Rotary vacuum thermocompression bonding device and method

Abstract

The invention relates to the technical field of thermocompression bonding equipment, and particularly discloses a rotary vacuum thermocompression bonding device and method, the rotary vacuum thermocompression bonding device comprises a support ring, the upper surface of the support ring is annularly and fixedly connected with a support rod, the rotary vacuum thermocompression bonding device also comprises a bonding mechanism, the bonding mechanism is fixedly installed at the top of the support rod; and the reinforcing mechanism is fixedly mounted in the bonding mechanism. According to the rotary vacuum hot pressing bonding device and method, the driving frame moves up and down in a reciprocating manner to drive the rotating disc to intermittently rotate clockwise, so that feeding, hot pressing and discharging of the chip composition board are automatically completed, the automation degree of the device is greatly improved, the use threshold of the device is greatly reduced, and the production efficiency is improved. And meanwhile, the bonding groove is locally vacuumized, so that the production efficiency can be greatly improved, and the problem of slow production caused by large-range vacuumizing is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hot-press bonding equipment, in particular to a rotary vacuum hot-press bonding device and method. BACKGROUND

[0002] In the field of microelectronic packaging and semiconductor manufacturing, hot-press bonding technology is a key process for reliable connection between chips and substrates, chips and chips. Through the synergistic effect of heating and pressing, a firm bond is formed at the material interface, directly affecting the electrical performance and reliability of the device. The rotary vacuum hot-press bonding device, as the core equipment of this process, integrates rotary conveying, vacuum environment control and hot-press forming functions, and can realize continuous bonding operation of chip assemblies. Such equipment needs to consider bonding accuracy, operation efficiency and stability of the vacuum environment, and is an important technical support for promoting large-scale and high-precision production of microelectronic devices.

[0003] The existing vacuum hot-press bonding equipment has many limitations. In terms of automation, traditional equipment relies on manual loading, positioning and unloading, which is tedious and prone to bonding deviation due to human operation errors, resulting in low production efficiency and difficulty in meeting large-scale production needs. In terms of vacuum control, traditional equipment often uses the whole chamber vacuum pumping method, which has a large vacuum pumping range and takes a long time. The chamber sealing structure is complex, and the vacuum degree is unstable due to frequent opening and closing, affecting the bonding quality. The product is not well protected, and the chip assemblies in the traditional conveying mechanism are directly in contact with the surface of the equipment, which is easy to cause damage due to friction, especially scratches on the bottom surface of precision chips, reducing product yield. In addition, the traditional sealing components are mostly static structures such as rubber rings, which are prone to sealing failure due to friction and wear during long-term use, not only increasing maintenance costs, but also affecting the bonding effect due to vacuum leakage, restricting the improvement of hot-press bonding process efficiency and reliability. SUMMARY

[0004] (I) Technical problems solved

[0005] The present application provides a rotary vacuum hot-press bonding device and method, which solves the problems mentioned in the background art.

[0006] (II) Technical solutions

[0007] In order to achieve the above object, the application is implemented by the following technical scheme: a rotary vacuum hot-press bonding device, comprising a support ring, the upper surface of the support ring is fixedly connected with a support rod in a ring shape, further comprising: a bonding mechanism, the bonding mechanism is fixedly installed at the top of the support rod; a reinforcing mechanism, the reinforcing mechanism is fixedly installed inside the bonding mechanism; wherein the bonding mechanism comprises a bottom disc, the bottom disc is fixedly connected at the top of the support rod, a discharge slot is formed through the lower surface of the bottom disc, a connecting ring is fixedly connected on the upper surface of the edge of the bottom disc, a top disc is fixedly connected on the top inner surface of the connecting ring, an inlet slot is formed through the upper surface of the top disc, a bonding slot is formed through the upper surface of the side of the top disc away from the inlet slot, a storage tube is fixedly connected on the upper surface of the top disc, wherein the storage tube is arranged directly above the inlet slot, and a first air pipe is fixedly connected through the outer surface of the bottom disc, wherein the inner end of the first air pipe is arranged directly below the bonding slot.

[0008] According to one embodiment of the application, the upper surface of the bottom disc is rotatably connected with a rotating disc, the upper surface of the rotating disc is rotatably connected with the lower surface of the top disc, a filling slot is formed through the upper surface of the rotating disc, two filling slots are symmetrically arranged on the rotating disc, a drive rod is rotatably connected through the upper surface of the middle part of the top disc, and the bottom of the drive rod is rotatably connected with the upper surface of the middle part of the bottom disc through the rotating disc.

