Electrostatic discharge apparatus and method for metal mask

Abstract

The application provides an electrostatic discharge device of a metal mask, which directly discharges the electric charge on the surface of a product through an electrostatic discharge assembly, thereby reducing the electrostatic adsorption component on the surface of the product. The electrostatic discharge assembly in the electrostatic discharge device can be in contact with the surface to be discharged with electrostatic in a bufferable manner, and can achieve buffering of a first buffer height, so that the position deviation is dynamically compensated while the electrostatic charge is discharged. The electrostatic discharge assembly is in contact with the surface to be discharged with electrostatic in a bufferable manner, so that hard collision and mechanical contact are avoided during the contact process, thereby avoiding scratching and contamination of the surface of the product, and further improving the yield of the product.

Description

Technical Field

[0001] This invention relates to precision processing equipment in the field of semiconductor or display panel manufacturing, and more particularly to an electrostatic discharge device and method for a metal mask. Background Technology

[0002] In existing technologies, laser processing stations typically use electrostatic adsorption to fix products. Specifically, after the product is loaded onto the glass platform, a positive voltage of 150V-200V needs to be applied to the platform, and electrostatic adsorption is used to fix the product to the platform surface. This process has the following technical drawbacks:

[0003] 1. When the electrostatic discharge is on, the product is subjected to a downward electrostatic force, forcibly expelling air between the product and the glass platform, creating a localized negative pressure environment. 2. Due to the charge induction effect, after the electrostatic discharge is off, some residual static charge remains between the glass platform and the product, and the negative pressure environment persists. Experiments show that this state of negative pressure adsorption and residual static charge takes 10-30 minutes to dissipate naturally. During material feeding, the combined effect of the negative pressure adsorption force and the residual static adsorption force generates excessive adhesion between the product and the platform, causing localized over-adsorption of the product by the platform. If material feeding is forced at this time, the adsorbed areas of the product will be subjected to uneven tensile forces, easily leading to plastic deformation or even structural damage, severely affecting product yield.

[0004] This problem is particularly pronounced for precision components such as ultra-thin flexible substrates. Current technologies that rely solely on extending the settling time to eliminate adsorption forces not only significantly reduce equipment utilization but also fail to fundamentally address the mechanical damage during material handling. Therefore, there is an urgent need to develop a technical solution that can effectively eliminate residual adsorption forces to solve this long-standing industry challenge. Summary of the Invention

[0005] The purpose of this application is to provide an electrostatic discharge device and method for metal photomasks, which can effectively eliminate the residual adsorption force after electrostatic adsorption and fundamentally solve the problem of mechanical damage to the product during unloading.

[0006] This application provides an electrostatic discharge device for a metal mask, connected to a product handling device, the product handling device comprising:

[0007] A drive component is used to realize the lifting and lowering of the product picking and placing device in the Z-axis direction;

[0008] A connecting component is fixedly connected to the driving component;

[0009] The electrostatic discharge device includes:

[0010] An electrostatic discharge component is fixedly disposed on the connecting component, and the electrostatic discharge component can bufferably contact the surface to be discharged static electricity, thereby achieving a first buffer height h1;

[0011] The electrostatic discharge assembly includes:

[0012] A telescopic component having a fixed housing and a telescopic shaft, the telescopic shaft being able to extend or retract along the Z-axis within the fixed housing, the telescopic component passing through a through hole in the connecting assembly;

[0013] A fastener, used to secure the retractable member to the connecting assembly; and,

[0014] A release element is fixedly disposed at the end of the telescopic shaft. When the release element comes into contact with the surface to be released static electricity, the telescopic shaft extends or shortens along the Z-axis in the fixed housing to buffer the magnitude of the contact force between the release element and the surface to be released static electricity.

[0015] In one embodiment, the electrostatic discharge device further includes: a grounding component, fixedly disposed on the electrostatic discharge component, one end of the grounding component being electrically connected to the electrostatic discharge component, and the other end of the grounding component being electrically connected to the outer casing of the product pick-and-place device.

[0016] In one embodiment, the release element includes a release monomer, wherein the electrostatic contact surface of the release monomer has a plating layer, the plating layer being a gold plating layer or a rhodium plating layer.

[0017] In one embodiment, the connection component includes:

[0018] A first connector, one end of which is fixedly connected to the drive assembly; the first connector has a bending angle of 90°;

[0019] A second connector is fixedly connected to the other end of the first connector. The second connector extends along the Z-axis and is closer to the surface from which static electricity is to be released.

[0020] The third connector is fixedly connected to the second connector. The third connector has a 90° bending angle and an extension surface in the XY plane. One end of the third connector is fixedly connected to the end of the second connector that extends along the Z-axis, and the other end of the third connector is fixedly connected to the electrostatic discharge assembly.

[0021] In one embodiment, the third connector further includes a support plate extending along the X-axis direction;

[0022] The support plate has a plurality of through holes spaced apart, and a release element is disposed in each of the through holes;

[0023] The release element further includes:

[0024] A release assembly is formed by combining a copper block and a high-density copper wire; the dimension of the release assembly in the Z-axis direction is the same as the dimension of the release unit in the Z-axis direction.

[0025] In one embodiment, the third connector further includes a support plate extending along the X-axis direction;

[0026] The support plate has a plurality of through holes spaced apart, and a release element is disposed in each of the through holes;

[0027] The release element includes:

[0028] At least one of the released monomers; and,

[0029] A release assembly formed by combining at least one copper block with high-density copper wire;

[0030] The contact area between the releasing monomer and the surface of the static electricity to be released is located in the product edge area, and the contact area between the releasing assembly and the surface of the static electricity to be released is located in the product pattern area.

[0031] In one embodiment, the connection component includes:

[0032] A fourth connector, one end of which is fixedly connected to the drive assembly; the fourth connector has a 90° bending angle; and,

[0033] The fifth connector is fixedly connected to the other end of the fourth connector;

[0034] The release element includes:

[0035] A first release element is fixedly disposed on the fifth connector; and

[0036] The second release element is connected to the first release element, and the second release element has a third buffer height h3 in the Z-axis direction.

[0037] In one embodiment, the fifth connector includes:

[0038] A connecting body, which extends along the X-axis direction;

[0039] Multiple connecting posts are integrally formed with the connecting body, and each connecting post is fixedly connected to one of the first release elements.

[0040] In one embodiment, each of the electrostatic discharge components is connected to one of the grounding components;

[0041] The grounding assembly includes: independent multi-strand tin-plated copper braided tape connected to a common grounding busbar; the resistance of the grounding loop is less than 1Ω.

[0042] This application also includes a method for electrostatic discharge of a metal mask, employing the electrostatic discharge device for the metal mask described in any of the preceding claims.

