Plasma cleaning of a substrate

By designing a U-shaped cathode groove and staggered plasma cleaning holes, the problem of limited contact area between the cathode and anode was solved, achieving uniform current density and comprehensive cleaning, thus improving cleaning efficiency and energy saving.

CN224389522UActive Publication Date: 2026-06-23DONGGUAN CHANGAN ZHUNLIANG ELECTRONIC EQUIPMENT FACTORY
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Patent Information

Application Number
CN202521519305.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-18
Publication Date
2026-06-23
Estimated Expiration
2035-07-18

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Abstract

The utility model discloses a kind of plasma cleaning plate, including bottom plate, bottom plate is provided with cathode, the surface of bottom plate is opened with at least one cathode groove, cathode groove is U shape, by the cathode groove design is U-shaped curved surface, the contact area of cathode and anode is significantly increased 30%-50%, current density distribution is optimized, make ionization area more concentrated and uniform, greatly improve the energy density of plasma arc and atmosphere dissociation degree, and, plasma can be maintained in lower temperature state in generation and effect process, unnecessary heat loss is reduced, to realize the effect of energy saving, at least one row of array distribution's plasma cleaning hole is equipped in cathode groove, and staggered distribution design is adopted, so that plasma beam is ejected at different angles and positions, form interlaced covering jet field, not only significantly improve cleaning efficiency, make cleaning process more efficient, can also ensure that cleaning has no dead angle, more comprehensive.
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Description

Technical Field

[0001] This utility model relates to the technical field of plasma cleaning device accessories, specifically a plasma cleaning plate. Background Technology

[0002] In the past, the panel industry did not have high requirements for surface cleanliness. Simple ion air bars and blowing devices were used to clean the product surface before proceeding with downstream processes. Currently, due to increasingly higher requirements for product surface quality, the panel manufacturing process includes processes such as treating surface organic matter, bonding organic films, reducing metal oxides, and cleaning the liquid crystal glass substrate. To address these issues, chemical reagents or plasma treatments are often used. However, the use of chemical reagents has the disadvantage of causing environmental pollution, so plasma cleaning is an indispensable part.

[0003] However, the cathode tanks of current plasma cleaning plates generally adopt a planar structure design, which limits the contact area between the cathode and the anode. This design results in uneven current density distribution, insufficient plasma reaction, and insufficient plasma arc energy density, which directly affects the cleaning degree. In addition, the plasma cleaning holes of traditional cleaning plates adopt a single direction or regular arrangement design. During the cleaning or pretreatment stage, the plasma jet is difficult to cover the dead corner areas of complex workpiece surfaces, resulting in incomplete cleaning. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a plasma cleaning plate, which can effectively solve the technical problems mentioned in the background art.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a plasma cleaning plate, including a base plate, wherein a cathode is provided on the base plate, and at least one cathode groove is opened on the surface of the base plate. The cathode groove is U-shaped to increase the contact area between the cathode and the anode. At least one row of plasma cleaning holes distributed in an array is provided in the cathode groove, and multiple plasma cleaning holes are staggered to allow the plasma beam to be ejected from different angles and positions.

[0006] Furthermore, the base plate is equipped with side plates at both the front and rear ends, and mounting plates at both the left and right ends.

[0007] Furthermore, the base plate is provided with multiple cooling components arranged in an array, and the mounting plate has mounting slots for installing the cooling components.

[0008] Furthermore, the cooling assembly includes a pipe joint and a water-cooled pipe communicating with the pipe joint, and the water-cooled pipe is embedded inside the base plate.

[0009] Furthermore, the pipe joint is connected to a diversion joint, which has at least two diversion ports, and one end of the water-cooled pipe is connected to the diversion ports.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] By designing the cathode groove as a U-shaped curved surface, the contact area between the cathode and anode is significantly increased by 30%-50% compared to the traditional planar structure. This improvement optimizes the current density distribution, making the ionization region more concentrated and uniform, greatly improving the energy density and atmosphere dissociation of the plasma arc, thereby forming a high-density plasma. Furthermore, the plasma can be maintained at a lower temperature during generation and action, reducing unnecessary heat loss and thus achieving energy-saving effects.

