Spray disc cooling structure and semiconductor equipment

Abstract

The invention discloses a spraying disc cooling structure and semiconductor equipment, the spraying disc cooling structure comprises a spraying disc main body, a connecting piece and a contact area adjusting assembly, the contact area adjusting assembly is connected with the connecting piece, and the contact area adjusting assembly is used for dynamically adjusting the cooling efficiency of the spraying disc main body by adjusting the contact area with the connecting piece. By introducing the contact area adjusting assembly, a fundamental mode for dynamically adjusting the cooling efficiency is provided. When process conditions change and different cooling rates are needed, the heat conduction capability of the system can be immediately and accurately changed by adjusting the contact area of the assembly and the connecting piece, so that on-demand control on the cooling strength of the spraying disc main body is realized. The limitation of a fixed cooling structure is effectively overcome, the stability and uniformity of the wafer process temperature are ensured, the film layer quality problem caused by temperature fluctuation is avoided, and finally the production yield and the equipment adaptability are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and in particular to a shower plate cooling structure and a semiconductor device. BACKGROUND

[0002] In a semiconductor film coating process, the shower plate as a key temperature control component directly affects the uniformity and stability of wafer surface temperature distribution, and further affects the quality of film deposition and the yield of chips. The existing shower plate cooling structure mostly adopts a fixed flow or fixed distribution cooling mode, lacking dynamic adjustment ability of cooling intensity. In actual process, different cooling rates are often required in different process stages or process conditions, and the traditional structure cannot flexibly adjust the cooling efficiency according to real-time temperature changes, resulting in temperature control response lag, which easily causes defects such as uneven film thickness and decreased adhesion. Especially in the process of high-precision semiconductor manufacturing, slight temperature fluctuation may cause the performance of the whole batch of wafers to degrade. SUMMARY

[0003] Embodiments of the present application provide a shower plate cooling structure and a semiconductor device, which can adjust the cooling efficiency of the shower plate in real time to meet the stringent requirements of temperature control under complex process conditions.

[0004] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present application provides a shower plate cooling structure, which comprises a shower plate body, a connecting piece and a contact area adjusting assembly, the contact area adjusting assembly is connected with the connecting piece, and is used for dynamically adjusting the cooling efficiency of the shower plate body by adjusting the contact area with the connecting piece.

[0005] In some embodiments, the contact area adjusting assembly comprises a water-cooled adjusting disc and an adjusting piece, the adjusting piece is used for fixing the water-cooled adjusting disc below the connecting piece and allowing the water-cooled adjusting disc to move relative to the connecting piece to change the contact area.

[0006] In some embodiments, the contact area adjusting assembly further comprises a connecting unit, the connecting unit comprises a fixing piece, a connecting sheet metal, a connecting block and a scale limiting plate, one end of the connecting sheet metal is connected with the connecting block and is fixed through the fixing piece, the other end of the connecting sheet metal is connected with the scale limiting plate, and the scale limiting plate is linked with the water-cooled adjusting disc through the fixing piece.

[0007] In some embodiments, the scale limiting plate has a limiting groove and a scale mark thereon, the limiting groove is used for limiting the rotation angle of the water-cooled adjusting disc, and the scale mark is used for indicating the cooling efficiency.

[0008] In some embodiments, the bottom surface of the water-cooled conditioning disc is provided with a groove structure, and the upper surface of the connecting piece is provided with a protrusion structure matching the groove structure; the groove structure and the protrusion structure form a gap in a non-matching state to block heat conduction.

[0009] In some embodiments, the cross-sectional shape of the groove structure and the protrusion structure is one of trapezoidal, rectangular or circular arc.

[0010] In some embodiments, the water-cooled conditioning disc is provided with a limiting waist groove, the conditioning piece is a conditioning bolt, the conditioning bolt passes through the limiting waist groove and is connected with the connecting piece; when the water-cooled conditioning disc is rotated, the conditioning bolt moves relatively in the limiting waist groove, and the limiting function is realized through the cooperation of the conditioning bolt and the two ends of the limiting waist groove.

[0011] In some embodiments, the contact area adjusting assembly further comprises a handle fixed on the water-cooled conditioning disc for manually adjusting the rotation angle thereof.

[0012] In some embodiments, the spray disc cooling structure further comprises a sensor assembly and a control assembly, the sensor assembly comprises a displacement sensor and a temperature sensor for monitoring the displacement of the contact area adjusting assembly and the inlet temperature of the spray disc in real time, and feeding back the monitoring data to the control assembly; the control assembly automatically adjusts the position of the contact area adjusting assembly according to the preset temperature parameter to realize temperature control.

[0013] According to another aspect of the present application, embodiments of the present application provide a semiconductor device comprising the spray disc cooling structure described above.

