A heating plate structure and its preparation method

Abstract

This invention discloses a heating plate structure and its manufacturing method. The heating plate structure includes a plate body, a metal block, and a ceramic sleeve. The plate body includes a base and a cover plate, with their opposite end faces joined together to form a splicing interface. A maintenance hole is provided through the plate body along its thickness direction, and the maintenance hole has a surrounding wall. The metal block is disposed within the maintenance hole, and a closed space is formed between the outer wall of the metal block and the surrounding wall of the maintenance hole. Along the thickness direction of the plate body, the splicing interface is within the confinement range of this closed space. A mounting hole is formed through the metal block along the thickness direction of the plate body. The ceramic sleeve is disposed within the mounting hole. This invention effectively reduces the impact of air gaps at the splicing interface on product performance and quality while ensuring smooth lifting and lowering of the ejector pin and extending its service life through the use of the ceramic sleeve.

Description

Technical Field

[0001] This invention relates to the field of semiconductor component processing technology, specifically to a heating plate structure and its preparation method. Background Technology

[0002] The heating plate is a core component in thin film deposition equipment. The heating plate generally includes a plate body and a cylinder. The plate body includes a base and a cover plate. The base has slots for embedding the heating wires. The cover plate is welded to the surface of the base to form a welded joint and to seal the heating wires. The cylinder body is coaxially welded to the side of the cover plate away from the base. The interior of the cylinder body is connected to the welded joint and to the outside to allow the cylindrical part of the heating wires to run and connect to the power supply. In order to reduce wear and extend service life while facilitating the lifting and lowering of the ejector pins to pick up and put down the wafer, mounting holes are usually machined through the plate body and ceramic sleeves are threaded into the mounting holes.

[0003] However, due to the limitations of current welding technology, air gaps may exist in the welding of the cover plate and the base. Furthermore, the mounting holes used to assemble the ceramic sleeve penetrate the disc body. This may cause the heating disc to form a leakage track through the cylinder, air gap, and mounting holes, resulting in unstable vacuum environment, impure deposition gas, and other consequences, which will affect the thin film deposition effect. Summary of the Invention

[0004] Therefore, the present invention provides a heating plate structure and preparation method to solve the problem that the heating plate of the prior art is prone to cause unstable vacuum environment and impure deposition gas when used for deposition, which affects the film deposition effect.

[0005] In a first aspect, the present invention provides a heating plate structure, comprising:

[0006] The disc body includes a base and a cover plate, wherein the end faces of the base and the cover plate facing each other are spliced ​​and fixed to form a splicing interface;

[0007] The disc body has a maintenance hole extending through it along its thickness direction, and the maintenance hole has a surrounding wall.

[0008] A metal block is disposed within the maintenance hole, and a closed space is formed between the outer wall of the metal block and the surrounding wall of the maintenance hole. In the thickness direction of the disc body, the splicing interface is within the limiting range of the closed space.

[0009] A ceramic sleeve is provided, wherein the metal block has a mounting hole formed through it along the thickness direction of the disc body, and the ceramic sleeve is disposed in the mounting hole.

[0010] Technical Effects: By placing the metal block within the maintenance hole and enclosing the area between the outer wall of the metal block and the wall of the maintenance hole to form a closed space, and ensuring that the splicing interface is within the limited range of this closed space in the thickness direction of the disk, the closed space covers the splicing interface. When the entire disk of this heating disk structure is placed inside the deposition chamber to maintain a vacuum environment for deposition, even if there are air gaps at the splicing interface, the trajectory between the air gaps at the splicing interface and the interior of the deposition chamber can be blocked. This ensures the stability of the vacuum environment in the deposition chamber and the purity of the deposition gas, thereby ensuring the deposition effect and film performance quality. Simultaneously, by fitting a ceramic sleeve into the mounting hole, the high hardness, smoothness reducing friction damage, and minimal deformation of the ceramic sleeve effectively reduce the impact of air gaps at the splicing interface on the film deposition effect, while ensuring smooth pin movement and extending service life.

[0011] In one alternative embodiment, a first end of the metal block is welded to the end of the base away from the cover plate to form a first sealing part, and a second end of the metal block is welded to the end of the cover plate away from the base to form a second sealing part.

[0012] Technical advantages: Compared to sealing the first and second ends of the metal block to the disk body separately using methods such as glue sealing, the first and second sealing parts formed by welding here seal the first and second ends of the metal block to the base and cover plate respectively. On the one hand, the sealing performance of the first and second sealing parts is negligibly affected by the high temperature environment during deposition, which can ensure the sealing effect of the enclosed space for a long time. On the other hand, it is only necessary to weld the outer wall of the first end of the metal block to the top of the maintenance hole wall and the outer wall of the second end of the metal block to the bottom of the maintenance hole wall to ensure the sealing effect of the enclosed space. The manufacturing process is simpler and the quality is easier to control.

[0013] In one optional embodiment, the mounting hole is configured as a stepped hole, with the large diameter portion of the mounting hole located at the end of the small diameter portion of the mounting hole facing the cover plate; the ceramic sleeve includes a fixing cap and a body, the fixing cap being threaded into the large diameter portion, and the end face of the fixing cap facing the small diameter portion having a recessed insertion hole, and the body being sequentially inserted into the small diameter portion and the insertion hole.

[0014] Technical advantages: Compared to using a fully threaded fit to fit the ceramic kit into the mounting hole, this method involves threading the fixing cap into the large diameter portion of the mounting hole and inserting the body into the small diameter portion and the insertion hole, making assembly simpler and the connection more secure.