[0012] In addition, at least one row of arrayed plasma cleaning holes is set in the cathode tank, and a staggered distribution design is adopted so that the plasma beam is sprayed at different angles and positions to form an interlaced jet field, which not only significantly improves the cleaning efficiency and makes the cleaning process more efficient, but also ensures that the cleaning is thorough and without dead angles. Attached Figure Description

[0013] Figure 1 A three-dimensional view of a plasma cleaning plate;

[0014] Figure 2 This is a plan view of a plasma cleaning plate;

[0015] Figure 3 This is a schematic diagram of the cooling component in a plasma cleaning plate.

[0016] Numbering on the map:

[0017] 1. Mounting plate; 2. Cathode tank; 3. Side plate; 4. Plasma cleaning hole; 5. Base plate; 6. Pipe joint; 7. Mounting groove; 8. Diverter joint; 9. Water-cooled pipe; 10. Diverter interface. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figure 1-3As shown, this utility model provides a plasma cleaning plate, including a base plate 5. Side plates 3 are mounted on both the front and rear ends of the base plate 5, and mounting plates 1 are mounted on both the left and right ends of the base plate 5. The base plate 5 is provided with a cathode. In this embodiment, the electrode is an aluminum alloy component, and the base plate 5 is made of 7075 aviation aluminum. At least one cathode groove 2 is formed on the surface of the base plate 5. The cathode groove 2 is U-shaped to increase the contact area between the cathode and the anode. At least one row of plasma cleaning holes 4 are arranged in an array in the cathode groove 2. The multiple plasma cleaning holes 4 are staggered to allow the plasma beam to be ejected from different angles and positions, covering a wider area and reducing cleaning blind spots.

[0020] The base plate 5 is provided with a plurality of cooling components arranged in an array. The mounting plate 1 has a mounting groove 7 for installing the cooling components. The cooling components include pipe joints 6 and water-cooled pipes 9 that are interconnected with the pipe joints 6. The water-cooled pipes 9 are embedded inside the base plate 5. The pipe joints 6 are connected to a diversion joint 8. The diversion joint 8 has at least two diversion interfaces 10. One end of the water-cooled pipe 9 is connected to the diversion interface 10, which increases the density of the water-cooled pipes 9, thereby increasing the heat exchange area and thus enabling the rapid removal of heat from the base plate 5.

[0021] Compared with traditional technology: By designing the cathode groove 2 as a U-shaped curved surface, the contact area between the cathode and anode is significantly increased by 30%-50% compared with the traditional planar structure. This improvement optimizes the current density distribution, making the ionization region more concentrated and uniform, greatly improving the energy density and atmosphere dissociation of the plasma arc, thereby forming a high-density plasma. Furthermore, the plasma can be maintained at a lower temperature during generation and action, reducing unnecessary heat loss and thus achieving energy saving.

[0022] In addition, at least one row of arrayed plasma cleaning holes 4 are provided in the cathode tank 2, and a staggered distribution design is adopted so that the plasma beam is sprayed at different angles and positions to form an interlaced jet field, which not only significantly improves the cleaning efficiency and makes the cleaning process more efficient, but also ensures that the cleaning is thorough and without dead angles.

[0023] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A plasma cleaning plate, comprising a base plate, wherein the base plate is provided with a cathode, characterized in that, At least one cathode groove is formed on the surface of the base plate. The cathode groove is U-shaped to increase the contact area between the cathode and the anode. At least one row of plasma cleaning holes is arranged in an array in the cathode groove. Multiple plasma cleaning holes are staggered so that the plasma beam is ejected from different angles and positions.

2. The plasma cleaning plate according to claim 1, characterized in that, The base plate is fitted with side plates at both the front and rear ends, and mounting plates at both the left and right ends.

3. A plasma cleaning plate according to claim 2, characterized in that, The base plate is provided with multiple cooling components arranged in an array, and the mounting plate has mounting slots for installing the cooling components.

4. A plasma cleaning plate according to claim 3, characterized in that, The cooling assembly includes a pipe joint and a water-cooled pipe that communicates with the pipe joint, and the water-cooled pipe is embedded inside the base plate.

5. A plasma cleaning plate according to claim 4, characterized in that, The pipe joint is connected to a diversion joint, which has at least two diversion interfaces, and one end of the water-cooled pipe is connected to the diversion interface.