A method, apparatus, and electronic device for three-dimensional inspection of semiconductor chips.

Abstract

This application discloses a three-dimensional inspection method, apparatus, and electronic device for semiconductor chips. The method includes: acquiring height detection data, intensity detection data, and a detection die of a chip wafer under test using a 3D camera probe; matching the detection die with a template die to obtain a valid die; forming an effective intensity map and an effective height map based on the height detection data and intensity detection data of the valid die; obtaining a target binary map based on the effective intensity map, identifying and acquiring bumps and their basic information; mapping the bumps onto the effective height map to obtain the effective height data of the bumps and reference substrate data, thereby obtaining the relative height data of the bumps; and obtaining the inspection result based on the basic information and the corresponding relative height data. This application can reduce the requirements for the contrast of the acquired height data and make chip inspection more robust.

Description

Technical Field

[0001] This application relates to the field of chip inspection technology, and in particular to a three-dimensional inspection method and apparatus for semiconductor chips, as well as electronic equipment. Background Technology

[0002] In the semiconductor chip manufacturing process, wafer processing is complex and involves numerous processes. Each step requires precise measurement and inspection to effectively select out unqualified products and prevent them from entering the next process, thereby improving product quality and reducing subsequent processing and production costs.

[0003] Traditional inspection methods involve visual inspection using a manual microscope. However, this method is highly subjective and affected by factors such as the operator's mood, eyesight, ambient lighting, and inconsistent standards of judgment among different individuals. Furthermore, with the advancement of wafer manufacturing processes, the structures on wafers are becoming smaller and more numerous. Manual microscope inspection is time-consuming, labor-intensive, and inefficient, failing to meet the high-speed, high-precision inspection requirements of wafer production lines.

[0004] Due to the limitations of manual microscopy, 2D defect detection technology is currently the primary method used. This technology mainly focuses on two-dimensional planar detection and cannot detect defects in other dimensions, especially the height dimension. However, three-dimensional data can more comprehensively and realistically reflect the characteristics of the wafer structure surface. By measuring the three-dimensional (3D) morphological features, structural components can be measured in the height dimension to determine their quality.

[0005] Existing 3D topographic feature measurement techniques primarily involve converting pixel data acquired by a 3D camera into a grayscale image, then binarizing the grayscale image to determine the position of the bump sphere, and finally measuring the height of the bump sphere. However, existing techniques have high requirements for the height data acquired by the 3D camera, resulting in high costs. Furthermore, if the data does not meet the accuracy requirements, it can lead to poor bump binarization, resulting in missed detections and abnormal height measurements. Summary of the Invention

[0006] To address the aforementioned issues, embodiments of this application provide a method and apparatus for three-dimensional inspection of semiconductor chips, an electronic device, a computer-readable storage medium, and a computer program product.

[0007] Firstly, in order to solve the above-mentioned technical problems, this application provides a three-dimensional inspection method for semiconductor chips, comprising:

[0008] The height and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, are obtained by using a 3D camera probe.

[0009] The detection die is matched with the template die of the chip wafer under test to obtain the valid die among the detection dies;

[0010] An effective intensity map and an effective height map are generated based on the height detection data and intensity detection data corresponding to the effective die.

[0011] Based on the effective intensity map, a target binary map is obtained, and the bump in the target binary map and the basic information of the bump are identified and obtained.

[0012] Map the bump onto the effective height map to obtain the effective height data and reference base data of the bump;

[0013] The relative height data between the bump and the reference base is obtained based on the effective height data and the reference base data, and the detection result is obtained based on the basic information and the corresponding relative height data.

[0014] The beneficial effects are:

[0015] In the technical solution provided in the embodiments of this application, height detection data and intensity detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, are acquired by a 3D camera probe; the detection die and the template die of the chip wafer under test are matched to obtain the valid die in the detection die; an effective intensity map and an effective height map are formed based on the height detection data and intensity detection data corresponding to the valid die; a target binary map is obtained based on the effective intensity map, and the bump in the target binary map and the basic information of the bump are identified and obtained; the bump is mapped to the effective height map to obtain the effective height data of the bump and the reference substrate data; the relative height data between the bump and the reference substrate is obtained based on the effective height data and the reference substrate data, and the detection result is obtained based on the basic information and the corresponding relative height data. Therefore, this application can determine the bump through a binarized intensity map, and then map it to the height data to calculate the height of the bump. This reduces the requirement for contrast of the acquired height data. At the same time, the target binary map can be obtained through the template die, and the bump and its basic information can be identified in the binary map. Then, the height of the bump can be calculated by mapping it to the height data. This can detect anomalies such as missing bumps due to poor chip manufacturing process, defects covering bumps, and defects being treated as bump spheres, making chip detection more robust.

