Component mounting substrate and method for manufacturing component mounting substrate

Abstract

The component mounting substrate includes an electronic component and a substrate to which the electronic component is soldered. The electronic component includes a chassis and a component body mounted on the chassis. The substrate is provided with a first through hole. The base is provided with a second through hole. The first through hole and the second through hole communicate with each other.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a component mounting substrate and a manufacturing method of a component mounting substrate. BACKGROUND

[0002] A technique has been conventionally proposed in which a through-hole is provided in a substrate in order to improve the reliability of melting of solder when an electronic component is soldered to the substrate. By this, if hot air is blown to the electronic component, the electronic component is efficiently heated. Since the electronic component is maintained at a high temperature, the solder in contact with the electronic component easily melts due to the heating.

[0003] PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: Japanese Patent Application Publication No. 2002-232130 SUMMARY

[0004] A component mounting substrate according to an embodiment of the present disclosure includes an electronic component and a substrate to which the electronic component is soldered. The electronic component includes a base and a component body placed on the base. The substrate includes a first through-hole. The base includes a second through-hole that communicates with the first through-hole.

[0005] A manufacturing method of a component mounting substrate according to an embodiment of the present disclosure includes a mounting step of mounting an electronic component on a substrate including a first through-hole by solder and a heating step of heating the substrate, the electronic component, and the solder. The electronic component includes a base including a second through-hole and a component body placed on the base. In the heating step, hot air is blown to the component body of the electronic component through the first through-hole and the second through-hole that communicate with each other.

[0006] According to the present disclosure, it is possible to provide a component mounting substrate in which an electronic component including a base is soldered to a substrate with high reliability. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a partial cross-sectional view of a main part of a component mounting substrate according to an embodiment.

[0008] Figure 2 is a view of a main part of a component mounting substrate according to an embodiment, as viewed from a substrate side.

[0009] Figure 3 is a graph showing a temperature change of a terminal in a heating step in a manufacturing method of a component mounting substrate according to an embodiment.

[0010] Figure 4 is a partial cross-sectional view of a main part of a component mounting substrate according to a modification of an embodiment. DETAILED DESCRIPTION

[0011] In the above-described prior art, in the case where the electronic component is of a type including a pedestal, it is difficult to improve the reliability of the melting of the solder. The reason for this is that, in the case where the electronic component includes a pedestal, since the pedestal intervenes between a component of large heat capacity that is housed in the electronic component and the surface of the electronic component to which hot air is blown, it is difficult to efficiently heat the component in the electronic component, and it is difficult to raise the temperature of the solder to the melting temperature.

[0012] The present disclosure provides a component mounting substrate on which an electronic component including a pedestal is soldered with high reliability.

[0013] Hereinafter, a component mounting substrate of the present disclosure will be described with reference to the drawings. The drawings referred to in the following embodiments are all schematic drawings. Therefore, the proportions of the sizes, thicknesses, and the like of the respective constituent elements in the drawings do not necessarily reflect actual size ratios. In addition, the materials, numerical values, and the like described in the embodiments are merely examples of preferred examples, and are not limited thereto.

[0014] 1. Embodiment (1) Outline of Component Mounting Substrate As shown in Figs. 1 and 2, the component mounting substrate 9 of the present embodiment is provided with a substrate 1, an electronic component 2 mounted to the substrate 1, and a solder 8 that joins the substrate 1 and the electronic component 2. Figure 1 Figure 2

[0015] In the following description, the direction from the substrate 1 to the electronic component 2 will be referred to as the first direction D1, and the direction from the electronic component 2 to the substrate 1 will be referred to as the second direction D2.

[0016] (2) Substrate The substrate 1 is a printed substrate for component mounting. A portion of the substrate 1 in which the electronic component 2 is mounted is provided with a plurality of pads 13. The plurality of pads 13 are each provided so as to be exposed in the first direction D1.

