Semiconductor grinding equipment and method thereof

Abstract

The invention discloses semiconductor grinding equipment which comprises an outer shell, a group of first vertical plates, a group of second vertical plates and a grinding mechanism, the first vertical plates and the second vertical plates are arranged in the outer shell, the grinding mechanism is located between the two second vertical plates, and the grinding mechanism comprises a first grinding disc and a second grinding disc. The opposite faces of the first grinding disc and the second grinding disc are provided with grinding pads used for grinding wafers, the back faces of the first grinding disc and the second grinding disc communicate with air guide pipes, one ends of the air guide pipes are sleeved with transmission sleeves in spline connection with the air guide pipes, and the transmission sleeves penetrate through the first vertical plate and are movably connected with a bearing of the first vertical plate. According to the double-sided grinding device, the first grinding disc and the second grinding disc are arranged, and double-sided grinding operation on a wafer can be realized by controlling high-pressure gas to be injected into the first grinding disc or the second grinding disc, so that manual surface changing is not needed, and the operation efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of processing machinery manufacturing, and more specifically, to a semiconductor wafer grinding equipment and method. Background Technology

[0002] Semiconductor wafers are the core substrate for integrated circuit manufacturing. After wafers are diced and shaped, their surfaces need to be polished. The relative movement between the wafer and the polishing pad achieves surface planarization to meet the stringent requirements of subsequent photolithography, thin film deposition, and etching processes for global / local flatness, surface roughness, and defect density. To achieve stable removal rates and minimal total thickness variation (TTV), the industry commonly employs a combination of mechanical polishing and chemical processes, focusing on comprehensive indicators such as uniform contact pressure, interface cleanliness, and cycle time efficiency.

[0003] In mechanical polishing, chemical etching is often combined, involving the addition of polishing slurry and other chemical reagents. As polishing progresses, particles etched / polished off the wafer, reaction byproducts, and wear debris from the wafer pad mix into the polishing slurry. This leads to a decrease in the effective components of the slurry, fluctuations in viscosity and pH, and agglomeration of abrasive particles, thereby reducing the polishing quality of the wafer surface and increasing the risk of scratches and residues. Existing treatment methods often struggle to quickly and effectively replace and remove the polishing slurry from the processing area in a timely manner, and lack directional flushing and closed-loop recycling pathways that are compatible with the equipment structure. This results in repeated accumulation of interface aging and contamination, affecting process stability and increasing the cost of clean equipment maintenance.

[0004] Meanwhile, many current grinding equipment can only grind one side of the wafer. When it is necessary to switch to processing the other side, the machine must be stopped for manual face-changing; this process involves picking up and placing, flipping, and realigning, which is relatively complex and time-limited. Furthermore, it poses potential risks of wafer drop, edge chipping, and secondary scratches to thinned wafers, thus restricting overall operational efficiency. With the increasing demands for large-size wafers and high-yield production, achieving continuous and stable double-sided processing and face-changing within the equipment has become an urgent need.

[0005] In summary, existing technologies still have shortcomings in online rapid processing and recycling of polishing slurries, maintenance of interface cleanliness, and continuous double-sided processing and safe face changing. There is an urgent need to improve the "self-refreshing" capability of the processing interface and the overall processing efficiency through more compact and reliable mechanism and fluid path design, while reducing maintenance difficulty and chemical consumption while ensuring yield. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0007] The special equipment for double-sided grinding proposed by the present invention belongs to the category of other metal processing machinery manufacturing. It can cooperate with the on-site bus control system of the machine tool, combine intelligent monitoring and laser measurement / calibration means, and realize the integration of processing-detection-control, providing a solution for wafer processing with high cleanliness, high consistency and traceability.

[0008] Therefore, the purpose of the present invention is to provide a semiconductor wafer grinding device, including a housing, a set of first vertical plates and a set of second vertical plates arranged inside the housing, and a grinding mechanism located between the two second vertical plates.

[0009] The grinding mechanism includes a first grinding disk and a second grinding disk. A grinding pad for grinding the wafer is provided on the opposite side of the first grinding disk and the second grinding disk. Air ducts are connected to the back of both the first grinding disk and the second grinding disk. One end of the air duct is sleeved with a drive sleeve that is spline-connected to it. The drive sleeve passes through the first vertical plate and is movably connected to the first vertical plate by a bearing. A magnet block is provided at one end of the air duct. An electromagnet is arranged in parallel on one side of the magnet block. The electromagnet is fixed on a fixed rod. One end of the fixed rod passes through the housing. The opposite sides of the magnet block and the electromagnet are opposite magnetic poles.

