Multi-layer combined type air bag grinding device, grinding equipment and grinding method

Abstract

The invention relates to the technical field of semiconductors, in particular to a multi-layer combined type air bag grinding device, grinding equipment and a grinding method.The multi-layer combined type air bag grinding device comprises a rotating plate, a supporting plate, an adjusting plate and a grinding plate, the rotating plate comprises a first rotating face and a second rotating face, and the first rotating face is provided with a piezoelectric film sensor; the second rotating face is in transmission connection with a supporting plate, a ventilation opening and closing valve is arranged on one side of the supporting plate, the supporting plate is connected with an adjusting plate through a supporting column, and the adjusting plate is connected with a grinding plate through an air bag. Pressure generated by contact of the grinding plate and the base plate is monitored in real time through the piezoelectric film sensor, the air pressure value needed by the air bag is calculated through fuzzy PI D, accordingly, the ventilation opening and closing valve is opened and closed, the air pump is controlled to increase or reduce pressure of the air bag, and the pressure of the grinding plate on the base plate is increased or reduced till the curved-surface base plate is completely ground flat. Therefore, the base plate is ground flat, and meanwhile the effect of monitoring the grinding state in real time is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a multi-layer composite air bag grinding device, a grinding equipment and a grinding method. BACKGROUND

[0002] In semiconductor manufacturing, the precision of the chip directly determines its performance and yield, and the wafer grinding equipment, as one of the key devices, undertakes the core task of processing the wafer surface to nanometer level flatness, and its technical development directly affects the chip yield and manufacturing cost; with the rapid development of semiconductor technology, the integration density of semiconductor is also higher and higher, and the process precision is also higher and higher, of course, mechanical grinding technology is the key equipment to realize the wafer thickness and surface flatness in the integrated circuit manufacturing process.

[0003] In the existing mechanical grinding technology, many adopt a single pressure area to grind the substrate, and adopt a spring buffer system to add pressure to the substrate for fine polishing through a hydraulic cylinder or an air cylinder, in the grinding process of this technology, the control of the pressure and angle of the grinding plate is insufficient, which leads to the uneven phenomenon of the substrate after being ground, and lacks precision; and there is no real-time monitoring technology in the grinding process, which leads to the inability to understand the grinding state of the substrate in real time, and the inability to determine whether the substrate has been flattened or not, and the need for additional detection.

[0004] In order to improve the grinding efficiency and the smoothness of the surface after grinding, polishing liquid (grinding liquid) is usually added to the grinding process to increase the grinding efficiency, but in the grinding process, substrate waste and old grinding liquid are generated, and the generated substrate waste may cause wear or scratches on the substrate during the grinding process, affecting the grinding effect of the substrate, and the process of adding polishing liquid needs to pause the grinding process, which reduces the work efficiency. SUMMARY

[0005] In order to solve the above problems existing in the prior art, the present application provides a multi-layer composite air bag grinding device, a grinding equipment and a grinding method. The technical problems to be solved by the present application are realized by the following technical solutions:

[0006] One aspect of the present application provides a multi-layer composite air bag grinding device for grinding a substrate, which comprises:

[0007] The rotating plate comprises a first rotating surface and a second rotating surface, the first rotating surface is provided with at least one piezoelectric film sensor, the first rotating surface is connected with a rotating rod, and the rotating rod is drivingly connected with an air pressure connecting body; the support plate is fixedly connected with the second rotating surface, at least one support column is arranged on one side of the support plate relative to the second rotating surface, and an air opening and closing valve is arranged on one side of the support column; the adjusting plate is fixedly connected with the support column, and at least one air bag is arranged on one side of the adjusting plate relative to the support column; the grinding plate comprises a fitting surface connected with the air bag and a grinding surface opposite to one side of the air bag, and the grinding surface is used for grinding the substrate.

[0008] The support plate has a first middle area on one side of the second rotating surface and a first edge area outside the first middle area, and at least one support column is arranged on the first middle area and the first edge area.

[0009] The adjusting plate has a second middle area on one side of the support column and a second edge area outside the second middle area, and at least one air bag is arranged on the second middle area and the second edge area.

[0010] In one embodiment of the multi-layer composite air bag grinding device, the first middle area and the second middle area can be a center point, and the first edge area and the second edge area are areas outside the center point.

[0011] The first middle area is provided with one support column, the first edge area is provided with a plurality of support columns arranged in a ring array, the second middle area is provided with one air bag, and the second edge area is provided with a plurality of air bags arranged in a ring array.

