Fan-out type packaging structure and packaging method thereof

Abstract

The invention discloses a fan-out type packaging structure and a packaging method thereof. The fan-out type packaging structure comprises a metal heat dissipation assembly, heat-conducting glue, a heat-conducting medium, a molding compound, an RDL layer and a solder ball. According to the semiconductor packaging piece, the chip is packaged in the metal heat dissipation assembly with the groove, and the heat conduction layers filled with the heat conduction medium are formed on the side faces and the front face of the chip, so that the six faces of the chip are all communicated with the metal heat dissipation assembly, the heat dissipation area is increased, the heat dissipation thermal resistance of the six faces of the chip is reduced, and the thermal performance and the heat dissipation efficiency of the semiconductor packaging piece can be improved; and the thermal resistance between interfaces is also reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a fan-out packaging structure and a packaging method thereof. BACKGROUND

[0002] As shown in the drawings, the conventional fan-out packaging structure relies on the back of the chip for heat dissipation, but high-power chips have higher requirements for heat dissipation efficiency and heat dissipation area. Figure 10

[0003] Therefore, it is necessary to develop a fan-out packaging structure and a packaging method thereof to solve the above problems. SUMMARY

[0004] The purpose of the present application is to design a fan-out packaging structure and a packaging method thereof to solve the above problems.

[0005] The present application achieves the above-mentioned purpose through the following technical solutions: A fan-out packaging structure, comprising: a metal heat dissipation component, a recess is arranged in the metal heat dissipation component, and a chip is arranged in the recess; a heat-conducting glue, the back of the chip is connected to the bottom of the recess through the heat-conducting glue, a heat-conducting medium, the front of the chip and the four side surfaces of the chip are connected to the side wall of the recess through the heat-conducting medium; a plastic sealing material, the top of the metal heat dissipation component, the top of the heat-conducting medium, and the outer side wall of the metal heat dissipation component are all plastic-sealed through the plastic sealing material; an RDL layer, the metal copper column of the chip is connected to the RDL layer through the plastic sealing material.

[0006] a solder ball, the solder ball is arranged on the top of the RDL layer.

[0007] A packaging method of a fan-out packaging structure, characterized by comprising the following steps: S1, obtaining a substrate; S2, mounting a metal heat dissipation component on the substrate; S3, using a chip picking and placing device to paste a chip into the recess of the metal heat dissipation component, and connecting the bottom of the chip to the metal heat dissipation component through a heat-conducting glue.

[0008] S4, filling the gap between the front of the chip and the four side surfaces of the chip and the metal heat dissipation component with a heat-conducting medium, and extending the filling of the heat-conducting medium into a filling groove; S5, plastic-sealing the top of the metal heat dissipation component, the top of the heat-conducting medium, and the outer side wall of the metal heat dissipation component through a plastic sealing material, and using a grinding process to grind the plastic sealing material on the top of the metal heat dissipation component and the top of the heat-conducting medium, and grinding out the metal copper column of the chip; S6, manufacturing an RDL circuit;​ S7, forming a final single-packaged chip unit by ball mounting and cutting.

[0009] The present application has the following advantages: In the present application, the chip is packaged in a metal heat-dissipating component with a groove, and a heat-conducting medium-filled heat-conducting layer is formed on the side and front of the chip, so that the six sides of the chip are in communication with the metal heat-dissipating component, the heat-dissipating area is increased, the heat-dissipating thermal resistance of the six sides of the chip is reduced, the thermal performance and heat-dissipating efficiency of the semiconductor package are improved, and the thermal resistance between the interfaces is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a structural schematic diagram of the present application; Figure 2 is a step S1 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 3 is a step S2 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 4 is a step S3 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 5 is a step S4 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 6 is a step S5 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 7 is a step S6 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 8 is a step S7 schematic diagram of a packaging method of a fan-out packaging structure in the present application; Figure 9 is a structural schematic diagram of removing the lower plastic encapsulant in the present application; Figure 10 is a structural schematic diagram of the prior art.