[0010] An activity frame for spraying grinding liquid is arranged around the grinding mechanism. A waste liquid collection box is provided at the bottom of the activity frame. A drain pipe is connected to the center of the waste liquid collection box.

[0011] An inflation component for injecting gas into the air duct is arranged inside the housing.

[0012] As a preferred technical solution:

[0013] For the semiconductor wafer grinding device as described above, the bottom ends of the first vertical plates are welded and fixed to the housing. Two groups of cross bars are welded and fixed between the two first vertical plates. The cross bars pass through the second vertical plates. A motor is bolted to the first vertical plate. A second gear is fixed to the output shaft of the motor by a snap pin. A first gear meshing with the second gear is fixed to the drive sleeve by a snap pin.

[0014] Through the above technical solution, the drive sleeve is spline-connected to the air duct. The air duct moves horizontally axially inside the drive sleeve. And when the drive sleeve rotates, the drive sleeve and the air duct can transmit torque, that is, when the air duct moves horizontally, it can also rotate axially synchronously with the drive sleeve.

[0015] For the semiconductor wafer grinding device as described above, the cross-sections of both the first grinding disk and the second grinding disk are in the shape of "匚". The first grinding disk, the second grinding disk and the grinding pad are all hermetically bonded. Limiting pads are evenly bonded on the inner walls of the first grinding disk and the second grinding disk.

[0016] With the above technical solution, when the polishing pad is squeezed into the first polishing pad or the second polishing pad by the wafer, the polishing pad will come into contact with the limiting pad. In this way, there is a gap between the polishing pad and the inner wall of the first polishing pad or the second polishing pad. When the first polishing pad or the second polishing pad is filled with gas, the gas can quickly push the polishing pad to pop out and expand.

[0017] As described above, in a semiconductor wafer grinding device, a fixed ring is welded and fixed to one end of the transmission sleeve, and an elastic spring is fitted on the air guide pipe between the fixed ring and the magnet block. Both ends of the elastic spring are fixedly connected to the fixed ring and the magnet block.

[0018] With the above technical solution, the air duct and the magnet are fixed by welding or other sealed connections. In this way, the magnet can block one end of the air duct to prevent gas leakage, thereby ensuring that the grinding pad can always remain in an expanded state.

[0019] As described above, in a semiconductor wafer grinding apparatus, a crossbar runs through the waste liquid collection box. The top surfaces of both sides of the waste liquid collection box are fixedly connected to the bottom of a movable frame. The interior of the top wall of the movable frame is divided into two flow chambers by a partition. Spray holes are provided at the bottom of the movable frame walls of both flow chambers.

[0020] Both the back wall and bottom wall of the outer casing are provided with through grooves for the liquid inlet main pipe and the liquid outlet pipe to pass through. One end of the liquid inlet main pipe is connected to two liquid inlet branch pipes through a three-way solenoid valve. The bottom end of the liquid inlet branch pipe passes through the movable frame and is connected to the diversion cavity.

[0021] With the above technical solution, the positions of the two sets of nozzles correspond to the positions of the first grinding disk and the second grinding disk, respectively. When the grinding pad on the first grinding disk or the second grinding disk is grinding, the corresponding nozzle above the first grinding disk or the second grinding disk can spray out the grinding fluid. The grinding fluid can wash away the grinding fluid mixed with particulate impurities on the surface of the wafer and the grinding pad, and a new layer of grinding fluid can be applied.

[0022] The inlet branch pipe and the movable frame are sealed together, such as by bonding or threading, to improve the overall sealing performance.

[0023] As described above, in a semiconductor wafer grinding device, the gas filling assembly includes a sealing sleeve fitted onto a gas guide tube. Both ends of the sealing sleeve are welded and fixed with outer sealing rings. The inner bearing of the outer sealing ring is connected to an inner sealing ring. The inner sealing ring is fitted onto the gas guide tube and welded and fixed to the gas guide tube.

[0024] The sealing sleeve has a first air guide hole, and the air guide pipe located inside the sealing sleeve has a second air guide hole.

[0025] Through the above technical solution, the outer sealing ring and the inner sealing ring are sealed by a labyrinth sealing structure. When the inner sealing ring rotates at high speed with the air guide tube, the sealing sleeve, the outer sealing ring, the inner sealing ring and the outer wall of the air guide tube can form a closed annular cavity, which can prevent leakage when the gas is transmitted and flows.