[0016] Furthermore, the acquisition of height and strength detection data of the chip wafer under test via a 3D camera probe, as well as the detection die on the chip wafer under test, includes:

[0017] Data is collected on each die on the chip wafer under test by a 3D camera probe along a preset acquisition direction, and the height detection data and intensity detection data of each die are obtained and formed into a bin file;

[0018] The bin file is read, and the images on the die are stitched together according to the preset stitching rules to obtain the stitched die, which is used as the detection die.

[0019] Furthermore, the die on the chip wafer under test is an ultra-large die with a size greater than a preset threshold;

[0020] The step of stitching the images on the die according to a preset stitching rule to obtain a stitched die, which is then used as the detection die, includes:

[0021] The super-large die is cut into multiple blocks;

[0022] Within each block, the images on the block are stitched together according to a preset stitching rule to obtain multiple stitched blocks;

[0023] The spliced ​​blocks are used as the detection dies.

[0024] Furthermore, the step of obtaining a target binary map based on the effective intensity map, identifying and acquiring bumps in the target binary map, and the basic information of the bumps, includes:

[0025] When the detection rate of bumps on the effective intensity map is less than a preset detection rate threshold, the template image of the template die is binarized to obtain the target binary map.

[0026] Alternatively, when the detection rate of bumps on the effective intensity map is greater than or equal to the preset detection rate threshold, the effective intensity map is binarized to obtain the target binary map;

[0027] Identify and obtain the Bump in the target binary image, as well as the basic information of the Bump.

[0028] Further, the step of mapping the bump to the effective height map to obtain the effective height data and reference base data of the bump includes:

[0029] Obtain the mapping relationship between the effective intensity map and the effective height map;

[0030] Based on the mapping relationship, the Bump is mapped proportionally to the effective height map to obtain the target height map;

[0031] Obtain the effective height data of the Bump in the target height map, as well as the reference base data corresponding to the Bump.

[0032] Furthermore, the step of mapping the bump proportionally onto the effective height map based on the mapping relationship to obtain the target height map includes:

[0033] In the target binary image, the centroid of each bump is obtained, and a predetermined number of pixels are expanded outward from the centroid to obtain the first measurement area of ​​the bump;

[0034] By expanding a predetermined range outward from the centroid, the second measurement area of ​​the four reference bases corresponding to the Bump is obtained;

[0035] Based on the mapping relationship, the first measurement area and the second measurement area are mapped proportionally onto the effective height map to obtain the target height map.

[0036] Further, the step of obtaining the relative height data between the bump and the reference base based on the effective height data and the reference base data, and obtaining the detection result based on the basic information and the corresponding relative height data, includes:

[0037] Based on the effective height data of all pixels in the effective height map and the reference base data, the first average height of the bump and the second average height of the reference base are obtained.

[0038] The relative height data is obtained based on the difference between the first average height and the second average height.

[0039] The basic information and the corresponding relative height data are saved to a CSV file as the detection result. The basic information includes the size and location information of the bump.

[0040] Furthermore, the method also includes:

[0041] The relative height data is compared with a preset acceptable height threshold range to obtain the comparison result;

[0042] If the comparison result indicates that the relative height data is within the preset qualified height threshold range, the corresponding bump is determined to be qualified.

[0043] If the comparison result indicates that the relative height data is not within the preset acceptable height threshold range, the corresponding bump is determined to be unacceptable.

[0044] In a second aspect, the present invention provides an apparatus comprising:

[0045] The acquisition unit is used to acquire height detection data and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, through a 3D camera probe.

[0046] A matching unit is used to match the detection die with the template die of the chip wafer under test to obtain the valid die among the detection dies;

[0047] An effective image unit is used to form an effective intensity map and an effective height map based on the height detection data and intensity detection data corresponding to the effective die;

[0048] The Bump recognition unit is used to obtain a target binary map based on the effective intensity map, identify and obtain the Bump in the target binary map, and the basic information of the Bump;

[0049] A mapping unit is used to map the Bump onto the effective height map to obtain the effective height data and reference base data of the Bump.

[0050] The result unit is used to obtain the relative height data between the Bump and the reference base based on the effective height data and the reference base data, and to obtain the detection result based on the basic information and the corresponding relative height data.

[0051] Thirdly, this application also provides an electronic device, including: one or more processors; and a storage device for storing one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the aforementioned three-dimensional detection method for semiconductor chips.

[0052] Fourthly, this application also provides a computer-readable storage medium storing computer-readable instructions thereon, which, when executed by a computer's processor, cause the computer to perform the three-dimensional detection method for a semiconductor chip as described above.

[0053] Fifthly, this application also provides a computer program product or computer program including computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the three-dimensional detection method for semiconductor chips provided in the various alternative embodiments described above.

