Intermediate connection board, packaging structure and electronic equipment

Abstract

The invention relates to an intermediary connection board, a packaging structure and electronic equipment. The intermediary connection board is used for connecting a packaging substrate and a chip, and comprises a base body layer, and a signal layer and an isolation layer which are arranged above the base body layer. The intermediary connection board further comprises a shielding layer, and the signal layer and the isolation layer are arranged between the shielding layer and the base body layer. The shielding layer is arranged on the side, away from the base body layer, of the intermediary connection board, crosstalk between signal layers in the intermediary connection board can be reduced, and the stability of signal transmission of the intermediary connection board is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to an interposer, a packaging structure and an electronic device. BACKGROUND

[0002] For 2.5D or 3D packaging structure, multiple chips are arranged side by side or stacked on the top of an interposer, the chips are connected to the metal wiring layer of the interposer through micro bumps (uBumps), and multiple layers of signal lines are usually arranged inside the interposer for signal transmission of the multiple chips, and a grounding structure is needed between two adjacent layers of signal lines for isolation to reduce signal crosstalk.

[0003] In the related art, with the increasing integration and the limitation of design rules, the current grounding structure cannot meet the high-density wiring requirement. SUMMARY

[0004] The purpose of the present disclosure is to provide an interposer, a packaging structure and an electronic device, which is provided with a shielding layer on the side away from the base layer, can reduce the crosstalk between the signal layers inside the interposer, and improve the stability of signal transmission of the interposer.

[0005] To achieve the above purpose, according to a first aspect of the present disclosure, an interposer is provided for connecting a packaging substrate and a chip, comprising a base layer, and a signal layer and an isolation layer arranged above the base layer. The interposer further comprises a shielding layer, and the signal layer and the isolation layer are arranged between the shielding layer and the base layer.

[0006] Optionally, the isolation layer is located between two adjacent signal layers; and / or the isolation layer is located between the signal layer and the base layer; and / or the isolation layer is located between the signal layer and the shielding layer.

[0007] Optionally, the signal layer and the isolation layer are both two and are alternately stacked between the base layer and the shielding layer.

[0008] Optionally, the signal lines of two adjacent signal layers are arranged in staggered positions.

[0009] Optionally, the isolation layer comprises at least one grounding structure, and the projection of the grounding structure and the signal lines of the adjacent signal layer on the plane of the base layer at least partially overlaps.

[0010] Optionally, the grounding structure comprises a plurality of first grounding lines and a plurality of second grounding lines perpendicular to and intersecting the plurality of first grounding lines.

[0011] Optionally, the width of the second grounding wire is greater than the width of the first grounding wire; and / or The distance between two adjacent second grounding wires is greater than the distance between two adjacent first grounding wires; wherein, the extension direction of the first grounding wire is the signal transmission direction.

[0012] Optionally, the thickness of the shielding layer is greater than the thickness of the signal layer, but less than twice the thickness of the signal layer.

[0013] According to a second aspect of this disclosure, a packaging structure is provided that includes the aforementioned intermediate connection board.

[0014] According to a third aspect of this disclosure, an electronic device is also provided, including the above-described packaging structure.

[0015] The above-described technical solution, namely the intermediate connection board disclosed herein, includes a substrate layer, a signal layer, an isolation layer, and a shielding layer. The signal layer and the isolation layer are located between the substrate layer and the shielding layer and are stacked alternately. Since a shielding layer is provided on the side of the intermediate connection board away from the substrate layer, crosstalk between signal layers in the intermediate connection board can be reduced, thereby improving the stability of signal transmission in the intermediate connection board.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a structural diagram of an intermediate connection plate provided in some embodiments of this disclosure; Figure 2 This is a structural diagram of an intermediate connection plate provided in other embodiments of this disclosure; Figure 3 This is a structural diagram of the grounding structure of the isolation layer provided in some embodiments of this disclosure; Figure 4 This is a schematic diagram of the packaging structure provided in some embodiments of this disclosure.