[0009] According to one embodiment of the application, the upper surfaces of the two sides of the top disc are fixedly connected with slide rods, the slide rods are symmetrically arranged on the two sides of the drive rod, the drive rod is arranged as a threaded rod, a drive frame is threadedly connected with the outer surface of the drive rod, a hydraulic device is arranged on the drive frame, the two ends of the drive frame are slidably sleeved on the outer surfaces of the slide rods, a heating block is fixedly installed on the outer end of the drive frame, and the heating block is arranged on the same central axis as the bonding slot.

[0010] According to one embodiment of the application, the middle part of the rotating disc is fixedly embedded with a mounting ring, the inner surface of the mounting ring is fixedly connected with a baffle, a sleeve is fixedly sleeved on the outer surface of the bottom of the drive rod, the sleeve is arranged inside the mounting ring, the outer surface of the sleeve is hingedly connected with a dislocation plate through a torsional spring, and the baffle is initially arranged in an inclined manner.

[0011] According to one embodiment of the present invention, the reinforcing mechanism includes mounting grooves symmetrically formed on both sides of the bottom surface of the rotating disk, wherein the mounting grooves are symmetrically arranged on both sides of the bottom of the filling groove. A positioning plate is fixedly connected to the inner surface of the mounting groove, and a connecting rod is slidably connected through the side surface of the positioning plate. A protrusion is fixedly connected to the outer end of the connecting rod, and a sliding plate is fixedly connected to the end of the connecting rod away from the protrusion. An elastic telescopic rod is fixedly connected to the inner surface of the middle part of the sliding plate, and the end of the elastic telescopic rod away from the sliding plate is fixedly connected to the side surface of the positioning plate.

[0012] According to one embodiment of the present invention, an annular groove is formed on the lower surface of the center of the rotating disk, and elastic sheets are symmetrically fixedly connected to the inner surface of the annular groove. The elastic sheets are arc-shaped, and compression bladders are fixedly connected to the inner surface of the elastic sheets. Each compression bladder communicates with the internal cavity of the elastic telescopic rod on its opposite side.

[0013] According to one embodiment of the present invention, a fitting ring is fixedly connected to the upper surface of the middle part of the chassis. The fitting ring is disposed in a ring groove, wherein the fitting ring and the ring groove are configured with the same central axis. An extrusion block is fixedly connected to the outer surface of the fitting ring, and the extrusion block is disposed opposite to the discharge groove.

[0014] According to one embodiment of the present invention, the outer surface of the drive rod is connected to a limiting ring by a thread. A telescopic ring is fixedly connected to the top inner surface of the limiting ring. The output end of the telescopic ring is fixedly connected to the middle upper surface of the drive frame. The inner surface of the drive frame is slidably connected to the outer surface of the limiting ring. A second air pipe is fixedly connected through the side of the chassis away from the first air pipe. The second air pipe is located directly below the feed trough and communicates with the internal cavity of the telescopic ring. The end of the drive frame away from the heating block is slidably sleeved on the outer surface of the storage tube. A sliding ring is slidably sleeved on the bottom outer surface of the storage tube. A pressure bladder is fixedly connected to the bottom of the sliding ring. The bottom of the pressure bladder is fixedly connected to the upper surface of the top plate. A first sealing bladder is fixedly embedded in the bottom surface of the top plate. The first sealing bladder is located directly below the bonding groove. A second sealing bladder is fixedly embedded in the upper surface of the chassis. The second sealing bladder is located directly below the filling groove on one side of the bonding groove. The first and second sealing bladders communicate with the internal cavities of the pressure bladder.

