Power module unit
By employing circuit board technology and fluid-sealed surface design in the power module and utilizing a turbulent structure to improve heat exchange, the problems of poor manufacturability and low cooling efficiency in existing technologies are solved, achieving efficient cooling and cost reduction.
Patent Information
- Application Number
- CN202510672607.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-05-23
- Filing Date
- 2025-05-23
- Publication Date
- 2025-11-25
AI Technical Summary
Existing power modules are poorly manufactured, making it difficult to achieve efficient cooling and reduce structural space requirements, and they are also costly.
Employing circuit board technology and a fluid-sealed surface design, a substantially fluid-sealed surface is formed by connecting the first and second conductive elements with the resin element. The turbulence generator structure increases heat exchange, directly transferring heat to the cooling structure and medium. The insulation layer is eliminated to improve power density and reduce costs.
It improves the manufacturability and cooling efficiency of power modules, reduces structural space requirements and manufacturing costs, enhances the heat exchange capacity of the cooling medium, and improves production flexibility and service life.
Smart Images
Figure CN121013301A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a power module unit, a method for producing a power module unit and a vehicle. BACKGROUND
[0002] There are now a variety of different solutions for constructing and cooling power modules. Due to the increasing number of power modules in the automotive sector and the increasing quality requirements, the demand for innovative and robust power modules is constantly increasing. SUMMARY
[0003] The power module unit according to the application having the features of claim 1 has the following advantages compared to known power module units: The manufacturability of the power module unit is significantly improved and it can be used, inter alia, in cooperation with a fluid of the dielectric. It is further preferred that a circuit board technology can be used in the production of the power module unit, which can be used for energy effects. It is further preferred that a high-performance thermal module concept for oil cooling of the power module unit can thus be realized. A particular advantage here can be that by eliminating the insulation layer and the base solder, the power density can be increased and the required installation space can be reduced, so that costs can thus be reduced overall. In addition, a new closure concept for the cooler of the power module unit is possible, in particular in cooperation with a plastic injection molding.
[0004] According to the application, this is achieved in that the power module unit has a first conducting element and a second conducting element, wherein the first conducting element is connected to the second conducting element by means of a resin element, wherein the first conducting element is connected to the second conducting element, wherein the first conducting element, the second conducting element and the resin element are designed to form a substantially fluid-tight surface, wherein the resin element is designed to electrically insulate the conducting elements from the second conducting element, wherein the first conducting element and the second conducting element are designed to conduct heat generated at the first conducting element and / or the second conducting element via the substantially fluid-tight surface to a cooling structure and / or a cooling medium.
[0005] In other words, a circuit board technology can be used to form the power module unit, wherein in particular the fluid-tight surface is substantially free of insulation layers or the like. Thus, the fluid-tight surface can be cooled in the case of a cooling medium using a dielectric, and the heat generated in the power module unit can thus be conducted to a cooling structure and / or a cooling medium by means of the first conducting element and the second conducting element. The resin element can be a prepreg layer or the like, in particular. It is further preferred that the conducting elements are copper tracks and / or copper lines, which have a longitudinal and / or transverse extension, for example, of approximately 1-2 mm. It is further preferred that the first insert and / or the second insert can be provided by means of a blanking grid or an insert.
[0006] The dependent claims illustrate preferred improvements of the invention.
[0007] Preferably, the first conductive element and / or the second conductive element have a turbulence generator structure, wherein the turbulence generator structure is provided to increase the heat exchange between the first conductive element and / or the second conductive element and the cooling medium.
[0008] The advantage of this implementation is that when the cooling medium of the liquid dielectric is directly guided to the first conductive element and / or the second conductive element, the heat exchange between the first conductive element and / or the second conductive element and the cooling medium can be increased by means of the turbulence device structure.
[0009] Further preferably, functional elements are arranged at the first conductive element and / or the second conductive element, wherein the power module unit is configured to conduct the heat generated at the functional element to the cooling structure and / or cooling medium via the fluid-sealed surface of the first conductive element and / or the second conductive element.
[0010] The advantage of this implementation is that it can improve the flexibility of power module unit configuration because by directly assembling functional components, such as chips and switches, the degree of freedom during production can be significantly increased.
[0011] Another aspect of the present invention relates to a method for manufacturing a power module unit as described above and below, comprising the following steps:
[0012] -Provide resin components,
[0013] - Arrange structural elements onto resin elements.
[0014] - Connecting resin elements to structural elements to form a substantially fluid-sealed surface between the resin elements and the structural elements.