[0018] Explanation of reference numerals in the attached figures 1-Intermediate connection board; 2-Chip; 3-Packaging substrate; 10 - Isolation layer; 20 - Signal layer; 21 - Signal line; 30 - Substrate layer; 40 - Shielding layer; 100 - Grounding structure; 110 - First grounding wire; 120 - Second grounding wire. Detailed Implementation

[0019] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0020] In this disclosure, unless otherwise stated, directional terms such as "upper," "lower," "left," and "right" generally refer to upper, lower, left, and right relative to the figures; "inner" and "outer" refer to the inner and outer contours of the corresponding components; and "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. In the figures of this disclosure, X indicates a first direction, i.e., the signal transmission direction of the signal line; Y indicates a second direction; and Z indicates the thickness direction of the intermediate connecting plate. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. In addition, in the following description, when referring to the figures, unless otherwise explained, the same reference numerals in different figures denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.

[0021] The purpose of this disclosure is to provide an intermediary connection board 1, a packaging structure, and an electronic device. The intermediary connection board 1 has a shielding layer 40 on the side opposite to the substrate layer 30, which can reduce crosstalk and improve the stability of signal transmission of the intermediary connection board 1.

[0022] To achieve the above objectives, such as Figures 1 to 4 As shown, according to a first aspect of this disclosure, an intermediary connection board 1 is provided for connecting a package substrate 3 and a chip 2, including a substrate layer 30, a signal layer 20 and an isolation layer 10 disposed above the substrate layer 30; the intermediary connection board 1 further includes a shielding layer 40, with the signal layer 20 and the isolation layer 10 disposed between the shielding layer 40 and the substrate layer 30.

[0023] The above-described technical solution, namely the intermediate connection board 1 disclosed herein, includes a substrate layer 30, a signal layer 20, an isolation layer 10, and a shielding layer 40. The signal layer 20 and the isolation layer 10 are located between the substrate layer 30 and the shielding layer 40 and are stacked alternately. Since the shielding layer 40 is provided on the side of the intermediate connection board 1 away from the substrate layer 30, crosstalk between the signal layers 20 in the intermediate connection board 1 can be reduced, thereby improving the stability of signal transmission in the intermediate connection board 1.

[0024] It should be noted that within the interfacing board 1, crosstalk occurs when each signal layer 20 radiates energy outwards, causing mutual interference. When the energy on the side of a signal layer 20 closest to the isolation layer 10 is absorbed, the energy on the other side also decreases. This ultimately reduces crosstalk between signal layers 20. Therefore, even if the isolation layer 10 is placed on the top layer of the interfacing board 1 in this embodiment, some energy from the signal layers 20 below it will be absorbed, thus reducing crosstalk between signal layers 20.

[0025] like Figure 1 and Figure 2 As shown, the substrate layer 30 is located at the bottom layer of the intermediate connection plate 1. Signal pins connected to the signal lines 21 of the signal layer 20 and ground pins connected to the ground structure 100 of the isolation layer 10 can be arranged therein. The signal pins are used to connect to the signal terminals of the packaging substrate 3, and the ground pins are used to connect to the ground terminals of the packaging substrate 3.

[0026] It should be noted that the shielding layer 40 here is not the green solder mask layer in the existing intermediate connection board 1. The green solder mask layer is used as a solder resist to protect the circuit pattern. However, the embodiment of this disclosure is a redesign of the original intermediate connection board 1, with a shielding layer 40 added above the signal layer 20 and the isolation layer 10 to reduce crosstalk.

[0027] It should be noted that the shielding layer 40 can be made of any suitable material. The shielding layer 40 is used for electromagnetic shielding or electrostatic protection to protect the chip 2 from external electromagnetic interference (EMI) and electrostatic discharge (ESD).

[0028] For example, common shielding layer 40 materials include metallic materials such as copper (Cu) and nickel (Ni), which have good electrical conductivity and magnetic permeability and can effectively shield electromagnetic waves.

[0029] The shielding layer 40 material may also include conductive polymers. Some conductive polymer materials also have a certain electromagnetic shielding effect, while having good flexibility and processing performance.

[0030] The shielding layer 40 is located above the isolation layer 10 and the signal layer 20 of the interfacing layer. The ball grid array for connection with the chip 2 can be arranged above the shielding layer 40. The shielding layer 40 can further improve the anti-crosstalk capability of the interfacing layer and improve the stability of the signal.

[0031] The shielding layer 40 material can also be a composite material, such as nickel / copper / nickel coated polyester fiber cloth, which combines the high conductivity of metals with the corrosion resistance of polymers to provide excellent shielding performance.