[0015] In one optional embodiment, the base has a mounting groove at one end facing the cover plate, the mounting groove being used for embedding the disc portion of the heating wire, and the opening of the mounting groove being covered and closed by the splicing interface; the cover plate has a cylinder at one end away from the base, and the interior of the cylinder is used for the cylindrical portion of the heating wire to pass through.

[0016] Technical effect: By embedding a heating wire in the mounting groove and sealing the heating wire in the mounting groove at the splicing interface, the heating wire can be energized to generate heat during deposition and diffuse it from the inside to the outside, so as to heat the disk evenly and improve the deposition effect of the film. At the same time, the inside of the cylinder provides a channel for the cylindrical part of the heating wire to pass through, so as to perform electrical installation.

[0017] Secondly, the present invention also provides a preparation method for obtaining the heating disk structure provided in the first aspect above, the preparation method comprising the following steps:

[0018] S1, vacuum brazing is used to weld the end faces of the base and the cover plate facing each other to form a splicing interface;

[0019] S2, A positioning hole is machined through the disc body at a predetermined position;

[0020] S3, perform ultrasonic scanning on the heating plate structure to obtain the actual welding rate A between the base and the cover plate, and compare the actual welding rate A with the first set welding rate A1 and the second set welding rate A2, wherein A1 is less than A2;

[0021] S41, if A1 < A < A2, and the non-welded area coincides with the positioning hole, then the disc body (100) shall be repaired.

[0022] Technical Effects: First, the actual welding rate A of the base and cover plate is obtained by ultrasonic scanning of the heating plate structure using an ultrasonic scanning device. When the actual welding rate A is greater than the first set welding rate A1 and less than the second set welding rate A2, and when the non-welded area coincides with the positioning hole, the plate is repaired to block the trajectory between the air gap at the splicing interface and the inside of the deposition chamber. This allows for further processing and repair even when an air gap appears at the splicing interface that connects to the positioning hole. This solves the problems of unstable vacuum environment and impure deposition gas caused by air gaps at the splicing interface, ensuring the deposition effect of the thin film even when an air gap appears at the splicing interface that connects to the positioning hole.

[0023] In one optional implementation, the maintenance work includes:

[0024] S411, a maintenance hole is machined based on the positioning hole, and then the metal block is installed in the maintenance hole;

[0025] S412, the first end of the metal block is sealed and connected to the end of the base away from the cover plate, and the second end of the metal block is sealed and connected to the end of the cover plate away from the base;

[0026] S413, A mounting hole is machined at a predetermined position on the metal block, and the ceramic fitting is fitted into the mounting hole.

[0027] Technical Effects: When it is determined that the non-welded area of ​​the base and cover plate coincides with the positioning hole and requires maintenance, a maintenance hole is machined based on the positioning hole, and a metal block is installed in the maintenance hole. The first and second ends of the metal block are respectively sealed to the disk body, so that the area between the outer wall of the metal block and the surrounding wall of the maintenance hole forms a closed space, and the closed space covers the splicing interface. When the entire disk body of the heating disk structure after maintenance is placed inside the deposition chamber to maintain a vacuum environment for deposition, even if there is an air gap at the splicing interface, it can ensure that the trajectory between the air gap at the splicing interface and the inside of the deposition chamber is blocked, thereby ensuring the stability of the vacuum environment of the deposition chamber and ensuring the purity of the deposition gas. It enables further processing and repair on the basis of air gaps at the splicing interface that connect with the positioning hole, solving the problems that air gaps at the splicing interface can easily cause instability of the vacuum environment of the deposition chamber and impurity of the deposition gas, ensuring the deposition effect of the thin film even if there are air gaps at the splicing interface that connect with the positioning hole.

[0028] In one optional embodiment, the preparation method further includes:

[0029] S42, if A≥A2, then process the cylindrical part;

[0030] S43. If A≤A1, the product is deemed unqualified and treated as scrap.

[0031] Technical benefits: By judging the actual welding rate A of the base and cover plate in advance, on the one hand, if it is determined that it cannot be remedied by subsequent maintenance work, the vacuum brazed disc is scrapped and no further processing is required, saving processing costs and time; on the other hand, if it is determined that no maintenance work is required on the vacuum brazed disc to ensure the film deposition effect, no maintenance work is performed, saving maintenance costs and time.

[0032] In an optional implementation, step S412 includes:

[0033] Electron beam welding is used to weld the first end of the metal block to the base to form a first sealing part, and the first sealing part seals the first end of the metal block to the end of the base away from the cover plate.

[0034] The second end of the metal block is welded to the cover plate using electron beam welding to form a second sealing part, and the second sealing part seals the second end of the metal block to the end of the cover plate away from the base.

[0035] Pre-treatment of welding marks: grinding, polishing, and cleaning.

[0036] Technical advantages: Compared to sealing the first and second ends of the metal block to the disk body separately using methods such as glue sealing, the first and second sealing parts formed by electron beam welding here seal the first and second ends of the metal block to the base and cover plate respectively. On the one hand, the sealing performance of the first and second sealing parts formed by high-temperature welding is negligibly affected by the high-temperature environment during deposition, which can ensure the sealing effect of the enclosed space for a long time. On the other hand, it is only necessary to weld the outer wall of the first end of the metal block around the top of the maintenance hole wall and the outer wall of the second end of the metal block around the bottom of the maintenance hole wall to ensure the sealing effect of the enclosed space. The manufacturing process is simpler and the quality is easier to control.

[0037] In an optional implementation, step S413 includes:

[0038] A large-diameter portion is machined at a predetermined position at the bottom of the metal block, and a small-diameter portion is machined at a predetermined position at the top of the metal block. The small-diameter portion and the large-diameter portion communicate to form the mounting hole.

