the chip (270) moves in the second direction in the placing groove (230), and the exhaust hole is used for pressure relief when the air pressure in the high-temperature test space (600) or the low-temperature test space (610) exceeds a set value.

10. The chip high-low temperature reliability airflow test apparatus of claim 9, wherein: The placing groove (230) is elastically provided with a test socket (260) by the second elastic element (250), the test socket (260) is provided with a probe (261) corresponding to the pin of the chip (270), and the test socket (260) is electrically connected with an ATE tester.

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