A precision grinding machine for pressure sensor production

Abstract

The application relates to the technical field of precision machining, in particular to a precision grinding machine for pressure sensor production, which comprises an outer frame and a silicon wafer, a rotating outer rotating frame is sealingly connected to the top of the inner part of the outer frame, an annular liquid storage cavity is formed in the inner side of the outer rotating frame, a liquid conveying mechanism connected with the annular liquid storage cavity is arranged on the outer frame, a plurality of water spraying columns communicated with the annular liquid storage cavity are fixedly arranged on the upper end of the outer rotating frame at equal intervals; a second driving mechanism is arranged at the middle position of the inner bottom wall of the outer frame, a connecting disc is arranged on the working end of the second driving mechanism; and a top polishing mechanism is arranged at the middle position of the top end of the connecting disc. In the application, on one hand, the points on the surface of the silicon wafer can be contacted with the polishing disc in a relatively stable mode, and the polishing force received is more uniform; on the other hand, the water spraying columns can uniformly spray the polishing liquid on the surface of the silicon wafer in a circular motion mode, so that each region of the silicon wafer can be fully supplied with the polishing liquid, and the polishing effect is improved.

Description

Technical Field

[0001] This invention relates to the field of precision machining technology, and in particular to a precision grinding machine tool for the production of pressure sensors. Background Technology

[0002] A pressure sensor is a device that senses pressure signals and converts them into usable electrical output signals according to a certain rule. It typically consists of a pressure-sensitive element and a signal processing unit, and is widely used in numerous industries such as water conservancy and hydropower, railway transportation, intelligent buildings, production automation, aerospace, military, petrochemicals, oil wells, power, shipbuilding, machine tools, and pipelines. Due to the high degree of precision required for pressure sensors, their production often necessitates precision machining. The housing, as a crucial component, affects the sensor's accuracy and heat dissipation performance; therefore, precision grinding using machining equipment is required when processing the sensor housing.

[0003] For example, Chinese invention patent application CN107900846A discloses a pressure sensor processing device. This device uses a combination of a first drive motor, a second drive motor, and a third drive motor to achieve adjustment of the grinding wheel in the front-back, left-right, and up-down directions, so that the grinding wheel can grind the pressure sensor housing more comprehensively. However, this device still has the following problem in use: it is difficult to make each point on the housing surface continuously contact the grinding disc in a relatively stable manner, which makes it difficult to make the grinding force on the housing surface uniform and affects the overall grinding effect. Summary of the Invention

[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by proposing a precision grinding machine tool for the production of pressure sensors.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A precision grinding machine tool for pressure sensor production includes an outer frame and a silicon wafer. The outer frame has a cavity inside. An outer rotating frame is rotatably connected to the upper part of the outer frame and sealed. The outer rotating frame is driven by a first driving mechanism mounted on the outer frame. An annular liquid storage cavity is opened on the inner side of the outer rotating frame. A liquid delivery mechanism connected to the annular liquid storage cavity is provided on the outer frame. Multiple water jets communicating with the annular liquid storage cavity are fixedly installed at equal intervals on the upper end of the outer rotating frame.

[0007] A second drive mechanism is installed in the middle of the bottom wall of the outer frame. A connecting plate is installed at the working end of the second drive mechanism. A grinding plate is fixedly installed on the outside of the connecting plate. Multiple control columns are fixedly installed at equal intervals on the upper end of the connecting plate. Multiple rotating gears are placed on the upper surface of the grinding plate. One side of the rotating gear is engaged with multiple control columns, and the other side is engaged with multiple water jets. A limit component is provided on the inner side of the rotating gear.

[0008] A top grinding mechanism is provided at the middle position of the top of the connecting plate.

[0009] Preferably, the first driving mechanism includes a first motor fixedly installed on the side wall of the outer frame, and the output end of the first motor is keyed to a driving gear after rotating through the side wall of the outer frame. A driving slot is installed at the lower periphery of the outer frame, and the driving gear is meshed with the driving slot.