[0015] The advantage of this implementation is that structural elements, such as copper-cut mesh, can be surrounded by resin elements, such as prepreg layers, so that they can be pressed subsequently. This allows for the construction of modular units using existing circuit board technology, thereby further reducing manufacturing costs.
[0016] A further preferred structural element has at least one tab, wherein the method further comprises the following steps:
[0017] - Remove the tabs from the structural elements to form the first and second conductive elements.
[0018] The advantage of this embodiment is that the structural elements can include multiple tabs for easier positioning; however, multiple tabs can hinder the formation of conductive elements. Therefore, it is preferable to remove the tabs so that the first conductive element and the second conductive element can be formed.
[0019] Preferably, the resin element comprises a first layer and a second layer, and the method further comprises the following steps:
[0020] - Arrange the structural elements between the first and second layers.
[0021] - Press structural elements, first layer and second layer.
[0022] The advantage of this implementation is that the combination of the first and second layers with structural elements can significantly improve automation capabilities, thereby reducing the manufacturing cost of the power module unit.
[0023] The preferred method comprises the following steps:
[0024] - Fill the cavity created by removing the patch.
[0025] - Repress the structural components, the first and second layers, and the filled cavities.
[0026] The advantage of this implementation is that it avoids possible cavities or similar objects, such as oxygen embeddings, and thereby increases the lifespan of the power module unit.
[0027] Further optimization of this method also includes the following steps:
[0028] - Exposing structural elements from resin elements to form surfaces for fluid sealing.
[0029] The advantage of this implementation is that it is easy to access by exposing the surfaces of the first and second conductive elements, so that functional elements can be arranged, for example, at the power module unit.
[0030] Further optimization of this method also includes the following steps:
[0031] - To place and / or apply the turbulence generator structure to structural elements.
[0032] The advantage of this implementation is that the turbulence generator structure can be adjusted individually according to the corresponding application scenario.
[0033] Further optimization of this method also includes the following steps:
[0034] - Apply functional elements to structural elements.
[0035] The advantage of this implementation is that, depending on the switching topology of the power module unit, individual switches and chips can be applied to the power module unit.
[0036] The method is further optimized by comprising the following steps:
[0037] - Provide a resin element having at least one recess.
[0038] - Arrange the structural elements in the recess.
[0039] - Press the structural elements and resin elements together into the recess.
[0040] The advantage of this implementation is that the structural element can be designed as a single conductor track and inserted into a recess in the resin element, thus providing positional accuracy even if the structural element has no tabs. For this purpose, the recess can be milled from the prepreg layer or the like, thereby creating space for the conductive element within the corresponding prepreg layer.
[0041] The preferred method also includes the following steps:
[0042] - Provides resin elements with multiple recesses.
[0043] - Arrange a portion of the structural element and / or the structural element in each of the multiple recesses.
[0044] - Press multiple structural elements into multiple recesses.
[0045] The advantage of this embodiment is that the structural element having tabs and multiple conductive elements can be inserted into multiple recesses, and the tabs can then be removed before pressing the structural element. Further preferably, multiple individual structural elements, which can be directly configured as conductive elements, can also be inserted into multiple recesses.
[0046] Further optimization of this method also includes the following steps:
[0047] - To form and / or apply additional metal cladding to resin elements and / or structural elements on a surface that is away from the fluid seal.
[0048] The advantage of this implementation is that, by using existing circuit board manufacturing techniques, additional PCB layers or the like can be applied to the power module unit. This allows for the creation of additional logic wiring or the like.
[0049] Another aspect of the invention relates to a vehicle having a power module unit as described above and below and / or an electronic unit manufactured by means of the methods described above and below. Attached Figure Description
[0050] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0051] Figures 1 to 9 A power module unit according to one embodiment is shown.
[0052] Figure 10A vehicle according to one embodiment is shown.
[0053] Figure 11 and 12 A flowchart illustrating the steps of a method according to one embodiment is shown. Detailed Implementation
[0054] Preferably, all identical elements, units, and / or steps are given the same reference numerals in all figures.
[0055] Figure 1 A power module unit 10 according to one embodiment is shown.
[0056] The power module unit 10 has a first conductive element 12 and a second conductive element 14. Furthermore, the first conductive element 12 is connected to the second conductive element 14 via a resin element 16, wherein the first conductive element 12, the second conductive element 14, and the resin element 16 are provided with a substantially fluid-sealed surface 18, wherein the resin element 16 is provided for electrically insulating the first conductive element 12 from the second conductive element 14, and wherein the first conductive element 12 and the second conductive element 14 are provided for discharging heat generated at the first conductive element 12 and / or the second conductive element 14 via the substantially fluid-sealed surface 18 to a cooling structure and / or a cooling medium.
