A thin film circularly polarized antenna

By using a thin-film circularly polarized antenna structure, radiating elements are fabricated using PET substrate and submicron-sized silver powder particles. Combined with a hollow structure and mechanical connection, the high cost and high loss problems of phased array antennas are solved, achieving lightweight and high-efficiency circularly polarized radiation.

CN121035602BActive Publication Date: 2026-03-03CHENGDU TOPANTECH CO LTD
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Patent Information

Application Number
CN202511553597.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-10-29
Publication Date
2026-03-03
Estimated Expiration
2045-10-29

AI Technical Summary

Technical Problem

Existing phased array antennas suffer from high manufacturing costs, large weight, and high signal transmission loss, making it difficult to meet the requirements of lightweight, miniaturized, and high-frequency applications.

Method used

A thin-film circularly polarized antenna structure is adopted. The radiating unit is prepared by screen printing or inkjet printing using PET substrate and submicron silver powder particles. Combined with hollow structure and mechanical connection method, the number of pressing times and dielectric loss are reduced, and air is used as the radiation medium.

Benefits of technology

It achieves low-cost, lightweight, and high-efficiency circular polarization radiation, improving shock resistance and reliability, and is suitable for high-frequency signal transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a thin film circularly polarized antenna and belongs to the technical field of phased array antennas. The thin film circularly polarized antenna comprises an upper layer radiation thin film antenna, the bottom of the upper layer radiation thin film antenna is provided with an intermediate hollow structure, the side, away from the upper layer radiation thin film antenna, of the intermediate hollow structure is provided with a lower layer radiation thin film antenna, and the side, away from the intermediate hollow structure, of the lower layer radiation thin film antenna is provided with a bottom layer radio frequency printed board. The hollow region of the intermediate hollow structure forms an air medium layer, and air is used as an antenna radiation medium. The upper layer radiation thin film antenna, the intermediate hollow structure and the lower layer radiation thin film antenna are fixed and assembled into an integrated whole through a mechanical connection mode. The thin film circularly polarized antenna of the application omits the processes such as exposure, development, etching and multiple pressing of the conventional PCB process, greatly simplifies the manufacturing process, greatly reduces the manufacturing cost, is suitable for quick mass production with low cost, and has the advantage of not being easy to break compared with the conventional PCB process antenna.
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Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and more particularly to a thin-film circularly polarized antenna. Background Technology

[0002] Phased array antennas, due to their powerful beam scanning and spatial signal processing capabilities, are widely used in radar, satellite communications, and fifth-generation (5G) and even sixth-generation (6G) mobile communication systems. Currently, mainstream phased array antennas are typically manufactured using multilayer printed circuit board (PCB) technology. For example, antenna radiating elements, feed networks, and related RF circuits are fabricated on a PCB substrate (such as FR4 or Rogers laminates) using photolithography and etching processes, and the multilayer structure is integrated through multiple lamination processes. However, this phased array antenna structure based on traditional PCB technology has some drawbacks:

[0003] First, manufacturing costs are high and yields are limited. As the number of antenna elements increases and system complexity rises, the number of lamination cycles the PCB needs to undergo also increases. This increase in lamination cycles leads to a sharp decrease in the yield of antennas on the printed circuit board, resulting in a significant increase in the cost of phased array antennas. Each lamination process introduces risks such as alignment deviations, poor interlayer bonding, or substrate warping, causing a sharp drop in the final product yield, especially for large-scale arrays, thus significantly increasing the manufacturing cost of a single antenna.

[0004] Secondly, signal transmission loss is significant. Regardless of the low-loss dielectric substrate material used (such as PTFE), electromagnetic waves inevitably experience dielectric and conductor losses when propagating through the PCB dielectric. This loss is particularly pronounced at high frequencies (such as millimeter-wave bands), severely reducing antenna radiation efficiency and system performance.

[0005] Finally, the antenna system is relatively heavy and bulky. The PCB substrate itself has a certain density, and when constructing a large-scale antenna array, its cumulative weight is significant, making it difficult to meet the urgent demands of modern communication equipment (such as satellite payloads, high-altitude drones, and portable terminals) for lightweight and miniaturization. In addition, the brittleness of the substrate also affects the antenna's impact resistance and environmental adaptability to some extent. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a thin-film circularly polarized antenna.

[0007] The objective of this invention is achieved through the following technical solution: a thin-film circularly polarized antenna, comprising an upper radiating thin-film antenna, a central hollow structure being stacked at the bottom of the upper radiating thin-film antenna, a lower radiating thin-film antenna being disposed on the side of the central hollow structure away from the upper radiating thin-film antenna, and a bottom radio frequency printed circuit board being disposed on the side of the lower radiating thin-film antenna away from the central hollow structure; the hollow area of ​​the central hollow structure forms an air dielectric layer, using air as the antenna radiation medium; the upper radiating thin-film antenna, the central hollow structure, and the lower radiating thin-film antenna are fixedly assembled into one unit by mechanical connection;

[0008] Both the upper and lower radiating thin-film antennas include a PET substrate, on which radiating elements with a preset pattern are disposed; the radiating elements are disposed on the PET substrate by screen printing or inkjet printing.