[0014] Compared with the prior art, the spray disc cooling structure of the present application has at least the following beneficial effects:

[0015] The spray disc cooling structure provided by the present application comprises a spray disc body, a connecting piece and a contact area adjusting assembly, the contact area adjusting assembly is connected with the connecting piece, and is used for dynamically adjusting the cooling efficiency of the spray disc body by adjusting the contact area with the connecting piece.

[0016] The present application provides a fundamental way to dynamically adjust the cooling efficiency by introducing a contact area adjusting assembly. When the process conditions change and different cooling rates are required, by adjusting the contact area between the assembly and the connecting piece, the heat conduction capacity of the system can be changed immediately and accurately, thereby realizing on-demand control of the cooling intensity of the spray disc body. This effectively overcomes the limitations of fixed cooling structures, ensures the stability and uniformity of wafer process temperature, avoids film quality problems caused by temperature fluctuations, and ultimately improves production yield and equipment adaptability.

[0017] The semiconductor device provided by the present application is designed based on the spray disc cooling structure, and the beneficial effects thereof are the same as those of the spray disc cooling structure, which will not be repeated here.

[0018] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clear and can be implemented according to the content of the description, the following will be described in detail with the preferred embodiments of the present application and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 The structural schematic diagram of the spray disc cooling structure provided by the embodiment of the present application is shown;

[0021] Figure 2 The structural schematic diagram of the contact area adjusting assembly in the spray disc cooling structure provided by the embodiment of the present application is shown;

[0022] Figure 3 The structural schematic diagram of the contact area adjusting assembly in the spray disc cooling structure provided by the embodiment of the present application is shown;

[0023] Figure 4 The structural schematic diagram of the contact area adjusting assembly in the spray disc cooling structure provided by the embodiment of the present application is shown;

[0024] Figure 5 The structural schematic diagram of the water cooling adjusting disc in the spray disc cooling structure provided by the embodiment of the present application is shown;

[0025] Figure 6 The principle block diagram of the spray disc cooling structure provided by the embodiment of the present application is shown;

[0026] Figure 7 The temperature distribution diagram of the spray disc when the contact area adjusting assembly in the spray disc cooling structure provided by the embodiment of the present application is in the maximum contact area is shown;

[0027] Figure 8 The temperature distribution diagram of the spray disc when the contact area adjusting assembly in the spray disc cooling structure provided by the embodiment of the present application is in the minimum contact area is shown;

[0028] Reference signs:

[0029] 100, spray disc body; 200, contact area adjusting assembly; 210, water-cooled adjusting disc; 211, groove structure; 212, limiting waist groove; 220, adjusting piece; 230, connecting unit; 231, fixing piece; 232, connecting sheet metal; 233, connecting block; 234, scale limiting plate; 235, limiting groove; 300, sensor assembly; 310, displacement sensor; 320, temperature sensor; 400, control assembly; 500, connecting piece. DETAILED DESCRIPTION

[0030] In order to further clarify the technical means and effects taken by the present application to achieve the predetermined object of the application, the specific embodiments, structures, features and effects according to the present application are described in detail below in combination with the drawings and preferred embodiments. In the following description, different "an embodiment" or "embodiments" do not necessarily refer to the same embodiment. In addition, the specific features, structures or characteristics in one or more embodiments can be combined in any suitable form.

[0031] In the description of the present application, it should be clear that the terms "first", "second", and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence; the terms "vertical", "horizontal", "longitudinal", "front", "back", "left", "right", "up", "down", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application, and do not mean that the device or element referred to must have a particular orientation or position, and therefore cannot be understood as a limitation on the present application.

[0032] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0033] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings and specific embodiments of the specification.

[0034] Embodiment 1

[0035] The present embodiment provides a spray disc cooling structure, such as Figures 1-6As shown, the showerhead cooling structure includes a showerhead body 100, a connecting piece 500, and a contact area adjustment assembly 200 connected with the connecting piece 500 for dynamically adjusting the cooling efficiency of the showerhead body 100 by adjusting the contact area with the connecting piece 500.

[0036] The contact area adjustment assembly 200 is adjustably connected with the connecting piece, specifically, the assembly is arranged to be movable relative to the connecting piece. The connecting piece is fixedly installed on the showerhead body 100 as an intermediate connection and heat transfer between the two. In terms of position, the contact area adjustment assembly 200 is generally located on one side or below the connecting piece, and by changing the relative position or the degree of fit between itself and the connecting piece, the dynamic change of the contact area is realized.