[0015] This invention provides a method of using a rotary vacuum hot-press bonding device, comprising the following steps: S1. Drive the hydraulic equipment to press the drive frame down to the bottom of the drive rod, then place the pre-bonded circular chip assembly boards one by one into the storage tube and press them down. At this time, the bottom chip assembly board is located in the filling groove of the rotating disk. S2. The drive frame is pulled upward by the hydraulic equipment. Under the action of the screw, the rotating disk starts to rotate. When the drive frame reaches the top of the drive rod, the filling slot of the chip assembly board rotates to the bottom of the bonding slot and aligns with it. Then, the drive frame is pressed down again by the hydraulic equipment. After the heating block enters the bonding slot at the bottom, the bonding slot is evacuated to a vacuum state through the No. 1 air pipe until the heating block enters the bonding slot to heat and squeeze the chip assembly board and maintain pressure. S3. After the thermosetting bonding is completed, the drive frame moves upward again. Under the action of the threads, the rotating disk begins to rotate further. When the bonded chip assembly board on the rotating disk rotates to the discharge slot on the chassis, it is discharged. The hydraulic equipment causes the drive frame to move up and down repeatedly, thus completing the continuous thermosetting bonding and discharge of the chip assembly board. The initially bonded circular chip assembly boards are placed into the storage tube in sequence. Under the action of gravity, the chip assembly boards are stacked in the storage tube, and the bottom chip assembly board enters the filling slot of the rotating disk. At this time, the drive frame is at the bottom of the drive rod. Once the chip assembly board is loaded, the drive frame can be moved upwards using an external hydraulic device. At this point, the drive rod begins to rotate clockwise under the action of the threads, meaning the sleeve at the bottom of the drive rod begins to rotate. This, in turn, drives the rotating disk to rotate through the interlocking action between the misalignment plate and the baffle hinged to the outer surface of the sleeve. When the drive frame moves to the top of the drive rod, the filling slot for the chip assembly board rotates to directly below the bonding slot. Then, the drive frame is pressed down again using the hydraulic device, causing the drive rod to rotate counterclockwise, meaning the sleeve and misalignment plate begin to rotate counterclockwise. When the misalignment plate rotates counterclockwise, it comes into contact with the baffle and is squeezed, causing it to rotate. This prevents the sleeve from rotating counterclockwise and thus prevents the mounting ring from rotating. In other words, the rotating disk remains stationary when the drive frame presses down. Finally, the heating block on the drive frame begins to embed into the bonding groove. Just as the heating block enters the bonding groove, the groove is evacuated to a vacuum state through the first air pipe. That is, when the heating block is fully inside the bonding groove and heats and compresses the chip assembly board, the bonding groove is in a relative vacuum state, ultimately completing the vacuum thermo-press bonding of the chip assembly board. After the thermo-pressing is complete, the drive frame is pulled upwards again. As the drive frame moves upward, it synchronously drives the rotating disk to rotate clockwise. Then, as the heating block moves upward with the drive frame, the chip assembly board that has been hot-pressed gradually rotates to the discharge slot of the chassis. When the chip assembly board is aligned with the discharge slot, it falls through the discharge slot to complete the export. When the drive frame moves to the top of the drive rod, the filling slot of the exported chip assembly board is aligned with the feeding slot. At this time, the chip assembly board to be processed falls downward under the action of gravity and re-enters the filling slot to complete the automatic filling of the chip assembly board. At the same time, the other filling slot of the chip assembly board is re-aligned with the bonding slot.

[0016] (III) Beneficial Effects

[0017] This invention provides a rotary vacuum hot-press bonding apparatus and method. It has the following beneficial effects: (I) This rotary vacuum hot pressing bonding device and method can drive the rotating disk to rotate intermittently clockwise by the reciprocating up and down movement of the drive frame, thereby automatically completing the loading, hot pressing and unloading of the chip assembly board, greatly improving the automation level of the equipment and thus greatly reducing the threshold for using the equipment. At the same time, by partially evacuating the bonding groove to a vacuum, the production efficiency can be greatly improved, avoiding the problem of slow production caused by the need for large-scale vacuuming.

[0018] (II) In this rotary vacuum thermoforming bonding device and method, when the rotating disk rotates clockwise, it simultaneously drives the elastic sheet and extrusion bladder in the bottom annular groove to rotate. As the elastic sheet gradually rotates to the discharge groove side, it contacts the extrusion block of the fitting ring on the chassis and generates extrusion, causing the elastic sheet to be gradually deformed and thus extruding the extrusion bladder. This causes the extrusion bladder to transfer its internal air pressure to the elastic telescopic rod on its outer side, causing the elastic telescopic rod to start pushing the sliding plate to move outward in the mounting groove. This, in turn, drives the protrusion to move into the mounting groove through the connecting rod, that is, the upper surface of the protrusion gradually detaches from the chipset. The contact surface of the chip assembly board is made with the bottom surface of the board, and the protrusion fully retracts when the filling groove and the discharge groove are aligned. At this time, the hot-pressed chip assembly board falls out from the discharge groove and is discharged. This achieves a suspension distance between the bottom surface of the chip assembly board and the contact surface of the protrusion and the chassis after the chip assembly board is first introduced into the filling groove, which protects the bottom surface of the chip assembly board and avoids the problem of damage to the chip assembly board caused by friction between the bottom surface of the chip assembly board and the chassis when the rotating disk rotates. The chip assembly board automatically retracts when the filling groove moves to the discharge groove, opening the bottom of the filling groove to facilitate the discharge of the processed chip assembly board, further improving the automation level of this equipment.

