Sample stage for electrical measurement device

Abstract

The invention discloses a sample stage for electrical measuring equipment. The sample stage comprises a sample supporting plate and a measuring plate, the measuring plate is used for measuring an electric signal of a sample, and the measuring plate comprises a sample probe which is electrically connected with the sample. Meanwhile, the measuring plate can be physically connected to the sample supporting plate. According to the sample table, the sample probe is used for collecting electric signals of the sample, the sample can be rapidly loaded in the testing process, and therefore the measuring efficiency is improved. Moreover, the positions and the spacing of the sample probes disclosed by the invention can be accurately controlled, so that relatively high measurement accuracy can be ensured without an expensive lead bonding process.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a sample stage, and more particularly, to a sample stage for an electrical measuring device. Background Technology

[0002] In materials research, by measuring the changes in a material's resistance under different temperatures, magnetic fields, and the angle between the current and the magnetic field, electrical information such as magnetoresistivity, Hall resistivity, anomalous Hall resistivity, and carrier concentration can be obtained. During measurement, the sample must be connected to the measuring equipment. To improve measurement efficiency, a sample stage is often used to simplify the sample preparation process. This involves connecting the sample to pads on the sample stage using a wiring process, thereby transmitting the sample's electrical information to the measuring equipment via the sample stage.

[0003] However, while existing wire bonding technology can achieve electrical interconnection between the sample and the stage, wire bonding machines are expensive, and the range of samples that can be wire-bonded is limited. For example, most metal oxides and intermetallic compounds are difficult to bond effectively and have poor stability. Manual wiring requires manual dispensing and other steps to achieve electrical interconnection between the sample and the stage, which is not only limited by the size and characteristics of the sample but also time-consuming, resulting in low measurement efficiency. Furthermore, manual wiring makes it difficult to precisely control the electrode spacing, leading to poor measurement accuracy. Summary of the Invention

[0004] To meet the requirements of efficiency, accuracy, and cost in practical applications of electrical measurements, a sample stage for electrical measurements is proposed.

[0005] A sample stage for an electrical measurement device according to an embodiment of the present disclosure includes: a sample tray and a measuring plate, wherein the upper surface of the sample tray is provided with a sample area and a pad area; the electrical measurement device includes a sample base, wherein the pad area is electrically connected to the sample base;

[0006] The lower surface of the measuring plate is provided with a sample probe and a pad probe; the head of the sample probe is used to contact the sample to achieve electrical connection; the head of the pad probe is used to contact the pad area to achieve electrical connection; the tail of the sample probe and the tail of the pad probe are electrically connected.

[0007] The sample tray and the measuring plate are detachably connected. When connected, the lower surface of the measuring plate is opposite to the upper surface of the sample tray, so that the sample placed on the sample area is connected to the pad area.

[0008] In one embodiment, the sample tray is a first circuit board;

[0009] The pad area is electrically connected to the sample base via pins;

[0010] The pins and the pad area are electrically connected via wires in the first circuit board.

[0011] Preferably, the sample area is located in the middle of the first circuit board, the sample area has a through hole penetrating the first circuit board, and a thermally conductive layer is provided on the surface of the sample area and in the through hole, the thermally conductive layer being a copper layer.

[0012] Preferably, the measuring board is a second circuit board; the tail of the sample probe and the tail of the pad probe are electrically connected through wires in the second circuit board; the position of the pad probe on the measuring board corresponds to the position of the pad area on the sample tray.

[0013] Preferably, the length of the sample probe is less than the length of the pad probe; and the size of the measuring plate is less than the size of the sample tray.

[0014] Preferably, the lower surface of the measuring plate is provided with n independent sample probes and n independent pad probes corresponding to the n sample probes; n is an integer greater than 1; the sample tray is provided with n independent pad areas corresponding to the n pad probes.

[0015] Preferably, the sample probe body is made of a flexible and deformable conductive material. The length and position of the probe head can be adjusted by bending and deformation. In use, the length and position of the probe head can be flexibly fine-tuned according to the shape of the sample, so that the positions of the heads of the n sample probes can be fine-tuned to different positions to adapt to the measurement of different physical signals.

[0016] Preferably, the sample probe can also be a spring-loaded needle.