[0043] The method includes:

[0044] S01, drive the electrostatic discharge component to move downward along the Z-axis towards the surface of the metal mask product at a first speed, and detect and feedback the height value of the electrostatic discharge component in real time; when the lower end of the electrostatic discharge component is at a first distance from the surface of the metal mask product, automatically switch to a second speed, the second speed being less than the first speed;

[0045] S02, detect the pressure value of the electrostatic discharge component at multiple locations, and when the pressure value at any location reaches the first pressure value, switch to pressure closed-loop mode;

[0046] S03, the pressure closed-loop mode includes: setting the target pressure to the standard pressure value, dynamically adjusting the output force of the drive component in the Z-axis direction to make the pressure value at multiple locations uniform; when the pressure value at multiple locations is uniform, it is determined that the electrostatic discharge component is in stable contact with the surface of the metal mask product.

[0047] S04, continuously monitor the surface voltage, cumulative release time, and voltage decay slope of the metal mask product. When any one of the above three parameters meets the constraint conditions, control the electrostatic discharge component to lift along the Z-axis at a third speed, the third speed being greater than the first speed.

[0048] The electrostatic discharge device and method for the metal mask of this application have at least the following advantages or beneficial effects:

[0049] 1. The electrostatic discharge device for the metal mask provided in this application directly discharges the charge from the product surface through the electrostatic discharge component, reducing the electrostatic adsorption component on the product surface. The electrostatic discharge component in the electrostatic discharge device can make buffered contact with the surface to be discharged, and can achieve buffering at a first buffer height, thereby dynamically compensating for positional deviations while discharging electrostatic charge. The buffered contact between the electrostatic discharge component and the surface to be discharged avoids hard collisions and mechanical contact during the contact process, thus preventing scratches / contamination of the product surface and improving product yield.

[0050] 2. The electrostatic discharge device for the metal mask provided in this application stably discharges charge through a buffered contact between the electrostatic discharge component and the surface to be discharged, and exhibits zero damage during physical contact with the metal mask product (the electrostatic discharge component can achieve a buffer height h1). A millisecond-level DC charge path is formed through an electrical connection between the grounding component and the outer shell of the product handling device, thereby eliminating electrostatic adsorption on the metal mask product (eliminating electrostatic residue). The flatness accuracy of the glass stage is ensured at the nanometer level without requiring surface roughening treatment. The electrostatic discharge device provided in this embodiment provides a fundamental technical guarantee for the manufacturing of metal masks for Micro LED, OLED, etc., improving the yield of metal masks and directly reducing the unit cost of metal masks.

[0051] 3. The electrostatic discharge device for the metal mask provided in this application has a first buffer height in the Z-axis direction, which ensures that when the discharge component descends or the product rises and surface contact occurs, even if there are minor unevennesses on the product surface or the glass stage, each discharge component can uniformly contact the product surface under elastic pressure. Furthermore, in this embodiment, a pressure detection module and / or a voltage detection module can be further provided to monitor the relationship between the buffer height of the discharge component in the Z-axis direction, the pressure value applied to the product, and the surface charge of the product. On the one hand, the rising or falling height of the discharge component in the Z-axis direction can be precisely controlled, and the amount of charge on the product surface can be monitored to determine whether residual static electricity has been completely released. On the other hand, by real-time monitoring of the pressure value between the discharge component and the product surface, and the amount of charge on the product surface, the dynamic relationship between the height of the discharge component on the product surface and the amount of charge on the product surface can be balanced, thereby achieving the effect of completely releasing residual static electricity while avoiding damage to the product surface. In this embodiment, an automated control system can realize closed-loop control of the three parameters—displacement, pressure value, and residual charge—thereby achieving process traceability and anomaly warning. Furthermore, the electrostatic discharge component completes a single lifting motion in the Z-axis direction, simultaneously releasing static electricity from the product surface and weakening the adhesion between the glass stage and the product surface, thus greatly improving its electrostatic removal efficiency. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0053] Figure 1a This is a front view of an electrostatic discharge device provided in one embodiment of this application;

[0054] Figure 1b This is a side view of an electrostatic discharge device provided in one embodiment of this application;

[0055] Figure 2 This is a schematic diagram of the structure of the electrostatic discharge assembly and grounding assembly provided in the embodiments of this application;

[0056] Figure 3 This is a schematic diagram of the structure of an electrostatic discharge assembly disposed on a carrier plate according to an embodiment of this application;

[0057] Figure 4 This is a schematic diagram of the structure of an electrostatic discharge assembly disposed on a support plate according to another embodiment of this application;

[0058] Figure 5 This is a schematic diagram of the structure of an electrostatic discharge assembly disposed on a support plate according to another embodiment of this application;

[0059] Figure 6a This is a partial structural schematic diagram of an electrostatic discharge device provided in another embodiment of this application;

[0060] Figure 6b A front view of the structure of an electrostatic discharge device provided in another embodiment of this application;

[0061] Figure 7 This is a schematic diagram of the connecting component in an electrostatic discharge device provided in another embodiment of this application;

[0062] Figure 8 A side view of the structure of an electrostatic discharge device provided in another embodiment of this application;

[0063] Figure 9 A top view of the product picking and placing device provided in this application embodiment when picking up or placing a metal mask product;

[0064] Figure 10 This is a top view of the electrostatic discharge device provided in this application embodiment when performing electrostatic discharge on a metal mask product.

[0065] Explanation of reference numerals in the attached figures:

[0066] Product handling device 100, suction cup 101, electrostatic discharge device 200, glass stage 301, electrostatic buffer film 302, metal mask 303;

[0067] Driver component 10;

[0068] Connection component 20:

[0069] First connector 21, second connector 22, third connector 23: bearing plate 231;

[0070] Fourth connector 24 and fifth connector 25: connecting body 251 and connecting post 252;

[0071] Static discharge assembly 30: telescopic component 31, fixing component 32, release component 33.

[0072] Release monomer 331,

[0073] Release assembly 332: copper block 332-1, copper wire 332-2;

[0074] First release element 34: main copper strip 341, covering copper strip 342, second release element 35;

[0075] Grounding component 40: grounding element 41, grounding connector 42. Detailed Implementation

[0076] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0077] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0078] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0079] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0080] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0081] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0082] Regarding the first problem mentioned in the background art—the negative pressure between the product and the glass platform surface—existing solutions typically involve physically or chemically roughening the glass platform surface to increase its surface roughness. This is intended to facilitate faster airflow into the gap between the product and the glass platform after electrostatic shut-off, thereby reducing the negative pressure adsorption force. However, this method has significant limitations: surface roughening may affect the flatness of the glass platform, leading to uneven product bonding and consequently affecting processing accuracy. Furthermore, the improvement in roughness is limited, the air penetration rate remains slow, and the negative pressure adsorption effect cannot be completely eliminated, leaving a risk of localized tensile deformation of the product during material handling.