[0019] (III) In this rotary vacuum thermoforming bonding device and method, when the drive frame moves downward, it first pulls the telescopic ring to expand. When the telescopic ring is stretched to its maximum value, it drives the limiting ring to move downward. At this time, the drive rod begins to rotate. When the telescopic ring is stretched, its interior is in a negative pressure state, that is, it begins to draw air pressure through the second air pipe, thereby generating a suction force at the feed trough, which helps the chip assembly board in the storage tube to enter the filling trough better, avoiding the problem of the chip assembly board being blocked and unable to enter the filling trough smoothly. As the drive frame continues to move downward, the drive frame eventually contacts and squeezes the sliding ring at the bottom of the storage tube, thereby squeezing the pressure bladder through the sliding ring, so that the pressure bladder delivers its internal air pressure to the first sealing bladder. The expansion of the No. 1 and No. 2 sealing bladders, along with the interior of the No. 2 sealing bladder, causes them to expand, sealing the upper and lower sides of the filling groove. This prevents vacuum environment failure caused by incomplete sealing during vacuuming of the bonding groove. Simultaneously, as the rotating disk on the drive frame begins to rotate, the No. 1 and No. 2 sealing bladders contract, disengaging from the upper and lower surfaces of the rotating disk. This ensures that the sealing of the filling groove is achieved only during hot pressing, and that the bladders do not contact the rotating disk during rotation. This not only reduces the friction between the No. 1 and No. 2 sealing bladders and the rotating disk, thus lowering the operating resistance of the equipment, but also differs from existing sealing methods that use sealing rubber rings, avoiding the problem of short service life caused by prolonged friction of the sealing rubber rings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the drive frame and its connection structure of the present invention; Figure 3 This is a schematic diagram of the rotating disk and its connecting structure of the present invention; Figure 4 This is a schematic diagram of the sleeve and its connection structure of the present invention; Figure 5 This is a schematic diagram of the interlocking ring and the second sealing bladder of the present invention; Figure 6 This is a schematic diagram of the bottom structure of the rotating disk of the present invention; Figure 7 This is a schematic diagram of the top plate structure of the present invention; Figure 8 This is a schematic diagram of the internal structure of the mounting ring of the present invention.

[0021] In the diagram: 1. Support ring; 2. Support rod; 3. Bonding mechanism; 31. Base; 32. Discharge chute; 33. Connecting ring; 34. Top plate; 35. Feed chute; 36. Bonding groove; 37. Storage pipe; 38. No. 1 air pipe; 39. Rotating disc; 310. Filling groove; 311. Drive rod; 312. Slide rod; 313. Drive frame; 314. Heating block; 315. Mounting ring; 316. Baffle; 317. Sleeve; 318. Misalignment 4. Positioning plate; 4. Reinforcing mechanism; 41. Mounting groove; 42. Positioning plate; 43. Connecting rod; 44. Protrusion; 45. Sliding plate; 46. Elastic telescopic rod; 47. Ring groove; 48. Elastic sheet; 49. Compression bladder; 410. Fitting ring; 411. Compression block; 412. Limiting ring; 413. Telescopic ring; 414. No. 2 air tube; 415. Sliding ring; 416. Pressure bladder; 417. No. 1 sealing bladder; 418. No. 2 sealing bladder. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] First embodiment: as follows Figures 1 to 8 As shown, the present invention provides a technical solution: a rotary vacuum hot-press bonding device, including a support ring 1, a support rod 2 fixedly connected in a ring shape to the upper surface of the support ring 1, and further including: Bonding mechanism 3 is fixedly installed on the top of support rod 2; Reinforcing mechanism 4 is fixedly installed inside bonding mechanism 3; The bonding mechanism 3 includes a chassis 31, which is fixedly connected to the top of the support rod 2. A discharge groove 32 is provided through the lower surface of the chassis 31. A connecting ring 33 is fixedly connected to the upper edge of the chassis 31. A top plate 34 is fixedly connected to the inner top surface of the connecting ring 33. A feed groove 35 is provided through the upper surface of the top plate 34. A bonding groove 36 is provided through the upper surface of the top plate 34 on the side away from the feed groove 35. A storage pipe 37 is fixedly connected to the upper surface of the top plate 34, which is located directly above the feed groove 35. A first air pipe 38 is fixedly connected through the outer surface of the chassis 31, and the inner end of the first air pipe 38 is located directly below the bonding groove 36.

[0024] A rotating disk 39 is rotatably connected to the upper surface of the chassis 31. The upper surface of the rotating disk 39 is rotatably connected to the lower surface of the top plate 34. A filling groove 310 is provided through the upper surface of the rotating disk 39. Two filling grooves 310 are symmetrically arranged on the rotating disk 39. A drive rod 311 is rotatably connected through the middle upper surface of the top plate 34. The bottom of the drive rod 311 is rotatably connected through the rotating disk 39 to the middle upper surface of the chassis 31.

[0025] Slide rods 312 are fixedly connected to the upper surfaces of both sides of the top plate 34. The slide rods 312 are symmetrically arranged on both sides of the drive rod 311. The drive rod 311 is a threaded rod. The outer surface of the drive rod 311 is connected to the drive frame 313 by thread. The drive frame 313 is externally connected to a hydraulic device. The two ends of the drive frame 313 are slidably sleeved on the outer surface of the slide rods 312. A heating block 314 is fixedly installed on the outer end of the drive frame 313. The heating block 314 and the bonding groove 36 are arranged on the same central axis.

