A building embedded part state monitoring method based on magnetic induction communication

Abstract

The application discloses a kind of based on magnetic induction communication's building embedded part state monitoring method, the present application relates to building embedded part monitoring technical field, solve the problem of modern construction engineering to the safety monitoring of embedded part full life cycle insufficient, the present application is for large building, important structure embedded part and so on high demand scene of monitoring dimension, the multi-axis monitoring of three groups of chips can be directly positioned displacement point through the cross checking of distance and included angle, meet the demand of all-dimensional monitoring;For small component, space limited or cost control scene, single-chip realizes angle test through automatic rotating mechanism, without additional hardware, only through algorithm optimization can complete displacement identification, both reduce hardware deployment cost, and widen the scope of application of method, can flexibly adapt to the embedded part monitoring demand of different types of buildings such as residential, bridge, high-rise building.

Description

Technical Field

[0001] This invention relates to the field of building embedded parts monitoring technology, specifically a method for monitoring the status of building embedded parts based on magnetic induction communication. Background Technology

[0002] As key components connecting main structural members and ancillary facilities (such as pipelines, curtain walls, and equipment foundations), embedded parts in buildings directly determine the overall structural safety and functional reliability of a building through their installation accuracy and long-term stability. During construction and long-term operation and maintenance, embedded parts are susceptible to factors such as foundation settlement, temperature stress, vibration loads, and concrete shrinkage and creep, resulting in minor displacements or shifts. If such displacements are not detected and addressed in a timely manner, their long-term accumulation may lead to loosening of the connection between the embedded parts and the main structure, imbalance of force transmission, and consequently, safety hazards such as the detachment of ancillary facilities and localized cracking of the structure. In severe cases, this can even threaten the overall stability of the building. Therefore, real-time and accurate monitoring of the displacement status of embedded parts is of significant engineering importance.

[0003] Traditional methods for monitoring embedded parts in buildings mainly rely on two technical approaches: manual inspection and single-sensor monitoring. However, both have significant limitations.

[0004] Firstly, manual inspections rely on staff to conduct periodic checks using rulers, visual inspection, or simple instruments (such as dial indicators). This not only consumes a lot of manpower but is also limited by the "periodic" nature of monitoring, making it difficult to capture the instantaneous or minute cumulative displacement of embedded parts, which can easily lead to delays in the discovery of hidden dangers. At the same time, the subjectivity of manual operation and environmental interference (such as narrow interior space and insufficient lighting in buildings) can also cause fluctuations in the accuracy of monitoring data, making it impossible to meet the needs of high-precision monitoring.

[0005] Secondly, existing single-sensor monitoring technologies mostly use strain gauges, accelerometers, or ordinary electromagnetic sensors. Strain gauges can only monitor stress changes in embedded parts and cannot directly correlate with displacement. Accelerometers need to obtain displacement data through integration calculations, which can easily lead to deviations in results due to accumulated errors. Although ordinary electromagnetic sensors can indirectly reflect displacement through changes in magnetic fields, they do not consider the coupling relationship between "distance-angle-voltage" and judge the displacement state based on a single distance or voltage parameter. This makes them susceptible to environmental electromagnetic interference or installation angle deviations, resulting in fuzzy displacement point positioning. Especially in complex building scenarios, it is difficult to achieve accurate displacement identification in three-dimensional space.

[0006] In summary, the current field of building embedded parts monitoring urgently needs a technical solution that can balance monitoring accuracy, scenario adaptability, ease of operation, and timely early warning, in order to solve the problems of strong reliance on manual labor, insufficient accuracy, poor scenario adaptability, and delayed detection of hidden dangers in traditional methods, and meet the needs of modern building engineering for full life cycle safety monitoring of embedded parts. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a method for monitoring the status of embedded building components based on magnetic induction communication, which solves the problem of insufficient safety monitoring of embedded components throughout their entire life cycle in modern building engineering.

[0008] To achieve the above objectives, the present invention provides a method for monitoring the status of embedded building components based on magnetic induction communication, comprising the following steps:

[0009] Step 1: Based on the experimental data generated between the Hall chip and the magnet, confirm the different magnetic field strengths associated with different magnet distances, and confirm the different monitoring voltages associated with different magnetic field strengths. Based on the confirmation results, generate the evaluation criteria associated with the experimental data. The specific method is as follows:

[0010] The magnet is controlled to move in a preset displacement direction, and the distance between the magnet and the Hall chip is confirmed. The monitoring voltage associated with the corresponding magnet distance is confirmed, and the monitoring voltage associated with the same magnet distance at different angles is confirmed. The monitoring voltage range associated with the corresponding magnet distance is generated.