[0054] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0055] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0056] Figure 1 This is a schematic diagram of one implementation environment involved in this application;

[0057] Figure 2 This is a schematic diagram of a 3D camera probe and a wafer stage performing chip wafer inspection in one embodiment;

[0058] Figure 3 This is a flowchart illustrating a three-dimensional inspection method for a semiconductor chip, as shown in an exemplary embodiment of this application;

[0059] Figure 4 In one embodiment, this is a comparison of the effects between the target binary map of the intensity map and the target binary map of the height map;

[0060] Figure 5 This is a comparison of the process leak bump detection and the template die detection results;

[0061] Figure 6 This is a schematic diagram of a bin file storing height detection data and intensity detection data in one embodiment of this application;

[0062] Figure 7 This is a schematic diagram of preset splicing rules and corresponding position image IDs in one embodiment of this application;

[0063] Figure 8 This is a schematic diagram of the preset stitching rules and corresponding position image IDs of the block of the super-large Die in one embodiment of this application;

[0064] Figure 9 This is a schematic diagram of a bump in a target binary image in one embodiment of this application;

[0065] Figure 10 This is a schematic diagram of the process of mapping the first measurement area and the second measurement area proportionally onto the effective height map in one embodiment of this application;

[0066] Figure 11 This is a schematic diagram of the contents of a CSV file storing basic bump information and relative height data in one embodiment of this application;

[0067] Figure 12 This is a block diagram illustrating a three-dimensional inspection device for a semiconductor chip, as shown in an exemplary embodiment of this application;

[0068] Figure 13 This is a schematic diagram of the structure of a computer system suitable for implementing the electronic devices of the present application embodiments. Detailed Implementation

[0069] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0070] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0071] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0072] In this application, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0073] To address the problems of poor detection performance in existing semiconductor chip testing, leading to missed bump detection and abnormal height measurement, embodiments of this application propose a three-dimensional detection method and apparatus for semiconductor chips, electronic devices, and computer-readable storage media. The main focus is on the three-dimensional detection technology for semiconductor chips included in chip testing technology. These embodiments will be described in detail below.

[0074] Please refer to the following first. Figure 1 , Figure 1 This is a schematic diagram of an implementation environment related to this application. The implementation environment includes a 3D camera 10 and a server 20, which communicate with each other via a wired or wireless network.

[0075] Server 20 is used to perform wafer inspection on the chip under test placed on the wafer stage using 3D camera 10, such as Figure 2 As shown, Figure 2 This is a schematic diagram of a 3D camera probe and a wafer stage performing chip wafer inspection in one embodiment.

[0076] Server 20 acquires height and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer, through the 3D camera probe of 3D camera 10. It matches the detection die with the template die of the chip wafer under test to obtain the valid dies. Based on the height and strength detection data corresponding to the valid dies, it forms an effective intensity map and an effective height map. Based on the effective intensity map, it obtains a target binary map, identifies and acquires bumps in the target binary map, and obtains the basic information of the bumps. It maps the bumps to the effective height map to obtain the effective height data of the bumps and the reference substrate data. Based on the effective height data and the reference substrate data, it obtains the relative height data between the bump and the reference substrate, and obtains the detection result based on the basic information and the corresponding relative height data. Compared with existing chip inspection solutions, the three-dimensional inspection method for semiconductor chips provided in this implementation environment can reduce the requirements for the contrast of the acquired height data. It can also detect anomalies such as missing bumps due to poor chip manufacturing processes, defect-covered bumps, and defects being mistaken for bump spheres through template matching, making chip inspection more robust.

[0077] It should be noted that, Figure 1 The server 20 in the implementation environment shown can be a standalone server or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms. No restrictions are imposed here.

[0078] Figure 3 This is a flowchart illustrating a three-dimensional inspection method for a semiconductor chip, as shown in an exemplary embodiment of this application. This method can be applied to... Figure 1 The implementation environment shown, and by Figure 1 The method is specifically executed by server 20 in the illustrated embodiment environment. However, in other implementation environments, this method can be executed by devices in those environments, and this embodiment does not impose any limitations on this.

[0079] like Figure 3 As shown, in an exemplary embodiment, the three-dimensional detection method for the semiconductor chip may include steps S301 to S306, which are described in detail below:

[0080] Step S301: Obtain the height detection data and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, through the 3D camera probe.

[0081] Step S302: Match the detection die with the template die of the chip wafer under test to obtain the valid die from the detection die.

[0082] Step S303: Based on the height detection data and intensity detection data corresponding to the effective die, an effective intensity map and an effective height map are formed.

[0083] Step S304: Obtain the target binary map based on the effective intensity map, identify and obtain the bump in the target binary map, and the basic information of the bump.

[0084] Step S305: Map the Bump onto the effective height map to obtain the effective height data and reference base data of the Bump.

[0085] Step S306: Obtain the relative height data between the Bump and the reference base based on the effective height data and the reference base data, and obtain the detection result based on the basic information and the corresponding relative height data.

