Magnetron device and magnetron sputtering equipment

Abstract

The invention discloses a magnetron device and magnetron sputtering equipment, the disclosed magnetron device is used for being matched with a target material assembly of the magnetron sputtering equipment, and the magnetron device comprises a first driving mechanism, an overturning support, a first magnetron and a second magnetron, wherein the first magnetron and the second magnetron are arranged on the overturning bracket at an interval along the radial direction of the target material assembly; the first driving mechanism is connected with the overturning support and used for driving the overturning support to rotate around a first axis so as to drive one of the first magnetron and the second magnetron to rotate to the position close to the target material assembly, and the other one of the first magnetron and the second magnetron is driven to rotate to the position away from the target material assembly. According to the scheme, the problem that the structure for switching the operation positions of the outer side magnetron and the inner side magnetron in the prior art is relatively complex and is not beneficial to simplifying the structure of the magnetron sputtering equipment can be solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a magnetron device and a magnetron sputtering device. Background Technology

[0002] In semiconductor integrated circuit manufacturing, sputtering is used to deposit various metal layers and related material layers. Sputtering utilizes the ionization of gas during anomalous glow discharge to bombard a cathode target, causing various particles (atoms, molecules, etc.) to escape from the target surface. Magnetron sputtering is a type of sputtering process that uses a magnetron near the target to generate a magnetic field. This confines electrons to the vicinity of the target surface, causing them to move in a spiral motion between two magnetic poles. This extends the electrons' travel distance and increases the probability of collision with the target, thereby significantly improving ionization efficiency and generating more target ions.

[0003] Magnetron sputtering processes are performed in magnetron sputtering equipment. In this technology, during the deposition process, the outer magnetron, opposite the large-diameter region of the target, needs to be brought close to the target and moved along that region to control plasma bombardment of the target's surface in that area, thereby achieving better film performance during deposition. Since the small-diameter region of the target receives little or no plasma bombardment, easily detachable particles can adhere to it over time. Therefore, to reduce the detachment of these particles from the small-diameter region and its impact on the film quality, the outer magnetron, opposite the large-diameter region, needs to be moved away from the target, while the inner magnetron, opposite the small-diameter region, needs to be brought close to the target and moved along that region to etch away the adhered particles, thus preventing particle detachment and ensuring the film quality on the wafer surface.

[0004] Since magnetron sputtering equipment needs to switch the operating positions of the outer and inner magnetrons to adapt to the switching between deposition and etching processes, a structure is required to switch the operating positions of the outer and inner magnetrons. However, the structure for switching the operating positions of the outer and inner magnetrons in related technologies uses a multi-stage gear-to-gear and gear-to-screw transmission method, which makes the structure for switching the operating positions of the outer and inner magnetrons relatively complex, thus hindering the simplification of the magnetron sputtering equipment structure. Summary of the Invention

[0005] This invention discloses a magnetron device and a magnetron sputtering equipment to solve the problem that the structure for switching the operating positions of the outer and inner magnetrons in related technologies is relatively complex, which is not conducive to the simplification of the structure of magnetron sputtering equipment.

[0006] To solve the above-mentioned technical problems, the present invention is implemented as follows:

[0007] In a first aspect, this application discloses a magnetron device for use with a target assembly of a magnetron sputtering equipment. The magnetron device includes a first drive mechanism, a flipping bracket, a first magnetron, and a second magnetron, wherein:

[0008] The first magnetron and the second magnetron are arranged radially spaced on the flipping bracket along the target assembly;

[0009] The first driving mechanism is connected to the flipping bracket and is used to drive the flipping bracket to rotate around the first axis, so as to drive one of the first magnetron and the second magnetron to rotate to a position close to the target assembly and the other to a position far away from the target assembly.

[0010] Secondly, this application also discloses a magnetron sputtering apparatus, which includes a reaction chamber and the magnetron device described in the first aspect. The top of the reaction chamber is provided with a mounting position for the target assembly, and the magnetron device is located on the upper side of the reaction chamber.

[0011] The technical solution adopted in this invention can achieve the following technical effects:

[0012] The magnetron device disclosed in this application, by providing a first driving mechanism and a flipping bracket, arranges a first magnetron and a second magnetron radially spaced on the flipping bracket along the target assembly. This allows the first driving mechanism to drive the flipping bracket to rotate around a first axis, causing the first magnetron to rotate closer to the target assembly and the second magnetron to rotate further away from the target assembly. In this case, the first magnetron can perform an etching process. When the flipping bracket rotates the first magnetron further away from the target assembly and the second magnetron closer to the target assembly, the second magnetron can perform a thin film deposition process.

[0013] Since the magnetron device disclosed in this application only needs to rotate the rotating bracket around the first axis to switch the positions of the first magnetron and the second magnetron, the magnetron device disclosed in this application is more conducive to the simplification of the structure of magnetron sputtering equipment compared with the multi-stage gear and gear, gear and screw structure used in related technologies. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a structure used in related technologies to switch the operating positions of the outer magnetron and the inner magnetron.

[0015] Figure 2This is a partial cross-sectional view of the magnetron sputtering apparatus disclosed in an embodiment of the present invention, wherein the x-axis represents the first axis and the z-axis represents the second axis;

[0016] Figure 3 This is a schematic diagram of the magnetron device disclosed in an embodiment of the present invention from a first perspective, where the dashed lines represent the perspective structure;

[0017] Figure 4 This is a schematic diagram of the magnetron device disclosed in an embodiment of the present invention from a second perspective;

[0018] Figure 5 This is a schematic diagram of the first output shaft driving the mounting base and the flipping bracket to rotate around the second axis in the fourth direction, as disclosed in an embodiment of the present invention. The arrows in the diagram indicate the rotation direction of the first output shaft.

[0019] Figure 6 for Figure 5 The partial bottom view shows the direction in which the first output shaft drives the mounting base and the flip bracket to rotate around the second axis in the fourth direction.

[0020] Figure 7 This is a schematic diagram of the first output shaft driving the mounting base and the flipping bracket to rotate around the second axis in a third direction, as disclosed in an embodiment of the present invention. The arrows in the diagram indicate the rotation direction of the first output shaft.