[0010] Preferably, the infusion mechanism includes a water inlet trough formed in the side wall of the outer frame, one end of the water inlet trough is connected to the interior of the annular liquid storage chamber, and the other end is connected to a water inlet pipe, which is connected to an external grinding fluid supply device.

[0011] Preferably, the second drive mechanism includes a second motor fixedly installed at the middle position of the bottom wall inside the outer frame, with the output end of the second motor facing upward and fixedly connected to the connecting plate.

[0012] Preferably, the limiting component includes a slot disposed below the inner side of the rotating gear, into which the silicon wafer is inserted during polishing.

[0013] Preferably, the surface of the rotating gear has multiple water inlet holes at equal intervals, and the lower end of the water inlet holes is located in the slot.

[0014] Preferably, the top polishing mechanism includes a telescopic device rotatably mounted at the middle position of the top of the connecting plate, the output end of the telescopic device facing upward and fixedly connected to a mounting plate, and multiple polishing devices fixedly mounted on the lower surface of the mounting plate.

[0015] Preferably, the positions of the plurality of grinding devices correspond one-to-one with the rotating gears.

[0016] Preferably, the grinding disc has multiple drainage holes running through it, an annular water inlet frame is fixedly installed on the bottom wall of the outer frame, the lower end of the drainage holes communicates with the interior of the annular water inlet frame, and a drainage component is provided on the side wall of the outer frame.

[0017] Preferably, the drainage assembly includes a drain pipe fixedly installed on the side wall of the outer frame, and the drain pipe communicates with the interior of the annular water inlet frame.

[0018] Compared with the prior art, the advantages of the present invention are as follows:

[0019] 1. In this application, the outer rotating frame and the polishing disc rotate in opposite directions. This way, the central rotating gear, under the action of the control column and the water jet with opposite rotation directions, maintains its own rotation while not revolving around the central axis. The relative motion trajectory of each point on the silicon wafer relative to the polishing disc per unit time is relatively regular. When the polishing disc rotates, the rotation of the silicon wafer allows each point on the surface of the silicon wafer to contact the polishing disc in a relatively stable manner. The polishing force on each part of the surface is more uniform, which is beneficial to obtaining silicon wafers with good thickness uniformity.

[0020] 2. In this application, when the water jet rotates around the silicon wafer, it can not only drive the rotating gear to rotate, but also spray the polishing fluid evenly on the surface of the silicon wafer in a circular motion. Because the silicon wafer is also in motion (rotating) during the polishing process, the rotating water jet can better adapt to the shape and movement trajectory of the silicon wafer, ensuring that all areas of the silicon wafer can receive a sufficient supply of polishing fluid, thereby improving the polishing effect.

[0021] 3. Since a large amount of silicon chips and other debris are generated during the polishing process of silicon wafers, the rotating water jet can wash the surface of the silicon wafer from different angles. It can remove these debris from the surface of the silicon wafer in time, preventing the debris from accumulating on the surface of the silicon wafer and scratching the silicon wafer again.

[0022] In summary, the design of the above structure in this application enables, on the one hand, all points on the silicon wafer surface to contact the polishing disc in a relatively stable manner, resulting in more uniform polishing force on the surface, which is beneficial for obtaining silicon wafers with good thickness uniformity; on the other hand, the water jet can evenly spray the polishing fluid onto the silicon wafer surface in a circular motion, ensuring that all areas of the silicon wafer receive a sufficient supply of polishing fluid, thereby improving the polishing effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall isometric structure of a precision grinding machine tool for producing pressure sensors proposed in this invention.

[0024] Figure 2 This is a schematic diagram of the outer frame and water jet structure of a precision grinding machine tool for producing pressure sensors, as proposed in this invention.

[0025] Figure 3 This is a schematic diagram of the drive slot and drive gear structure of a precision grinding machine tool for producing pressure sensors, as proposed in this invention.

[0026] Figure 4 This is a schematic diagram of the second motor and connecting disc structure of a precision grinding machine tool for producing pressure sensors, as proposed in this invention.

