Riveting mechanism and riveting method thereof

Abstract

The invention discloses a riveting mechanism and a riveting method thereof, and relates to the technical field of machining, a blocking assembly comprises a blocking air cylinder and a blocking plate which are both installed on a first conveying assembly, the blocking air cylinder is in transmission connection with the blocking plate, and the blocking plate is arranged close to a riveting position so that a PCB and a radiator can be limited to the riveting position; the jacking assembly is installed on the rack and used for jacking the bearing disc at the riveting position, the jacking assembly is installed on the rack and used for pressing and jacking the PCB and the radiator, the jacking assembly comprises a second conveying assembly and a pressing machine which are both installed on the rack, and the second conveying assembly is in transmission connection with the pressing machine so that the pressing machine can be moved to the riveting position; the plurality of PCBs and the radiators at the riveting position are sequentially riveted by the press; according to the technical scheme, the riveting efficiency of the riveting mechanism is improved, and the riveting yield is increased.

Description

Technical Field

[0001] This invention relates to the field of machining technology, and in particular to a riveting mechanism and riveting method thereof. Background Technology

[0002] In the field of electronic assembly, reliable riveting of PCB boards and heat sinks is crucial to the product's heat dissipation performance and structural stability. Traditional riveting operations rely heavily on manual positioning and operation, resulting in low efficiency and poor consistency. Some solutions using semi-automatic equipment often suffer from inaccurate positioning and imprecise pressure control, which can easily lead to riveting misalignment or component damage. Summary of the Invention

[0003] The main objective of this invention is to provide a riveting mechanism and its riveting method, which aims to improve the riveting efficiency of the riveting mechanism and increase the yield of riveted products.

[0004] To achieve the above objectives, the riveting mechanism proposed in this invention includes: The frame is provided with a riveting position; A first transport assembly is mounted on the frame and is used to transport a carrier plate containing a PCB board and a heat sink to the riveting position. A blocking assembly, comprising a blocking cylinder and a blocking plate both mounted on the first transport assembly, wherein the blocking cylinder is throttle-connected to the blocking plate and the blocking plate is disposed near the riveting position to limit the PCB board and the heat sink to the riveting position; A lifting assembly, mounted on the frame, is used to lift the bearing plate at the riveting position; A pressing assembly, mounted on the frame, is used to press and lift the PCB board and the heat sink, thereby pressing and lifting the PCB board and the heat sink; and The riveting assembly includes a second transport assembly and a press, both mounted on the frame. The second transport assembly is drive-connected to the press to move the press to the riveting position, so that the press sequentially rivets a plurality of PCB boards and heat sinks at the riveting position.

[0005] In one embodiment, the lifting assembly includes a fixed lifting frame, a movable lifting frame, a lifting cylinder, a lifting block, multiple lifting linear bearings, and multiple lifting guide rods. The fixed lifting frame is mounted on the frame, and one of the lifting linear bearings is correspondingly sleeved on one of the lifting guide rods. The lifting linear bearing and the lifting cylinder are fixed to the fixed lifting frame, and one end of the lifting guide rod is fixed to the movable lifting frame. The lifting block is drivenly connected to the output shaft of the lifting cylinder, and the lifting cylinder pushes the movable lifting frame to rise and fall relative to the fixed lifting frame through the lifting block.

[0006] In one embodiment, the riveting mechanism further includes a pressure-bearing component, which in turn includes a third transport component and a pressure plate. The pressure plate is fixed to the third transport component. When the lifting component lifts the bearing plate at the riveting position, the third transport component moves the pressure plate to below the lifting component, and the ends of the plurality of lifting guide rods that are away from the lifting movable frame abut against the pressure plate.

[0007] In one embodiment, the riveting mechanism further includes a detection component, which includes a laser sensor and a pressure sensor both mounted on the riveting component. The laser sensor is used to detect the riveting height of the PCB board and / or the heat sink, and the pressure sensor is used to detect the actual pressure value of the press.