[0039] An insertion hole is machined at a predetermined position on one end face of the fixing cap of the ceramic sleeve;

[0040] The fixing cap is threaded onto the large diameter portion, and then the body of the ceramic sleeve is sequentially inserted into the small diameter portion and the insertion hole.

[0041] Technical advantages: Compared to using a fully threaded fit to fit the ceramic kit into the mounting hole, this method involves threading the fixing cap into the large diameter portion of the mounting hole and inserting the body into the small diameter portion and the insertion hole, making assembly simpler and the connection more secure.

[0042] In an optional implementation, prior to step S1, the following steps are further included:

[0043] S02, a mounting groove is machined at a position at one end of the base facing the cover plate, and then the disc of the heating wire is embedded into the mounting groove.

[0044] Technical effect: By embedding a heating wire in the mounting groove and sealing the heating wire in the mounting groove at the splicing interface, the heating wire can be energized to generate heat during deposition and diffuse it from the inside to the outside, so as to heat the disk evenly and improve the deposition effect of the film.

[0045] In one alternative implementation, the following steps are also included:

[0046] S5, turn on the heating wire to heat to the set temperature, and maintain the set temperature for the set duration.

[0047] Technical effect: The heat generated by the energized heating wire diffuses from the inside out, resulting in uniform heating and helping to remove the stress generated during welding in the preparation process.

[0048] In an optional implementation, prior to step S1, the following steps are further included:

[0049] S01, a positioning groove is pre-machined at a set position on the end face of the base away from the cover plate. The positioning groove is used as a positioning reference for machining the positioning hole. The positioning groove can be removed by grinding.

[0050] Technical effect: Before welding the opposite ends of the base and cover plate to form a splicing interface, a positioning groove is pre-machined on the base to avoid the mounting groove. After the base and cover plate are welded and fixed into a whole, the positioning groove is used as a reference to machine the positioning hole. This ensures that the positioning hole and maintenance hole will not come into contact with the heating wire located in the mounting groove and cause damage. Attached Figure Description

[0051] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0052] Figure 1 A schematic diagram of an existing heating plate with a gas flow path;

[0053] Figure 2 This is a cross-sectional view of a heating plate structure according to this embodiment;

[0054] Figure 3 This is a partially enlarged schematic diagram of a heating plate structure according to this embodiment;

[0055] Figure 4 for Figure 2 A schematic diagram of a structure with a gas flow path;

[0056] Figure 5 This is an exploded view of a portion of the structure of a heating plate in this embodiment;

[0057] Figure 6 This is a schematic diagram of the structure of the disk body prepared after completing step S2 in the preparation method of this embodiment;

[0058] Figure 7 This is a flowchart of the preparation method in this embodiment;

[0059] Figure 8 This is a schematic diagram illustrating the comparison process between the actual welding rate and the first and second set welding rates in the preparation method of this embodiment.

[0060] Explanation of reference numerals in the attached figures:

[0061] 100-Disc body, 110-Base, 111-Mounting slot, 112-Splicing interface, 1121-Air gap, 113-Positioning slot, 120-Cover plate, 121-Connecting slot, 122-Pin hole, 130-Maintenance hole, 131-Enclosed space, 140-Positioning hole;

[0062] 200 - Heating wire;

[0063] 300 - cylinder body, 310 - locating pin;

[0064] 400 - Metal block, 410 - First sealing part, 420 - Second sealing part, 430 - Mounting hole, 431 - Large diameter part, 432 - Small diameter part;

[0065] 500-Ceramic sleeve, 510-Fixing cap, 511-Socket, 520-Body;

[0066] 600-thimble. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0068] In the description of this embodiment, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this embodiment. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0069] In the description of this embodiment, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0070] Reference Figure 1 The heating plate of the related technology generally includes a plate body and a cylinder body. The plate body includes a base and a cover plate. The base has a groove for embedding the heating wire. The cover plate is welded to the surface of the base to form a welded joint and to seal the heating wire plate. The cylinder body is coaxially welded to the side of the cover plate away from the base. The interior of the cylinder body is connected to the welded joint and to the outside so that the cylindrical part of the heating wire can be wired to achieve electrical connection with the power supply.

[0071] During the process of welding the cover plate to the base surface to form a weld joint, due to limitations in current welding technology, air gaps exist at the weld joint due to factors such as pressure and solder uniformity. When the entire heating plate is placed inside the deposition chamber to maintain a vacuum environment, refer to... Figure 1 As shown by the arrow path, external gas may enter the deposition chamber through leakage paths formed by the inside of the cylinder, the air gap, and the gap between the ceramic sleeve and the inner wall of the mounting hole. This can lead to unstable vacuum environment and impure deposition gas, affecting the film deposition effect. To solve the above technical problems, the heating plate structure and its preparation method are provided in the following embodiments.

[0072] The following is combined Figures 2 to 8 The following describes embodiments of the present invention.

[0073] Reference Figures 2 to 4According to a first aspect of the present invention, a heating plate structure is provided, including a plate body 100, a cylinder 300, a metal block 400, and a ceramic sleeve 500. The plate body 100 includes a base 110 and a cover plate 120. The base 110 has a mounting groove 111 at one end facing the cover plate 120 for embedding a plate portion of a heating wire 200. The end faces of the base 110 and the cover plate 120 facing each other are spliced ​​and fixed to form a splicing interface 112. The cylinder 300 is disposed at one end of the cover plate 120 away from the base 110, and the interior of the cylinder 300 is used for the cylindrical portion of the heating wire 200 to pass through and be electrically connected to a power source. A maintenance hole 130 is provided through the disk body 100 along the thickness direction of the disk body 100. The maintenance hole 130 has a surrounding wall. A metal block 400 is disposed in the maintenance hole 130. The outer wall of the metal block 400 and the surrounding wall of the maintenance hole 130 form a closed space 131. In the thickness direction of the disk body 100, the splicing interface 112 is within the range defined by the closed space 131. A mounting hole 430 is formed through the metal block 400 along the thickness direction of the disk body 100. A ceramic sleeve 500 is disposed in the mounting hole 430. The interior of the ceramic sleeve 500 is used for the lifting and lowering of the ejector pin 600 to realize the picking and placing of the wafer product.