[0086] In this embodiment, the intensity detection data collected by the 3D camera probe refers to the grayscale value at the camera pixel position corresponding to the detection height, generally the grayscale value at the focal plane of the sample. For samples with height differences, it refers to the grayscale value at their respective focal planes. A die (chip / chip) refers to a small, independent, functionally identical square unit on a wafer; each die is the core part of an unpackaged chip. A bump, often called a solder ball, is a microstructure in semiconductor packaging (especially advanced packaging), a tiny, usually spherical, conductive bump formed on the chip's I / O (input / output) pads. A template die refers to a die pre-obtained on the wafer of the chip under test, where a clear, undamaged, and covered bump can be identified.

[0087] In this embodiment, during semiconductor chip wafer inspection, a 3D camera probe acquires height and strength detection data of the chip wafer under test, as well as inspection dies on the chip wafer. To address issues such as missing bumps or defect-damaged bumps due to poor manufacturing processes of the wafer under test, leading to missed bump detections and abnormal height measurements, the embodiment provided in this application sets up template dies with corresponding template height and strength data. The inspection die is matched with the template die of the chip wafer under test, and the inspection die is trimmed to obtain the valid dies from the inspection dies.

[0088] Then, based on the height and intensity detection data corresponding to the effective dies, effective intensity and effective height maps are generated. Based on the effective intensity map, a target binary map is obtained, and bumps and their basic information are identified within the target binary map. The binarization method can be adapted to the detected product by selecting adaptive thresholds, Otsu thresholds, or gradient thresholds, etc.

[0089] Finally, in order to obtain the height data for qualification determination, the Bump determined in the target binary map is mapped to the effective height map to obtain the effective height data of the Bump and the reference base data; based on the effective height data and the reference base data, the relative height data between the Bump and the reference base is obtained, and the detection result is obtained based on the basic information and the corresponding relative height data.

[0090] In addition, in order not to affect the subsequent identification of other adjacent bumps, in other embodiments provided in this application, the missing parts can also be filled in by templates. That is, the final valid die includes the actual valid die and the template die, and the filled template die is marked so that the detection results corresponding to the actual valid die can be output later.

[0091] As can be seen from the above, in the method provided in this embodiment, on the one hand, the height detection data and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, are acquired through a 3D camera probe; the detection die and the template die of the chip wafer under test are matched to obtain the valid die among the detection dies. In this way, the matching with the template die solves the problems of abnormal bump height caused by bump loss due to poor die manufacturing process, dirt, scratches, etc. covering the bump sphere, and abnormal measurement caused by substrate defects being regarded as bumps.

[0092] On the other hand, after determining the valid dies, effective intensity maps and effective height maps are formed based on the height and intensity detection data corresponding to the valid dies. A target binary map is obtained based on the effective intensity map, and bumps and their basic information are identified within the target binary map. The bumps are mapped onto the effective height map to obtain their effective height data and reference base data. The relative height data between the bump and the reference base is obtained based on the effective height data and the reference base data, and the detection result is obtained based on the basic information and the corresponding relative height data. In this way, by obtaining the target binary map from the effective intensity map and determining the bumps within the valid dies based on the target binary map, the problem of missing detections due to the inability to extract the size and position information of all bumps from the height images acquired by some detection dies using binarization methods is solved.

[0093] Therefore, this application can determine the bump through a binarized intensity map, and then map it to the height data to calculate the height of the bump. This reduces the requirement for contrast of the acquired height data. At the same time, the target binary map can be obtained through the template die, and the bump and its basic information can be identified in the binary map. Then, the height of the bump can be calculated by mapping it to the height data. This can detect anomalies such as missing bumps due to poor chip manufacturing process, defects covering bumps, and defects being treated as bump spheres, making chip detection more robust.

[0094] In an exemplary embodiment of this application, the specific steps for obtaining a target binary map based on an effective intensity map, identifying and acquiring bumps in the target binary map, and the basic information of the bumps may include:

[0095] When the detection rate of bumps on the effective intensity map is less than the preset detection rate threshold, the template image of the template die is binarized to obtain the target binary map.

[0096] Alternatively, if the detection rate of bumps on the effective intensity map is greater than or equal to a preset detection rate threshold, the effective intensity map is binarized to obtain the target binary map.

[0097] Identify and obtain the bump in the target binary image, as well as the basic information of the bump.

[0098] In this embodiment, when the detection rate of bumps on the effective intensity map is greater than or equal to a preset detection rate threshold, the effective intensity map is binarized to obtain a target binary map, thereby identifying and acquiring the bumps in the target binary map. This solves the problem that height images cannot extract the size and location information of all bumps through binarization methods, resulting in the inability to measure the height of some bumps and causing missed detections. Figure 4 As shown, Figure 4 In one embodiment, this is a comparison of the effects between the target binary map of the intensity map and the target binary map of the height map.

