Wafer flip device with force feedback and dynamic compensation

Abstract

The application belongs to the technical field of semiconductor devices, and particularly relates to a wafer flip device with force feedback and dynamic compensation, which comprises a bearing plate and a main suction nozzle for picking up a chip, a circular shell is installed on the bearing plate, a main shaft is installed on the circular shell, a No. 1 pipeline is installed in the main shaft, the No. 1 pipeline is communicated with the main suction nozzle, the No. 1 pipeline is externally connected with a negative pressure gas supply system, and the wafer flip device further comprises: a No. 1 detection assembly, the No. 1 detection assembly comprises: an air bag and a pressure sensor which are installed in the main shaft; a control system which is electrically connected with the pressure sensor and the negative pressure gas supply system; and a simplified force feedback structure relying on the air bag and the single pressure sensor, which can effectively avoid chip cracks and corner damage caused by hard contact and ensure adsorption stability, meanwhile, dynamic compensation of adsorption force can always maintain the stable posture of the chip, and can prevent inclination and misplacement problems caused by suction force fluctuation, and finally can significantly improve the alignment accuracy of chip and substrate bump interconnection.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of semiconductor devices, and particularly relates to a wafer flip device with force feedback and dynamic compensation. BACKGROUND

[0002] Wafer flip is an advanced packaging technology for chips, and the core thereof is to change the posture of the chip through a flip device to turn the originally upward active surface to downward, so that the chip is directly interconnected with a substrate or a packaging carrier through bumps. This innovative technology can significantly shorten the signal transmission path inside the chip, greatly enhance the heat dissipation performance, effectively reduce the signal delay and power consumption, and fully release the electrical performance potential of the chip, thereby providing key technical support for the realization of high-density and high-performance electronic devices.

[0003] A patent application with the publication number CN215815829U discloses a chip packaging pickup device, which comprises a cabinet body, a box body mounted on the cabinet body, a first air cylinder mounted on the top of the box body, a cantilever mounted on the first air cylinder, a second air cylinder mounted on the other end of the cantilever, a push end of the second air cylinder extending below the cantilever and mounted with a connecting plate, and a connecting plate fixedly sleeved with a connecting rod at an end away from the first air cylinder. The suction cup is preliminarily lifted by the first air cylinder, and then lifted again by the second air cylinder to the upper side of the chip, and the chip is picked up by the suction cup.

[0004] In the above-mentioned scheme, the suction cup generates negative pressure through a negative pressure air supply system to adsorb the chip, but there are two obvious deficiencies: first, the adsorption force between the chip and the suction cup cannot be quantitatively controlled, and the chip is easily damaged due to excessive suction force, which directly affects the packaging yield; second, the contact force between the suction cup and the chip at the moment of contact lacks effective monitoring, which may further cause chip damage or positioning deviation due to improper contact force, thereby restricting the processing reliability of the device for precise chips.

[0005] Therefore, the present application provides a wafer flip device with force feedback and dynamic compensation. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical scheme adopted by the present application to solve its technical problems is: the wafer flip device with force feedback and dynamic compensation comprises a bearing plate and a main suction nozzle for picking up a chip, a circular shell is installed on the bearing plate, a main shaft is installed on the circular shell, a No. 1 pipeline is installed in the main shaft, the No. 1 pipeline is communicated with the main suction nozzle, the No. 1 pipeline is externally connected with a negative pressure gas supply system, and the wafer flip device further comprises a No. 1 detection assembly, the No. 1 detection assembly comprises an air bag and a pressure sensor installed in the main shaft, a No. 1 abutting plate installed on the main shaft, and a No. 2 abutting plate installed on the main suction nozzle, the No. 1 abutting plate and the No. 2 abutting plate are respectively abutted at the upper and lower ends of the air bag, the main suction nozzle is slidably connected with the main shaft, the pressure sensor is located on the side wall of the main shaft, the air bag is provided with a No. 1 protrusion, the pressure sensor is located within the protruding range of the No. 1 protrusion, and a control system is electrically connected with the pressure sensor and the negative pressure gas supply system.