[0026] As described above, in a semiconductor wafer grinding device, the gas filling assembly further includes an air inlet pipe and an air guide groove opened inside the second vertical plate. The air inlet pipe passes through the fixed base and is fixedly connected to the fixed base. A crossbar passes through the fixed base.

[0027] The bottom end of the air intake pipe is connected to two stainless steel telescopic hoses via a three-way solenoid valve. One end of each stainless steel telescopic hose passes through the second vertical plate and is connected to the air guide groove.

[0028] Through the above technical solution, the three-way solenoid valve can adjust the direction of gas flow, thereby controlling the opening and closing of the two stainless steel telescopic hoses. The stainless steel telescopic hoses and the second vertical plate are sealed together, such as by bonding or threading, to improve the overall sealing performance.

[0029] In the semiconductor wafer grinding equipment described above, the second vertical plate has a through hole for a sealing sleeve to pass through, and the sealing sleeve is sealed and fitted with the through hole.

[0030] One end of the air guide groove is connected to the wall of the through hole, and the first air guide hole is located inside the through hole and is opposite to one end of the air guide groove.

[0031] Through the above technical solution, the sealing sleeve wall around the first air guide hole and the hole wall of the through hole can be sealed with a sealing ring or with sealant to ensure that all the gas in the air guide groove enters the first air guide hole.

[0032] A semiconductor wafer grinding method includes the following steps:

[0033] S1. Place the wafer to be polished between the first polishing pad and the second polishing pad, and inject high-pressure air into the second polishing pad through the air filling component.

[0034] S2. The polishing pad on the second polishing disk expands under high pressure. After expansion, the polishing pad adheres to the right side of the wafer. At this time, the left side of the wafer is embedded in the first polishing disk.

[0035] S3. Drive the second polishing disc to rotate, and at the same time, polishing slurry can be sprayed from the nozzles on the movable frame. The chemical components in the polishing slurry react chemically with the right side of the wafer, while the second polishing disc generates mechanical friction with the right side of the wafer through the polishing pad, thereby realizing the polishing operation on the wafer surface.

[0036] S4. High-pressure air is injected into the first polishing pad through the inflation component, while the air in the second polishing pad is gradually released. After the polishing pad on the first polishing pad expands, it pushes the wafer out and into the second polishing pad, so that the right side of the wafer is embedded in the second polishing pad.

[0037] S5. Drive the first polishing disc to rotate, and at the same time, polishing fluid can be sprayed from the nozzle on the movable frame. The chemical components in the polishing fluid react chemically with the left side of the wafer. Meanwhile, the first polishing disc generates mechanical friction with the left side of the wafer through the polishing pad, thereby realizing the double-sided polishing operation of the wafer.

[0038] Compared with the prior art, the present invention has at least the following beneficial effects:

[0039] (1) The dual-disc opposing structure is coupled with the inflation component, the "U"-shaped disk cavity and the limiting pad: the air guide tube-transmission sleeve spline transmission torque drives either grinding disk to rotate while directional inflation into the disk cavity, so that the grinding pad can be controlled to expand into an "airbag-like" fit in the sealed cavity; the grinding pad on the uninflated side, together with the "U"-shaped cavity and the limiting pad, forms a "bowl-shaped" covering and clamping surface. With the attraction and pull of the electromagnet-magnet block and the spring reset, the wafer completes the continuous "pull-relay-embedding" face-changing between the two disks. Throughout the process, the grinding pads on both sides always support the wafer, avoiding wafer drop and impact, saving manual face-changing and alignment time, and realizing stable double-sided continuous grinding in one machine.

[0040] (2) Electromagnetic attraction and displacement, zoned spraying, and closed-loop linkage of waste liquid: The periodic attraction of the electromagnet drives the air guide pipe / grinding disc to undergo short-range horizontal displacement, instantly opening the gap between the grinding pad and the wafer; the diversion chamber and directional spray hole in the movable frame are precisely replenished and flushed on the side being processed under the control of the three-way valve, and particles and aged grinding fluid are promptly carried away and centrally recovered by the closed-loop channel composed of the movable frame shielding + waste liquid collection box + drain pipe. This rhythmic linkage of "displacement-flushing-reset" enables the mechanical / chemical collaborative processing interface to continuously "self-refresh", significantly reducing the risk of scratches and abrasions, stabilizing the removal rate and flatness, and reducing cavity contamination and waste of chemical solution.

