Radiator fixing device and pressure dynamic balancing method

Abstract

The invention provides a radiator fixing device and a pressure dynamic balancing method, the radiator fixing device comprises a radiator installed on a mainboard, the radiator and a processor arranged on the surface of the mainboard form heat conduction contact, and the radiator fixing device further comprises a pressurizing mechanism arranged on the upper surface, away from the mainboard, of the radiator and comprising at least one first elastic piece, the first elastic piece applies first elastic force vertically pointing to the main board to the radiator in a pre-compressed state, and the strength of the first elastic force is configured to enable the radiator to generate controllable elastic deformation; the compensation mechanism is arranged in a deformation compensation area between the radiator and the mainboard and comprises a second elastic piece corresponding to the space of the deformation compensation area, the second elastic piece generates second elastic force opposite to the first elastic force in direction, and the strength of the second elastic force is configured to enable the radiator to generate controllable elastic deformation when the radiator generates controllable elastic deformation. The second elastic force can dynamically counteract the first elastic force increment used for generating controllable elastic deformation; the problem that the processor is uneven in stress is solved.

Description

Technical Field

[0001] This application relates to the field of radiator technology, and in particular to a radiator fixing device and a method for dynamic pressure balancing. Background Technology

[0002] In the field of electronic device heat dissipation, traditional heat sink mounting devices typically employ rigid bolt locking or spring preload structures to control the contact pressure between the processor and the heat sink. However, due to manufacturing and assembly errors of components such as bolts and springs, as well as factors such as the solder height of the motherboard and the height of the processor, the spring compression at different locations on the heat sink varies. This results in uneven force on the processor, which may cause excessive local pressure on the processor, leading to damage, or insufficient local pressure on the processor, resulting in poor contact with the heat sink and excessively high local temperatures.

[0003] It is evident that balancing the pressure exerted by the heatsink on the processor is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a heat sink fixing device and a dynamic pressure balancing method, which can solve the problem of uneven force on the processor.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a heatsink fixing device, including a heatsink mounted on a motherboard, wherein the heatsink forms thermal conductive contact with a processor disposed on the surface of the motherboard, and further comprising:

[0006] A pressurizing mechanism is disposed on the upper surface of the heat sink away from the motherboard, and includes at least one first elastic element. The first elastic element applies a first elastic force perpendicular to the motherboard to the heat sink in a pre-compressed state. The strength of the first elastic force is configured to cause the heat sink to produce controllable elastic deformation.

[0007] The compensation mechanism is disposed in the deformation compensation area between the heat sink and the motherboard, and includes a second elastic element corresponding to the space of the deformation compensation area. The second elastic element generates a second elastic force in the opposite direction to the first elastic force. Its strength is configured such that when the heat sink generates controllable elastic deformation, the second elastic force can dynamically offset the increment of the first elastic force used to generate controllable elastic deformation.

[0008] In some embodiments, the heat sink includes a heat sink body, a heat spreader is provided at the bottom of the heat sink body, a first elastic member abuts against the upper surface of the heat spreader away from the motherboard, and a second elastic member abuts against the lower surface of the heat spreader facing the motherboard.

[0009] In some embodiments, the lower surface of the heat spreader abuts against the processor, the processor being configured to provide a supporting force to the heat spreader opposite to the first elastic force;

[0010] The contact surface between the heat spreader and the processor is provided with a heat-conducting layer.

[0011] In some embodiments, a locking screw is also included that penetrates the heat spreader plate, the lower end of the locking screw being connected to the main board and the upper end being provided with a limiting nut;

[0012] The first elastic element is a first compression spring sleeved on the outer periphery of the locking screw, and the two ends of the first compression spring form rigid contact with the lower surface of the limiting nut and the upper surface of the heat spreader plate, respectively.

[0013] In some embodiments, the second elastic element is a second compression spring, with its two ends forming rigid contact with the lower surface of the heat spreader and the upper surface of the main board, respectively. The second compression spring is sleeved on the outer periphery of the locking screw or is independently disposed on the outside of the locking screw.