[0026] A mounting ring 315 is fixedly embedded in the middle of the rotating disk 39. A baffle 316 is fixedly connected to the inner surface of the mounting ring 315. A sleeve 317 is fixedly sleeved on the bottom outer surface of the drive rod 311. The sleeve 317 is located inside the mounting ring 315. A misalignment plate 318 is hinged to the outer surface of the sleeve 317 by a torsion spring. The baffle 316 is inclined. The misalignment plate 318 is also initially inclined.

[0027] Second embodiment: as follows Figures 1 to 8 As shown, the reinforcing mechanism 4 includes a mounting groove 41, which is symmetrically opened on both sides of the bottom surface of the rotating disk 39. The mounting groove 41 is symmetrically arranged on both sides of the bottom of the filling groove 310. A positioning plate 42 is fixedly connected to the inner surface of the mounting groove 41. A connecting rod 43 is slidably connected through the side surface of the positioning plate 42. A protrusion 44 is fixedly connected to the outer end of the connecting rod 43. A sliding plate 45 is fixedly connected to the end of the connecting rod 43 away from the protrusion 44. An elastic telescopic rod 46 is fixedly connected to the inner surface of the middle part of the sliding plate 45. The end of the elastic telescopic rod 46 away from the sliding plate 45 is fixedly connected to the side surface of the positioning plate 42.

[0028] A ring groove 47 is provided on the lower surface of the middle part of the rotating disk 39. An elastic sheet 48 is symmetrically fixedly connected to the inner surface of the ring groove 47. The elastic sheet 48 is arc-shaped. A compression bladder 49 is fixedly connected to the inner surface of the elastic sheet 48. Each compression bladder 49 is connected to the internal cavity of the elastic telescopic rod 46 on its opposite side.

[0029] A fitting ring 410 is fixedly connected to the upper surface of the middle part of the chassis 31. The fitting ring 410 is set in the ring groove 47, wherein the fitting ring 410 and the ring groove 47 are set to the same central axis. An extrusion block 411 is fixedly connected to the outer surface of the fitting ring 410, and the extrusion block 411 is set opposite to the discharge chute 32.

[0030] A limit ring 412 is threadedly connected to the outer surface of the drive rod 311. A telescopic ring 413 is fixedly connected to the top inner surface of the limit ring 412. The output end of the telescopic ring 413 is fixedly connected to the upper middle surface of the drive frame 313. The inner surface of the drive frame 313 is slidably connected to the outer surface of the limit ring 412. A second air pipe 414 is fixedly connected through the side of the chassis 31 away from the first air pipe 38. The second air pipe 414 is located directly below the feed trough 35 and communicates with the internal cavity of the telescopic ring 413. The end of the drive frame 313 away from the heating block 314 is slidably sleeved on the storage compartment. A sliding ring 415 is slidably sleeved on the outer surface of the tube 37 and the bottom outer surface of the storage tube 37. A pressure bladder 416 is fixedly connected to the bottom of the sliding ring 415. The bottom of the pressure bladder 416 is fixedly connected to the upper surface of the top plate 34. A first sealing bladder 417 is fixedly embedded on the bottom surface of the top plate 34. The first sealing bladder 417 is located directly below the bonding groove 36. A second sealing bladder 418 is fixedly embedded on the upper surface of the bottom plate 31. The second sealing bladder 418 is located directly below the filling groove 310 on one side of the bonding groove 36. The first sealing bladder 417 and the second sealing bladder 418 are respectively connected to the internal cavity of the pressure bladder 416.

[0031] A method of using a rotary vacuum thermoforming bonding apparatus includes the following steps: S1. Drive the hydraulic equipment to press the drive frame 313 down to the bottom of the drive rod 311, and then place the pre-bonded circular chip assembly boards one by one into the storage tube 37 and press them down. At this time, the bottom chip assembly board is located in the filling groove 310 of the rotating disk 39. S2. The drive frame 313 is pulled upward by the hydraulic equipment. Under the action of the screw, the rotating disk 39 starts to rotate. When the drive frame 313 reaches the top of the drive rod 311, the filling slot 310 of the chip assembly board rotates to be directly below the bonding slot 36 and aligned with it. Then, the drive frame 313 is pressed down again by the hydraulic equipment. After the heating block 314 enters the bonding slot 36 at the bottom, the bonding slot 36 is evacuated to a vacuum state through the first air pipe 38 until the heating block 314 enters the bonding slot 36 to heat, squeeze and hold the chip assembly board. S3. After the hot-press bonding is completed, the drive frame 313 is moved up again. Under the action of the thread, the rotating disk 39 begins to rotate further. When the chip assembly board that has been bonded on the rotating disk 39 rotates to the discharge slot 32 on the chassis 31, it is discharged. The drive frame 313 is moved up and down repeatedly by the hydraulic equipment to complete the continuous hot-press bonding and discharge of the chip assembly board.