[0011] The magnets are sorted from smallest to largest distance, and the associated monitoring voltage ranges are sorted synchronously. A two-dimensional coordinate system is established with the magnet distance as the horizontal axis and the monitoring voltage as the vertical axis. The different monitoring voltage ranges associated with different magnet distances are marked in the two-dimensional coordinate system to generate evaluation criteria.

[0012] Step 2: Verify and compare the real-time monitored voltage with the preset voltage. Based on the comparison process, identify whether there are any displacement anomalies in the building's embedded parts, and generate a displacement anomaly signal based on the identification results. The specific method is as follows:

[0013] The real-time monitoring voltage is calibrated to V. i Where i represents the corresponding time, and the monitored voltage V i The voltage is compared and verified with the preset voltage Vb. If |V i If -Vb|≥Y1, then a displacement anomaly signal is directly generated; if |V i If -Vb| < Y1, then continuous monitoring will continue, where Y1 is a preset value;

[0014] Step 3: Based on the generated displacement anomaly signal, identify the number of Hall chip sensors in the building embedded part scene. If there are three, confirm the displacement point according to the voltage characteristics of the three sets of Hall chip sensors and the evaluation criteria. If there is only one, control the Hall chip sensor to rotate, confirm the monitoring voltage change characteristics generated during the rotation, compare the confirmed monitoring voltage change characteristics with the evaluation criteria, confirm the displacement point, and generate a displacement vector based on the displacement point for display.

[0015] In step three:

[0016] When the number of Hall effect chip sensors is three:

[0017] Randomly select a group of Hall effect chip sensors as the main sensors, and confirm the monitoring voltage V associated with the main sensors at the current moment. i Confirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances, and the different magnet distances each have different marked included angles, are sorted in ascending order of value to confirm the magnet distance sequence;

[0018] Starting from the first magnet distance in the confirmed magnet distance sequence, based on the angle associated with the corresponding magnet distance, the circle containing the magnet is identified. Magnet position points are then selected sequentially from this circle. Based on the position points of the other two sets of Hall effect sensor chips, the associated distances L1 and L2 between the magnet position points and their respective position points are confirmed. Simultaneously, the angles associated with these associated distances are confirmed. The monitoring voltages associated with these distances L1 and L2 are then confirmed within the evaluation criteria. Finally, it is determined whether the confirmed monitoring voltages match the voltage values ​​monitored by the corresponding Hall effect sensor chips.

[0019] If there is a discrepancy, continue to select other magnet positions in the circle to confirm. If the displacement point cannot be confirmed in the circle associated with the distance of the first magnet, start from the distance of the second magnet and use the same confirmation method as the distance of the first magnet to confirm the displacement point. Continue to confirm the displacement point in this way until the displacement point is confirmed.

[0020] If they match, the selected magnet position point is directly recorded as the displacement point.

[0021] In step three:

[0022] When the number of Hall chip sensors is one:

[0023] Based on the monitoring voltage V associated with the Hall chip sensor at the current moment iConfirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances are then sorted in ascending order of value to confirm the magnet distance sequence.

[0024] The Hall chip sensor is controlled to perform an angle test. The offset angle associated with the offset process is a preset angle. The offset process is completed, and the voltage change data associated with the offset process is monitored. The starting point of the original angle test process is used as the initial point to generate the voltage change data curve associated with the rotation test process.

[0025] Confirm the included angle A1 associated with the distance of the first magnet in the magnet distance sequence, and use (A1 + rotation angle) = A2 to confirm the change angle A2. Identify the voltage between the included angle A1 and A2 of the distance of the first magnet and generate its voltage standard curve. Compare the voltage change data curve with the voltage standard curve, place the two sets of curves in the same two-dimensional coordinate system, and calibrate the initial points of the two sets of curves to coincide. Confirm the voltage difference between corresponding points on different curves at the same vertical position. The voltage difference is ≥0. Perform variance processing on the confirmed voltage difference values ​​to confirm the calibration variance. Use the confirmed calibration variance as the calibration feature associated with this magnet distance.

