Three-dimensional nanometer pickup coil and manufacturing method thereof

Abstract

The application relates to a three-dimensional nanometer pickup coil and a manufacturing method thereof. The method for manufacturing the three-dimensional nanometer pickup coil comprises the following steps: forming a probe structure, wherein the probe structure comprises a needle body and a needle tip, the needle tip is arranged at one end of the needle body in an extension direction; forming a conductive material layer wrapping the probe structure; and forming a first coil wound around the needle body based on the conductive material layer through a focused ion beam rotation etching process. The method can manufacture a three-dimensional nanometer pickup coil with nanometer resolution.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of nanotechnology and electromagnetic induction measurement, and particularly to a three-dimensional nanometer pickup coil and a manufacturing method thereof. BACKGROUND

[0002] Electromagnetic induction mutual inductance technology is widely used in superconducting thin film critical current detection, magnetic measurement system and other fields. The core principle of electromagnetic induction mutual inductance technology is to detect the alternating magnetic field generated by the sample or the response of the sample to the driving magnetic field through an induction coil.

[0003] The current technical solution generally uses a mechanically wound pickup coil for electromagnetic induction measurement. However, due to the size limitation of the mechanically wound pickup coil, the spatial resolution of this technical solution is usually in the millimeter level. With the development of technology, the size of the sample to be measured is reduced from millimeter, micrometer level to nanometer level. The resolution of the pickup coil of the traditional technology is insufficient, and it is difficult to further meet the measurement requirements.

[0004] There is still a lack of a system that can achieve high spatial resolution electromagnetic induction measurement at the nanometer scale. SUMMARY

[0005] Therefore, it is necessary to provide a three-dimensional nanometer pickup coil and a manufacturing method thereof in view of at least one of the above problems.

[0006] In a first aspect, the present application provides a method for manufacturing a three-dimensional nanometer pickup coil, the method comprising: forming a probe structure, wherein the probe structure comprises a needle body and a needle tip, the needle tip being arranged at one end of the needle body in the extension direction; forming a conductive material layer wrapping the probe structure; and forming a first coil wound around the needle body based on the conductive material layer through a focused ion beam rotation etching process.

[0007] By arranging the probe structure, the conductive material layer can be provided with a shaped form during processing for supporting the first coil. The focused ion beam can etch the nanometer-level first coil, and the rotation etching process ensures that the first coil structure shape is available. In addition, the needle tip of the formed probe structure is suitable for contacting the sample, ensuring that the first coil is close enough to the sample. The method provided by the embodiments of the present application can manufacture a three-dimensional nanometer pickup coil with nanometer-level resolution, which can be used for electromagnetic detection of small-size superconducting thin films and the like, and can also be used for topography and electromagnetic composite detection.

[0008] In some embodiments, the step of forming the probe structure comprises: processing a polymer precursor through a laser direct writing process.

[0009] In this way, the probe structure has a precise shape and good performance.

[0010] In some embodiments, the step of forming the probe structure comprises processing the semiconductor material precursor by a photolithography process and an etching process.

[0011] In this way, the probe structure is easy to manufacture.

[0012] In some embodiments, the method for manufacturing the three-dimensional nanometer pickup coil further comprises forming an insulating layer covering the first coil. Illustratively, the method further comprises forming a second coil wound outside the insulating layer.

[0013] In this way, the first coil is protected by the insulating layer, improving the use reliability and service life of the three-dimensional nanometer pickup coil. The insulating layer can isolate the first coil and the second coil, achieve more turns in a small scale, and improve the electromagnetic induction capacity of the three-dimensional nanometer pickup coil.

[0014] In some embodiments, the step of forming the conductive material layer comprises growing a metal material, and the thickness of the conductive material layer ranges from 10 nm to 500 nm. The step of forming the insulating layer comprises growing silicon dioxide, and the thickness of the insulating layer ranges from 10 nm to 500 nm.

[0015] In this way, the first coil has good electrical conductivity and stable structure; the insulating layer can effectively fill between the two turns of the winding, ensure the performance of the first coil, and protect the first coil from accidental contact with external structures, reducing the risk of short circuit of the winding.