[0083] Regarding the second issue mentioned in the background technology—static charge residue—some existing technical solutions include adding a contact-type static eliminator to the laser equipment, such as using a rigid conductor, to conduct residual charge through direct contact with the product. However, this method has the following drawbacks: contact-type static eliminator may cause scratches or contamination on the product surface due to mechanical contact. The rigid conductor needs to be precisely aligned; otherwise, poor contact may lead to incomplete static eliminator removal. It can only eliminate static residue and cannot simultaneously solve the negative pressure adsorption problem; the combined adsorption force may still cause product damage during unloading.

[0084] In summary, existing technologies struggle to simultaneously and efficiently address both negative pressure adsorption and electrostatic residue issues, and may pose risks such as decreased processing precision and secondary product damage. A more reliable, non-contact solution is urgently needed. The following embodiments of this application resolve the paradox of "the inability to simultaneously achieve surface treatment precision and electrostatic removal efficiency": traditional solutions sacrifice platform flatness (roughening) or increase the risk of contact damage (hard contact) to improve electrostatic removal efficiency. The electrostatic release device provided in the following embodiments of this application achieves nanometer-level processing precision while minimizing damage through non-invasive charge conduction and adaptive buffering.

[0085] Please see Figure 1a and Figure 1b This application provides an electrostatic discharge device 200 for a metal photomask. The electrostatic discharge device 200 is integrated into a product pick-and-place device 100. The product pick-and-place device 100 includes a drive assembly 10 and a connection assembly 20. The electrostatic discharge device 200 includes an electrostatic discharge assembly 30.

[0086] The drive assembly 10 is used to realize the lifting and lowering of the product pick-and-place device in the Z-axis direction. The drive assembly also controls the lifting and lowering of the electrostatic discharge component 30 in the electrostatic discharge device 200 in the Z-axis direction. The drive assembly 10 can be configured as a drive cylinder, and is fixedly connected to the product pick-and-place device 100 to control the lifting and lowering of the copper block of the electrostatic discharge component 30 in the Z-axis direction. The drive assembly 10 is controlled by a controller, and its repeatability is ±0.01mm. The drive assembly 10 can achieve nanometer-level motion control, with a Z-axis lifting cycle ≤0.5s, and can be integrated with metal mask production lines. The abnormal response speed of the drive assembly 10 is <10ms.

[0087] The connecting component 20 is fixedly connected to the driving component 10. The connecting component 20 is also fixedly connected to the electrostatic discharge component 30 in the electrostatic discharge device 200. The connecting component 20 is fixedly connected to the driving component 10 (e.g., a driving cylinder) and the electrostatic discharge component 30 (e.g., a copper block). The electrostatic discharge component 30 is fixedly disposed on the connecting component 20, and the electrostatic discharge component 30 can bufferly contact the surface to be discharged static electricity, achieving a first buffer height h1.

[0088] Please refer to further information. Figure 2 and Figure 3 The electrostatic discharge assembly 30 includes: a retractable member 31, a fixing member 32, and a release member 33.

[0089] The telescopic component 31 has a fixed housing and a telescopic shaft. The telescopic shaft can extend or retract within the fixed housing. Figure 2 The fixed housing shown has external threads for fixed connection with the fixing member 32. The telescopic member 31 passes through a through hole in the connecting assembly 20. The telescopic shaft may include a precision spring. The fixing member 32 may be configured as a fixing screw, used to fix the telescopic member 31 to the connecting assembly 20. A release member 33 is fixedly disposed at the end of the telescopic shaft; when the release member 33 contacts the surface to be discharged static electricity, the telescopic shaft extends or retracts within the fixed housing to buffer the contact force between the release member 33 and the surface to be discharged static electricity. Figure 2As shown, the release element 33 can achieve a first buffer height h1 under the drive of the telescopic shaft. In some embodiments, the first buffer height h1 is 1mm-5mm. That is, the release element 33 has an independent buffer stroke of 1mm-5mm in the direction perpendicular to the product surface (Z-axis direction). The release element 33 can be selected as a high-purity copper block with a resistivity as low as 1.68×10⁻⁶. -8 Ω·m to achieve millisecond-level charge release (<0.2s).

[0090] In this embodiment, the electrostatic discharge component 30 in the electrostatic discharge device 200 can make buffered contact with the surface to be discharged static electricity, and can achieve buffering at a first buffer height, thereby dynamically compensating for positional deviations while discharging static charge. The buffered contact between the electrostatic discharge component 30 and the surface to be discharged static electricity avoids hard collisions and mechanical contact during the contact process, thus preventing scratches / contamination on the product surface and improving product yield.

[0091] In one embodiment, the electrostatic discharge device 200 further includes a grounding component 40. The grounding component 40 is fixedly disposed on the electrostatic discharge component 30. One end of the grounding component 40 is electrically connected to the electrostatic discharge component 30, and the other end is electrically connected to the outer casing of the product pick-and-place device 100. This prevents breakdown of electronic components, damage to the performance of electronic components, or electromagnetic interference (EMI) affecting the metal mask during the production / testing process, thus avoiding production line shutdown. The grounding component 40 directly conducts residual charge to the equipment casing, simultaneously disintegrating electrostatic adsorption forces, so that the product is no longer pulled by the combined force of "static electricity + negative pressure" when it is detached, eliminating the risk of product deformation at the source.

[0092] The electrostatic discharge device 200 provided in this embodiment can maintain the original flatness of the glass stage 301 without roughening the glass stage 301, retaining 100% of its optical-grade flat surface, ensuring the uniformity of the product's bonding with the glass stage 301, and avoiding micron-level processing deviations caused by the roughness of the glass stage 301 surface.

[0093] The electrostatic discharge device 200 provided in this embodiment directly discharges the charge on the product surface through the electrostatic discharge component 30, reducing the electrostatic adsorption component on the product surface. A grounding path is formed through the grounding component 40, cutting off the charge accumulation near the electrostatic discharge component 30 / grounding component 40, thus eliminating the electrostatic synergistic effect of the adsorption voltage on the product surface. That is, through the coordinated operation of the electrostatic discharge component 30 and the grounding component 40, the electrostatic adsorption force on the product surface is simultaneously eliminated. The electrostatic discharge component 30 in the electrostatic discharge device 200 can make buffered contact with the surface to be discharged, and can achieve buffering at a first buffer height h1, achieving dynamic compensation for positional deviations while releasing electrostatic charge. The buffered contact between the electrostatic discharge component 30 and the surface to be discharged avoids hard collisions and mechanical contact during the contact process, thereby preventing scratches / contamination of the product surface and improving product yield.