[0099] Furthermore, if the detection rate of bumps on the effective intensity map is less than a preset detection rate threshold, it indicates that bumps cannot be identified in the effective intensity map. Therefore, the template die is binarized to determine the bump location and map it onto the effective height map to complete the height data detection. This further solves the problem of bumps being unmeasurable due to missing bumps or being covered by dirt. Figure 5 As shown, Figure 5 This is a comparison result of process leak bump detection and template die detection.

[0100] In an exemplary embodiment of this application, the specific steps for acquiring height detection data and intensity detection data of the chip wafer under test using a 3D camera probe, and for detecting dies on the chip wafer under test, may include:

[0101] Data is collected on each die on the chip wafer under test by a 3D camera probe along a preset acquisition direction, and the height detection data and intensity detection data of each die are obtained and formed into a bin file;

[0102] Read the bin file and stitch the images on the die according to the preset stitching rules to obtain the stitched die, which is used as the detection die.

[0103] In this embodiment, a 3D camera probe collects data on each die along a preset acquisition direction on the wafer under test, obtaining height and intensity detection data for each die, and forming a bin file. Simultaneously, the images needed to stitch the dies are monitored. For example... Figure 6 As shown, Figure 6 This is a schematic diagram of a bin file storing height detection data and intensity detection data in one embodiment of this application.

[0104] Once all height and intensity data for a die have been collected, a stitching operation is triggered. The bin file is read, and the image is stitched together according to the preset stitching rules, corresponding to the number of rows and columns, to obtain the stitched die, which serves as the detection die. Figure 7 As shown, Figure 7 This is a schematic diagram of preset splicing rules and corresponding position image IDs in one embodiment of this application.

[0105] In another exemplary embodiment provided in this application, when the die on the chip wafer under test is an extra-large die with a size greater than a preset threshold, rather than a normal die with a size less than or equal to the preset threshold, the images on the die are stitched together according to a preset stitching rule to obtain a stitched die. Specific steps for detecting the die may include:

[0106] The super-large die is cut into multiple blocks;

[0107] Within each block, the images on the block are stitched together according to a preset stitching rule to obtain multiple stitched blocks;

[0108] The spliced ​​blocks are used as the detection die.

[0109] In this embodiment, the large die is divided according to the block size in the algorithm parameter configuration file to obtain multiple blocks, such as block_0, block_1, block_2, and block_3. Within each block, the image on the block is stitched together according to the preset stitching rules corresponding to the block, resulting in multiple stitched blocks. These multiple stitched blocks are then used as the detection die. Figure 8 As shown, Figure 8 This is a schematic diagram of the preset stitching rules and corresponding position image IDs for the blocks of an ultra-large die in one embodiment of this application.

[0110] Thus, through the above embodiments, this application performs splicing processing on the die on the chip wafer under test that is larger than a preset threshold, which is different from normal dies, thereby improving data processing speed.

[0111] In an exemplary embodiment of this application, the specific steps for mapping the Bump to an effective height map and obtaining the effective height data and reference base data of the Bump may include:

[0112] Obtain the mapping relationship between the effective intensity map and the effective height map;

[0113] Based on the mapping relationship, the Bump is mapped proportionally to the effective height map to obtain the target height map;

[0114] Obtain the effective height data of the Bump in the target height map, as well as the reference base data corresponding to the Bump.

[0115] In another exemplary embodiment, the specific steps of mapping the Bump proportionally onto the effective height map based on the mapping relationship to obtain the target height map may include:

[0116] In the target binary image, obtain the centroid of each bump, and expand outward by a preset specified number of pixels with the centroid as the center to obtain the first measurement area of ​​the bump;

[0117] By expanding outward from the centroid within a pre-defined range, the second measurement area corresponding to the four reference bases of the Bump is obtained;

[0118] Based on the mapping relationship, the first and second measurement areas are mapped proportionally onto the effective height map to obtain the target height map.

[0119] like Figure 9 As shown, Figure 9 This is a schematic diagram of a bump in a target binary image according to one embodiment of this application. In this embodiment, after obtaining the target binary image corresponding to the intensity map or the template die, the following steps are taken: Figure 9The centroid of each bump in the target binary image is shown, and a first measurement region of the bump is obtained by expanding a preset specified number of pixels outward from the centroid; at the same time, a second measurement region of the four reference bases corresponding to the bump is obtained by expanding a preset specified range outward from the centroid.

[0120] Then, based on the mapping relationship between the effective intensity map and the effective height map, the first and second measurement areas are proportionally mapped onto the effective height map to obtain the target height map. For example... Figure 10 As shown, Figure 10 This is a schematic diagram illustrating the process of mapping the first measurement area and the second measurement area proportionally onto the effective height map in one embodiment of this application.