[0032] During operation, the pre-bonded circular chip assembly boards are sequentially placed into the storage tube 37. Under the influence of gravity, the chip assembly boards are stacked within the storage tube 37, with the bottom chip assembly board entering the filling slot 310 of the rotating disk 39. At this time, the drive frame 313 is at the bottom of the drive rod 311. After the chip assembly boards are loaded, the drive frame 313 can be pulled upwards by an external hydraulic device. At this time, the drive rod 311 begins to rotate clockwise under the action of the threads, which means that the sleeve 317 at the bottom of the drive rod 311 begins to rotate. This, through the locking action between the misalignment plate 318 hinged to the outer surface of the sleeve 317 and the baffle 316, drives the rotating disk 39 to rotate. When the drive frame 313 moves to the drive... At the top of rod 311, the filling slot 310 for loading the chip assembly board rotates to directly below the bonding slot 36. At this point, the drive frame 313 is pressed down again by hydraulic equipment, which starts to drive the drive rod 311 to rotate counterclockwise. That is, the sleeve 317 and the misalignment plate 318 begin to rotate counterclockwise. When the misalignment plate 318 rotates counterclockwise, it comes into contact with the baffle 316 and is squeezed, causing it to rotate. This prevents the sleeve 317 from driving the mounting ring 315 to rotate when it rotates counterclockwise. That is, when the drive frame 313 is pressed down, the rotating disk 39 is in a stationary state. Finally, the heating block 314 on the drive frame 313 begins to fit into the bonding slot 36. When the heating block 314 just enters the bonding slot 36, the bonding slot 36 is evacuated to a vacuum state through the first air pipe 38. In the heat-pressing process, when the heating block 314 is fully inserted into the bonding groove 36 to heat and compress the chip assembly board, the bonding groove 36 is in a relative vacuum state, ultimately completing the vacuum heat-pressing bonding of the chip assembly board. After the heat-pressing is completed, the drive frame 313 is pulled upward again. As the drive frame 313 moves upward, it synchronously drives the rotating disk 39 to rotate clockwise. As the heating block 314 moves upward with the drive frame 313, the heat-pressed chip assembly board gradually rotates to the discharge slot 32 of the chassis 31. When the chip assembly board is aligned with the discharge slot 32, it falls through the discharge slot 32 to complete the export. When the drive frame 313 moves to the top of the drive rod 311, the filling slot 310 of the exported chip assembly board is aligned with the feeding slot 35. At this time, the chip assembly board to be processed... Under the influence of gravity, the chip assembly board falls downwards and re-enters the filling slot 310, completing the automatic filling of the chip assembly board. Meanwhile, the other filling slot 310, which holds the chip assembly board, realigns with the bonding slot 36. The reciprocating up-and-down movement of the drive frame 313 drives the rotating disk 39 to rotate intermittently clockwise, thus automatically completing the loading, hot pressing, and unloading of the chip assembly board. This significantly improves the automation level of the equipment and greatly lowers the barrier to entry for its use. Furthermore, by partially vacuuming the bonding slot 36, production efficiency is greatly improved, avoiding the slow production caused by requiring large-scale vacuuming. When the rotating disk 39 rotates clockwise, it simultaneously drives the elastic sheet 48 and the compression bladder 49 within its bottom annular groove 47 to rotate.As the elastic sheet 48 gradually rotates to the side of the discharge trough 32, it contacts and is squeezed by the extrusion block 411 of the fitting ring 410 on the chassis 31. This causes the elastic sheet 48 to be gradually squeezed and deformed, thereby squeezing the extrusion bladder 49. The extrusion bladder 49 then transfers its internal air pressure to the elastic telescopic rod 46 on its outer side. This causes the elastic telescopic rod 46 to push the sliding plate 45 to move outward in the mounting groove 41. Consequently, it begins to drive the protrusion 44 into the mounting groove 41 via the connecting rod 43. That is, the upper surface of the protrusion 44 gradually detaches from the contact with the bottom surface of the chip assembly board. When the filling groove 310 and the discharge trough 32 are aligned, the protrusion 44 completely retracts. At this time, the hot-pressed chip assembly board falls out of the discharge trough 32 and is discharged. The system ensures that after the chip assembly board is introduced into the filling slot 310, there is a gap between its bottom surface and the contact point between the bump 44 and the chassis 31, protecting the bottom surface of the chip assembly board and preventing damage caused by friction between the bottom surface and the chassis 31 when the chip assembly board rotates with the rotating disk 39. The system automatically retracts when the filling slot 310 moves to the discharge slot 32, opening the bottom of the filling slot 310 to facilitate the removal of the processed chip assembly board, further improving the automation level of the equipment. When the drive frame 313 moves downward, it first pulls the telescopic ring 413 to expand. When the telescopic ring 413 is stretched to its maximum value, it drives the limit ring 412 to move downward. Only then does the drive rod 311 begin to rotate. When stretched, its interior is under negative pressure, meaning that air pressure is drawn in through the second air pipe 414, creating a suction force at the feed trough 35. This helps the chip assembly board in the storage tube 37 to better enter the filling trough 310, preventing the chip assembly board from being blocked and unable to enter the filling trough 310 smoothly. As the drive frame 313 continues to move downward, it eventually contacts and compresses the sliding ring 415 at the bottom of the storage tube 37. This compresses the pressure bladder 416 through the sliding ring 415, causing the pressure bladder 416 to transfer its internal air pressure to the first sealing bladder 417 and the second sealing bladder 418. This causes the first sealing bladder 417 and the second sealing bladder 418 to expand, thus compressing the filling trough. The upper and lower sides of the groove 310 are sealed to prevent vacuum environment failure caused by incomplete sealing during vacuuming of the bonding groove 36. Simultaneously, when the rotating disk 39 on the drive frame 313 begins to rotate, the first sealing bag 417 and the second sealing bag 418 contract, disengaging from contact with the upper and lower surfaces of the rotating disk 39. This ensures that the sealing of the sides of the filling groove 310 is achieved only during hot pressing, and that the sealing bags do not contact the rotating disk 39 during its rotation. This not only reduces the friction between the first sealing bag 417 and the second sealing bag 418 and the rotating disk 39, thus reducing the operating resistance of the equipment, but also differs from existing sealing methods that use sealing rubber rings, avoiding the problem of short service life caused by prolonged friction of the sealing rubber rings.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rotary vacuum hot-press bonding device, comprising a support ring (1), characterized in that: The upper surface of the support ring (1) is fixedly connected to the support rod (2) in a ring shape, and also includes: A bonding mechanism (3) is fixedly installed on the top of the support rod (2); The reinforcing mechanism (4) is fixedly installed inside the bonding mechanism (3); The bonding mechanism (3) includes a chassis (31), which is fixedly connected to the top of the support rod (2). A discharge groove (32) is provided through the lower surface of the chassis (31). A connecting ring (33) is fixedly connected to the upper edge of the chassis (31). A top plate (34) is fixedly connected to the inner top surface of the connecting ring (33). A feed groove (35) is provided through the upper surface of the top plate (34). A bonding groove (36) is provided through the upper surface of the top plate (34) away from the feed groove (35). A storage pipe (37) is fixedly connected to the upper surface of the top plate (34). The storage pipe (37) is located directly above the feed groove (35). A first air pipe (38) is fixedly connected through the outer surface of the chassis (31). The inner end of the first air pipe (38) is located directly below the bonding groove (36).