[0008] In one embodiment, the lifting assembly further includes a pad and a positioning pin. The pad and the positioning pin are connected to the side of the lifting movable frame away from the lifting fixed plate. The pad and the positioning pin are both inserted into the bearing plate, and the pad is arranged opposite to the PCB board and the heat sink to facilitate riveting the PCB board and the heat sink.

[0009] In one embodiment, the carrier plate includes a carrier and a reinforcing plate, the reinforcing plate being located inside the carrier, the PCB board and the heat sink being placed on the reinforcing plate, and a pad protruding from the upper surface of the carrier. When the press rivets the PCB board and the heat sink, the pad abuts against the reinforcing plate, and the carrier detaches from the reinforcing plate.

[0010] In one embodiment, the pressing assembly further includes a pressing fixed frame, a pressing movable frame, a pressing cylinder, a pressing transmission component, multiple pressing linear bearings, and multiple pressing guide rods. The pressing fixed frame is mounted on the frame, and one pressing linear bearing is correspondingly sleeved on one of the pressing guide rods. The pressing linear bearing and the pressing cylinder are fixed to the pressing fixed frame. One end of the pressing guide rod is fixed to the pressing movable frame. The pressing transmission component is tractively connected to the output shaft of the pressing cylinder. The pressing cylinder pushes the pressing movable frame to press the carrier plate and / or the PCB board and the heat sink within the carrier plate through the pressing transmission component. The pressing movable frame is provided with clearance holes, and the press passes through the clearance holes to rivet the PCB board and the heat sink.

[0011] In one embodiment, the pressing assembly further includes a shape-changing plate, the clearance hole is provided on the shape-changing plate, the pressing movable frame is provided with a sliding groove, the shape-changing plate is slidably connected in the sliding groove, and the shape-changing plate is detachably connected to the pressing movable frame. The shape-changing plate is provided with an elastic pressing post on the side facing the pressing fixed frame. The pressing movable frame presses the carrier plate and / or the PCB board and / or the heat sink through the elastic pressing post. The shape-changing plate has a variety of different models, and the position and / or size of the elastic pressing post on the shape-changing plate of different models are different.

[0012] In one embodiment, the elastic pressing column includes an elastic pressure bar and a pressing column, the pressing column being elastically connected to the forming plate via the elastic pressure bar, and the pressing column being made of a flexible material.

[0013] The present invention also proposes a riveting method for the riveting mechanism described above, comprising: Step S1: Detect the transport of the carrier plate carrying the PCB board and the heat sink to the riveting position, control the start of the blocking cylinder, and limit the carrier plate to the riveting position through the blocking plate; Step S2: First, control the lifting assembly to lift the bearing plate, and control the first transport assembly to move the pressure plate directly below the lifting assembly. Then, control the lifting assembly to lower so that the end of the lifting guide rod away from the lifting movable frame abuts against the pressure plate. Step S3: Control the pressing component to descend, so that the pressing component and the lifting component fix the PCB board and the heat sink from both the top and bottom directions; Step S4: The second transport component drives the press to move, so as to sequentially rivet the plurality of PCB boards and the heat sink on the carrier plate; Step S5: The laser sensor detects the riveting height of each PCB board and the heat sink, and the pressure sensor detects the actual pressure value of the press on each PCB board and the heat sink, and stores the corresponding riveting height information and actual pressure value information in the corresponding tag of each PCB board and the heat sink.