[0021] Figure 8 for Figure 7 The partial bottom view shows the direction in which the first output shaft drives the mounting base and the flip bracket to rotate around the second axis along a third direction.

[0022] Figure 9 A schematic diagram for adjusting the radial position of the first and second magnetrons along the target assembly.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100-Target Material Assembly

[0025] 200 - First drive mechanism, 210 - First drive body, 211 - First output shaft, 212 - First motor, 213 - Pulley mechanism

[0026] 220 - Transmission mechanism, 221 - First bevel gear, 222 - Second bevel gear, 223 - First bearing assembly, 224 - Second bearing assembly

[0027] 300-Flip bracket, 310-Second limiting part

[0028] 400-First Magnetron

[0029] 500-Second Magnetron

[0030] 600 - Mounting base, 610 - First limiting part,

[0031] 710-First lead screw, 720-First nut, 730-Adapter bracket, 740-Guide sleeve, 750-Manual crank,

[0032] 810 - First photoelectric sensor, 820 - Second photoelectric sensor, 830 - First reflector, 840 - Second reflector, 850 - Third photoelectric sensor, 860 - Third reflector

[0033] 910-Connecting shaft, 920-Housing shell, 921-Housing shell top wall, 930-Counterweight, 940-Lifting guide rail, 950-Lifting slider, 960-Second lead screw, 970-Second nut, 980-Pulley. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0035] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] Please refer to Figures 2 to 9 This invention discloses a magnetron device, which is used in conjunction with the target assembly 100 of a magnetron sputtering device. The magnetron device guides electrons to form a dense plasma region near the target assembly 100, extending the electron travel distance and the probability of collision with the target, thereby significantly improving the ionization efficiency and generating more target ions.

[0037] The target assembly 100 can be mounted on the top of the reaction chamber of the magnetron sputtering equipment.

[0038] The disclosed magnetron device includes a first drive mechanism 200, a flipping bracket 300, a first magnetron 400, and a second magnetron 500.

[0039] The flip bracket 300 can be rotatably mounted on the target assembly 100 via a mounting base. The flip bracket 300 can also be mounted on other components of the magnetron device. The flip bracket 300 can be positioned opposite to and spaced apart from the target assembly 100, and can rotate around a first axis. The extension direction of the first axis can be parallel to the extension plane of the target assembly 100. Alternatively, the extension direction of the first axis can have a certain angle with the extension plane of the target assembly 100. For example, the angle between the extension direction of the first axis and the extension plane of the target assembly 100 can be between 1 and 10°, or between 1 and 20°. This embodiment does not specifically limit the angle between the extension direction of the first axis and the extension plane of the target assembly 100.

[0040] The first magnetron 400 and the second magnetron 500 are key components of the magnetron device. The first magnetron 400 and the second magnetron 500 are used to control the plasma during the sputtering deposition process to improve the deposition rate and the uniformity and purity of the film, thereby ensuring high-quality film deposition.

[0041] The first magnetron 400 and the second magnetron 500 are radially spaced on the flipping bracket 300 of the target assembly 100. The first magnetron 400 and the second magnetron 500 may also be radially spaced on the flipping bracket 300 along the extension direction of the first axis. In the radial direction of the target assembly 100, the first magnetron 400 may be located between the second magnetron 500 and the center position of the target assembly 100.

[0042] The first drive mechanism 200 is connected to the flipping bracket 300 and is used to drive the flipping bracket 300 to rotate around the first axis, so as to drive one of the first magnetron 400 and the second magnetron 500 to rotate to a position close to the target assembly 100 and the other to rotate to a position far away from the target assembly 100.

[0043] It should be noted that when the first magnetron 400 rotates to a position close to the target assembly 100 and the second magnetron 500 rotates to a position far away from the target assembly 100, the distance between the first magnetron 400 and the target assembly 100 is less than the distance between the second magnetron 500 and the target assembly 100, and the first magnetron 400 is located between the target assembly 100 and the second magnetron 500. Conversely, when the first magnetron 400 rotates to a position far away from the target assembly 100 and the second magnetron 500 rotates to a position close to the target assembly 100, the distance between the first magnetron 400 and the target assembly 100 is greater than the distance between the second magnetron 500 and the target assembly 100, and the second magnetron 500 is located between the first magnetron 400 and the target assembly 100.

[0044] Specifically, in the direction perpendicular to the extension of the first axis, the first magnetron 400 and the second magnetron 500 can be disposed on opposite sides of the flipping bracket 300. Of course, in the projection plane perpendicular to the first axis, the angle between the projection of the first magnetron 400 and the projection of the second magnetron 500 on the projection plane can be 80°, 90°, or 120°, etc. The specific placement of the first magnetron 400 and the second magnetron 500 in this embodiment is not limited, as long as the flipping bracket 300 rotates around the first axis, causing one of the first magnetron 400 and the second magnetron 500 to rotate to a position close to the target assembly 100, and the other to rotate to a position away from the target assembly 100.

[0045] To facilitate understanding of the technical solutions disclosed in the embodiments of this application, a simplified description of the thin film deposition and etching processes performed using a magnetron sputtering apparatus is provided below. During the thin film deposition process on a wafer using a magnetron sputtering apparatus, the gas in the reaction chamber undergoes an anomalous glow discharge to ionize the gas. The ions generated by the gas plasma bombard the cathode target, causing various particles (atoms, molecules, etc.) to escape from the target surface, thereby depositing these particles on the wafer surface to form a thin film. To obtain better thin film performance, a second magnetron 500, opposite to the large-diameter region of the target assembly 100, is brought close to the target assembly 100, and the second magnetron 500 is driven to move along the large-diameter region of the target assembly 100 to control the plasma bombardment of the target surface located in the large-diameter region, thereby achieving better thin film performance during the deposition process.

[0046] Because the surface of the small-diameter area of ​​the target assembly 100 receives little or no plasma bombardment during the thin film deposition process on the wafer using magnetron sputtering equipment, easily detachable particles can adhere to this surface after a prolonged deposition process. These particles accumulate to a certain thickness and are prone to detachment, eventually falling onto the wafer and affecting the quality of the deposited film. To prevent these particles from detaching and affecting the film quality on the wafer surface, magnetron sputtering equipment requires an etching process.