2. The rotary vacuum hot-press bonding device according to claim 1, characterized in that: The upper surface of the chassis (31) is rotatably connected to a rotating disk (39), the upper surface of the rotating disk (39) is rotatably connected to the lower surface of the top plate (34), a filling groove (310) is provided through the upper surface of the rotating disk (39), two filling grooves (310) are symmetrically arranged on the rotating disk (39), a drive rod (311) is rotatably connected through the middle upper surface of the top plate (34), and the bottom of the drive rod (311) is rotatably connected through the rotating disk (39) to the middle upper surface of the chassis (31).

3. The rotary vacuum hot-press bonding device according to claim 2, characterized in that: The top plate (34) has slide rods (312) fixedly connected to the upper surfaces of both sides. The slide rods (312) are symmetrically arranged on both sides of the drive rod (311). The drive rod (311) is a threaded rod. The outer surface of the drive rod (311) is connected to a drive frame (313) by thread. The drive frame (313) is externally connected to a hydraulic device. The two ends of the drive frame (313) are slidably sleeved on the outer surface of the slide rod (312). The outer end of the drive frame (313) is fixedly installed with a heating block (314). The heating block (314) and the bonding groove (36) are arranged on the same central axis.

4. The rotary vacuum hot-press bonding device according to claim 3, characterized in that: A mounting ring (315) is fixedly embedded in the middle of the rotating disk (39). A baffle (316) is fixedly connected to the inner surface of the mounting ring (315). A sleeve (317) is fixedly sleeved on the bottom outer surface of the drive rod (311). The sleeve (317) is located inside the mounting ring (315). A misalignment plate (318) is hinged to the outer surface of the sleeve (317) by a torsion spring. The baffle (316) is inclined. The misalignment plate (318) is also initially inclined.