[0041] (3) The combined realization of coaxial sealing air supply and rotary torque transmission: The sealed air path consisting of sealing sleeve—inner / outer sealing ring (labyrinth type)—first / second air guide hole—second vertical plate inner air guide groove—stainless steel telescopic hose works coaxially with the torque chain consisting of motor—gear—spline transmission sleeve, so that the grinding disc can still achieve low leakage and fast response pressure regulation under rotation / axial micro-movement conditions. As a result, the repeatability of the grinding pad expansion height and contact pressure is better, the end jump and surface disturbance are reduced, and the stability of the grinding process and the yield of finished products are improved. Attached Figure Description

[0042] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0043] Figure 1 This is an internal front view of the present invention;

[0044] Figure 2 This is an external perspective view of the present invention;

[0045] Figure 3 This is a three-dimensional bottom view of the present invention;

[0046] Figure 4 This is a three-dimensional top view of the present invention;

[0047] Figure 5 This is a cross-sectional view of the first and second grinding discs of the present invention;

[0048] Figure 6 This is a perspective view of the first and second grinding discs of the present invention;

[0049] Figure 7 This is a perspective view of the air guide tube and transmission sleeve of the present invention;

[0050] Figure 8 This is a perspective sectional view of the air guide tube and sealing sleeve of the present invention;

[0051] Figure 9 This is a three-dimensional sectional view of the movable frame of the present invention.

[0052] In the diagram: 1. Outer shell; 2. First vertical plate; 3. Second vertical plate; 4. Horizontal bar; 5. First grinding disc; 6. Second grinding disc; 7. Grinding pad; 8. Wafer; 9. Limiting pad; 10. Air guide pipe; 11. Transmission sleeve; 12. First gear; 13. Second gear; 14. Fixing ring; 15. Magnet block; 16. Elastic spring; 17. Electromagnet; 18. Fixing rod; 19. Air inlet pipe; 20. Fixing base; 21. Stainless steel telescopic hose; 22. Air guide groove; 23. Sealing sleeve; 24. Outer sealing ring; 25. Inner sealing ring; 26. First air guide hole; 27. Second air guide hole; 28. Movable frame; 29. ​​Waste liquid collection box; 30. Drain pipe; 31. Main inlet pipe; 32. Diverter chamber; 33. Spray hole; 34. Through groove; 35. Inlet branch pipe. Detailed Implementation

[0053] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0054] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited by the specific embodiments disclosed below.

[0055] As Figures 1-9 shown, an embodiment of the present invention discloses a semiconductor wafer grinding device, including an outer housing 1, a set of first vertical plates 2 and a set of second vertical plates 3 disposed within the outer housing 1, and a grinding mechanism located between the two second vertical plates 3.

[0056] The grinding mechanism includes a first grinding disk 5 and a second grinding disk 6. A grinding pad 7 for grinding a wafer 8 is provided on the opposite side of the first grinding disk 5 and the second grinding disk 6. The cross-sections of the first grinding disk 5 and the second grinding disk 6 are both in the shape of "匚". The first grinding disk 5, the second grinding disk 6, and the grinding pad 7 are all hermetically bonded. Limiting pads 9 are evenly bonded on the inner walls of the first grinding disk 5 and the second grinding disk 6.

[0057] Air ducts 10 are connected to the backs of both the first grinding disk 5 and the second grinding disk 6. One end of the air duct 10 is sleeved with a transmission sleeve 11 that is spline-connected thereto. The transmission sleeve 11 passes through the first vertical plate 2 and is rotatably connected to the first vertical plate 2 by a bearing.

[0058] The bottom end of the first vertical plate 2 is welded and fixed to the outer housing 1. Two groups of cross bars 4 are welded and fixed between the two first vertical plates 2. The cross bars 4 pass through the second vertical plates 3. A motor is bolted to the first vertical plate 2. A second gear 13 is fixed to the output shaft of the motor by a snap pin. A first gear 12 meshing with the second gear 13 is fixed to the transmission sleeve 11 by a snap pin.

[0059] An activity frame 28 for spraying grinding liquid is provided around the grinding mechanism. A waste liquid collection box 29 is provided at the bottom of the activity frame 28. A drain pipe 30 is connected to the center of the waste liquid collection box 29.

[0060] An inflation component for injecting gas into the air duct 10 is provided inside the outer housing 1.

[0061] Specifically, as Figure 1-6 shown, the working surface of the grinding pad 7 can be made of a polyurethane composite material. The part of the working surface periphery connected to the first grinding disk 5 or the second grinding disk 6 can be made of a silicone ring. The silicone ring has elasticity and can undergo elastic deformation with the change of air pressure, so that the working surface of the grinding pad 7 can pop out of the first grinding disk 5 or the second grinding disk 6, or be embedded into the first grinding disk 5 or the second grinding disk 6.