[0032] The thickness of the shielding layer 40 can be designed according to the actual packaging structure. In some embodiments, the thickness of the shielding layer 40 is greater than the thickness of the signal layer 20, but less than twice the thickness of the signal layer 20. The shielding layer 40 cannot be too thin, otherwise it will not provide adequate crosstalk protection; conversely, it cannot be too thick, otherwise it may affect the packaging or hinder size reduction. Therefore, setting the thickness of the shielding layer 40 to be greater than the thickness of the signal layer 20, but less than twice the thickness of the signal layer 20, effectively balances shielding effectiveness and cost while ensuring the stability and reliability of signal transmission. On the one hand, the shielding layer 40 can prevent external electromagnetic interference from affecting signal transmission; on the other hand, it can also reduce the interference of electromagnetic radiation generated by the signal layer 20 itself on the external environment. By reasonably controlling the thickness of the shielding layer 40, the increased cost and structural complexity caused by an excessively thick shielding layer 40 can be avoided while meeting electromagnetic shielding requirements. Furthermore, an appropriate thickness of the shielding layer 40 also helps to improve the mechanical strength of the entire packaging structure, enhancing its resistance to physical shock and vibration, thereby providing more stable performance in various harsh working environments.

[0033] The stacking of isolation layer 10 and signal layer 20 can be done in any suitable manner, such that isolation layer 10 is located between two adjacent signal layers 20; and / or, isolation layer 10 is located between signal layer 20 and substrate layer 30; and / or, isolation layer 10 is located between signal layer 20 and shielding layer 40.

[0034] In some embodiments, the isolation layer 10 can be disposed between two adjacent signal layers 20 to prevent crosstalk between the two signal layers 20 and improve the stability of signal transmission. Since signal layers 20 typically carry high-speed, high-density signal transmission tasks, any external electromagnetic interference can lead to signal distortion, increased bit error rate, and other problems. The introduction of the isolation layer 10 forms a barrier, isolating the electromagnetic fields of different signal layers 20 from each other, thereby ensuring the purity and integrity of the signal during transmission. Furthermore, this arrangement can reduce crosstalk between different signal layers 20, allowing each signal layer 20 to operate independently and efficiently, improving the performance and reliability of the entire electronic device.

[0035] An isolation layer 10 can be placed between the signal layer 20 and the substrate layer 30, primarily to prevent the substrate layer 30 from adversely affecting the signal layer 20. The substrate layer 30, as the foundational support and electrical connection point of the entire structure, contains multiple signal pins and ground pins. The isolation layer 10 acts like a protective film, preventing electromagnetic radiation from penetrating the upper signal layer 20, thus protecting its normal operation. Simultaneously, the isolation layer 10 also provides a buffering effect, mitigating thermal expansion differences or mechanical stress between the substrate layer 30 and the signal layer 20, preventing stress concentration that could lead to cracks or delamination in the signal layer 20, thereby improving the overall stability and lifespan of the structure.

[0036] An isolation layer 10 can be placed between the signal layer 20 and the shielding layer 40. Its main function is to optimize the electromagnetic compatibility between the signal layer 20 and the shielding layer 40. The purpose of the shielding layer 40 is to block external electromagnetic interference from entering the internal signal layer 20, while preventing electromagnetic radiation from the signal layer 20 from leaking into the external environment. However, there may be some electromagnetic coupling or reflection problems between the directly contacting signal layer 20 and the shielding layer 40, affecting the shielding effect. The addition of the isolation layer 10 can improve this situation. It can adjust the electromagnetic field distribution between the signal layer 20 and the shielding layer 40, allowing the shielding layer 40 to perform its shielding function more uniformly and effectively.

[0037] In addition, the isolation layer 10 can also serve as an intermediate medium to improve the bonding force between the signal layer 20 and the shielding layer 40, ensuring that the two will not separate or loosen during long-term use, thereby guaranteeing the stability and reliability of the electromagnetic shielding performance of the entire structure.

[0038] Optionally, there are two signal layers 20 and two isolation layers 10, which are alternately stacked between the substrate layer 30 and the shielding layer 40.

[0039] like Figure 1 As shown, in some embodiments, isolation layers 10, signal layers 20, isolation layers 10, and signal layers 20 can be alternately arranged on the substrate layer 30, with a shielding layer 40 disposed above the topmost signal layer 20, thereby arranging two signal layers 20 and two isolation layers 10 between the substrate layer 30 and the shielding layer 40. The combined effect of the top shielding layer 40 and the isolation layer 10 reduces crosstalk in the signal layer 20.

