Semiconductor wafer surface defect detection equipment and detection method

Abstract

The invention relates to the technical field of wafer detection, in particular to semiconductor wafer surface defect detection equipment and method, and the semiconductor wafer surface defect detection equipment comprises a detection shell and a conveying shell; a carrying table is arranged in the conveying shell, and a piece taking device, a camera, a spotlight, a first rotating ring, a support and a first driving unit are arranged in the detection shell. The pick-up device is arranged in the detection shell and used for taking out the semiconductor wafer on the carrying table, the moving direction of the carrying table serves as a rotation axis, the pick-up device can rotate around the rotation axis, and the rotation angle of each time is 180 degrees; the camera is arranged on one side of the pick-up device; the spotlight is of an annular structure and is arranged on the periphery of the camera in a surrounding and sleeving mode. The first rotating ring is rotationally arranged in the detection shell along the rotating axis; the support is fixedly arranged on the first rotating ring, and the camera is arranged on the support; the first driving unit is arranged on one side of the first rotating ring. According to the invention, the precision and reliability of double-sided detection of the semiconductor wafer are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection, in particular to a semiconductor wafer surface defect detection equipment and a detection method. BACKGROUND

[0002] After cutting, the semiconductor wafer needs to go through the stages of removing mortar, degumming treatment, ultrasonic cleaning, grinding, polishing and detection. Among them, the detection of defects on the surface of the semiconductor wafer is a crucial step in the detection process.

[0003] Chinese patent CN120109040B discloses a semiconductor wafer surface defect online detection device, which comprises a base, a machine cover fixedly installed at the upper end of the base, a first detection probe fixedly installed on the inner side of the machine cover, and a second detection probe fixedly installed inside the base. A feeding mechanism is used to feed the semiconductor wafer into the machine cover for detection, and the feeding mechanism is installed at the upper end of the base. A load assembly is used to clamp the semiconductor wafer, and the load assembly is installed on the upper side of the feeding mechanism. A suction assembly is used to suck out the gas inside the load assembly, and the number of suction assemblies is two, which are symmetrically distributed. The feeding mechanism comprises two guide rails fixedly installed at the upper end of the base, two symmetrically distributed sliding seats movably sleeved on the outer side of the guide rails, and four sliding seats fixedly connected by a connecting plate. The upper end of the sliding seat is fixedly installed with a supporting column, and the upper end of the base is fixedly installed with two symmetrically distributed electric push rods corresponding to the outer sides of the two guide rails.

[0004] The above scheme uses two high-transparency membranes to clamp the wafer in order to detect both surfaces of the wafer simultaneously. However, the high-transparency membrane may reflect light during detection, which requires special treatment of the high-transparency membrane. In addition, the high-transparency membrane may discolor after a period of use, which greatly affects detection. Furthermore, the surface of the high-transparency membrane needs to be cleaned regularly, and if there are stains on the surface of the high-transparency membrane, it will also cause deviation in the detection results. In addition, the stability of the wafer clamping process is poor. If a stable stage is used, the surface of the wafer in contact with the stage will be blocked by the stage, resulting in the need for manual or mechanical intervention to remove the wafer after completing the detection of one surface of the wafer. The existing turning structure cooperating with the stage is complex. Since the visual scheme is often used for detecting defects on the surface of the wafer, the turning mechanism needs to invade the visual detection area during turning. After turning is completed, the turning structure needs to be withdrawn from the visual detection area, resulting in a large overall structure, high use cost and high maintenance cost. SUMMARY

[0005] In order to solve the above problems, the application provides a semiconductor wafer surface defect detection device and a detection method, which optimizes the design of the semiconductor wafer surface defect detection device, adopts a 180-degree rotatable pick-up device, a multi-angle rotatable camera and a ring-shaped spotlight, realizes the automatic turning function without manual intervention in the single semiconductor wafer detection process, and effectively reduces the detection blind area caused by single-angle light through the semicircular moving path formed by the rotation of the camera around the rotation axis and the dynamic change of the light angle of the spotlight.

[0006] In order to solve the above problems, the application provides a semiconductor wafer surface defect detection device and a detection method, which optimizes the design of the semiconductor wafer surface defect detection device, adopts a 180-degree rotatable pick-up device, a multi-angle rotatable camera and a ring-shaped spotlight, realizes the automatic turning function without manual intervention in the single semiconductor wafer detection process, and effectively reduces the detection blind area caused by single-angle light through the semicircular moving path formed by the rotation of the camera around the rotation axis and the dynamic change of the light angle of the spotlight. In order to solve the above problems, the application provides a semiconductor wafer surface defect detection device and a detection method, which optimizes the design of the semiconductor wafer surface defect detection device, adopts a 180-degree rotatable pick-up device, a multi-angle rotatable camera and a ring-shaped spotlight, realizes the automatic turning function without manual intervention in the single semiconductor wafer detection process, and effectively reduces the detection blind area caused by single-angle light through the semicircular moving path formed by the rotation of the camera around the rotation axis and the dynamic change of the light angle of the spotlight. The pick-up device is arranged in the detection shell and is used for picking up the semiconductor wafer on the carrier, the rotation axis is the moving direction of the carrier, the pick-up device can rotate around the rotation axis and the rotation angle is 180 degrees each time; The camera is arranged on one side of the pick-up device, the camera can rotate around the rotation axis and is always not lower than the upper end surface of the carrier; The spotlight is in a ring-shaped structure and is sleeved around the periphery of the camera; The first rotating ring is arranged in the detection shell and rotates along the rotation axis; The bracket is fixedly arranged on the first rotating ring, and the camera is arranged on the bracket; The first driving unit is arranged on one side of the first rotating ring and is used for driving the first rotating ring to rotate.