[0012] In one embodiment of the multi-layer composite air bag grinding device, the first middle area and the second middle area can also be a circle, a polygon or a special shape.

[0013] In one embodiment of the multi-layer composite air bag grinding device, the support column and the air bag are vertically and one-to-one corresponding, the piezoelectric film sensor is uniformly distributed in a ring array on the first rotating surface, and the piezoelectric film sensor and the air opening and closing valve are both connected with a PID control template.

[0014] In one embodiment of the multi-layer composite air bag grinding device, the rotating rod and the middle part of the rotating plate have a communication air hole, the adjusting plate and the support column have a communication air duct inside, and the air duct is connected with the air hole and the air bag.

[0015] In addition, in one embodiment of the multi-layer composite air bag grinding device, the support plate and the support column are both NBR rubber materials with elasticity, the adjusting plate and the air bag are both composite materials of aramid fiber and silicone rubber, and the grinding plate is a high-wear-resistant grinding material with a Shore hardness of 60-90HD.

[0016] The application also provides a grinding device, which comprises the multi-layer composite air bag grinding device in any one of the above embodiments and a table assembly for carrying a substrate, wherein the table assembly comprises a rotating column arranged below the grinding plate, the rotating column is provided with a grinding table on a side facing the grinding plate, the grinding table is used for carrying the substrate, and a fixing clamping ring is clamped to an outer edge of the grinding table.

[0017] In one embodiment of the grinding device, an annular groove is arranged in the outer edge of the grinding table, a clamping groove is further arranged in the annular groove, two clamping protrusions are arranged on the fixing clamping ring and are inserted into the annular groove, outer side walls of the two clamping protrusions are provided with clamping hooks for clamping the clamping groove, and inner side walls of the two clamping protrusions are provided with return springs.

[0018] In one embodiment of the grinding device, a plurality of inclined grooves are further arranged on the fixing clamping ring, and the inclined grooves are arranged in a diagonal direction on the fixing clamping ring.

[0019] In addition, the application also provides a grinding method for grinding a curved substrate in a grinding device, which comprises the following steps.

[0020] Step 01: placing the substrate on the grinding table, and obtaining the required grinding pressure of some areas of the substrate by the piezoelectric film sensor when the grinding plate contacts the substrate;

[0021] Step 02: converting the required pressure value into a required air pressure value by the PID control template according to the pressure obtained by the piezoelectric film sensor, so as to calculate the required air pressure value of the substrate;

[0022] Step 03: increasing or decreasing the grinding pressure of the substrate by increasing or decreasing the air pressure of the air bag through the air pump and the air opening and closing valve according to the required air pressure value;

[0023] Step 04: repeating the operations of steps 01 to 03 according to the real-time feedback of the piezoelectric film sensor until the curved substrate is completely ground flat.

[0024] Compared with the prior art, the application has the following advantages:

[0025] 1. The present application monitors the pressure generated by the contact between the grinding plate and the substrate in real time according to the piezoelectric film sensor, calculates the required air pressure value of the air bag through fuzzy PID calculation, thereby opening and closing the air opening and closing valve, controlling the air pump to pressurize or depressurize the air bag, increasing and reducing the pressure of the grinding plate on the substrate, until the curved substrate is completely ground flat, thereby achieving the grinding of the substrate, and through the setting of the electric film sensor, the effect of real-time monitoring of the grinding state can be achieved.

[0026] 2. The present application avoids the traditional single pressure control area by setting multiple support columns and air bags to abut the grinding plate, and cooperating with multiple one-to-one piezoelectric film sensors for control, thereby increasing the fineness of grinding.

[0027] 3. The present application discharges the waste and old grinding liquid generated during the grinding process of the substrate from the inclined groove on the fixed clasp during the rotation of the grinding table, and at the same time, the new grinding liquid flows into the inclined groove, forming a circulating flow, and the fixed clasp makes the grinding work in a closed space, avoiding the grinding waste from causing wear or scratches on the substrate during the grinding process, and avoiding the splashing of waste. BRIEF DESCRIPTION OF DRAWINGS

[0028] The present application will be further described in detail below in combination with the drawings and examples.

[0029] Figure 1 It is a structural schematic view of a multi-layer composite air bag grinding device of the present application.

[0030] Figure 2 It is a sectional view schematic view of a multi-layer composite air bag grinding device of the present application.

