Wet-insulation, heat-insulation and magnetic-insulation graphene vibration sensor packaging system and method

Abstract

The invention discloses a moisture-proof, heat-proof and magnetic-proof graphene vibration sensor packaging system and method, and belongs to the technical field of sensor packaging. The packaging system comprises a three-layer composite structure: an airtight packaging layer made of a polyimide material, the airtight packaging layer is in gapless fit with the surface of the graphene vibration sensor through a vacuum hot pressing process to form a sealing interface; the anti-magnetic shielding layer is made of a nickel-plated copper alloy material, the anti-magnetic shielding layer covers the outer side of the airtight packaging layer, and the anti-magnetic shielding layer is uniformly deposited on the surface of the airtight packaging layer through a magnetron sputtering technology; the heat insulation layer is made of a nano aerogel material, the heat insulation layer covers the outer side of the diamagnetic shielding layer, and the heat insulation layer is tightly bonded with the diamagnetic shielding layer through a low-temperature hot pressing process; by adopting a composite material and a multi-layer structure design, the working stability and precision of the sensor in a complex environment can be effectively improved.

Description

Technical Field

[0001] This invention relates to a moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system and method, belonging to the field of sensor packaging technology. Background Technology

[0002] In modern power transmission and distribution equipment, aerospace, and precision industrial applications, graphene vibration sensors have become key components for condition monitoring and precision detection due to their ultra-high sensitivity, wide frequency response range, and fast response characteristics. However, because these sensors often operate in complex and harsh environments, such as high humidity, drastic temperature changes, and strong electromagnetic interference, traditional packaging solutions struggle to meet their stability and accuracy requirements during long-term operation. Environmental humidity is one of the key factors affecting the performance of graphene vibration sensors. Due to graphene's excellent adsorption capacity, moisture easily seeps into the sensor through packaging gaps or micropores, causing changes in the conductivity of the graphene material, resulting in output signal drift or nonlinearity, severely impacting the sensor's measurement accuracy. The effect of humidity on graphene is particularly pronounced during long-term use; sensor performance fluctuates continuously with humidity changes, and may even fail in extremely humid environments.

[0003] Furthermore, temperature fluctuations significantly interfere with the performance of graphene vibration sensors. The electrical conductivity and mechanical properties of graphene are highly sensitive to temperature. Drastic fluctuations in ambient temperature can trigger thermal expansion and contraction of the graphene film, leading to residual stress within the material and consequently causing signal output instability. In addition, temperature changes can alter the thermal expansion coefficient and structural integrity of the encapsulation material, causing deformation or damage to the encapsulation structure, further affecting the sensor's output accuracy and long-term stability.

[0004] Current encapsulation technologies primarily employ conventional polymers or metals for physical encapsulation. While these technologies can provide some degree of insulation against humidity and temperature, their shielding effectiveness and stability are significantly insufficient in environments with high-frequency vibration and complex electromagnetic interference. Traditional encapsulation processes (such as metal encapsulation and resin encapsulation) typically utilize thermoforming or mechanical bonding. These methods are prone to introducing internal stress during encapsulation, leading to poor interfacial bonding between the encapsulation material and graphene, and consequently causing nonlinear drift in the output signal. To improve the environmental adaptability of sensors, the industry has proposed several improvement schemes, such as employing double-layer or multi-layer encapsulation structures, introducing conductive shielding layers within the encapsulation to reduce electromagnetic interference, or incorporating nanoscale aerogels into the encapsulation material to enhance thermal insulation performance. However, these improvements often suffer from poor material compatibility, increased encapsulation volume, and high encapsulation costs, limiting their widespread application in practical industrial scenarios.