[0026] Then, using the same method, the calibration features associated with other magnet distances are confirmed in sequence, and the minimum value is selected from the different confirmed calibration features. The magnet distance associated with the minimum value is taken as the determined distance, and the displacement point is confirmed based on the included angle associated with the determined distance.

[0027] It also includes: generating the displacement vector associated with the building embedded parts based on the initial position points set by the building embedded parts and the confirmed displacement points.

[0028] This invention provides a method for monitoring the status of embedded building components based on magnetic induction communication. Compared with existing technologies, it has the following advantages:

[0029] This invention generates a three-dimensional evaluation standard including "distance-angle-voltage range" by controlling the movement of a magnet along a preset direction and its arc-shaped motion centered on the chip, providing a precise data benchmark for subsequent monitoring. In the real-time displacement confirmation stage, for the three chip scenarios, invalid points are eliminated layer by layer by locking the distance sequence with the main sensor and verifying the distance and angle matching degree with the secondary sensor, ensuring that the displacement point is located without deviation. For the single chip scenario, a voltage change curve is generated by testing the deflection angle within a 3° range, and the variance is compared with the standard curve. The distance and displacement point are locked and determined by the logic of "the minimum variance corresponds to the highest similarity", avoiding misjudgment caused by single-dimensional monitoring. Finally, it achieves millimeter-level accurate identification of the displacement of embedded parts, which is significantly better than the traditional monitoring method that relies on manual inspection or a single sensor.

[0030] For scenarios with high requirements for monitoring dimensions, such as large buildings and important structural embedded parts, the multi-axis monitoring of three chips can directly and quickly locate displacement points through cross-verification of distance and angle, meeting the needs of all-round monitoring. For small components, space-constrained scenarios, or cost-control scenarios, a single chip can achieve deflection angle testing through an automatic rotation mechanism. No additional hardware is required, and displacement identification can be completed only through algorithm optimization. This reduces hardware deployment costs and broadens the scope of application of the method, which can flexibly adapt to the monitoring needs of embedded parts of different types of buildings such as residential buildings, bridges, and high-rise buildings.

[0031] The entire method is designed with both logic and practicality in mind. From the generation of evaluation criteria to the identification of displacement anomalies and the confirmation of displacement points, each step has clear operational guidelines and data processing rules, eliminating the need to rely on the subjective experience of professional technicians. In the initial experimental phase, the standard can be established simply by following the steps of "controlling magnet movement - recording distance / angle / voltage - generating two-dimensional coordinate system calibration," without the need for complex professional calculations. In the displacement point confirmation stage, both the "sequence alignment - point verification" of the three sets of chips and the "curve alignment - variance calculation" of a single chip have standardized execution logic, which can be automated through programming, greatly reducing the technical threshold for monitoring operations and making it easy for on-site construction or maintenance personnel to get started quickly. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the method flow of the present invention. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] First Embodiment

[0035] Please see Figure 1 This application provides a method for monitoring the status of embedded building components based on magnetic induction communication, including the following steps:

[0036] Step 1: Based on the experimental data generated between the Hall chip and the magnet, confirm the different magnetic field strengths associated with different magnet distances, and confirm the different monitoring voltages associated with different magnetic field strengths. Based on the confirmation results, generate the evaluation criteria associated with the experimental data. Specifically, during the experiment, when the corresponding magnet undergoes displacement, the associated magnet distance will also change, leading to a change in the associated magnet strength, which in turn causes a related change in the voltage value of the corresponding Hall chip. Therefore, based on the displacement distance associated with the actual displacement process and the angle data associated with the same displacement distance, confirm the voltage data associated with the corresponding magnet strength, thereby effectively generating a set of evaluation criteria. In the subsequent monitoring and processing process, confirm whether there is a displacement change in the building embedded parts and display the signal in a timely manner. Subsequently, distinguish and confirm based on the total number of chips set in the actual monitoring scenario: if the total number of chips is three sets (that is, one set is set in each of the X-axis, Y-axis, and Z-axis directions), then it is easy to confirm the displacement point through comparison. If the total number of chips is only one set, then the actual confirmation of the displacement point is based on the analysis and control process.