[0062] Before operation, the polishing pad 7 is attached to the limiting pad 9 on the first polishing disk 5 or the second polishing disk 6. In this way, the first polishing disk 5 or the second polishing disk 6 and the polishing pad 7 are combined into a "bowl"-shaped structure. The wafer 8 to be polished is placed between the first polishing disk 5 and the second polishing disk 6, so that one side of the wafer 8 is embedded in the first polishing disk 5.

[0063] Next, high-pressure air is injected into the air duct 10 on the second grinding disk 6 through the air inflation component. As the internal air pressure of the second grinding disk 6 increases, the grinding pad 7 on the second grinding disk 6 also gradually expands and comes into contact with one side of the wafer 8. The grinding pad 7 on the first grinding disk 5 can wrap one side of the wafer 8 to fix the wafer 8.

[0064] The movable frame 28 can be sprayed with polishing fluid, so that a layer of polishing fluid adheres to the polishing pad 7 on the second polishing disk 6 and the surface of the wafer 8.

[0065] When the motor is powered on, the motor drives the first gear 12 to rotate synchronously through the second gear 13. The first gear 12 drives the air guide pipe 10 to rotate through the transmission sleeve 11. The air guide pipe 10 drives the second polishing disc 6 to rotate. The second polishing disc 6 mechanically polishes the surface of the wafer 8 through the polishing pad 7 on it. Combined with the chemical etching of the polishing fluid, the planarization treatment of one side surface of the wafer 8 is achieved.

[0066] When the other side of the wafer 8 needs to be polished, the high-pressure gas in the second polishing pad 6 is gradually released, and high-pressure air is filled into the air guide tube 10 on the first polishing pad 5. As the internal air pressure of the first polishing pad 5 increases, the polishing pad 7 on the first polishing pad 5 also gradually expands and pushes the wafer 8 out. During this process, the polishing pad 7 on both the first polishing pad 5 and the second polishing pad 6 are in contact with the wafer 8 to prevent the wafer 8 from falling off.

[0067] After the high-pressure gas in the second grinding disc 6 is completely released, the wafer 8 is pushed out and embedded into the second grinding disc 6. The grinding pad 7 on the second grinding disc 6 can wrap one side of the wafer 8 to fix the wafer 8. The first grinding disc 5 is driven to rotate by the motor. The first grinding disc 5 mechanically grinds the surface of the wafer 8 through the grinding pad 7 on it. Combined with the chemical etching of the grinding fluid, the other side of the wafer 8 is planarized. This eliminates the need for manual switching of the grinding surface of the wafer 8, which helps to improve work efficiency.

[0068] During the grinding process, the grinding pad 7 will throw out some of the grinding liquid. The movable frame 28 can block the splashed grinding liquid to prevent the grinding liquid from polluting the internal environment of the equipment. The blocked grinding liquid will gradually flow into the waste liquid collection box 29 and be discharged through the drain pipe 30 for recycling.

[0069] In one specific embodiment of the present invention, a magnet block 15 is provided at one end of the air guide tube 10, and an electromagnet 17 is provided parallel to one side of the magnet block 15. The electromagnet 17 is fixed on a fixing rod 18, and one end of the fixing rod 18 penetrates the outer shell 1. The side of the magnet block 15 opposite to the electromagnet 17 is a different magnetic pole.

[0070] One end of the transmission sleeve 11 is fitted with a fixing ring 14 welded to it. A spring 16 is fitted on the air guide pipe 10 between the fixing ring 14 and the magnet block 15. Both ends of the spring 16 are fixedly connected to the fixing ring 14 and the magnet block 15.

[0071] Specifically, such as Figure 1 and Figure 7 As shown, a bushing for inserting the fixing rod 18 is welded to the outer wall of the outer casing 1. A locking bolt is screwed into the bushing. When the electromagnet 17 is moved to a suitable position by the fixing rod 18, the locking bolt is rotated to abut against the fixing rod 18, so that the electromagnet 17 can be kept in a fixed state.

[0072] When the grinding pad 7 on the second grinding disc 6 is performing grinding operations, the electromagnet 17 on one side of the first grinding disc 5 is moved by the fixing rod 18, so that the electromagnet 17 on that side is in contact with the magnet block 15. In this way, the air guide tube 10 on the first grinding disc 5 is limited, thereby ensuring that the first grinding disc 5 and the wafer 8 inside it will not be displaced during the grinding operation, which is beneficial to ensuring the grinding quality.