[0008] Preferably, the wafer flip device further comprises a No. 1 connecting block installed on the outside of the main shaft, a plurality of slide rail groups installed on the No. 1 connecting block, each slide rail group comprising two slide rails, a mounting seat slidably installed on the slide rail group, and a secondary suction nozzle installed on the mounting seat.

[0009] Preferably, the wafer flip device further comprises a No. 2 connecting block slidably installed on the main shaft, a connecting rod installed between the No. 2 connecting block and the mounting seat, and both ends of the connecting rod being rotatably connected with the No. 2 connecting block and the mounting seat, respectively, a threaded rod driving the No. 2 connecting block to slide relative to the main shaft, one end of the threaded rod being rotatably installed on the circular shell, and the control system being electrically connected with the threaded rod.

[0010] Preferably, the wafer flip device further comprises a transition cavity shell installed in the circular shell, a No. 2 pipeline communicated between the transition cavity shell and the secondary suction nozzle, an electric three-way valve installed on the transition cavity shell, the electric three-way valve comprising three connecting pipelines, two of which are connected with the No. 1 pipeline and the transition cavity shell, respectively, and the other one being externally connected with a positive pressure gas supply system, and the electric three-way valve and the positive pressure gas supply system being electrically connected with the control system.

[0011] Preferably, the wafer flip device further comprises a No. 3 connecting block installed on the main shaft, a No. 1 electric telescopic rod installed between the No. 3 connecting block and the No. 1 connecting block, the No. 1 connecting block being slidably connected with the main shaft, the No. 1 electric telescopic rod being electrically connected with the control system, a circular ring block slidably installed on the No. 2 connecting block, the circular ring block being threadedly connected with the threaded rod, and a No. 1 spring being installed between the circular ring block and the No. 2 connecting block.

[0012] Preferably, a circular tube is mounted on the outer periphery of the auxiliary suction nozzle, the auxiliary suction nozzle is in sliding connection with the circular tube, the circular tube is in rotational connection with the mounting seat, a second detection assembly is mounted on the circular tube, and the structure of the second detection assembly is consistent with that of the first detection assembly.

[0013] Preferably, the transition cavity shell is further provided with a plurality of tapered pipes in communication with the transition cavity shell through the second pipe, a tapered stopper is slidably mounted on the tapered pipe, a second telescopic rod is used to drive the sliding of the tapered stopper, the fixed end of the second telescopic rod is fixedly mounted on the transition cavity shell, the movable end of the second telescopic rod penetrates through the transition cavity shell and is connected with the tapered stopper, and the second telescopic rod is electrically connected with the control system.

[0014] Preferably, the air bags of the first detection assembly and the second detection assembly further comprise a second protrusion, a first pressing plate and a second pressing plate are slidably mounted on the circular tube and the main shaft respectively, and the first pressing plate and the second pressing plate are used to press the second protrusion.

[0015] Preferably, the first detection assembly and the second detection assembly further comprise an electromagnet and a second spring, the electromagnet is used to control the sliding of the first pressing plate and the second pressing plate, the second spring of the first detection assembly is located between the second pressing plate and the main shaft, and the second spring of the second detection assembly is located between the circular tube and the first pressing plate.

[0016] The beneficial effects of the present application are as follows:

[0017] 1. The wafer flip device with force feedback and dynamic compensation can accurately monitor and control the contact resistance force and negative pressure adsorption force of the main and auxiliary suction nozzles and the chip through the force feedback structure of the air bag and the single pressure sensor, effectively avoids chip cracks and corner damage caused by hard contact, prevents damage to the internal circuit of the chip caused by excessive suction force, reduces packaging problems from the root, and significantly improves the alignment accuracy of the chip and the substrate bump interconnection.

[0018] 2. The wafer flip device with force feedback and dynamic compensation can adapt to chips of various sizes without replacing different specifications of suction nozzles by means of the slide rail group, the slidable auxiliary suction nozzle and the threaded rod driving structure, meets the needs of multi-category chip packaging scenes, and evenly disperses the adsorption force to multiple contact points through the cooperation of multiple auxiliary suction nozzles and the main suction nozzle, avoids chip cracking and deformation caused by excessive local stress when a single suction nozzle is adsorbed, and adapts to the processing of chips made of different materials.