[0074] In this embodiment, the heating plate structure encloses a closed space 131 by placing a metal block 400 inside the maintenance hole 130 and forming a closed space 131 between the outer wall of the metal block 400 and the surrounding wall of the maintenance hole 130. The splicing interface 112 is within the limiting range of the closed space 131 in the thickness direction of the plate body 100, so that the closed space 131 covers the splicing interface 112. When the entire plate body 100 of this embodiment is placed inside the deposition chamber to maintain a vacuum environment for deposition, refer to... Figure 4 As shown by the arrow path, even if the splicing interface 112 has an air gap 1121 due to factors such as pressure and solder uniformity, and this air gap 1121 is connected to the closed space 131, it can ensure that the gas flowing from the outside through the inside of the cylinder 300 and the air gap 1121 of the splicing interface 112 is retained in the closed space 131. This blocks the trajectory between the air gap 1121 of the splicing interface 112 and the inside of the deposition chamber, preventing outside gas from entering the inside of the deposition chamber. This ensures the stability of the vacuum environment of the deposition chamber and the purity of the deposition gas, thereby ensuring the deposition effect and performance quality of the thin film. At the same time, by assembling the ceramic sleeve 500 in the mounting hole 430, the high hardness, smoothness, reduced friction damage, and low deformation of the ceramic sleeve 500 are utilized to effectively reduce the impact of the air gap 1121 of the splicing interface 112 on the thin film deposition effect while ensuring the smooth lifting and lowering of the ejector pin 600 and extending its service life.

[0075] It should be noted that, in this embodiment, because the enclosed space 131 is not connected to the interior of the deposition chamber, the toxic and corrosive deposition gases located inside the deposition chamber cannot escape to the outside, thus improving the safety of use.

[0076] It should be noted that in this embodiment, by embedding the heating wire 200 in the mounting groove 111 and sealing the heating wire 200 in the mounting groove 111 by the splicing interface 112, the heating wire 200 can be energized to generate heat during deposition and diffuse it from the inside to the outside, so as to heat the disk 100 evenly and improve the deposition effect of the film. At the same time, the inside of the cylinder 300 provides a channel for the disk portion of the heating wire 200 to pass through, so as to perform electrical installation.

[0077] It should be noted that the ceramic material has less deformation, which can reduce the squeezing deformation of the ceramic sleeve 500 caused by the deformation of the heating plate, and ensure the smooth lifting and lowering of the lifting pin 600.

[0078] Understandably, for ease of description, the following is used: Figure 1 The first direction in the description is used as the thickness direction of the disk body 100, but it is not used as a limitation on the thickness direction of the disk body 100.

[0079] It is understandable that the statement in the text that the splicing interface 112 is within the limiting range of the closed space 131 in the thickness direction of the disk body 100 means that the projection area of ​​the splicing interface 112 along the flow direction of gas in the air gap 1121 of the splicing interface 112 falls entirely within the range of the closed space 131, so that the gas passing through the air gap 1121 of the splicing interface 112 flows into the closed space 131.

[0080] Reference Figure 3 Specifically, the mounting hole 430 is configured as a stepped hole, and the large diameter portion 431 of the mounting hole 430 is located at one end of the small diameter portion 432 of the mounting hole 430 facing the cover plate 120 in the first direction. The ceramic sleeve 500 includes a fixing cap 510 and a body 520. The fixing cap 510 is threaded into the large diameter portion 431 of the mounting hole 430. The fixing cap 510 has a recessed insertion hole 511 on its end face facing the base 110 in the first direction. The body 520 is sequentially inserted into the small diameter portion 432 and the insertion hole 511 of the mounting hole 430. Compared with the method of using a full threaded fit to assemble the ceramic sleeve 500 into the mounting hole 430, this embodiment makes the assembly operation simpler and the connection more stable by threading the fixing cap 510 into the large diameter portion 431 of the mounting hole 430 and inserting the body 520 into the small diameter portion 432 and the insertion hole 511.

[0081] In some embodiments, the first end of the metal block 400 and the end of the base 110 away from the cover plate 120 are electron beam welded to form a first sealing part 410, and the second end of the metal block 400 and the end of the cover plate 120 away from the base 110 are electron beam welded to form a second sealing part 420.

[0082] Compared to sealing the first and second ends of the metal block 400 to the disk body 100 by means of adhesive sealing, this embodiment seals the first and second ends of the metal block 400 to the base 110 and the cover plate 120 by welding the first sealing part 410 and the second sealing part 420, respectively. On the one hand, the sealing performance of the first sealing part 410 and the second sealing part 420 is negligibly affected by the high temperature environment generated by the heating wire 200, which can ensure the sealing effect of the enclosed space 131 for a long time. On the other hand, it is only necessary to weld the outer wall of the first end of the metal block 400 around the top of the wall of the maintenance hole 130 and the outer wall of the second end of the metal block 400 around the bottom of the wall of the maintenance hole 130 to ensure the sealing effect of the enclosed space 131. The manufacturing process is simpler and the quality is easier to control.