5. The rotary vacuum hot-press bonding device according to claim 4, characterized in that: The reinforcing mechanism (4) includes a mounting groove (41), which is symmetrically opened on both sides of the bottom surface of the rotating disk (39). The mounting groove (41) is symmetrically arranged on both sides of the bottom of the filling groove (310). A positioning plate (42) is fixedly connected to the inner surface of the mounting groove (41). A connecting rod (43) is slidably connected through the side surface of the positioning plate (42). A protrusion (44) is fixedly connected to the outer end of the connecting rod (43). A sliding plate (45) is fixedly connected to the end of the connecting rod (43) away from the protrusion (44). An elastic telescopic rod (46) is fixedly connected to the inner surface of the middle part of the sliding plate (45). The end of the elastic telescopic rod (46) away from the sliding plate (45) is fixedly connected to the side surface of the positioning plate (42).

6. The rotary vacuum hot-press bonding device according to claim 5, characterized in that: The lower surface of the rotating disk (39) is provided with an annular groove (47). An elastic sheet (48) is symmetrically fixedly connected to the inner surface of the annular groove (47). The elastic sheet (48) is set in an arc shape. A compression bladder (49) is fixedly connected to the inner surface of the elastic sheet (48). Each compression bladder (49) is connected to the cavity inside the elastic telescopic rod (46) on its opposite side.

7. The rotary vacuum hot-press bonding device according to claim 6, characterized in that: A fitting ring (410) is fixedly connected to the upper surface of the middle part of the chassis (31). The fitting ring (410) is set in the ring groove (47), wherein the fitting ring (410) and the ring groove (47) are set to the same central axis. An extrusion block (411) is fixedly connected to the outer surface of the fitting ring (410), and the extrusion block (411) is set opposite to the discharge groove (32).

8. The rotary vacuum hot-press bonding device according to claim 7, characterized in that: The outer surface of the drive rod (311) is connected to a limiting ring (412) by a thread. A telescopic ring (413) is fixedly connected to the top inner surface of the limiting ring (412). The output end of the telescopic ring (413) is fixedly connected to the upper middle surface of the drive frame (313). The inner surface of the drive frame (313) is slidably connected to the outer surface of the limiting ring (412). A second air pipe (414) is fixedly connected through the side of the chassis (31) away from the first air pipe (38). The second air pipe (414) is located directly below the feed trough (35) and communicates with the internal cavity of the telescopic ring (413). The end of the drive frame (313) away from the heating block (314) is slidably sleeved on the storage pipe (314). 7) The outer surface of the storage tube (37) is slidably fitted with a sliding ring (415). The bottom of the sliding ring (415) is fixedly connected with a pressure bladder (416). The bottom of the pressure bladder (416) is fixedly connected to the upper surface of the top plate (34). The bottom surface of the top plate (34) is fixedly inlaid with a first sealing bladder (417). The first sealing bladder (417) is located directly below the bonding groove (36). The upper surface of the base plate (31) is fixedly inlaid with a second sealing bladder (418). The second sealing bladder (418) is located directly below the filling groove (310) on one side of the bonding groove (36). The first sealing bladder (417) and the second sealing bladder (418) are respectively connected to the internal cavity of the pressure bladder (416).

9. A method of using a rotary vacuum hot-press bonding apparatus, comprising using the rotary vacuum hot-press bonding apparatus as described in claim 8, characterized in that: Includes the following steps: S1. Drive the hydraulic equipment to press the drive frame (313) down to the bottom of the drive rod (311), and then place the pre-bonded circular chip assembly boards one by one into the storage tube (37) and press them down. At this time, the bottom chip assembly board is located in the filling groove (310) of the rotating disk (39). S2. The drive frame (313) is pulled upward by the hydraulic equipment. Under the action of the screw, the rotating disk (39) starts to rotate. When the drive frame (313) reaches the top of the drive rod (311), the filling slot (310) of the chip assembly board rotates to the bottom of the bonding slot (36) and aligns with it. Then, the drive frame (313) is pressed down again by the hydraulic equipment. After the heating block (314) enters the bonding slot (36) at the bottom, the bonding slot (36) is evacuated to a vacuum state through the No. 1 air pipe (38) until the heating block (314) enters the bonding slot (36) to heat and squeeze the chip assembly board and maintain pressure. S3. After the hot-press bonding is completed, the drive frame (313) is moved up again. Under the action of the thread, the rotating disk (39) begins to rotate further. When the chip assembly board that has been bonded on the rotating disk (39) rotates to the discharge slot (32) on the chassis (31), it is discharged. The drive frame (313) is moved up and down repeatedly by the hydraulic equipment to complete the continuous hot-press bonding and discharge of the chip assembly board.

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