[0016] In a second aspect, the present application provides a three-dimensional nanometer pickup coil, comprising: a probe structure comprising a needle body and a needle tip, the needle tip being arranged at one end of the needle body in the extension direction, the length of the probe structure ranging from 5 μm to 100 μm; and a first coil attached and wound around the needle body, the number of turns of the coil ranging from 10 turns to 500 turns.

[0017] By arranging the micron-level probe structure, the structural strength and the size of the needle tip are ensured to be small; the first coil with sufficient number of turns is attached and wound around the needle body, the first coil can be made based on a micro-nano processing process, which can reliably act with the needle body and sensitively detect. The three-dimensional nanometer pickup coil provided by the present application has high resolution and can precisely detect structures in nanometer scale; in addition, the three-dimensional nanometer pickup coil can be used for synchronous electromagnetic induction and direct contact.

[0018] In some embodiments, the line width of the first coil ranges from 5 nm to 100 nm, and the line spacing of the first coil ranges from 5 nm to 100 nm.

[0019] In this way, the structural strength and inductance performance of the first coil can be ensured, and the required number of turns can be achieved.

[0020] Thirdly, this application provides a measurement system comprising: a three-dimensional nanopickup coil, wherein the three-dimensional nanopickup coil is a three-dimensional nanopickup coil manufactured according to the steps of the aforementioned method or the aforementioned three-dimensional nanopickup coil; an induction signal processing circuit electrically connected to the three-dimensional nanopickup coil; a displacement sensing device for sensing the displacement of the three-dimensional nanopickup coil along its extension direction; and a support device disposed opposite to the three-dimensional nanopickup coil for supporting a sample.

[0021] By setting up a three-dimensional nanoparticle pickup coil, direct contact and electromagnetic induction of micro-nano structures can be achieved. The morphology of the sample and electromagnetic properties can be detected and analyzed by the induction signal processing circuit and displacement sensing device, respectively. The support device ensures the scanning action of the three-dimensional nanoparticle pickup coil relative to the sample.

[0022] In some embodiments, the measurement system further includes: a proportional-integral-differential controller and an excitation device, the excitation device being used to excite the sample, the proportional-integral-differential controller being electrically connected to the support device and the displacement sensing device respectively; the displacement sensing device includes a tuning fork connected to the needle body, a driving circuit and a reading circuit disposed on the tuning fork, and a phase-locked loop electrically connected to the driving circuit and the reading circuit; the sensing signal processing circuit includes: a preamplifier and a lock-in amplifier.

[0023] This setup allows for sample excitation; broadens the applicability of the measurement system; and enables the processing of weak signals, achieving high-resolution, fine analysis.

[0024] Fourthly, this application provides a measurement method comprising: scanning a sample using a three-dimensional nanopickup coil manufactured according to the steps of the aforementioned method, or the aforementioned three-dimensional nanopickup coil, or the aforementioned measurement system; obtaining an electromagnetic induction signal of the sample; and obtaining morphological information of the sample.

[0025] By using a three-dimensional nano-pickup coil for scanning, electromagnetic induction signals can be obtained at high resolution; in addition, the morphological information of the sample can be obtained simultaneously, which is beneficial for more comprehensive and accurate detection and analysis of the sample. Attached Figure Description

[0026] Figure 1 This is a schematic flowchart of a method for manufacturing a three-dimensional nanopickup coil according to one or more embodiments;

[0027] Figure 2 A schematic cross-sectional view of a three-dimensional nanopickup coil according to one or more embodiments;

[0028] Figure 3 A schematic cross-sectional view of a three-dimensional nanopickup coil according to one or more embodiments;

[0029] Figure 4 A schematic cross-sectional view of a three-dimensional nanopickup coil according to one or more embodiments;

[0030] Figure 5 This is a schematic structural block diagram of a measurement system according to one or more embodiments;

[0031] Figure 6 This is a schematic flowchart of a measurement method according to one or more embodiments.

