Magnetron sputtering device

Abstract

The invention relates to the technical field of sputter coating processes, in particular to a magnetron sputtering device which comprises an installation shell, the installation shell is provided with a back plate used for arranging magnetron sputtering target materials, a base rotating around a center shaft is arranged in the installation shell, and a magnet is arranged on the base. The magnetic field of the magnet acts on the magnetron sputtering target material in the process that the magnet rotates along with the base, the magnet is assembled on the base in a reciprocating sliding mode in the direction parallel to the back plate, a sliding driving mechanism is arranged on the base, and the sliding driving mechanism drives the magnet to slide in a reciprocating mode in the process that the magnet rotates along with the base; according to the magnetron sputtering device, the magnets slide back and forth in the rotation process, so that the area, acting on the target material, of the magnetic field of the single magnet is relatively wide, grooves generated in the target material are relatively shallow, the influence of the shallow grooves in the target material on the sputtering rate is relatively small, sputtering sources on the surface of the target material are relatively uniform, and the sputtering efficiency is improved. And thus, the film thickness uniformity of the deposited film can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sputtering coating process, and particularly relates to a magnetron sputtering device. BACKGROUND

[0002] In the semiconductor manufacturing process, a magnetron sputtering device is generally used to deposit corresponding thin films. When the magnetron sputtering device is working, high-energy argon ions are used to bombard the surface of the target material to knock out target atoms on the target material, and the target atoms are deposited on the substrate to form a thin film. By arranging a magnet behind the target material, the magnet generates closed magnetic lines of force, so that the electrons make spiral motion along the magnetic lines of force, increasing the probability of electron and argon gas collision, and thus improving the efficiency of thin film formation.

[0003] In the conventional magnetron sputtering device, the magnet is fixed, and the magnetic field of the magnet is relatively fixed with the target material. The plasma is limited in a narrow area with a length of about 5-10 cm on the surface of the target material, which causes the sputtering of target atoms to be concentrated in the narrow area, and thus the utilization rate of the target material is less than 30%. At the same time, the uniformity of the film thickness of the target atoms on the substrate has a large periodic fluctuation, which affects the film formation quality of the target atoms on the substrate surface.

[0004] In view of the problems of low utilization rate of the target material and poor film formation quality caused by the fixed magnet of the existing magnetron sputtering device, the industry usually adopts a rotating magnet method to improve the film formation quality, that is, rotating the permanent magnet around a fixed axis to make the permanent magnet move in a circle. This method can form a ring-shaped etching groove on the surface of the target material, which can improve the utilization rate of the target material. For example, the patent with the authorization announcement number CN220796648U discloses a magnetron assembly, the rotating shaft of which extends in the vertical direction, and the rotating shaft is driven to rotate by a driver. The rotating shaft is fixedly assembled with a horizontally arranged cantilever, and the other end of the cantilever is provided with the magnetron assembly. The rotating shaft drives the cantilever to rotate with the magnetron assembly. The magnetron assembly scans the entire surface of the target material facing the base during the rotation process, thereby realizing magnetron sputtering. Similar devices are disclosed in the patent with the authorization announcement number CN215856307U, which discloses a magnetic field adjuster.

[0005] However, the above-mentioned device still has some defects in use: the rotating path of the permanent magnet of the above-mentioned device is relatively fixed during rotating movement, and during long-time use, a ring-shaped etching groove will gradually be formed on the surface of the target material, and the depth of the etching groove will continue to deepen. As the groove deepens, the distance from the surface of the target material to the magnet increases, and the strength of the magnetic field at the bottom of the groove gradually weakens, resulting in a gradual decrease in the plasma density and sputtering rate in this area. The non-uniformity of the groove shape caused by the non-uniformity of the magnetic field strength will cause the target material atoms sputtered from the surface of the target material to be distributed unevenly on the substrate, thereby affecting the film thickness uniformity of the film deposited on the substrate. As the depth of the etching groove continues to deepen, the film uniformity will periodically fluctuate, and even if different types of permanent magnet layouts are matched to improve the utilization rate of the target material, this problem cannot be optimized. SUMMARY

[0006] The present application provides a magnetron sputtering device to optimize the technical problem of periodic deepening of the etching groove depth caused by the fixed rotating path of the permanent magnet in the prior art, which results in periodic fluctuation of the uniformity of the sputtered film.