[0019] 3. The wafer flip device with force feedback and dynamic compensation provided by the application can direct the impurities on the chip surface through the positive pressure airflow in the vice suction nozzle blowing stage, and the second detection assembly can monitor the blowing intensity in real time and dynamically adjust the airflow. When the chip edge is warped, through the targeted pressurization design of the conical pipe and the conical block and the pressure dispersion of the double protrusions, it can accurately judge whether the warped edge is flattened, adapt to small range pressure sensors to improve the detection accuracy, simplify the judgment logic, and ensure the stability and efficiency of subsequent adsorption picking. BRIEF DESCRIPTION OF DRAWINGS

[0020] The application will be further described below in combination with the drawings.

[0021] Figure 1 is a perspective view of an embodiment of the application;

[0022] Figure 2 is a position schematic view of the first detection assembly of the application;

[0023] Figure 3 is a position schematic view of the electric three-way valve of the application;

[0024] Figure 4 is a structure schematic view of the first electric telescopic rod of the application;

[0025] Figure 5 is a cross-sectional view of the main shaft, the first pipe, the transition cavity shell and the conical pipe of the application;

[0026] Figure 6 is Figure 5 is a local enlarged view of A in FIG. 6;

[0027] Figure 7 is a cross-sectional view of the second connecting block of the application;

[0028] Figure 8 is a cross-sectional view of the circular pipe of the application;

[0029] In the figure: 1, bearing plate; 2, main suction nozzle; 3, circular shell; 4, main shaft; 5, first pipe; 6, first detection assembly; 61, pressure sensor; 62, first stop plate; 63, second stop plate; 64, air bag; 65, first protrusion; 66, second protrusion; 67, second pressure plate; 68, electromagnet; 7, first connecting block; 8, sliding rail; 9, mounting seat; 10, vice suction nozzle; 11, second connecting block; 12, connecting rod; 13, threaded rod; 14, transition cavity shell; 15, second pipe; 16, electric three-way valve; 17, third connecting block; 18, first electric telescopic rod; 19, circular ring block; 20, circular pipe; 21, second detection assembly; 211, first pressure plate; 22, conical pipe; 23, conical block; 24, second telescopic rod. DETAILED DESCRIPTION

[0030] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0031] like Figures 1-8 As shown, an embodiment of the present invention provides a flip chip device with force feedback and dynamic compensation, comprising a carrier plate 1 and a main suction nozzle 2 for picking up chips. A circular shell 3 is mounted on the carrier plate 1, and a main shaft 4 is mounted on the circular shell 3. A first pipe 5 is installed inside the main shaft 4, and the first pipe 5 is connected to the main suction nozzle 2. The first pipe 5 is externally connected to a negative pressure air supply system. The device also includes a first detection component 6, which includes an airbag 64 and a pressure sensor 61 installed inside the main shaft 4; a first abutment plate 62 installed on the main shaft 4; and a second abutment plate 63 installed on the main suction nozzle 2. The first abutment plate 62 and the second abutment plate 63 respectively abut against the upper and lower ends of the airbag 64. The main suction nozzle 2 is slidably connected to the main shaft 4. The pressure sensor 61 is located on the side wall of the main shaft 4. The airbag 64 has a first protrusion 65, and the pressure sensor 61 is located within the protrusion range of the first protrusion 65. A control system is also included, which is electrically connected to the pressure sensor 61 and the negative pressure air supply system.

[0032] Specifically, the existing main suction nozzle 2 generates negative pressure through a negative pressure air supply system to adsorb the chip, but it has two obvious shortcomings: First, the adsorption force between the chip and the suction cup cannot be quantitatively controlled, and the chip is easily damaged due to excessive suction, which directly affects the packaging yield; Second, the contact force between the suction cup and the chip at the moment of contact lacks effective monitoring, which may further damage the chip or cause positioning deviation due to improper contact force, thus restricting the reliability of the device in processing precision chips.

