A CPO light engine package structure and optical interconnection module

Abstract

This invention relates to the field of optical component technology, and more particularly to a CPO optical engine packaging structure and an optical interconnect module. The CPO optical engine packaging structure includes a first optical engine board, a second optical engine board, an interposer plate, and a heat dissipation device. The interposer plate includes a first region plate and a second region plate that are interconnected. A portion of the first surface of the first optical engine board is detachably connected to the first surface of the first region plate, and a portion of the first surface of the second optical engine board is detachably connected to the second surface of the first region plate. One or more of the first optical engine board, the second optical engine board, and the interposer plate are detachably connected to the heat dissipation device. The heat dissipation device actively dissipates heat from one or more of the first optical engine board, the second optical engine board, and the interposer plate, improving heat dissipation efficiency and avoiding the high temperature conditions caused by the dense components, poor heat dissipation effect, and high heat density of the CPO optical engine packaging structure, thereby improving the reliability and durability of the CPO optical engine packaging structure.

Description

Technical Field

[0001] This invention relates to the field of optical component technology, and in particular to a CPO optical engine packaging structure and an optical interconnect module. Background Technology

[0002] Currently, on-board optical interconnects (mainly Co-Package Optics, or CPO for short) have become the ultimate solution for increasing the switching density of optical switches and GPU servers. Their packaging process solutions are referenced... Figure 8 Among them, the TIA (Trans Impedance Amplifier Chip) is a transimpedance amplifier chip whose core function is to convert input current signals into output voltage signals. Its gain unit is ohms, and it is widely used in optical communication, high-speed circuits in data centers, and sensor systems to achieve signal amplification, noise suppression, and high-speed data transmission. The TSV (Through Silicon Via) chip is a three-dimensional integrated circuit structure that achieves vertical stacking of chips using through-silicon via (TSV) technology. It features high integration, low power consumption, and short interconnect paths. Flip Chip, also known as flip-chip packaging, is a type of chip packaging technology. Fiber Array refers to an optical fiber array. Silicon photonics refers to silicon photonics engineering, which refers to the engineering technology of fabricating optical devices, photonic integrated circuits, and optoelectronic integrated circuits on silicon-based materials, aiming to realize ultra-large capacity information systems by replacing electrons with photons. High-Speed ​​Circuit Board is a circuit board designed for processing high-frequency signals.

[0003] However, the existing CPO optical engine packaging structure has significant technical challenges: First, the existing CPO optical engine packaging structure uses a 3D packaging structure, which is difficult to disassemble and reassemble in layers, thus making it impossible to repair and requiring complete replacement; Second, due to the dense components, poor heat dissipation, and high heat density, the CPO optical engine packaging structure operating at room temperature will generate temperatures exceeding 85 degrees Celsius, which will have a significant impact on the reliability of the product. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a CPO optical engine packaging structure and an optical interconnect module.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the CPO optical engine packaging structure of the present invention includes a first optical engine board, a second optical engine board, an intermediate board, and a heat dissipation device.

[0008] The intermediate plate includes a first area plate and a second area plate that are connected to each other. A portion of the first surface of the first light engine plate is detachably connected to the first surface of the first area plate, and a portion of the first surface of the second light engine plate is detachably connected to the second surface of the first area plate. The first surface and the second surface of the intermediate plate are a pair of opposing surfaces.

[0009] One or more of the first light engine board, the second light engine board, and the intermediate board are detachably connected to the heat dissipation device.

[0010] Optionally, the heat dissipation device is located between the first light engine board and the second light engine board, and another part of the first side of the first light engine board and the second light engine board is detachably connected to the part of the heat dissipation device located between the first light engine board and the second light engine board.

[0011] Optionally, the heat dissipation device is located between the first light engine board and the second light engine board, and another part of the first side of the first light engine board and the second light engine board is detachably connected to the part of the heat dissipation device located between the first light engine board and the second light engine board, and the first area board is detachably connected to the part of the heat dissipation device located between the first light engine board and the second light engine board.

[0012] Optionally, the heat dissipation device includes a heat exchange section and a heat dissipation section, and the heat exchange section and the heat dissipation section are connected in a plate-like structure;

[0013] The heat exchange section is located between the first light engine plate and the second light engine plate, and the other part of the first side of the first light engine plate and the second light engine plate are detachably connected to the heat exchange section.