[0047] When performing the etching process, the magnetron sputtering equipment brings the first magnetron 400, which is opposite to the small diameter region of the target assembly 100, close to the target assembly 100 and drives the first magnetron 400 to rotate along the small diameter region of the target assembly 100 so that the plasma etches the particles attached to the small diameter region of the target assembly 100, thereby avoiding the attachment of particles from peeling off and affecting the film quality on the wafer surface.

[0048] It should be noted that the large-diameter region can be considered as an annular region defined by a first preset diameter range, and the small-diameter region can be considered as a central region defined by a second preset diameter range, with the annular region surrounding the central region. The etching process is actually a cleaning process for the small-diameter region or the central region of the target assembly 100.

[0049] When switching between thin film deposition and etching processes in a magnetron sputtering apparatus, it is necessary to control one of the first magnetron 400 and the second magnetron 500 to be close to the target assembly 100 while the other is away from the target assembly 100. To facilitate understanding of the technical solution of this application, the structure for achieving the effect of one of the first magnetron 400 and the second magnetron 500 being close to the target assembly 100 while the other is away from the target assembly is described here. The related technology employs a multi-stage gear-to-gear and gear-to-screw transmission method; details can be found in the appendix. Figure 1 The related technology uses a pulley 4 to drive the central shaft 5 to rotate. A driving gear 11 is connected to the central shaft 5. The driving gear 11, driven gear 10, idler gear 18, and driven gear 19 mesh with each other to achieve transmission. Driven gear 10 and driven gear 19 drive screw 12 and screw 20 to rotate, respectively. This causes screw 12 and screw 20 to raise and lower the inner magnetron 13 and outer magnetron 24, respectively. This allows one of the inner magnetron 13 to rise away from the target assembly, while the other descends and approaches the target assembly. Because the related technology uses a multi-stage gear-to-gear and gear-to-screw transmission method, the structure for switching the operating positions of the outer and inner magnetrons in the magnetron sputtering equipment is relatively complex, which is detrimental to the structural simplification of the magnetron sputtering equipment.

[0050] The magnetron device disclosed in this application, by providing a first driving mechanism 200 and a flipping bracket 300, allows the first magnetron 400 and the second magnetron 500 to be radially spaced on the flipping bracket 300 along the target assembly 100. This allows the first driving mechanism 200 to drive the flipping bracket 300 to rotate around a first axis, thereby rotating the first magnetron 400 closer to the target assembly 100 and the second magnetron 500 further away from the target assembly 100. In this case, the first magnetron 400 can perform an etching process. When the flipping bracket 300 rotates the first magnetron 400 further away from the target assembly 100 and the second magnetron 500 closer to the target assembly 100, the second magnetron 500 can perform a thin film deposition process.

[0051] Since the magnetron device disclosed in this application embodiment only requires rotating the rotating bracket 300 around the first axis to switch the positions of the first magnetron 400 and the second magnetron 500, the magnetron device disclosed in this application embodiment is more conducive to the simplification of the structure of magnetron sputtering equipment compared with the multi-stage gear and gear, gear and screw structure used in related technologies.

[0052] Optionally, the magnetron device may further include a mounting base 600. The first drive mechanism 200 may include a first drive body 210 and a transmission mechanism 220. The tilting bracket 300 is rotatably mounted on the mounting base 600 about a first axis, and the tilting bracket 300 may be rotatably mounted on the mounting base 600 via bearings. The first output shaft 211 of the first drive body 210 may be connected to the tilting bracket 300 via the transmission mechanism 220.

[0053] The first output shaft 211 can be used to rotate around the second axis. The first output shaft 211 can drive the flipping bracket 300 to rotate around the first axis through the transmission mechanism 220. The second axis intersects or is not in the same plane as the first axis, and the second axis is parallel or coincides with the central axis of the target assembly 100.

[0054] The magnetron device disclosed in this application configures the first drive mechanism 200 to include a first drive body 210 and a transmission mechanism 220, so that the first drive body 210 can drive the transmission mechanism 220 to move through the first output shaft 211, so that the transmission mechanism 220 drives the flipping bracket 300 to rotate around the first axis. Since the second axis intersects or is not in the same plane as the first axis, and the second axis is parallel or coincident with the central axis of the target assembly 100, the first output shaft 211 and the flipping bracket 300 rotate around different axes, which is beneficial to the positional arrangement of the various components of the magnetron device.

[0055] Specifically, the first drive body 210 may further include a first motor 212 and a pulley mechanism 213. The first motor 212 may be connected to the pulley mechanism 213, and the pulley mechanism 213 may be connected to the first output shaft 211. The first motor 212 can drive the first output shaft 211 to rotate around the second axis through the pulley mechanism 213. Of course, the first drive body 210 may also include a rotary drive motor, and the first output shaft 211 may be the output shaft of the rotary drive motor. Of course, the first drive body 210 may also have other structures, and the embodiments of this application do not impose specific limitations on the structure of the first drive body 210.

[0056] During thin film deposition or etching processes, it is necessary to maintain the movement of the first magnetron 400 along the small-diameter region of the target assembly 100 or the second magnetron 500 along the large-diameter region of the target assembly 100. To achieve this movement, the magnetron device may optionally include a second drive mechanism. This second drive mechanism can drive the first drive mechanism 200 and the flipping support 300 to rotate as a whole around the central axis of the target assembly 100 or an axis parallel to the central axis of the target assembly 100, thereby causing the first magnetron 400 to move along the small-diameter region of the target assembly 100 or the second magnetron 500 to move along the large-diameter region of the target assembly 100. The second drive mechanism can be a hydraulic drive mechanism, a pneumatic drive mechanism, a drive motor, etc. This application embodiment does not specifically limit the type of the second drive mechanism. Specifically, the second drive mechanism can be directly connected to the mounting base 600. The second drive mechanism can drive the first drive mechanism 200 and the flipping bracket 300 to rotate as a whole around the central axis of the target assembly 100 or an axis parallel to the central axis of the target assembly 100 through the mounting base 600.