[0014] In the riveting mechanism of this invention, a first transport component transports a carrier plate containing a PCB and a heat sink to the riveting position. Then, a blocking cylinder drives a blocking plate to block the carrier plate, limiting its position at the riveting position. Next, a lifting component lifts the carrier plate at the riveting position, and a pressing component presses and fixes the heat sink and / or PCB from above. Once the heat sink and PCB are fixed, a second transport component drives a press to the riveting position, whereby the press sequentially rivets multiple heat sinks and PCBs at the riveting position. In one embodiment, a heat sink corresponds to a PCB board. The press rivets one PCB board onto the corresponding heat sink at a time. Then, the second transport component moves the press to the next heat sink and PCB board to be riveted, until all PCB boards and heat sinks at the riveting positions are riveted. Compared with the traditional manual positioning and riveting technology, the riveting process of this application is fully automated. Its control is precise and the pressure control is uniform, thereby improving the riveting efficiency of the riveting mechanism and improving the riveting yield. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a structure of an embodiment of the riveting assembly provided by the present invention; Figure 2 for Figure 1 Schematic diagram of the central lifting component; Figure 3 for Figure 1 Schematic diagram of the structure of the medium-pressure bearing component; Figure 4 for Figure 1 A schematic diagram of the structure of the middle pressing component; Figure 5 for Figure 4 Schematic diagram of the structure of the intermediate replacement plate; Figure 6 for Figure 1 A schematic diagram of the structure of a medium-pressure press.

[0017] Explanation of icon numbers: 10. Frame; 20. First transport assembly; 40. Lifting assembly; 41. Lifting fixed frame; 42. Lifting movable frame; 43. Lifting cylinder; 44. Lifting block; 45. Lifting linear bearing; 46. Lifting guide rod; 47. Buffer block; 48. Pad block; 49. Positioning pin; 50. Pressing assembly; 51. Pressing fixed frame; 52. Pressing movable frame; 521. Sliding groove; 53. Pressing cylinder; 54. Pressing transmission component; 55. Pressing linear bearing; 56. Pressing guide rod; 57. Changing plate; 571. Clearance hole; 58. Elastic pressing column; 60. Riveting assembly; 61. Press; 62. Second transport assembly; 63. Laser actuator; 71. Pressure plate; 72. Third slide rail.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0022] Reference Figures 1 to 6 The present invention proposes a riveting mechanism 61, comprising: Frame 10, wherein the frame 10 is provided with a riveting position; A first transport component 20 is mounted on the frame 10 and is used to transport a carrier plate carrying a PCB board and a heat sink to the riveting position. A blocking assembly, comprising a blocking cylinder and a blocking plate both mounted on the first transport assembly 20, wherein the blocking cylinder is throttle-connected to the blocking plate and the blocking plate is disposed near the riveting position to limit the PCB board and the heat sink to the riveting position; A lifting assembly 40 is installed on the frame 10 and is used to lift the PCB board and the heat sink at the riveting position. Pressing assembly 50, mounted on the frame 10, is used to press and lift the PCB board and the heat sink, thereby pressing and lifting the PCB board and the heat sink; and The riveting assembly 60 includes a second transport assembly 62 and a press 61, both mounted on the frame 10. The second transport assembly 62 is connected to the press 61 in a drive connection to move the press 61 to the riveting position so that the press 61 can perform riveting processing on the PCB board and the heat sink at the riveting position.

[0023] In the technical solution of this invention, the riveting machine 61 transports a carrier plate containing a PCB and a heat sink to the riveting position via a first transport component 20. Then, a blocking cylinder drives a blocking plate to block the carrier plate, limiting its position at the riveting position. Next, a lifting component 40 lifts the carrier plate at the riveting position, and a pressing component 50 presses and fixes the heat sink and / or PCB from above. Once the heat sink and PCB are fixed, a second transport component 62 drives a press 61 to move to the riveting position. The press 61 then sequentially rivets multiple heat sinks and PCBs at the riveting position. In one embodiment, a heat sink corresponds to a PCB board. The press 61 rivets one PCB board onto the corresponding heat sink at a time. Then, the second transport component 62 drives the press 61 to move to the next heat sink and PCB board to be riveted, until all PCB boards and heat sinks at the riveting positions are riveted. Compared with the traditional manual positioning and riveting technology, the riveting process of this application is fully automated, with precise control and uniform pressure control, thereby improving the riveting efficiency of the riveting machine 61 and increasing the yield rate of riveting.