[0031] Figure 3 It is an enlarged view of A in Figure 2

[0032] Figure 4 It is a schematic view of one of the arrangements of the support column of a multi-layer composite air bag grinding device of the present application on the support plate.

[0033] Figure 5 It is a schematic view of one of the arrangements of the air bag of a multi-layer composite air bag grinding device of the present application on the adjusting plate.

[0034] Figure 6 It is a sectional view schematic view of a grinding equipment of the present application.

[0035] Figure 7 It is another sectional view schematic view of a grinding equipment of the present application.

[0036] Figure 8 It is an enlarged view of B in Figure 7 ​​

[0037] Figure 9 A clockwise rotation diagram of a fixed clasp ring in the grinding process of the present application;

[0038] Figure 10 A clockwise rotation diagram of a fixed clasp ring in the grinding process of the present application;

[0039] Figure 11 An example diagram of a curved substrate.

[0040] Reference signs: 1, rotating plate; 11, first rotating surface; 12, second rotating surface; 13, piezoelectric film sensor; 100, substrate; 2, support plate; 21, support column; 22, air opening and closing valve; 201, first middle area; 202, first edge area; 3, adjusting plate; 31, air bag; 301, second middle area; 302, second edge area; 4, grinding plate; 41, fitting surface; 42, grinding surface; 5, rotating rod; 51, air pressure connecting body; 52, air hole; 53, air duct; 6, table assembly; 61, rotating column; 62, grinding table surface; 63, fixed clasp ring; 621, annular groove; 622, clamping groove; 631, clamping convex; 632, clamping hook; 633, inclined groove; 7, reset spring; 8, straight line. DETAILED DESCRIPTION

[0041] It can be clearly presented. Through the description of the specific embodiments, the technical means and effects taken by the present application to achieve the predetermined purposes can be more deeply and specifically understood. However, the accompanying drawings are only provided for reference and illustration, and are not used to limit the technical solutions of the present application.

[0042] It should be noted that, in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variant are intended to cover non-exclusive inclusion, so that the article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed. Without more limitation, the element defined by the sentence "including a" does not exclude the presence of other identical elements in the article or device including the element. The words such as "connection" or "connection" are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationship, when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0043] To solve the problem of the traditional substrate 100 (wafer) in the grinding process, the single pressure area control leads to the lack of grinding pressure and grinding angle control, which leads to the lack of precision of grinding and the existence of grinding waste, which may cause wear or scratches on the substrate 100 during grinding.

[0044] To solve the above problems, in the embodiment, referring to Figures 1 to 3 The application provides a multi-layer composite air bag grinding device for grinding the substrate 100, which comprises a rotating plate 1, wherein the rotating plate 1 comprises a first rotating surface 11 and a second rotating surface 12, the first rotating surface 11 is provided with at least one piezoelectric film sensor 13, the first rotating surface 11 is connected with a rotating rod 5, the rotating rod 5 is drivingly connected with an air pressure connecting body 51, the air pressure connecting body 51 is connected with an external air pump (not shown in the figure); the second rotating surface 12 is fixedly connected with a support plate 2, the support plate 2 is provided with at least one support column 21 on one side of the second rotating surface 12, one side of the support column 21 is provided with an air opening and closing valve 22, the piezoelectric film sensor 13 and the air opening and closing valve 22 are both connected with a PID control template (not shown in the figure), and the air opening and closing valve 22 is controlled to open and close through the PID control template; the bottom of the support column 21 is fixedly connected with an adjusting plate 3, and the adjusting plate 3 is provided with at least one air bag 31 on one side of the support column 21.

[0045] Specifically, the grinding plate 4 comprises a fitting surface 41 connected with the air bag 31 and a grinding surface 42 opposite the air bag 31, and the grinding surface 42 is used for grinding the substrate 100.

[0046] Among them, the support plate 2 has a first middle area 201 and a first edge area 202 outside the first middle area 201 on one side of the second rotating surface 12, and at least one support column 21 is arranged on the first middle area 201 and the first edge area 202;

[0047] The adjusting plate 3 has a second middle area 301 and a second edge area 302 outside the second middle area 301 on one side of the support column 21, and at least one air bag 31 is arranged on the second middle area 301 and the second edge area 302.