[0073] As the grinding process progresses, particles softened and ground off the surface of wafer 8 will mix into the grinding slurry, hindering the grinding operation. To solve this problem, electromagnet 17 is energized, generating an attraction between it and magnet 15. This attracts magnet 15, causing it to move towards electromagnet 17. Magnet 15, through air duct 10, can pull the first grinding disc 5 or the second grinding disc 6, causing the grinding pad 7 on the first or second grinding disc 5 to separate from the wafer 8. At this point, the movable frame 28 sprays grinding slurry to wash away the grinding slurry containing particulate impurities from the surface of wafer 8 and grinding pad 7, and a new layer of grinding slurry is applied. By intermittently energizing electromagnet 17, the first or second grinding disc 5 or the second grinding disc 6 can be moved multiple times during the grinding process, thereby achieving multiple washing of wafer 8 and grinding pad 7, which helps to ensure grinding quality.

[0074] The air guide tube 10 can form an elastic movable structure through the elastic spring 16. After moving horizontally under the action of magnetic force, when the magnetic force disappears, the air guide tube 10 can quickly drive the first grinding disk 5 or the second grinding disk 6 to reset through the elastic spring 16. After the first grinding disk 5 or the second grinding disk 6 is reset, the grinding pad 7 on it will re-adhere to the wafer 8 and continue the grinding operation.

[0075] Since the polishing pad 7 expands under internal air pressure, the polishing pad 7 and the internal high-pressure air can form an airbag structure. When the polishing pad 7 is put into contact with the wafer 8 again, the airbag structure can play a buffering role, avoiding excessive impact on the wafer 8 and causing damage to the wafer 8.

[0076] In one specific embodiment of the present invention, a crossbar 4 passes through the waste liquid collection box 29, and the top surfaces on both sides of the waste liquid collection box 29 are fixedly connected to the bottom of the movable frame 28. The interior of the top wall of the movable frame 28 is divided into two diversion chambers 32 by a partition, and spray holes 33 are opened in the walls of the movable frame 28 at the bottom of the two diversion chambers 32.

[0077] The back wall of the outer casing 1 is provided with through grooves 34 for the liquid inlet main pipe 31 and the liquid outlet pipe 30 to pass through. One end of the liquid inlet main pipe 31 is connected to two liquid inlet branch pipes 35 through a three-way solenoid valve. The bottom end of the liquid inlet branch pipe 35 passes through the movable frame 28 and is connected to the diversion chamber 32.

[0078] Specifically, such as Figure 1 and Figure 9 As shown, the waste liquid collection box 29 can move horizontally on the crossbar 4, which in turn can drive the movable frame 28 to move, making it convenient to place and remove the wafer 8 between the first grinding disc 5 and the second grinding disc 6. The through slot 34 allows the liquid inlet manifold 31 and the liquid outlet pipe 30 to move synchronously with the movable frame 28 and the waste liquid collection box 29, avoiding bending and breakage of the liquid inlet manifold 31 and the liquid outlet pipe 30.

[0079] External grinding fluid is pumped into the main inlet pipe 31 through the pipeline, then split into two inlet branch pipes 35, and finally the grinding fluid enters the two branch chambers 32 and is sprayed out from the nozzle 33.

[0080] The three-way solenoid valve can control the opening and closing of the two inlet branches 35. For example, when the polishing pad 7 on the first polishing disk 5 is polishing, the three-way solenoid valve can guide the polishing fluid into the corresponding diversion chamber 32 above the first polishing disk 5. The polishing fluid can be sprayed out from the corresponding nozzle 33, thereby ensuring that the polishing fluid can be accurately sprayed onto the surface of the polishing pad 7 and the surface of the wafer 8 on the first polishing disk 5, and at the same time, it can also avoid the waste of polishing fluid.

[0081] In one specific embodiment of the present invention, the inflation assembly includes a sealing sleeve 23 sleeved on the air guide tube 10. Both ends of the sealing sleeve 23 are welded and fixed with an outer sealing ring 24. The inner bearing of the outer sealing ring 24 is connected to an inner sealing ring 25. The inner sealing ring 25 is sleeved on the air guide tube 10 and welded and fixed to the air guide tube 10.

[0082] The sealing sleeve 23 has a first air guide hole 26, and the air guide pipe 10 located inside the sealing sleeve 23 has a second air guide hole 27.