[0007] To solve the above-mentioned problems, the magnetron sputtering device provided by the present application adopts the following technical scheme: a magnetron sputtering device, comprising a mounting shell having a back plate for arranging a magnetron sputtering target material, a base provided in the mounting shell and rotating around a central axis perpendicular to the back plate, a magnet provided on the base, the magnetic field of the magnet acting on the magnetron sputtering target material during rotation of the magnet with the base, the magnet being reciprocally slidably assembled on the base along a direction parallel to the back plate, and a sliding drive mechanism provided on the base and driving the magnet to reciprocally slide during rotation of the magnet with the base.

[0008] In the magnetron sputtering device provided by the present application, the magnet in the mounting shell can not only rotate, but also reciprocally slide during rotation, which effectively expands the distribution area of the magnetic field of the magnet on the surface of the target material. When the magnet only rotates without moving, the magnetic field of the magnet acting on the target material is relatively narrow, and the relatively deep target material groove formed by the narrow magnetic field significantly reduces the sputtering rate, and the sputtering source on the surface of the target material is unevenly distributed. In the magnetron sputtering device provided by the present application, the magnet reciprocally slides during rotation, and the area of a single magnet acting on the target material is relatively wide, the target material groove is relatively shallow and uniform, and the uniform and shallow target material groove has less effect on the sputtering rate, thereby making the sputtering source on the surface of the target material relatively uniform, and thereby improving the film thickness uniformity of the deposited film.

[0009] As a further optimization improvement of the base, a magnet center area is arranged on the base beside the central axis, a plurality of magnets are uniformly distributed around the magnet center area, and the reciprocating sliding direction of the magnets on the base extends radially along the magnet center area.

[0010] The beneficial effect is that the magnets are uniformly distributed around the magnet center area and can be adjusted by radial sliding, which can make the magnetic field more uniform and symmetrical on the target surface, effectively controlling the overall ring-shaped coverage area.

[0011] Further, the sliding drive mechanism includes a cylinder corresponding to each magnet, and each cylinder drives the corresponding magnet to reciprocatingly slide.

[0012] The beneficial effect is that by using a cylinder corresponding to each magnet as the sliding drive mechanism, the action is sensitive, clean, simple and reliable, with low failure rate, easy to control the reciprocating sliding speed and stroke of the magnet, and can accurately adjust the position of the magnet, thereby accurately controlling the magnetic field distribution.

[0013] Further, a sliding seat corresponding to each magnet is arranged on the base, and the magnet is fixedly installed on the sliding seat.

[0014] The beneficial effect is that by arranging a sliding seat corresponding to each magnet on the base, the magnet can be easily installed and removed on the base, and the magnet can also be stably supported to ensure the stability and accuracy of the magnet during reciprocating sliding, reduce the influence of vibration and other factors on the moving accuracy of the magnet, improve the reliability of the device, and also facilitate the connection of the cylinder to drive the magnet to slide.

[0015] Further, each cylinder is located on the side of the corresponding magnet facing the magnet center area.

[0016] The beneficial effect is that the cylinder is arranged on the side of the magnet facing the magnet center area, which can save space and make the overall structure of the magnetron sputtering device more compact.

[0017] Further, the magnet center area is provided with a gas distribution disc, and the gas distribution disc is provided with a main gas port for connecting the main gas path and a distribution gas port for corresponding communication with each cylinder.