[0033] When the main suction nozzle 2 moves to contact the chip, the reverse force of the chip is transmitted to the air bag 64 through the main suction nozzle 2. The air bag 64 is squeezed, causing the first protrusion 65 to protrude. The pressure sensor 61 detects the resistance force in real time and transmits the data to the control system. The control system controls the main suction nozzle 2 to stop or continue moving based on this data. After the contact is completed, the control system starts the negative pressure air supply system. When the main suction nozzle 2 generates suction force, the force is also transmitted to the air bag 64. The pressure sensor 61 feeds back the detected value to the control system, which dynamically adjusts the output parameters of the negative pressure air supply system.

[0034] The simplified force feedback structure of the air bag 64 and the single pressure sensor 61 can synchronously realize the precise monitoring and regulation of two key forces. In the stage of the main suction nozzle 2 contacting the chip, the hard contact caused chip cracking and corner collapse can be effectively avoided. In the stage of negative pressure adsorption, the adsorption stability can be ensured to prevent the chip from falling off during transfer, and the adsorption force can be avoided to damage the internal circuit of the chip. At the same time, the dynamic compensation of the adsorption force can always maintain the stable posture of the chip to eliminate the inclination and misplacement problems caused by the fluctuation of the adsorption force. Finally, the alignment accuracy of the chip and the substrate bump interconnection can be significantly improved, the packaging failure rate can be reduced from the root, and the packaging yield can be greatly improved.

[0035] As shown in Figures 1-4 , further comprising: a first connecting block 7 mounted outside the main shaft 4; a plurality of slide rail groups mounted on the first connecting block 7, each slide rail group containing two slide rails 8; a mounting seat 9 slidably mounted on the slide rail group; and a secondary suction nozzle 10 mounted on the mounting seat 9.

[0036] Further comprising: a second connecting block 11 slidably mounted on the main shaft 4, a connecting rod 12 mounted between the second connecting block 11 and the mounting seat 9, and the two ends of the connecting rod 12 are rotatably connected with the second connecting block 11 and the mounting seat 9 respectively; a threaded rod 13 driving the second connecting block 11 to slide relative to the main shaft 4, one end of the threaded rod 13 being rotatably mounted on the circular shell 3, and the control system being electrically connected with the threaded rod 13.

[0037] Specifically, the rotation of the threaded rod 13 is controlled by a motor, and the control system is electrically connected with the motor. Before the main suction nozzle 2 and the secondary suction nozzle 10 move to contact the chip, the control system controls the rotation of the threaded rod 13, the threaded rod 13 drives the second connecting block 11 to slide downward, the second connecting block 11 pushes the mounting seat 9 and the secondary suction nozzle 10 thereon to slide on the slide rail 8 through the connecting rod 12, so as to adapt to the size of different chips, and then controls the main suction nozzle 2 and the secondary suction nozzle 10 to contact the chip.

[0038] Through the design of the slide rail group and the slidable secondary suction nozzle 10, different specifications of suction nozzles are not required to adapt to various chips, the applicability of the device in multi-specification chip packaging scenarios is improved, and when a single main suction nozzle 2 is adsorbed, all adsorption forces are concentrated at the contact point of the main suction nozzle 2 and the chip. If the chip material is brittle, the chip may crack or deform due to excessive local stress. When multiple secondary suction nozzles 10 cooperate with the main suction nozzle 2, the adsorption force can be evenly distributed to multiple contact points, so that the overall stress of the chip is balanced, and the local pressure exceeding the threshold of the chip is avoided.

[0039] As shown in Figures 1-6As shown, it also comprises: a transition cavity 14 installed in the round shell 3; a second pipeline 15 connected with the transition cavity 14 and the auxiliary suction nozzle 10; an electric three-way valve 16 installed on the transition cavity 14, the electric three-way valve 16 contains three connecting pipelines, two of which are connected with the first pipeline 5 and the transition cavity 14 respectively, and the other is connected with the positive pressure gas supply system, and the electric three-way valve 16 and the positive pressure gas supply system are electrically connected with the control system.