[0014] In some embodiments, the heat sink further includes a base plate located on the side of the motherboard away from the heat spreader, and the lower end of the locking screw passes through the motherboard and is threadedly connected to a nut on the base plate;

[0015] The base plate is used to provide the processor with a clamping force that abuts against the heat spreader.

[0016] In some embodiments, the heat sink body is a finned heat dissipation module, the heat spreader is disposed at the bottom of the heat dissipation module, and the number of the first elastic element and the second elastic element is at least three.

[0017] The plurality of the first elastic elements are evenly distributed along a first circumferential distribution with the center line of the heat dissipation module as the axis.

[0018] Multiple second elastic elements are evenly distributed along a second circumferential distribution with the center line of the heat dissipation module as the axis.

[0019] The first distribution circle and the second distribution circle are concentric circles or circles with different diameters and a predetermined radial distance.

[0020] In some embodiments, the deformation compensation region is provided with a deformation monitoring component, the deformation monitoring component comprising:

[0021] The detection module includes a strain gauge group embedded in the edge of the heat exchange plate. The strain gauge group is evenly distributed along the outer periphery of the heat exchange plate, and the sensitive grid direction of the strain gauge group is consistent with the deformation direction of the heat exchange plate.

[0022] The processing module, connected to the strain gauge group, is used to convert the strain signal into a deformation displacement.

[0023] The control module receives the deformation displacement and generates control commands to drive the pressurization mechanism to adjust the compression state of the first elastic element;

[0024] The pressurizing mechanism further includes a driving unit for driving the first elastic element to compress or stretch. The strain gauge group detects the deformation of the heat spreader and feeds it back to the driving unit in real time. The driving unit dynamically adjusts the compression of the first elastic element to correct the balance between the first elastic force and the second elastic force.

[0025] The deformation monitoring component and the pressurizing mechanism form a closed-loop control system. When the deformation of the heat spreader exceeds a preset threshold, the compression of the first elastic element is dynamically adjusted to bring the net pressure value of the first elastic force and the second elastic force back to the target range.

[0026] In some embodiments, the heat spreader and the contact surface between the processor are provided with a pressure sensor array. The detection area of ​​the pressure sensor array covers the core area and non-core area of ​​the processor. The output signal of the pressure sensor array is fed back to the control module to drive the pressurization mechanism to adjust the compression state of the first elastic element.

[0027] A dynamic pressure balancing method, comprising:

[0028] Pre-compression stage: The first elastic element is compressed by the pressurization mechanism to generate the first elastic force F1, so that the heat sink and the processor are pressed together, and the second elastic element of the compensation mechanism is in an uncompressed state;

[0029] Deformation stage: After the first elastic element reaches the preset compression amount, the first elastic force F1 causes the heat sink to deform. The deformed part contacts and compresses the second elastic element, and the second elastic element generates a second elastic force F2 in the opposite direction to F1.

[0030] Balance phase: The first elastic element is continuously compressed to make F1 and F2 increase synchronously, and the support force F3 of the processor on the heat sink is controlled by the formula F3=F1-F2;

[0031] in , The stiffness coefficient of the first elastic element is... This is the compression amount of the first elastic element; , This is the stiffness coefficient of the second elastic element. The compression amount of the second elastic element, and satisfies Δx is the deformation of the heat sink;

[0032] Fixed phase: When F3 reaches the target pressure value, the compression of the first elastic element stops, and the elastic forces of the first elastic element and the second elastic element are continuously and dynamically canceled out.