[0014] The end face of the first area plate is detachably connected to the heat exchange section.

[0015] Optionally, the heat exchange section and the heat dissipation section are connected in a T-shaped plate structure;

[0016] The heat exchange section is located between the first light engine plate and the second light engine plate. The other part of the first side of the first light engine plate and the second light engine plate is detachably connected to the heat exchange section. The end face of the first light engine plate and the second light engine plate is detachably connected to the heat dissipation section.

[0017] The end face of the first area plate is detachably connected to the heat exchange section.

[0018] Optionally, the heat dissipation section and / or the heat exchange section are provided with a medium flow channel, and the heat dissipation section is provided with a heat exchange medium inlet and a heat exchange medium outlet, both of which are connected to the medium flow channel.

[0019] Optionally, the area of ​​the first light engine board and the second light engine board connected to the intermediate plate is smaller than the area connected to the heat dissipation device.

[0020] Optionally, both the first light engine board and the second light engine board are connected to the heat dissipation device by metal adhesive.

[0021] Optionally, the second side of the first optical engine board is provided with Tx & Rx optical devices, a driver chip, and a TIA chip;

[0022] The second side of the second optical engine board is provided with a CPO Engine power chip, an MCU controller, an I2C interface, and an SPI interface.

[0023] Optionally, the first surface of the first light engine board, the first surface of the second light engine board, and the second surface of the first area board are connected by an inverted connection.

[0024] Optionally, the first and / or second surfaces of the second region plate are provided with multiple welding points.

[0025] Furthermore, the present invention also provides an optical interconnect module, which includes a motherboard and multiple CPO optical engine packaging structures as described above;

[0026] Multiple CPO optical engine packaging structures are arranged sequentially along the outer periphery of the motherboard, and the first side of the second area board of the interposer is connected to the flip-chip back of the motherboard.

[0027] (III) Beneficial Effects

[0028] A portion of the first surface of the first light engine board is detachably connected to the first surface of the first area board. Similarly, a portion of the first surface of the second light engine board is detachably connected to the second surface of the first area board. The first and second surfaces of the intermediary board are a pair of opposing surfaces, facilitating the assembly and disassembly of the first and second light engine boards, improving the feasibility and convenience of maintenance and replacement, and reducing operating costs. The first and second light engine boards are arranged opposite each other and spaced a predetermined distance apart. The first area board of the intermediary board connects between the first and second light engine boards, enabling interconnection between them. The detachable connection method can be soldering. The first and second light engine boards are symmetrically arranged with the intermediary board, making the CPO light engine packaging structure more regular and avoiding excessive installation space occupation. One or more of the first light engine board, second light engine board, and intermediary board are detachably connected to a heat dissipation device. The heat dissipation device actively dissipates heat from one or more of the first light engine board, second light engine board, and intermediary board, improving heat dissipation efficiency and avoiding high temperatures caused by dense components, poor heat dissipation, and high heat density in the CPO light engine packaging structure. This improves the reliability and durability of the CPO light engine packaging structure, further reducing operating costs. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the CPO optical engine packaging structure of the present invention;

[0030] Figure 2 This is a schematic diagram of a first embodiment of the CPO optical engine packaging structure of the present invention;

[0031] Figure 3 This is a schematic diagram of a second embodiment of the CPO optical engine packaging structure of the present invention;

[0032] Figure 4 This is a schematic diagram of a third embodiment of the CPO optical engine packaging structure of the present invention;

[0033] Figure 5 This is a schematic diagram of a fourth embodiment of the CPO optical engine packaging structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the heat exchange medium inlet and outlet of the CPO light engine packaging structure of the present invention;

[0035] Figure 7 This is a schematic diagram of the optical interconnect module of the present invention;

[0036] Figure 8 This is a conventionally defined CPO engine process scheme.

[0037] [Explanation of Labels in the Attached Image]

[0038] 1: First light engine board;

[0039] 2: Second light engine board;

[0040] 3: Intermediate board; 31: First area board; 32: Second area board; 321: Welding point;

[0041] 4: Heat dissipation device; 41: Heat exchange section; 42: Heat dissipation section; 421: Heat exchange medium inlet; 422: Heat exchange medium outlet;

[0042] 5: Motherboard. Detailed Implementation

[0043] To better explain and facilitate understanding of the present invention, a detailed description of the invention is provided below with reference to the accompanying drawings and specific embodiments. In this document, directional terms such as "upper," "lower," etc., are used interchangeably with respect to... Figure 1 The orientation is used as a reference.