[0057] To simplify the structure of the magnetron device, the first output shaft 211 may optionally be rotatably connected to the mounting base 600, so that the mounting base 600 is suspended relative to the target assembly 100. The first output shaft 211 may be rotatably connected to the mounting base 600 via a bearing. The mounting base 600 may be provided with a first limiting part 610, and the flipping bracket 300 may be provided with a second limiting part 310 and a third limiting part.

[0058] When the flip bracket 300 rotates along the first direction around the first axis to the position where the first magnetron 400 is close to the target assembly 100, the first limiting part 610 can cooperate with the second limiting part 310 for limiting. Under the limiting cooperation of the first limiting part 610 and the second limiting part 310, the first output shaft 211 can drive the mounting base 600 and the flip bracket 300 as a whole to rotate along the third direction around the second axis, thereby causing the first magnetron 400 to move along the small diameter area of ​​the target assembly 100. When the flip bracket 300 rotates along the second direction around the first axis to a position where the second magnetron 500 is close to the target assembly 100, the first limiting part 610 can engage with the third limiting part for limiting. The first output shaft 211 can drive the mounting base 600 and the flip bracket 300 as a whole to rotate along the fourth direction around the second axis when the first limiting part 610 and the third limiting part are engaged for limiting. This causes the second magnetron 500 to move along the large diameter area of ​​the target assembly 100. The first direction and the second direction are opposite, and the third direction and the fourth direction are opposite.

[0059] In the specific working process, when etching is required, the first output shaft 211 first rotates around the second axis in a third direction. The first output shaft 211 drives the flip bracket 300 to rotate around the first axis in a first direction through the transmission mechanism 220. When the flip bracket 300 rotates around the first axis in the first direction to the position where the first magnetron 400 is close to the target assembly 100, the first limiting part 610 and the second limiting part 310 engage in a limiting cooperation to restrict the flip bracket 300 from continuing to rotate around the first axis in the first direction. At this time, the first output shaft 211 continues to rotate around the second axis in a third direction. Under the limiting cooperation of the first limiting part 610 and the second limiting part 310, the first output shaft 211 drives the mounting base 600 and the flip bracket 300 as a whole to rotate around the second axis in a third direction, thereby causing the first magnetron 400 to move along the small diameter area of ​​the target assembly 100.

[0060] When a thin film deposition process is required, the first output shaft 211 first rotates along the fourth direction around the second axis. The first output shaft 211 drives the flipping bracket 300 to rotate along the second direction around the first axis through the transmission mechanism 220. When the flipping bracket 300 rotates along the second direction around the first axis to the position where the second magnetron 500 is close to the target assembly 100, the first limiting part 610 and the third limiting part cooperate to limit the flipping bracket 300 from continuing to rotate along the second direction around the first axis. At this time, the first output shaft 211 continues to rotate along the fourth direction around the second axis. With the first limiting part 610 and the third limiting part cooperating, the first output shaft 211 drives the mounting base 600 and the flipping bracket 300 as a whole to rotate along the fourth direction around the second axis, thereby causing the second magnetron 500 to move along the large diameter area of ​​the target assembly 100.

[0061] The magnetron device disclosed in this application rotatably connects a first output shaft 211 to a mounting base 600. The mounting base 600 is provided with a first limiting part 610, and the flipping bracket 300 is provided with a second limiting part 310 and a third limiting part. This allows the first output shaft 211 to rotate not only around the first axis in a third direction, but also to drive the mounting base 600 and the flipping bracket 300 as a whole to rotate around the second axis in a third direction. When the first output shaft 211 rotates around the second axis in a fourth direction, it not only allows the flipping bracket 300 to rotate around the first axis in a second direction, but also drives the mounting base 600 and the flipping bracket 300 as a whole to rotate around the second axis in a fourth direction. This eliminates the need for an additional second driving mechanism, thereby simplifying the structure of the magnetron device.

[0062] Specifically, the first limiting part 610 can be a limiting rod, and the second limiting part 310 and the third limiting part can be limiting recesses. The limiting rod is used to limit the engagement with the limiting recess, so that when the first limiting part 610 is engaged with the second limiting part 310 and the third limiting part, the limiting end of the limiting rod is located in the limiting recess, thereby making the limiting engagement of the first limiting part 610 with the second limiting part 310 and the third limiting part more stable. Of course, the first limiting part 610 can also be the end of the mounting base 600, and the second limiting part 310 and the third limiting part can be limiting rods located at two opposite ends of the flip bracket 300. The embodiments of this application do not specifically limit the structure of the first limiting part 610, the second limiting part 310 and the third limiting part.

[0063] In another embodiment, a fourth limiting part may be provided on the side of the mounting base 600 away from the flip bracket 300. The first output shaft 211 can pass through the mounting base 600 from the side of the mounting base 600 away from the flip bracket 300. A fifth limiting part and a sixth limiting part may be provided on the side wall of the first output shaft 211 on the side of the mounting base 600 away from the flip bracket 300. When the flip bracket 300 rotates along the first direction around the first axis to a position where the first magnetron 400 is close to the target assembly 100, the fourth limiting part and the fifth limiting part engage in a limiting cooperation. Under the limiting cooperation of the fourth limiting part and the fifth limiting part, the first output shaft 211 drives the mounting base 600 and the flip bracket 300 as a whole to rotate along the third direction around the second axis. When the flip bracket 300 rotates along the second direction around the first axis to a position where the second magnetron 500 is close to the target assembly 100, the fourth limiting part and the sixth limiting part engage in a limiting cooperation. Under the action of the limiting cooperation between the fourth and sixth limiting parts, the first output shaft 211 drives the mounting base 600 and the flip bracket 300 as a whole to rotate along the fourth direction around the second axis. Specifically, the fourth limiting part, the fifth limiting part, and the sixth limiting part can all be protrusions. Of course, the fourth limiting part can also be a protrusion, and the fifth limiting part and the sixth limiting part can be two opposing inner sidewalls of a groove formed on the first output shaft 211. The specific structure of the fourth limiting part, the fifth limiting part, and the sixth limiting part is not limited in the embodiments of this application.