[0032] Explanation of reference numerals in the attached diagram: 1. Probe structure; 11. Needle body; 12. Needle tip; 2. First coil; 3. Insulating layer; 4. Second coil; 5. Base;

[0033] 1000 Measurement system; 1100 Three-dimensional nano-pickup coil; 1200 Induction signal processing circuit; 1201 Preamplifier; 1202 Lock-in amplifier; 1300 Displacement sensing device; 1301 Tuning fork; 1302 Drive circuit; 1303 Readout circuit; 1304 Phase-locked loop; 1400 Bearing device; 1401 Coarse adjustment displacement stage; 1402 Fine scanning displacement stage; 1500 Proportional-integral-derivative controller; 1600 Excitation device; 1601 Excitation coil; 1602 Excitation source. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. For example, a first coil may also be referred to as a second coil, and a second coil may also be referred to as a first coil. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a flexible connection or a rigid connection along at least one direction; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or a direct connection with an intermediate medium present; and they can also refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. The terms "installed," "set," "fixed," etc., can be broadly understood as connection. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0039] As used in this application, the terms "layer" and "region" refer to a material portion comprising a defined area and having a defined thickness. A layer can extend horizontally, vertically, and / or along a conical surface. A layer can be a region of uniform or non-uniform continuous structure, and its thickness perpendicular to the direction of extension may not exceed the thickness of the continuous structure. A layer can comprise multiple layers, which can be stacked layers or discretely extending layers. The shapes of the various regions and layers in the accompanying drawings, as well as their relative sizes and positional relationships, are merely illustrative and may deviate from actual dimensions due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0040] refer to Figure 1 , Figure 1The flowchart of a method for manufacturing a three-dimensional nanopickup coil according to an embodiment of this application is shown. In an exemplary embodiment, the method 100 for manufacturing a three-dimensional nanopickup coil may include steps S101 to S103.

[0041] Step S101, forming probe structure 1, reference Figure 2 The three-dimensional nanoparticle pickup coil 1100 in the illustrated embodiment is shown. For ease of description, a spatial rectangular coordinate system XYZ is established. The probe structure 1 includes a needle body 11 and a needle tip 12. The extension direction of the needle body 11 is approximately along the Z-axis. The needle tip 12 is disposed at one end of the needle body 11 along the extension direction.

[0042] Step S102: Forming a conductive material layer encapsulating the probe structure 1. The material of the probe structure 1 may include a semiconductor material or an insulating material. The conductive material layer may be attached to the probe structure 1. The probe structure 1 is capable of providing a shaped form for the conductive material layer during processing, generally a cylindrical shape.

[0043] In step S103, a first coil 2 is formed around the needle body 11 based on a conductive material layer using a focused ion beam spin etching process. The conductive material outside the needle tip 12 can be removed. Alternatively, the portion of the probe structure 1 protruding from the first coil 2 can be considered the needle tip 12. The focused ion beam can be used to etch the nanoscale first coil 2, and the spin etching process ensures the usability of the structural shape of the first coil 2.

[0044] The method 100 for manufacturing a three-dimensional nanopickup coil according to the embodiments of this application can manufacture a nanoscale three-dimensional nanopickup coil 1100. The tip 12 of the formed probe structure 1 is suitable for contacting the sample, ensuring that the first coil 2 is sufficiently close to the sample. It can be used for electromagnetic detection of small-sized superconducting thin films, and can also be used for morphology and electromagnetic composite detection.

[0045] For example, step S101 includes processing a polymer precursor of the photosensitive material using a laser direct-writing process to obtain a probe structure 1 of polymer material. The laser direct-writing process is controllable and produces a well-defined three-dimensional structure. Specifically, high-precision processing can be achieved through two-photon polymerization three-dimensional nanoprinting, which helps to ensure the performance of the probe structure 1.