[0017] The portion of the substrate 1 in which the electronic component 2 is mounted is also provided with a first through-hole 10 for ventilation. The first through-hole 10 penetrates the substrate 1 in the thickness direction thereof. The first through-hole 10 is open in the first direction D1 and is open in the second direction D2.

[0018] The substrate 1 is provided with a first face 1A and a second face 1B that face opposite sides of each other. The first face 1A includes the plurality of pads 13. The first face 1A is the face of the substrate 1 in the first direction D1, and the second face 1B is the face of the substrate 1 in the second direction D2. The direction in which the first face 1A and the second face 1B are aligned is the thickness direction of the substrate 1.

[0019] ​​The opening of the first through-hole 10 is located on the first surface 1A of the substrate 1. A plurality of pads 13 is located on a portion surrounding the opening edge of the first through-hole 10.

[0020] (3) Electronic component The electronic component 2 includes a base 3, a component main body 4 placed on the base 3, and a terminal 5 drawn from the component main body 4. In the present embodiment, a pair of terminals 5 is drawn from the component main body 4. The pair of terminals 5 is a first terminal 51 and a second terminal 52.

[0021] In the present embodiment, the electronic component 2 is a choke coil 21. The choke coil 21 is a component having a large heat capacity compared to a general electronic component. The component main body 4 constituting the main body of the choke coil 21 includes a housing 42 constituting an outer shell of the component main body 4, and a coil 45 housed in the housing 42.

[0022] The housing 42 is made of a material containing metal, and has high thermal conductivity. The material of the housing 42 is, for example, a material of the Mn-Zn system. The coil 45 has a large heat capacity. In particular, the coil 45 is not a coil wound by a twisted wire, but a coil wound in a spiral shape by an elongated plate-like wire, and thus has a large heat capacity. An example of the wire width of the coil 45 is 3.2 mm, and an example of the number of turns of the coil 45 is 4.5.

[0023] The coil 45 wound in a spiral shape is covered with an insulating cover film. A pair of end portions 451, 452 of the coil 45 drawn from the component main body 4 is not covered with the insulating cover film. One end portion 451 of the pair of end portions 451, 452 constitutes the first terminal 51 drawn from the component main body 4, and the other end portion 452 of the pair of end portions 451, 452 constitutes the second terminal 52 drawn from the component main body 4.

[0024] In the present embodiment, the base 3 is made of an insulator such as synthetic resin. The base 3 has insulating properties, and has low thermal conductivity. The base 3 can also have heat insulating properties. An example of the synthetic resin constituting the base 3 is phenol resin.

[0025] The base 3 includes a second through-hole 30 for ventilation. The second through-hole 30 penetrates the base 3 in the thickness direction thereof. The second through-hole 30 is open in the first direction D1 and in the second direction D2. The base 3 includes a first surface 3A and a second surface 3B facing opposite sides of each other. The first surface 3A is a surface of the base 3 in the first direction D1, and the second surface 3B is a surface of the base 3 in the second direction D2. The direction in which the first surface 3A and the second surface 3B are aligned is the thickness direction of the base 3. In a state in which the electronic component 2 is mounted to the substrate 1 (hereinafter, referred to as "mounting state"), the thickness direction of the base 3 included in the electronic component 2 coincides with the thickness direction of the substrate 1.

[0026] The first terminal 51 extending from the main body 4 has an end portion 451 extending toward the second through hole 30 of the base 3. The second terminal 52 extending from the main body 4 has an end portion 452 extending toward the second through hole 30 of the base 3.

[0027] (4) Solder Solder 8 is a paste-like solder that melts upon heating. The melting point of solder 8 is, for example, 220 degrees Celsius. A plurality of solders 8 are provided on the substrate 1. A first solder 81, included in the plurality of solders 8, solidifies after melting upon heating, thereby mechanically and electrically connecting the first terminal 51 of the electronic component 2 relative to the substrate 1. A second solder 82, included in the plurality of solders 8, solidifies after melting upon heating, thereby mechanically and electrically connecting the second terminal 52 of the electronic component 2 relative to the substrate 1.