[0033] As can be seen from the above technical solution, the beneficial effect of the present invention is that, by applying a first elastic force perpendicular to the motherboard to the heat sink through the pressurizing mechanism, the heat sink is pressed tightly against the processor under the action of the first elastic force, and the heat sink can produce controllable elastic deformation as the first elastic force continues to compress. Before the heat sink deforms, the second elastic element of the compensation mechanism is not compressed, and the pressure on the processor at this time comes entirely from the first elastic force. After the heat sink deforms, the second elastic element is compressed, thereby generating a second elastic force opposite to the first elastic force. The second elastic force can dynamically offset the increase in the first elastic force used to generate the controllable elastic deformation, and as the first elastic force increases, the second elastic force also increases synchronously, thus keeping the resultant force of the first and second elastic forces within a stable range. The resultant force of the first and second elastic forces is the pressure on the processor. Therefore, even if the compression amount of each first elastic element is different, the heat sink will still subject the processor to uniform pressure under the action of the second elastic element. Attached Figure Description

[0034] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of some components of the radiator fixing device provided in an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of a heat sink structure provided in an embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of the tightening process of the locking screw provided in an embodiment of the present invention;

[0038] Figure 4 An exploded view of the first type of radiator fixing device provided in an embodiment of the present invention;

[0039] Figure 5 This is an assembly drawing of a first type of radiator fixing device provided in an embodiment of the present invention;

[0040] Figure 6 An exploded view of a second type of radiator fixing device provided in an embodiment of the present invention;

[0041] Figure 7This is an assembly diagram of a second type of radiator fixing device provided in an embodiment of the present invention;

[0042] Figure 8 A flowchart of the pressure dynamic balancing method provided in an embodiment of the present invention.

[0043] In the diagram: 1-Heat sink; 2-Locking screw; 3-Nut; 4-First elastic element; 5-Second elastic element; 6-Heat-conducting layer; 7-Processor; 8-Motherboard;

[0044] 11-Radiator body; 12-Heat spreader; 13-Base plate. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0046] The terms "comprising" and "having," and any variations thereof, in the specification and accompanying drawings of this invention are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may include steps or units not listed.

[0047] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] Next, a detailed description of a radiator fixing device provided in the embodiments of the present invention will be provided. Please refer to [link / reference]. Figure 4 and Figure 5 The heat sink mounting device includes a heat sink 1 mounted on the motherboard 8. The heat sink 1 forms a thermal conduction contact with the processor 7 disposed on the surface of the motherboard 8, thereby transferring the heat of the processor 7 to the heat sink 1, and the heat sink 1 realizes heat exchange to achieve heat dissipation of the processor 7.

[0049] Please refer to Figure 1 and Figure 2 , Figure 1 Schematic diagram of some components of the radiator mounting device. Figure 2This is a schematic diagram of the heat sink structure; the heat sink fixing device includes a pressurizing mechanism and a compensation mechanism. The pressurizing mechanism is located on the upper surface of the heat sink 1 away from the motherboard 8 and includes at least one first elastic member 4. The first elastic member 4 applies a first elastic force perpendicular to the motherboard 8 to the heat sink 1 in a pre-compressed state; and the first elastic member 4 can provide different first elastic forces to the heat sink 1 according to different compression amounts.

[0050] Under the action of the first elastic force, the heatsink 1 is displaced towards the motherboard 8 until it is tightly attached to the processor 7. As the first elastic element 4 continues to compress, the first elastic force gradually increases, and the pressure on the processor 7 also increases accordingly. The strength of the first elastic force is configured to cause controllable elastic deformation of the heatsink 1. Therefore, when the first elastic force increases to a certain strength, it will cause the heatsink 1 to undergo a certain deformation effect. This deformation refers to the heatsink 1 tilting, bending, or translating in the direction perpendicular to the motherboard 8.

[0051] The compensation mechanism is located in the deformation compensation area between the heatsink and the motherboard 8. When the heatsink 1 deforms under the action of the first elastic force, the distance between the heatsink 1 and the motherboard 8 shortens in the direction perpendicular to the motherboard 8, thus compressing the second elastic element 5. This causes the second elastic element 5 to generate a second elastic force in the opposite direction to the first elastic force. The strength of the second elastic force is configured such that when the heatsink 1 undergoes controllable elastic deformation, the second elastic force can dynamically offset the increase in the first elastic force used to generate the controllable elastic deformation. In other words, the effect of the second elastic force can overcome the deformation of the heatsink 1 caused by the increase in the first elastic force.