[0024] Reference Figure 2 and Figure 3Specifically, the lifting assembly 40 includes a lifting fixed frame 41, a lifting movable frame 42, a lifting cylinder 43, a lifting block 44, multiple lifting linear bearings 45, and multiple lifting guide rods 46. The lifting fixed frame 41 is installed on the frame 10. One of the lifting linear bearings 45 is correspondingly sleeved on one of the lifting guide rods 46. The lifting linear bearings 45 and the lifting cylinder 43 are fixed to the lifting fixed frame 41. One end of the lifting guide rod 46 is fixed to the lifting movable frame 42. The lifting block 44 is throttle-connected to the output shaft of the lifting cylinder 43. The lifting cylinder 43 pushes the lifting movable frame 42 to rise and fall relative to the lifting fixed frame 41 through the lifting block 44.

[0025] The lifting cylinder 43 drives the lifting block 44 to rise and fall, which in turn drives the lifting movable frame 42 to rise and fall. This causes the lifting guide rod 46 to move linearly in the axial direction within the lifting linear bearing 45. The lifting linear bearing 45 has low frictional resistance, which reduces the resistance of the lifting guide rod 46 during the lifting process and thus reduces energy consumption. At the same time, the lifting guide rod 46 plays a guiding role, which reduces the possibility of the lifting movable frame 42 deviating during the lifting process and thus improves the stability and reliability of the lifting assembly 40.

[0026] Understandably, in the existing technical solution, because the lifting guide rod 46 needs to be raised and lowered, it cannot directly contact the frame 10 during the riveting process. Therefore, in the existing technical solution, the entire lifting assembly 40 bears the riveting pressure of the press 61 alone. During the riveting process, the press 61 will exert a large pressure on the lifting assembly 40, and this pressure, directly transmitted to the lifting assembly 40, will make the lifting assembly 40 easily damaged, thereby reducing its service life. Furthermore, increasing the structural strength of the lifting assembly 40 would inevitably require using more expensive... The expensive materials increase the manufacturing cost of the lifting assembly 40. Therefore, in one embodiment, the riveting machine 61 also includes a pressure-bearing assembly, which further includes a third transport assembly and a pressure plate 71. The pressure plate 71 is fixed to the third transport assembly. When the lifting assembly 40 lifts the bearing plate at the riveting position, the third transport assembly drives the pressure plate 71 to move below the lifting assembly 40, and the ends of the plurality of lifting guide rods 46 that are away from the lifting movable frame 42 all abut against the pressure plate 71.

[0027] That is, after the lifting assembly 40 lifts the carrier plate carrying the PCB board and heat sink at the riveting position, the third transport assembly moves the pressure plate 71 to directly below the lifting assembly 40. At this time, the lifting assembly 40 lowers the carrier plate so that the end of the lifting guide rod 46 away from the lifting movable frame 42 abuts against the pressure plate 71. Thus, when the press 61 rivets the PCB board and heat sink at the riveting position, the pressure transmission process of the press 61 is as follows: PCB board and heat sink → carrier plate → lifting movable frame 42 → lifting guide rod 46 → pressure plate 71 → First transport component 20 → Frame 10, so that the lifting fixed plate and lifting cylinder 43 are not subjected to force, that is, the connection between the lifting fixed plate and the frame 10 is not subjected to force, so the entire lifting component 40 does not need to bear the riveting pressure of the press 61, so only the lifting movable frame 42 and the lifting guide rod 46 need to be reinforced, thereby reducing the manufacturing cost of the lifting component 40 and increasing the service life of the lifting component 40; and reducing the impact on the connection between the lifting fixed plate and the frame 10, thus improving the stability of the lifting component 40.