[0028] In detail, the first solder 81 is applied in such a way that it is in contact with the first pad 131, which is one of the plurality of pads 13 provided on the substrate 1, and the first terminal 51 of the electronic component 2. The first terminal 51 of the electronic component 2 is mechanically and electrically connected to the first pad 131 via the first solder 81.

[0029] Similarly, the second solder 82 is applied in a manner that connects to the second pad 132, which is included in the plurality of pads 13 disposed on the substrate 1, and to the second terminal 52 of the electronic component 2. The second terminal 52 of the electronic component 2 is mechanically and electrically connected to the second pad 132 via the second solder 82.

[0030] (5) Installation status like Figure 1 In the shown installation state, the ends 451 of the first terminal 51 and 452 of the second terminal 52 of the electronic component 2 are respectively located between the base 3 and the substrate 1. Furthermore, in the installation state, it is acceptable for at least a portion of the first terminal 51 to be located between the base 3 and the substrate 1, or for the entire first terminal 51 to be located between the base 3 and the substrate 1. Similarly, in the installation state, it is acceptable for at least a portion of the second terminal 52 to be located between the base 3 and the substrate 1, or for the entire second terminal 52 to be located between the base 3 and the substrate 1.

[0031] In the installed state, the first through hole 10 of the substrate 1 and the second through hole 30 of the base 3 are connected in a straight line. The main body 4 of the component placed on the base 3 can be exposed through the first through hole 10 of the substrate 1 and the second through hole 30 of the base 3.

[0032] like Figure 2As shown, in this embodiment, when the component mounting substrate 9 is viewed in the first direction D1 (in other words, when viewed from the substrate 1 toward the electronic component 2), the second through hole 30 of the base 3 is located inside the first through hole 10 of the substrate 1. In other words, when the component mounting substrate 9 is viewed in the first direction D1, the entire opening edge of the second through hole 30 of the base 3 is located inside the opening edge of the first through hole 10 of the substrate 1.

[0033] The opening of the first through hole 10 on the substrate 1 is larger than the opening of the second through hole 30 on the base 3. The opening area of ​​the first through hole 10 on the substrate 1 is larger than the opening area of ​​the second through hole 30 on the base 3. Furthermore, when viewing the component mounting substrate 9 in the first direction D1, the opening of the first through hole 10 on the substrate 1 and the opening of the second through hole 30 on the base 3 can also coincide. That is, the opening edge of the second through hole 30 on the base 3 and the opening edge of the first through hole 10 on the substrate 1 can also coincide. In this case, the opening area of ​​the first through hole 10 on the substrate 1 and the opening area of ​​the second through hole 30 on the base 3 are equal.

[0034] In the installed state, the central axis of the first through hole 10 of the substrate 1 and the central axis of the second through hole 30 of the base 3 preferably coincide with each other. The central axis of the first through hole 10 of the substrate 1 is preferably close to the center of the core 48 of the component body 4. Similarly, the central axis of the second through hole 30 of the base 3 is preferably close to the center of the core 48 of the component body 4.

[0035] The dimensional relationships of the component mounting base plate 9 in the installed state are as follows.

[0036] The height H2 of electronic component 2 in its installed state is 15.7 mm. The height H2 of electronic component 2 is the sum of the height H3 of base 3 and the height H4 of component body 4. The height H3 of base 3 is 1.0 mm. The height H4 of component body 4 is 14.7 mm. The thickness T1 of substrate 1 is 1.6 mm.

[0037] The distance between the second surface 1B of the substrate 1 and the main body 4 is equal to T1 + H3. That is, the distance between the second surface 1B of the substrate 1 and the main body 4 is 2.6 mm. The total axial length of the first through hole 10 and the second through hole 30 connected on a line is equal to T1 + H3. That is, the total axial length of the first through hole 10 and the second through hole 30 is 2.6 mm.