[0064] As a transmission component, the transmission mechanism 220 can be implemented in many ways. For example, the transmission mechanism 220 may include a universal joint, and the first output shaft 211 can be connected to the flip bracket 300 through the universal joint, thereby realizing the change of transmission direction.

[0065] In another embodiment, the transmission mechanism 220 may include a first bevel gear 221 and a second bevel gear 222. Both the first bevel gear 221 and the second bevel gear 222 are rotatably mounted on the mounting base 600. For example, the first bevel gear 221 can be rotatably mounted on the mounting base 600 via a first bearing assembly 223, and the second bevel gear 222 can be rotatably mounted on the mounting base 600 via a second bearing assembly 224. Alternatively, the first bevel gear 221 and the second bevel gear 222 may be directly rotatably mounted on the mounting base 600. This application does not limit the arrangement of the first bevel gear 221 and the second bevel gear 222. The rotation axis of the first bevel gear 221 may coincide with the second axis, and the rotation axis of the second bevel gear 222 may coincide with the first axis. The first bevel gear 221 can mesh with the second bevel gear 222. The first output shaft 211 can be connected to the first bevel gear 221, and the flipping bracket 300 is connected to the second bevel gear 222.

[0066] It should be noted that the connection between the first output shaft 211 and the first bevel gear 221 means that the first output shaft 211 and the first bevel gear 221 are connected at the position of their rotation axes. The first output shaft 211 can drive the first bevel gear 221 to rotate around the second axis. The connection between the flip bracket 300 and the second bevel gear 222 means that the flip bracket 300 and the second bevel gear 222 are connected at the position of their rotation axes. The second bevel gear 222 can drive the flip bracket 300 to rotate around the first axis.

[0067] The magnetron device disclosed in this application sets the transmission mechanism 220 to include a first bevel gear 221 and a second bevel gear 222, so that the power transmission direction can be changed by the meshing of the first bevel gear 221 and the second bevel gear 222. This makes the structure of the transmission mechanism 220 relatively simple and the transmission relatively more stable.

[0068] To avoid interference between the flip bracket 300 and the mounting base 600 when the flip bracket 300 rotates around the first axis, the flip bracket 300 may optionally be connected to the second bevel gear 222 via the connecting shaft 910, and the flip bracket 300 may extend beyond the mounting base 600 in the extension direction of the first axis, thereby avoiding interference between the flip bracket 300 and the mounting base 600 when the flip bracket 300 rotates around the first axis.

[0069] Target assemblies 100 with different radial lengths and materials require different rotation radii for the magnetron along the target assembly 100. To meet these different requirements, the magnetron device may optionally include a position adjustment mechanism, which can be located on the flipping bracket 300. The first magnetron 400 and the second magnetron 500 may be respectively connected to the position adjustment mechanism. Specifically, the position adjustment mechanism corresponding to the first magnetron 400 can be used to adjust the position of the first magnetron 400 radially in the target assembly 100, and the position adjustment mechanism corresponding to the second magnetron 500 can be used to adjust the position of the second magnetron 500 radially in the target assembly 100.

[0070] The magnetron device disclosed in this application embodiment has a position adjustment mechanism that allows the first magnetron 400 and the second magnetron 500 to be adjusted radially in the target assembly 100. This allows the first magnetron 400 and the second magnetron 500 to adapt to targets with different radial lengths and materials along the rotation radius of the target assembly 100.

[0071] Specifically, the position adjustment mechanism may include a linear drive motor. The first magnetron 400 and the second magnetron 500 may be connected to a corresponding linear drive motor. The first magnetron 400 and the second magnetron 500 may be moved by extending or retracting the telescopic shaft of the linear drive motor.

[0072] To ensure relatively stable movement of the first magnetron 400 or the second magnetron 500 when the position adjustment mechanism adjusts their positions, the position adjustment mechanism may optionally include a first lead screw 710, a first nut 720, and an adapter 730. The first lead screw 710 is rotatably mounted on the flip bracket 300. The first nut 720 is sleeved on the first lead screw 710 and threadedly engaged with it. The adapter 730 is connected to the first nut 720 and can limit the rotation direction of the first lead screw 710 within the flip bracket 300. When the first lead screw 710 rotates, the first nut 720 does not rotate with the first lead screw 710 due to the limiting effect of the adapter 730. The first nut 720 drives the adapter 730 to move along the extension direction of the first lead screw 710. The first magnetron 400 and the second magnetron 500 can be mounted on the corresponding adapter 730. The first nut 720 and the adapter 730 can drive the corresponding first magnetron 400 or second magnetron 500 to move radially along the target assembly 100 under the rotation of the first lead screw 710.

[0073] The magnetron device disclosed in this application configures the position adjustment mechanism as including a first lead screw 710, a first nut 720, and an adapter 730. This allows the first nut 720 and the adapter 730 to drive the corresponding first magnetron 400 or second magnetron 500 to move radially along the target assembly 100 under the rotation of the first lead screw 710. Since the first lead screw 710 and the first nut 720 are infinitely variable in transmission, the first nut 720 drives the first magnetron 400 or second magnetron 500 to move more stably and with higher position adjustment accuracy when it does so through the adapter 730.

[0074] To further improve the stability of the adapter frame 730 in moving the first magnetron 400 or the second magnetron 500, the adapter frame 730 may optionally have a clearance hole, in which a guide sleeve 740 may be installed. The first lead screw 710 corresponding to the first magnetron 400 and the first lead screw 710 corresponding to the second magnetron 500 are parallel and opposite to each other. The first lead screw 710 corresponding to the first magnetron 400 passes through the guide sleeve 740 on the adapter frame 730 corresponding to the second magnetron 500, and the first lead screw 710 corresponding to the second magnetron 500 passes through the guide sleeve 740 on the adapter frame 730 corresponding to the first magnetron 400. This allows the adapter frame 730 to move more stably under the guidance of the guide sleeve 740, thereby improving the stability of the adapter frame 730 in moving the first magnetron 400 or the second magnetron 500.