[0052] It should be noted that before the heat sink 1 deforms, the second elastic element 5 of the compensation mechanism is not compressed, and the pressure on the processor 7 at this time comes from the first elastic force. After the heat sink 1 deforms, the second elastic element 5 is compressed, thereby generating a second elastic force opposite to the first elastic force. The second elastic force can dynamically offset the increment of the first elastic force used to generate controllable elastic deformation.

[0053] Furthermore, as the first elastic force increases, the second elastic force also increases synchronously, thus keeping the resultant force of the first and second elastic forces within a stable range. This resultant force is the pressure exerted on the processor 7. Therefore, even if the compression of each first elastic element 4 is different, the heat sink 1 will ensure that the processor 7 is subjected to uniform pressure under the action of the second elastic element 5.

[0054] Please refer to Figure 3During implementation, the first elastic element 4 is compressed, applying pressure F1 to the heat sink 1. The second elastic element 5 is not compressed, and its pressure on the spring F2 = 0. The spring pressure on the heat sink 1 is F1 - F2 = F1, at which point F1 is equal to the pressure F1 on the processor 7. When the first elastic element 4 is continuously compressed and reaches a preset value, the pressure F1 applied by the first elastic element 4 to the heat sink 1 will cause the heat sink to deform. At this time, the second elastic element 5 begins to be squeezed by the heat sink 1 and applies pressure F2 to the heat sink 1 to counteract the pressure F1 of the first elastic element 4. Here, F1 is the first elastic force, F2 is the second elastic force, F1 and F2 are in opposite directions, and F1 is always greater than F2.

[0055] The magnitude of the first elastic force is related to the compression of the first elastic element 4, and the magnitude of the second elastic force is related to the compression of the second elastic element 5. The resultant force of the first elastic force and the second elastic force is the net pressure actually applied to the processor 7. Conversely, the processor 7 provides the heat sink 1 with a support force F3 of the same magnitude but opposite direction to the net pressure. Furthermore, the support force F3 can be precisely controlled by adjusting the elastic coefficients of the first elastic element 4 and the second elastic element 5, so that the support force F3 on the processor 7 is within a stable range, that is, the net pressure on the processor 7 is within a stable range.

[0056] Further, please refer to Figure 3 , Where k1 is the elastic coefficient of the first elastic element 4. The compression amount of the first elastic element 4; The elastic modulus of the second elastic element 5 is... This is the compression amount of the second elastic element 5. Δx represents the amount of compression that the first elastic element 4 provides compared to the second elastic element 5.

[0057] In some embodiments, the radiator 1 includes a radiator body 11, please refer to... Figure 2 and Figure 4 The heat sink body 11 has a heat spreader 12 at the bottom. The first elastic member 4 abuts against the upper surface of the heat spreader 12 away from the motherboard 8, and the second elastic member 5 abuts against the lower surface of the heat spreader 12 facing the motherboard 8.

[0058] The lower surface of the heat spreader 12 abuts against the processor 7, and the processor 7 is used to provide a supporting force F3 to the heat spreader 12 opposite to the first elastic force. A thermally conductive layer 6 is provided on the contact surface between the heat spreader 12 and the processor 7. The thermally conductive layer 6 can be a thermally conductive silicone grease layer to ensure that the heat spreader 12 and the processor 7 can achieve stable heat transfer.

[0059] In some embodiments, the radiator fixing device further includes a locking screw 2 penetrating the heat spreader 12, please refer to Figure 4 and Figure 5 The lower end of the locking screw 2 is connected to the main board 8, and the upper end is provided with a limiting nut. The first elastic element 4 is a first compression spring sleeved on the outer periphery of the locking screw 2. The two ends of the first compression spring form rigid contact with the lower surface of the limiting nut and the upper surface of the heat spreader 12, respectively. By turning the locking screw 2, the distance between the limiting nut and the upper surface of the heat spreader 12 is increased or decreased, thereby adjusting the compression of the first compression spring and thus increasing or decreasing the first elastic force.

[0060] The second elastic element 5 is a second compression spring. The two ends of the second compression spring are rigidly in contact with the lower surface of the heat spreader 12 and the upper surface of the main board 8, respectively. Since the second elastic element 5 is located in the deformation compensation zone, when the heat spreader 12 deforms, the second elastic element 5 will be gradually compressed, thereby generating a second elastic force.