[0007] Preferably, the inner ring side of the first rotating ring is coated with black light-absorbing paint.

[0008] Preferably, the pick-up device comprises a second rotating ring, a suction cup and a second driving unit; The second rotating ring is arranged on one side of the first rotating ring and rotates along the rotation axis; The suction cup is arranged on the second rotating ring; The second driving unit is arranged on one side of the second rotating ring and is used for driving the second rotating ring to rotate.

[0009] Preferably, the pick-up device further comprises a sliding table, a lifting frame and an electrical synchronous controller; The suction cup is arranged in two groups, the sliding table is arranged in two groups and is symmetrical about the first rotating ring, and the two sliding tables are vertically arranged in the detection shell; The lifting frame is arranged in two groups and is arranged on the two sliding tables, respectively, and the two groups of suction cups are arranged on the two lifting frames, respectively; The electric synchronous controller is arranged on one side of the two sliding tables and is used for controlling synchronous operation of the two sliding tables.

[0010] Preferably, the pickup device further comprises a breather pipe and a solenoid valve. The breather pipe is arranged at the upper portion of the suction cup, and the lower end of the breather pipe is communicated with the upper portion of the suction cup. The solenoid valve is arranged at the upper end of the breather pipe.

[0011] Preferably, a power supply assembly for supplying power to the spotlight and the camera is arranged on one side of the first rotating ring.

[0012] Preferably, the power supply assembly comprises a carbon ring, a carbon brush, a spring and a conductive sheet. The carbon ring is arranged on one side of the first rotating ring, and the axis of the spring is collinear with the axis of the first rotating ring. The carbon brush is arranged on the bracket and moves along the axis direction of the first rotating ring, and the end of the carbon brush is in contact with and slidingly matched with the carbon ring. The spring is arranged between the carbon brush and the bracket along the axis direction of the first rotating ring, and the two ends of the spring are connected with the carbon brush and the bracket respectively, and an insulating sheet is arranged between the spring and the carbon brush. The conductive sheet is arranged on the bracket, the side wall of the carbon brush is slidingly matched with the conductive sheet, and the conductive sheet is electrically connected with the spotlight and the camera respectively.

[0013] Preferably, a positioning unit for detecting the state of the second rotating ring after rotation is arranged on one side of the second rotating ring.

[0014] Preferably, a lead screw and a third rotary driver are further arranged in the conveying shell. The lead screw is arranged in the conveying shell and rotates along the arrangement direction of the detection shell and the conveying shell, and the lead screw penetrates through the carrier and is threadedly matched with the carrier. The third rotary driver is arranged at the end of the lead screw and is used for driving the lead screw to rotate.

[0015] The application also relates to a semiconductor wafer surface defect detection method, and the method adopts a semiconductor wafer surface defect detection device, and the specific process is as follows: S1, feeding, the semiconductor wafer is placed on the carrier in the conveying shell, the carrier drives the semiconductor wafer to enter the detection shell and stop moving when reaching the position right below the camera S2, first surface detection, the camera rotates around the rotation axis at the upper portion of the carrier, and the height of the camera is always not lower than the upper end surface of the carrier, while the spotlight is synchronously turned on, the camera rotates around the rotation axis and photographs the surface of the semiconductor wafer according to the inherent frequency, and the moving path formed when the camera moves is semicircular. S3, after the first surface detection, the taking device is rotated from below the platform to above the platform, and the semiconductor wafer on the platform is adsorbed and taken out, then the platform is withdrawn from the detection shell, the taking device drives the adsorbed semiconductor wafer to rotate 180 degrees, and the turning over is completed; S4, second surface detection, the camera repeats the step in S2; S5, discharging, after the detection is completed, the taking device drives the semiconductor wafer after the detection to rotate 180 degrees again, and the height of the semiconductor wafer is higher than the height of the platform, then the platform is inserted into the detection shell and stopped when it is located directly below the semiconductor wafer, the taking device releases the semiconductor wafer after placing it on the platform, and the platform drives the semiconductor wafer to reset to the conveying shell, and the semiconductor wafer can be taken out by the worker.