[0075] Specifically, the position adjustment mechanism may further include a manual crank 750, which can be connected to the first lead screw 710. The operator can operate the manual crank 750 to drive the first lead screw 710 to rotate, thereby enabling manual adjustment of the position of the first magnetron 400 or the second magnetron 500.

[0076] Of course, the first lead screw 710 can also be driven to rotate by a drive motor, thereby realizing intelligent adjustment of the position of the first magnetron 400 or the second magnetron 500.

[0077] To accurately determine whether the flipping bracket 300 has flipped into position during the flipping process, the magnetron device may optionally include a first photoelectric sensor 810, a second photoelectric sensor 820, a first reflector 830, and a second reflector 840. The first photoelectric sensor 810 and the second photoelectric sensor 820 can be mounted on other components of the magnetron device, and the first reflector 830 and the second reflector 840 can both be mounted on the position adjustment mechanism, for example... Figure 3As shown, the first reflector 830 can be disposed on the adapter 730 corresponding to the second magnetron 500, and the first reflector 830 and the second magnetron 500 can be located on the same side of the corresponding adapter 730. The second reflector 840 can be disposed on the adapter 730 corresponding to the first magnetron 400, and the second reflector 840 and the first magnetron 400 can be located on the same side of the corresponding adapter 730. Of course, in another embodiment, the first reflector 830 can also be disposed on the adapter 730 corresponding to the first magnetron 400, and the first reflector 830 and the first magnetron 400 can be located on opposite sides of the corresponding adapter 730. The second reflector 840 can be disposed on the adapter 730 corresponding to the second magnetron 500, and the second reflector 840 and the second magnetron 500 can be located on opposite sides of the corresponding adapter 730. In this case, the positions of the first photoelectric sensor 810 and the second photoelectric sensor 820 also need to be adjusted accordingly. Of course, the arrangement of the first photoelectric sensor 810, the second photoelectric sensor 820, the first reflector 830, and the second reflector 840 can also be in other ways, and this application embodiment does not limit this.

[0078] When the flip bracket 300 drives the first magnetron 400 to rotate to a position close to the target assembly 100, the first reflector 830 can be opposite to the first photoelectric sensor 810. The light emitted by the first photoelectric sensor 810 can be reflected by the first reflector 830 and then received by the first photoelectric sensor 810 again. Thus, it can be determined that the flip bracket 300 drives the first magnetron 400 to rotate to a position close to the target assembly 100. If the first photoelectric sensor 810 does not receive the light emitted by the first photoelectric sensor 810 after being reflected by the first reflector 830, it indicates that the flip bracket 300 has not driven the first magnetron 400 to rotate to a position close to the target assembly 100.

[0079] When the flip bracket 300 drives the second magnetron 500 to rotate to a position close to the target assembly 100, the second reflector 840 can be opposite to the second photoelectric sensor 820. The light emitted by the second photoelectric sensor 820 can be reflected by the second reflector 840 and then re-received by the second photoelectric sensor 820. This can determine that the flip bracket 300 has driven the second magnetron 500 to rotate to a position close to the target assembly 100. If the second photoelectric sensor 820 does not receive the light emitted by the second photoelectric sensor 820 after being reflected by the second reflector 840, it indicates that the flip bracket 300 has not driven the second magnetron 500 to rotate to a position close to the target assembly 100.

[0080] It should be noted that when the first output shaft 211 drives the mounting base 600 and the flip bracket 300 to rotate as a whole around the second axis in a third or fourth direction, when the first output shaft 211 stops rotating, it always maintains the position where the first reflector 830 is opposite to the first photoelectric sensor 810 or the position where the second reflector 840 is opposite to the second photoelectric sensor 820. This can be achieved by specifically involving the drive stroke of the first drive body 210 or the second drive mechanism.

[0081] The magnetron device disclosed in this application embodiment, by setting a first photoelectric sensor 810, a second photoelectric sensor 820, a first reflector 830 and a second reflector 840, enables the flipping bracket 300 to accurately determine whether the first photoelectric sensor 810 receives the light emitted by the first photoelectric sensor 810 and reflected by the first reflector 830, or whether the second photoelectric sensor 820 receives the light emitted by the second photoelectric sensor 820 and reflected by the second reflector 840, when rotating around the first axis.

[0082] In specific applications, the first photoelectric sensor 810, the second photoelectric sensor 820, the first reflector 830, and the second reflector 840 can also be used to determine whether the flip bracket 300 rotates around the second axis. When the first output shaft 211 drives the flip bracket 300 to rotate around the second axis, if the first photoelectric sensor 810 can periodically receive the light emitted by the first photoelectric sensor 810 and reflected by the first reflector 830, or periodically receive the light emitted by the second photoelectric sensor 820 and reflected by the second reflector 840, it can be concluded that the first output shaft 211 is driving the flip bracket 300 to rotate around the second axis.

[0083] Of course, the first reflector 830 can be replaced by the first light signal transmitter, and the second reflector 840 can be replaced by the second light signal transmitter. In this case, the first photoelectric sensor 810 and the second photoelectric sensor 820 do not need to emit light; only the first light signal transmitter and the second light signal transmitter need to emit light.

[0084] Optionally, the magnetron device may further include a counterweight 930, a third photoelectric sensor 850, and a third reflector 860. The counterweight 930 may be disposed on the mounting base 600 and located on opposite sides of the second axis from the flipping bracket 300. The counterweight 930 serves as a counterweight to prevent the flipping bracket 300 from deviating significantly from the center of rotation when rotating around the second axis, thus avoiding poor stability of the flipping bracket 300. The third reflector 860 may be disposed on the counterweight 930, and the third photoelectric sensor 850 may be disposed on other components of the magnetron device. When the flipping bracket 300 rotates one revolution around the second axis, the third photoelectric sensor 850 receives light emitted by the third photoelectric sensor 850 and reflected by the third reflector 860.