[0061] In one embodiment, the second compression spring may be sleeved on the outer periphery of the locking screw 2, please refer to... Figure 4 and Figure 5 That is, the first compression spring and the second compression spring are coaxially arranged, and the locking screw 2 can play a certain limiting role on the second compression spring to ensure the axial stability of the second compression spring during the compression process.

[0062] In another embodiment, the second compression spring can also be independently disposed on the outside of the locking screw 2, please refer to... Figure 6 and Figure 7 That is, although the first compression spring and the second compression spring are not coaxial, their axes are parallel, which allows the second compression spring to provide a second elastic force in the opposite direction to the first elastic force.

[0063] Heatsink 1 also includes base plate 13, please refer to Figure 5 and Figure 7 The base plate 13 is located on the side of the main plate 8 away from the heat spreader 12. The lower end of the locking screw 2 passes through the main plate 8 and is threadedly connected to the nut 3 on the base plate 13. When the locking screw 2 is tightened, the locking screw 2 will move axially under the limiting action of the nut 3, thereby changing the distance between the limiting nut and the heat spreader 12, and thus changing the compression of the first elastic element 4.

[0064] In addition, the motherboard 8 is located on the base plate 13. Since the base plate 13 is connected to the heat spreader 12, the base plate 13 can provide stable support for the motherboard 8 and the processor 7, thereby making the processor 7 press against the heat spreader 12.

[0065] In some embodiments, the heat sink body 11 can be a finned heat sink module, the heat spreader 12 is disposed at the bottom of the heat sink module, and the number of the first elastic element 4 and the second elastic element 5 is at least three. It should be noted that in order to ensure that the first elastic force generated by the multiple first elastic elements 4 can stably press the heat sink 1 onto the processor 7 and prevent random shaking, at least three first elastic elements 4 are used to provide the first elastic force to the heat sink 1. The multiple first elastic elements 4 are evenly distributed along a first circumferential distribution with the center line of the heat sink module as the axis, so that the first elastic force generated by each first elastic element 4 can act evenly on the outer periphery of the heat sink module, ensuring that the heat sink module can be stably set relative to the processor 7.

[0066] Similarly, multiple second elastic elements 5 are evenly distributed along the second circumferential distribution with the center line of the heat dissipation module as the axis. The principle is similar to that of the first elastic element 4, and will not be described again here.

[0067] It should be noted that the first distribution circle and the second distribution circle can be concentric circles, such as... Figure 4 and Figure 5 In the case where the first elastic element 4 and the second elastic element 5 are coaxially arranged; the first distribution circle and the second distribution circle can also be circles with different diameters and a predetermined radial distance, such as... Figure 6 and Figure 7 The first elastic element 4 and the second elastic element 5 are not coaxial.

[0068] This application uses four locking screws 2 as an example for further description. The four locking screws 2 are distributed at the four right angles of the heat spreader 12. The parameters of the first elastic element 4 and the second elastic element 5 are shown in the table below:

[0069]

[0070] Insert the first elastic element 4 into the locking screw 2, the locking screw 2 passes through the heat spreader 12, and insert the second elastic element 5 into the lower end of the locking screw 2. The above operation completes one installation. Repeat the above operation three times to install a total of four locking screws 2, thus completing the assembly of the radiator 1.

[0071] Install the base plate 13 onto the motherboard 8, install the processor 7 onto the motherboard 8, apply thermal paste 6 evenly to the processor 7, align the locking screws 2 with the nuts 3 on the base plate 13, and twist the four locking screws 2 until they can no longer be rotated, thus completing the installation of the heatsink 1.

[0072] The following table shows the results obtained by pressure testing on components such as the first elastic element 4 and the second elastic element 5 on three of the locking screws 2:

[0073]

[0074] It can be seen that although the first elastic element 4 on each locking screw 2 has a different compression amount, the compression amount of the second elastic element 5 on the corresponding locking screw 2 will also change accordingly, so that the pressure on the heat sink 1 from each locking screw 2 tends to be the same or approximately the same. The pressure on the heat sink 1 from the locking screw 2 can be converted into the pressure of the heat sink 1 on the processor 7. Therefore, it can be concluded that the heat sink fixing device of this application makes the pressure of the heat sink 1 on the processor 7 uniformly distributed.