[0005] In summary, although graphene vibration sensors possess enormous potential in terms of sensitivity, response speed, and stability, their application in complex environments remains severely constrained by external factors such as humidity, temperature, and electromagnetic interference. Existing packaging technologies still face bottlenecks in improving anti-interference capabilities and environmental adaptability, failing to fully meet the long-term stable operation requirements of graphene vibration sensors in high-end industrial fields. Therefore, developing a packaging technology for graphene vibration sensors that simultaneously meets the requirements of humidity resistance, heat resistance, and electromagnetic interference resistance has become a crucial problem urgently needing to be solved in the current technological field. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a moisture-proof, heat-proof, and magnetically-proof graphene vibration sensor packaging system and method. It adopts composite materials and multi-layer structure design, which can effectively improve the working stability and accuracy of the sensor in complex environments.

[0007] To achieve the above objectives, the present invention is implemented using the following technical solution: In a first aspect, the present invention provides a moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system, comprising a three-layer composite structure: The hermetic sealing layer is made of polyimide material. The hermetic sealing layer is bonded to the sensor surface without gaps through a vacuum hot pressing process to form a sealing interface to block the intrusion of environmental moisture and particles. The antimagnetic shielding layer is made of nickel-plated copper alloy material. The antimagnetic shielding layer covers the outside of the hermetically sealed packaging layer. The antimagnetic shielding layer is uniformly deposited on the surface of the hermetically sealed packaging layer by magnetron sputtering technology. It has high magnetic permeability and low resistance characteristics and is used to shield complex electromagnetic interference. The heat insulation layer is made of nano-aerogel material and covers the outside of the antimagnetic shielding layer. The heat insulation layer is tightly bonded to the antimagnetic shielding layer by a low-temperature hot-pressing process and has a low thermal conductivity, which is used to suppress the influence of external ambient temperature changes on the sensor output signal. The three-layer composite structure constitutes a flexible package that is bendable and suitable for installation on curved surfaces with a radius of curvature of not less than 10 mm. The design of matching the elastic modulus between multiple materials alleviates the residual stress inside the package.

[0008] Furthermore, the overall packaging volume of the three-layer composite structure is less than 500 mm³, making it suitable for space-constrained industrial equipment.

[0009] Furthermore, the thickness of the hermetic sealing layer is 0.1 mm to 0.2 mm to achieve a high-density seal while maintaining flexibility.

[0010] Furthermore, the thickness of the antimagnetic shielding layer is 0.1 mm to 0.3 mm, which is used to improve the electromagnetic interference resistance without significantly increasing the packaging stiffness.

[0011] Furthermore, the insulation layer has a thickness of 1 mm to 2 mm and a thermal conductivity of no more than 0.016 W / m·K.

[0012] Furthermore, an elastic buffer structure or a modulus transition structure is provided between the hermetically sealed layer and the antimagnetic shielding layer to alleviate the interfacial stress caused by the difference in thermal expansion coefficients.

[0013] Furthermore, the outer surface of the insulation layer has a flexible coating to enhance its resistance to contamination and surface mechanical strength, thereby improving its vibration resistance and structural stability.

[0014] Furthermore, the antimagnetic shielding layer and the hermetic sealing layer are fixedly connected by precision screws and elastic washers.

[0015] In a second aspect, the present invention provides a packaging method for the packaging system according to any one of the foregoing claims, comprising: Polyimide material is processed using laser cutting technology and then bonded to the sensor surface using a vacuum hot pressing process to form an airtight packaging layer. A nickel-copper alloy layer is deposited on the outer surface of the hermetic packaging layer using magnetron sputtering technology to form an antimagnetic shielding layer. A nano-aerogel material is coated on the outer surface of the antimagnetic shielding layer and cured by a low-temperature hot-pressing process to form a heat insulation layer; An elastic buffer structure or modulus transition layer is set between the hermetically sealed layer and the antimagnetic shielding layer to alleviate residual stress caused by the mismatch of material thermal expansion. A conditioning circuit module is integrated inside the package or under the hermetically sealed layer to perform temperature and humidity compensation processing on the vibration signal.