[0121] It should also be noted that in the embodiments provided in this application, there is no absolute sequential relationship between the steps of determining the first measurement area and the second measurement area and the step of mapping the Bump to the effective height map on a proportional scale. The area can be determined and then mapped, or the area can be determined after mapping.

[0122] Thus, through the above embodiments, this application determines the bump by using a binarized intensity map, and then maps it to the height data to calculate the height of the bump, which reduces the requirement for contrast in the acquired height data.

[0123] In an exemplary embodiment of this application, the specific steps of obtaining the relative height data between the bump and the reference base based on the effective height data and the reference base data, and obtaining the detection result based on the basic information and the corresponding relative height data, may include:

[0124] Based on the effective height data of all pixels in the effective height map and the reference base data, the first average height of the Bump and the second average height of the reference base are obtained.

[0125] The relative height data is obtained based on the difference between the first average height and the second average height.

[0126] The basic information and corresponding relative height data are saved to a CSV file as the detection result. The basic information includes the size and location of the bump.

[0127] In this embodiment, in the effective height map, a first average height of the effective height data for all pixels in the bump measurement area and a second average height of the reference base are calculated; relative height data is obtained based on the difference between the first average height and the second average height; the basic information and the corresponding relative height data are saved to a CSV file as the detection result, whereby the basic information includes the size and location information of the bump. Please refer to... Figure 11 , Figure 11This is a schematic diagram of the contents of a CSV file storing basic bump information and relative height data, as shown in one embodiment of this application. Figure 11 As shown, the CSV file can also be configured with relevant parameters for the 3D camera, such as various pixels of the bump, camera coordinates, and machine coordinates.

[0128] An exemplary embodiment of this application further includes a qualification determination step, which may specifically include:

[0129] The relative height data is compared with a preset acceptable height threshold range to obtain the comparison result;

[0130] If the comparison result indicates that the relative height data is within the preset qualified height threshold range, the corresponding bump is determined to be qualified.

[0131] If the comparison result indicates that the relative height data is not within the preset acceptable height threshold range, the corresponding bump is determined to be unacceptable.

[0132] In this embodiment, the relative height data of the bump ball is used as an indicator to measure whether the bump ball is qualified. The method to determine whether the bump ball is qualified is to compare the relative height data with the standard height upper and lower limit control data of the preset qualified height threshold range. Bumps with relative height data higher than the standard height upper limit or lower than the standard height lower limit are determined to be unqualified, while bumps with relative height between the standard height lower and upper limits are determined to be qualified, so as to improve the accuracy of chip wafer inspection.

[0133] Figure 12 This is a block diagram illustrating a three-dimensional inspection device 1200 for a semiconductor chip, as shown in an exemplary embodiment of this application. Figure 12 As shown, the device includes:

[0134] The acquisition unit 1201 is used to acquire height detection data and strength detection data of the chip wafer under test, as well as the detection die on the chip wafer under test, through a 3D camera probe.

[0135] The matching unit 1202 is used to match the detection die with the template die of the chip wafer under test to obtain the valid die among the detection dies;

[0136] Effective image unit 1203 is used to form an effective intensity map and an effective height map based on the height detection data and intensity detection data corresponding to the effective die;

[0137] Bump recognition unit 1204 is used to obtain a target binary map based on the effective intensity map, identify and obtain the bump in the target binary map, and the basic information of the bump;

[0138] The mapping unit 1205 is used to map the Bump onto the effective height map to obtain the effective height data and reference base data of the Bump.

[0139] The result unit 1206 is used to obtain the relative height data between the Bump and the reference base based on the effective height data and the reference base data, and to obtain the detection result based on the basic information and the corresponding relative height data.

[0140] This device applies the three-dimensional detection method for semiconductor chips provided in this application. It determines the bump by using a binarized intensity map, and then maps it to the height data to calculate the height of the bump. This reduces the requirement for contrast of the acquired height data. At the same time, it can detect anomalies such as missing bumps due to poor chip manufacturing process, defect covering bumps, and defects being mistaken for bump spheres through template matching, making chip detection more robust.

[0141] In another exemplary embodiment, the acquisition unit 1201 is further configured to acquire data on each die along a preset acquisition direction on the chip wafer under test using a 3D camera probe, obtain height detection data and intensity detection data of each die, and form a bin file; read the bin file, and stitch the images on the die according to a preset stitching rule to obtain the stitched die, which serves as the detection die.

[0142] In another exemplary embodiment, the die on the chip wafer under test is an ultra-large die with a size greater than a preset threshold; the acquisition unit 1201 is further used to cut the ultra-large die to obtain multiple blocks; within each block, the image on the block is stitched together according to a preset stitching rule to obtain multiple stitched blocks; the multiple stitched blocks are used as the detection die.