[0038] The distance between the first surface 1A of the substrate 1 and the main body 4 is equal to H3. That is, the distance between the first surface 1A of the substrate 1 and the main body 4 is 1.0 mm. The axial length of the second through hole 30 is equal to H3. That is, the axial length of the second through hole 30 is 1.0 mm.

[0039] (6) Manufacturing method of component mounting substrate The manufacturing method of the component mounting substrate 9 in this embodiment includes an mounting process and a heating process.

[0040] In the mounting process, electronic component 2 is mounted onto substrate 1 having a first through hole 10 via solder 8. Specifically, first solder 81 is applied to a first pad 131 on substrate 1, and second solder 82 is applied to a second pad 132 on substrate 1, mounting electronic component 2 in contact with both solder 81 and solder 82. At this time, first solder 81 contacts a first terminal 51 of electronic component 2, and second solder 82 contacts a second terminal 52 of electronic component 2. The end 451 of the first terminal 51 is located between the base 3 and the first pad 131. The end 452 of the second terminal 52 is located between the base 3 and the second pad 132.

[0041] In the heating process, hot air is blown onto the substrate 1, electronic component 2, and solder 8 in the reflow oven to heat the substrate 1, electronic component 2, and solder 8 together. More specifically, as follows... Figure 1 As indicated by the hollow arrow, hot air in the first direction D1 and the second direction D2 is blown onto the substrate 1, the electronic component 2, and the solder 8. In this embodiment, the component body 4 of the electronic component 2 is directly blown by the hot air in the first direction D1 and the hot air in the second direction D2 together.

[0042] In other words, in this embodiment, in addition to the hot air in the second direction D2 being directly blown onto the surface of the housing 42 of the component body 4, the hot air in the first direction D1 is also directly blown onto the surface of the housing 42 of the component body 4 through the first through hole 10 of the substrate 1 and the second through hole 30 of the base 3 (in other words, the bottom surface of the component body 4). The coil 45 housed in the component body 4 is a part with a large heat capacity, but because the component body 4 is heated from both sides, the coil 45 heats up rapidly.

[0043] The first terminal 51 and the second terminal 52, extending from the component body 4, are blown by hot air in the second direction D2 and are also conducted heat from the substrate 1, thereby rapidly heating up. Here, as described above in this embodiment, the coil 45 within the component body 4 heats up rapidly, thus suppressing heat escape from the first terminal 51 and the second terminal 52 towards the coil 45 side. As a result, the first solder 81, which contacts the first terminal 51 and the substrate 1, and the second solder 82, which contacts the second terminal 52 and the substrate 1, melt through heating.

[0044] (7) Effects In the component mounting substrate 9 of this embodiment, the electronic component 2, which includes a base 3 with low thermal conductivity, is soldered to the substrate 1 with high reliability. Figure 3This is a graph showing the temperature change of terminal 5 during the heating process in the manufacturing method of component mounting substrate 9. Figure 3 Curve C1 in the diagram represents the temperature change of terminal 51, and curve C2 represents the temperature change of terminal 52. For example... Figure 3 As shown, it was confirmed that during the heating process of this embodiment, the temperature of terminal 5 rapidly rises through reflow heating, exceeding 220 degrees Celsius, which is the melting point (liquid phase temperature) of solder 8. Specifically, the peak temperature of the first terminal 51 is approximately 228 degrees Celsius, and the peak temperature of the second terminal 52 is approximately 232 degrees Celsius. In other words, the temperature of terminal 5 is above the liquid phase temperature at which solder 8 becomes completely liquid, thus the temperature of solder 8 easily reaches above the liquid phase temperature. Therefore, terminal 5 is soldered to substrate 1 with high reliability. Furthermore, in this temperature measurement, the opening size of the first through-hole 10 of substrate 1 is set to 12.5 mm × 20.0 mm, and the opening size of the second through-hole 30 of base 3 is set to 12.0 × 14.4 mm. That is, the opening area of ​​the first through-hole 10 of substrate 1 is 250 mm². 2 The opening area of ​​the second through hole 30 in the base 3 is 172.8 mm². 2 Furthermore, the opening area of ​​the first through hole 10 on the substrate 1 and the opening area of ​​the second through hole 30 on the base 3 are set to 25 mm. 2 Above and 1000mm 2 the following.