[0016] Furthermore, the packaging method also includes: using automated positioning technology to calibrate the dimensions of the packaging structure to ensure that the overall volume is less than 500 mm³.

[0017] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: By using polyimide material with excellent airtightness and flexibility, combined with vacuum hot pressing process, a high degree of tightness in bonding to sensitive components is achieved, significantly improving moisture resistance. The antimagnetic shielding layer utilizes high magnetic permeability materials and thin-layer sputtering technology to form a uniform coverage structure, effectively suppressing interference signals introduced by complex electromagnetic environments; Nano-aerogels have extremely low thermal conductivity and can mitigate temperature gradient fluctuations through their porous structure, thereby enhancing the thermal stability of the sensor. Stress relief can be achieved between multiple materials by using an elastic interlayer or modulus gradient structure to solve the common problem of thermal expansion and contraction incompatibility in multi-material packaging systems. By integrating conditioning circuitry and employing automated assembly and calibration processes, the system's functional integration, structural reliability, and batch consistency are improved.

[0018] The multifunctional flexible packaging system provided by this invention can maintain high sensitivity, low noise and good signal linearity even in high humidity, high temperature and strong electromagnetic interference environments. It solves the technical problems of poor adaptability and high failure risk of existing packaging in complex environments, and has important technical promotion value and industrialization prospects. Attached Figure Description

[0019] Figure 1 This is a diagram of the encapsulation material layer structure provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the packaging system structure provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the sensor packaging process provided in an embodiment of the present invention. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0021] Example 1: This example introduces a moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system, comprising a three-layer composite structure: The hermetic sealing layer is made of polyimide material. The hermetic sealing layer is bonded to the sensor surface without gaps through a vacuum hot pressing process to form a sealing interface to block the intrusion of environmental moisture and particles. The antimagnetic shielding layer is made of nickel-plated copper alloy material. The antimagnetic shielding layer covers the outside of the hermetically sealed packaging layer. The antimagnetic shielding layer is uniformly deposited on the surface of the hermetically sealed packaging layer by magnetron sputtering technology. It has high magnetic permeability and low resistance characteristics and is used to shield complex electromagnetic interference. The heat insulation layer is made of nano-aerogel material and covers the outside of the antimagnetic shielding layer. The heat insulation layer is tightly bonded to the antimagnetic shielding layer by a low-temperature hot-pressing process and has a low thermal conductivity, which is used to suppress the influence of external ambient temperature changes on the sensor output signal. The three-layer composite structure constitutes a flexible package that is bendable and suitable for installation on curved surfaces with a radius of curvature of not less than 10 mm. The design of matching the elastic modulus between multiple materials alleviates the residual stress inside the package.

[0022] The following description, in conjunction with a preferred embodiment, illustrates the content involved in the above embodiments.

[0023] like Figure 1 As shown, the encapsulation system of this invention adopts a three-layer composite structure, namely an hermetically sealed encapsulation layer, an antimagnetic shielding layer, and a thermal insulation layer. The hermetically sealed encapsulation layer is made of polyimide (PI) material with a thickness between 0.1 mm and 0.2 mm, exhibiting excellent moisture resistance and corrosion resistance. The PI material is tightly bonded to the sensor surface through a precision hot-pressing process, forming a high-density encapsulation that effectively blocks the intrusion of moisture and particles, maintaining a low-humidity environment inside the encapsulation and ensuring that the sensor maintains a stable output signal even in high humidity (10% to 95%) environments. The antimagnetic shielding layer is made of nickel-plated copper alloy material with a thickness controlled between 0.1 mm and 0.3 mm. Utilizing its high permeability and low resistance characteristics, it effectively shields external electromagnetic interference, reduces noise levels in the output signal, and improves signal purity. The thermal insulation layer is made of nano-aerogel material with an encapsulation thickness controlled between 1 mm and 2 mm and a thermal conductivity as low as 0.016 W / m·K. The porous structure of aerogel can effectively suppress the interference of external environmental temperature fluctuations on the sensor output signal, reduce internal stress caused by thermal expansion and contraction, and ensure that the sensor maintains accuracy and stability in a temperature range of -40℃ to 85℃. The outer surface of the heat insulation layer has a flexible coating to improve its pollution resistance and surface mechanical strength. The three-layer composite structure constitutes a flexible package, which is flexible and suitable for installation on curved surfaces with a curvature radius of not less than 10mm. The design of matching elastic modulus between multiple materials alleviates the residual stress inside the package.