[0040] It also comprises: a third connecting block 17 installed on the main shaft 4; a first electric telescopic rod 18 installed between the third connecting block 17 and the first connecting block 7, the first connecting block 7 being in sliding connection with the main shaft 4, the first electric telescopic rod 18 being electrically connected with the control system; and a circular ring block 19 slidingly installed on the second connecting block 11, the circular ring block 19 being in threaded connection with the threaded rod 13, and a first spring being installed between the circular ring block 19 and the second connecting block 11.

[0041] The auxiliary suction nozzle 10 is provided with a circular tube 20 around the periphery, the auxiliary suction nozzle 10 is in sliding connection with the circular tube 20, the circular tube 20 is in rotational connection with the mounting seat 9, and the circular tube 20 is provided with a second detection assembly 21.

[0042] Specifically, the rotation of the circular tube 20 and the mounting seat 9 is controlled by electricity, in the initial state, there is a height difference between the auxiliary suction nozzle 10 and the main suction nozzle 2, and an angle is generated between the auxiliary suction nozzle 10 and the chip, and the transition cavity 14 is in communication with the second pipeline 15 and the positive pressure gas supply system;

[0043] The main suction nozzle 2 moves and contacts the chip preferentially; after the main suction nozzle 2 completes the contact with the chip, the control system synchronously starts two actions: on the one hand, the positive pressure gas supply system starts to supply gas, the gas passes through the transition cavity 14 into the second pipeline 15, and is finally sprayed out from the auxiliary suction nozzle 10; on the other hand, the threaded rod 13 is controlled to rotate, driving the auxiliary suction nozzle 10 to slide along the guide rail, in this process, the airflow sprayed out from the auxiliary suction nozzle 10 can form directional blowing on the surface of the chip, and cooperating with the sliding action of the auxiliary suction nozzle 10, the impurities such as the debris and dust adhered to the surface of the chip can be completely removed;

[0044] During the blowing process, the force acting on the surface of the chip by the auxiliary suction nozzle 10 is small, the force can be reversely transmitted to the auxiliary suction nozzle 10 and be captured in real time by the second detection assembly 21, the detection data are synchronously transmitted to the control system, the control system dynamically adjusts the gas output of the positive pressure gas supply system according to the force, so as to ensure that the blowing strength is always in a safe range;

[0045] In the process of moving the sub-suction nozzle 10, when the edge of the chip is warped, the pressure sensor 61 of the second detection assembly 21 on the corresponding position of the sub-suction nozzle 10 senses an increase in the pressure value. After the control system captures the signal, the rotation of the threaded rod 13 is stopped, so that the sub-suction nozzle 10 stops sliding, and the gas output of the positive pressure gas supply system is increased to increase the pressure of the sub-suction nozzle 10 acting on the chip. Until the warped edge of the chip is flattened, the control system restarts the rotation of all threaded rods 13, so that the sub-suction nozzle 10 continues to move until the four suction heads reach the target position and stop sliding.

[0046] Then the control system controls the positive pressure gas supply system to stop working, controls the electric three-way valve 16 to change the communication state, so that the transition cavity shell 14 is in communication with the first pipeline 5, and controls the first electric telescopic rod 18 to extend downward to drive the first connecting block 7 and the sub-suction nozzle 10 to slide downward synchronously until the sub-suction nozzle 10 is in contact with the chip. Then the control system controls the negative pressure gas supply system to start, so that suction is generated at the sub-suction nozzle 10 and the main suction nozzle 2 to pick up the chip.

[0047] As shown in Figures 1-5 , it further comprises: a plurality of tapered pipelines 22 arranged on the transition cavity shell 14, the second pipeline 15 being in communication with the transition cavity shell 14 through the tapered pipelines 22; a tapered block 23 slidingly installed on the tapered pipeline 22; a second telescopic rod 24 for driving the tapered block 23 to slide, the fixed end of the second telescopic rod 24 being fixedly installed on the transition cavity shell 14, the movable end of the second telescopic rod 24 being connected with the tapered block 23 through the transition cavity shell 14, and the second telescopic rod 24 being electrically connected with the control system.