[0083] It should be noted that the first end and the second end of the metal block 400 refer to the two opposite ends of the metal block 400 along the first direction, wherein the end of the metal block 400 facing the base 110 along the first direction is designated as the first end, and the end of the metal block 400 facing the cover plate 120 along the first direction is designated as the second end.

[0084] In practical applications, both the metal block 400 and the disk 100 are made of the same metal material, specifically aluminum. Aluminum provides strong installation consistency, and the same material also facilitates welding.

[0085] In another alternative embodiment, heat-resistant sealant can be applied between the outer wall of the first end of the metal block 400 and the top of the enclosure wall of the maintenance hole 130, and between the outer wall of the second end of the metal block 400 and the bottom of the enclosure wall of the maintenance hole 130.

[0086] In some embodiments, the cylinder 300 is welded and fixed to the cover plate 120, and the cover plate 120 and the cylinder 300 are connected by a positioning and mating assembly. The positioning and mating assembly accurately positions the relative positions of the cover plate 120 and the cylinder 300, so as to keep the cylinder 300 coaxially welded and fixed to the cover plate 120.

[0087] Reference Figure 5In some embodiments, a pin hole 122 is provided on either the cover plate 120 or the cylinder 300. Preferably, the pin hole 122 is provided on the end face of the cover plate 120 away from the base 110. The positioning and mating assembly includes a positioning pin 310, which is provided at the end of the cylinder 300 facing the cover plate 120. The positioning pin 310 matches the pin hole 122.

[0088] In this embodiment, the positioning pin 310 is inserted into the corresponding pin hole 122 to ensure that the relative positions of the cover plate 120 and the cylinder 300 are accurately positioned and that the two do not rotate relative to each other, thereby ensuring the subsequent welding quality.

[0089] In another alternative embodiment, the end of the cylinder 300 facing the cover plate 120 is provided with a pin hole 122, and the end face of the cover plate 120 away from the base 110 is provided with a positioning pin 310.

[0090] Specifically, a connecting groove 121 is provided at the end of the cover plate 120 away from the base 110. The connecting groove 121 is used for the top end of the cylinder 300 to be fitted. By fitting the top end of the cylinder 300 into the connecting groove 121, it can not only serve as a positioning tool, but also increase the welding area and improve the tightness of the connection between the cylinder 300 and the cover plate 120.

[0091] Reference Figures 2 to 8 According to a second aspect of the present invention, a preparation method is also provided for preparing the heating disk structure provided in the first aspect of the present invention. The preparation method includes the following steps:

[0092] S02, a mounting groove 111 is machined at a set position at one end of the base 110 facing the cover plate 120, and then the disc of the heating wire 200 is embedded into the mounting groove 111;

[0093] S1, Vacuum brazing is used to weld the end faces of the base 110 and the cover plate 120 facing each other to form a splicing interface 112;

[0094] S2, a positioning hole 140 is machined through at a set position on the disc body 100;

[0095] S3, perform ultrasonic scanning on the plate body 100 of the heating plate structure to obtain the actual welding rate A of the base 110 and the cover plate 120, and compare the actual welding rate A with the first set welding rate A1 and the second set welding rate A2, wherein A1 is less than A2.

[0096] S41, if A1 < A < A2, and the non-welded area partially overlaps with the positioning hole 140, then the disc body 100 shall be repaired.

[0097] The preparation method of this embodiment first uses an ultrasonic scanning device to perform ultrasonic scanning on the heating plate structure 100 to obtain the actual welding rate A of the base 110 and the cover plate 120. When the actual welding rate A is greater than the first set welding rate A1 and less than the second set welding rate A2, and when the non-welded area partially overlaps with the positioning hole 140, the plate 100 is repaired to block the trajectory between the air gap 1121 of the splicing interface 112 and the interior of the deposition chamber. This allows for further processing and repair based on the air gap 1121 of the splicing interface 112 communicating with the positioning hole 140, solving the problems that the air gap 1121 of the splicing interface 112 can easily cause unstable vacuum environment and impure deposition gas in the deposition chamber. This ensures that even if the air gap 1121 of the splicing interface 112 communicates with the positioning hole 140, the deposition effect of the thin film can still be ensured.

[0098] It should be noted that the weld ratio mentioned in this article refers to the ratio between the effective weld contact area between the base 110 and the cover plate 120 and the overlapping area between the two. The effective weld contact area is displayed in one color on the ultrasonic scanning image, while the ineffective weld contact area is displayed in another color, representing welding defects such as incomplete welds.

[0099] In some embodiments, the maintenance work includes:

[0100] S411, a maintenance hole 130 is machined based on the positioning hole 140, and then the metal block 400 is installed in the maintenance hole 130;

[0101] S412, the first end of the metal block 400 is sealed and connected to the end of the base 110 away from the cover plate 120, and the second end of the metal block 400 is sealed and connected to the end of the cover plate 120 away from the base 110.

[0102] S413, a mounting hole 430 is machined at a set position on the metal block 400, and the ceramic sleeve 500 is assembled into the mounting hole 430.