[0094] In this embodiment, the electrostatic discharge component 30 achieves stable charge discharge through buffer contact with the surface to be discharged, and exhibits zero damage during physical contact with the metal mask product (the electrostatic discharge component 30 can achieve buffering at a first buffer height h1). The grounding component 40 is electrically connected to the outer casing of the product handling device 100, forming a millisecond-level DC charge path, thereby eliminating electrostatic adsorption on the metal mask product (eliminating electrostatic residue). The flatness accuracy of the glass stage 301 is ensured at the nanometer level without requiring surface roughening treatment. The electrostatic discharge device 200 provided in this embodiment provides a fundamental technical guarantee for the manufacturing of metal masks for Micro LED, OLED, etc., improving the yield of metal masks and directly reducing the unit cost of metal masks.

[0095] In one embodiment, the electrostatic discharge assembly 30 (which may include multiple discharge elements 33 and / or multiple second discharge elements 35) forms a large-area equipotential contact with the product surface, significantly improving charge release efficiency. Static electricity is cleared within the lifting cycle of the drive assembly 10 (typically <0.5s), seamlessly connecting to the production line cycle. The grounding path of the grounding assembly 40 is directly coupled to the equipment housing of the product pick-and-place device 100, preventing electromagnetic interference (EMI) from being conducted to sensitive electronic components and reducing the downtime rate caused by electrostatic discharge to near zero.

[0096] In this embodiment, the electrostatic discharge assembly 30 has a first buffer height h1 in the Z-axis direction (perpendicular to the product surface). This ensures that when the discharge member 33 descends or the product rises and surfaces come into contact, even if there are minor unevennesses on the product surface or the glass stage 301, each discharge member 33 can uniformly contact the product surface under elastic pressure. Furthermore, in this embodiment, a pressure detection module and / or a voltage detection module can be further provided to monitor the relationship between the buffer height of the discharge member 33 in the Z-axis direction, the pressure value applied to the product, and the charge on the product surface. On the one hand, the rising or falling height of the discharge member 33 in the Z-axis direction can be precisely controlled, and the amount of charge on the product surface can be monitored to determine whether residual static electricity has been completely released. On the other hand, by real-time monitoring of the pressure value between the discharge member 33 and the product surface, and the amount of charge on the product surface, the dynamic relationship between the height of the discharge member 33 on the product surface and the amount of charge on the product surface can be balanced, thereby achieving the effect of completely releasing residual static electricity while avoiding damage to the product surface. In this embodiment, the movable and automated control system realizes closed-loop control of three parameters: displacement, pressure, and residual charge, thereby achieving process traceability and anomaly early warning. Furthermore, the electrostatic discharge component 30 completes a single lifting action in the Z-axis direction, simultaneously releasing static electricity from the product surface and weakening the adsorption force between the glass stage 301 and the product surface, greatly improving its electrostatic removal efficiency.

[0097] In some embodiments, the release member 33 is a hollow cylindrical structure, with its hollow portion allowing the retractable member 31 to extend into it. The retractable member 31 also includes a limiting member disposed near one end of the release member. The grounding assembly 40 includes a grounding member 41, a grounding connector 42, and a grounding wire (not shown). The grounding member 41 has a 90° bend angle and a through hole in a first extending plane perpendicular to the Z-axis direction. The limiting member of the retractable member 31 is located within the through hole to limit the further extension of the retractable member 31 in the Z-axis direction. The grounding member 41 has a mounting hole for the grounding connector 42 in a second extending plane perpendicular to the first extending plane. The grounding connector 42 can be configured as a screw (hexagonal screw) for securing the grounding wire. Each release member 33 can be independently grounded with a sufficiently thick grounding wire (e.g., a cross-sectional area ≥ 4 mm²). 2(Multi-strand ultra-flexible tin-plated copper braided strip). If multiple release elements 33 are provided, multiple sets of grounding wires can be connected in parallel to a low-resistance busbar for unified grounding connection. In one embodiment, a high-purity copper block with a hollow cylindrical structure having only one top surface is used as a release element 33. The connection point between a release element 33 and the grounding element 41 can be achieved by first drilling a hole in the center of the top surface of the release element 33, and then using a stainless steel screw + star washer + conductive pad to press the braided grounding wire terminal to ensure a firm and low-resistance connection. If multiple release elements 33 are provided, it is absolutely necessary to avoid connecting the high-purity copper block in series with wires before grounding, as this will result in a long release path, high resistance, and poor effect for copper blocks far from the grounding point.

[0098] In this embodiment, the electrostatic discharge component 30 includes a retractable member 31, a fixing member 32, and a discharge member 33. The grounding component 40 includes a grounding member 41, a grounding connector 42, and a grounding wire (not shown). The connection method between the electrostatic discharge component 30 and the grounding component 40 makes the connection between them more robust, reduces the connection resistance, shortens the path for releasing electrostatic current through the electrostatic discharge component 30, and improves the electrostatic discharge effect.

[0099] A plating layer can be applied to the surface of the release element 33 that directly contacts the metal mask product. This plating layer prevents copper oxidation, which could increase contact resistance and ensure long-term stable and reliable contact. An insulating ceramic coating is applied to the area where the release element 33 does not directly contact the metal mask product, giving the release element 33 an anti-interference shielding effect. On one hand, it blocks high-frequency interference and suppresses electromagnetic pulses during discharge. On the other hand, the insulating ceramic coating has a withstand voltage of >15kV, preventing false triggering of high-voltage equipment.

[0100] Please see Figure 2 , Figure 3 , Figure 4 and Figure 5 In one embodiment, such as Figure 2 As shown, the electrostatic discharge assembly 30 includes a discharge element 33 (the discharge element 33 is configured as a discharge unit 331). In some embodiments, such as Figure 3 , Figure 4 and Figure 5 As shown, the electrostatic discharge assembly 30 includes a plurality of discharge members 33 spaced apart. Figure 3 The multiple release elements 33 set at intervals are all set as release units 331. Figure 4 The multiple release components 33 set at intervals are all set as release assemblies 332. Figure 5 The electrostatic discharge assembly 30 includes both a discharge element 33 composed of multiple discharge units 331 and a discharge element 33 composed of multiple discharge assemblies 332. In such cases... Figure 2 and Figure 3In the illustrated embodiment, the release monomer 331 can be configured as a cylindrical hollow copper block or a high-purity oxygen-free copper structure to ensure optimal conductivity. The electrostatic contact surface of the release monomer 331 (the surface in direct contact with the metal mask product) has a plating layer, which is a gold plating layer or a rhodium plating layer. In one embodiment, a cylindrical hollow copper block structure with a diameter of 15mm to 25mm can be used as the release monomer 331. The electrostatic contact surface of the release monomer 331 can be finely polished. In some embodiments, the thickness of the gold plating layer or the rhodium plating layer is greater than 1μm.