[0048] When the number of support columns 21 and air bags 31 is one, one support column 21 is arranged on the first middle area 201 and the first edge area 202, and one air bag 31 is arranged on the second middle area 301 and the second edge area 302, and one air bag 31 is supported by one support column 21, forming a single pressure area, at this time, the grinding plate 4 is controlled by the single air bag 31, and the edge of the grinding plate 4 may be inclined and unbalanced, which may cause the substrate 100 to be uneven during grinding, the deformation ability is limited, and it cannot adapt to the micron-level surface undulation and cannot control the grinding plate 4 to be in a truly flat state.

[0049] When the number of support columns 21 and air bags 31 is set to 16, 16 support columns 21 are arranged in a ring array on the first middle area 201 and the first edge area 202, and 16 air bags 31 are arranged in a ring array on the second middle area 301 and the second edge area 302, the support columns 21 and the air bags 31 are uniformly distributed, at this time, through the support of the plurality of support columns 21 to the air bag 31, the plurality of air bags 31 adjusts the grinding plate 4 in multiple areas, forming multiple pressure areas, through the air pressure adjustment of the plurality of air bags 31, the grinding plate 4 is in a flat state, avoiding the uneven state caused by a single pressure area, at the same time, through the setting of the plurality of air bags 31 and support columns 21, the more the number, the more it can adapt to the micron-level surface relief degree.

[0050] Taking the setting of 16 support columns 21 and air bags 31 as an example, exemplarily, the first middle area 201 and the second middle area 301 are the center areas of the support plate 2 and the adjusting plate 3, and the first edge area 202 and the second edge area are the areas outside the center of the support plate 2 and the adjusting plate 3; the first middle area 201 and the second middle area 301 can also be a center point, a circle, a polygon or a special-shaped area; as shown in Figure 4 and Figure 5 , the first middle area 201 and the first edge area 202 are Figure 4 the internal and external areas of the dotted circle on the surface of the support plate 2, and the second middle area 301 and the second edge area are Figure 5 the internal and external areas of the dotted circle on the surface of the adjusting plate 3.

[0051] Example 01: The first middle area 201 and the second middle area 301 can be a center point, and the first edge area 202 and the second edge area 302 are areas outside the center point; the first middle area 201 is provided with one support column 21, the first edge area 202 is provided with a plurality of support columns 21 arranged in a ring array, the second middle area 301 is provided with one air bag 31, and the second edge area 302 is provided with a plurality of air bags 31 arranged in a ring array, one support column 21 or one air bag 31 at the center point plays a role of a central lever for the middle of the support plate 2 or the adjusting plate 3;

[0052] For example 02, the first middle area 201 and the second middle area 301 can also be a circle, and the first edge area 202 and the second edge area 302 are areas other than the circle; the first middle area 201 is provided with a plurality of uniformly distributed support columns 21, the first edge area 202 is provided with a plurality of annularly and uniformly distributed support columns 21, the second middle area 301 is provided with a plurality of uniformly distributed air bags 31, and the second edge area 302 is provided with a plurality of annularly and uniformly distributed air bags 31; the circular area is provided with a plurality of uniformly distributed support columns 21 or a plurality of air bags 31, which play a central supporting role in the middle of the support plate 2 or the adjusting plate 3.

[0053] According to the above examples, the angles of the support plate 2 and the adjusting plate 3 tilting outward can also be compared, such as the angle of tilting outward by the central lever effect being greater than the angle of tilting outward by the central supporting effect.

[0054] Therefore, by changing the shape and arrangement of the above middle area, the support column 21 or the plurality of air bags 31 can respectively play a central different supporting role in the middle of the support plate 2 or the adjusting plate 3, and the specific implementation is set according to actual application, which will not be exemplified here.

[0055] In this embodiment, taking example 01 as an embodiment, the support column 21, the air bag 31 and the piezoelectric film sensor 13 are respectively set to 16, wherein the support column 21 and the air bag 31 are provided with one at the central position of the middle area, which plays a central lever role, and the rest are distributed in an annular array, and the distribution interval is equal to ensure balance.

[0056] In this embodiment, the support plate 2 and the support column 21 are a one-piece structure formed by forging and pressing, and the support plate 2 and the support column 21 are both NBR rubber materials with elasticity, the adjusting plate 3 and the air bag 31 are a one-piece structure formed by hot melting, and the adjusting plate 3 and the air bag 31 are both composite materials of aramid fiber and silicone rubber, the aramid fiber is a high-strength and high-temperature-resistant material, the NBR rubber and the silicone rubber are high-elasticity materials, the NBR rubber and the silicone rubber can resist the rebound and high-frequency vibration of the grinding plate 4 and the substrate 100 during the grinding process, play a shockproof role, and prolong the service life of the device, and the aramid fiber can resist the high temperature generated during the grinding process, ensuring the sustainability of the grinding process.