[0027] Figure 5This is a schematic diagram of the rotating gear and water inlet structure of a precision grinding machine tool for producing pressure sensors, as proposed in this invention.

[0028] Figure 6 This is a half-sectional view of the outer frame and connecting plate of a precision grinding machine tool for producing pressure sensors, as proposed in this invention.

[0029] Figure 7 for Figure 6 Enlarged view of the structure at point A in the middle.

[0030] In the diagram: 1 Outer frame, 2 Water jet, 3 Outer rotating frame, 4 Annular liquid storage chamber, 5 Drive slot, 6 First motor, 7 Drive gear, 8 Second motor, 9 Connecting plate, 10 Grinding plate, 11 Control column, 12 Telescopic device, 13 Water inlet, 14 Drain pipe, 15 Annular water inlet frame, 16 Water inlet pipe, 17 Water inlet trough, 18 Mounting plate, 19 Grinding device, 20 Rotating gear, 21 Water inlet, 22 Slot, 23 Silicon wafer. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] Reference Figures 1 to 6 A precision grinding machine tool for pressure sensor production includes an outer frame 1 with a cavity inside. An outer rotating frame 3 is rotatably connected to the upper part of the outer frame 1. A drive slot 5 is installed at the lower periphery of the outer rotating frame 3. A first motor 6 is fixedly installed on the side wall of the outer frame 1. After the output end of the first motor 6 rotates through the side wall of the outer frame 1, a drive gear 7 is keyed to it. The drive gear 7 meshes with the drive slot 5, so that when the first motor 6 is running, the outer rotating frame 3 can be rotated inside the outer frame 1 through the drive gear 7 and the drive slot 5.

[0033] An annular liquid storage chamber 4 is provided on the inner side of the outer rotating frame 3, and a water inlet trough 17 is provided in the side wall of the outer frame 1. One end of the water inlet trough 17 is connected to the inside of the annular liquid storage chamber 4, and the other end is connected to a water inlet pipe 16. The water inlet pipe 16 is connected to an external grinding fluid supply device, so that the grinding fluid can enter the annular liquid storage chamber 4 through the water inlet pipe 16 and the water inlet trough 17 in sequence. Multiple water spray columns 2 that are connected to the annular liquid storage chamber 4 are fixedly installed at equal intervals on the upper end of the outer rotating frame 3. The water spray columns 2 can spray out the grinding fluid in the annular liquid storage chamber 4.

[0034] A second motor 8 is fixedly installed in the middle of the bottom wall of the outer frame 1. The output end of the second motor 8 faces upward and is fixedly connected to a connecting plate 9. A grinding plate 10 is fixedly installed on the outside of the connecting plate 9. Multiple control columns 11 are fixedly installed at equal intervals on the upper end of the connecting plate 9. Multiple rotating gears 20 are placed on the upper surface of the grinding plate 10. One side of the rotating gear 20 is meshed with multiple control columns 11, and the other side is meshed with multiple water jets 2, so that when multiple control columns 11 and multiple water jets 2 rotate, the rotating gear 20 can be driven to rotate.

[0035] A slot 22 is provided on the lower inner side of the rotating gear 20. The silicon wafer 23 is inserted into the slot 22 during polishing. Multiple water inlets 21 are evenly spaced on the surface of the rotating gear 20. The lower end of the water inlet 21 is located in the slot 22, so that the polishing fluid sprayed onto the surface of the rotating gear 20 can enter the slot 22 through the water inlet 21. This ensures that the polishing fluid can fully contact the silicon wafer 23 inside and improve the polishing effect.

[0036] A telescopic device 12 is rotatably mounted at the top center of the connecting plate 9. The output end of the telescopic device 12 faces upward and is fixedly connected to a mounting plate 18. Multiple grinding devices 19 are fixedly mounted on the lower surface of the mounting plate 18. The grinding devices 19 are existing technology, and their specific structural design will not be described in detail here. The positions of the multiple grinding devices 19 and the self-rotating gear 20 are set one-to-one. The shaft of the connecting plate 9 and the telescopic device 12 are connected by a specific bearing, and the mounting plate 18 will not rotate.