[0057] like Figure 1 As can be seen, turbulence converter structures 20 are arranged at the first conductive element 12 and the second conductive element 14 to improve heat exchange between the first conductive element 12 and / or the second conductive element 14 and the cooling medium. Furthermore, functional elements 22 are arranged at the first conductive element 12 and the second conductive element 14, respectively. Figure 1 As can be clearly seen, the heat generated at functional element 22 can be conducted to the cooling medium via the first conductive element 12 and the turbulence structure 20. Preferably, this power module unit can be mounted on the bracket 204 by means of screws 206. Preferably, a sealing ring 208 can be arranged between the power module unit 10 and the housing 204 to hold the liquid cooling medium in place.
[0058] Figure 2 A power module unit 10 according to one embodiment is shown. Figure 2 This is a power module unit that has not yet been pressed, which includes a structural element 102 arranged to a resin element 16. The resin element 16 here has a first layer 106 and a second layer 108. Preferably, the structural element 102 may have a tab 104 between the first conductive element 12 and the second conductive element 14.
[0059] Figure 3A power module unit 10 according to one embodiment is shown. Figure 3 The diagram shows a power module unit 10 in a non-pressed state, wherein a connector 104 can connect a first conductive element 12 and a second conductive element 16 to each other. More preferably, a first layer 106 and a second layer 108 are arranged around a structural element 102.
[0060] Figure 4a A power module unit 10 according to one embodiment is shown. Preferably, the tab 104 is removed in the power module unit 10, thereby creating a cavity 110. The cavity 110 in the resin element 16 can be filled, etc.
[0061] Figure 4b A power module unit 10 according to one embodiment is shown. Figure 4b The power module unit 10 in the middle has Figure 4a The filled cavity 110 forms the first conductive element 12 and the second conductive element 14, which are connected by means of the resin element 16.
[0062] Figure 5 A power module unit 10 according to one embodiment is shown. The power module unit 10 here has exposed structural elements 102, thereby enabling contact with additional electrical components not only at the first conductive element 12 but also at the second conductive element 14.
[0063] Figure 6 A power module unit 10 according to one embodiment is shown. For example... Figure 6 As can be seen, the turbulence generator structure 20 is arranged at the first conductive element 12 and the second conductive element 14, respectively.
[0064] Figure 7 A power module unit 10 according to one embodiment is shown. In the power module unit 10, a functional element 22 and a turbulence structure 20 are respectively arranged at a first conductive element 12 and a second conductive element 14, such that heat generated at the functional element can be discharged by means of the turbulence structure 20.
[0065] Figure 8 A power module unit 10 according to one embodiment is shown. On a surface 114 facing away from the fluid surface 18, an additional metal cladding 112 is arranged on the resin element and / or structural element 102 and / or the first conductive element 12 and / or the second conductive element 14.
[0066] Figure 9A power module unit 10 according to one embodiment is shown. On the power module unit 10, an additional metal cladding 112 is applied to the first conductive element 12 and the second conductive element 14. The additional metal cladding 112 is specifically applied to the surface 114 facing away from the fluid-tight surface 18.
[0067] Figure 10 A vehicle 200 according to one embodiment is shown. The vehicle 200 preferably has a power module unit 10 as described above and below and / or an electronic unit manufactured by means of the methods described above and below.
[0068] Figure 11 A flowchart illustrating the steps of a method 100 according to one embodiment is shown. As described above and below, the method 100 for manufacturing a power module unit 10 preferably includes the following steps: providing a resin element 16 S1, arranging a structural element 102 S2 to the resin element 16, and forming the resin element 16 and the structural element 102 S3 to form a substantially fluid-tight surface 18 between the resin element 16 and the structural element 102.
[0069] Figure 12 A flowchart illustrating the steps of a method 100 according to one embodiment is shown. Method 100 herein has as already described... Figure 11The same steps S1 to S3 are described. A further preferred method 100 includes the step of removing the tab 104 from the structural element 102 for forming the first conductive element 12 and the second conductive element 14. A further preferred method 100 includes the step of arranging the structural element 102 between the first layer 106 and the second layer 108 and pressing the structural element 102, the first layer 106, and the second layer 108. A further preferred method 100 includes the step of filling the cavity 110 created by removing the tab 104, and re-pressing the structural element 102, the first layer 106, the second layer 108, and the filled cavity 110, S7. A further preferred method 100 includes the step of exposing the structural element 102 from the resin element 16 for forming a fluid-tight surface 18, S9. A further preferred method 100 includes the step of placing and / or applying the turbulence generator structure 20 onto the structural element 102, S10. The preferred method 100 further comprises the step of applying the functional element 22 to the structural element 102 on S11. A further preferred method 100 further comprises the steps of providing a resin element 16 having at least one recess on S12, arranging the structural element 102 in the recess on S13, and pressing the structural element 102 together with the resin element 16 in the recess on S14. The preferred method 100 further comprises the steps of providing a resin element 16 having a plurality of recesses on S15, arranging a portion of the structural element 102 and / or the structural element 102 in each of the plurality of recesses, and pressing the plurality of structural elements 102 into the plurality of recesses on S17. A further preferred method 100 further comprises the steps of forming an additional metal cladding 112 on a surface 114 facing away from the fluid seal surface 18 on S18 and / or applying it to the resin element 16 and / or the structural element 102.