[0101] In this embodiment, a plating layer is provided on the surface of the release monomer 331 that directly contacts the metal mask product. The plating layer can prevent copper oxidation from increasing the contact resistance and ensure long-term stable and reliable contact. The gold or rhodium plating layer needs to have a certain degree of wear resistance to extend the service life of the release monomer 331.

[0102] Please see Figure 1a and Figure 1b As shown, in one embodiment, the connecting assembly 20 includes a first connector 21, a second connector 22, and a third connector 23. One end of the first connector 21 is fixedly connected to the cylinder of the drive assembly 10. The first connector 21 has a 90° bending angle. The other end of the first connector 21 is fixedly connected to the second connector 22. The second connector 22 extends along the Z-axis and is closer to the surface to be released static electricity. The third connector 23 is fixedly connected to the second connector 22. The third connector 23 also has a 90° bending angle. The third connector 23 has an extension surface in the XY plane. One end of the third connector 23 is fixedly connected to the end of the second connector 22 extending along the Z-axis, and the other end of the third connector 23 is fixedly connected to the static electricity release assembly 30, which extends along the Z-axis.

[0103] Specific examples Figure 1b Both the first connector 21 and the third connector 23 shown have a portion extending along the Y-axis. The third connector 23 also has a portion extending along the X-axis. The first connector 21 and the second connector 22 can be made of high-resistance alloys or resistance alloys (e.g., nickel-chromium alloys, copper-nickel alloys, iron-chromium-aluminum alloys, etc.). The third connector 23 can be made of metals or alloys with good electrical conductivity, such as copper, copper alloys (e.g., beryllium copper alloys, copper-nickel-silicon alloys, copper-chromium-zirconium alloys), nickel, nickel alloys (e.g., nickel-titanium alloys or palladium-nickel alloys), tungsten, tungsten alloys (e.g., copper-tungsten alloys). A portion of the structure of the above-mentioned connecting assembly 20 can contact or be arranged side by side with the product pick-and-place device 100 to save space for the electrostatic discharge device 200 and the product pick-and-place device 100.

[0104] Please see Figure 3 , Figure 4 and Figure 5 In one embodiment, the third connector 23 further includes a component along the X direction ( Figure 1a A support plate 231 extends along both the positive and negative X-axis directions. The support plate 231 has multiple through holes spaced apart, each containing a release element 33. In this embodiment, multiple release elements 33 arranged in an array may be included. The extension length of the third connector 23 along the X-direction can be designed according to the product dimensions. In this embodiment, the structure of the third connector 23 can accommodate a larger number of release elements 33 of different types, thereby improving electrostatic discharge efficiency.

[0105] The release component 33 also includes a release assembly 332 of a solid copper block 332-1 and a high-density copper wire 332-2. The solid copper block 332-1 can be welded to the high-density copper wire 332-2. The high-density copper wire 332-2 can be made of brass with a diameter of 0.1 mm and a length of 10 mm to 80 mm, which can be selected according to actual needs. The density of the high-density copper wire 332-2 is 90 wires / mm². 2 -150 roots / mm 2 For example, it can be set to 120 threads / mm 2 The high-density copper wire 332-2 can achieve a second buffer height h2 in the Z-axis direction, where the second buffer height can reach 0.5mm-1.5mm. The dimensions of the release assembly 332 in the Z-axis direction are the same as those of the release unit 331 in the Z-axis direction. The copper block 332-1 can be cylindrical, cubic, or other shapes. The copper block 332-1 can be a hollow copper block or a solid copper block. Figure 3 The image shows multiple release elements 33 spaced apart on the support plate 231. (As shown...) Figure 4 As shown, multiple release assemblies 332 are spaced apart on the support plate 231. Figure 5 As shown, multiple release units 331 and multiple release assemblies 332 are spaced apart on the support plate 231, wherein the positions of the release units 331 and the release assemblies 332 are interchangeable.

[0106] In this embodiment, the support plate 231 included in the third connector 23 can be configured as a long strip base, for example, with a length slightly less than 1200mm, such as 1150mm. Multiple, such as 5-8, independent release units 331 are vertically fixed on it at equal intervals of 150mm-250mm, or a release assembly 332 comprising a cylindrical solid copper block 332-1 and high-density copper wire 332-2. Overall, the contact area between the release unit 33 and the surface to be released is approximately 100mm². 2 -180mm 2 Within the specified range. In one specific embodiment, the overall contact area between the release element 33 and the surface to be released static electricity is 150 mm². 2The thickness of the release element 33 can be set to 10mm. The thickness of the release element 33 ensures the rigidity and heat dissipation of the electrostatic discharge assembly 30. The contact area between the release element 33 and the surface to be discharged ensures that the electrostatic discharge assembly 30 has sufficient discharge current density. In this embodiment, the release element 33 is provided as a combination of a release unit 331 and a release assembly 332. On the one hand, it is convenient to observe or detect the displacement of the release element 33 when it comes into contact with the surface to be discharged (this can be reflected by whether the release assembly 332 is deformed, or by [other means]). On the other hand, the combination of the release unit 331 and the release assembly 332 facilitates sufficient electrostatic discharge.

[0107] Please see Figure 6a , Figure 6b , Figure 7 and Figure 8 In one embodiment, the connecting assembly 20 includes a fourth connector 24 and a fifth connector 25. One end of the fourth connector 24 is fixedly connected to the cylinder of the drive assembly 10. The fourth connector 24 has a bending angle of 90°. The fifth connector 25 is fixedly connected to the other end of the fourth connector 24.

[0108] The electrostatic discharge assembly 30 includes a first discharge element 34 and a second discharge element 35. The first discharge element 34 is fixedly mounted on the fifth connector 25. The second discharge element 35 is connected to the first discharge element 34. The second discharge element 35 has a third buffer height h3 in the Z-axis direction, wherein the third buffer height can be 2mm-10mm. The contact area between the second discharge element 35 and the surface to be discharged is 40mm². 2 -80mm 2 In one specific embodiment, the contact area between the second releasing element 35 and the surface to be released static electricity is 70 mm². 2 Specifically, both the first release element 34 and the second release element 35 can be made of copper. The second release element 35 can be a copper strip of a certain width, wound into a hollow ring with a hollow center. Figure 6b As shown, the first release element 34 may include a main copper strip 341 and a covering copper strip 342. The main copper strip 341 is directly and fixedly connected to the fifth connector 25. The covering copper strip 342 is disposed on the outside of the main copper strip 341, wrapping the main copper strip 341 and part of the fifth connector 25. The covering copper strip 342 is used to reinforce the connection between the main copper strip 341 and the fifth connector 25.