[0037] The grinding disc 10 has multiple drainage holes 13 running through its interior. An annular water inlet frame 15 is fixedly installed on the bottom inner wall of the outer frame 1. The lower end of the drainage holes 13 is connected to the interior of the annular water inlet frame 15. A drain pipe 14 is fixedly installed on the side wall of the outer frame 1. The drain pipe 14 is connected to the interior of the annular water inlet frame 15. The drainage holes 13 on the surface of the grinding disc 10 can allow excess grinding fluid to fall into the annular water inlet frame 15 through the drainage holes 13, and then be discharged through the drain pipe 14.

[0038] The specific working principle of this invention is as follows: A silicon wafer 23 is inserted into a slot 22 below a rotating gear 20, and the teeth on the edge of the rotating gear 20 are brought into contact with the water jet 2 and the control column 11, ensuring that the water jet 2 and the control column 11 can drive the rotating gear 20 to rotate when they rotate; a first motor 6 drives a drive gear 7 to rotate, which in turn drives the outer rotating frame 3 and the water jet 2 above it to rotate clockwise through the drive slot 5 below the outer rotating frame 3; polishing fluid is introduced into the water inlet pipe 16, and added to the annular storage chamber 4 through the water inlet trough 17; the water jet 2 can spray out the polishing fluid from the annular storage chamber 4; a second motor 8 drives a connecting plate 9 to rotate, and a polishing disc 10 is fixedly connected to the outside of the connecting plate 9. The second motor 8 drives the polishing disc 10 and the control column 11 to rotate counterclockwise. This has the following advantages:

[0039] First, the outer rotating frame 3 and the polishing disc 10 rotate in opposite directions. In this way, the rotating gear 20 in the middle maintains its own rotation while not revolving around the revolution under the action of the control column 11 and the water jet 2 which rotate in opposite directions. The relative motion trajectory of each point on the silicon wafer 23 relative to the polishing disc 10 is relatively regular in a unit of time. When the polishing disc 10 rotates, the rotation of the silicon wafer 23 makes each point on the surface of the silicon wafer 23 able to contact the polishing disc 10 in a relatively stable manner. The polishing force on each part of the surface is more uniform, which is conducive to obtaining silicon wafers 23 with good thickness uniformity.

[0040] Second, the rotation of silicon wafer 23 allows its surface to interact with the polishing disc 10 more regularly during the polishing process. Since there is no complex motion trajectory caused by revolution, the pressure and friction force applied by the polishing disc 10 to the surface of silicon wafer 23 are more stable.

[0041] Third, when the water jet 2 rotates around the silicon wafer 23, it can not only drive the rotating gear 20 to rotate, but also spray the polishing fluid evenly on the surface of the silicon wafer 23 in a circular motion. Because the silicon wafer 23 is also in motion (rotating) during the polishing process, the rotating water jet 2 can better adapt to the shape and movement trajectory of the silicon wafer 23, ensuring that all areas of the silicon wafer 23 can receive a sufficient supply of polishing fluid and improve the polishing effect.

[0042] Fourth, the surface of the rotating gear 20 is also provided with water inlet holes 21 to ensure that the polishing fluid can fully contact the internal silicon wafer 23 and improve the polishing effect.

[0043] Fifth, a large amount of silicon chips and other debris will be generated during the polishing process. The rotating water jet 2 can wash the surface of the silicon wafer 23 from different angles. It can remove these debris from the surface of the silicon wafer 23 in time, preventing the debris from accumulating on the surface of the silicon wafer 23 and scratching the silicon wafer 23 again.

[0044] The surface of the grinding disc 10 is provided with a drainage hole 13, which can allow excess grinding fluid to fall into the annular water inlet frame 15 through the drainage hole 13, and then be discharged through the drain pipe 14.