[0103] In this embodiment, when it is determined that the non-welded areas of the base 110 and cover plate 120 partially overlap with the positioning hole 140 and require maintenance, a maintenance hole 130 is fabricated based on the positioning hole 140. A metal block 400 is then installed inside the maintenance hole 130, and the first and second ends of the metal block 400 are respectively sealed to the disk body 100. This creates a closed space 131 between the outer wall of the metal block 400 and the surrounding wall of the maintenance hole 130, ensuring that the closed space 131 covers the splicing interface 112 and blocks the trajectory between the air gap 1121 of the splicing interface 112 and the interior of the deposition chamber. This process is then performed on the entire heating disk structure 100 after maintenance. When the body is placed inside the deposition chamber and a vacuum environment is maintained for deposition, even if gas flows from the outside through the inside of the cylinder 300 and the air gap 1121 of the splicing interface 112, it remains in the closed space 131 and cannot enter the inside of the deposition chamber, ensuring the stability of the vacuum environment of the deposition chamber and ensuring the purity of the deposition gas; further processing and repair are achieved on the basis of the air gap 1121 communicating with the positioning hole 140 at the splicing interface 112, solving the problems that the air gap 1121 at the splicing interface 112 can easily cause instability of the vacuum environment of the deposition chamber and impurity of the deposition gas, ensuring the film deposition effect even if the air gap 1121 communicating with the positioning hole 140 appears at the splicing interface 112.

[0104] It should be noted that in this embodiment, the metal block 400 is first installed in the maintenance hole 130 and then sealed and connected before the ceramic sleeve 500 is assembled in the mounting hole 430. This can effectively avoid contamination of the ceramic sleeve 500 during the sealing and connection of the metal block 400 and the plate body 100 and during the grinding process, reduce the amount of rework, improve the quality of the prepared heating plate structure, and improve the processing efficiency.

[0105] It should be noted that the second set welding rate A2 mentioned in the text refers to the welding rate when there is an air gap 1121 at the splicing interface 112, and the position of the air gap 1121 and the positioning hole 140 have a partially overlapping area (i.e., the air gap 1121 and the positioning hole 140 are connected); here, the second set welding rate A2 is preferably 95%.

[0106] In some embodiments, the preparation method further includes:

[0107] S42, if A≥A2, then process part 300 of the cylinder;

[0108] S43. If A≤A1, the product is deemed unqualified and treated as scrap.

[0109] In this embodiment, the preparation method pre-determines the actual welding rate A of the base 110 and the cover plate 120. On the one hand, if it is determined that the welding cannot be remedied by subsequent maintenance work, the vacuum-brazed disc 100 is scrapped and no further processing is performed, saving processing costs and time. On the other hand, if it is determined that the vacuum-brazed disc 100 can be repaired without further maintenance to ensure the film deposition effect, the cylinder 300 is processed directly without maintenance, saving maintenance costs and time.

[0110] It should be noted that when the actual welding rate A is less than the first set welding rate A1, considering that the connection strength between the base 110 and the cover plate 120 is insufficient to meet the performance requirements such as service life due to the low welding rate, maintenance is not very meaningful, so it is considered to discard it.

[0111] It should be noted that the first set welding rate A1 in the text refers to the welding rate when there is an air gap 1121 at the splicing interface 112, and even after maintenance and repair, there is still a possibility that external gas can enter the deposition chamber; here, the first set welding rate A1 is preferably 70%; the second set welding rate A2 mentioned in the text refers to the welding rate when there is an air gap 1121 at the splicing interface 112, and the position of the air gap 1121 partially overlaps with the positioning hole 140 (i.e., the air gap 1121 is connected to the positioning hole 140), and maintenance work can be performed to repair it; here, the second set welding rate A2 is preferably 95%.

[0112] In practical applications, if A1 < A < A2, after maintenance work is carried out, the 300mm portion of the cylinder is machined.

[0113] In some embodiments, step S412 includes:

[0114] Electron beam welding is used to weld the first end of the metal block 400 to the base 110 to form a first sealing part 410, and the first end of the metal block 400 is sealed and connected to the end of the base 110 away from the cover plate 120 through the first sealing part 410.

[0115] The second end of the metal block 400 is welded to the cover plate 120 by electron beam welding to form a second sealing part 420. The second sealing part 420 seals the second end of the metal block 400 to the end of the cover plate 120 away from the base 110.

[0116] Pre-treatment of welding marks: grinding, polishing, and cleaning.

[0117] Compared to sealing the first and second ends of the metal block 400 to the disk body 100 using methods such as glue sealing, the preparation method of this embodiment uses electron beam welding to form the first sealing part 410 and the second sealing part 420, which seal the first and second ends of the metal block 400 to the base 110 and the cover plate 120 respectively. On the one hand, the sealing performance of the first sealing part 410 and the second sealing part 420 formed by high-temperature welding is negligibly affected by the high-temperature environment generated by the heating wire 200, which can ensure the sealing effect of the enclosed space 131 for a long time. On the other hand, it is only necessary to weld the outer wall of the first end of the metal block 400 around the top of the wall of the maintenance hole 130 and the outer wall of the second end of the metal block 400 around the bottom of the wall of the maintenance hole 130 to ensure the sealing effect of the enclosed space 131. The preparation process is simpler and the quality is easier to control.

[0118] It should be noted that, based on the condition that A1 < A < A2, the penetration depth of electron beam welding can be flexibly selected according to the difference between the actual welding rate A and the second set welding rate A2. This ensures that, based on solving the problems that the air gap 1121 at the splicing interface 112 can easily cause instability in the vacuum environment of the deposition chamber and impurity of the deposition gas, corresponding electron beam welding is performed according to different actual conditions to form the first sealing part 410 and the second sealing part 420, which is beneficial to reducing processing costs.

[0119] In some embodiments, step S413 includes:

[0120] A large diameter portion 431 is machined at a set position at the bottom of the metal block 400, and a small diameter portion 432 is machined at a set position at the top of the metal block 400. The small diameter portion 432 and the large diameter portion 431 are connected to form a mounting hole 430.

[0121] A socket 511 is machined at a set position on one end face of the fixing cap 510 of the ceramic sleeve 500;

[0122] The fixing cap 510 is threaded onto the large diameter portion 431, and then the body 520 of the ceramic sleeve 500 is sequentially inserted into the small diameter portion 432 and the socket 511.