[0085] It should be noted that the position of the third photoelectric sensor 850 is fixed. When the flip bracket 300 rotates around the second axis, the flip bracket 300 drives the third reflector 860 to rotate around the second axis together through the counterweight 930. When the flip bracket 300 rotates around the second axis for one revolution, the third photoelectric sensor 850 can receive the light emitted by the third photoelectric sensor 850 and reflected by the third reflector 860 once. When the flip bracket 300 rotates continuously around the second axis, the third photoelectric sensor 850 can intermittently receive the light emitted by the third photoelectric sensor 850 and reflected by the third reflector 860. If the third photoelectric sensor 850 can intermittently receive the light emitted by the third photoelectric sensor 850 and reflected by the third reflector 860, it indicates that the flip bracket 300 drives the third reflector 860 to rotate around the second axis through the counterweight 930. This confirms that the first output shaft 211 is driving the mounting base 600 and the flip bracket 300 as a whole to rotate around the second axis, indicating that the rotation of the mounting base 600 and the flip bracket 300 as a whole around the second axis driven by the first output shaft 211 is in a normal state.

[0086] Specifically, when the flip bracket 300 is not rotating around the second axis, the third photoelectric sensor 850 can be opposite to the third reflector 860, which helps to determine whether the working status of the third photoelectric sensor 850 and the third reflector 860 is normal before the flip bracket 300 starts to rotate around the second axis.

[0087] To avoid interference between the flipping bracket 300 and other components when it flips the first magnetron 400 and the second magnetron 500, the magnetron device may optionally include a lifting mechanism. This lifting mechanism can be connected to the first drive body 210 and can be used to drive the first drive body 210 to move the flipping bracket 300 closer to or further away from the target assembly 100. Thus, when the flipping bracket 300 flips the first magnetron 400 and the second magnetron 500, the distance between the flipping bracket 300 and the target assembly 100 can be adjusted by the lifting mechanism to prevent interference between the flipping bracket 300 and other components during flipping.

[0088] Specifically, the lifting mechanism may include a lifting guide rail 940, a lifting slider 950, a second lead screw 960, and a second nut 970. The lifting slider 950 is slidably disposed on the lifting guide rail 940. The first drive body 210 may be connected to the lifting slider 950. For example, the first output shaft 211 of the first drive body 210 may be rotatably disposed on the lifting slider 950 around a second axis. The second nut 970 may be sleeved on the second lead screw 960 and threadedly engaged with it. The lifting slider 950 may be connected to the second nut 970. When the second lead screw 960 rotates, the first drive body 210 may move along the extension direction of the second lead screw 960 with the second nut 970 and the lifting slider 950, thereby causing the first output shaft 211 to drive the flipping bracket 300 to approach or move away from the target assembly 100. Specifically, the second lead screw 960 may be connected to a pulley 980, which may drive the second lead screw 960 to rotate.

[0089] Optionally, in a plane perpendicular to the first axis, the first magnetron 400 and the second magnetron 500 can be located on opposite sides of the flipping bracket 300. By placing the first magnetron 400 and the second magnetron 500 on opposite sides of the flipping bracket 300, the distance between the second magnetron 500 and the target assembly 100 can be maximized when the first magnetron 400 is close to the target assembly 100, and vice versa. This reduces interference between the magnetic fields of the first magnetron 400 and the second magnetron 500.

[0090] Optionally, the first axis can be parallel to the plane where the target assembly 100 is located. By setting the first axis to be parallel to the plane where the target assembly 100 is located, the distances of the first magnetron 400 and the second magnetron 500 from the target assembly 100 are equal when the flipping bracket 300 is in a position close to the target assembly 100, thereby facilitating the adjustment of the distances of the first magnetron 400 and the second magnetron 500 from the target assembly 100.

[0091] This application also discloses a magnetron sputtering apparatus, which includes a reaction chamber and a magnetron device disclosed in the above embodiments. The top of the reaction chamber is provided with a mounting position for a target assembly 100, which can be installed in the mounting position. The magnetron device is located on the upper side of the reaction chamber, that is, on the side where the top of the reaction chamber is located.

[0092] The magnetron sputtering equipment disclosed in this application simplifies the structure of the magnetron sputtering equipment by setting the magnetron device disclosed in the above embodiments. Since the switching of the positions of the first magnetron 400 and the second magnetron 500 can be achieved simply by rotating the rotating bracket 300 around the first axis, the structure of the magnetron sputtering equipment is simplified.

[0093] Optionally, the magnetron sputtering equipment may also include a housing 920, which may be located outside the reaction chamber and may form an accommodating space with the target assembly 100. The transmission mechanism 220, the flipping bracket 300, the first magnetron 400 and the second magnetron 500 may all be located within the accommodating space, thereby protecting the transmission mechanism 220, the flipping bracket 300, the first magnetron 400 and the second magnetron 500. Moreover, coolant, lubricant, etc. may be injected into the accommodating space, thereby cooling and lubricating the transmission mechanism 220, the first magnetron 400 and the second magnetron 500 and other components.

[0094] Specifically, when the magnetron device includes components such as a first drive body 210, a transmission mechanism 220, a lifting mechanism, a first photoelectric sensor 810, a second photoelectric sensor 820, and a third photoelectric sensor 850, the first output shaft 211 of the first drive body 210 can pass through the top wall 921 of the housing 920 and connect to the transmission mechanism 220, wherein the top wall 921 of the housing can be opposite to the target assembly 100. The lifting guide rail 940 of the lifting mechanism can be fixedly installed on the top wall 921 of the housing. The first photoelectric sensor 810, the second photoelectric sensor 820, and the third photoelectric sensor 850 can all be installed on the top wall 921 of the housing.

[0095] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0096] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A magnetron device for use with a target assembly (100) of a magnetron sputtering apparatus, characterized in that, The magnetron device includes a first drive mechanism (200), a flipping bracket (300), a first magnetron (400), and a second magnetron (500), wherein: The first magnetron (400) and the second magnetron (500) are disposed radially at intervals on the flipping bracket (300) along the target assembly (100); The first drive mechanism (200) is connected to the flipping bracket (300) and is used to drive the flipping bracket (300) to rotate around the first axis, so as to drive one of the first magnetron (400) and the second magnetron (500) to rotate to a position close to the target assembly (100) and the other to rotate to a position away from the target assembly (100).