[0075] Similarly, for another embodiment, the parameters of the first elastic member 4 and the second elastic member 5 are shown in the table below:

[0076]

[0077] Insert the first elastic element 4 into the locking screw 2, the locking screw 2 passes through the heat spreader 12, and the second elastic element 5 is installed on the heat spreader 12. The above operation completes one installation. Repeat the above operation three times to install a total of four locking screws 2, thus completing the assembly of the radiator 1.

[0078] Install the base plate 13 onto the motherboard 8, install the processor 7 onto the motherboard 8, apply thermal paste 6 evenly to the processor 7, align the locking screws 2 with the nuts 3 on the base plate 13, and twist the four locking screws 2 until they can no longer be rotated, thus completing the installation of the heatsink 1.

[0079] The following table shows the results obtained by pressure testing on components such as the first elastic element 4 and the second elastic element 5 on three of the locking screws 2:

[0080]

[0081] It can be seen that although the first elastic element 4 on each locking screw 2 has a different compression amount, the compression amount of the corresponding second elastic element 5 on the locking screw 2 will also change accordingly, so that the pressure on the heat sink 1 from each locking screw 2 tends to be the same or approximately the same. The pressure on the heat sink 1 from the locking screw 2 can be converted into the pressure of the heat sink 1 on the processor 7. Therefore, it can be concluded that the heat sink fixing device of this application keeps the pressure of the heat sink 1 on the processor 7 uniformly distributed. Moreover, the effect of this method is better than the first embodiment.

[0082] Furthermore, to more accurately correct the balance between the first and second elastic forces, a deformation monitoring component can be installed in the deformation compensation zone. The deformation monitoring component includes a detection module, a processing module, and a control module. The detection module includes a strain gauge group embedded in the edge of the heat spreader 12. The strain gauge group is evenly distributed along the outer periphery of the heat spreader 12, and the sensitive grid direction of the strain gauge group is consistent with the deformation direction of the heat spreader 12, so that the strain gauge group can accurately capture the signal when the heat spreader 12 deforms. The processing module is connected to the strain gauge group to convert the strain signal into a deformation displacement, and feeds the deformation displacement back to the control module. The control module generates a control command based on the deformation displacement, thereby controlling the pressurization mechanism to adjust the compression state of the first elastic element 4.

[0083] It should be noted that the pressurizing mechanism also includes a drive unit for driving the first elastic element 4 to compress or stretch. The strain gauge group detects the deformation of the heat spreader 12 and feeds it back to the drive unit in real time. The drive unit dynamically adjusts the compression amount of the first elastic element 4 to correct the balance between the first elastic force and the second elastic force.

[0084] The drive unit can be a stepper motor or a servo motor, which adjusts the rotation angle and rotation direction of the locking screw 2 according to the deformation signal output by the strain gauge group, thereby controlling the compression increment of the first elastic element 4.

[0085] As can be seen, the deformation monitoring component and the pressurizing mechanism of this application constitute a closed-loop control system. When the deformation of the heat spreader 12 exceeds the preset threshold, the compression amount of the first elastic element 4 is dynamically adjusted to make the net pressure value of the first elastic force and the second elastic force return to the target range, thereby ensuring that the pressure of the heat sink 1 on the processor 7 is within a stable range.

[0086] In addition, a pressure sensor array can be set on the contact surface between the heat spreader 12 and the processor 7. The detection area of ​​the pressure sensor array covers the core area and non-core area of ​​the processor 7. The output signal of the pressure sensor array is fed back to the control module to drive the pressurization mechanism to adjust the compression state of the first elastic element 4.

[0087] By using both deformation monitoring components and pressure sensor arrays for dual monitoring, a closed-loop control system is constructed to ensure that radiator 1 always maintains optimal pressure distribution under thermal cycling conditions.