[0048] Specifically, after a certain sub-suction nozzle 10 detects warping, the control system captures the signal and controls the corresponding second telescopic rod 24 to contract to drive the tapered block 23 to slide upward, so that the flow area of the tapered pipeline 22 increases. In the case that the overall gas supply amount of the transition cavity shell 14 is stable and the pipeline flow area of the remaining sub-suction nozzles 10 does not change, the airflow will preferentially gather in the channel with a larger flow area, so that the airflow pressure at the sub-suction nozzle 10 significantly increases, while the sub-suction nozzles 10 at the remaining positions still maintain a small airflow output, realizing targeted pressurization. If multiple sub-suction nozzles 10 detect warping at the same time, the system controls the extension and contraction of the corresponding second telescopic rod 24 in order according to the "warping height from high to low", and only one suction head is increased in wind each time.

[0049] As shown in Figure 2 , Figure 6 and Figure 8 , the air bag 64 of the first detection assembly 6 and the second detection assembly 21 further contains a second protrusion 66, a first pressing plate 211 and a second pressing plate 67 are slidingly installed on the circular tube 20 and the main shaft 4 respectively, and the first pressing plate 211 and the second pressing plate 67 are used to press the second protrusion 66.

[0050] The first detection assembly 6 and the second detection assembly 21 further comprise an electromagnet 68 for controlling the sliding of the first pressing plate 211 and the second pressing plate 67, and a second spring of the first detection assembly 6 is located between the second pressing plate 67 and the main shaft 4, and a second spring of the second detection assembly 21 is located between the circular tube 20 and the first pressing plate 211.

[0051] Specifically, the first pressing plate 211 and the second pressing plate 67 are made of a material that can cooperate with the electromagnet 68, the circular tube 20 and the main shaft 4 are made of an electromagnetically isolated material, and in the initial state, the first pressing plate 211 and the second pressing plate 67 are pressed on the second protrusion 66 to limit the protrusion of the second protrusion 66; when the cleaning operation of the auxiliary suction nozzle 10 is detected, the second telescopic rod 24 is controlled to contract to increase the air flow at the auxiliary suction nozzle 10, and the control system controls the electromagnet 68 on the auxiliary suction nozzle 10 to start at the same time, so that the first pressing plate 211 slides and the second spring is compressed, and the second protrusion 66 is in contact with the limit, so that when the air bag 64 is compressed after the auxiliary suction nozzle 10 is subjected to the reverse force of the chip, the first protrusion 65 and the second protrusion 66 deform together, so that the value of the pressure sensor 61 is always maintained within a range, and when the edge is pressed flat, the first protrusion 65 is not in contact with the pressure sensor 61, and the control system cannot detect the value, which represents that the edge is pressed flat, and then the electromagnet 68 and the second telescopic rod 24 are controlled to restore, so that the air flow is restored to the flow of the cleaning state;

[0052] This jump from pressure to no pressure directly serves as the basis for judging that the edge has been flattened, without relying on the value fluctuation range, the logic is clearer, and this method can adapt to small-range pressure sensors 61, so that the detection accuracy is higher;

[0053] When the main suction nozzle 2 and the auxiliary suction nozzle 10 are in contact with the chip and perform suction picking, the above operation can be performed, and the air pressure of the negative pressure gas supply system can be more directly judged, and the negative pressure can be adjusted.