[0037] The showerhead body 100 is the core component for performing the cooling function, with a cooling medium inside, directly responsible for absorbing and carrying away the heat generated in the process to control the wafer temperature. The main function of the connecting piece is to provide a mounting base and a heat conduction path, which connects the showerhead body 100 and the contact area adjustment assembly 200, and is responsible for transferring heat between the two. The function of the contact area adjustment assembly 200 is to dynamically change the physical contact area between itself and the connecting piece, according to the Fourier heat transfer law, the change of the contact area directly regulates the heat conduction efficiency from the connecting piece to the assembly, thereby realizing the precise control of the cooling capacity of the showerhead body 100.

[0038] The showerhead body 100, the connecting piece 500, and the contact area adjustment assembly 200 are combined into a complete temperature control system through mechanical connection. When the contact area adjustment assembly 200 is operated, for example, by rotation or translation, it will move relative to the fixed connecting piece 500. This movement directly leads to a change in the effective contact area between the two, which actually occurs heat conduction. More specifically, when the contact area increases, the heat conduction path increases, and the cooling efficiency improves; when the contact area decreases, the heat conduction is limited, and the cooling efficiency decreases. In this way, the system can respond to different process requirements and continuously and dynamically adjust the cooling intensity of the showerhead body 100.

[0039] The background technology points out that the traditional fixed cooling mode cannot flexibly adjust the cooling intensity, resulting in process temperature response lag and insufficient control precision. The embodiment introduces a contact area adjusting component 200 to provide a fundamental way to dynamically adjust the cooling efficiency. When the process conditions change and different cooling rates are needed, by adjusting the contact area of the component with the connecting piece 500, the heat conduction capacity of the system can be changed immediately and accurately, thereby realizing on-demand control of the cooling intensity of the spray disc body 100. This effectively overcomes the limitations of fixed cooling structure, ensures the stability and uniformity of wafer process temperature, avoids film quality problems caused by temperature fluctuations, and ultimately improves production yield and equipment adaptability.

[0040] In specific embodiments, as shown in Figure 2 The contact area adjusting component 200 includes a water-cooled adjusting disc 210 and an adjusting piece 220, which is used to fix the water-cooled adjusting disc 210 above the connecting piece 500 and allow the water-cooled adjusting disc 210 to move relative to the connecting piece 500 to change the contact area.

[0041] The adjusting piece 220 is used to install and fix the water-cooled adjusting disc 210 below the connecting piece 500. More specifically, the adjusting piece 220 penetrates the water-cooled adjusting disc 210 and is connected with the connecting piece 500, thereby realizing the suspended fixation of the water-cooled adjusting disc 210. The water-cooled adjusting disc 210 is located directly above the connecting piece 500, and the two planes are opposite. The water-cooled adjusting disc 210 is kept in a position state close to but movable relative to the connecting piece 500 through the fixation of the adjusting piece 220, and the adjusting piece 220 itself becomes a mechanical connection hub between the two. The water-cooled adjusting disc 210 is the core functional component of the adjusting component, with a cooling waterway inside, and its main role is to act as a movable heat exchange interface, directly adjusting the heat conduction efficiency by changing the actual contact area with the connecting piece 500 above. The main role of the adjusting piece 220 is mechanical fixation and motion guidance. On the one hand, it reliably installs the water-cooled adjusting disc 210 on the connecting piece 500 to prevent falling off; on the other hand, its special structural design allows and restricts the movement of the water-cooled adjusting disc 210 relative to the connecting piece 500 in a specific path or direction, thereby providing the possibility of changing the contact area.

[0042] When adjustment is needed, the operator rotates or dials the water-cooling adjustment disc 210, at which time the limiting structure on the adjustment member 220 guides the water-cooling adjustment disc 210 to move in translation or rotation relative to the connecting member 500. More specifically, this relative movement directly changes the area of mutual adhesion between the upper surface of the water-cooling adjustment disc 210 and the lower surface of the connecting member 500, i.e. the effective heat conduction area. The effect produced is that linear and continuous precise regulation of cooling efficiency can be achieved. According to the Fourier heat conduction law, an increase in the contact area significantly improves the heat dissipation capacity, while a decrease in the contact area reduces the cooling strength, so that the system can quickly respond to different process temperature requirements, solving the fundamental problem of adjustment lag and inaccuracy of traditional fixed cooling methods.