[0037] The specific method for generating the evaluation criteria is as follows:

[0038] The magnet is controlled to move in a preset displacement direction, and the distance between the magnet and the Hall chip is confirmed. The monitoring voltage associated with the corresponding magnet distance is also confirmed. Then, the monitoring voltage associated with the same magnet distance at different angles is confirmed, and a monitoring voltage range associated with the corresponding magnet distance is generated. Specifically, the displacement direction is a preset direction. When the magnet moves in the corresponding preset direction, the first set of distances associated with it is the corresponding magnet distance. Then, with the corresponding magnet distance as the radius and the chip location as the center, the magnet is controlled to move in an arc. This allows the confirmation of different monitoring voltages associated with different angles. The angle is the horizontal angle relative to the original radius. That is, the original set radius is a reference. Based on the corresponding reference, the corresponding angle characteristics can be confirmed. At the same distance, the different monitoring characteristics associated with different angle characteristics are confirmed.

[0039] The magnets are sorted from smallest to largest distance, and the associated monitoring voltage ranges are sorted synchronously. A two-dimensional coordinate system is established with the magnet distance as the horizontal axis and the monitoring voltage as the vertical axis. Different monitoring voltage ranges associated with different magnet distances are marked in the two-dimensional coordinate system to generate evaluation criteria. In the specific test process, when the angle changes, there is a set angle range, which is specifically set by relevant personnel. When the angle changes, the distance between the chip and the magnet must be kept consistent, and the parameter difference must not be too large.

[0040] Step 2: During actual application, the real-time monitored voltage is compared with the preset voltage. Based on the comparison process, it is determined whether there are any displacement anomalies in the building's embedded parts. A displacement anomaly signal is generated based on the identification results. The specific method for identification is as follows:

[0041] The real-time monitoring voltage is calibrated to V. i Where i represents the corresponding time, and the monitored voltage V i The voltage is compared and verified with the preset voltage Vb. If |V i If -Vb|≥Y1, a displacement anomaly signal is generated directly; otherwise, continuous monitoring is performed. Y1 is a preset value, which is determined in advance by the operator based on experience.

[0042] Step 3: Based on the generated displacement anomaly signal, identify the number of Hall chip sensors in the building embedded part scene. If there are three, confirm the displacement point according to the voltage characteristics of the three sets of Hall chip sensors and the evaluation criteria. If there is only one, control the rotation of the Hall chip sensor to confirm the monitoring voltage change characteristics generated during the rotation, compare the confirmed monitoring voltage change characteristics with the evaluation criteria, confirm the displacement point, and generate a displacement vector based on the displacement point for display.

[0043] When the number of Hall effect sensor chips in the corresponding building embedded part scenario is three:

[0044] Randomly select a group of Hall effect chip sensors as the main sensors, and confirm the monitoring voltage V associated with the main sensors at the current moment. i Confirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances, and the different magnet distances each have different marked included angles, are sorted in ascending order of value to confirm the magnet distance sequence;

[0045] Starting from the first magnet distance in the confirmed magnet distance sequence, based on the angle associated with the corresponding magnet distance, confirm the circle containing the magnet (any point on the circle is acceptable). Select magnet positions sequentially from the circle, and based on the positions of the other two sets of Hall effect sensor chips, confirm the associated distances L1 and L2 between the magnet positions and different positions. Simultaneously confirm the angles associated with these associated distances. Confirm the monitoring voltages associated with the associated distances L1 and L2 from the evaluation criteria. Identify whether the confirmed monitoring voltages match the voltage values ​​monitored by the corresponding Hall effect sensor chips. If they match, directly record the selected magnet position as the displacement point. If they do not match, continue selecting other magnet positions within the circle for confirmation. If the displacement point cannot be confirmed within the circle associated with the first magnet distance, start from the second magnet distance and continue using the first magnet distance... The same confirmation method is used to confirm the displacement point of the iron distance. The displacement points are confirmed sequentially, and so on, until the displacement point is confirmed. Specifically, in the associated distance sequence, there is a first distance and the subsequent distances in sequence. When the corresponding circle associated with the first distance cannot confirm the corresponding displacement point, the confirmation can be carried out sequentially. Then, the second magnet distance, the third magnet distance, etc., are confirmed using the same displacement point confirmation method. According to the specific confirmation process, the corresponding displacement point can be effectively locked. With three sets of monitoring sensors, they can be directly compared and verified one by one according to the corresponding evaluation standards. According to the actual comparison and verification process, the actual position of the displacement point can be quickly and effectively confirmed, thereby quickly locking the corresponding displacement vector for display, so that external personnel can check and confirm the offset position caused by the building embedded parts.