[0057] Further, the grinding plate 4 is made of high-wear-resistant grinding material with a Shore hardness of 60-90HD. The high-wear-resistant grinding material is one of diamond particles or ceramic particles. Taking diamond as an example, diamond is the hardest substance in nature, which has high strength and high wear resistance, and reduces the situation of grinding residue of the grinding plate 4 during the grinding process, ensuring the durability of the grinding work.

[0058] It should be noted that the air bag 31 also has the functions of axial contraction and radial swing, and the axial contraction is controlled within 0-15mm, and the radial swing is controlled within about 5°, which is suitable for the curved surface with a curvature radius greater than or equal to 50mm. The axial contraction and radial swing values can effectively control the radial contraction range and radial swing degree of the grinding plate 4. The curvature radius helps the air bag 31 to adjust the grinding plate 4 in microns. The above functions can make the grinding precision less than 0.1μm and the loss rate less than 0.5%.

[0059] Please refer to Figure 2 and Figure 3 In the embodiment, the support column 21 and the air bag 31 are vertically corresponding, the piezoelectric film sensor 13 is uniformly distributed in a ring array on the first rotating surface 11, the piezoelectric film sensor 13 and the air opening and closing valve 22 are both connected with the PID control template. The pressure generated by the contact between the grinding plate 4 and the substrate 100 is sensed by the piezoelectric film sensor 13, the pressure value is transmitted to the PID control template for calculation, and the calculated data is fed back to the air opening and closing valve 22 and the air pump (not shown in the figure). The air inlet and outlet of the air bag 31 are controlled by controlling the air opening and closing valve 22 and the air pump, so as to adjust the grinding and flattening of the grinding plate 4 to the curved substrate 100.

[0060] Further, the air bag 31 has an inflatable and contractible cavity inside, the rotating rod 5 and the rotating plate 1 have a communicating air hole 52 in the middle, the air hole 52 is connected with an external air pump through an air pressure connecting body 51, the adjusting plate 3 and the support column 21 have a communicating air duct 53 inside, the air duct 53 is connected with the air hole 52 and the cavity of the air bag 31, forming a closed and communicating environment, improving the agility of the air pump to pressurize or depressurize the air bag 31, and making the pressure applied by the air bag 31 to the grinding plate 4 close to the pressure value calculated by the PID control template, thereby increasing the numerical precision of the device.

[0061] Referring to Figures 6 to 8 The grinding equipment provided by the present application comprises the multilayer composite air bag 31 grinding device of any one of the above embodiments and a table assembly 6 for carrying the substrate 100. The table assembly 6 comprises a rotating column 61 arranged below the grinding plate 4. A grinding table 62 is arranged between the rotating column 61 and the grinding plate 4. The grinding table 62 is used for carrying the substrate 100. An annular groove 621 is formed in the outer edge of the grinding table 62. A clamping groove 622 is further formed in the inner wall of the annular groove 621. A fixed clamping ring 63 is arranged in the annular groove 621. The fixed clamping ring 63 has two clamping protrusions 631 which are inserted into the annular groove 621. The outer side wall of the two clamping protrusions 631 has a clamping hook 632 which is clamped with the clamping groove 622. A reset spring 7 is arranged in the inner side wall of the two clamping protrusions 631. The reset spring 7 is used for taking out the fixed clamping ring 63, thereby facilitating the disassembly and assembly of the device.

[0062] Specifically, the fixed clasp 63 has an outer ring and an inner ring, the inner ring can make the rotating plate 1 and the supporting plate 2 fit and put in, so that the fixed clasp 63, the supporting plate 2 and the grinding table 62 form a grinding space inside, which can prevent the grinding process, and the grinding waste and the grinding waste liquid from splashing.

[0063] The fixed clasp 63 is also provided with a plurality of inclined grooves 633, which are arranged in an inclined manner on the fixed clasp 63, and the same side of the outer ring and the inner ring of the fixed clasp 63 is a straight line 8, or the vertical width between the outer ring and the inner ring is a straight line 8. The inclined arrangement can be understood as that one connected groove is opened in the inclined direction of the straight line 8, and the other connected groove is opened in the inclined direction of the straight line 8 at the mirror position, and the two grooves are arranged in a cross manner.