[0028] Meanwhile, the lifting assembly 40 also includes a buffer block 47, which is sleeved on the lifting linear bearing 45 and located on the side facing the lifting movable frame 42. By adding the buffer block 47, when the lifting movable frame 42 is excessively pressed in an emergency, the buffer block 47 can buffer the impact between the lifting movable frame 42 and the lifting fixed plate, thereby reducing the impact on the lifting fixed plate and the possibility of damage to the lifting fixed plate and lifting cylinder 43, thus improving the service life of the lifting assembly 40. The buffer block 47 can be made of flexible materials such as rubber blocks or silicone blocks, or elastic materials such as springs.

[0029] Furthermore, the lifting assembly 40 also includes a pad 48 and a positioning pin 49. The pad 48 and the positioning pin 49 are connected to the side of the lifting movable frame 42 opposite to the lifting fixed plate. Both the pad 48 and the positioning pin 49 are inserted into the support plate, and the pad 48 is positioned opposite to the PCB board and the heat sink to facilitate riveting the PCB board and the heat sink. Understandably, positioning the support plate by the positioning pin 49 reduces the possibility of displacement of the support plate during pressure riveting, thereby improving the stability of the support plate. Simultaneously, by setting the pad 48 against the bottom of the support plate and corresponding to the area directly below the PCB board and the heat sink, a solid foundation is formed, ensuring that the riveting pressure can be fully and effectively applied to the PCB board and the heat sink, without being absorbed by the support plate and the lifting movable frame 42, thereby improving the riveting effect and the stability during the riveting process.

[0030] Understandably, during the riveting process, if the bearing plate bears excessive riveting pressure, it will be easily damaged. Therefore, in one embodiment, the bearing plate includes a carrier and a reinforcing plate. The reinforcing plate is located inside the carrier, and the PCB board and the heat sink are placed on the reinforcing plate. The pad 48 protrudes from the upper surface of the carrier. When the press 61 rivets the PCB board and the heat sink, the pad 48 abuts against the reinforcing plate, and the carrier detaches from the reinforcing plate. Therefore, when the pad 48 is inserted into the corresponding hole of the carrier, the thickness of the pad 48 is much greater than the thickness of the carrier. At this time, the carrier falls freely under the action of gravity and detaches from the reinforcing plate. The pad 48 abuts against the reinforcing plate, so that the carrier is not subjected to pressure during the riveting process by the press 61, thus preventing damage to the carrier and improving the service life of the bearing plate.

[0031] Furthermore, the riveting machine 61 also includes a detection component, which includes a laser sensor and a pressure sensor both mounted on the riveting assembly 60. The laser sensor is used to detect the riveting height of the PCB board and / or the heat sink, and the pressure sensor is used to detect the actual pressure value of the press 61. The laser sensor detects the riveting height of the PCB board and the heat sink to determine whether the riveting of the PCB board and the heat sink is qualified. The pressure sensor detects the actual riveting pressure value and compares it with the theoretically required riveting pressure value to determine whether the riveting is qualified.

[0032] Reference Figure 4 and Figure 5 Specifically, the pressing assembly 50 further includes a pressing fixed frame 51, a pressing movable frame 52, a pressing cylinder 53, a pressing transmission component 54, multiple pressing linear bearings 55, and multiple pressing guide rods 56. The pressing fixed frame 51 is installed on the frame 10. One pressing linear bearing 55 is correspondingly sleeved on one pressing guide rod 56. The pressing linear bearing 55 and the pressing cylinder 53 are fixed to the pressing fixed frame 51. One end of the pressing guide rod 56 is fixed to the pressing movable frame 52. The pressing transmission component 54 is connected to the output shaft of the pressing cylinder 53. The pressing cylinder 53 pushes the pressing movable frame 52 to press the carrier plate and / or the PCB board and the heat sink in the carrier plate through the pressing transmission component 54. The pressing movable frame 52 is provided with a clearance hole 571. The press 61 passes through the clearance hole 571 to rivet the PCB board and the heat sink.