[0109] In this embodiment, a detailed structure of another electrostatic discharge device 200 is provided, which includes a simpler structure for the connecting component 20 and the electrostatic discharge component 30, while still achieving high-efficiency electrostatic discharge. In this embodiment, the third buffer height h3 in the Z-axis direction is achieved through the second discharge element 35.

[0110] Please see Figure 7 and Figure 8 In one embodiment, the fifth connector 25 includes a connector body 251 and a plurality of connector posts 252. The connector body 251 extends along the X-axis. The plurality of connector posts 252 are integrally formed with the connector body 251, and each connector post 252 is fixedly connected to a first release element 34. The plurality of connector posts 252 are spaced apart, and each connector post 252 is also provided with a grounding component 40. Specifically, the grounding component 40 can be wound around the connector post 252, and the grounding component 40 is further fixed by covering it with copper strip 342.

[0111] This embodiment provides a specific structural form of the fifth connector 25 and clarifies the connection method between the grounding component 40 and the fifth connector 25. The structural design of the fifth connector 25 in this embodiment makes it easier to install the first release element 34 and the second release element 35, thereby facilitating the electrostatic discharge of the metal mask product.

[0112] Please see Figure 6a , Figure 6b and Figure 8 In one embodiment, each electrostatic discharge assembly 30 is connected to a grounding assembly 40. The grounding assembly 40 comprises: individual multi-strand tin-plated copper braided tape with an impedance <0.1Ω. The cross-sectional area of ​​the grounding assembly 40 is ≥4mm². 2 The grounding component 40 can be connected to a common grounding busbar. It can also be connected to the product handling device 100. The resistance of the grounding loop formed by the grounding component 40 is less than 1Ω, and ideally, its grounding resistance value is <0.5Ω. The grounding resistance can be monitored continuously during the static electricity removal process. For example, a real-time monitoring module can be integrated into the grounding loop to issue an audible and visual alarm when the grounding resistance abnormally increases, such as >1.5Ω. In this embodiment, through the optimized setting of the grounding component 40, an ultra-low impedance grounding path can be formed. After being led out by the grounding component 40, the residual voltage on the surface of the metal mask product drops to <0.03kV, while eliminating false triggering caused by electromagnetic interference. The grounding component 40 has a long fatigue life, specifically a bending life greater than 1 million cycles, and a long maintenance cycle. After installation, the grounding component 40 is measured and recorded using a grounding resistance tester, and checked regularly, such as monthly.

[0113] Table 1: Comparison of the technical effects of the traditional solution and the solution of this application.

[0114]

[0115] The schemes in Table 1 above are those adopted in this application. Figures 1a-5 The embodiments shown, and, Figures 6a-8The illustrated embodiment shows that, compared to conventional solutions, the static electricity removal time in this application is significantly reduced, the product damage rate is greatly decreased, and the frequency of production line downtime is significantly reduced. In a single production line downtime incident using the conventional solution, the production line for metal photomasks was shut down for 8 hours, resulting in a large number of defective products, extended product delivery time, and reduced production efficiency. After adopting the solution in this application, the production line for metal photomasks has not experienced any downtime, the static electricity removal time for each product is significantly shortened, and the product damage rate is also reduced, fully meeting current production needs.

[0116] In this embodiment, a multi-point contact design is used to cover a long-sized metal mask product, thereby increasing the contact area of ​​the antistatic contact surface (e.g., Figures 1a-5 In the embodiment shown, the contact area between the electrostatic discharge component 30 and the surface to be discharged is 100 mm². 2 -180mm 2 ,like Figures 6a-8 In the embodiment shown, the contact area between the electrostatic discharge component 30 and the surface to be discharged is 40 mm². 2 -80mm 2 Gold plating on the surface of the release monomer 331 ensures low contact resistance and improves electrostatic discharge efficiency, while also enhancing oxidation resistance and allowing for regular maintenance to maintain electrostatic discharge performance.

[0117] In several embodiments of this application, the electrostatic discharge assembly 30 has a first buffer height h1 of 1mm-5mm in some embodiments. In other embodiments, the electrostatic discharge assembly 30 has a buffer height of 1mm-6.5mm (first buffer height h1 + second buffer height h2). In still other embodiments, the electrostatic discharge assembly 30 has a third buffer height h3 of 2mm-10mm. This buffer design enables more uniform surface contact, ensuring uniform pressure at all points on the surface of the metal mask product. It also facilitates gradual release of static electricity, avoids sparks, and allows for monitoring and standardized operation during the electrostatic discharge process.

[0118] This application also provides a method for electrostatic discharge of a metal mask, including:

[0119] The product handling device 100 places the product to be tested onto the glass stage 301. (See also...) Figure 9The glass stage 301 is used to place the metal mask product (metal mask 303 in the figure). An electrostatic buffer film 302 is located on the glass stage 301. The electrostatic buffer film 302 is made of PET adhesive-free electrostatic frosted film, and its frosted surface is in direct contact with the metal mask 303 to improve the negative pressure between the metal mask 303 and the glass stage 301. When the metal mask 303 is placed on the glass stage 301, the electrostatic buffer film 302 is located between the metal mask 303 and the glass stage 301 in the stacking direction. The metal mask 303 includes a product area and an edge support area, wherein the edge support area is located on the electrostatic buffer film 302 to prevent the frosted surface of the electrostatic buffer film 302 from damaging the product area. Correspondingly, when the product pick-and-place device 100 acts on the metal mask 303, it also acts on the product area to prevent the suction cup 101 of the product pick-and-place device 100 from damaging the product area.

[0120] The controller applies a positive voltage to the product under test to electrostatically attract it and perform various tests.

[0121] After the test is completed, the controller adjusts the ambient humidity to 40%-60%RH. In this step, the ambient humidity of 40%-60%RH can effectively suppress the generation of static electricity and accelerate the weak release of charge through the air as a supplement to the static discharge component 30.

[0122] After testing, the controller initiates ionization blowing on the metal mask product. In this step, an ion fan can be installed near the product retrieval station to blow air onto the retrieval area of ​​the metal mask product. This ionization blowing neutralizes any residual static charge (such as on the glass surface or non-conductive parts of the product) that may remain on the product or surrounding insulating materials after contact with the electrostatic discharge component 30, and neutralizes any triboelectric charge that may regenerate during operation. This ionization blowing provides dual protection.