[0017] These and other features of this disclosure will be apparent to those skilled in the art upon understanding all the disclosure, including the accompanying drawings and claims. Attached Figure Description

[0018] To better understand this disclosure, it will be described in detail with reference to the following figures:

[0019] Figure 1 A schematic diagram of the structure of the sample base 10 of an existing electrical measurement device is shown;

[0020] Figure 2 A schematic diagram of the existing sample stage 20 is shown;

[0021] Figure 3 An exploded three-dimensional view of a sample stage 30 according to an embodiment of the present disclosure is shown;

[0022] Figure 4 An embodiment of the present disclosure is shown as follows: Figure 3 The side view of the measuring plate 32 shown;

[0023] Figure 5 A schematic diagram of the electrical signal transmission path of the sample stage 30 during testing is shown according to an embodiment of the present disclosure;

[0024] Figure 6 A top view of a measuring plate 32A-32E with sample probes 322 having different arrangements according to various embodiments of the present disclosure is shown;

[0025] Figure 7 A side view of a measuring plate 32F according to an embodiment of the present disclosure is shown;

[0026] Figure 8 A schematic diagram of the structure of a sample tray 31A according to an embodiment of the present disclosure is shown. Detailed Implementation

[0027] Specific embodiments of this disclosure will now be described in detail. It should be noted that the embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this disclosure. In the following description, numerous specific details are set forth in order to provide a thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that these specific details are not necessary to implement this disclosure. In other instances, well-known circuits, materials, or methods have not been specifically described to avoid obscuring this disclosure.

[0028] Throughout this specification, references to “an embodiment,” “an embodiment,” “an example,” or “an example” mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of this disclosure. Therefore, the phrases “in an embodiment,” “in an embodiment,” “an example,” or “an example” appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, particular features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the accompanying drawings provided herein are for illustrative purposes and are not necessarily drawn to scale. The same reference numerals indicate the same devices. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Figure 1 A schematic diagram of the sample base 10 of an existing electrical measurement device is shown. (See diagram below.) Figure 1As shown, the sample base 10 includes a socket 11, a fixing bolt 12, and a temperature measuring area 13. The fixing bolt 12 is used to fix the sample base 10 to an electrical measurement device (e.g., a Physical Property Measurement System, PPMS). The temperature measuring area 13 is used to measure the temperature of the sample and is typically located in the middle or near the middle of the sample base 10.

[0030] Figure 2 A schematic diagram of the existing sample stage 20 is shown. Figure 2 As shown, the existing sample stage 20 includes a conventional sample area 21, conventional pins 22, and conventional pads 23. The conventional sample area 21 is used to place the sample 24 of the existing sample stage. During testing, the conventional pins 22 of the existing sample stage 20 need to be inserted into the sockets 11 of the sample base 10. At the same time, the sample 24 of the existing sample stage is fixed in the conventional sample area 21, and the sample 24 of the existing sample stage is connected to the conventional pads 23 by wire bonding or manual wiring with wires 25, so that the electrical signal of the sample 24 of the existing sample stage is transmitted to the sample base 10 through the wires 25, the conventional pads 23, and the conventional pins 22, and then transmitted to the electrical measurement equipment through the sample base 10. However, as mentioned above, the existing wiring method has problems such as high cost, low measurement efficiency, and poor measurement accuracy.

[0031] Figure 3 An exploded three-dimensional view of a sample stage 30 according to an embodiment of the present disclosure is shown. Figure 3 As shown, the sample stage 30 includes a sample tray 31 for holding a sample; and a measuring plate 32 located above the sample tray 31 for measuring the electrical signal of the sample. In some embodiments, the size of the measuring plate 32 is smaller than the size of the sample tray 31. For example, in one example, the length of the measuring plate 32 (i.e., as shown in the figure) is smaller than the length of the sample tray 31. Figure 3 The dimension in the x-axis direction shown is smaller than the dimension in the length direction of the sample tray 31. In another example, the dimension in the width direction of the measuring plate 32 (i.e., as shown) is smaller than the dimension in the length direction of the sample tray 31. Figure 3 The dimension in the y-axis direction shown is smaller than the dimension in the width direction of the sample tray 31. The design of the measuring plate 32 with a smaller size in the embodiments of this disclosure is beneficial for the use of the sample stage 30 in electrical measuring devices with limited measurement space. For example, in a PPMS, the sample stage 30 may need to rotate around the y-axis, and the smaller measuring plate 32 is beneficial for the application of the sample stage 30 on the rotating rod of the PPMS.

[0032] like Figure 3As shown, the sample tray 31 includes a first circuit board 311, pins 312, and a nut 313. In some embodiments, the first circuit board 311 includes a sample area 3111 for placing samples; and pad areas 3112 disposed on both sides of the first circuit board 311 in the x-axis direction. Figure 3 In the example, pin 312 passes through the first circuit board 311 and is disposed on both sides of the first circuit board 311 in the y-axis direction. In one embodiment, the top of pin 312 can be secured with a fixing material (e.g., Figure 3 In the example, solder 3121 is fixed to the first circuit board 311. In one embodiment, the bottom of the pin 312 can be inserted into... Figure 1 The sample base 10 shown has insertion holes 11 for physically connecting the sample tray 31 to the sample base 10 in a pluggable manner. Therefore, the number and position of the pins 312 in the sample tray 31 can correspond to the number and position of the insertion holes 11 in the sample base (e.g., sample base 10). Similarly, the position of the sample area 3111 can also correspond to the temperature measuring area 13 of the sample base 10 (e.g., located in the middle of the first circuit board 311) to accurately obtain the sample temperature. Figure 3 In the example, the nuts 313 of the sample tray 31 are symmetrically placed on the upper surface of the first circuit board 311. In one embodiment, the bottom of the nuts 313 can be fixed to the upper surface of the first circuit board 311 by a fixing material (e.g., glue or solder).