[0011] In the figure, 1-metal heat-dissipating component, 11-heat-dissipating main body, 12-side protruding ring, 13-upper protruding ring, 14-mounting groove, 15-filling groove, 2-heat-conducting glue, 3-chip, 4-heat-conducting medium, 5-passivation layer or insulation layer, 6-plastic encapsulant, 7-RDL layer, 8-substrate, 9-soldering ball. DETAILED DESCRIPTION

[0012] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0013] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0014] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0015] In the description of this invention, it should be understood that the terms "upper," "lower," "inner," "outer," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this invention and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0016] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0017] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0018] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0019] like Figure 1 As shown, a fan-out package structure includes: Metal heat sink assembly 1; a groove is provided inside the metal heat sink assembly 1; chip 3 is placed inside the groove; Thermal conductive glue 2; the back of the chip 3 is connected with the bottom of the recess through the thermal conductive glue 2, Thermal conductive medium 4; the front of the chip 3, the four sides of the chip 3 are connected with the side wall of the recess through the thermal conductive medium 4; the thermal conductive medium 4 is made of material with high thermal conductivity, such as metal thermal interface material, such as indium, thermal conductive silicone grease, (phase change type) thermal conductive glue, thermal conductive gel, polymer-based material and advanced compliant material, etc.; Plastic sealing material 6; the top of the metal heat dissipation assembly 1, the top of the thermal conductive medium 4, and the outer side wall of the metal heat dissipation assembly 1 are all plastic sealed through the plastic sealing material 6; RDL layer 7; the metal copper column of the chip 3 penetrates upward through the plastic sealing material 6 and is connected with the RDL layer 7.

[0020] Soldering ball 9; the soldering ball 9 is arranged on the top of the RDL layer 7.

[0021] As shown in Figure 3 , the metal heat dissipation assembly 1 includes a heat dissipation main body 11 and a side protruding ring 12, the heat dissipation main body 11 is provided with a mounting groove 14, the chip 3 is arranged in the mounting groove 14, the side protruding ring 12 is sleeved on the outer side of the upper end of the heat dissipation main body 11, and the thermal conductive medium 4 is connected with the top of the side protruding ring 12. The metal heat dissipation assembly 1 further includes an upper protruding ring 13, the lower end of the upper protruding ring 13 is connected with the outermost upper end of the side protruding ring 12, and the inner side of the upper protruding ring 13 and the upper side of the side protruding ring 12 form a filling groove 15, and the thermal conductive medium 4 is filled in the filling groove 15. The side protruding ring 12 and the upper protruding ring 13 are arranged to increase the contact area of the thermal conductive medium 4 and the metal heat dissipation assembly 1, and improve the heat dissipation area of the packaging structure.

[0022] As shown in Figure 4 , a passivation layer or an insulating layer 5 is arranged on the front of the chip 3 and the side wall of the metal copper column of the chip 3. The passivation layer or the insulating layer 5 on the chip 3 can be made after the Wafer process is completed and before the chip 3 is cut, or can be made by methods such as vapor deposition or coating after the chip 3 is embedded in the recess.

[0023] A packaging method of a fan-out packaging structure, characterized in that it comprises the following steps: S1, as shown in Figure 2 , a substrate 8 is obtained; S2, as shown in Figure 3 , a metal heat dissipation assembly 1 is mounted on the substrate 8; S3, as shown in Figure 4 , the chip 3 is pasted into the recess of the metal heat dissipation assembly 1 by a chip 3 pick-and-place device, and the bottom of the chip 3 is connected with the metal heat dissipation assembly 1 through the thermal conductive glue 2.