[0123] Compared to using a fully threaded fit to assemble the ceramic sleeve 500 into the mounting hole 430, the preparation method of this embodiment involves threading the fixing cap 510 into the large diameter portion 431 of the mounting hole 430 and inserting the body 520 into the small diameter portion 432 and the insertion hole 511, which makes the assembly operation simpler and the connection more stable.

[0124] In some embodiments, the preparation method further includes the following steps:

[0125] S5, turn on the heating wire 200 to heat to the set temperature, and maintain the set temperature for the set duration.

[0126] The preparation method of this embodiment utilizes the heat generated by the energized heating wire 200 to diffuse from the inside out, resulting in uniform heating and facilitating the removal of stress generated during welding during the preparation process.

[0127] Specifically, turn on heating wire 200 to heat to 400°C and maintain at 400°C for 8 hours.

[0128] Reference Figure 6 In some embodiments, the following steps are included before step S1:

[0129] S01, a positioning groove 113 is pre-machined at a set position on the end face of the base 110 away from the cover plate 120. The positioning groove 113 is used as a positioning reference for machining the positioning hole 140. The positioning groove 113 can be removed by grinding.

[0130] The preparation method of this embodiment involves pre-processing a positioning groove 113 on the base 110, avoiding the mounting groove 111, before welding the end faces of the base 110 and the cover plate 120 facing each other to form the splicing interface 112. This ensures that after the base 110 and the cover plate 120 are welded and fixed into a whole, the positioning groove 113 is used as a reference to process the positioning hole 140, thus ensuring that the positioning hole 140 and the maintenance hole 130 will not come into contact with the heating wire 200 located in the mounting groove 111 and cause damage during the processing.

[0131] It should be noted that the depth of the positioning groove 113 is less than 0.5 mm, which makes it easy to grind and remove the positioning groove 113 after preparation, ensuring the flatness of the end face of the base 110 away from the cover plate 120.

[0132] In some embodiments, before vacuum brazing the mutually facing end faces of the base 110 and the cover plate 120 to form a splicing interface 112, the following steps are also included:

[0133] A protective film is wrapped around the outside of the cylindrical portion of the heating wire 200 in a detachable manner.

[0134] In this embodiment, the preparation method involves wrapping a protective film around the cylindrical portion of the heating wire 200 in advance to prevent water or cutting oil from adhering and causing contamination during subsequent processing, as well as to prevent subsequent welding contamination, thus ensuring the quality of the prepared heating plate structure.

[0135] It should be noted that after preparation is completed, the protective film is removed, and the cylindrical part of the heating wire 200 is electrically connected to the power source via an electric wire.

[0136] Reference Figure 5 In some embodiments, processing the cylinder 300 portion includes:

[0137] A connecting groove 121 is machined at a set position on the end face of the cover plate 120 away from the base 110;

[0138] A pin hole 122 is machined at a predetermined position on the top wall of the connecting groove 121;

[0139] The top end of the cylinder 300 is inserted into the connecting groove 121, and the positioning pin 310 of the cylinder 300 is inserted into the pin hole 122.

[0140] Electron beam welding is used to weld the top of the cylinder 300 to the cover plate 120 to form a fixed connection.

[0141] The preparation method of this embodiment uses the positioning pin 310 to be inserted into the corresponding pin hole 122 to ensure that the relative positions of the cover plate 120 and the cylinder 300 are accurately positioned and do not rotate relative to each other, thereby ensuring the subsequent welding quality. At the same time, by embedding the top of the cylinder 300 into the connecting groove 121, it can not only play a positioning role, but also increase the welding area and improve the connection tightness between the cylinder 300 and the cover plate 120.

[0142] In some embodiments, after machining portion 300 of the cylinder, the following steps are further included:

[0143] For the leak test, the opening connecting the cylinder 300 to the outside is sealed. Then, test gas is filled into the cylinder 300 until the pressure stabilizes. A pressure detector is then used to detect the change in the internal pressure of the cylinder 300 within a set time.

[0144] In this embodiment, after sealing the first and second ends of the metal block 400 to the plate body 100, the opening of the cylinder 300 connecting to the outside is sealed, and a test gas is injected into the cylinder 300 and pressurized for a period of time. By comparing the internal pressure values ​​of the cylinder 300 before and after a set time, if the difference between the internal pressure values ​​of the cylinder 300 before and after is less than a set difference, the heating plate structure prepared by this embodiment is considered to be of qualified quality. If the difference between the internal pressure values ​​of the cylinder 300 before and after is less than a set difference, it is considered that there is a risk of air leakage between the outer wall of the metal block 400 and the surrounding wall of the maintenance hole 130, and the first sealing part 410 and the second sealing part 420 need to be repaired by welding to ensure the quality of the prepared heating plate structure.

[0145] In practical applications, the pressure detector is set as a pressure gauge, and the detection gas is set as an inert gas, specifically helium.

[0146] Understandably, after heating the heating wire to eliminate the stress generated by welding, it is necessary to first perform fine machining to remove excess material and welding marks from the surface of each component, then wash and polish it with water, then perform chemical cleaning, then fluorination, then test the insulation and resistance, then lead the wire of the heating wire 200 out from inside the cylinder 300 to connect to the power supply to achieve electrical assembly, and finally package it.