[0024] like Figure 2 As shown, the packaging system of this invention adopts a modular design, mainly composed of a sensor module, an hermetically sealed module, an antimagnetic shielding module, and a thermal insulation module. The sensor module is located in the center of the packaging system and is fixed by a flexible connection structure, providing a certain degree of vibration resistance. An elastic buffer structure or modulus transition structure is provided between the hermetically sealed layer and the antimagnetic shielding layer to alleviate interface stress caused by differences in thermal expansion coefficients. The hermetically sealed module and the antimagnetic shielding module are fixed to the outside of the sensor module by precision screws and elastic washers, forming a tightly fitted structure to prevent loosening or misalignment under external vibration. The thermal insulation module is tightly bonded to the outer layer of the packaging structure through a low-temperature hot-pressing process, ensuring the integrity and mechanical strength of the packaging system under extreme environments. The overall size of the packaging system is controlled within 500 mm³, making it suitable for space-constrained industrial equipment.

[0025] The encapsulation system operates under different environmental conditions as follows: In high humidity environments (10% to 95% relative humidity), the hermetic sealing layer effectively blocks moisture intrusion through the high-density structure of polyimide, preventing moisture from interfering with the conductivity of the graphene material and ensuring the linearity and stability of the output signal. In temperature fluctuation environments (-40℃ to 85℃), the thermal insulation layer reduces thermal expansion and contraction effects through the low thermal conductivity of the nano-aerogel material, lowering the thermal stress inside the encapsulation material and maintaining the stability of the output signal. In environments with strong electromagnetic interference (shielding capability up to 45dB), the antimagnetic shielding layer effectively shields external electromagnetic interference, maintaining high signal purity and stability.

[0026] like Figure 3 As shown, the manufacturing process of the packaging system includes the following key steps: First, polyimide packaging material is processed using laser cutting technology and then bonded to the sensor surface using a vacuum hot-pressing process to form a high-density hermetically sealed packaging layer. Second, a nickel-copper alloy antimagnetic shielding layer is deposited on the outer surface of the package using magnetron sputtering technology, with the thickness controlled between 0.1 mm and 0.3 mm to ensure the uniformity of the shielding layer surface and its magnetic permeability. Then, a nano-aerogel thermal insulation layer is covered on the outer layer of the packaging system and bonded tightly to the packaging structure using a low-temperature hot-pressing curing process to form a stable composite layer structure. An elastic buffer structure or modulus transition layer is set between the hermetically sealed packaging layer and the antimagnetic shielding layer to alleviate residual stress caused by material thermal expansion mismatch. A conditioning circuit module is integrated inside the package or below the hermetically sealed packaging layer for temperature and humidity compensation processing of vibration signals. The overall manufacturing process of the packaging system uses automated production equipment combined with precision packaging positioning technology to ensure batch consistency of packaging size and structure, improving production efficiency and product qualification rate.

[0027] The packaging system underwent rigorous environmental testing and performance evaluation, demonstrating excellent environmental adaptability and stability. Under conditions of high humidity (95%RH), alternating high and low temperatures (-40℃ to 85℃), and strong electromagnetic interference (45dB), the output sensitivity fluctuation of the packaging system was less than ±0.5%, and the linearity fluctuation of the output signal was less than ±1%, with no instances of package peeling, material aging, or mechanical damage observed. In dynamic vibration environments, the packaging system maintained stable output signals within a frequency range of 10Hz to 2kHz, with noise levels remaining below 0.1mV, exhibiting excellent shock resistance and dynamic response capabilities.