[0046] Exemplarily, step S101 includes processing a semiconductor material precursor using photolithography and etching processes. The semiconductor material precursor may be made of silicon or quartz. Photolithography can be performed first, followed by etching. Wet etching, dry etching, or a combination thereof can be used to obtain the probe structure 1 of the desired shape. The probe structure 1 is easy to manufacture using semiconductor processes and is conducive to mass production.

[0047] The probe structure 1 can be a single, integrated structure. Alternatively, the probe structure 1 can be segmented or layered. For example, the probe body 11 can be formed using photolithography and etching processes, while the probe tip 12 can be formed using laser direct writing. For instance, a semiconductor process can be used to form the core, followed by the fabrication of a cover layer that encloses the core.

[0048] The steps for forming a conductive material layer include: growing a metallic material. At least one of gold, niobium, and platinum can be grown. For example, a single layer of niobium can be grown. Alternatively, two metallic layers can be grown, with the inner layer having stronger adhesion and the outer layer exhibiting good conductivity. The thickness of the conductive material layer ranges from 10 nm to 500 nm.

[0049] A first coil 2 is obtained by focusing an ion beam to process a conductive material layer. When the probe structure 1 is an axisymmetric structure, for example... Figure 2 When the needle body 11 is roughly cylindrical, it is easier to use an axisymmetric rotational etching process to create grooves to separate adjacent windings. The first coil 2 is roughly helical and wound around the needle body 11. Focused ion beam technology can precisely control the number of turns, line width, line spacing, and overall three-dimensional morphology of the first coil 2.

[0050] The thickness of the conductive material layer can range from 10 nm to 500 nm. For example, the thickness of the first coil 2 ranges from 50 nm to 100 nm, such as 60 nm or 80 nm. The depth of the trench can be greater than its width.

[0051] The linewidth of the first coil 2 can range from 5 nm to 100 nm. For example, the linewidth of the first coil 2 can range from 20 nm to 50 nm, such as 30 nm or 40 nm, which can have better strength and achieve denser winding.

[0052] The wire spacing of the first coil 2 ranges from 5 nm to 100 nm, which ensures insulation performance while achieving a relatively dense winding. For example, the wire spacing of the first coil 2 ranges from 20 nm to 50 nm, such as 30 nm or 40 nm. The wire spacing can be the same as or different from the wire width.

[0053] The first coil 2 has good structural strength and good inductance performance. The number of turns of the first coil 2 ranges from 10 to 500 turns, and exemplarily, from 50 to 200 turns.

[0054] Combination Figure 3 As shown, the method 100 for manufacturing a three-dimensional nanopickup coil may further include step S104, forming an insulating layer 3. The insulating layer 3 can cover the first coil 2, protecting the first coil 2, preventing accidental contact between the first coil 2 and external structures, reducing the risk of short circuits in the winding, and improving the reliability and lifespan of the three-dimensional nanopickup coil 1100.

[0055] The material of the needle body 11 is designed to prevent the first coil 2 from short-circuiting. Exemplarily, an insulating layer 3 may also be formed around the needle body 11 before the first coil 2 is formed.

[0056] The step of forming the insulating layer 3 may include: growing silicon dioxide, wherein the thickness of the insulating layer 3 may range from 10 nm to 500 nm. For example, the thickness of the insulating layer 3 may range from 50 nm to 100 nm. The insulating layer 3 can effectively fill the space between two turns of the winding, effectively preventing short circuits in the first coil 2 and protecting the first coil 2.

[0057] The method 100 for manufacturing a three-dimensional nanopickup coil may further include step S105, forming a second coil 4 wound around an insulating layer 3. The insulating layer 3 can isolate the first coil 2 and the second coil 4, achieving a greater number of turns on a smaller scale and improving the electromagnetic induction capability of the three-dimensional nanopickup coil 1100. A second insulating layer may also be formed covering the second coil 4, in which case the insulating layer 3 may be referred to as the first insulating layer.

[0058] Multi-layered coils can be connected in series. For ease of external connection, the beginning and end of the first coil 2 can be slightly wider or continuous. (Reference) Figure 3 The two nested and connected coils are used as a whole for external connection at both ends, which can be located on the part of the needle body 11 away from the needle tip 12, and can be made into a larger area.