[0033] When the lifting assembly 40 lifts the support plate carrying the PCB board and heat sink and then lowers it until the lifting guide rod 46 abuts against the pressure plate 71, the pressing cylinder 53 drives the pressing transmission component 54 to move. This causes the pressing transmission component 54 to move the pressing movable frame 52 downward and press the PCB board and heat sink, thereby fixing the PCB board and / or heat sink. The support plate can also be pressed and fixed simultaneously. The pressing guide rod 56 and the pressing linear bearing 55 limit the pressing trajectory of the pressing movable frame 52, thus improving the stability and reliability of the pressing movable frame 52. Simultaneously, the pressing guide rod 56 experiences low friction as it moves linearly within the pressing linear bearing 55, reducing frictional consumption and thus lowering energy consumption.

[0034] Furthermore, the pressing assembly 50 also includes a shape-changing plate 57, the clearance hole 571 is provided on the shape-changing plate 57, the pressing movable frame 52 is provided with a sliding groove 521, the shape-changing plate 57 is slidably connected in the sliding groove 521, and the shape-changing plate 57 is detachably connected to the pressing movable frame 52. The shape-changing plate 57 is provided with an elastic pressing post 58 on the side facing the pressing fixed frame 51. The pressing movable frame 52 presses the carrier plate and / or the PCB board and / or the heat sink through the elastic pressing post 58. The shape-changing plate 57 has a variety of different models, and the position and / or size of the elastic pressing post 58 on the shape-changing plate 57 of different models are different.

[0035] Understandably, when riveting PCBs and heat sinks of different models or sizes, the pressing position of the elastic pressing column 58 may change. Replacing the entire pressing frame 52 would be cumbersome. Therefore, by setting a changing plate 57, when pressing a PCB of a certain model or size is required, the corresponding changing plate 57 can be directly replaced. The changing plate 57 slides into the pressing frame 52 through the sliding groove 521, and is then fixed to the pressing frame 52 by screws or other fasteners.

[0036] Specifically, the elastic pressing column 58 includes an elastic pressure bar and a pressing column. The pressing column is elastically connected to the forming plate 57 via the elastic pressure bar, and the pressing column is made of a flexible material. Through the elastic pressure plate and the pressing column, the PCB board and / or heat sink are elastically pressed, thereby reducing the stability and reliability of the PCB board and heat sink, reducing the possibility of PCB board and heat sink misalignment during the riveting process of the press 61, and reducing damage to the PCB board and heat sink through elastic pressing, thus improving the riveting yield.

[0037] The first transport component 20 includes a drive wheel, a driven wheel, a transport motor, and a chain. The output shaft of the transport motor is connected to the drive wheel via a transmission. The chain is fitted onto the drive wheel and the driven wheel. The transport motor drives the drive wheel to rotate, which in turn drives the chain to rotate, thereby moving the carrier on the chain. Of course, the chain can also be a transmission belt.

[0038] The second transport component 62 can be a robotic arm that directly moves the press 61 to a predetermined position to perform riveting on the PCB board and the heat sink. Alternatively, it can be a combination of an X-axis cylinder, an X-axis bracket, a Y-axis bracket, a Y-axis cylinder, a Z-axis bracket, and a Z-axis cylinder. The X-axis bracket, Y-axis bracket, and Z-axis bracket are equipped with X-axis slide rails, Y-axis slide rails, and Z-axis slide rails, respectively. The press 61 is slidably connected to the Z-axis slide rail and driven by the Z-axis cylinder. The Z-axis bracket is slidably connected to the Y-axis slide rail and driven by the Y-axis cylinder. The Y-axis bracket is slidably connected to the X-axis slide rail and driven by the X-axis cylinder. The X-axis bracket is mounted on the frame 10.

[0039] The third transport component includes a third cylinder and a third slide rail 72. The pressure plate 71 is slidably connected to the third slide rail 72, and the third slide rail 72 is fixedly connected to the frame 10. The output shaft of the third cylinder is connected to the pressure plate 71 for transmission. When the lifting component 40 lifts the bearing plate, the third cylinder drives the pressure plate 71 to move below the lifting component 40.