[0016] The beneficial effects of the present application compared with the prior art are: 1, the semiconductor wafer surface defect detection equipment is optimized and designed, the taking device capable of rotating 180 degrees is matched with the camera capable of rotating at multiple angles and the ring-shaped spotlight, the automatic turning over function without manual intervention in the single semiconductor wafer detection process is realized, the detection blind area caused by single-angle light is effectively reduced through the semicircular moving path formed by the rotation of the camera around the rotation axis and the dynamic change of the light angle of the spotlight, the influence of external light is effectively reduced since the whole detection process is located in the detection shell, and the precision and reliability of the double-side detection of the semiconductor wafer are significantly improved. In addition, after the inner wall of the first rotating ring is coated with black light-absorbing paint, the light reflection of the inner wall of the first rotating ring during the detection of the camera is avoided, and the detection precision of the camera is further improved.

[0017] 2, by setting the second rotating ring, the second driving unit, the sliding table and the lifting frame, the suction cup can be below the platform when the semiconductor wafer is placed on the platform for detection, and the suction cup will not hinder the camera area.

[0018] 3, by setting the carbon ring, the carbon brush, the spring and the conductive sheet, the camera and the spotlight can be continuously and stably powered when the first rotating ring drives the camera to rotate. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a three-dimensional schematic view of a semiconductor wafer surface defect detection equipment.

[0020] Figure 2 is a three-dimensional schematic view of a semiconductor wafer surface defect detection equipment without a detection shell and a conveying shell Figure 1 .

[0021] Figure 3 is a three-dimensional schematic view of a semiconductor wafer surface defect detection equipmentFigure 2 Partial enlarged view at A.

[0022] Figure 4 is a partial enlarged view at B. Figure 2

[0023] Figure 5 is a side view of the semiconductor wafer surface defect detection device.

[0024] Figure 6 is a partial enlarged view at C-C. Figure 5

[0025] Figure 7 is a sectional view of the semiconductor wafer surface defect detection device.

[0026] Figure 8 is a partial enlarged view at D. Figure 7

[0027] Figure 9 is a partial enlarged view at E. Figure 7

[0028] Figure 10 is a perspective view of the semiconductor wafer surface defect detection device after removing the detection shell and the conveying shell. Figure 2

[0029] Figure 11 is a combined perspective view of the semiconductor wafer surface defect detection device and the first rotating ring provided with the power supply assembly.

[0030] Figure 12 is a perspective view of the semiconductor wafer surface defect detection device after the wafer taking device completes one time of turning over.

[0031] ​​​​​The figure marks are: 1, detection shell; 11, taking device; 111, second rotating ring; 112, suction cup; 113, second driving unit; 1131, second rotary driver; 1132, gear; 114, sliding table; 115, lifting frame; 116, air pipe; 117, electromagnetic valve; 12, camera; 13, spotlight; 14, first rotating ring; 141, support; 142, power supply assembly; 1421, carbon ring; 1422, carbon brush; 1423, spring; 1424, conductive sheet; 15, first driving unit; 151, worm; 152, worm gear; 153, first rotary driver; 16, positioning unit; 2, conveying shell; 21, loading platform; 22, lead screw; 23, third rotary driver; 3, semiconductor wafer. DETAILED DESCRIPTION

[0032] In order to further understand the features, technical means and specific purposes and functions achieved by the present application, the present application will be described in further detail below with reference to the drawings and specific embodiments.

[0033] Reference Figure 1 , Figure 2 and Figures 5-7 : A semiconductor wafer surface defect detection device, comprising a detection shell 1 and a conveying shell 2 arranged horizontally and interconnected; A loading platform 21 for receiving a semiconductor wafer 3 is arranged in the conveying shell 2 and moves along the arrangement direction of the detection shell 1 and the conveying shell 2, and a taking device 11, a camera 12, a spotlight 13, a first rotating ring 14, a support 141 and a first driving unit 15 are arranged in the detection shell 1; The taking device 11 is arranged in the detection shell 1 and is used to take out the semiconductor wafer 3 on the loading platform 21, and the taking device 11 can rotate around the rotation axis in the moving direction of the loading platform 21 and each rotation angle is 180 degrees; The camera 12 is arranged on one side of the taking device 11, and the camera 12 can rotate around the rotation axis and is always not lower than the upper end surface of the loading platform 21; The spotlight 13 is in a ring structure and is sleeved around the periphery of the camera 12; The first rotating ring 14 is arranged in the detection shell 1 and rotates along the rotation axis; The support 141 is fixedly arranged on the first rotating ring 14, and the camera 12 is arranged on the support 141; The first driving unit 15 is arranged on one side of the first rotating ring 14 and is used to drive the first rotating ring 14 to rotate.