[0024] S4, as shown in Figure 5As shown, the gap between the front side of the chip 3 and the four side walls of the chip 3 and the metal heat dissipation assembly 1 is filled with the heat-conducting medium 4, and the filling of the heat-conducting medium 4 extends into the filling groove 15; S5, as Figure 6 shown, the top of the metal heat dissipation assembly 1, the top of the heat-conducting medium 4, and the outer side wall of the metal heat dissipation assembly 1 are all molded with the plastic sealing material 6; the plastic sealing material 6 on the top of the metal heat dissipation assembly 1 and the top of the heat-conducting medium 4 is ground flat by using a grinding process, and the metal copper pillar of the chip 3 is ground out; S6, as Figure 7 shown, the RDL circuit is made; S7, as Figure 8 shown, the final single-packaged chip 3 unit is formed by ball planting and cutting.

[0025] In some embodiments, as Figure 9 shown, a release agent or release film is added to the outer side wall of the metal heat dissipation assembly 1 before the outer side wall of the metal heat dissipation assembly 1 is molded, and the plastic sealing material 6 provided on the outer side wall of the heat dissipation body 11 is removed after the final single-packaged chip 3 unit is formed. Such a structural design can further improve the heat dissipation effect of the side surface of the packaging structure.

[0026] The above is only the preferred embodiment of the present application, and it should be noted that for those skilled in the art, without departing from the technical principles of the present application, several improvements and refinements can be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A fan-out package structure, characterized by, Comprise: A metal heat dissipation assembly; a recess is arranged in the metal heat dissipation assembly; a chip is placed in the recess; Thermal conductive glue; the back of the chip is connected with the bottom of the recess through the thermal conductive glue, Thermal conductive medium; the front of the chip and the four peripheral sides of the chip are connected with the side wall of the recess through the thermal conductive medium; Plastic sealing material; the top of the metal heat dissipation assembly, the top of the thermal conductive medium and the outer side wall of the metal heat dissipation assembly are all plastic sealed through the plastic sealing material; RDL layer; The metal copper column of the chip penetrates upward through the plastic sealing material and is connected with the RDL layer; Soldering ball; the soldering ball is arranged on the top of the RDL layer.

2. The fan-out package structure of claim 1, wherein, The metal heat dissipation assembly comprises a heat dissipation main body and a side protruding ring, the heat dissipation main body is provided with a mounting groove, the chip is placed in the mounting groove, the side protruding ring is sleeved on the outer side of the upper end of the heat dissipation main body, and the thermal conductive medium is connected with the top of the side protruding ring.

3. The fan-out package structure of claim 2, wherein, The metal heat dissipation assembly further comprises an upper protruding ring, the lower end of the upper protruding ring is connected with the outermost upper end of the side protruding ring, and the inner side of the upper protruding ring and the upper side of the side protruding ring form a filling groove, and the thermal conductive medium is filled in the filling groove.

4. The fan-out package structure of claim 1, wherein, A passivation layer or an insulation layer is arranged on the front of the chip and the side wall of the metal copper column of the chip.

5. The packaging method of the fan-out package structure according to any one of claims 1-4, wherein, Comprise the following steps: S1, obtain a substrate; S2, install a metal heat dissipation assembly on the substrate; S3, through a chip picking and placing device, paste the chip into the recess of the metal heat dissipation assembly, and connect the bottom of the chip with the metal heat dissipation assembly through the thermal conductive glue; S4, fill the gap between the front of the chip, the four peripheral sides of the chip and the metal heat dissipation assembly with the thermal conductive medium, and extend the filling of the thermal conductive medium into the filling groove; S5, plastic seal the top of the metal heat dissipation assembly, the top of the thermal conductive medium and the outer side wall of the metal heat dissipation assembly through the plastic sealing material; adopt a grinding process to grind the plastic sealing material on the top of the metal heat dissipation assembly and the top of the thermal conductive medium, and grind out the metal copper column of the chip; S6, make RDL circuit; S7, form a final single encapsulated chip unit through ball planting and cutting.

6. The packaging method of claim 5, wherein, Before plastic sealing the outer side wall of the metal heat dissipation assembly, add a release agent or a release film on the outer side wall of the metal heat dissipation assembly, and remove the plastic sealing material arranged on the outer side wall of the heat dissipation main body after forming the final single encapsulated chip unit.

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