2. The magnetron device according to claim 1, characterized in that, The magnetron device further includes a mounting base (600), the first drive mechanism (200) includes a first drive body (210) and a transmission mechanism (220), the flipping bracket (300) is rotatably disposed on the mounting base (600) about the first axis, the first output shaft (211) of the first drive body (210) is connected to the flipping bracket (300) through the transmission mechanism (220), the first output shaft (211) is used to rotate about a second axis so as to drive the flipping bracket (300) to rotate about the first axis through the transmission mechanism (220), wherein the second axis intersects or is not in the same plane as the first axis, and the second axis is parallel or coincident with the central axis of the target assembly (100).

3. The magnetron device according to claim 2, characterized in that, The first output shaft (211) is rotatably connected to the mounting base (600), the mounting base (600) is provided with a first limiting part (610), and the flip bracket (300) is provided with a second limiting part (310) and a third limiting part; When the flip bracket (300) rotates along the first direction around the first axis to a position where the first magnetron (400) is close to the target assembly (100), the first limiting part (610) and the second limiting part (310) engage in a limiting cooperation. Under the action of the limiting cooperation between the first limiting part (610) and the second limiting part (310), the first output shaft (211) drives the mounting base (600) and the flip bracket (300) to rotate as a whole along the third direction around the second axis. When the flipping bracket (300) rotates along the second direction around the first axis to a position where the second magnetron (500) is close to the target assembly (100), the first limiting part (610) and the third limiting part engage in a limiting cooperation. Under the action of the limiting cooperation between the first limiting part (610) and the third limiting part, the first output shaft (211) drives the mounting base (600) and the flipping bracket (300) as a whole to rotate along the fourth direction around the second axis. The first direction is opposite to the second direction, and the third direction is opposite to the fourth direction.

4. The magnetron device according to claim 3, characterized in that, The transmission mechanism (220) includes a first bevel gear (221) and a second bevel gear (222). The first bevel gear (221) and the second bevel gear (222) are rotatably mounted on the mounting base (600). The rotation axis of the first bevel gear (221) coincides with the second axis, and the rotation axis of the second bevel gear (222) coincides with the first axis. The first bevel gear (221) meshes with the second bevel gear (222). The first output shaft (211) is connected to the first bevel gear (221), and the flipping bracket (300) is connected to the second bevel gear (222).

5. The magnetron device according to claim 4, characterized in that, The flip bracket (300) is connected to the second bevel gear (222) via a connecting shaft (910), and the flip bracket (300) extends beyond the mounting base (600) in the extending direction of the first axis.

6. The magnetron device according to claim 1, characterized in that, The magnetron device further includes a position adjustment mechanism, which is disposed on the flipping bracket (300). The first magnetron (400) and the second magnetron (500) are respectively connected to the position adjustment mechanism. The position adjustment mechanism corresponding to the first magnetron (400) is used to adjust the position of the first magnetron (400) in the radial direction of the target assembly (100), and the position adjustment mechanism corresponding to the second magnetron (500) is used to adjust the position of the second magnetron (500) in the radial direction of the target assembly (100).

7. The magnetron device according to claim 6, characterized in that, The position adjustment mechanism includes a first lead screw (710), a first nut (720), and an adapter (730). The first lead screw (710) is rotatably mounted on the flip bracket (300). The first nut (720) is sleeved on the first lead screw (710) and threadedly engaged with it. The adapter (730) is connected to the first nut (720). The first magnetron (400) and the second magnetron (500) are mounted on the corresponding adapter (730). Under the rotation of the first lead screw (710), the first nut (720) and the adapter (730) drive the corresponding first magnetron (400) or second magnetron (500) to move radially along the target assembly (100).

8. The magnetron device according to claim 7, characterized in that, The adapter frame (730) has a clearance hole, and a guide sleeve (740) is installed in the clearance hole. The first lead screw (710) corresponding to the first magnetron (400) and the first lead screw (710) corresponding to the second magnetron (500) are parallel and opposite to each other. The first lead screw (710) corresponding to the first magnetron (400) passes through the guide sleeve (740) on the adapter frame (730) corresponding to the second magnetron (500), and the first lead screw (710) corresponding to the second magnetron (500) passes through the guide sleeve (740) on the adapter frame (730) corresponding to the first magnetron (400).

9. The magnetron device according to claim 7, characterized in that, The position adjustment mechanism also includes a manual crank (750), which is connected to the first lead screw (710) and is used to drive the first lead screw (710) to rotate.

10. The magnetron device according to claim 6, characterized in that, The magnetron device further includes a first photoelectric sensor (810), a second photoelectric sensor (820), a first reflector (830), and a second reflector (840), wherein the first reflector (830) and the second reflector (840) are both disposed in the position adjustment mechanism; When the flip bracket (300) drives the first magnetron (400) to rotate to a position close to the target assembly (100), the first reflector (830) is opposite to the first photoelectric sensor (810); When the flipping bracket (300) drives the second magnetron (500) to rotate to a position close to the target assembly (100), the second reflector (840) is opposite to the second photoelectric sensor (820).

11. The magnetron device according to claim 3, characterized in that, The magnetron device further includes a counterweight (930), a third photoelectric sensor (850), and a third reflector (860). The counterweight (930) is located on the mounting base (600) and is located on opposite sides of the second axis from the flipping bracket (300). The third reflector (860) is located on the counterweight (930). When the flip bracket (300) rotates one revolution around the second axis, the third photoelectric sensor (850) receives light emitted by the third photoelectric sensor (850) after being reflected by the third reflector (860).

12. The magnetron device according to claim 2, characterized in that, The magnetron device further includes a lifting mechanism connected to the first drive body (210). The lifting mechanism is used to drive the first drive body (210) to lift and move the flipping bracket (300) closer to or away from the target assembly (100).

13. The magnetron device according to claim 1, characterized in that, In a plane perpendicular to the first axis, the first magnetron (400) and the second magnetron (500) are located on opposite sides of the flipping bracket (300), and / or the first axis is parallel to the extension plane of the target assembly (100).

14. A magnetron sputtering apparatus, characterized in that, The device includes a reaction chamber and a magnetron device according to any one of claims 1 to 13, wherein the top of the reaction chamber is provided with a mounting position for the target assembly (100), and the magnetron device is located on the upper side of the reaction chamber.

Images