[0033] Figure 4 An embodiment of the present disclosure is shown as follows: Figure 3 The side view of the measuring plate 32 shown. (Combined with...) Figure 3 and Figure 4 As shown, the measuring board 32 includes a second circuit board 321, a sample probe 322, a pad probe 323, and a bolt 324. In some embodiments, the sample probe 322 penetrates the second circuit board 321 and may be positioned at the center of the second circuit board 321 to correspond to the position of the sample area 3111 of the first circuit board 311; the pad probe 323 penetrates the second circuit board 321 and may be positioned on both sides of the second circuit board 321 in the x-axis direction to correspond to the position of the pad area 3112 of the first circuit board 311; the bolt 324 penetrates the second circuit board 321 and may be positioned on both sides of the second circuit board 321 in the y-axis direction to correspond to the position of the nut 313 of the first circuit board 311. In one embodiment, the tops of the pad probe 323 and the sample probe 322 can be joined by a fixing material (e.g., Figure 3 In the example, solder 3231 is fixed to the second circuit board 321. In a preferred embodiment, sample probe 322 and / or pad probe 323 may be implemented using spring-loaded pins. Figure 3 and Figure 4As shown, the bottoms of the sample probe 322 and the pad probe 323 are retractable. In other words, the lengths of the sample probe 322 and / or the pad probe 323 can vary within a certain range. Therefore, the sample probe 322 and the pad probe 323 in the measurement board 32 can respectively achieve effective electrical contact between the probe and the sample and between the probe and the pad area 3112 on the first circuit board 311, thereby meeting the testing requirements of samples with different thicknesses.

[0034] In some embodiments, the first circuit board 311 and the second circuit board 321 may be printed circuit boards (PCBs). In other embodiments, the first circuit board 311 and the second circuit board 321 may be alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, aluminum substrates, etc.

[0035] Figure 5 A schematic diagram of the electrical signal transmission path of the sample stage 30 during testing is shown according to an embodiment of the present disclosure. Figure 5 In the illustrated embodiment, before testing, sample 33 can be fixed to sample area 3111 of sample tray 31, and the measuring plate 32 of sample stage 30 is physically connected to sample tray 31 via bolts 324 and nuts 313. Simultaneously, the pad probes 323 of measuring plate 32 are connected to pad area 3112 on sample tray 31, and the sample probes 322 of measuring plate 32 are connected to sample 33 on sample tray 31. Therefore, as... Figure 5 As indicated by the arrow, the electrical signal of sample 33 can be transmitted through sample probe 322 and second circuit board 321 to pad probe 323, and then through pad probe 323, pad area 3112, and first circuit board 311 to pin 312. Finally, it is received by the sample base (e.g., sample base 10) connected to pin 312. Those skilled in the art will understand that the bolt-nut connection between measuring plate 32 and sample holder 31 is merely illustrative, and the physical connection between measuring plate 32 and sample holder 31 can be achieved using other suitable connection methods, such as pluggable structures.

[0036] Figure 6 A plan view top view of measuring plates 32A-32E with sample probes 322 having different arrangements according to various embodiments of the present disclosure is shown. Figure 6As shown, measurement plate 32A is provided with multiple (e.g., 4) sample probes 322 arranged in a straight line, which can be used to measure the resistivity of the sample. Measurement plate 32B is provided with multiple (e.g., 4) sample probes 322 arranged in a cross shape, which can be used to measure the Hall coefficient of the sample. Measurement plate 32C is provided with multiple (e.g., 4) sample probes 322 arranged in a square shape, which can be used to measure the resistivity and Hall coefficient of the sample using the van der Bauer method. Measurement plate 32D is provided with multiple (e.g., 5) sample probes 322, of which 4 sample probes 322 are arranged in a straight line, and the remaining 1 sample probe 322 is located below the 4 sample probes 322, which can be used to measure the resistivity and Hall coefficient of the sample simultaneously. Measurement plate 32E is provided with at least one set (e.g., 2 sets) of sample probes 322 arranged in a straight line, which can be used to measure the resistance of the sample in multiple channels. It should be understood that... Figure 6 The measurement plates 32A-32E with sample probes 322 arranged in different positions shown are for illustrative purposes only. The positions and spacing of the sample probes in this embodiment can be flexibly adjusted according to actual measurement needs.