[0064] In order to realize that the waste generated by the substrate 100 during the grinding process can be discharged and the grinding liquid can enter, the following refers to Figure 9 The angle between the a inclined groove 633 and the straight line 8 is a angle, and the angle between the b inclined groove 633 and the straight line 8 is b angle. When the grinding table 62 rotates counterclockwise, it drives the fixed clasp 63 to rotate counterclockwise. Because the object will generate centrifugal force when rotating, the new grinding liquid will enter from the a inclined groove 633, and the old grinding liquid and the waste generated during the grinding process will flow out from the b inclined groove 633;

[0065] Similarly, referring to Figure 10 When the grinding table 62 rotates clockwise, it drives the fixed clasp 63 to rotate clockwise. The new grinding liquid will enter from the b inclined groove 633, and the old grinding liquid and the waste generated during the grinding process will flow out from the a inclined groove 633. In this way, the waste and waste liquid generated during the grinding process are avoided to damage the substrate 100.

[0066] It should be noted that the shape of the inclined groove 633 can be changed, such as a wavy line, an arc, and various shapes.

[0067] The application also provides a grinding method, which is applied to the grinding device of any one of the above embodiments. The method comprises the following steps:

[0068] Step 01: Place the curved substrate 100 on the grinding table 62. When the grinding plate 4 contacts the substrate 100, the piezoelectric film sensor 13 will feel the surface force of the contact between the grinding surface 42 on the grinding plate 4 and the substrate 100, so as to obtain the area on the substrate 100 that needs to increase or decrease the grinding pressure;

[0069] When the contact surface and the force receiving surface are unbalanced, refer to Figure 11For example, the area c in the figure is the convex area of the curved substrate 100, and the area d in the figure is the concave area of the curved substrate 100; when the grinding plate 4 contacts the curved substrate 100, the area c is contacted first, and other areas are not contacted, and the piezoelectric film sensor 13 obtains that the area c needs to increase the grinding pressure, and other areas need to reduce the grinding pressure, so as to grind the area c to be flat with other areas; when the area c is completely ground flat, the grinding plate 4 contacts the curved substrate 100, and the piezoelectric film sensor 13 only identifies the area outside the area d, and does not identify the area d, so that the piezoelectric film sensor 13 obtains that the area d needs to reduce the grinding pressure, and other areas need to increase the grinding pressure;

[0070] Step 02: According to the pressure obtained by the piezoelectric film sensor in step 01, the pressure is transmitted to the PID control template for algorithm calculation, and the pressure value required by some areas of the substrate 100 is calculated;

[0071] Step 03: According to the required pressure value calculated by the PID control template, the required pressure value is converted into the required air pressure value, the air pump is controlled to inflate and inhale the air bag 31, so as to increase or reduce the air pressure in the air bag 31, and the air passage 53 needing inflation or inhalation is opened by the air opening and closing valve 22, so as to adjust the area of the curved substrate 100 needing to increase or reduce the grinding pressure;

[0072] Step 04: According to the real-time feedback of the piezoelectric film sensor 13, the inflation and inhalation of the air pump and the air opening and closing valve 22 to the air bag 31 are adjusted in real time, that is, the operations of steps 01 to 03 are repeated, until the curved substrate 100 is completely ground flat.

[0073] The above is a further detailed description of the present application in combination with a specific preferred embodiment, and cannot be regarded as a limitation of the specific implementation of the present application. For ordinary skilled persons in the technical field to which the present application belongs, some simple deductions or replacements can be made without departing from the concept of the present application, and all of them should be regarded as falling within the protection scope of the present application.