[0123] The glass stage 301 is in the first position, and the controller controls the electrostatic discharge device 200 to contact the product to be discharged for a first time (which can be set to 1s-2s). The electrostatic discharge device 200 is then lifted. The glass stage 301 moves to the second position, and the controller controls the electrostatic discharge device 200 to contact the product to be discharged for a second time (which can be set to 1s-2s). After the electrostatic discharge of the metal mask is completed, the product pick-and-place device 100 removes the product.

[0124] Please see Figure 10 , corresponding to Figure 5The figure shows a top view of the electrostatic discharge device 200 performing electrostatic discharge on a metal mask product. The surfaces of the electrostatic discharge assembly 30 and the metal mask 303 in contact are the surface of the discharge unit 331 or the surface of the discharge assembly 332, respectively. Figure 10 In the illustrated embodiment, the static electricity of the metal mask 303 is fully released by the static discharge component 30 with a certain buffer height, so as to solve the problems of negative pressure and static electricity residue between the product and the glass platform surface.

[0125] In one embodiment, the electrostatic discharge device 200 further includes a pressure sensor and a displacement sensor integrated into the electrostatic discharge assembly 30. The pressure sensor is integrated at the lowermost end of the release member 33 or the second release element 35 in the Z-axis direction, i.e., on or near the surface in contact with the product. The displacement sensor is integrated at the lowermost end of the third connector 23 or the fifth connector 25 in the Z-axis direction to accurately measure the displacement of the electrostatic discharge assembly 30. The electrostatic discharge device 200 also includes a voltage detector disposed between the glass stage 301 and the metal mask 303 to continuously detect the electrostatic voltage. Alternatively, the electrostatic discharge device 200 also includes a non-contact electrostatic voltmeter to rapidly scan the surface of the metal mask product before and after electrostatic discharge by the electrostatic discharge device 200, especially at both ends and the middle of the product, to verify the electrostatic discharge effect, i.e., whether the residual voltage on the surface of the metal mask product drops to 0.03kV or below after being discharged by the grounding component 40.

[0126] In this embodiment, the drive component 10 is precisely programmed and controlled by a controller. Combined with real-time feedback from a pressure sensor regarding the contact state between the electrostatic discharge component 30 and the product surface, a three-parameter closed-loop control of "displacement-pressure-charge" is formed, enabling process traceability and anomaly warning. The displacement-pressure-charge control method includes:

[0127] Electrostatic discharge methods for metal photomasks include:

[0128] S01, the controller drives the electrostatic discharge component 30 to move vertically (Z-axis direction) downwards towards the surface of the metal mask product at a constant first speed (which can be set to 0.3 mm / s). The displacement sensor detects and feeds back the height value of the electrostatic discharge component 30 in real time at a frequency of ≥100Hz. When the lower end of the electrostatic discharge component 30 is at a first distance (which can be set to 2.0 mm) from the product surface, it automatically switches to a micro-motion mode at a second speed (the second speed is less than the first speed, and the second speed can be set to 0.1 mm / s).

[0129] S02, the pressure values ​​experienced by the electrostatic discharge assembly 30 at multiple locations are detected. When the pressure value at any location reaches a first pressure value, the system switches to pressure closed-loop mode. Since the electrostatic discharge assembly 30 may include multiple discharge elements 33 or second discharge elements 35, a pressure sensor can be installed on each discharge element 33 or second discharge element 35. Therefore, when any pressure sensor detects that the pressure value reaches the first pressure value (which can be set to 0.1 N / cm), the system switches to pressure closed-loop mode. 2 When the initial contact moment is determined, the pressure closed-loop mode is immediately executed.

[0130] The pressure closed-loop mode includes: setting the target pressure to a standard pressure value, and dynamically adjusting the output force of the drive component 10 in the Z-axis direction to ensure uniform pressure at multiple locations. The specific implementation method includes: switching the controller to the pressure closed-loop mode, and setting the target pressure to a standard pressure value (the standard pressure value can be set to 4.0 ± 0.3 N / cm²). 2 -4.8±0.3 N / cm 2 ).

[0131] The controller dynamically adjusts the output force of the drive assembly 10 in the Z-axis direction to ensure uniform pressure values ​​at multiple pressure detection points (the maximum pressure difference between multiple pressure detection points can be set to ≤1.0 N / cm). 2 The uniformity of pressure values ​​at multiple locations can be understood as the pressure values ​​at multiple locations all tending towards the standard pressure value, or as the maximum pressure difference between the pressure values ​​at multiple locations being less than or equal to 1.0 N / cm. 2 .

[0132] If the standard deviation of pressure at multiple pressure monitoring points consistently exceeds 0.8 N / cm 2 If the pressure distribution remains uneven for more than 3 seconds, the tilt compensation algorithm is activated to automatically balance the pressure distribution. The tilt compensation algorithm includes: reading pressure sensor data from all electrostatic discharge components 30 and applying a moving average filter (0.2-second window width) to each component 30 to eliminate mechanical vibration noise; calculating key pressure distribution indicators: average pressure, pressure range, and standard deviation; initiating compensation when the pressure distribution is significantly uneven based on these indicators; calculating the pressure deviation for each component 30, generating compensation instructions, and performing pressure compensation step-by-step (compensating low-pressure points first, then high-pressure points); verifying and iterating the effect after compensation, and monitoring the single-point pressure value and pressure oscillation amplitude in real time during each compensation process. This tilt compensation algorithm can be integrated into the controller; when activation is required, the corresponding tilt compensation algorithm module in the controller can be directly called.

[0133] S03, once the pressure values ​​at multiple locations (pressure detection points) are uniform, it is determined that the electrostatic discharge component 30 is in stable contact with the surface of the metal mask product, voltage monitoring is performed, and the voltage discharge strategy is adjusted.

[0134] Voltage monitoring and adjustment of voltage release strategies include:

[0135] S031, based on the detection data of the voltage detector, calculate the voltage decay slope S (S=ΔV / Δt) every 0.1 seconds.

[0136] S032, dynamically adjusts the voltage release strategy based on the voltage decay slope:

[0137] When S < -100V / s, the current state is maintained;

[0138] When -100V / s≤S<-50V / s, the electrostatic discharge time is extended by 1 second;

[0139] When S≥-50V / s, the electrostatic discharge component 30 micro-vibration is activated (the micro-vibration can be set to an amplitude of 10μm and a frequency of 50Hz) to accelerate electrostatic discharge;

[0140] S04. Continuously monitor the surface voltage, cumulative release time, and voltage decay slope of the metal mask product. When any one of the above three parameters (surface voltage, cumulative release time, and voltage decay slope of the metal mask product) meets the constraint conditions, the electrostatic discharge component 30 is triggered to separate from the surface of the metal mask product.