[0044] While exemplary embodiments of the invention are shown in the accompanying drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention can be understood more clearly and thoroughly, and that the scope of the invention can be fully conveyed to those skilled in the art.

[0045] This invention provides a CPO optical engine packaging structure that integrates the optical engine with an electrical chip, thereby improving the transmission rate and integration of the optical engine while reducing power consumption and cost.

[0046] like Figure 1As shown, the CPO light engine packaging structure includes a first light engine board 1, a second light engine board 2, an intermediate board 3, and a heat dissipation device 4. The intermediate board 3 includes a first region board 31 and a second region board 32 connected to each other. Preferably, the intermediate board 3 is a single-plate structure; however, this invention divides the intermediate board 3 into the first region board 31 and the second region board 32. A portion of the first surface of the first light engine board 1 is detachably connected to the first surface of the first region board 31. Similarly, a portion of the first surface of the second light engine board 2 is detachably connected to the second surface of the first region board 31. The first and second surfaces of the intermediate board 3 are a pair of opposing surfaces, facilitating the assembly and disassembly of the first light engine board 1 and the second light engine board 2, improving the feasibility and convenience of maintenance and replacement, and reducing usage costs. The first light engine board 1 and the second light engine board 2 are arranged opposite each other and spaced a predetermined distance apart. The first region board 31 of the intermediate board 3 connects the first light engine board 1 and the second light engine board 2, realizing the interconnection of the first light engine board 1 and the second light engine board 2. The detachable connection method can be soldering. The first light engine board 1 and the second light engine board 2 are symmetrically arranged with an intermediary plate 3, making the CPO light engine packaging structure more regular and avoiding excessive installation space occupation. One or more of the first light engine board 1, the second light engine board 2, and the intermediary plate 3 are detachably connected to the heat dissipation device 4. The heat dissipation device 4 actively dissipates heat from one or more of the first light engine board 1, the second light engine board 2, and the intermediary plate 3, improving heat dissipation efficiency and avoiding high temperature conditions caused by dense components, poor heat dissipation, and high heat density in the CPO light engine packaging structure. This improves the reliability and durability of the CPO light engine packaging structure, thereby further reducing the cost of use.

[0047] Example 1, as Figure 2 As shown, a portion of the heat dissipation device 4 is positioned between the first light engine board 1 and the second light engine board 2 for heat exchange. The portion of the heat dissipation device 4 located outside the areas of the first and second light engine boards 1 and 2 is used for heat dissipation, which can employ finned cooling, liquid cooling, or air cooling. On the first surface of the first and second light engine boards 1 and 2, the portion connected to the intermediate plate 3 is the connecting area, and the portion not connected to the intermediate plate 3 is the heat dissipation area. The heat dissipation area is detachably connected to the portion of the heat dissipation device 4 located between the first and second light engine boards 1 and 2. The first light engine board 1, intermediate plate 3, and second light engine board 2 are stacked sequentially to form a three-layer board structure, improving the integration of the CPO light engine packaging structure and effectively reducing the structure's volume. The first light engine board 1, the heat dissipation device 4, and the second light engine board 2 are stacked and connected in sequence to form a three-layer board structure, which increases the heat exchange area between the heat dissipation device 4 and the light engine board. The heat dissipation device 4 also dissipates heat for the first light engine board 1 and the second light engine board 2 at the same time, which effectively improves the heat dissipation efficiency and avoids damage to the CPO light engine packaging structure due to high temperature.