[0059] refer to Figure 4 , Figure 3 and Figure 2 This application provides a three-dimensional nanoparticle pickup coil 1100. The three-dimensional nanoparticle pickup coil 1100 can be manufactured by the steps of the aforementioned method. The three-dimensional nanoparticle pickup coil 1100 may include a probe structure 1 and a first coil 2.

[0060] The probe structure 1 includes a needle body 11 and a needle tip 12. The needle tip 12 is located at one end of the needle body 11 along the extending direction. The needle tip 12 can be tapered, with the tip pointing away from the needle body 11 along the extending direction. The maximum outer diameter of the needle tip 12 can be different from the outer diameter of the needle body 11.

[0061] refer to Figure 2 The needle body 11 can be cylindrical, and the needle tip 12 can be conical; the two can be coaxially arranged. (Reference) Figure 4 The probe structure 1 can be conical, the part protruding from the first coil 2 can be the needle tip 12, and the frustum part wrapped by the first coil 2 can be the needle body 11.

[0062] refer to Figure 3The three-dimensional nanoparticle pickup coil 1100 may also include a base 5. The base 5 may be an integral part of the probe structure 1, for example, both made of silicon. The base 5 and the probe structure 1 may also be made of different materials. Conductive materials, insulating layers 3, etc., may extend to cover the base 5. The base 5 makes the three-dimensional nanoparticle pickup coil 1100 easier to manufacture, transfer, and fix.

[0063] Combination Figure 4 As shown, probe structure 1 can also be pyramid-shaped, nail-shaped, obelisk-shaped, etc.

[0064] The length of the probe structure 1 can range from 5 μm to 100 μm, exemplarily from 10 μm to 20 μm. The micron-sized probe structure 1 ensures structural strength and a small tip 12 size. High resolution can be achieved by combining it with a finer first coil 2. This application also provides a larger probe structure 1 for different or complex needs.

[0065] The first coil 2 is attached and wound around the needle body 11. The first coil 2 can be fabricated based on micro-nano processing technology and can reliably move with the needle body 11 without falling off. The number of turns of the first coil 2 ranges from 10 to 500 turns, for example, 50 to 200 turns. The first coil 2 with a sufficient number of turns is attached and wound around the needle body 11, which can sensitively detect.

[0066] The three-dimensional nanopickup coil 1100 provided in this application has high resolution and can precisely detect nanoscale structures. The tip 12 is designed to facilitate nanoscale proximity or even contact with the surface of the sample to be measured, which is the key physical basis for achieving ultra-high spatial resolution. The three-dimensional nanopickup coil 1100 can be used to simultaneously perform electromagnetic induction and direct contact.

[0067] refer to Figure 5 This application provides a measurement system 1000. The measurement system 1000 includes a three-dimensional nanopickup coil 1100, which may be a three-dimensional nanopickup coil 1100 manufactured according to the steps of the aforementioned method or the three-dimensional nanopickup coil 1100 of the aforementioned embodiments.

[0068] The measurement system 1000 may also include a sensing signal processing circuit 1200, a displacement sensing device 1300, a load-bearing device 1400, a proportional-integral-derivative controller 1500, and an excitation device 1600.

[0069] The support device 1400 is disposed opposite to the three-dimensional nanopickup coil 1100. The support device 1400 is used to support the sample. The support device 1400 may include a coarse adjustment stage 1401 and a fine scanning stage 1402, which can ensure precise movement of the sample relative to the three-dimensional nanopickup coil 1100.

[0070] The excitation device 1600 can be positioned remotely from the support device 1400, and the range of motion of the sample is within the effective working range of the excitation device 1600. The excitation device 1600 may include an excitation coil 1601 and an excitation source 1602. The excitation source 1602 is electrically connected to the excitation coil 1601. The excitation coil 1601 is capable of exciting the sample and can generate or enhance a magnetic field.

[0071] The proportional-integral-derivative controller 1500 is electrically connected to the load-bearing device 1400 and the displacement sensing device 1300, respectively.