[0043] In specific embodiments, as shown in FIG. 2, the contact area adjustment assembly 200 further comprises a connecting unit 230, which comprises a fixing member 231, a connecting sheet metal 232, a connecting block 233 and a scale limiting plate 234. One end of the connecting sheet metal 232 is connected with the connecting block 233 and is fixed by the fixing member 231. The other end of the connecting sheet metal 232 is movably connected with the scale limiting plate 234, and the scale limiting plate 234 is linked with the water-cooling adjustment disc 210 through the fixing member 231. Figure 2

[0044] The connecting block 233 is installed and fixed on the water-cooling adjustment disc 210 by the fixing member 231, becoming a component that moves synchronously with it. One end of the connecting sheet metal 232 is connected with this moving connecting block 233 through the fixing member 231, and the other end is movably connected with the scale limiting plate 234. More specifically, this end of the connecting sheet metal 232 is connected with the scale limiting plate 234 as a pivot through a fixing member 231, allowing it to rotate or move on the plate. The scale limiting plate 234 itself is completely fixed and installed on the external stationary structure of the device as an absolute position reference datum. In terms of position relationship, when the water-cooling adjustment disc 210 moves, it will drive the connecting block 233 and one end of the connecting sheet metal 232 to move, and then force the other end of the connecting sheet metal 232 to move on the fixed scale limiting plate 234, and the moving track is determined by the movable connection mode of the two.

[0045] ​The core role of the fixing part 231 is multiple, which is used to lock the connecting block 233 on the water-cooled adjusting disc 210, and also serves as a pivot to connect the movable end of the connecting sheet metal 232 with the scale limiting plate 234, which is a key component to realize motion transmission and conversion. The main role of the connecting sheet metal 232 is to serve as a moving connecting rod, which converts the rotary motion of the water-cooled adjusting disc 210 into the movement of the specific path of the movable end thereof on the scale limiting plate 234. The role of the connecting block 233 is to serve as a solid adapter to provide a reliable fulcrum for the connecting sheet metal 232 installed on the water-cooled adjusting disc 210. The core role of the scale limiting plate 234 is to provide a fixed reference plate with accurate scale markings, and different scale positions on the plate surface directly correspond to different contact area states between the water-cooled adjusting disc 210 and the connecting part, which is used for the end of the moving connecting sheet metal 232 to indicate.

[0046] When the operator rotates the water-cooled adjusting disc 210, the motion is transmitted to the connecting sheet metal 232 through the connecting block 233. The connecting sheet metal 232 moves, and the movable end thereof connected with the scale limiting plate 234 is forced to move on the plate surface of the scale limiting plate 234. More specifically, the movement path of the movable end enables it to pass through different scale positions on the scale limiting plate 234. The operator can directly and accurately read the contact area state corresponding to the mechanical position of the water-cooled adjusting disc 210 at this moment by observing the fixed scale pointed by the movable end of the connecting sheet metal 232, such as MIN (as shown in Figure 4 MAX (as shown in Figure 3 The core effect of this cooperation is to successfully convert the invisible angular displacement of the water-cooled adjusting disc 210 into the visible linear displacement of the movable end of the connecting sheet metal 232 on the fixed scale plate, realizing the visualization, quantification and accurate indication of the adjustment process, so that the operator can accurately and intuitively set, and finally greatly improve the reliability, repeatability and operation convenience of the system control.

[0047] In specific embodiments, as shown in Figure 2 , the scale limiting plate 234 has a limiting groove 235 and a scale marking, the limiting groove 235 is used to limit the rotation angle of the water-cooled adjusting disc 210, and the scale marking is used to indicate the cooling efficiency.

[0048] The limiting groove 235 is a specially shaped slot hole processed on the body of the scale limiting plate 234, which cooperates with a moving part fixed on the water-cooled adjusting disc 210. The moving track of the moving part is strictly limited within the boundary of the limiting groove 235, thereby physically restricting the maximum and minimum angle limits of the rotation of the water-cooled adjusting disc 210. At the same time, the scale marks are a series of marks and characters presented on the surface of the scale limiting plate 234 in the form of accurate marking or printing. These marks are pre-calibrated according to their positions and correspond to specific contact areas and cooling efficiency ratios.

[0049] In the present embodiment, firstly, the limiting groove 235 provides hard stop for the rotational movement of the water-cooled adjusting disc 210 through its physical boundary, fundamentally preventing mechanical interference, component damage or contact area adjustment failure caused by excessive or insufficient rotation angle, and greatly improving the safety and reliability of the equipment operation. Secondly, the scale marks provide a clear, intuitive and calibrated visual reference system for the operator. The operator can directly read the cooling efficiency ratio corresponding to the current system by observing the specific scale mark pointed by the moving part on the scale limiting plate 234 without any calculation or estimation, realizing the quantization and visualization of the adjustment process. Further, the integration of the limiting and indicating functions in the same part, the scale limiting plate 234, makes the system structure more compact, reduces the complexity of installation and calibration, and enables the operator to quickly, accurately and repeatedly set the cooling efficiency at any state required by the process under the premise of mechanical safety, effectively solving the problem of insufficient temperature control precision caused by the inability to dynamically and accurately adjust in the background technology, and improving the stability of the entire process and the product quality.