[0034] After the semiconductor wafer 3 is cut off, the surface defects of the semiconductor wafer 3 need to be detected before leaving the factory, and the existing detection method is a fixed detection method, that is, the semiconductor wafer 3 is horizontally placed below the camera 12, and then visual detection is performed through the camera 12, but it is affected by light, and blind areas are prone to occur during detection. At the same time, the semiconductor wafer 3 has two surfaces, so when detecting, the semiconductor wafer 3 needs to be turned over by hand or a mechanical hand. If a mechanical hand is used to turn over, it will cause the detection equipment to increase the floor area. In order to avoid the occurrence of detection blind area, the existing equipment makes the camera 12 can be multi-angle, but the above-mentioned equipment does not have the function of automatically turning over, because the existing turning device will block the camera area of the camera 12, causing the camera 12 to be unable to shoot the whole picture of the semiconductor wafer 3. If you want to avoid the turning device from blocking, you need to install a moving mechanism on the turning device. When the turning device is turned over, the moving mechanism moves the turning device out of the camera area, but the semiconductor wafer 3 is still on the turning device at this time, causing the semiconductor wafer 3 to be moved out synchronously with the turning device when the turning device is moved out, still causing the camera 12 to be unable to shoot the whole picture of the semiconductor wafer 3. The existing equipment that can detect both surfaces of the semiconductor wafer 3 at the same time cannot match the camera 12 with multi-angle adjustment, because when detecting both surfaces of the semiconductor wafer 3 at the same time, the existing equipment relies on a high-transparency film to clamp the semiconductor wafer 3, but the high-transparency film itself still has a certain reflectivity. At the same time, if there is a defect on the surface of the semiconductor wafer 3, it will also damage the surface of the high-transparency film. In addition, the high-transparency film will gradually discolor after long-term use, so it has a great influence on the detection result and cannot be compatible with the visual detection method of the camera 12.

[0035] In order to avoid the above situation, the existing semiconductor wafer 3 surface defect detection equipment is optimized and designed, so that when detecting a single semiconductor wafer 3, human intervention is not required, and the influence of external environmental light is small, thereby improving the detection accuracy of the surface of the semiconductor wafer 3. The specific structure and working process of the present application are as follows: The first driving unit 15 comprises a worm 151, a worm wheel 152 and a first rotary driver 153. The worm wheel 152 is fixedly sleeved on the periphery of the first rotating ring 14. The worm 151 is vertically arranged on one side of the worm wheel 152 and in transmission cooperation with the worm wheel 152. The first rotary driver 153 is arranged at the end of the worm 151 and is used to drive the worm 151 to rotate. The first rotary driver 153 is preferably a servo motor.

[0036] Before detection, the carrier 21 is located in the conveying shell 2, the upper part of the conveying shell 2 is provided with a loading port, the worker puts the semiconductor wafer 3 into the conveying shell 2 from the loading port, and the carrier 21 receives the semiconductor wafer 3, the upper part of the carrier 21 is provided with a circular recess, the diameter of the circular recess is the same as the diameter of the semiconductor wafer 3, then the carrier 21 drives the semiconductor wafer 3 into the detection shell 1, at this time the taking device 11 is located below the carrier 21, and the camera 12 is always not lower than the upper end surface of the carrier 21, so the taking device 11 will not form an obstruction above the carrier 21, after confirming that the carrier 21 stops moving, at this time the semiconductor wafer 3 is located directly below the camera 12, the camera 12 is in a vertical state, the spotlight 13 arranged on the periphery of the camera 12 is turned on, then the camera 12 starts to detect the surface of the semiconductor wafer 3, the camera 12 rotates around the rotation axis when detecting the surface of the semiconductor wafer 3, and the height of the camera 12 is not lower than the upper end surface of the carrier 21, the moving path formed by the camera 12 during detection is semicircular, so when the camera 12 detects the surface of the semiconductor wafer 3, the angle of the light projected by the spotlight 13 will change with the rotation of the camera 12, reducing the occurrence of a blind area, after completing the detection of one surface of the semiconductor wafer 3, the taking device 11 rotates from below the carrier 21 to above the carrier 21, the taking device 11 adsorbs the semiconductor wafer 3 located on the carrier 21, then the carrier 21 is withdrawn from the detection shell 1, the taking device 11 drives the semiconductor wafer 3 to rotate by 180 degrees, completing the overturning, the upper surface of the overturned semiconductor wafer 3 is in a horizontal state, then the camera 12 detects the surface of the semiconductor wafer 3 again, the moving path formed by the camera 12 during detection is the same as the moving path formed during the previous detection, when the camera 12 completes the detection of the second surface of the semiconductor wafer 3, the taking device 11 drives the semiconductor wafer 3 to overturn by 180 degrees, at the same time, the taking device 11 drives the semiconductor wafer 3 to rise, so that the height of the semiconductor wafer 3 adsorbed by the taking device 11 is higher than the carrier 21, the carrier 21 is inserted into the detection shell 1 again and stops moving when reaching directly below the semiconductor wafer 3, the taking device 11 places the semiconductor wafer 3 on the carrier 21 and releases it, the carrier 21 drives the semiconductor wafer 3 to withdraw from the detection shell 1 and reset in the conveying shell 2, then the worker can take out the semiconductor wafer 3 placed on the carrier 21.