[0046] When the number of Hall effect sensor corresponding to the building embedded part scenario is one:

[0047] Based on the monitoring voltage V associated with the Hall chip sensor at the current moment i Confirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances are then sorted in ascending order of value to confirm the magnet distance sequence.

[0048] The Hall chip sensor is controlled to perform an angle test. The offset angle associated with the offset process is a preset angle, which is determined by the operator based on experience. Generally, the offset is within a range of 3°. The original position is used as the central axis, and the offset is 3°. A set of voltage ranges is formed according to the offset range of 3°. The sensor is equipped with an automatic rotation mechanism to drive the chip to offset and complete the rotation process. The voltage change data associated with the angle test process is monitored. The starting point of the original angle test process is used as the initial point to generate the voltage change data curve associated with the rotation test process.

[0049] Confirm the included angle A1 associated with the distance of the first magnet in the magnet distance sequence, and use (A1 + rotation angle) = A2 to confirm the change angle A2. Identify the voltage between the included angle A1 and A2 of the distance of the first magnet and generate its voltage standard curve. Compare the voltage change data curve with the voltage standard curve, place the two sets of curves in the same two-dimensional coordinate system, and calibrate the initial points of the two sets of curves to coincide. Confirm the voltage difference between corresponding points on different curves at the same vertical position. The voltage difference is ≥0. Perform variance processing on the confirmed voltage difference values ​​to confirm the calibration variance. Use the confirmed calibration variance as the calibration feature associated with this magnet distance.

[0050] Then, using the same method, the calibration features associated with other magnet distances are confirmed in sequence, and the minimum value is selected from the different confirmed calibration features. The magnet distance associated with the minimum value is taken as the determined distance, and the displacement point is confirmed based on the included angle associated with the determined distance.

[0051] Based on the initial position points set for the building embedded parts and the confirmed displacement points, a displacement vector associated with the building embedded parts is generated, and the generated displacement vector is directly displayed on the display terminal for external personnel to view and take timely countermeasures.

[0052] Specifically, during the actual confirmation process, different spatial locations will generate different voltage change curves when the angle offset is processed. By comparing these voltage change curves with the voltage curves generated during the actual monitoring process, the voltage difference generated during the comparison can be confirmed. The variance of the confirmed voltage difference can then be determined to confirm the similarity. The optimal position with the best similarity can then be selected, and the point with the highest similarity can be recorded as the displacement point. The displacement characteristics can then be confirmed and displayed for relevant personnel to review and take timely countermeasures.

[0053] Some of the data in the above formulas are numerical calculations with dimensions removed, and the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0054] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A method for monitoring the status of embedded building components based on magnetic induction communication, characterized in that, Includes the following steps: Step 1: Based on the experimental data generated between the Hall chip and the magnet, confirm the different magnetic field strengths associated with different magnet distances, and confirm the different monitoring voltages associated with different magnetic field strengths. Based on the confirmation results, generate the evaluation criteria associated with the experimental data. Step 2: Verify and compare the real-time monitored voltage with the preset voltage. Based on the comparison process, identify whether there is any displacement anomaly in the building's embedded parts, and generate a displacement anomaly signal based on the identification results. Step 3: Based on the generated displacement anomaly signal, identify the number of Hall chip sensors in the building embedded part scene. If there are three, confirm the displacement point according to the voltage characteristics of the three sets of Hall chip sensors and the evaluation criteria. If there is only one, control the Hall chip sensor to rotate, confirm the monitoring voltage change characteristics generated during the rotation, compare the confirmed monitoring voltage change characteristics with the evaluation criteria, confirm the displacement point, and generate a displacement vector based on the displacement point for display. When the number of Hall chip sensors is three: Randomly select a group of Hall effect chip sensors as the main sensors, and confirm the monitoring voltage V associated with the main sensors at the current moment. i Confirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances, and the different magnet distances each have different marked included angles, are sorted in ascending order of value to confirm the magnet distance sequence; Starting from the first magnet distance in the confirmed magnet distance sequence, based on the angle associated with the corresponding magnet distance, the circle containing the magnet is identified. Magnet position points are then selected sequentially from this circle. Based on the position points of the other two sets of Hall effect sensor chips, the associated distances L1 and L2 between the magnet position points and their respective position points are confirmed. Simultaneously, the angles associated with these associated distances are confirmed. The monitoring voltages associated with these distances L1 and L2 are then confirmed within the evaluation criteria. Finally, it is determined whether the confirmed monitoring voltages match the voltage values ​​monitored by the corresponding Hall effect sensor chips. If there is a discrepancy, continue to select other magnet positions in the circle to confirm. If the displacement point cannot be confirmed in the circle associated with the distance of the first magnet, start from the distance of the second magnet and use the same confirmation method as the distance of the first magnet to confirm the displacement point. Continue to confirm the displacement point in this way until the displacement point is confirmed. If they match, the selected magnet position point is directly recorded as the displacement point.