[0028] Example 2: This example provides a packaging method for the packaging system according to any one of Examples 1, comprising: Polyimide material is processed using laser cutting technology and then bonded to the sensor surface using a vacuum hot pressing process to form an airtight packaging layer. A nickel-copper alloy layer is deposited on the outer surface of the hermetic packaging layer using magnetron sputtering technology to form an antimagnetic shielding layer. A nano-aerogel material is coated on the outer surface of the antimagnetic shielding layer and cured by a low-temperature hot-pressing process to form a heat insulation layer; An elastic buffer structure or modulus transition layer is set between the hermetically sealed layer and the antimagnetic shielding layer to alleviate residual stress caused by the mismatch of material thermal expansion. A conditioning circuit module is integrated inside the package or under the hermetically sealed layer for temperature and humidity compensation processing of vibration signals. Automated positioning technology is used to calibrate the dimensions of the packaging structure to ensure that the overall volume is less than 500mm³.

[0029] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system, characterized in that, Includes a three-layer composite structure: The hermetic packaging layer is made of polyimide material. The hermetic packaging layer is bonded to the surface of the graphene vibration sensor without gaps through a vacuum hot pressing process to form a sealed interface. The antimagnetic shielding layer is made of nickel-plated copper alloy material. The antimagnetic shielding layer covers the outside of the hermetically sealed packaging layer. The antimagnetic shielding layer is uniformly deposited on the surface of the hermetically sealed packaging layer by magnetron sputtering technology. The heat insulation layer is made of nano-aerogel material and covers the outside of the antimagnetic shielding layer. The heat insulation layer is tightly bonded to the antimagnetic shielding layer by a low-temperature hot-pressing process. The three-layer composite structure constitutes a flexible package, which is flexible as a whole and suitable for curved surface structures with a radius of curvature not less than a set threshold. The residual stress inside the package is relieved by the matching design of elastic modulus between multiple materials.

2. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The overall encapsulation volume of the three-layer composite structure is less than 500 mm³, and it is suitable for curved surface structures with a curvature radius of not less than 10 mm.

3. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The thickness of the hermetic sealing layer is 0.1 mm to 0.2 mm.

4. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The thickness of the antimagnetic shielding layer is 0.1 mm to 0.3 mm.

5. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The insulation layer has a thickness of 1 mm to 2 mm and a thermal conductivity of no more than 0.016 W / m·K.

6. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, An elastic buffer structure or a modulus transition structure is provided between the hermetically sealed layer and the antimagnetic shielding layer.

7. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The outer surface of the insulation layer has a flexible coating.

8. The moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to claim 1, characterized in that, The antimagnetic shielding layer and the hermetic sealing layer are fixedly connected by precision screws and elastic washers.

9. A packaging method for a moisture-proof, heat-proof, and magnetically insulating graphene vibration sensor packaging system according to any one of claims 1-8, characterized in that, include: Polyimide material is processed using laser cutting technology and then bonded to the sensor surface using a vacuum hot pressing process to form an airtight packaging layer. A nickel-copper alloy layer is deposited on the outer surface of the hermetic packaging layer using magnetron sputtering technology to form an antimagnetic shielding layer. A nano-aerogel material is coated on the outer surface of the antimagnetic shielding layer and cured by a low-temperature hot-pressing process to form a heat insulation layer; An elastic buffer structure or modulus transition layer is set between the hermetically sealed layer and the antimagnetic shielding layer to alleviate residual stress caused by the mismatch of material thermal expansion. A conditioning circuit module is integrated inside the package or under the hermetically sealed layer to perform temperature and humidity compensation processing on the vibration signal.

10. The packaging method according to claim 9, characterized in that, The packaging method further includes: using automated positioning technology to calibrate the dimensions of the packaging structure to ensure that the overall volume is less than 500 mm³.

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