[0018] The beneficial effect is that by arranging the gas distribution disc, the gas source gas can be centrally distributed and controlled, the gas path connection is simplified, the cylinders can be uniformly adjusted and controlled, which is conducive to improving the overall stability and reliability of the gas path system, and ensuring the synchronous and stable work of each cylinder.

[0019] Further, the base is provided with a sliding rail extending radially along the magnet center area corresponding to each magnet, and each sliding rail is slidably assembled with the magnet to reciprocatingly slide on the base.

[0020] The beneficial effect is that the sliding rails radially extending along the center of the magnets are arranged below the magnets, so that the magnets can reciprocate under the guidance of the sliding rails, improving the stability and precision of the magnet sliding, and prolonging the service life of the device.

[0021] Further, the mounting shell is fixed with a center support seat, an outer rotating sleeve is rotatably sleeved outside the center support seat, the outer rotating sleeve is driven to rotate by a driver, a through hole is arranged in the center support seat, a center rotating shaft is rotatably arranged in the through hole, the center rotating shaft is driven to rotate by the outer rotating sleeve, the mounting end of the center rotating shaft extends into the mounting shell, and the base is fixedly arranged on the mounting end of the center rotating shaft, so as to drive the base to rotate by the center rotating shaft.

[0022] The beneficial effect is that the stable rotation of the base can be realized by arranging the outer rotating sleeve, the driver and the center rotating shaft, the rotation speed of the base can be accurately controlled by multi-stage transmission, the operation stability and precision of the magnet are improved, and the external rotating sleeve is convenient for operators to maintain and overhaul the device.

[0023] Further, the center rotating shaft is provided with a ventilation gas path for supplying gas to the gas cylinder to control the extension and contraction action of the gas cylinder.

[0024] The beneficial effect is that the ventilation gas path is arranged in the center rotating shaft, which can reduce the complexity of the sputtering device, avoid the complex winding of the external gas path, and ensure the stability and reliability of the gas path during the rotation of the base.

[0025] Further, the end of the outer rotating sleeve away from the mounting shell is assembled with a pneumatic slip ring through an adapter sleeve.

[0026] The beneficial effect is that the pneumatic slip ring can realize the continuous transmission of gas in the ventilation gas path during the rotation of the outer rotating sleeve, solve the gas path connection problem between the rotating part and the stationary part, ensure the normal work of the gas path system during the operation of the sputtering device, and further improve the reliability and stability of the sputtering device.

[0027] The magnetically controlled sputtering device provided by the application has the beneficial effect that the magnet in the installation shell can not only rotate but also reciprocatingly slide during the rotation, so that the distribution area of the magnetic field of the magnet on the surface of the target material can be effectively expanded. When the magnet only rotates without moving, the magnetic field of the magnet acting on the target material is relatively narrow, the sputtering rate is obviously reduced due to the too deep target material groove formed by the narrow magnetic field, and the sputtering source on the surface of the target material is unevenly distributed. In the magnetically controlled sputtering device provided by the application, the magnet reciprocatingly slides during the rotation, the area of a single magnet acting on the target material is relatively wide, the target material groove is relatively shallow and uniform, the uniform and shallow target material groove has a relatively small influence on the sputtering rate, so that the sputtering source on the surface of the target material is relatively uniformly distributed, and the film thickness uniformity of the deposited film can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 2 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 1 A semi-sectional view of the magnetically controlled sputtering device shown in the figure; Figure 3 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 2 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 4 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 2 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 5 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 4 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 6 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 7 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 6 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 8 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 9 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application; Figure 8 A structure schematic view of an embodiment of the magnetically controlled sputtering device provided by the application.