[0048] Example 2, as Figure 3 As shown, similar to Embodiment 1, a portion of the heat dissipation device 4 is positioned between the first light engine board 1 and the second light engine board 2 for heat exchange. The portion of the heat dissipation device 4 located outside the areas of the first and second light engine boards 1 and 2 is used for heat dissipation, which can employ finned cooling, liquid cooling, or air cooling. On the first surface of the first and second light engine boards 1 and 2, the portion connected to the intermediate plate 3 is the connecting area, and the portion not connected to the intermediate plate 3 is the heat dissipation area. The heat dissipation area is detachably connected to the portion of the heat dissipation device 4 located between the first and second light engine boards 1 and 2. The first light engine board 1, intermediate plate 3, and second light engine board 2 are stacked sequentially to form a three-layer board structure, improving the integration of the CPO light engine packaging structure and effectively reducing the structure's volume. The first light engine board 1, the heat dissipation device 4, and the second light engine board 2 are stacked and connected in sequence to form a three-layer board structure. This increases the heat exchange area between the heat dissipation device 4 and the light engine board, and the heat dissipation device 4 simultaneously dissipates heat from both the first and second light engine boards 1 and 2, effectively improving heat dissipation efficiency and preventing damage to the CPO light engine packaging structure due to high temperatures. Furthermore, the first area plate 31 of the interposer plate 3 is also detachably connected to the portion of the heat dissipation device 4 located between the first and second light engine boards 1 and 2. While the heat dissipation device 4 exchanges heat with the first and second light engine boards 1 and 2, it also exchanges heat with the interposer plate 3, further improving heat dissipation efficiency based on the first embodiment, thereby providing better cooling for the CPO light engine packaging structure.

[0049] Example 3, as Figure 4 As shown, the heat dissipation device 4 includes a heat exchange section 41 and a heat dissipation section 42, which are connected in a plate-like structure. Preferably, the heat exchange section 41 and the heat dissipation section 42 are an integral plate-like structure, which facilitates placement between the first light engine plate 1 and the second light engine plate 2 and close mounting to both, thereby increasing the heat exchange effect. Specifically, the heat exchange section 41 is located between the first light engine plate 1 and the second light engine plate 2. The other part of the first surface of the first light engine plate 1 and the second light engine plate 2 are detachably connected to the heat exchange section 41, realizing efficient heat exchange between the first light engine plate 1 and the second light engine plate 2 and the heat exchange section 41. Furthermore, the end face of the first area plate 31 is detachably connected to the heat exchange section 41, which effectively reduces the volume of the CPO light engine packaging structure while ensuring that the first area plate 31 can exchange heat with the heat exchange section 41. The heat exchange section 41 connects to and exchanges heat with the heat dissipation section 42, carrying away the heat absorbed in the heat exchange section 41.

[0050] Example 4, as Figure 5As shown, the thickness of the heat dissipation part 42 is greater than the thickness of the heat exchange part 41, and the heat exchange part 41 and the heat dissipation part 42 are connected in a T-shaped plate structure. Similar to Embodiment 3, the heat exchange part 41 and the heat dissipation part 42 are preferably an integral structure, in the form of a plate, so as to be disposed between the first light engine plate 1 and the second light engine plate 2 and installed close to both of them, thereby increasing the heat exchange effect. Specifically, the heat exchange part 41 is located between the first light engine plate 1 and the second light engine plate 2, and the other part of the first surface of the first light engine plate 1 and the second light engine plate 2 are detachably connected to the heat exchange part 41, so as to realize efficient heat exchange between the first light engine plate 1 and the second light engine plate 2 and the heat exchange part 41. In addition, the end face of the first area plate 31 is detachably connected to the heat exchange part 41, which effectively reduces the volume of the CPO light engine packaging structure while ensuring that the first area plate 31 can exchange heat with the heat exchange part 41. The heat exchange part 41 is connected to the heat dissipation part 42 and exchanges heat, carrying away the heat absorbed in the heat exchange part 41. Furthermore, the end faces of the first light engine board 1 and the second light engine board 2 are detachably connected to the portion of the heat dissipation part 42 that protrudes from the heat exchange part 41. The heat dissipation part 42 dissipates heat from the first light engine board 1 and the second light engine board 2, further improving the heat dissipation efficiency. It also forms a mortise and tenon-like structure between the heat dissipation device 4, the first light engine board 1 and the second light engine board 2, making the connection more stable and reliable and reducing the difficulty of installation.

[0051] Preferably, the present invention employs a liquid-cooled heat dissipation structure, and a medium flow channel is provided within the heat dissipation section 42 and / or the heat exchange section 41, such as... Figure 6 As shown, the heat dissipation section 42 is provided with a heat exchange medium inlet 421 and a heat exchange medium outlet 422. Both the heat exchange medium inlet 421 and the heat exchange medium outlet 422 are connected to the medium flow channel. The medium flow channel is provided with circulating heat exchange medium to improve the effect of active heat dissipation and to cope with extreme high temperature conditions.