[0009] The upper radiating thin-film antenna, the middle hollow structure, and the lower radiating thin-film antenna are each processed independently, thereby reducing the number of times the bottom radio frequency printed circuit board is laminated.

[0010] Preferably, the surface of the air dielectric layer near the upper radiating thin-film antenna is covered with the radiating element of the upper radiating thin-film antenna; the surface of the air dielectric layer near the lower radiating thin-film antenna is covered with the radiating element of the lower radiating thin-film antenna.

[0011] Preferably, the mechanical connection method is screw connection.

[0012] Preferably, the materials used to prepare the radiating unit include silver powder particles and adhesive components, and the mass percentage of silver powder particles is greater than or equal to 98%.

[0013] Preferably, the diameter of the silver powder particles is in the submicron range.

[0014] Preferably, the hollowed-out structural component in the middle is manufactured by machining or injection molding, and the material of the hollowed-out structural component is glass fiber FR4 or PC doped with glass fiber.

[0015] The beneficial effects of this invention are:

[0016] 1) By screen printing or inkjet printing, submicron-sized silver powder particles are directly formed into radiating units with preset patterns on the PET substrate. This eliminates the exposure, development, etching, and multiple lamination processes required by conventional PCB processes, greatly simplifying the manufacturing process and significantly reducing manufacturing costs. It is suitable for rapid, high-volume, low-cost production and has the advantage of being less prone to breakage compared to conventional PCB antennas.

[0017] 2) Hollow-out structural components are produced directly by machining or injection molding, which is convenient in terms of material sourcing and simple in terms of process.

[0018] 3) The upper and lower radiating thin-film antennas and the intermediate hollow support layer can be assembled together using a screw-on process. The air in the middle serves as the antenna's radiation medium. Compared to conventional PCB processes, there is almost no dielectric loss, and the overall weight is significantly reduced. Air is used as the primary radiation medium. Air has a dielectric constant close to 1 and an extremely low loss tangent, fundamentally avoiding the dielectric loss inherent in traditional PCB dielectric materials. Furthermore, the radiating element is composed of high-purity (≥98%), submicron-sized silver powder particles. Their excellent conductivity and smooth printing edges greatly reduce conductor loss caused by the skin effect. The combination of these two factors enables the antenna of this invention to achieve extremely high radiation efficiency, making it particularly suitable for high-frequency applications sensitive to signal loss.

[0019] 4) The PET substrate selected in this invention has excellent strength, toughness and flexibility. Compared with the brittle PP (prepreg) or FR4 material commonly used in traditional PCBs, its bending resistance, vibration resistance and impact resistance are significantly improved, which greatly reduces the risk of cracking due to stress during transportation, installation and use, and improves the reliability and service life of the product.

[0020] 5) The upper radiating thin-film antenna, the middle hollow structure, and the lower radiating thin-film antenna of this invention can be manufactured independently and in parallel, and finally integrated through a simple screw-on process. This modular design not only improves production flexibility but also facilitates later maintenance and replacement. Simultaneously, this structure facilitates the integration of the antenna with the RF front-end, laying the foundation for system-level miniaturization design. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention;

[0022] In the diagram, 1 is the upper radiating thin-film antenna; 2 is the middle hollow structure; 3 is the bottom radio frequency printed circuit board; and 4 is the lower radiating thin-film antenna. Detailed Implementation

[0023] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] See Figure 1This invention provides a technical solution: a thin-film circularly polarized antenna, comprising an upper radiating thin-film antenna, a central hollow structure being stacked at the bottom of the upper radiating thin-film antenna, a lower radiating thin-film antenna being disposed on the side of the central hollow structure away from the upper radiating thin-film antenna, and a bottom radio frequency printed circuit board being disposed on the side of the lower radiating thin-film antenna away from the central hollow structure; the hollow area of ​​the central hollow structure forms an air dielectric layer, using air as the antenna radiation medium; the upper radiating thin-film antenna, the central hollow structure, and the lower radiating thin-film antenna are fixedly assembled into one unit by mechanical connection;

[0025] Both the upper and lower radiating thin-film antennas include a PET substrate, on which radiating elements with a preset pattern are disposed; the radiating elements are disposed on the PET substrate by screen printing or inkjet printing.

[0026] The upper radiating thin-film antenna, the middle hollow structure, and the lower radiating thin-film antenna are each processed independently, thereby reducing the number of times the bottom radio frequency printed circuit board is laminated.

[0027] In this embodiment, the present invention employs new materials, new manufacturing processes, and new structures to solve the problems of high cost, high weight, and high loss in traditional printed circuit board antennas. While proposing the antenna design, the invention also presents its manufacturing method and principle, enabling large-scale, low-cost, and rapid processing. The circular polarization characteristic of the present invention is achieved through a microstrip antenna with a double-layer radiating patch. The antenna element is fed by a 3dB bridge in the form of a stripline. When excited from the input port, signals of equal amplitude and a 90° phase difference are output from the output port, achieving broadband 0° and 90° phase allocation, synthesizing circularly polarized electromagnetic waves, thereby exciting the antenna to achieve circularly polarized radiation performance.