[0088] This application also provides a method for dynamic pressure balancing; please refer to [reference needed]. Figure 8 The method includes:

[0089] Pre-compression stage: The first elastic element 4 is compressed by the pressurization mechanism to generate the first elastic force F1, so that the heat sink 1 and the processor 7 are pressed together, and the second elastic element 5 of the compensation mechanism is in an uncompressed state.

[0090] Deformation stage: After the first elastic element 4 reaches the preset compression amount, the first elastic force F1 causes the radiator 1 to deform. The deformed part contacts and compresses the second elastic element 5, and the second elastic element 5 generates a second elastic force F2 in the opposite direction to F1.

[0091] Balance phase: Continuous compression of the first elastic element 4 causes F1 and F2 to grow synchronously, and the supporting force F3 of the processor 7 on the heat sink 1 is controlled by the formula F3=F1-F2;

[0092] in , The stiffness coefficient of the first elastic element is 4. The compression amount of the first elastic element 4; , The stiffness coefficient of the second elastic element is 5. The compression amount of the second elastic element 5, and satisfies Δx is the amount of compression that the first elastic element 4 provides compared to the second elastic element 5;

[0093] Fixed phase: When F3 reaches the target pressure value, the compression of the first elastic element 4 stops, and the elastic forces of the first elastic element 4 and the second elastic element 5 are continuously and dynamically offset.

[0094] This method achieves self-balancing control of the installation pressure of the heatsink 1 by using the timing compression and force cancellation of dual springs, thus avoiding the uneven force on the processor 7 caused by the traditional single-spring pressurization.

[0095] The foregoing has provided a detailed description of a radiator fixing device and a dynamic pressure balancing method provided by embodiments of the present invention. The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to the method section.

[0096] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0097] The above provides a detailed description of the radiator fixing device and pressure dynamic balancing method provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat sink mounting device, comprising a heat sink (1) mounted on a motherboard (8), wherein the heat sink (1) forms thermal conductive contact with a processor (7) disposed on the surface of the motherboard (8), characterized in that, Also includes: A pressurizing mechanism is provided on the upper surface of the heat sink (1) away from the motherboard (8), including at least one first elastic element (4), the first elastic element (4) applies a first elastic force perpendicular to the motherboard (8) to the heat sink (1) in a pre-compression state, the strength of the first elastic force is configured to cause the heat sink (1) to produce controllable elastic deformation. The compensation mechanism is located in the deformation compensation area between the heat sink (1) and the motherboard (8), and includes a second elastic element (5) corresponding to the space of the deformation compensation area. The second elastic element (5) generates a second elastic force opposite to the direction of the first elastic force. Its strength is configured such that when the heat sink (1) generates controllable elastic deformation, the second elastic force can dynamically offset the increment of the first elastic force used to generate controllable elastic deformation.

2. The radiator fixing device according to claim 1, characterized in that, The heat sink (1) includes a heat sink body (11), and a heat spreader (12) is provided at the bottom of the heat sink body (11). The first elastic member (4) abuts against the upper surface of the heat spreader (12) away from the motherboard (8), and the second elastic member (5) abuts against the lower surface of the heat spreader (12) facing the motherboard (8).

3. The radiator fixing device according to claim 2, characterized in that, The lower surface of the heat spreader (12) abuts against the processor (7), which is used to provide the heat spreader (12) with a supporting force opposite to the first elastic force. The contact surface between the heat spreader (12) and the processor (7) is provided with a heat-conducting layer (6).

4. The radiator fixing device according to claim 2, characterized in that, It also includes a locking screw (2) that penetrates the heat spreader (12), the lower end of the locking screw (2) is connected to the main board (8), and the upper end is provided with a limiting nut; The first elastic element (4) is a first compression spring sleeved on the outer periphery of the locking screw (2). The two ends of the first compression spring form rigid contact with the lower surface of the limiting nut and the upper surface of the heat-spreading plate (12), respectively.