[0143] In another exemplary embodiment, the Bump recognition unit 1204 is further configured to: when the detection rate of Bumps on the effective intensity map is less than a preset detection rate threshold, perform binarization processing on the template image of the template die to obtain a target binary map; or, when the detection rate of Bumps on the effective intensity map is greater than or equal to the preset detection rate threshold, perform binarization processing on the effective intensity map to obtain a target binary map; and identify and obtain the Bumps in the target binary map, as well as the basic information of the Bumps.

[0144] In another exemplary embodiment, the mapping unit 1205 is further configured to obtain the mapping relationship between the effective intensity map and the effective height map; based on the mapping relationship, map the bump proportionally onto the effective height map to obtain a target height map; and obtain the effective height data of the bump in the target height map, as well as the reference base data corresponding to the bump.

[0145] In another exemplary embodiment, the mapping unit 1205 is further configured to: obtain the centroid of each bump in the target binary map; expand a predetermined number of pixels outward from the centroid to obtain a first measurement region of the bump; expand a predetermined range outward from the centroid to obtain a second measurement region of the four reference bases corresponding to the bump; and based on the mapping relationship, map the first measurement region and the second measurement region proportionally onto the effective height map to obtain a target height map.

[0146] In another exemplary embodiment, the result unit 1206 is further configured to obtain a first average height of the bump and a second average height of the reference base based on the effective height data of all pixels in the effective height map and the reference base data; obtain relative height data based on the difference between the first average height and the second average height; and save the basic information and the corresponding relative height data to a CSV file as a detection result, wherein the basic information includes the size information and position information of the bump.

[0147] In another exemplary embodiment, the device further includes:

[0148] The pass / fail determination unit is used to compare the relative height data with a preset pass / fail height threshold range to obtain a comparison result; if the comparison result indicates that the relative height data is within the preset pass / fail height threshold range, the corresponding bump is determined to be pass / fail; if the comparison result indicates that the relative height data is not within the preset pass / fail height threshold range, the corresponding bump is determined to be fail / fail.

[0149] It should be noted that the three-dimensional semiconductor chip inspection device and the three-dimensional semiconductor chip inspection method provided in the above embodiments belong to the same concept. The specific operation methods of each module and unit have been described in detail in the method embodiments and will not be repeated here. In practical applications, the three-dimensional semiconductor chip inspection device provided in the above embodiments can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. This is not a limitation here.

[0150] Embodiments of this application also provide an electronic device, including: one or more processors; and a storage device for storing one or more programs, wherein when the one or more programs are executed by the one or more processors, the electronic device enables the three-dimensional detection method of the semiconductor chip provided in the above embodiments.

[0151] Figure 13 A schematic diagram of a computer system suitable for implementing the embodiments of this application is shown. It should be noted that... Figure 13 The computer system 1300 of the electronic device shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of this application.

[0152] like Figure 13 As shown, the computer system 1300 includes a Central Processing Unit (CPU) 1301, which can perform various appropriate actions and processes, such as executing the methods described in the above embodiments, based on programs stored in Read-Only Memory (ROM) 1302 or programs loaded from storage portion 1308 into Random Access Memory (RAM) 1303. The RAM 1303 also stores various programs and data required for system operation. The CPU 1301, ROM 1302, and RAM 1303 are interconnected via a bus 1304. An Input / Output (I / O) interface 1305 is also connected to the bus 1304.

[0153] The following components are connected to I / O interface 1305: an input section 1306 including a keyboard, mouse, etc.; an output section 1307 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and speakers, etc.; a storage section 1308 including a hard disk, etc.; and a communication section 1309 including a network interface card such as a LAN (Local Area Network) card, modem, etc. The communication section 1309 performs communication processing via a network such as the Internet. A drive 1310 is also connected to I / O interface 1305 as needed. Removable media 1311, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 1310 as needed so that computer programs read from them can be installed into storage section 1308 as needed.

[0154] Specifically, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program including a computer program for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 1309, and / or installed from removable medium 1311. When the computer program is executed by central processing unit (CPU) 1301, it performs various functions defined in the system of this application.

[0155] It should be noted that the computer-readable medium shown in the embodiments of this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this application, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, carrying a computer-readable computer program. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media can also be any computer-readable medium other than computer-readable storage media, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to wireless, wired, etc., or any suitable combination thereof.

[0156] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. Each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram or flowchart, and combinations of blocks in a block diagram or flowchart, may be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0157] The units described in the embodiments of this application can be implemented in software or hardware, and the described units can also be located in a processor. The names of these units do not necessarily limit the specific unit itself.

[0158] Another aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the aforementioned three-dimensional detection method for a semiconductor chip. This computer-readable storage medium may be included in the electronic device described in the above embodiments, or it may exist independently and not assembled into the electronic device.

[0159] Another aspect of this application provides a computer program product or computer program including computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the three-dimensional detection method for semiconductor chips provided in the various embodiments described above.