[0037] By optimizing the design of the semiconductor wafer 3 surface defect detection device, the 180-degree rotatable pickup device 11 is used in cooperation with the multi-angle rotatable camera 12 and the ring-shaped flash 13 to realize the automatic turning function without manual intervention in the single semiconductor wafer 3 detection process. At the same time, through the semicircular moving path formed by the rotation of the camera 12 around the rotation axis, combined with the dynamic change of the light angle of the flash 13, the detection blind area caused by single-angle light is effectively reduced. And because the detection shell 1 has a certain light shielding property, the precision and reliability of the double-sided detection of the semiconductor wafer 3 are significantly improved.

[0038] With reference to Figure 2 and Figure 6 : The inner ring side of the first rotating ring 14 is coated with black light-absorbing paint.

[0039] Since the camera 12 needs to use the light source of the flash 13 to irradiate the surface of the semiconductor wafer 3 when taking pictures, and the semiconductor wafer 3 itself has a certain reflection effect, part of the light will be reflected to the inner ring side wall of the first rotating ring 14. If the inner ring side wall of the first rotating ring 14 is not treated, the inner wall of the first rotating ring 14 will also have a reflection phenomenon, which will affect the visual detection of the camera 12 on the surface of the semiconductor wafer 3, and finally lead to deviation of the detection result. After coating the inner wall of the first rotating ring 14 with black light-absorbing paint, the light reflection of the inner wall of the first rotating ring 14 during the detection process of the camera 12 is avoided, and the detection accuracy of the camera 12 is improved.

[0040] With reference to Figure 2 , Figure 3 , Figure 9 and Figure 10 : The pickup device 11 includes a second rotating ring 111, a suction cup 112, and a second driving unit 113; The second rotating ring 111 is arranged on one side of the first rotating ring 14 along the rotation axis; The suction cup 112 is arranged on the second rotating ring 111; The second driving unit 113 is arranged on one side of the second rotating ring 111 and is used to drive the second rotating ring 111 to rotate.

[0041] The chuck 112 drives the semiconductor wafer 3 to rise after adsorbing the semiconductor wafer 3 on the carrier 21, then the carrier 21 is reset from the detection shell 1 to the conveying shell 2, the second driving unit 113 drives the second rotating ring 111 to rotate by 180 degrees, so that the chuck 112 drives the semiconductor wafer 3 to overturn by 180 degrees, thereby realizing the turning of the semiconductor wafer 3, and finally the camera 12 is driven to rotate around the rotation axis by the first rotating ring 14, so that the camera 12 detects the surface of the overturned semiconductor wafer 3. The second driving unit includes a second rotary driver 1131 and a gear 1132, the outer periphery of the second rotating ring 111 is uniformly provided with meshing teeth, the gear 1132 is rotatably arranged on one side of the second rotating ring 111 and meshes with the meshing teeth on the second rotating ring 111, and the second rotary driver 1131 is arranged at the end of the gear 1132. The second rotary driver 1131 is preferably a servo motor.

[0042] With reference to Figure 9 And Figure 10 The taking device 11 further includes a sliding table 114, a lifting frame 115 and an electrical synchronous controller; The chuck 112 is provided in two groups, the sliding table 114 is provided in two groups and is symmetrical about the first rotating ring 14, and the two sliding tables 114 are vertically arranged in the detection shell 1; The lifting frame 115 is provided in two groups and is arranged on the two sliding tables 114 respectively, and the two groups of chucks 112 are arranged on the two lifting frames 115 respectively; The electrical synchronous controller is arranged on one side of the two sliding tables 114 and is used for controlling the synchronous operation of the two sliding tables 114.

[0043] The two groups of chucks 112 are arranged in the taking device 11, so that the two groups of chucks 112 can simultaneously produce adsorption effect on the semiconductor wafer 3, thereby improving the stability during subsequent overturning. The two sliding tables 114 drive the two lifting frames 115 respectively, so that the two lifting frames 115 do not collide with the camera 12 when lifting, thereby avoiding the collision between the lifting frame 115 and the camera 12 when the sliding table 114 drives the lifting frame 115 to rise after the chuck 112 adsorbs the semiconductor wafer 3. By arranging the electrical synchronous controller, the synchronism of the two sliding tables 114 when driving the two lifting frames 115 to lift is ensured, so that the stress of the semiconductor wafer 3 is more uniform when being adsorbed and lifted, thereby avoiding the damage of the semiconductor wafer 3 due to detection.

[0044] With reference to Figure 11 The taking device 11 further includes an air pipe 116 and a solenoid valve 117; The air pipe 116 is arranged at the upper portion of the chuck 112, and the lower end of the air pipe 116 is in communication with the upper portion of the chuck 112; The solenoid valve 117 is arranged at the upper end of the air pipe 116.