[0083] The inflation assembly also includes an air inlet pipe 19 and an air guide groove 22 opened inside the second vertical plate 3. The air inlet pipe 19 passes through the fixing seat 20 and is fixedly connected to the fixing seat 20. A crossbar 4 passes through the fixing seat 20.

[0084] The bottom of the air intake pipe 19 is connected to two stainless steel telescopic hoses 21 via a three-way solenoid valve. One end of the stainless steel telescopic hose 21 passes through the second vertical plate 3 and is connected to the air guide groove 22.

[0085] The second vertical plate 3 has a through hole for the sealing sleeve 23 to pass through, and the sealing sleeve 23 is sealed and fitted with the through hole.

[0086] One end of the air guide groove 22 is connected to the wall of the through hole, and the first air guide hole 26 is located inside the through hole and is opposite to one end of the air guide groove 22.

[0087] Specifically, such as Figure 1 and Figure 8 As shown, one end of the air inlet pipe 19 is connected to the air supply equipment. For example, when it is necessary to inject high-pressure gas into the second grinding disc 6, the three-way solenoid valve can switch to connect with the corresponding stainless steel telescopic hose 21. The air supply equipment sends high-pressure gas into the stainless steel telescopic hose 21 through the air inlet pipe 19, and then into the air guide groove 22. The gas enters the sealing sleeve 23 through the first air guide hole 26, and then enters the air guide pipe 10 through the second air guide hole 27. Finally, the gas enters the second grinding disc 6. As the gas is continuously injected, the internal air pressure of the second grinding disc 6 increases, thereby causing the grinding pad 7 to expand.

[0088] The second vertical plate 3 can move horizontally on the crossbar 4. When the air duct 10 moves horizontally under the action of magnetic force, the sealing sleeve 23 will move horizontally as well. In this way, the sealing sleeve 23 will drive the second vertical plate 3 to move synchronously. The stainless steel telescopic hose 21 is a flexible pipe that can contract and stretch as the second vertical plate 3 moves.

[0089] The stainless steel telescopic hose 21 is equipped with an electromagnetic exhaust valve. When it is necessary to inject high-pressure air into the first grinding disc 5, the stainless steel telescopic hose 21 gradually releases the air inside the second grinding disc 6 through the electromagnetic exhaust valve.

[0090] In the description of this specification, terms such as "connection," "installation," and "fixation" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meanings of the above terms within this invention based on the specific circumstances.

[0091] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0092] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor wafer grinding apparatus, comprising a housing (1), a set of first vertical plates (2) and a set of second vertical plates (3) disposed within the housing (1), and a grinding mechanism located between the two second vertical plates (3), characterized in that: The grinding mechanism includes a first grinding disk (5) and a second grinding disk (6). A grinding pad (7) for grinding the wafer (8) is provided on the opposite surfaces of the first grinding disk (5) and the second grinding disk (6). Air ducts (10) are connected to the backs of both the first grinding disk (5) and the second grinding disk (6). One end of the air duct (10) is sleeved with a transmission sleeve (11) which is spline-connected thereto. The transmission sleeve (11) penetrates through the first vertical plate (2) and is in bearing movable connection with the first vertical plate (2). One end of the air duct (10) is provided with a magnet block (15). An electromagnet (17) is arranged in parallel on one side of the magnet block (15). The electromagnet (17) is fixed on a fixed rod (18). One end of the fixed rod (18) penetrates through the outer housing (1). The opposite surfaces of the magnet block (15) and the electromagnet (17) are opposite magnetic poles; An activity frame (28) for spraying grinding liquid is arranged around the grinding mechanism. A waste liquid collection box (29) is arranged at the bottom of the activity frame (28). A drain pipe (30) is connected to the center of the waste liquid collection box (29); An air inflation component for injecting gas into the air duct (10) is arranged inside the outer housing (1).

2. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The bottom end of the first vertical plate (2) is welded and fixed to the outer housing (1). Two groups of cross bars (4) are welded and fixed between the two first vertical plates (2). The cross bar (4) passes through the second vertical plate (3). A motor is bolted to the first vertical plate (2). A second gear (13) is fixed to the output shaft of the motor by a snap pin. A first gear (12) meshing with the second gear (13) is fixed to the transmission sleeve (11) by a snap pin.

3. The semiconductor wafer grinding equipment according to claim 1, characterized in that: The cross-sections of both the first grinding disk (5) and the second grinding disk (6) are in the shape of "匚". The first grinding disk (5), the second grinding disk (6) and the grinding pad (7) are all hermetically bonded. Limiting pads (9) are evenly bonded on the inner walls of the first grinding disk (5) and the second grinding disk (6).