[0040] The present invention also proposes a riveting method for the riveting machine 61 structure as described above, comprising: Step S1: Detect the transport of the carrier plate carrying the PCB board and the heat sink to the riveting position, control the start of the blocking cylinder, and limit the carrier plate to the riveting position through the blocking plate; Step S2: First, control the lifting assembly 40 to lift the bearing plate, and control the first transport assembly 20 to move the pressure plate 71 to directly below the lifting assembly 40. Then, control the lifting assembly 40 to descend so that the end of the lifting guide rod 46 away from the lifting movable frame 42 abuts against the pressure plate 71. Step S3: Control the pressing component 50 to descend, so that the pressing component 50 and the lifting component 40 fix the PCB board and the heat sink from both the top and bottom directions; Step S4: The second transport component 62 drives the press 61 to move, so as to sequentially rivet the plurality of PCB boards and the heat sink on the carrier plate; Step S5: The laser sensor detects the riveting height of each PCB board and the heat sink, and the pressure sensor detects the actual pressure value of the press 61 on each PCB board and the heat sink, and stores the corresponding riveting height information and actual pressure value information in the corresponding tag of each PCB board and the heat sink.

[0041] By having the lifting guide rod 46 abut against the pressure plate 71 in step S2, the riveting pressure of the press 61 will not be transmitted to the entire frame 10 through the lifting guide rod 46 and the pressure plate 71 during the riveting process of the PCB board and the heat sink. This prevents the lifting assembly 40 from bearing the riveting pressure itself, thereby improving the service life of the lifting assembly 40.

[0042] Meanwhile, by storing the corresponding riveting height information and actual pressure value information in the corresponding tags of each PCB board and heat sink, it is convenient to track and inspect the products later to check whether the riveting of the PCB board is qualified. At the same time, it is also convenient to improve and optimize the riveting process and riveting machine structure in the later processing, thereby improving the product yield.

[0043] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A riveting mechanism, characterized in that, include: The frame is provided with a riveting position; A first transport assembly is mounted on the frame and is used to transport a carrier plate containing a PCB board and a heat sink to the riveting position. A blocking assembly, comprising a blocking cylinder and a blocking plate both mounted on the first transport assembly, wherein the blocking cylinder is throttle-connected to the blocking plate and the blocking plate is disposed near the riveting position to limit the PCB board and the heat sink to the riveting position; A lifting assembly, mounted on the frame, is used to lift the bearing plate at the riveting position; A pressing assembly, mounted on the frame, is used to press and lift the PCB board and the heat sink after they have been lifted. as well as The riveting assembly includes a second transport assembly and a press, both mounted on the frame. The second transport assembly is drive-connected to the press to move the press to the riveting position, so that the press sequentially rivets a plurality of PCB boards and heat sinks at the riveting position.

2. The riveting mechanism as described in claim 1, characterized in that, The lifting assembly includes a fixed lifting frame, a movable lifting frame, a lifting cylinder, a lifting block, multiple lifting linear bearings, and multiple lifting guide rods. The fixed lifting frame is mounted on the machine frame. One of the lifting linear bearings is correspondingly sleeved on one of the lifting guide rods. The lifting linear bearings and the lifting cylinder are fixed to the fixed lifting frame. One end of the lifting guide rod is fixed to the movable lifting frame. The lifting block is drivenly connected to the output shaft of the lifting cylinder. The lifting cylinder pushes the movable lifting frame to rise and fall relative to the fixed lifting frame through the lifting block.

3. The riveting mechanism as described in claim 2, characterized in that, The riveting mechanism further includes a pressure-bearing component, which in turn includes a third transport component and a pressure plate. The pressure plate is fixed to the third transport component. When the lifting component lifts the bearing plate at the riveting position, the third transport component moves the pressure plate to below the lifting component, and the ends of the plurality of lifting guide rods that are away from the lifting movable frame abut against the pressure plate.