[0045] When the chuck 112 is used to suck the semiconductor wafer 3 on the carrier 21, the electromagnetic valve 117 is in the closed state, the lifting frame 115 is driven by the slide table 114 to lower the chuck 112, the chuck 112 generates a suction force on the semiconductor wafer 3 when it is pressed against the surface of the semiconductor wafer 3, then the chuck 112 rises with the semiconductor wafer 3 being sucked, the carrier 21 is withdrawn, the second rotating ring 111 drives the semiconductor wafer 3 being sucked to rotate 180 degrees, so that the semiconductor wafer 3 is flipped, the upper surface of the flipped semiconductor wafer 3 is in a horizontal state, after the camera 12 completes detection, the second rotating ring 111 rotates 180 degrees again, then the carrier 21 extends into the detection shell 1 again and moves to the lower side of the semiconductor wafer 3, then the slide table 114 drives the lifting frame 115 to lower, so that the semiconductor wafer 3 is placed on the carrier 21, then the electromagnetic valve 117 is opened, the suction force of the chuck 112 on the semiconductor wafer 3 disappears, the slide table 114 drives the lifting frame 115 to rise again, the chuck 112 is separated from the semiconductor wafer 3, and the carrier 21 drives the semiconductor wafer 3 after detection to move into the conveying shell 2 to complete resetting.

[0046] With reference to Figure 6 : A power supply assembly 142 for supplying power to the spotlight 13 and the camera 12 is arranged on one side of the first rotating ring 14.

[0047] With reference to Figure 8 and Figure 11 : The power supply assembly 142 comprises a carbon ring 1421, a carbon brush 1422, a spring 1423 and a conductive sheet 1424. The carbon ring 1421 is arranged on one side of the first rotating ring 14, and the axis of the spring 1423 is collinear with the axis of the first rotating ring 14. The carbon brush 1422 is arranged on the bracket 141 and moves along the axis direction of the first rotating ring 14, and the end of the carbon brush 1422 is in sliding fit with the carbon ring 1421. The spring 1423 is arranged between the carbon brush 1422 and the bracket 141 along the axis direction of the first rotating ring 14, and the two ends of the spring 1423 are connected with the carbon brush 1422 and the bracket 141 respectively, and an insulating sheet is arranged between the spring 1423 and the carbon brush 1422. The conductive sheet 1424 is arranged on the bracket 141, the side wall of the carbon brush 1422 is in sliding fit with the conductive sheet 1424, and the conductive sheet 1424 is electrically connected with the spotlight 13 and the camera 12 respectively.

[0048] The spring 1423 provides a pressing force to the carbon brush 1422, so that the carbon brush 1422 is always pressed on the carbon ring 1421, when the first rotating ring 14 rotates, the carbon brush 1422 slides on the carbon ring 1421, when the carbon ring 1421 is powered, the current is transmitted to the conductive sheet 1424 through the carbon brush 1422, so as to realize power supply to the spotlight 13 and the camera 12.

[0049] Referring to Figure 6 and Figure 7 : The second rotating ring 111 is provided with a positioning unit 16 for detecting the state of the second rotating ring 111 after rotation.

[0050] The positioning unit 16 can be selected from a Hall sensor or an angle sensor according to actual conditions. When a Hall sensor is used, a magnetic sensing sheet needs to be provided on the second rotating ring 111. The Hall sensor can identify the magnetic sensing sheet every 180 degrees of rotation of the second rotating ring 111, thereby completing positioning of the second rotating ring 111. If an angle sensor is used, the angle sensor is arranged between the second rotary driver 1131 and the gear 1132. Since the diameter of the gear 1132 is smaller than that of the second rotating ring 111, the angle sensor accumulatively counts the rotation angle of the gear 1132. When a specified cumulative value is reached, it indicates that the second rotating ring 111 has rotated 180 degrees.

[0051] Referring to Figure 4 and Figure 7 : The conveying shell 2 is further provided with a lead screw 22 and a third rotary driver 23. The lead screw 22 is arranged in the conveying shell 2 along the arrangement direction of the detection shell 1 and the conveying shell 2, penetrates the carrier 21 and threadedly cooperates with the carrier 21. The third rotary driver 23 is arranged at the end of the lead screw 22 and is used to drive the lead screw 22 to rotate.

[0052] The third rotary driver 23 is preferably a servo motor. The third rotary driver 23 drives the lead screw 22 to rotate, so that the carrier 21 extends into or withdraws from the detection shell 1.