4. The semiconductor wafer grinding equipment according to claim 1, characterized in that: One end of the transmission sleeve (11) is sleeved with a fixing ring (14) welded and fixed thereto. A elastic spring (16) is sleeved on the air duct (10) between the fixing ring (14) and the magnet block (15). Both ends of the elastic spring (16) are fixedly connected to the fixing ring (14) and the magnet block (15).

5. A semiconductor wafer grinding apparatus according to claim 1, characterized in that: The waste liquid collection box (29) is penetrated by the cross bar (4). The top surfaces on both sides of the waste liquid collection box (29) are fixedly connected to the bottom of the activity frame (28). The top wall body inside the activity frame (28) is divided into two diversion cavities (32) by a partition. Spray holes (33) are formed in the wall bodies of the activity frame (28) at the bottoms of the two diversion cavities (32).

6. A semiconductor wafer grinding apparatus according to claim 5, characterized in that: Through grooves (34) for the inlet liquid main pipe (31) and the drain pipe (30) to penetrate are formed in the back wall body and the bottom wall body of the outer housing (1). One end of the inlet liquid main pipe (31) is connected to two inlet liquid branch pipes (35) through a three-way solenoid valve. The bottom ends of the inlet liquid branch pipes (35) penetrate through the activity frame (28) and are connected to the diversion cavities (32).

7. A semiconductor wafer grinding apparatus according to claim 1, characterized in that: The inflation assembly includes a sealing sleeve (23) fitted onto the air guide tube (10). Both ends of the sealing sleeve (23) are welded and fixed with outer sealing rings (24). The inner bearing of the outer sealing ring (24) is connected to an inner sealing ring (25). The inner sealing ring (25) is fitted onto the air guide tube (10) and welded and fixed to it. The sealing sleeve (23) has a first air guide hole (26), and the air guide pipe (10) located inside the sealing sleeve (23) has a second air guide hole (27).

8. A semiconductor wafer grinding apparatus according to claim 7, characterized in that: The inflation assembly also includes an air inlet pipe (19) and an air guide groove (22) opened inside the second vertical plate (3). The air inlet pipe (19) passes through the fixed seat (20) and is fixedly connected to the fixed seat (20). A crossbar (4) passes through the fixed seat (20). The bottom end of the air intake pipe (19) is connected to two stainless steel telescopic hoses (21) through a three-way solenoid valve. One end of the stainless steel telescopic hose (21) passes through the second vertical plate (3) and is connected to the air guide groove (22).

9. A semiconductor wafer grinding apparatus according to claim 8, characterized in that: The second vertical plate (3) has a through hole for the sealing sleeve (23) to pass through, and the sealing sleeve (23) is sealed and fitted with the through hole. One end of the air guide groove (22) is connected to the wall of the through hole, and the first air guide hole (26) is located inside the through hole and is opposite to one end of the air guide groove (22).

10. A method for implementing a semiconductor wafer grinding apparatus as described in any one of claims 1-9, characterized in that: It includes the following steps: S1. Place the wafer (8) to be ground between the first grinding disk (5) and the second grinding disk (6), and inject high-pressure air into the second grinding disk (6) through the air filling component. S2. The polishing pad (7) on the second polishing disk (6) expands under the action of high pressure air. After the polishing pad (7) expands, it fits against the right side of the wafer (8). At this time, the left side of the wafer (8) is embedded in the first polishing disk (5). S3. Drive the second polishing disc (6) to rotate. At the same time, polishing fluid can be sprayed from the nozzle (33) on the movable frame (28). The chemical components in the polishing fluid react chemically with the right side of the wafer (8). Meanwhile, the second polishing disc (6) generates mechanical friction with the right side of the wafer (8) through the polishing pad (7), thereby realizing the polishing operation on the wafer surface. S4. High-pressure air is injected into the first grinding disk (5) through the inflation component, while the air in the second grinding disk (6) is gradually released. After the grinding pad (7) on the first grinding disk (5) expands, it pushes the wafer (8) out and into the second grinding disk (6). In this way, the right side of the wafer (8) is embedded into the second grinding disk (6). S5. Drive the first grinding disc (5) to rotate. At the same time, the grinding fluid can be sprayed at the nozzle (33) on the movable frame (28). The chemical components in the grinding fluid react chemically with the left side of the wafer (8). Meanwhile, the first grinding disc (5) generates mechanical friction with the left side of the wafer (8) through the grinding pad (7), thereby realizing the double-sided grinding operation of the wafer.

Images