Claims
1. A power module unit (10) having: -First conductive element (12), -Second conductive element (14), in, The first conductive element (12) is connected to the second conductive element (14) via a resin element (16), wherein the first conductive element (12), the second conductive element (14) and the resin element (16) are provided with a substantially fluid-sealed surface (18), wherein the resin element (16) is provided with electrical insulation between the first conductive element (12) and the second conductive element (14), wherein the first conductive element (12) and the second conductive element (14) are provided with a means to conduct heat generated at the first conductive element (12) and / or the second conductive element (14) to a cooling structure and / or a cooling medium via the substantially fluid-sealed surface (18).
2. The power module unit (10) according to claim 1, wherein, The first conductive element (12) and / or the second conductive element (14) have a turbulence generator structure (20), wherein the turbulence generator structure (20) is configured to increase the heat exchange between the first conductive element (12) and / or the second conductive element (14) and the cooling medium.
3. The power module unit (10) according to any one of the preceding claims, wherein, Functional element (22) is arranged at the first conductive element (12) and / or the second conductive element (14), wherein the power module unit (10) is configured to conduct the heat generated at the functional element (22) to the cooling structure and / or the cooling medium via the first conductive element (12) and / or the second conductive element (14) through the fluid-sealed surface (18).
4. A method (100) for manufacturing a power module unit (10) according to any one of claims 1 to 3, comprising the following steps: - Provides (S1) resin element (16), - Arrange the structural element (102) (S2) onto the resin element (16), - Connect the resin element (16) to the structural element (102) (S3) to form a substantially fluid-sealed surface (18) between the resin element (16) and the structural element (102).
5. The method (100) according to claim 4, wherein, The structural element (102) has at least one tab (104), wherein the method (100) further comprises the following steps: - Remove (S4) the tab (104) from the structural element (102) to form the first conductive element (12) and the second conductive element (14).
6. The method (100) according to any one of claims 4 to 5, wherein, The resin element (16) includes a first layer (106) and a second layer (108), wherein the method (100) further comprises the following steps: - The structural element (102) is arranged (S5) between the first layer (106) and the second layer (108). - Press (S6) the structural element (102), the first layer (106) and the second layer (108).
7. The method (100) according to any one of claims 5 and 6, wherein, The method (100) comprises the following steps: - Fill (S7) the cavity (110) created by removing (S4) the tab (104), - Press (S8) again the structural element (102), the first layer (106), the second layer (108) and the filled cavity (110).
8. The method (100) according to any one of claims 4 to 7 further comprises the following step: - The structural element (102) is exposed from the resin element (16) (S9) to form a surface (18) for fluid sealing.
9. The method (100) according to any one of claims 4 to 8 further comprises the following step: - The turbulence generator structure (20) is placed and / or applied (S10) onto the structural element (102).
10. The method (100) according to any one of claims 4 to 9 further comprises the following step: - Apply (S11) the functional element (22) to the structural element (102).
11. The method (100) according to any one of claims 4 to 5, wherein, The method (100) further includes the following steps: - Provide (S12) a resin element (16) having at least one recess, - The structural element (102) is arranged (S13) in the recess. - Press the structural element (102) together with the resin element (16) in the recess (S14).
12. The method (100) according to claim 11, further comprising the following step: - Provide (S15) a resin element (16) having multiple recesses, - In each of the plurality of recesses, a portion of the structural element (102) and / or the structural element (102) is arranged (S16). - Press (S17) multiple structural elements (102) into multiple recesses.
13. The method (100) according to any one of claims 4 to 12 further comprises the following step: - An additional metal cladding (112) is formed (S18) on the surface (114) opposite to the fluid seal surface (18) and / or applied to the resin element (16) and / or the structural element (102).
14. A vehicle (200) having a power module unit (10) according to any one of claims 1 to 3 and / or an electronic unit (202) manufactured by means of the method (100) according to any one of claims 4 to 13.