[0053] Referring to Figures 1-12 : The present application also relates to a semiconductor wafer surface defect detection method, which adopts a semiconductor wafer surface defect detection device, and the specific process is as follows: S1, feeding, placing the semiconductor wafer 3 on the carrier 21 in the conveying shell 2, driving the carrier 21 to enter the detection shell 1 with the semiconductor wafer 3 and stopping moving when reaching the position directly below the camera 12 S2, first surface detection, rotating the camera 12 around the rotating axis on the upper part of the carrier 21, and the height of the camera 12 is always not lower than the upper end surface of the carrier 21, while the spotlight 13 is synchronously turned on. The camera 12 rotates around the rotating axis and photographs the surface of the semiconductor wafer 3 according to the inherent frequency. The moving path formed when the camera 12 moves is semicircular. S3, turn over, after the first side detection, the taking device 11 rotates from below the loading platform 21 to above the loading platform 21, and the semiconductor wafer 3 on the loading platform 21 is adsorbed and taken out, then the loading platform 21 is withdrawn from the detection shell 1, the taking device 11 drives the adsorbed semiconductor wafer 3 to rotate 180 degrees, and the turning over is completed; S4, second side detection, the camera 12 repeats the step in S2; S5, discharge, after the detection is completed, the taking device 11 drives the semiconductor wafer 3 after the detection to rotate 180 degrees again, and the height of the semiconductor wafer 3 is higher than the height of the loading platform 21, then the loading platform 21 is inserted into the detection shell 1 and stopped when it is located directly below the semiconductor wafer 3, the taking device 11 releases the semiconductor wafer 3 after it is placed on the loading platform 21, the loading platform 21 drives the semiconductor wafer 3 to reset into the conveying shell 2, and the semiconductor wafer 3 can be taken out by the worker.

[0054] Working principle: Before testing, the stage 21 is located in the conveying shell 2. The upper part of the conveying shell 2 has a discharge port. The operator places the semiconductor wafer 3 into the conveying shell 2 through the discharge port, and the stage 21 receives it. The upper part of the stage 21 has a circular recess, the diameter of which is the same as the diameter of the semiconductor wafer 3. Then, the stage 21 carries the semiconductor wafer 3 into the testing shell 1. At this time, the picking device 11 is located below the stage 21, while the camera 12 is always not lower than the upper surface of the stage 21. Therefore, the picking device 11 will not obstruct the upper part of the stage 21. After confirming that the stage 21 has stopped moving... At this time, the semiconductor wafer 3 is located directly below the camera 12, which is in a vertical position. The spotlights 13 surrounding the camera 12 are turned on. The camera 12 then begins to visually inspect the surface of the semiconductor wafer 3. When inspecting the surface of the semiconductor wafer 3, the camera 12 rotates around its axis of rotation, and the height of the camera 12 is not lower than the upper surface of the stage 21. The movement path formed by the camera 12 during the inspection process is semi-circular. Therefore, when the camera 12 inspects the surface of the semiconductor wafer 3, the angle of the light projected by the spotlights 13 changes as the camera 12 rotates. This reduces the occurrence of blind spots. After completing the inspection of one surface of the semiconductor wafer 3, the pick-up device 11 rotates from below the stage 21 to above the stage 21. The pick-up device 11 picks up the semiconductor wafer 3 located on the stage 21, and then the stage 21 is removed from the detection housing 1. The pick-up device 11 drives the semiconductor wafer 3 to rotate 180 degrees, completing the flip. After the flip, the upper surface of the semiconductor wafer 3 is in a horizontal state. Then the camera 12 inspects the surface of the semiconductor wafer 3 again. The movement path formed by the camera 12 during inspection is the same as the movement path formed in the previous inspection. When the camera 12 is halfway... After the second surface of the conductor wafer 3 is inspected, the pick-up device 11 rotates the semiconductor wafer 3 180 degrees. At the same time, the pick-up device 11 lifts the semiconductor wafer 3, so that the height of the semiconductor wafer 3 adsorbed by the pick-up device 11 is higher than the stage 21. The stage 21 extends into the inspection shell 1 again and stops moving when it reaches directly below the semiconductor wafer 3. The pick-up device 11 places the semiconductor wafer 3 on the stage 21 and releases it. The stage 21 pulls the semiconductor wafer 3 out of the inspection shell 1 and into the transport shell 2 for reset. Then, the operator can take out the semiconductor wafer 3 placed on the stage 21.

[0055] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A semiconductor wafer surface defect detection device, comprising a detection shell (1) and a transport shell (2) arranged horizontally and interconnected. Its features are, A platform (21) for receiving semiconductor wafers (3) is provided inside the conveying shell (2) along the arrangement direction of the detection shell (1) and the conveying shell (2). A pick-up device (11), a camera (12), a spotlight (13), a first rotating ring (14), a bracket (141) and a first driving unit (15) are provided inside the detection shell (1). The picking device (11) is set inside the detection shell (1) and is used to pick up the semiconductor wafer (3) on the stage (21). With the moving direction of the stage (21) as the axis of rotation, the picking device (11) can rotate around the axis of rotation and the rotation angle is 180 degrees each time. The camera (12) is set on one side of the picking device (11). The camera (12) can rotate around the rotation axis and is always not lower than the upper surface of the platform (21). The spotlight (13) has a ring structure and is fitted around the camera (12); The first rotating ring (14) is rotatably disposed inside the detection housing (1) along the rotation axis; The bracket (141) is fixedly mounted on the first rotating ring (14), and the camera (12) is mounted on the bracket (141); The first drive unit (15) is located on one side of the first rotating ring (14) and is used to drive the first rotating ring (14) to rotate.

2. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, The inner ring side of the first rotating ring (14) is coated with black light-absorbing paint.

3. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, The picking device (11) includes a second rotating ring (111), a suction cup (112), and a second drive unit (113). The second rotating ring (111) is rotatably disposed on one side of the first rotating ring (14) along the rotation axis; The suction cup (112) is mounted on the second rotating ring (111); The second drive unit (113) is located on one side of the second rotating ring (111) and is used to drive the second rotating ring (111) to rotate.

4. The semiconductor wafer surface defect detection device according to claim 3, characterized in that, The picking device (11) also includes a slide (114), a lifting frame (115), and an electrical synchronization controller; There are two sets of suction cups (112) and two slides (114) symmetrical about the first rotating ring (14). Both slides (114) are vertically set in the detection shell (1). There are two lifting frames (115) respectively located on two slides (114), and two sets of suction cups (112) are respectively located on the two lifting frames (115); An electrical synchronization controller is set on one side of the two slides (114) and is used to control the synchronous operation of the two slides (114).

5. A semiconductor wafer surface defect detection device according to claim 3, characterized in that, The part-retrieving device (11) also includes a vent pipe (116) and a solenoid valve (117). The vent pipe (116) is located on the upper part of the suction cup (112), and the lower end of the vent pipe (116) is connected to the upper part of the suction cup (112); The solenoid valve (117) is located at the upper end of the vent pipe (116).

6. The semiconductor wafer surface defect detection device according to claim 1, characterized in that, A power supply component (142) for supplying power to the spotlight (13) and the camera (12) is provided on one side of the first rotating ring (14).

7. A semiconductor wafer surface defect detection device according to claim 6, characterized in that, The power supply assembly (142) includes a carbon ring (1421), a carbon brush (1422), a spring (1423), and a conductive sheet (1424). A carbon ring (1421) is disposed on one side of the first rotating ring (14), and the axis of the spring (1423) is collinear with the axis of the first rotating ring (14). The carbon brush (1422) is mounted on the bracket (141) along the axial direction of the first rotating ring (14), and the end of the carbon brush (1422) contacts and slides with the carbon ring (1421); The spring (1423) is arranged between the carbon brush (1422) and the bracket (141) along the axial direction of the first rotating ring (14). The two ends of the spring (1423) are connected to the carbon brush (1422) and the bracket (141) respectively. An insulating sheet is provided between the spring (1423) and the carbon brush (1422). The conductive sheet (1424) is mounted on the bracket (141), and the sidewall of the carbon brush (1422) slides in cooperation with the conductive sheet (1424). The conductive sheet (1424) is electrically connected to the spotlight (13) and the camera (12) respectively.

8. A semiconductor wafer surface defect detection device according to claim 3, characterized in that, A positioning unit (16) is provided on one side of the second rotating ring (111) to detect the state of the second rotating ring (111) after rotation.

9. A semiconductor wafer surface defect detection device according to claim 1, characterized in that, A lead screw (22) and a third rotary drive (23) are also provided in the conveyor housing (2); The lead screw (22) is rotatably disposed in the conveying shell (2) along the arrangement direction of the detection shell (1) and the conveying shell (2), and the lead screw (22) passes through the platform (21) and is threadedly engaged with the platform (21); The third rotary actuator (23) is located at the end of the lead screw (22) and is used to drive the lead screw (22) to rotate.

10. A method for detecting surface defects on a semiconductor wafer, employing the semiconductor wafer surface defect detection equipment according to any one of claims 1-9, characterized in that, The specific process is as follows: S1. Feeding: Place the semiconductor wafer (3) on the stage (21) located in the transport housing (2). The stage (21) moves the semiconductor wafer (3) into the detection housing (1) and stops moving when it reaches directly below the camera (12). S2, First surface detection: The camera (12) rotates around the rotation axis on the upper part of the stage (21), and the height of the camera (12) is always not lower than the upper surface of the stage (21). At the same time, the spotlight (13) is turned on. When the camera (12) rotates around the rotation axis, it takes pictures of the surface of the semiconductor wafer (3) according to the inherent frequency. The movement path formed by the camera (12) when it moves is semi-circular. S3. Flip over. After the first side inspection is completed, the pick-up device (11) rotates from below the stage (21) to above the stage (21) and picks up the semiconductor wafer (3) located on the stage (21). Then the stage (21) is removed from the inspection shell (1). The pick-up device (11) drives the picked-up semiconductor wafer (3) to rotate 180 degrees to complete the flipping. S4, Second side detection, camera (12) repeats the steps in S2; S5. After the test is completed, the pick-up device (11) rotates the semiconductor wafer (3) that has been tested by 180 degrees again, so that the height of the semiconductor wafer (3) is higher than the height of the stage (21). Then the stage (21) extends into the test shell (1) and stops when it is directly below the semiconductor wafer (3). The pick-up device (11) places the semiconductor wafer (3) on the stage (21) and releases it. The stage (21) drives the semiconductor wafer (3) to reset to the conveying shell (2). The staff can then take out the semiconductor wafer (3).

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