[0050] In specific embodiments, as shown in Figure 4 The bottom surface of the water-cooled adjusting disc 210 is provided with a groove structure 211, and the upper surface of the connecting piece 500 is provided with a protruding structure matching the groove structure; the groove structure 211 and the protruding structure form a gap in the non-cooperating state to block heat conduction.

[0051] The bottom surface of the water-cooled adjustment disc 210 is provided with a set of precisely machined groove structures 211, and the upper surface of the connecting piece 500 located above it is designed with a convex structure that is completely complementary to the geometric shape. More specifically, the groove structure 211 and the convex structure can be designed as continuous annular grooves and flanges, or a plurality of regularly distributed discrete pits and bumps. The core relationship of these two structures is that through the horizontal rotating motion of the water-cooled adjustment disc 210, the engagement overlap between the groove structure 211 and the convex structure can be controlled. In the uncooperative state, that is, when the groove and the convex are staggered with each other, a physical gap full of air will be formed between them. Since air is a poor conductor of heat, this gap can effectively block or greatly weaken the heat conduction path from the connecting piece 500 to the water-cooled adjustment disc 210.

[0052] Firstly, the embodiment provides an extremely direct and efficient mechanical method to regulate the heat conduction efficiency, which can continuously and smoothly transition between the maximum contact heat transfer and nearly complete thermal insulation states through simple rotating motion, achieving stepless adjustment of cooling intensity. Secondly, the active formation of the gap in the uncooperative state realizes the physical blockage of heat conduction, which can achieve lower limit cooling intensity compared to the method of reducing contact area to reduce heat flow, and even nearly close the cooling function when a small amount of cooling is needed, providing a wider adjustment range and more precise control ability. Further, this adjustment method based on mechanical shape matching has high reliability and good repeatability, and there is no risk of flow path blockage or leakage that may occur in traditional valve regulation, and its state only depends on the rotation angle, making the control more direct and stable.

[0053] In specific embodiments, the cross-sectional shape of the groove structure 211 and the convex structure is one of trapezoidal, rectangular, or circular arc.

[0054] The embodiment further limits the cross-sectional geometry of the groove structure 211 and the convex structure, specifying it as one of trapezoidal, rectangular, or circular arc. More specifically, this means that in the cross-section perpendicular to the bottom surface of the water-cooled adjustment disc 210, the included angle between the groove side of the groove structure 211 and the bottom surface, and the included angle between the matching convex structure and the upper surface of the connecting piece 500, are precisely defined as a 90-degree right angle, an angle greater or less than 90 degrees (forming a trapezoidal cross-section), or a smooth curve (forming a circular arc cross-section). Each shape is not arbitrary, but is selected based on specific functional requirements and application scenarios, such as the rectangular cross-section providing the maximum lateral contact area, the trapezoidal cross-section facilitating guidance and engagement, and the circular arc cross-section facilitating stress distribution and cleaning.

[0055] The shape constraints of this pair of basic mating structures produce significant technical benefits. First, they ensure a predictable, stable, and highly repeatable mechanical fit between the groove structure 211 and the raised structure. Different cross-sectional shapes directly affect the interaction between the two during engagement and disengagement. For example, a trapezoidal cross-section has a self-guiding effect, making the rotation and alignment of the water-cooled regulating plate 210 smoother and reducing the risk of jamming; a rectangular cross-section provides the most precise gradient of contact area variation, resulting in a more linear relationship between the adjustment amount of cooling efficiency and the rotation angle, facilitating precise control; while an arc-shaped cross-section avoids stress concentration at sharp corners, improving the fatigue life of parts, and is less prone to particle accumulation, maintaining thermal conductivity stability during long-term operation. Furthermore, this clear shape constraint provides a clear basis for the machining and precision assurance of parts, ensuring the consistency of performance between different batches of products. Ultimately, this guarantees the reliability, accuracy, and durability of the core function of dynamic temperature control achieved by adjusting the contact area, meeting the stringent requirements of high-precision semiconductor manufacturing for process repeatability.

[0056] In a specific embodiment, such as Figure 2 and Figure 4 As shown, the water-cooled regulating plate 210 has a limiting groove 212, and the adjusting member 220 is an adjusting bolt. The adjusting bolt passes through the limiting groove 212 and is connected to the connecting member 500. When the water-cooled regulating plate 210 is rotated, the adjusting bolt moves relative to the limiting groove 212. The limiting function is achieved by the cooperation between the adjusting bolt and the two ends of the limiting groove 212.