[0072] The displacement sensing device 1300 is used to sense the displacement of the three-dimensional nanopickup coil 1100 along its extension direction. The displacement sensing device 1300 can be an optical distance sensor, which can non-contactly sense the height of the three-dimensional nanopickup coil 1100 to obtain the height of the sample at different positions.

[0073] For example, the displacement sensing device 1300 may include a tuning fork 1301 connected to the needle body 11, a driving circuit 1302 and a reading circuit 1303 disposed on the tuning fork 1301, and a phase-locked loop 1304 electrically connected to the driving circuit 1302 and the reading circuit 1303.

[0074] The displacement sensing device 1300 using the tuning fork 1301 can operate in either frequency modulation (FM) or amplitude modulation (AM) mode. When the needle 11 contacts the sample, the force exerted is transmitted to the displacement sensing device 1300. By measuring the change in the resonant frequency or amplitude of the tuning fork 1301, nanoscale morphological information of the sample surface can be acquired simultaneously.

[0075] Optionally, the micro-force sensor of the displacement sensing device 1300 may include a quartz tuning fork 1301, or may include a piezoresistive sensor or a piezoelectric cantilever beam, etc.

[0076] The induction signal processing circuit 1200 is electrically connected to the three-dimensional nanoparticle pickup coil 1100, specifically to the first coil 2, or as an integral nested coil. The induction signal processing circuit 1200 may include a preamplifier 1201 and a lock-in amplifier 1202. The preamplifier 1201 may include a current amplifier and a superconducting quantum interference device (SQUID). The lock-in amplifier 1202 can filter by demodulating the reference frequency.

[0077] Based on the induced magnetic signal from the sample, a three-dimensional nano-pickup coil 1100 induces a weak voltage signal. This weak voltage signal can be extracted through a low-noise transmission line, and a high-performance, low-noise preamplifier 1201 is used to improve the signal-to-noise ratio of the induced signal measurement. A lock-in amplifier 1202 is used to extract the induced signal at a specific frequency. The induced signal processing circuit 1200 may also include a data acquisition card (not shown), which can be used to simultaneously acquire morphological signals and electromagnetic induction signals. The measurement system 1000 can reconstruct a sample surface morphology map and obtain high-resolution magnetic signal distribution maps, such as critical current density (Jc) distribution maps and magnetic susceptibility distribution maps.

[0078] The measurement system 1000 has wide applicability and can process weak signals. By setting up a three-dimensional nano-pickup coil 1100, it can directly contact and electromagnetically induct nanostructures. The induction signal processing circuit 1200 and the displacement sensing device 1300 respectively detect the morphology of the sample and analyze its electromagnetic properties. Through the control of the proportional-integral-derivative controller 1500, the morphology information and electromagnetic induction signal can be acquired synchronously. The measurement system 1000 has the advantages of high spatial resolution, high sensitivity, and synchronous measurement.

[0079] refer to Figure 6 This application provides a measurement method 200, which may include steps S201 to S203.

[0080] Step S201: Scan the sample using the three-dimensional nanopickup coil 1100. The three-dimensional nanopickup coil 1100 may be a three-dimensional nanopickup coil 1100 manufactured according to the steps of the aforementioned method, or the aforementioned three-dimensional nanopickup coil 1100, or the three-dimensional nanopickup coil 1100 in the aforementioned measurement system 1000.

[0081] Step S202: Obtain the electromagnetic induction signal of the sample.

[0082] Step S203: Obtain the morphological information of the sample.

[0083] This application provides a high spatial resolution measurement system 1000 and measurement method 200 based on a three-dimensional nano-pickup coil 1100 with a three-dimensional nanostructure. This overcomes the problem of low spatial resolution caused by coil size limitations. By using the three-dimensional nano-pickup coil 1100 for scanning, electromagnetic induction signals can be obtained at high resolution, and the morphological information of the sample can be obtained simultaneously, which is beneficial for more comprehensive and accurate detection and analysis of the sample. The measurement system 1000 and measurement method 200 achieve high spatial resolution imaging and measurement of properties such as critical current density, superfluid density, material magnetization, and magnetic susceptibility of superconducting thin films.