[0029] Explanation of reference signs: 1. Pneumatic slip ring; 2. Adapter sleeve; 3. Outer rotating sleeve; 4. Magnetron sputtering target; 5. Mounting shell; 51. Back plate; 6. Drive belt; 7. Rotary motor; 8. Magnet; 9. Base; 10. Gas distribution plate; 101. Main air inlet; 102. Sub-air inlet; 11. Cylinder; 12. Sliding rail; 13. External air inlet; 14. Upper air nozzle; 15. Middle air nozzle; 16. Central rotating shaft; 17. Air passage; 18. Lower air nozzle; 19. Central support seat; 20. Thrust bearing; 21. Magnetic field lines; 22. Sputtered particle distribution area; 23. Groove; 24. First position; 25. Second position. Detailed Implementation

[0030] The main concept of this invention lies in moving the magnet 8 back and forth in other directions, based on the existing magnetron sputtering apparatus where the magnet 8 rotates around the center of rotation. This effectively expands the distribution area of ​​the magnetic field of the magnet 8 on the surface of the magnetron sputtering target, thereby avoiding the formation of narrow and deep grooves 23 on the surface of the magnetron sputtering target 4 during long-term operation. This prevents the uniformity of the target atoms' distribution on the substrate surface during sputtering, thus improving the film quality of the target atoms on the substrate. Furthermore, controlling multiple magnets 8 to move back and forth simultaneously in an orderly and coordinated manner, so that the magnetic field covers the magnetron sputtering target 4, can further improve the film uniformity and the utilization rate of the magnetron sputtering target 4.

[0031] The principles and spirit of the present invention will be explained in detail below with reference to several representative embodiments.

[0032] Embodiment 1 of the magnetron sputtering apparatus provided by the present invention: like Figures 1 to 5 As shown, the magnetron sputtering device provided in this embodiment includes a mounting shell 5, in which a magnet 8 and other components are installed. A rotary sliding drive mechanism for driving the magnet 8 to rotate is installed on the mounting shell 5.

[0033] Specifically, the mounting shell 5 is a cylindrical insulating shell structure. The mounting shell 5 has mounting sides and supporting sides arranged opposite to each other. The mounting sides of the mounting shell 5 are used to fix and mount the magnetron sputtering target 4. An outer rotating sleeve 3 and a rotary motor 7 are mounted on the supporting side. The rotary motor 7 is fixedly mounted on the supporting side of the mounting shell 5, and the outer rotating sleeve 3 is rotatably mounted on the mounting shell 5. The rotary motor 7 drives the outer rotating sleeve 3 to rotate via a transmission belt 6. In this embodiment, the mounting shell 5 includes an integrally formed circular basin. A back plate 51 is bolted to the opening of the circular basin. The corresponding outer surface of the back plate 51 forms the mounting side of the mounting shell 5, and the corresponding outer surface of the circular basin forms the supporting side of the mounting shell 5. Here, both the circular basin and the back plate 51 are made of insulating material to avoid affecting the magnetic field of the magnet 8 inside the mounting shell 5.

[0034] A center support base 19 is fixedly assembled on the installation side of the installation shell 5 by screws, and a through hole is arranged in the center of the center support base 19, and a center rotating shaft 16 is rotatably assembled in the through hole, and the center rotating shaft 16 is arranged perpendicularly to the back plate 51 of the installation shell 5. Thrust bearings 20 are arranged at the upper and lower ends of the through hole of the center support base 19, and the center rotating shaft 16 is rotatably assembled in the thrust bearings 20. One end of the center rotating shaft 16 is an installation end, which extends into the installation shell 5, and the base 9 is fixedly assembled on the installation end of the center rotating shaft 16 by bolts, and the magnet 8 is arranged on the base 9. The other end of the center rotating shaft 16 is fixedly connected with the outer rotating sleeve 3 to rotate synchronously with the outer rotating sleeve 3. When the magnetron sputtering device is used, the base 9 is driven to rotate by the center rotating shaft 16, and the base 9 rotates together with the magnet 8.