[0045] On the other hand, since the base 3 does not have the second through hole, the hot air in the second direction D2 cannot be blown onto the component body 4, so the heat from the first terminal 51 and the second terminal 52 easily escapes to the coil 45 side. Therefore, the temperature of the first terminal 51 and the second terminal 52 is difficult to rise to the liquidus temperature of the solder 8.

[0046] In summary, according to this embodiment, it is possible to provide a component mounting substrate 9 that includes a base 3 with low thermal conductivity and electronic components 2 that are soldered to the substrate 1 with high reliability.

[0047] 2. Variations The above-described embodiments are merely one of the various embodiments of this disclosure. As long as the objectives of this disclosure can be achieved, the above-described embodiments can be modified in various ways, such as the variations listed below, depending on the design. In the following descriptions of the variations, the same reference numerals are used for configurations identical to those in the above-described embodiments, and detailed descriptions are omitted.

[0048] exist Figure 4In the modified example shown, the substrate 1 is composed of a multilayer substrate including an outer layer 11 and an inner layer 12. The outer layer 11 and the inner layer 12 are each composed of copper foil. The substrate 1 includes two outer layers 11 that are formed on opposite sides of each other in the thickness direction of the substrate 1, at least one inner layer 12 disposed between the two outer layers 11, and a plurality of insulating layers 14 disposed between the two outer layers 11.

[0049] The outer layer 11 and the inner layer 12 are both conductive layers and thermally conductive layers. The thickness of the outer layer 11 is preferably in the range of 35 μm to 100 μm, and in this example it is 35 μm. The thickness of the inner layer 12 is preferably in the range of 35 μm to 100 μm, and in this example it is 35 μm.

[0050] In this modified example, the substrate 1 has two inner layers 12 and three insulating layers 14. The inner layers 12 and insulating layers 14 are alternately arranged between the two outer layers 11. One of the two outer layers 11 includes a pad 13.

[0051] The substrate 1 also includes a plurality of through holes 15 extending through the substrate 1 in the thickness direction. The plurality of through holes 15 are located in the portion surrounding the opening edge of the first through hole 10 for ventilation. Each of the plurality of through holes 15 has an opening significantly smaller than that of the first through hole 10.

[0052] Each of the plurality of through holes 15 is configured to penetrate two outer layers 11 and at least one inner layer 12 disposed between the two outer layers 11. In this modified example, each of the plurality of through holes 15 penetrates two outer layers 11 and two inner layers 12. A metal layer 152 is provided on the inner peripheral surface of each through hole 15. The metal layer 152 is a conductive layer and a thermally conductive layer. The metal layer 152 is, for example, made of copper plating. The metal layer 152 is electrically connected to each outer layer 11 and each inner layer 12 and is thermally connected. The two outer layers 11 and the two inner layers 12 are electrically connected and thermally connected through the metal layer 152 of each through hole 15.

[0053] Multiple through holes 15 are distributed at intervals in a direction orthogonal to the thickness direction of the substrate 1. The multiple through holes 15 are parallel to each other. In addition, the multiple through holes 15 are not used for through-hole mounting, and no pins of electronic components are inserted into any of the through holes 15.

[0054] exist Figure 4 In the modified example shown, heat applied to the outer layer 11 of the substrate 1 by hot air blowing is conducted to each inner layer 12 through multiple through-holes 15. In this modified example, heat applied to the substrate 1 by hot air in the first direction D1 and hot air in the second direction D2 is accumulated in the two outer layers 11 and two inner layers 12 of the substrate 1. Therefore, according to this modified example, the solder 8 melts more easily by heating in the reflow oven. In addition, it is not necessary for the substrate 1 to be composed of the above-mentioned multilayer substrate.