[0057] The water-cooled regulating plate 210 has multiple specially shaped limiting grooves 212, each groove being an elongated hole with a specific length and arc-shaped trajectory. The adjusting member 220 is specifically implemented as an adjusting bolt, which passes sequentially through the limiting grooves 212 on the water-cooled regulating plate 210 before finally being threaded and tightened by the connecting member 500. This means that the water-cooled regulating plate 210 is actually suspended above the connecting member 500 by the adjusting bolt, and the threaded portion of the adjusting bolt passes through the limiting groove 212. When the operator rotates the water-cooled regulating plate 210, since the head of the adjusting bolt is fixedly locked to the connecting member 500, the water-cooled regulating plate 210 rotates around its center. At this time, the groove wall of the limiting groove 212 slides relative to the stationary adjusting bolt thread. More specifically, the rotation angle of the water-cooled adjustment plate 210 is strictly limited within the sliding stroke allowed by the limiting groove 212. When the adjustment bolt slides to contact one end of the groove wall of the limiting groove 212, the rotation is stopped. This is the maximum or minimum limit position of rotation.

[0058] The cooperation between the limiting waist groove 212 and the adjusting bolt can produce key and reliable technical effects. First, it provides accurate and solid physical limitation for the rotary motion of the water-cooled adjusting disc 210 in a purely mechanical way, fundamentally preventing mechanical interference, concave-convex structure disengagement, even component damage and other problems caused by excessive rotation angle, greatly improving the safety of equipment operation and the reliability of long-term operation. Second, this limiting method is directly integrated on the core adjusting component, with very compact structure, without the need for additional complex limiting mechanism, reducing the complexity and manufacturing cost of the system. Further, the precise length and arc trajectory of the limiting waist groove 212 directly determine the adjustable range of the contact area, which makes the maximum and minimum cooling efficiency set values inherent reliable properties of the equipment, ensuring that different operators or different operations can obtain completely consistent adjustment limits, thereby ensuring the repeatability of the process and the consistency of product quality. Finally, while ensuring the core requirements of the adjustment function, this structure gives the entire system higher durability and operational safety, which is an important guarantee for achieving precise and reliable dynamic temperature control.

[0059] In specific embodiments, the contact area adjusting assembly 200 further comprises a handle fixed on the water-cooled adjusting disc 210 for manual adjustment of the rotation angle thereof.

[0060] The contact area adjusting assembly 200 adds a handle specially used for manual operation on the basis of the original structure. The handle is fixed and installed on an easily operated part of the outer edge or upper surface of the water-cooled adjusting disc 210 by mechanical means, such as by welding or using fasteners to firmly connect with the body of the water-cooled adjusting disc 210, so that the handle and the water-cooled adjusting disc 210 form a rigid whole. More specifically, the handle is designed with full consideration of ergonomics, with size and shape facilitating the operator to grasp and exert force, and installation position ensuring sufficient force arm during rotation operation, thereby allowing the operator to easily and labor-savingly drive the entire water-cooled adjusting disc 210 to perform accurate rotary motion around the center axis.

[0061] This increase in the design of the manual handle can produce significant human-computer interaction optimization effect and operation performance improvement. First of all, it provides an intuitive, convenient and direct operation interface for the operator without the need for any special tools, greatly simplifying the adjustment process. The operator can directly hold and rotate the handle to accurately control the rotation angle of the water-cooled adjustment disc 210, thereby fine-tuning the engagement degree of the groove structure 211 and the protruding structure, and finally realizing dynamic control of the cooling efficiency. Secondly, the force arm provided by the handle greatly reduces the operating force required to rotate the water-cooled adjustment disc 210, even in high-torque or fine-tuning scenarios, the operator can smoothly and smoothly adjust, avoiding excessive adjustment or equipment damage caused by excessive force, improving control precision and operation safety. Further, this manual direct operation mode has fast response speed, omits complex intermediate control links, has high reliability and simple maintenance, and is very suitable for semiconductor manufacturing sites that need to frequently or quickly adjust process parameters.

[0062] In specific embodiments, as shown in Figure 6 The spray disc cooling structure further comprises a sensor assembly 300 and a control assembly 400. The sensor assembly 300 comprises a displacement sensor 310 and a temperature sensor 320 for real-time monitoring of the displacement of the contact area adjustment assembly 200 and the inlet temperature of the spray disc, and feeding back the monitoring data to the control assembly 400; the control assembly 400 automatically adjusts the position of the contact area adjustment assembly 200 according to the preset temperature parameters to achieve temperature control.