[0054] Working principle: when the main suction nozzle 2 moves to contact the chip, the reverse force of the chip is transmitted to the air bag 64 through the main suction nozzle 2, the air bag 64 is squeezed to make the first protrusion 65 protrude, the pressure sensor 61 detects the contact force in real time and transmits the data to the control system, the control system controls the main suction nozzle 2 to stop or continue to move accordingly, after the contact is completed, the control system controls the threaded rod 13 to rotate, the threaded rod 13 drives the second connecting block 11 to slide downward, the second connecting block 11 pushes the mounting seat 9 and the auxiliary suction nozzle 10 on it to slide on the slide rail 8 through the connecting rod 12, so as to adapt to the size of different chips, at the same time, the control system controls the positive pressure gas supply system to start to supply gas, the gas enters the second pipeline 15 through the transition cavity shell 14, and finally is sprayed out from the auxiliary suction nozzle 10, the airflow sprayed out of the auxiliary suction nozzle 10 can form directional blowing on the surface of the chip, cooperating with the sliding action of the auxiliary suction nozzle 10, the impurities such as debris and dust attached to the surface of the chip can be completely removed, during the blowing process, the force acting on the surface of the chip by the auxiliary suction nozzle 10 is small, the force can be reversely transmitted to the auxiliary suction nozzle 10 and be captured in real time by the second detection assembly 21, the detection data will be transmitted to the control system at the same time, the control system dynamically adjusts the gas output of the positive pressure gas supply system according to the size of the force, so as to ensure that the blowing intensity is always in a safe range, during the movement of the auxiliary suction nozzle 10, when the edge of the chip is warped, the pressure sensor 61 of the second detection assembly 21 on the corresponding auxiliary suction nozzle 10 senses that the pressure value increases, after the control system captures the signal, the rotation of the threaded rod 13 is stopped, so that the auxiliary suction nozzle 10 stops sliding, the corresponding second telescopic rod 24 is controlled to contract, driving the conical block 23 to slide upward, so that the flow area of the conical pipeline 22 increases, under the condition that the overall gas supply amount of the transition cavity shell 14 is stable and the pipeline flow area of the remaining auxiliary suction nozzle 10 does not change, the airflow will preferentially gather in the channel with larger flow area, so that the airflow pressure at the auxiliary suction nozzle 10 is significantly increased, while the auxiliary suction nozzles 10 at other positions still maintain small airflow output, realizing targeted pressurization, at the same time, the electromagnet 68 on the auxiliary suction nozzle 10 is controlled to start, so that the first pressure plate 211 slides, the second spring is compressed, the second protrusion 66 is in contact with the limit, so that when the air bag 64 is compressed after the auxiliary suction nozzle 10 is subjected to the reverse force of the chip, the first protrusion 65 and the second protrusion 66 deform together, so that the value of the pressure sensor 61 is always maintained within a range, when the warping is flattened, the first protrusion 65 is not in contact with the pressure sensor 61, and the control system cannot detect the value, which represents that the warping is flattened, the control system restarts the rotation of all threaded rods 13, so that the auxiliary suction nozzle 10 continues to move, until all four suction nozzles reach the target position and stop sliding, then the control system controls the positive pressure gas supply system to stop working, and controls the electric three-way valve 16 to change the communication state, so that the transition cavity shell 14 is communicated with the first pipeline 5, at the same time, the control system controls the circular pipe 20 and the auxiliary suction nozzle 10 to rotate to be perpendicular to the chip, the first electric telescopic rod 18 extends downward, driving the first connecting block 7 and the auxiliary suction nozzle 10 to slide downward synchronously, until the auxiliary suction nozzle 10 contacts the chip,Subsequently, the control system controls the negative pressure air supply system to start, so that suction force is generated at the sub-suction nozzle 10 and the main suction nozzle 2 to pick up the chip.

[0055] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer flip device with force feedback and dynamic compensation, comprising a bearing plate (1) and a main suction nozzle (2), a circular shell (3) is installed on the bearing plate (1), a main shaft (4) is installed on the circular shell (3), a No. 1 pipeline (5) is installed inside the main shaft (4), the No. 1 pipeline (5) is communicated with the main suction nozzle (2), and the No. 1 pipeline (5) is connected with a negative pressure gas supply system, characterized in that, Also include: A number of detection components (6), the number of detection components (6) includes: Air bag (64) and pressure sensor (61) installed in the main shaft (4); A number of resistance plate (62) installed on the main shaft (4); The second resistance plate (63) is installed on the main suction nozzle (2), the first resistance plate (62) and the second resistance plate (63) are respectively in contact with the upper and lower ends of the air bag (64), the main suction nozzle (2) is in sliding connection with the main shaft (4), the pressure sensor (61) is located on the side wall of the main shaft (4), the air bag (64) contains a number of protrusions (65), the pressure sensor (61) is located in the protruding range of the number of protrusions (65); The control system is electrically connected with the pressure sensor (61) and the negative pressure gas supply system.