[0035] The outer rotating sleeve 3 is rotatably assembled outside the center support base 19, and a bearing is assembled between the outer rotating sleeve 3 and the center support base 19 to realize the rotatable assembly therebetween. The bottom of the center support base 19 is provided with an outer flange, and a plurality of screw mounting holes are arranged on the outer flange in the circumferential direction, and when assembled, the fastening screws are passed and assembled into the screw mounting holes to fix the center support base 19 on the installation shell 5. In fact, a transmission tooth is arranged on the outer circumferential surface of the outer rotating sleeve 3, and the output end of the driver fixed on the installation shell 5 drives the outer rotating sleeve 3 to rotate through the transmission belt 6, and the power source of the driver is a rotating motor 7, and the rotating motor 7 is transmissionally connected with a speed change structure, and the output end of the speed change structure is taken as the output end of the driver to drive the outer rotating sleeve 3 to rotate through the transmission belt 6.

[0036] In the embodiment, as shown in Figure 4 and Figure 5As shown, the base 9 is eccentrically fixedly installed on the central rotating shaft 16, and a magnet center area is arranged on the base 9, which is located beside the central rotating shaft 16, and a plurality of magnets 8 are evenly arranged around the magnet center area on the base 9. The magnets 8 evenly arranged around the magnet center area can make the magnetic field more uniform and symmetrical on the target surface, so as to effectively control the overall annular coverage area. In this embodiment, the number of magnets 8 is 8, and in other embodiments, the number of magnets 8 can be any number, as long as the magnetic field of the magnet 8 can effectively cover the target. A sliding track 12 extending radially along the magnet center area is arranged on the base 9 corresponding to each magnet 8, and the extension direction of the sliding track 12 is arranged in parallel with the back plate 51 of the mounting shell 5, and a sliding seat is slidingly assembled on each sliding track 12, and each sliding seat is one-to-one assembled with a magnet 8. Moreover, a sliding drive mechanism is arranged on the base 9 corresponding to each sliding seat, and the sliding seat with the magnet 8 is driven by the sliding drive mechanism to reciprocally slide radially along the magnet center area. The sliding drive mechanism includes a gas cylinder 11 located on the side of the corresponding magnet 8 facing the magnet center area, and the extension end of the gas cylinder 11 extending out of the cylinder body is fixedly connected with the sliding seat, so that the sliding seat and the magnet 8 are reciprocally slid by the gas cylinder 11. In operation, the central rotating shaft 16 drives the base 9 to rotate, and the magnetic field of the magnet 8 acts on the corresponding magnetron sputtering target 4 during the rotation of the base 9, and the sliding seat and the magnet 8 are driven by the gas cylinder 11 to reciprocally slide during the rotation of the base 9, so as to effectively expand the coverage range of the magnetic field of the magnet 8. The use of the gas cylinder 11 as the sliding drive mechanism can accurately control the reciprocating sliding speed and stroke of each magnet 8, thereby accurately adjusting the moving position of the magnet 8, and cleaning is clean, simple and reliable, and has good stability. In addition, the sliding seat provides stable support for the magnet 8, and also facilitates the installation and disassembly of each magnet 8 on the base 9, thereby improving the convenience of use and maintenance.

[0037] In addition, the gas distribution disc 10 is arranged at the center region of the magnet, and the gas distribution disc 10 is provided with a main gas port 101 arranged in communication and a plurality of sub-gas ports 102 arranged in correspondence with each of the gas cylinders 11, the main gas port 101 is used for connecting the main gas path, and the sub-gas ports 102 are used for one-to-one communication with the corresponding gas cylinders 11 through the sub-gas path. By arranging the gas distribution disc 10, the centralized distribution and control of the gas source gas can be realized, the gas path connection is simplified, the unified adjustment and control of each gas cylinder 11 is facilitated, the overall stability and reliability of the gas path system are improved, and the synchronous and stable work of each gas cylinder 11 is ensured. It needs to be particularly pointed out that the gas distribution disc 10 is arranged on the outer rotating sleeve 3 in the axial direction of the central rotating shaft 16, and the adapter sleeve 2 is fixedly installed on the end of the outer rotating sleeve 3 away from the mounting shell 5, and the pneumatic slip ring 1 is fixedly installed on the adapter sleeve 2, and the pneumatic slip ring 1 is provided with an external gas port 13 and an internal gas port, the external gas port 13 is used for communicating with the gas source through the external gas path, and the internal gas port is used for communicating with the upper gas nozzle 14 on the adapter sleeve 2. The pneumatic slip ring 1 can realize the stable connection between the static external gas port 13 and the rotating upper gas nozzle 14, solve the gas path connection problem between the rotating part and the static part, realize the continuous transmission of the gas in the gas distribution disc 10, and ensure the normal work of the gas path system during the operation of the sputtering device. In addition, the arrangement of the internal gas distribution disc 10 of the central rotating shaft 16 can reduce the complexity of the magnetron sputtering device, avoid complex winding between the gas paths, and ensure the stability and reliability of the gas path during the rotation of the base 9.