[0052] In a specific implementation, the heat exchange section 41 has multiple heat exchange channels internally, which are connected in series or parallel. The heat dissipation section 42 has multiple heat dissipation channels internally, which are also connected in series or parallel. Both the heat dissipation channels and the heat exchange channels can be channels with multiple S-shaped bends connected sequentially, or they can be straight channels or spiral channels. The heat dissipation channels are connected to the heat exchange channels. One end of the heat exchange medium inlet 421 and the heat exchange medium outlet 422 are respectively connected to the inlet and outlet of the heat dissipation channel. The other end of the heat exchange medium inlet 421 and the heat exchange medium outlet 422 are connected to a circulation pump. The circulation pump drives the heat exchange medium to circulate. The medium absorbs heat in the heat exchange channel through the heat exchange section 41 and then enters the heat dissipation channel, where it dissipates heat into the air through the heat dissipation section 42. It then re-enters the heat exchange channel, repeating the cycle of heat exchange. The heat exchange medium can be water, a mixture of ethanol and water, etc. To improve heat dissipation efficiency, an external auxiliary radiator can be installed. The heat exchange medium outlet 422, the circulating pump, the auxiliary radiator, and the heat exchange medium inlet 421 are connected in sequence. The heat dissipation efficiency can be effectively improved through the auxiliary radiator.

[0053] like Figures 1 to 5 As shown, the area of ​​the intermediate plate 3 connecting the first light engine board 1 and the second light engine board 2 is smaller than the area connecting the heat dissipation device 4. While ensuring the interconnection of the first light engine board 1 and the second light engine board 2, the heat exchange area is increased as much as possible to improve the heat exchange efficiency and thus improve the heat dissipation effect.

[0054] Preferably, the first light engine board 1 and the second light engine board 2 are connected to the heat dissipation device 4 by metal glue, which facilitates layered assembly and disassembly and avoids air pockets between the first light engine board 1 and the second light engine board 2 and the heat dissipation device 4, thus avoiding affecting the heat exchange efficiency.

[0055] like Figure 1 As shown, the second side of the first optical engine board 1 is equipped with Tx & Rx optical devices, a driver chip, and a TIA chip. The Tx & Rx optical devices, driver chip, and TIA chip transmit signals to the first optical engine board 1 via a hard-connected socket. Compared to a TSV design, this reduces process complexity and industrialization difficulty, thereby lowering production costs. The second side of the second optical engine board 2 is equipped with a CPO Engine power chip, an MCU controller, an I2C interface, and an SPI interface.

[0056] In a preferred embodiment, the first surface of the first optical engine board 1, the first surface of the second optical engine board 2, and the second surface of the first area board 31 are connected by an inverted connection, which can shorten the signal line transmission distance, avoid the use of wirebonding for signal transmission, and achieve better data transmission.

[0057] like Figure 1 As shown, the first and / or second sides of the second area board 32 are provided with multiple solder points 321, which are soldered to the motherboard 5 of the optical interconnect module through tinning, thereby realizing the installation of the CPO optical engine package structure and the communication between the CPO optical engine package structure and the motherboard 5.

[0058] The present invention also provides an optical interconnect module, such as Figure 7 As shown, the optical interconnect module includes a motherboard 5 and multiple CPO optical engine package structures. The multiple CPO optical engine package structures are arranged sequentially along the outer periphery of the motherboard 5. The first surface of the first area board 31 of the interposer 3 is flip-chip connected to the back of the motherboard 5, allowing for convenient assembly and disassembly and reliable connection.