4. The riveting mechanism as described in claim 3, characterized in that, The riveting mechanism further includes a detection component, which includes a laser sensor and a pressure sensor both mounted on the riveting component. The laser sensor is used to detect the riveting height of the PCB board and / or the heat sink, and the pressure sensor is used to detect the actual pressure value of the press.

5. The riveting mechanism as described in claim 2, characterized in that, The lifting assembly also includes a pad and a positioning pin. The pad and the positioning pin are connected to the side of the lifting movable frame away from the lifting fixed plate. The pad and the positioning pin are both inserted into the bearing plate, and the pad is arranged opposite to the PCB board and the heat sink to facilitate the riveting of the PCB board and the heat sink.

6. The riveting mechanism as described in claim 5, characterized in that, The carrier plate includes a carrier and a reinforcing plate. The reinforcing plate is located inside the carrier. The PCB board and the heat sink are placed on the reinforcing plate. The pad protrudes from the upper surface of the carrier. When the press rivets the PCB board and the heat sink, the pad abuts against the reinforcing plate, and the carrier detaches from the reinforcing plate.

7. The riveting mechanism as described in claim 1, characterized in that, The pressing assembly further includes a pressing fixed frame, a pressing movable frame, a pressing cylinder, a pressing transmission component, multiple pressing linear bearings, and multiple pressing guide rods. The pressing fixed frame is installed on the machine frame. One pressing linear bearing is correspondingly sleeved on one of the pressing guide rods. The pressing linear bearing and the pressing cylinder are fixed to the pressing fixed frame. One end of the pressing guide rod is fixed to the pressing movable frame. The pressing transmission component is driven to the output shaft of the pressing cylinder. The pressing cylinder pushes the pressing movable frame to press the carrier plate and / or the PCB board and the heat sink within the carrier plate through the pressing transmission component. The pressing movable frame is provided with clearance holes. The press passes through the clearance holes to rivet the PCB board and the heat sink.

8. The riveting mechanism as described in claim 7, characterized in that, The pressing assembly further includes a shape-changing plate, the clearance hole is provided on the shape-changing plate, the pressing movable frame is provided with a sliding groove, the shape-changing plate is slidably connected in the sliding groove, and the shape-changing plate is detachably connected to the pressing movable frame. The shape-changing plate is provided with an elastic pressing post on the side facing the pressing fixed frame. The pressing movable frame presses the carrier plate and / or the PCB board and / or the heat sink through the elastic pressing post. The shape-changing plate has a variety of different models, and the position and / or size of the elastic pressing post on the shape-changing plate of different models are different.

9. The riveting mechanism as described in claim 8, characterized in that, The elastic pressing column includes an elastic pressure bar and a pressing column. The pressing column is elastically connected to the forming plate through the elastic pressure bar. The pressing column is made of a flexible material.

10. A riveting method using the riveting mechanism as described in claim 4, characterized in that, include: Step S1: Detect the transport of the carrier plate carrying the PCB board and the heat sink to the riveting position, control the start of the blocking cylinder, and limit the carrier plate to the riveting position through the blocking plate; Step S2: First, control the lifting assembly to lift the bearing plate, and control the third transport assembly to move the pressure plate directly below the lifting assembly. Then, control the lifting assembly to lower so that the end of the lifting guide rod away from the lifting movable frame abuts against the pressure plate. Step S3: Control the pressing component to descend, so that the pressing component and the lifting component fix the PCB board and the heat sink from both the top and bottom directions; Step S4: The second transport component drives the press to move, so as to sequentially rivet the plurality of PCB boards and the heat sink on the carrier plate; Step S5: The laser sensor detects the riveting height of each PCB board and the heat sink, and the pressure sensor detects the actual pressure value of the press on each PCB board and the heat sink, and stores the corresponding riveting height information and actual pressure value information in the corresponding tag of each PCB board and the heat sink.

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