[0037] Figure 7 A side view of a measuring plate 32F according to an embodiment of the present disclosure is shown. In embodiments of the present disclosure, the lengths of the sample probe 322 and the pad probe 323 can be set according to the thickness of the sample. In some embodiments, when the sample is thick, even if a spring needle is used as the sample probe 322, damage to the sample and / or the sample probe 322 may occur due to the limited travel of the spring needle itself. Therefore, as Figure 7 As shown, the length L1 of the sample probe 322 can be set to be less than the length L2 of the pad probe 323, thereby ensuring effective contact between the sample probe 322 and the sample, and also avoiding damage to the sample probe 322 and the sample.

[0038] Figure 8 A schematic diagram of the sample tray 31A according to an embodiment of the present disclosure is shown. Figure 3 The sample tray 31 in this embodiment differs in that the sample area 3111 of the first circuit board 311 of the sample tray 31A is further provided with a through hole 3113 penetrating the first circuit board 311, and a thermally conductive layer (e.g., a copper layer) with good thermal conductivity is provided on the surface of the sample area 3111 and in the through hole 3113 to improve the heat conduction efficiency of the sample, thereby enabling accurate measurement of the sample temperature. In other embodiments, the sample area 3111 of the first circuit board 311 may include a material with good thermal conductivity, such as copper.

[0039] Compared to manual wiring, the sample stage in this embodiment utilizes the sample probes of the measuring plate to measure the sample's electrical signals, eliminating the need for manual wiring. Simply fixing the sample in the sample area of ​​the sample tray allows for rapid sample loading, facilitating subsequent testing and improving measurement efficiency. Furthermore, the spacing and position of the sample probes in this embodiment can be flexibly adjusted and precisely controlled according to sample size and testing requirements, improving measurement accuracy. Simultaneously, the sample probes and pad probes in this embodiment are preferably spring-loaded pins to achieve effective and stable electrical contact between the probe and the sample, and between the probe and the pad. Therefore, using the sample stage in this embodiment eliminates the need for expensive wire bonding machines while ensuring measurement accuracy and solves the problem of poor sample bonding stability.

[0040] Although this disclosure has been described with reference to several exemplary embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Because this disclosure can be embodied in many forms without departing from the spirit or substance of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A sample stage for an electrical measuring device, characterized in that, include: The sample tray and the measuring plate are provided, wherein the upper surface of the sample tray is provided with a sample area and a pad area; the electrical measuring device includes a sample base, and the pad area is electrically connected to the sample base; The lower surface of the measuring plate is provided with a sample probe and a pad probe; the head of the sample probe is used to contact the sample to achieve electrical connection; the head of the pad probe is used to contact the pad area to achieve electrical connection; the tail of the sample probe and the tail of the pad probe are electrically connected. The sample tray and the measuring plate are detachably connected. When connected, the lower surface of the measuring plate is opposite to the upper surface of the sample tray, so that the sample placed on the sample area is connected to the pad area.

2. The sample stage as described in claim 1, characterized in that: The sample tray is the first circuit board; The pad area is electrically connected to the sample base via pins; The pins and the pad area are electrically connected via wires in the first circuit board.

3. The sample stage as described in claim 2, characterized in that: The sample area is located in the middle of the first circuit board.

4. The sample stage as described in claim 2, characterized in that: The sample area is provided with a through hole penetrating the first circuit board, and a thermally conductive layer is provided on the surface of the sample area and in the through hole.

5. The sample stage as described in claim 4, characterized in that: The heat-conducting layer is a metallic copper layer.

6. The sample stage as described in claim 2, characterized in that: The measuring board is a second circuit board; The tail of the sample probe and the tail of the pad probe are electrically connected by wires in the second circuit board. The position of the pad probe on the measuring plate corresponds to the position of the pad area on the sample tray.

7. The sample stage as described in claim 6, characterized in that: The length of the sample probe is less than the length of the pad probe; the size of the measuring plate is less than the size of the sample tray.

8. The sample stage as described in claim 1, characterized in that: The lower surface of the measuring plate is provided with n independent sample probes and n independent pad probes corresponding to the n sample probes; n is an integer greater than 1; the sample tray is provided with n independent pad areas corresponding to the n pad probes.

9. The sample stage as described in claim 8, characterized in that: The sample probe body is made of a flexible and deformable conductive material. The length and position of the probe head are adjusted by bending and deformation, so that the head positions of the n sample probes are finely adjusted to different positions to adapt to the measurement of different physical signals.

10. The sample stage as described in any one of claims 1-8, characterized in that: The sample probe is a spring-loaded needle.

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