[0040] like Figure 2As shown, in some embodiments, signal layers 20, isolation layers 10, and signal layers 20 and isolation layers 10 can be alternately arranged on the substrate layer 30, with a shielding layer 40 disposed above the topmost isolation layer 10. Alternatively, two signal layers 20 and two isolation layers 10 can be arranged between the substrate layer 30 and the shielding layer 40. Similarly, the top shielding layer 40 and isolation layer 10 are used to reduce crosstalk of the signal layers 20 inside the interfacing board 1.

[0041] In some embodiments, the signal lines 21 of two adjacent signal layers 20 are staggered. That is, the signal lines 21 of two adjacent signal layers 20 do not overlap in the vertical projection direction, but are staggered by a certain distance or completely staggered. This arrangement effectively reduces electromagnetic interference and improves signal transmission stability. Furthermore, the staggered arrangement helps optimize wiring density, allowing more signal lines 21 to be accommodated within a limited package space, thus improving package integration. Simultaneously, this arrangement also improves signal integrity, reduces signal reflection and loss, and ensures signal quality during transmission. In practical applications, the stagger distance of the signal lines 21 can be flexibly adjusted according to specific signal frequencies, package sizes, and performance requirements to achieve optimal signal transmission performance and system performance.

[0042] It should be noted that the signal lines 21 of two adjacent signal layers 20 can also be arranged relative to each other, and electromagnetic interference can be reduced by the isolation layer 10 between the two signal layers 20.

[0043] To achieve the isolation effect, a grounding structure 100, such as a metal grounding wire, is usually arranged in the isolation layer 10. In some embodiments, the isolation layer 10 includes the grounding structure 100, and the projection of the grounding structure 100 and the signal line 21 of the adjacent signal layer 20 on the plane of the substrate layer 30 at least partially coincides.

[0044] The grounding structure 100 can be a metal grounding plate with a certain shape and size, and its material can be a metal material with good conductivity, such as copper. The grounding structures 100 are distributed in an array in the isolation layer 10, and the overlapping area of ​​the projection of each grounding structure 100 and the adjacent signal line 21 should meet a certain area requirement to ensure a good grounding effect.

[0045] This structural design effectively reduces electromagnetic interference during signal transmission, improving signal integrity and stability. Since the grounding structure 100 and the signal line 21 overlap in their projections on the horizontal plane, when the signal transmitted on the signal line 21 generates electromagnetic radiation, the grounding structure 100 can absorb and shield this radiation energy to a certain extent, thereby reducing interference to other surrounding signal lines 21.

[0046] In addition, in some embodiments, the grounding structure 100 may be arranged so that its projection in the horizontal plane coincides with the signal line 21. This arrangement further helps to reduce crosstalk between the signal lines 21, improve the anti-interference capability of the entire circuit system, and thus improve the performance and reliability of the product.

[0047] like Figure 3 As shown, in some embodiments, the grounding structure 100 includes a plurality of first grounding wires 110 and a plurality of second grounding wires 120 perpendicular to and intersecting the plurality of first grounding wires 110. The grounding structure 100 employs a plurality of first grounding wires 110 extending in a first direction and spaced apart in a second direction, and a plurality of second grounding wires 120 extending in the second direction and spaced apart in the first direction. The plurality of first grounding wires 110 and the plurality of second grounding wires 120 intersect to form a mesh structure. That is, by arranging the plurality of first grounding wires 110 and the plurality of second grounding wires 120 in the first and second directions, higher integration density and improved shielding effect are achieved. This grounding structure 100 can be arranged between two layers of signal lines 21 to reduce crosstalk between the signal lines 21, or it can be arranged on one side of a signal line 21 to reduce interference from other devices on the other side, thus meeting the high-density wiring requirements of the intermediate connection board 1. It should be noted that the grounding structure 100, which consists of multiple first grounding wires 110 and multiple second grounding wires 120 arranged perpendicularly and intersectingly, exhibits a relatively small anti-crosstalk effect in simulation and testing.

[0048] The first grounding wire 110 and the second grounding wire 120 can both be made of metallic materials, including but not limited to copper.

[0049] In some embodiments, the width of the second grounding wire 120 is greater than the width of the first grounding wire 110; and / or, the distance between two adjacent second grounding wires 120 is greater than the distance between two adjacent first grounding wires 110; wherein, the extension direction of the first grounding wire 110 is the signal transmission direction, that is, the first grounding wire 110 extends along a first direction.