[0055] In this embodiment, the first through hole 10 of the substrate 1 and the second through hole 30 of the base 3 are both rectangular in shape, but the shapes of the first through hole 10 and the second through hole 30 are not limited to this. The first through hole 10 may also have other shapes such as circular, elliptical, or polygonal, and the second through hole 30 may also have other shapes such as circular, elliptical, or polygonal.

[0056] In this embodiment, when the component mounting substrate 9 is viewed in the first direction D1, the opening edge of the second through hole 30 of the base 3 is located inside the opening edge of the first through hole 10 of the substrate 1, but this positional relationship is not mandatory. The opening edge of the second through hole 30 of the base 3 may coincide with the opening edge of the first through hole 10 of the substrate 1, or a portion of the opening edge of the second through hole 30 of the base 3 may be located inside the opening edge of the first through hole 10 of the substrate 1, while another portion may be located outside the opening edge of the first through hole 10 of the substrate 1. Alternatively, the entire opening edge of the second through hole 30 of the base 3 may be located outside the opening edge of the first through hole 10 of the substrate 1. The opening of the second through hole 30 of the base 3 may also be larger than the opening of the first through hole 10 of the substrate 1.

[0057] In this embodiment, the electronic component 2 is provided as a single component including the component body 4 and the base 3, but it is not limited to this. For example, the component body 4 and the base 3, which are provided as different components, can be combined to form the electronic component 2 of this disclosure.

[0058] 3. Summary The component mounting substrate (9) of the first type includes an electronic component (2) and a substrate (1) to which the electronic component (2) is soldered. The electronic component (2) includes a base (3) and a component body (4) placed on the base (3). The substrate (1) includes a first through hole (10). The base (3) includes a second through hole (30) communicating with the first through hole (10).

[0059] According to this method, when hot air is blown onto the substrate (1) to solder the electronic component (2) including the base (3) onto the substrate (1), the components inside the electronic component (2) can be heated efficiently through the first through hole (10) of the substrate (1) and the second through hole (30) of the base (3). Therefore, the electronic component (2) including the base (3) can be soldered onto the substrate (1) with high reliability.

[0060] In the component mounting substrate (9) of the second type, in the first type, the electronic component (2) is a choke coil (21). The coil (45) is housed in the component body (4).

[0061] According to this method, when hot air is blown onto the substrate (1) to weld the choke coil (21) containing the base (3) and the coil (45) onto the substrate (1), the coil (45) with a large heat capacity stored in the choke coil (21) can be heated efficiently through the first through hole (10) of the substrate (1) and the second through hole (30) of the base (3). Therefore, the choke coil (21) can be welded onto the substrate (1) with high reliability.

[0062] In the component mounting substrate (9) of the third embodiment, in the first embodiment, the electronic component (2) also has a terminal (5) extending from the component body (4). At least a portion of the terminal (5) is located between the base (3) and the substrate (1).

[0063] According to this method, the terminal (5) can be connected to the substrate (1), and the base (3) is positioned between the terminal (5) and the component body (4) to prevent the terminal (5) from contacting the component body (4).

[0064] In the component mounting substrate (9) of the fourth embodiment, in the second embodiment, the electronic component (2) further includes a terminal (5) extending from the component body (4). The terminal (5) is the end (451, 452) of a coil (45) extending from the component body (4). At least a portion of the terminal (5) is located between the base (3) and the substrate (1).

[0065] According to this method, the ends (451, 452) of the coil (45) can be connected to the substrate (1), and the base (3) is positioned between the ends (451, 452) of the coil (45) and the component body (4), so as to prevent the ends (451, 452) of the coil (45) from contacting the component body (4).

[0066] In the component mounting substrate (9) of the fifth type, in any of the first to fourth types, the electronic component (2) is a surface mount component.