[0063] The sensor assembly 300 is composed of a displacement sensor 310 and a temperature sensor 320. The displacement sensor 310 is arranged at a position that can directly or indirectly detect the physical position of the moving part in the contact area adjustment assembly 200, such as the water-cooled adjustment disc 210 or the part rigidly connected thereto, to accurately monitor its linear displacement or rotation angle in real time; The temperature sensor 320 is installed in the inlet channel or key temperature measurement point of the spray disc to continuously collect inlet temperature data reflecting the cooling effect. The two sensors convert the displacement and temperature data monitored in real time into electrical signals and continuously feed back to the control assembly 400. The control assembly 400 is a computing unit containing a processor, a memory and a control algorithm, which internally stores the preset temperature parameters required by the process. The control assembly 400 continuously receives and processes data from the sensor, compares the real-time inlet temperature with the preset temperature parameters, and calculates the required adjustment direction and amplitude according to the comparison result through the built-in control algorithm, and then drives an actuator to automatically adjust the position of the contact area adjustment assembly 200, such as controlling a motor to accurately rotate the water-cooled adjustment disc 210, thereby finally realizing automatic closed-loop control of the temperature of the spray disc.

[0064] The embodiment changes the process originally relying on manual observation and manual operation into a high-precision and high-response speed intelligent adjustment mode. First, the real-time data provided by the displacement sensor 310 and the temperature sensor 320 realizes transparent monitoring of the working state of the system, providing an indispensable data basis for automatic control. The automatic adjustment of the control component 400 based on these real-time data has a response speed far exceeding manual operation, and can instantly compensate for temperature fluctuations in the process, greatly improving the dynamic response characteristics and steady-state accuracy of temperature control, and effectively suppressing the temperature overshoot and response lag problems that are difficult to avoid in the traditional way. Further, this automatic closed-loop control completely eliminates the judgment errors and operation inconsistencies that may be caused by human operation, ensuring that different shifts and different operators performing the same process can obtain highly repeatable and stable temperature control effects, which is crucial for ensuring the yield rate of mass semiconductor production. Finally, the system realizes the leap from “passive monitoring and manual intervention” to “active sensing and automatic regulation”, not only significantly improving product quality and process stability, but also reducing the burden on operators, representing the development direction of high-precision semiconductor manufacturing temperature control technology.

[0065] The complete working process of the spray pan cooling structure provided by the embodiment starts from the response to the cooling demand of the system. When the process requirement changes or the sensor component 300 monitors that the spray pan inlet temperature deviates from the preset temperature parameter, the control component 400 will start the adjustment program, and the operator will start operating if it is in manual mode. The core of the whole process is the movement of the contact area adjustment component 200, more specifically, the control component 400 will output a signal to drive an actuator, or the operator directly holds the handle fixed on the water-cooled adjustment disc 210 and applies a rotating force. The rotating force will drive the water-cooled adjustment disc 210 to rotate around its central axis, and the rotating movement of the water-cooled adjustment disc 210 is guided and constrained by two key components at the same time: one is the adjustment bolt, the screw part of which passes through the limiting waist groove 212 on the water-cooled adjustment disc 210 and is fixedly connected with the connecting piece 500 above, so when the water-cooled adjustment disc 210 rotates, the groove wall of the limiting waist groove 212 will slide relative to the stationary adjustment bolt; the other is the connecting unit 230, the connecting block 233 fixed on the water-cooled adjustment disc 210 will move with it, and the movable end of the connecting sheet metal 232 will move on the fixed scale limiting plate 234 through the connecting block 233, and the scale mark pointed by the connecting block 233 shows the current adjustment state in real time, and the physical limit of the adjustment is finally determined by the cooperation of the two ends of the limiting waist groove 212 and the adjustment bolt.

[0066] With the rotation of the water-cooled conditioning disc 210, its most fundamental functional change occurs. The relative position between the groove structure 211 on the bottom surface of the water-cooled conditioning disc 210 and the matching protrusion structure on the upper surface of the connecting piece 500 changes, resulting in a continuous change in the meshing overlap area of the two. The cross-sectional shape of the groove structure 211 and the protrusion structure, whether trapezoidal, rectangular, or circular arc, directly affects the gradient and smoothness of the change in the contact area. When the two are fully engaged, the contact area is the largest, and according to the Fourier heat conduction law, the heat conduction efficiency from the connecting piece 500 to the water-cooled conditioning disc 210 with cooling water is the highest, and the cooling intensity reaches the maximum; when the two are fully staggered, an air gap is formed between the groove structure 211 and the protrusion structure, and the heat conduction is effectively blocked, and the cooling intensity is reduced to the minimum; in the intermediate state, different proportions of cooling efficiency adjustment are achieved.