[0084] The technical features of the above-disclosed embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] In the embodiments disclosed above, unless otherwise explicitly specified and limited, the execution order of each step is not restricted. For example, they can be executed in parallel or sequentially in different orders. The sub-steps of each step can also be executed alternately. Various forms of processes described above can be used, and steps can be reordered, added, or deleted, as long as the desired result of the technical solution provided in this application can be achieved, and this application does not impose any restrictions here.

[0086] The embodiments disclosed above merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of patent protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of patent protection claimed by this application. Therefore, the scope of patent protection of this application should be determined by the appended claims.

Claims

1. A method for manufacturing a three-dimensional nanometric pickup coil, characterized by, The method comprises: forming a probe structure, wherein the probe structure comprises a needle body and a needle tip, the needle tip is arranged at one end of the needle body along an extension direction, and the length of the probe structure ranges from 5 μm to 100 μm; forming a conductive material layer covering the probe structure; and forming a first coil wound around the needle body based on the conductive material layer by a focused ion beam spin etching process, the number of turns of the first coil ranges from 10 turns to 500 turns, the line width of the first coil ranges from 5 nm to 100 nm, and the line spacing of the first coil ranges from 5 nm to 100 nm.

2. The method for manufacturing a three-dimensional nano-picking coil according to claim 1, wherein, The step of forming the probe structure comprises processing a polymer precursor by a laser direct writing process.

3. The method for manufacturing a three-dimensional nano-picking coil according to claim 1, wherein, The step of forming the probe structure comprises processing a semiconductor material precursor by a photolithography process and an etching process.

4. The method for manufacturing a three-dimensional nano-picking coil according to claim 1, wherein The method further comprises: forming an insulating layer covering the first coil; forming a second coil wound around the insulating layer.

5. The method for manufacturing a three-dimensional nano-picking coil according to claim 4, wherein, The step of forming the conductive material layer comprises growing a metal material, and the thickness of the conductive material layer ranges from 10 nm to 500 nm. The step of forming the insulating layer comprises growing silicon dioxide, and the thickness of the insulating layer ranges from 10 nm to 500 nm.

6. A three-dimensional nanoprober coil, characterized by, The three-dimensional nanometer pickup coil is obtained according to the steps of the method of any one of claims 1 to 5.

7. A measurement system characterized by, The method comprises: a three-dimensional nanometer pickup coil, wherein the three-dimensional nanometer pickup coil is: a three-dimensional nanometer pickup coil manufactured according to the steps of the method of any one of claims 1 to 5 or the three-dimensional nanometer pickup coil of claim 6; an inductive signal processing circuit electrically connected to the three-dimensional nanometer pickup coil; a displacement sensing device for sensing the displacement of the three-dimensional nanometer pickup coil along the extension direction; and a carrying device arranged opposite to the three-dimensional nanometer pickup coil and used for carrying a sample. The method further comprises a proportional-integral-derivative controller and an excitation device used for exciting the sample, and the proportional-integral-derivative controller is electrically connected to the carrying device and the displacement sensing device, respectively.

8. The measurement system of claim 7, wherein, The displacement sensing device comprises a tuning fork connected to the needle body, a driving circuit and a reading circuit arranged on the tuning fork, and a phase-locked loop electrically connected to the driving circuit and the reading circuit. The inductive signal processing circuit comprises a preamplifier and a phase-locked amplifier. The method comprises:

9. A method of measurement, characterised in that, scanning a sample by using the three-dimensional nanometer pickup coil of claim 6 or the measurement system of claim 7 or claim 8; obtaining an electromagnetic induction signal of the sample; and obtaining topographic information of the sample. The method comprises: scanning a sample by using the three-dimensional nanometer pickup coil of claim 6 or the measurement system of claim 7 or claim 8; obtaining an electromagnetic induction signal of the sample; and obtaining topographic information of the sample.

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