[0067] According to this method, electronic components (2), which are surface-mount components including a base (3), can be soldered onto a substrate (1) with high reliability.

[0068] In the component mounting substrate (9) of the sixth type, in any of the first to fifth types, the opening area of ​​the first through hole (10) is larger than the opening area of ​​the second through hole (30).

[0069] According to this method, hot air can be efficiently blown to the component body (4) through the first through hole (10) and the second through hole (30).

[0070] In the component mounting substrate (9) of the seventh type, in any of the first to sixth types, when viewed from the substrate (1) toward the electronic component (2), the second through hole (30) is located inside the first through hole (10).

[0071] According to this method, hot air can be efficiently blown to the component body (4) through the first through hole (10) and the second through hole (30).

[0072] In the component mounting substrate (9) of the eighth embodiment, in any of the first to seventh embodiments, the substrate (1) is a multilayer substrate including an outer layer (11) and an inner layer (12), and has a through hole (15) penetrating the outer layer (11) and the inner layer (12).

[0073] According to this method, the heat applied to the substrate (1) by blowing hot air is conducted to the outer layer (11) and the inner layer (12) through the through hole (15), and the heat is stored in the outer layer (11) and the inner layer (12), so the solder (8) is easier to melt.

[0074] The manufacturing method of the component mounting substrate (9) of the ninth method includes: a mounting step in which an electronic component (2) is mounted on a substrate (1) having a first through hole (10) by solder (8); and a heating step in which the substrate (1), the electronic component (2) and the solder (8) are heated. The electronic component (2) includes a base (3) having a second through hole (30) and a component body (4) placed on the base (3). In the heating step, hot air is blown into the component body (4) of the electronic component (2) through the interconnected first through hole (10) and second through hole (30).

[0075] According to this method, during the heating process, the components inside the electronic component (2) can be heated efficiently through the first through hole (10) of the substrate (1) and the second through hole (30) of the base (3), so that the electronic component including the base (3) can be soldered to the substrate with high reliability.

[0076] Marker description 1 substrate 10 First through hole 11 Outer layer 12 Inner Layer 15 Through Holes 2 Electronic components 21 Choke coil 3 bases 30 Second through hole 4. Main body of the component 45 coil 451 end 452 end 5 terminals 8 Solder 9-Component Mounting Baseboard

Claims

1. A component mounting substrate, comprising: Electronic components; and The electronic components are soldered to the substrate. The electronic component includes a base and a component body mounted on the base. The substrate has a first through hole. The base has a second through hole that communicates with the first through hole.

2. The component mounting substrate as described in claim 1, The electronic component is a choke coil. A coil is housed within the main body of the component.

3. The component mounting substrate as described in claim 1, The electronic component also includes terminals extending from the component body. At least a portion of the terminal is located between the base and the substrate.

4. The component mounting substrate as described in claim 2, The electronic component also includes terminals extending from the component body. The terminal is the end of the coil that extends from the main body of the component. At least a portion of the terminal is located between the base and the substrate.

5. The component mounting substrate as described in claim 1 or 2, The electronic component is a surface mount component.

6. The component mounting substrate as described in claim 1 or 2, The opening area of ​​the first through hole is larger than the opening area of ​​the second through hole.

7. The component mounting substrate as described in claim 1 or 2, When viewed from the substrate toward the electronic component, the second through hole is located inside the first through hole.

8. The component mounting substrate as described in claim 1 or 2, The substrate is a multilayer substrate comprising an outer layer and an inner layer, and has through holes penetrating the outer layer and the inner layer.

9. A method for manufacturing a component mounting substrate, comprising: In the installation process, electronic components are installed on a substrate with the first through hole using solder. as well as The heating process involves heating the substrate, the electronic components, and the solder. The electronic components include: A base having a second through hole, and a main body of a component placed on the base; In the heating process, hot air is blown into the main body of the electronic component through the interconnected first through hole and the second through hole.

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