[0059] In the description of this invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0060] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0061] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "over," or "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0062] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0063] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A CPO optical engine packaging structure, characterized in that, The CPO light engine packaging structure includes a first light engine board (1), a second light engine board (2), an intermediate board (3), and a heat dissipation device (4). The intermediate plate (3) includes a first area plate (31) and a second area plate (32) that are connected to each other. A portion of the first surface of the first light engine plate (1) is detachably connected to the first surface of the first area plate (31), and a portion of the first surface of the second light engine plate (2) is detachably connected to the second surface of the first area plate (31). The first surface and the second surface of the intermediate plate (3) are a pair of opposing surfaces. One or more of the first light engine board (1), the second light engine board (2), and the intermediate board (3) are detachably connected to the heat dissipation device (4); The first area plate (31) of the intermediary plate (3) is connected between the first light engine plate (1) and the second light engine plate (2). The first light engine plate (1), the intermediary plate (3) and the second light engine plate (2) are stacked and connected in sequence to form a three-layer plate structure, thereby realizing the interconnection between the first light engine plate (1) and the second light engine plate (2). The first and / or second sides of the second area board (32) are provided with multiple solder points (321), which are soldered to the motherboard (5) of the optical interconnect module by tinning, so as to realize the installation of the CPO optical engine packaging structure and the communication between the CPO optical engine packaging structure and the motherboard (5). The heat dissipation device (4) is located between the first light engine board (1) and the second light engine board (2). Another part of the first side of the first light engine board (1) and the second light engine board (2) is detachably connected to the part of the heat dissipation device (4) located between the first light engine board (1) and the second light engine board (2). The first area plate (31) is detachably connected to the part of the heat dissipation device (4) located between the first light engine board (1) and the second light engine board (2).

2. The CPO optical engine packaging structure as described in claim 1, characterized in that, The heat dissipation device (4) is located between the first light engine board (1) and the second light engine board (2), and another part of the first side of the first light engine board (1) and the second light engine board (2) is detachably connected to the part of the heat dissipation device (4) located between the first light engine board (1) and the second light engine board (2).

3. The CPO optical engine packaging structure as described in claim 1 or 2, characterized in that, The heat dissipation device (4) includes a heat exchange section (41) and a heat dissipation section (42), which are connected in a plate-like structure. The heat exchange section (41) is located between the first light engine plate (1) and the second light engine plate (2), and the other part of the first side of the first light engine plate (1) and the second light engine plate (2) are detachably connected to the heat exchange section (41). The end face of the first area plate (31) is detachably connected to the heat exchange part (41).

4. The CPO optical engine packaging structure as described in claim 3, characterized in that, The heat exchange section (41) and the heat dissipation section (42) are connected in a T-shaped plate structure; The heat exchange section (41) is located between the first light engine plate (1) and the second light engine plate (2). The other part of the first side of the first light engine plate (1) and the second light engine plate (2) are detachably connected to the heat exchange section (41). The end face of the first light engine plate (1) and the second light engine plate (2) are detachably connected to the heat dissipation section (42). The end face of the first area plate (31) is detachably connected to the heat exchange part (41).

5. The CPO optical engine packaging structure as described in claim 4, characterized in that, The heat dissipation section (42) and / or the heat exchange section (41) are provided with a medium flow channel. The heat dissipation section (42) is provided with a heat exchange medium inlet (421) and a heat exchange medium outlet (422). Both the heat exchange medium inlet (421) and the heat exchange medium outlet (422) are connected to the medium flow channel.

6. The CPO optical engine packaging structure as described in claim 1 or 2, characterized in that, The area of ​​the first light engine board (1) and the second light engine board (2) connected to the intermediate board (3) is smaller than the area connected to the heat dissipation device (4).

7. The CPO optical engine packaging structure as described in claim 1 or 2, characterized in that, The first light engine board (1) and the second light engine board (2) are connected to the heat dissipation device (4) by metal glue.

8. The CPO optical engine packaging structure as described in claim 1, characterized in that, The second side of the first optical engine board (1) is provided with Tx & Rx optical devices, a driver chip and a TIA chip; The second side of the second light engine board (2) is provided with a CPO Engine power chip, an MCU controller, an I2C interface and an SPI interface.

9. The CPO optical engine packaging structure as described in claim 1, characterized in that, The first surface of the first light engine board (1), the first surface of the second light engine board (2), and the second surface of the first area board (31) are connected by an inverted connection.

10. An optical interconnect module, characterized in that, The optical interconnect module includes a motherboard (5) and multiple CPO optical engine packaging structures as described in any one of claims 1-8; Multiple CPO optical engine packaging structures are arranged sequentially along the outer periphery of the motherboard (5), and the first side of the second area board (32) of the intermediate board (3) is flip-chip connected to the back side of the motherboard (5).

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