[0147] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A heating disc structure, characterized by, The application relates to a heating disc structure, which comprises the following parts: a disc body (100) comprising a base (110) and a cover plate (120), the end faces of the base (110) and the cover plate (120) being fixedly spliced with each other and forming a splicing interface (112); a maintenance hole (130) is arranged through the disc body (100) along the thickness direction of the disc body (100), the maintenance hole (130) has a surrounding wall surrounding the maintenance hole (130); a metal block (400) is arranged in the maintenance hole (130), an enclosed space (131) is formed between the outer side wall of the metal block (400) and the surrounding wall of the maintenance hole (130), and the splicing interface (112) is located in the range of the enclosed space (131) in the thickness direction of the disc body (100); a first end of the metal block (400) is welded with one end of the base (110) away from the cover plate (120) to form a first sealing part (410), and a second end of the metal block (400) is welded with one end of the cover plate (120) away from the base (110) to form a second sealing part (420); a ceramic sleeve (500) is arranged in the mounting hole (430) of the metal block (400) along the thickness direction of the disc body (100).

2. A heating tray structure according to claim 1, wherein The mounting hole (430) is a stepped hole, a large-diameter part (431) of the mounting hole (430) is located at one end of the mounting hole (430) away from the cover plate (120), the ceramic sleeve (500) comprises a fixing cap (510) and a body (520), the fixing cap (510) is threadedly matched with the large-diameter part (431), an end face of the fixing cap (510) away from the small-diameter part (432) is recessed with a insertion hole (511), and the body (520) is sequentially inserted and matched with the small-diameter part (432) and the insertion hole (511).

3. The heating tray structure of claim 1, wherein, One end of the base (110) away from the cover plate (120) is provided with a mounting groove (111) for embedding a disc part of a heating wire (200), and the opening of the mounting groove (111) is covered and sealed by the splicing interface (112); one end of the cover plate (120) away from the base (110) is provided with a cylinder (300), and the inside of the cylinder (300) is used for penetrating a column part of the heating wire (200).

4. A method of manufacture characterised by, The application further discloses a preparation method of the heating disc structure, which comprises the following steps: S1, welding the end faces of the base (110) and the cover plate (120) to form the splicing interface (112) by vacuum brazing; S2, machining a positioning hole (140) at a set position of the disc body (100); S3, arranging the metal block (400) in the positioning hole (140) and welding the first end of the metal block (400) with one end of the base (110) away from the cover plate (120) to form the first sealing part (410); S3, ultrasonic scanning is performed on the disc body (100) of the heating disc structure to obtain an actual welding rate A of the base (110) and the cover plate (120), and the actual welding rate A is compared with a first set welding rate A1 and a second set welding rate A2, wherein A1 is less than A2; the first set welding rate A1 refers to a welding rate corresponding to a situation that the splicing interface (112) has an air gap (1121) and even after processing correction through repair work, there is still a possibility that external gas enters the inside of the deposition cavity; the second set welding rate A2 refers to a welding rate corresponding to a situation that the splicing interface (112) has an air gap (1121), the position of the air gap (1121) has a partial overlapping area with the positioning hole (140), and the air gap (1121) can be repaired through repair work; S41, if A1 < A < A2 and the non-welding area partially overlaps with the positioning hole (140), repair work is performed on the disc body (100).

5. A method of manufacture according to claim 4, wherein, The repair work includes: S411, a repair hole (130) is processed based on the positioning hole (140), and then a metal block (400) is installed in the repair hole (130); S412, a first end of the metal block (400) is sealingly connected to an end of the base (110) away from the cover plate (120), and a second end of the metal block (400) is sealingly connected to an end of the cover plate (120) away from the base (110); S413, an installation hole (430) is processed at a set position of the metal block (400), and a ceramic sleeve (500) is assembled in the installation hole (430).

6. The preparation method according to claim 4, characterized in that, The preparation method further includes: S42, if A is greater than or equal to A2, a barrel body (300) part is processed; S43, if A is less than or equal to A1, it is determined that the product is unqualified and is treated as waste.

7. The preparation method according to claim 5, characterized in that, The step S412 includes: The first end of the metal block (400) is welded to the base (110) by electron beam welding to form a first sealing part (410), and the first end of the metal block (400) is sealingly connected to an end of the base (110) away from the cover plate (120) through the first sealing part (410); The second end of the metal block (400) is welded to the cover plate (120) by electron beam welding to form a second sealing part (420), and the second end of the metal block (400) is sealingly connected to an end of the cover plate (120) away from the base (110) through the second sealing part (420); Welding trace pretreatment: polishing, cleaning.

8. The preparation method according to claim 5, characterized in that, The step S413 includes: A large-diameter part (431) is processed at a set position of the bottom end of the metal block (400), and a small-diameter part (432) is processed at a set position of the top end of the metal block (400), the small-diameter part (432) and the large-diameter part (431) are in communication to form the installation hole (430); An insertion hole (511) is processed at a set position of one end face of a fixed cap (510) of the ceramic sleeve (500); The fixed cap (510) is threadedly fitted to the large diameter portion (431), and then the body (520) of the ceramic sleeve (500) is sequentially fitted to the small diameter portion (432) and the insertion hole (511).

9. A method of manufacture according to any one of claims 4 to 8, wherein, Before the step S1, the following step is further included: S02, a mounting groove (111) is machined at a position of one end of the base (110) towards the cover plate (120), and then the disc portion of the heating wire (200) is embedded into the mounting groove (111).

10. The preparation method according to claim 9, characterized in that, The following steps are further included: S5, the heating wire (200) is turned on to heat to a set temperature, and is kept at the set temperature for a set time length.

11. The preparation method according to claim 9, characterized in that, Before the step S1, the following step is further included: S01, a positioning groove (113) is pre-machined at a position of an end face of the base (110) away from the cover plate (120), the positioning groove (113) is used as a positioning reference for machining the positioning hole (140), and the positioning groove (113) can be polished away.

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