2. The apparatus according to claim 1, wherein the apparatus is characterized by: Also include: A number of connecting blocks (7) installed outside the main shaft (4); A number of slide rail groups are installed on the number of connecting blocks (7), each slide rail group contains two slide rails (8); The mounting seat (9) is slidably installed on the slide rail group; The auxiliary suction nozzle (10) is installed on the mounting seat (9).

3. The apparatus according to claim 2, wherein the apparatus is characterized by: Also include: The second connecting block (11) is slidably installed on the main shaft (4), the connecting rod (12) is installed between the second connecting block (11) and the mounting seat (9), and the two ends of the connecting rod (12) are respectively in rotary connection with the second connecting block (11) and the mounting seat (9); The threaded rod (13) drives the second connecting block (11) to slide relative to the main shaft (4), one end of the threaded rod (13) is rotatably installed on the circular shell (3), and the control system is electrically connected with the threaded rod (13).

4. The apparatus according to claim 3, wherein the apparatus further comprises a force sensor. Also include: The transition cavity shell (14) is installed in the circular shell (3); The second pipeline (15) communicates the transition cavity shell (14) and the auxiliary suction nozzle (10); The electric three-way valve (16) is installed on the transition cavity shell (14), the electric three-way valve (16) contains three connecting pipelines, two of which are connected with the first pipeline (5) and the transition cavity shell (14) respectively, and the other is connected with the positive pressure gas supply system, and the electric three-way valve (16) and the positive pressure gas supply system are electrically connected with the control system.

5. The apparatus according to claim 4, wherein the apparatus further comprises a force sensor. Also include: The third connecting block (17) is installed on the main shaft (4); The first electric telescopic rod (18) is installed between the third connecting block (17) and the first connecting block (7), the first connecting block (7) is in sliding connection with the main shaft (4), and the first electric telescopic rod (18) is electrically connected with the control system; The circular ring block (19) is slidably installed on the second connecting block (11), the circular ring block (19) is in threaded connection with the threaded rod (13), and a first spring is installed between the circular ring block (19) and the second connecting block (11).

6. The apparatus according to claim 2, wherein: The outer periphery of the auxiliary suction nozzle (10) is provided with a circular tube (20), the auxiliary suction nozzle (10) is in sliding connection with the circular tube (20), the circular tube (20) is in rotary connection with the mounting base (9), the circular tube (20) is provided with a second detection assembly (21), and the structure of the second detection assembly (21) is consistent with that of the first detection assembly (6).

7. The apparatus according to claim 5, wherein the apparatus further comprises a force sensor. Also include: A plurality of tapered pipes (22) arranged on the transition cavity shell (14), and the second pipe (15) communicates with the transition cavity shell (14) through the tapered pipes (22); A tapered stop block (23) slidingly mounted on the tapered pipe (22); A second telescopic rod (24) for driving the tapered stop block (23) to slide, the fixed end of the second telescopic rod (24) is fixedly installed on the transition cavity shell (14), the movable end of the second telescopic rod (24) penetrates through the transition cavity shell (14) and is connected with the tapered stop block (23), and the second telescopic rod (24) is in electrical connection with the control system.

8. The apparatus according to claim 6, wherein the apparatus is characterized by: The air bag (64) of the first detection assembly (6) and the second detection assembly (21) further contains a second protrusion (66), the circular tube (20) and the main shaft (4) are respectively slidingly provided with a first pressing plate (211) and a second pressing plate (67), and the first pressing plate (211) and the second pressing plate (67) are used for pressing the second protrusion (66).

9. The apparatus according to claim 8, wherein the apparatus further comprises a force sensor. The first detection assembly (6) and the second detection assembly (21) further include an electromagnet (68) and a second spring, the electromagnet (68) is used for controlling the sliding of the first pressing plate (211) and the second pressing plate (67), the second spring of the first detection assembly (6) is located between the second pressing plate (67) and the main shaft (4), and the second spring of the second detection assembly (21) is located between the circular tube (20) and the first pressing plate (211).

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