5. The radiator fixing device according to claim 4, characterized in that, The second elastic element (5) is a second compression spring. The two ends of the second compression spring are rigidly connected to the lower surface of the heat spreader (12) and the upper surface of the main board (8), respectively. The second compression spring is sleeved on the outer periphery of the locking screw (2) or independently set on the outside of the locking screw (2).

6. The radiator fixing device according to claim 4, characterized in that, The radiator (1) also includes a base plate (13), which is located on the side of the main board (8) away from the heat spreader (12). The lower end of the locking screw (2) passes through the main board (8) and is threadedly connected to the nut (3) on the base plate (13). The base plate (13) is used to provide the processor (7) with a clamping force that abuts against the heat spreader (12).

7. The radiator fixing device according to any one of claims 2-6, characterized in that, The heat sink body (11) is a finned heat dissipation module, the heat spreader (12) is disposed at the bottom of the heat dissipation module, and the number of the first elastic element (4) and the second elastic element (5) is at least three; Multiple first elastic elements (4) are evenly distributed along a first circumferential distribution with the center line of the heat dissipation module as the axis; Multiple second elastic elements (5) are evenly distributed along a second circumferential distribution with the center line of the heat dissipation module as the axis; The first distribution circle and the second distribution circle are concentric circles or circles with different diameters and a predetermined radial distance.

8. The radiator fixing device according to claim 2, characterized in that, The deformation compensation zone is equipped with a deformation monitoring component, which includes: The detection module includes a strain gauge group embedded in the edge of the heat spreader (12), the strain gauge group is distributed at equal intervals along the outer periphery of the heat spreader (12), and the sensitive grid direction of the strain gauge group is consistent with the deformation direction of the heat spreader (12); The processing module, connected to the strain gauge group, is used to convert the strain signal into a deformation displacement. The control module receives the deformation displacement and generates control commands to drive the pressurization mechanism to adjust the compression state of the first elastic element (4); The pressurizing mechanism further includes a driving unit for driving the first elastic element (4) to compress or stretch. The strain gauge group detects the deformation of the heat spreader (12) and feeds it back to the driving unit in real time. The driving unit dynamically adjusts the compression amount of the first elastic element (4) to correct the balance relationship between the first elastic force and the second elastic force. The deformation monitoring component and the pressurizing mechanism constitute a closed-loop control system. When the deformation of the heat spreader (12) exceeds the preset threshold, the compression amount of the first elastic element (4) is dynamically adjusted so that the net pressure value of the first elastic force and the second elastic force returns to the target range.

9. The radiator fixing device according to claim 8, characterized in that, The heat spreader (12) and the processor (7) have a pressure sensor array on their contact surface. The detection area of ​​the pressure sensor array covers the core area and non-core area of ​​the processor (7). The output signal of the pressure sensor array is fed back to the control module to drive the pressurization mechanism to adjust the compression state of the first elastic element (4).

10. A method for dynamic pressure balancing, characterized in that, include: Pre-compression stage: The first elastic element (4) is compressed by the pressurizing mechanism to generate the first elastic force F1, so that the heat sink (1) and the processor (7) are pressed together, and the second elastic element (5) of the compensation mechanism is in an uncompressed state; Deformation stage: After the first elastic element (4) reaches the preset compression amount, the first elastic force F1 causes the radiator (1) to deform, and the deformed part contacts and compresses the second elastic element (5). The second elastic element (5) generates a second elastic force F2 in the opposite direction to F1. Balance phase: Continuously compress the first elastic element (4) to make F1 and F2 grow synchronously, and control the supporting force F3 of the processor (7) on the heat sink (1) by the formula F3=F1-F2; in , The stiffness coefficient of the first elastic element (4) is... The compression amount of the first elastic element (4); , The stiffness coefficient of the second elastic element (5) is... The compression amount of the second elastic element (5) and satisfying Δx is the amount of compression that the first elastic element (4) provides compared to the second elastic element (5); Fixed phase: When F3 reaches the target pressure value, the compression of the first elastic element (4) is stopped, and the elastic forces of the first elastic element (4) and the second elastic element (5) are continuously and dynamically offset.

Images