2. The method for monitoring the status of embedded building components based on magnetic induction communication according to claim 1, characterized in that, In step one, the specific method for generating evaluation criteria based on the confirmation results is as follows: The magnet is controlled to move in a preset displacement direction, and the distance between the magnet and the Hall chip is confirmed. The monitoring voltage associated with the corresponding magnet distance is confirmed, and the monitoring voltage associated with the same magnet distance at different angles is confirmed. The monitoring voltage range associated with the corresponding magnet distance is generated. The magnets are sorted from smallest to largest distance, and the associated monitoring voltage ranges are sorted synchronously. A two-dimensional coordinate system is established with the magnet distance as the horizontal axis and the monitoring voltage as the vertical axis. Different monitoring voltage ranges associated with different magnet distances are then marked in the two-dimensional coordinate system to generate evaluation criteria.

3. The method for monitoring the status of embedded building components based on magnetic induction communication according to claim 1, characterized in that, In step two, the specific method for generating the displacement anomaly signal based on the identification result is as follows: The real-time monitoring voltage is calibrated to V. i Where i represents the corresponding time, and the monitored voltage V i The voltage is compared and verified with the preset voltage Vb. If |V i If -Vb|≥Y1, then a displacement anomaly signal is directly generated, where Y1 is a preset value.

4. The method for monitoring the status of embedded building components based on magnetic induction communication according to claim 3, characterized in that, If |V i If -Vb| < Y1, then continuous monitoring will continue, where Y1 is a preset value.

5. The method for monitoring the status of embedded building components based on magnetic induction communication according to claim 1, characterized in that, In step three: When the number of Hall chip sensors is one: Based on the monitoring voltage V associated with the Hall chip sensor at the current moment i Confirm the monitoring voltage V from the evaluation criteria. i The associated monitoring voltage range is used to identify the corresponding monitoring voltage V from different monitoring voltage ranges. i The associated magnet distances are then sorted in ascending order of value to confirm the magnet distance sequence. The Hall chip sensor is controlled to perform an angle test. The offset angle associated with the offset process is a preset angle. The offset process is completed, and the voltage change data associated with the offset process is monitored. The starting point of the original angle test process is used as the initial point to generate the voltage change data curve associated with the rotation test process. Confirm the included angle A1 associated with the distance of the first magnet in the magnet distance sequence, and use (A1 + rotation angle) = A2 to confirm the change angle A2. Identify the voltage between the included angle A1 and A2 of the distance of the first magnet and generate its voltage standard curve. Compare the voltage change data curve with the voltage standard curve, place the two sets of curves in the same two-dimensional coordinate system, and calibrate the initial points of the two sets of curves to coincide. Confirm the voltage difference between corresponding points on different curves at the same vertical position. The voltage difference is ≥0. Perform variance processing on the confirmed voltage difference values ​​to confirm the calibration variance. Use the confirmed calibration variance as the calibration feature associated with this magnet distance. Using the same method, the calibration features associated with other magnet distances are confirmed in sequence. From the confirmed different calibration features, the minimum value is selected, and the magnet distance associated with the minimum value is taken as the determined distance. Based on the included angle associated with the determined distance, the displacement point is confirmed.

6. The method for monitoring the status of embedded building components based on magnetic induction communication according to claim 5, characterized in that, Step three also includes: generating a displacement vector associated with the building embedded parts based on the initial position points set by the building embedded parts and the confirmed displacement points.

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