[0050] The widths of the first grounding wire 110 and the second grounding wire 120 can be appropriately selected. In some embodiments, the width of the second grounding wire 120 is greater than the width of the first grounding wire 110. While achieving the shielding effect, this also reduces the amount of metal material used, thereby lowering costs.

[0051] In some embodiments, the extension direction of the first ground wire 110 is consistent with the signal transmission direction, while the extension direction of the second ground wire 120 is perpendicular to the signal transmission direction. By arranging the spacing between two adjacent second ground wires 120 to be greater than the spacing between two adjacent first ground wires 110, the electromagnetic coupling between adjacent signal lines 21 during signal transmission can be effectively reduced, thereby reducing crosstalk. This design is particularly effective in high-frequency signal transmission scenarios, significantly improving signal integrity and system reliability.

[0052] like Figure 4 As shown, according to a second aspect of this disclosure, a packaging structure is provided, the packaging structure including a chip 2 and the aforementioned interposer 1, wherein the chip 2 is connected to the top of the interposer 1. A shielding layer 40 disposed on the top of the interposer 1 can reduce crosstalk between signal lines 21 within the interposer 1.

[0053] In some embodiments, the package may further include a package substrate 3, which is connected to the bottom of the intermediate connection plate 1 and is used to connect to an external circuit.

[0054] It is understood that the substrate layer 30, signal layer 20 and isolation layer 10 may also include other structures or corresponding devices to meet the requirements of signal transmission, insulation and encapsulation. For reference, please refer to relevant technologies, which will not be elaborated here.

[0055] According to a third aspect of this disclosure, an electronic device is also provided, which includes the above-described packaging structure. Therefore, the electronic device also has all the advantages of the above-described packaging structure, which will not be repeated here.

[0056] It should be noted that the electronic device includes, but is not limited to, mobile phones, smartwatches, tablets, laptops, microcontrollers, servers, etc.

[0057] The present disclosure includes an intermediate connection board 1, a packaging structure, and an electronic device. The intermediate connection board 1 includes a substrate layer 30, a signal layer 20, an isolation layer 10, and a shielding layer 40. The signal layer 20 and the isolation layer 10 are located between the substrate layer 30 and the shielding layer 40 and are stacked alternately. Since the shielding layer 40 is provided on the side of the intermediate connection board 1 away from the substrate layer 30, crosstalk between signal lines of the signal layer 20 inside the intermediate connection board 1 can be reduced, thereby improving the stability of signal transmission of the intermediate connection board 1.

[0058] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0059] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0060] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. An interposer board for connecting a packaging substrate and a chip, characterized in that, It includes a substrate layer, and a signal layer and an isolation layer disposed above the substrate layer; The intermediate connection board also includes a shielding layer, and the signal layer and the isolation layer are disposed between the shielding layer and the substrate layer.

2. The intermediary connecting plate according to claim 1, characterized in that, The isolation layer is located between two adjacent signal layers; and / or The isolation layer is located between the signal layer and the substrate layer; and / or The isolation layer is located between the signal layer and the shielding layer.

3. The intermediary connecting plate according to claim 1, characterized in that, There are two signal layers and two isolation layers, which are alternately stacked between the substrate layer and the shielding layer.

4. The intermediary connecting plate according to claim 1, characterized in that, The signal lines of two adjacent signal layers are arranged in a staggered manner.

5. The intermediary connecting plate according to any one of claims 1-4, characterized in that, The isolation layer includes at least one grounding structure, and the grounding structure at least partially overlaps with the projection of the signal line of the adjacent signal layer onto the plane where the substrate layer is located.

6. The intermediary connecting plate according to claim 5, characterized in that, The grounding structure includes a plurality of first grounding wires and a plurality of second grounding wires that are perpendicular to and intersect with the plurality of first grounding wires.

7. The intermediary connecting plate according to claim 6, characterized in that, The width of the second grounding wire is greater than the width of the first grounding wire; and / or The distance between two adjacent second grounding wires is greater than the distance between two adjacent first grounding wires; wherein, the extension direction of the first grounding wire is the signal transmission direction.

8. The intermediary connecting plate according to any one of claims 1-4, characterized in that, The thickness of the shielding layer is greater than the thickness of the signal layer, but less than twice the thickness of the signal layer.

9. A packaging structure, characterized in that, Includes the intermediate connection plate as described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the packaging structure described in claim 9.

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