[0160] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A three-dimensional inspection method of a semiconductor chip, characterized by, The method comprises: obtaining height detection data and intensity detection data of a chip wafer to be measured and detection dies on the chip wafer to be measured by a 3D camera probe; matching the detection dies and template dies of the chip wafer to be measured to obtain effective dies in the detection dies; forming effective intensity maps and effective height maps based on the height detection data and the intensity detection data corresponding to the effective dies; obtaining a target binary map based on the effective intensity maps, identifying and obtaining bumps in the target binary map, and basic information of the bumps; obtaining a mapping relationship between the effective intensity maps and the effective height maps; in the target binary map, obtaining a centroid of each of the bumps, and obtaining a first measurement area of the bump by extending a preset specified pixel outward from the centroid as a center; extending a preset specified range outward from the centroid as a center to obtain a second measurement area of four reference substrates corresponding to the bump; based on the mapping relationship, mapping the first measurement area and the second measurement area to the effective height maps in a proportional manner to obtain a target height map; obtaining effective height data of the bumps in the target height map and reference substrate data corresponding to the bumps; obtaining relative height data between the bumps and the reference substrates based on the effective height data and the reference substrate data, and obtaining a detection result based on the basic information and the corresponding relative height data.

2. The method of claim 1, wherein, The method comprises: obtaining height detection data and intensity detection data of a chip wafer to be measured and detection dies on the chip wafer to be measured by a 3D camera probe; reading the bin file and splicing images on the dies according to a preset splicing rule to obtain spliced dies as detection dies.

3. The method of claim 2, wherein, The dies on the chip wafer to be measured are super-large dies with a size greater than a preset threshold; The method comprises: cutting the super-large dies to obtain a plurality of blocks; splicing images on the blocks according to a preset splicing rule to obtain spliced blocks in each block; The spliced blocks are taken as detection dies.

4. The method of claim 1, wherein, The method comprises: when a detection rate of detected bumps on the effective intensity maps is less than a preset detection rate threshold, performing binaryzation processing on a template image of the template dies to obtain a target binary map; or, when the detection rate of the detected bumps on the effective intensity maps is greater than or equal to the preset detection rate threshold, performing binaryzation processing on the effective intensity maps to obtain a target binary map. Identify a bump in the target binary image and basic information of the bump.

5. The method of claim 1, wherein, The relative height data between the bump and the reference substrate is obtained based on the effective height data and the reference substrate data, and a detection result is obtained based on the basic information and the corresponding relative height data, including: A first height average value of the bump and a second height average value of the reference substrate are obtained based on the effective height data and the reference substrate data of all pixels in the effective height image; The relative height data is obtained based on the difference between the first height average value and the second height average value; The basic information including size information and position information of the bump and the corresponding relative height data are saved to a csv file as a detection result.

6. The method of claim 1, wherein, The method further includes: The relative height data is compared with a preset qualified height threshold range to obtain a comparison result; If the comparison result indicates that the relative height data is in the preset qualified height threshold range, it is determined that the corresponding bump is qualified; If the comparison result indicates that the relative height data is not in the preset qualified height threshold range, it is determined that the corresponding bump is unqualified.

7. A three-dimensional inspection device for semiconductor chips, characterized in that, The device is used to perform the three-dimensional detection method of the semiconductor chip as claimed in any one of claims 1 to 6, and the device includes: An acquisition unit configured to acquire height detection data and intensity detection data of a chip wafer to be detected and a detection die on the chip wafer to be detected by a 3D camera probe; A matching unit configured to match the detection die and a template die of the chip wafer to be detected to obtain an effective die in the detection die; An effective image unit configured to form an effective intensity image and an effective height image based on the height detection data and the intensity detection data corresponding to the effective die; A bump identification unit configured to obtain a target binary image based on the effective intensity image, identify a bump in the target binary image, and obtain basic information of the bump; A mapping unit configured to obtain a mapping relationship between the effective intensity image and the effective height image; in the target binary image, obtain a centroid of each bump, and obtain a first measurement area of the bump by extending a preset specified pixel outward from the centroid as a center; obtain a second measurement area of four reference substrates corresponding to the bump by extending a preset specified range outward from the centroid as a center; based on the mapping relationship, map the first measurement area and the second measurement area to the effective height image in a proportional manner to obtain a target height image; and obtain effective height data of the bump in the target height image and reference substrate data corresponding to the bump; A result unit configured to obtain relative height data between the bump and the reference substrate based on the effective height data and the reference substrate data, and obtain a detection result based on the basic information and the corresponding relative height data.

8. An electronic device, comprising: The electronic device is configured to perform the three-dimensional detection method of a semiconductor chip according to any one of claims 1 to 6, and the electronic device comprises: one or more processors; a memory configured to store one or more programs, when the one or more programs are executed by the one or more processors, the electronic device is enabled to implement the three-dimensional detection method of a semiconductor chip according to any one of claims 1 to 6.

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