[0141] The constraints include: surface voltage of the metal mask product ≤ 0.03kV; cumulative release time greater than 10 seconds; voltage decay slope |S| < 10V / s for more than 3 seconds.

[0142] The specific steps for triggering the separation of the electrostatic discharge component 30 from the surface of the metal mask product include: the controller controls the electrostatic discharge component 30 to rise along the Z-axis at a third speed (the third speed can be set to 0.5 mm / s), and simultaneously monitors the voltage rebound value ΔV_sep at the moment of separation; if |ΔV_sep|>10V, the system immediately pauses and alarms, and the third speed is greater than the first speed.

[0143] Within a preset time period after separation (the preset time can be set to 5 seconds), the surface voltage of the metal mask product is detected (by scanning the voltage values ​​at the center and four corners of the product surface using a non-contact electrostatic voltmeter). If the surface voltage |V_residual| at all points is ≤0.03kV, electrostatic discharge is complete. If any point exceeds the limit, a secondary discharge process is automatically initiated (the pressure can be increased by 10%-20%).

[0144] In this embodiment, the electrostatic discharge method for the metal mask adopts a three-parameter closed-loop control method of "displacement-pressure-charge". Pressure control can eliminate micron-level product scratches; different displacement amounts in the Z-axis direction are achieved using three speeds to avoid the risk of electric sparks generated by secondary discharge; voltage release is fast, and the single operation time is shortened to 1s-2s, with a maximum of no more than 8.5s; the electrostatic discharge method involved in this application has a high degree of integration, and the control process is embedded in the part picking action, making it convenient to operate.

[0145] The electrostatic discharge method for metal photomasks also includes storing all parameters (displacement / pressure / voltage timing data) after each batch of electrostatic discharge is completed, bound to the product ID. A process report is automatically generated, and abnormal events are marked. Early warnings are triggered based on rules (e.g., an alarm is triggered when residual voltage > 0.03kV three consecutive times).

[0146] In this embodiment of the application, by associating abnormal events with original sensor data segments (such as data from 10 seconds before pressure imbalance), early warning and tracing can be achieved, the cause of the alarm can be found, and the problem can be resolved in a timely manner.

[0147] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A method for electrostatic discharge of a metal photomask, characterized in that, An electrostatic discharge device using a metal mask is used to release electrostatic charge from the metal mask product; the electrostatic discharge device of the metal mask is connected to the product pick-and-place device; The product picking and placing device includes: a driving component (10) and a connecting component (20); The electrostatic discharge device (200) includes: An electrostatic discharge assembly (30) is fixedly disposed on the connecting assembly (20), and the electrostatic discharge assembly (30) can be buffered to contact the surface to be discharged static electricity; The connecting component (20) includes: a fourth connector (24) and a fifth connector (25); The electrostatic discharge assembly (30) includes: a first discharge element (34) and a second discharge element (35); The first release element (34) is fixedly disposed on the fifth connector (25); the first release element (34) includes a main copper strip (341) and a covering copper strip (342), the main copper strip (341) is fixedly connected to the fifth connector (25); the covering copper strip (342) is disposed on the outside of the main copper strip (341) and wraps the main copper strip (341) and part of the fifth connector (25). The second release element (35) is connected to the first release element (34), and the second release element (35) has a third buffer height in the Z-axis direction; the second release element (35) is set as a copper strip with a certain width, which is wrapped into a hollow ring with a hollow center; One end of the fourth connector (24) is fixedly connected to the drive assembly (10); the fourth connector (24) has a bending angle of 90°; The fifth connector (25) is fixedly connected to the other end of the fourth connector (24); The fifth connector (25) includes: a connector body (251) and a plurality of connector posts (252). The connecting body (251) extends along the X-axis direction; Multiple connecting posts (252) are integrally formed with the connecting body (251), and each connecting post (252) is fixedly connected to one of the first release elements (34). The method includes: S01, drive the electrostatic discharge component (30) to move downward along the Z-axis towards the surface of the metal mask product at a first speed, and detect and feedback the height value of the electrostatic discharge component (30) in real time; when the lower end of the electrostatic discharge component (30) is at a first distance from the surface of the metal mask product, automatically switch to the second speed, the second speed being less than the first speed; S02, detect the pressure value of the electrostatic discharge component (30) at multiple locations. When the pressure value at any location reaches the first pressure value, switch to the pressure closed-loop mode. The pressure closed-loop mode includes: setting the target pressure to the standard pressure value and dynamically adjusting the output force of the drive component (10) in the Z-axis direction to make the pressure value at multiple locations uniform. S03, once the pressure values ​​at multiple locations are uniform, it is determined that the electrostatic discharge component (30) is in stable contact with the surface of the metal mask product, voltage monitoring is performed, and the voltage discharge strategy is adjusted. S04, continuously monitor the surface voltage, cumulative release time, and voltage decay slope of the metal mask product. When any one of the three parameters meets the constraint conditions, control the electrostatic release component (30) to lift along the Z-axis at a third speed, the third speed being greater than the first speed.

2. The electrostatic discharge method for a metal photomask according to claim 1, characterized in that, The first pressure value is set to 0.1 N / cm. 2 The standard pressure value is set to 4.0 ± 0.3 N / cm. 2 -4.8±0.3 N / cm 2 ).

3. The electrostatic discharge method for a metal photomask according to claim 1, characterized in that, In step S03, the voltage monitoring and voltage release strategy adjustment includes: S031, based on the detection data of the voltage detector, calculate the voltage decay slope S every 0.1 seconds; S032, dynamically adjusts the voltage release strategy based on the voltage decay slope S: When S < -100V / s, the current state is maintained; When -100V / s≤S<-50V / s, the electrostatic discharge time is extended by 1 second; When S≥-50V / s, the electrostatic discharge component (30) starts the micro-vibration mode to accelerate electrostatic discharge.

4. The electrostatic discharge method for a metal photomask according to claim 1, characterized in that, It also includes binding the product ID to store all parameters after each batch of products has completed electrostatic discharge, automatically generating a process report, and marking abnormal events.

5. The electrostatic discharge method for a metal photomask according to claim 1, characterized in that, The first speed is set to 0.3 mm / s; The first distance is set to 2.0 mm, and the second speed is set to 0.1 mm / s; The third speed is set to 0.5 mm / s.

6. The electrostatic discharge method for a metal photomask according to claim 1, characterized in that, The third buffer height h3 is 2mm-10mm.

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