[0067] The intelligence and automation of the entire working process are realized by the closed-loop control of the sensor assembly 300 and the control assembly 400. The displacement sensor 310 monitors the displacement of the contact area adjustment assembly 200 in real time, i.e., the rotation angle of the water-cooled conditioning disc 210 or the position of the movable end of the connecting piece 232; the temperature sensor 320 monitors the inlet temperature of the spray disc in real time, which is the final manifestation of the cooling effect. These real-time monitoring data are continuously fed back to the control assembly 400, and the core processor of the control assembly 400 compares the received temperature data with the preset temperature parameters and issues control instructions according to the algorithm calculation results to automatically drive the actuator to finely adjust the angle of the water-cooled conditioning disc 210, thereby forming a dynamic and accurate closed-loop temperature control system. This process ensures that the spray disc can instantaneously respond to process temperature changes, achieving ultra-high precision temperature stability, and ultimately ensuring the quality and uniformity of semiconductor thin film deposition.

[0068] In addition, in combination with Figure 7 and Figure 8 It can be seen that under the condition that the heater is set to 300 degrees Celsius and the cooling water temperature is 25 degrees Celsius, when the spray disc cooling structure is in the full contact mode, the maximum temperature of the spray disc is 160.53 degrees Celsius; and when it is in the non-contact mode, the maximum temperature of the spray disc rises to 172.79 degrees Celsius. This set of data directly shows that the design of adjusting the heat conduction efficiency by changing the contact area is effective, and the full contact mode can achieve more efficient heat dissipation, controlling the component temperature at a lower level.

[0069] Example 2

[0070] The present embodiment provides a semiconductor device comprising the spray disc cooling structure of example 1.

[0071] The semiconductor device provided by the embodiment can realize accurate, dynamic and automatic control on the process temperature by adopting the spray disc cooling structure of the embodiment 1, significantly improve the uniformity and repeatability of the thin film deposition, and finally improve the yield and comprehensive performance of the semiconductor production.

[0072] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements shall be encompassed within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A spray plate cooling structure, characterized in that, The spray plate cooling structure includes a spray plate body, a connector, and a contact area adjustment component. The contact area adjustment component is connected to the connector and is used to dynamically adjust the cooling efficiency of the spray plate body by adjusting the contact area with the connector.

2. The spray plate cooling structure according to claim 1, characterized in that, The contact area adjustment assembly includes a water-cooled adjustment plate and an adjustment component. The adjustment component is used to fix the water-cooled adjustment plate above the connector and allow the water-cooled adjustment plate to move relative to the connector to change the contact area.

3. The spray plate cooling structure according to claim 2, characterized in that, The contact area adjustment assembly further includes a connecting unit, which includes a fixing component, a connecting sheet metal, a connecting block, and a scale limiting plate. One end of the connecting sheet metal is connected to the connecting block and fixed by the fixing component. The other end of the connecting sheet metal is connected to the scale limiting plate, and the scale limiting plate is linked to the water-cooled adjustment plate through the fixing component.

4. The spray plate cooling structure according to claim 3, characterized in that, The scale limit plate has a limit groove and a scale mark. The limit groove is used to limit the rotation angle of the water-cooling adjustment plate, and the scale mark is used to indicate the cooling efficiency.

5. The spray plate cooling structure according to claim 2, characterized in that, The bottom surface of the water-cooled regulating plate is provided with a groove structure, and the upper surface of the connector is provided with a protrusion structure that matches the groove structure; the groove structure and the protrusion structure form a gap in the non-fitting state to block heat conduction.

6. The spray plate cooling structure according to claim 5, characterized in that, The cross-sectional shape of the groove structure and the protrusion structure is one of trapezoidal, rectangular or circular arc.

7. The spray plate cooling structure according to claim 2, characterized in that, The water-cooling adjustment plate has a limiting groove, and the adjusting component is an adjusting bolt. The adjusting bolt passes through the limiting groove and is connected to the connecting component. When the water-cooling adjustment plate is rotated, the adjusting bolt moves relative to the limiting groove, and the limiting function is achieved by the cooperation between the adjusting bolt and the two ends of the limiting groove.

8. The spray plate cooling structure according to claim 2, characterized in that, The contact area adjustment component also includes a handle, which is fixed to the water-cooled adjustment plate for manually adjusting its rotation angle.

9. The spray plate cooling structure according to claim 1, characterized in that, The spray plate cooling structure also includes a sensor assembly and a control assembly. The sensor assembly includes a displacement sensor and a temperature sensor, which are used to monitor the displacement of the contact area adjustment assembly and the air inlet temperature of the spray plate in real time, and feed the monitoring data back to the control assembly. The control assembly automatically adjusts the position of the contact area adjustment assembly according to the preset temperature parameters to achieve temperature control.

10. A semiconductor device, characterized in that, The semiconductor device includes the spray plate cooling structure according to any one of claims 1-9.

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