[0028] The antenna's radiating element is made of submicron-sized silver powder particles and a small amount of adhesive components, with silver comprising ≥98%. It is printed onto a PET substrate using printing or inkjet printing methods to form a top and bottom radiating thin-film antenna. The submicron-sized silver powder ensures the edge precision and surface roughness of the printed antenna element, thus guaranteeing extremely low skin effect loss. Silver also possesses excellent electrical conductivity. This thin-film antenna uses air as the radiating medium, resulting in virtually no dielectric loss. The three antenna parts are fabricated independently and then joined together using a conventional screw-on assembly process.

[0029] The upper and lower radiating thin-film antennas are made of the same material and have the same structure. Both are created by printing or inkjet printing submicron-sized silver powder particles onto a PET substrate to form pre-defined radiating elements. PET substrate possesses excellent strength, toughness, and a low dielectric constant. Compared to traditional PCB phased array antennas made of brittle PP, this type of antenna is virtually crack-free and extremely lightweight. The intermediate support layer can be fabricated by machining or injection molding, using either PC doped with glass fiber or FR4 glass fiber through machining. Since the thin-film radiating antennas are fabricated separately through printing, the number of lamination steps on the bottom RF printed circuit board is reduced by at least one, significantly simplifying its processing and improving yield. This results in a substantial reduction in overall manufacturing costs. Furthermore, the hollow structure of the antenna, using air as the dielectric, significantly reduces the overall weight.

[0030] The fabrication of a thin-film circularly polarized antenna includes the following steps:

[0031] By using screen printing or inkjet printing processes, a mixture of silver powder particles and adhesive components is printed onto a PET substrate to form a radiating unit with a pre-defined pattern, thereby obtaining an upper radiating thin film antenna and a lower radiating thin film antenna.

[0032] A hollowed-out structure is obtained by machining or injection molding.

[0033] The upper radiating thin-film antenna, the middle hollow structure, and the lower radiating thin-film antenna are aligned from top to bottom and fixed together by mechanical connection, so that the hollow area of ​​the middle hollow structure forms an air dielectric layer; and when assembling the lower radiating thin-film antenna, it is fixed together with the pre-prepared bottom radio frequency printed circuit board.

[0034] In some embodiments, the surface of the air dielectric layer near the upper radiating thin-film antenna is covered with the radiating element of the upper radiating thin-film antenna; the surface of the air dielectric layer near the lower radiating thin-film antenna is covered with the radiating element of the lower radiating thin-film antenna.

[0035] In some embodiments, the mechanical connection method is screw connection.

[0036] In some embodiments, the materials used to prepare the radiating unit include silver powder particles and colloidal components, and the mass percentage of silver powder particles is greater than or equal to 98%.

[0037] In some embodiments, the diameter of the silver powder particles is in the submicron range.

[0038] In some embodiments, the hollowed-out structural component is manufactured by machining or injection molding, and the material of the hollowed-out structural component is glass fiber FR4 or PC doped with glass fiber.

[0039] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A thin film circularly polarized antenna, characterized by: The application relates to a multilayer radiating antenna, which comprises an upper layer radiating thin film antenna, a middle hollow structure arranged at the bottom of the upper layer radiating thin film antenna, a lower layer radiating thin film antenna arranged at the side of the middle hollow structure away from the upper layer radiating thin film antenna, and a bottom layer radio frequency printed board arranged at the side of the lower layer radiating thin film antenna away from the middle hollow structure; the hollow region of the middle hollow structure forms an air medium layer, and air is used as the antenna radiation medium; the upper layer radiating thin film antenna, the middle hollow structure and the lower layer radiating thin film antenna are fixed and assembled into an integrated whole through a mechanical connection mode. The upper layer radiating thin film antenna and the lower layer radiating thin film antenna both comprise a PET base material, and a preset pattern radiating unit is arranged on the PET base material; the radiating unit is arranged on the PET base material through a silk screen printing or inkjet printing mode; The upper layer radiating thin film antenna, the middle hollow structure and the lower layer radiating thin film antenna are independently processed, so that the pressing frequency of the bottom layer radio frequency printed board is reduced. The preparation material of the radiating unit comprises silver powder particles and glue components, and the mass percentage of the silver powder particles is greater than or equal to 98%. The diameter of the silver powder particles is submicron level.

2. The thin film circularly polarized antenna according to claim 1, wherein: The surface of the air medium layer close to the side of the upper layer radiating thin film antenna is covered with the radiating unit of the upper layer radiating thin film antenna. The surface of the air medium layer close to the side of the lower layer radiating thin film antenna is covered with the radiating unit of the lower layer radiating thin film antenna.

3. The thin film circularly polarized antenna according to claim 1, wherein: The mechanical connection mode is screwing.

4. The thin film circularly polarized antenna according to claim 1, wherein: The middle hollow structure is made through a mechanical processing or injection molding process, and the material of the middle hollow structure is glass fiber FR4 or PC doped glass fiber.

Citation Information

Patent Citations

  • X-band satellite-borne phased-array antenna

    CN108172976A

  • Film-type microstrip patch antenna

    CN110326160A