Claims

1. A multi-layered composite airbag polishing apparatus for polishing a substrate (100), characterized in that, The utility model relates to a kind of plate grinding machine, including: Rotary plate (1): the rotary plate (1) includes first rotary surface (11) and second rotary surface (12), at least one piezoelectric film sensor (13) is provided in the first rotary surface (11), the first rotary surface (11) is connected with rotating rod (5), and rotating rod (5) is drivingly connected with air pressure connecting body (51); Support plate (2): the support plate (2) is fixedly connected with the second rotary surface (12), and at least one support column (21) is provided on the side of the support plate (2) relative to the second rotary surface (12), and air opening and closing valve (22) is provided on the side of the support column (21); Adjusting plate (3): the adjusting plate (3) is fixedly connected with support column (21), and at least one air bag (31) is provided on the side of the adjusting plate (3) relative to the support column (21); Grinding plate (4): the grinding plate (4) includes the abutting surface (41) connected with air bag (31) and the grinding surface (42) on the side of the air bag (31), and the grinding surface (42) is used for grinding substrate (100); The support plate (2) has first middle region (201) and first edge region (202) outside the first middle region (201) on the side relative to the second rotary surface (12), and at least one support column (21) is provided on the first middle region (201) and the first edge region (202); The adjusting plate (3) has second middle region (301) and second edge region (302) outside the second middle region (301) on the side relative to the support column (21), and at least one air bag (31) is provided on the second middle region (301) and the second edge region (302).

2. The multi-layer complex air cell milling device according to claim 1, wherein, The first middle region (201) and the second middle region (301) can be a center point, and the first edge region (202) and the second edge region (302) are regions outside the center point; The first middle region (201) is provided with one support column (21), the first edge region (202) is provided with a plurality of support columns (21) in annular array distribution, the second middle region (301) is provided with one air bag (31), and the second edge region (302) is provided with a plurality of air bags (31) in annular array distribution.

3. The multi-layer complex air cell mill device according to claim 2, wherein, The first middle region (201) and the second middle region (301) can also be a circle, a polygon or a special shape.

4. The multi-layer complex air cell milling device according to claim 1, wherein The support column (21) and the air bag (31) are vertically one-to-one corresponding, the piezoelectric film sensor (13) is uniformly distributed in annular array on the first rotary surface (11), and the piezoelectric film sensor (13) and the air opening and closing valve (22) are both connected with PID control template.

5. The multi-layer complex air cell milling device according to claim 1, wherein The rotating rod (5) and the rotary plate (1) have the air hole (52) connected in the middle, the adjusting plate (3) and the support column (21) have the air channel (53) connected in the inside, and the air channel (53) is connected with the air hole (52) and the air bag (31).

6. The multi-layer complex air cell milling device according to claim 1, wherein The support plate (2) and the support column (21) are both NBR rubber materials with elasticity, the adjusting plate (3) and the air bag (31) are both composite materials of aramid fiber and silicone rubber, and the grinding plate (4) is a high-wear-resistant grinding material with a Shore hardness of 60-90HD.

7. A grinding apparatus characterized by comprising: The application relates to a multi-layer composite air bag grinding device. The application further relates to a table assembly (6) for carrying a substrate (100), wherein the table assembly (6) comprises a rotating column (61) arranged below the grinding plate (4), the rotating column (61) is provided with a grinding table (62) on a side facing the grinding plate (4), the grinding table (62) is used for carrying the substrate (100), and a fixing clamping ring (63) is clamped on an outer edge of the grinding table (62). The outer edge of the grinding table (62) is provided with an annular groove (621), and the annular groove (621) is further provided with a clamping groove (622) inside; the fixing clamping ring (63) is provided with two clamping protrusions (631) which are inserted into the annular groove (621); the outer side walls of the two clamping protrusions (631) are provided with clamping hooks (632) which are clamped into the clamping groove (622); and the inner side walls of the two clamping protrusions (631) are provided with reset springs (7).

8. The lapping apparatus of claim 7, wherein, The fixing clamping ring (63) is further provided with a plurality of inclined grooves (633) which are arranged in a diagonal direction on the fixing clamping ring (63).

9. The lapping apparatus of claim 8, wherein, The application further relates to a method for grinding a substrate (100) by using the multi-layer composite air bag grinding device.

10. A polishing method for polishing a substrate having a curved surface by a polishing apparatus, characterized by, Step 01: placing the substrate (100) on the grinding table (62), and acquiring the required grinding pressure of some areas of the substrate (100) by using the piezoelectric film sensor (13) when the grinding plate (4) contacts the substrate (100); Step 02: converting the required pressure value into a required air pressure value by using a PID control template according to the pressure acquired by the piezoelectric film sensor (13), so as to calculate the required air pressure value of the substrate (100); Step 03: increasing or reducing the grinding pressure of the substrate (100) by increasing or reducing the air pressure of the air bag (31) through the air pump and the air opening and closing valve (22) according to the required air pressure value; Step 04: repeating the operations of steps 01 to 03 according to the real-time feedback of the piezoelectric film sensor (13) until the curved substrate (100) is completely ground flat. ​

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