[0045] Before polishing, activate the telescopic device 12 to control the mounting plate 18 to descend, allowing the polishing device 19 to contact the upper part of the silicon wafer 23. This allows for simultaneous polishing of the upper and lower parts of the silicon wafer 23. Furthermore, the polishing device 19 rotates in the opposite direction to the rotation of the silicon wafer 23, thus improving the polishing effect.

[0046] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A precision grinding machine tool for producing pressure sensors, comprising an outer frame (1) and a silicon wafer (23), wherein the outer frame (1) has a cavity inside, characterized in that, The outer frame (1) is sealed and rotatably connected to the upper part of the outer frame (3). The outer frame (3) is driven by the first driving mechanism installed on the outer frame (1). The inner side of the outer frame (3) is provided with an annular liquid storage cavity (4). The outer frame (1) is provided with a delivery mechanism connected to the annular liquid storage cavity (4). The upper end of the outer frame (3) is fixedly installed with multiple water spray columns (2) that communicate with the annular liquid storage cavity (4). A second drive mechanism is installed at the middle position of the inner bottom wall of the outer frame (1). A connecting plate (9) is installed at the working end of the second drive mechanism. A grinding plate (10) is fixedly installed on the outer side of the connecting plate (9). Multiple control columns (11) are fixedly installed at equal intervals on the upper end of the connecting plate (9). Multiple rotating gears (20) are placed on the upper surface of the grinding plate (10). One side of the rotating gear (20) is meshed with multiple control columns (11), and the other side is meshed with multiple water spray columns (2). A limit component is provided on the inner side of the rotating gear (20). A top grinding mechanism is provided at the middle position of the top of the connecting disk (9); The infusion mechanism includes a water inlet trough (17) opened in the side wall of the outer frame (1). One end of the water inlet trough (17) is connected to the interior of the annular liquid storage chamber (4), and the other end is connected to a water inlet pipe (16). The water inlet pipe (16) is connected to an external grinding liquid supply device. The limiting component includes a slot (22) located below the inner side of the self-rotating gear (20), into which the silicon wafer (23) is inserted during polishing; The surface of the self-rotating gear (20) is provided with multiple water inlet holes (21) at equal intervals, and the lower end of the water inlet hole (21) is located in the slot (22).

2. The precision grinding machine tool for producing pressure sensors according to claim 1, characterized in that, The first drive mechanism includes a first motor (6) fixedly installed on the side wall of the outer frame (1). The output end of the first motor (6) is keyed to a drive gear (7) after rotating through the side wall of the outer frame (1). A drive slot (5) is installed at the lower periphery of the outer frame (3). The drive gear (7) meshes with the drive slot (5).

3. The precision grinding machine tool for producing pressure sensors according to claim 1, characterized in that, The second drive mechanism includes a second motor (8) fixedly installed in the middle of the bottom wall of the outer frame (1), with the output end of the second motor (8) facing upward and fixedly connected to the connecting plate (9).

4. The precision grinding machine tool for producing pressure sensors according to claim 1, characterized in that, The top polishing mechanism includes a telescopic device (12) rotatably mounted at the middle position of the top of the connecting plate (9). The output end of the telescopic device (12) faces upward and is fixedly connected to a mounting plate (18). Multiple polishing devices (19) are fixedly mounted on the lower surface of the mounting plate (18).

5. The precision grinding machine tool for producing pressure sensors according to claim 4, characterized in that, The positions of the multiple polishing devices (19) correspond one-to-one with the rotating gears (20).

6. The precision grinding machine tool for producing pressure sensors according to claim 1, characterized in that, The grinding disc (10) has multiple drainage holes (13) inside. An annular water inlet frame (15) is fixedly installed on the bottom wall of the outer frame (1). The lower end of the drainage hole (13) is connected to the inside of the annular water inlet frame (15). A drainage component is provided on the side wall of the outer frame (1).

7. The precision grinding machine tool for producing pressure sensors according to claim 6, characterized in that, The drainage assembly includes a drain pipe (14) fixedly installed on the side wall of the outer frame (1), and the drain pipe (14) is connected to the interior of the annular water inlet frame (15).

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