[0038] Correspondingly, the two ends of the gas distribution disc 10 extend to the two ends of the central rotating shaft 16, the intermediate gas nozzle 15 is arranged at the end of the gas distribution disc 10 facing the adapter sleeve 2, and the lower gas nozzle 18 is arranged at the end of the gas distribution disc 10 extending into the mounting shell 5. The intermediate gas nozzle 15 communicates with the upper gas nozzle 14 through the corresponding pipeline, and the lower gas nozzle 18 communicates with the main gas port 101 of the gas distribution disc 10 through the corresponding pipeline. In use, the working gas in the gas source reaches the gas cylinder 11 through the external gas path, the pneumatic slip ring 1, the gas distribution disc 10, and the gas cylinder 11, controls the gas cylinder 11 to perform the extension and retraction action, and then controls the sliding seat and the magnet 8 to perform the extension and retraction sliding on the base 9.

[0039] It needs to be particularly pointed out that, as shown in Figure 6 and Figure 7 , the magnet 8 of the existing magnetron sputtering device is fixed on the base 9 and rotates synchronously with the base 9. Since the magnet 8 is fixed, the magnetic induction line 21 of the magnet 8 forms a circular track area. Due to the sputtering effect, the sputtering particle distribution area 22 constrained by the magnetic field is highly concentrated. The target material in this area is continuously and quickly removed. With the passage of time, the concentrated track area forms a V-shaped groove 23, as shown in Figure 7As shown, with the deepening of the groove 23, the strength of the magnetic field at the bottom of the groove 23 gradually decreases, resulting in a decrease in the plasma concentration and a gradual decrease in the sputtering rate in this area. In other words, with the gradual deepening of the groove 23, the sputtering rate gradually decreases, and the sputtering angle of the particles affected by the magnetic field is significantly narrowed. Moreover, since the magnet 8 is fixed on the base 9, the annular track area formed by the magnetic field of the magnet 8 is not uniformly distributed relative to the target material. The uneven distribution of the magnetic field leads to uneven distribution of the grooves 23 on the target material, which in turn leads to uneven distribution of the sputtering source on the surface of the target material, ultimately affecting the film thickness uniformity of the deposited film. That is, with the deepening of the grooves 23 in the target material, the sputtering rate decreases and the unevenness of the shape of the grooves 23, which leads to poorer film thickness uniformity.

[0040] For the fixed manner of the magnet 8 in the prior art, in the magnetron sputtering device provided by the present application, the magnet 8 is driven by the air cylinder 11 to reciprocate between the first position 24 and the second position 25, and the magnetic field of the magnet 8 covers a wider area during the rotation of the magnet 8, as shown in Figure 8 and Figure 9 As shown, after a period of work, the magnetic field of the magnet 8 causes the plasma to impact a relatively wide groove 23 on the surface of the target material. This not only expands the high-efficiency sputtering area of the target material, but also effectively improves the utilization rate of the target material, while avoiding the formation of a narrow and deep V-shaped groove 23, effectively reducing the divergence problem of the sputtering atom angle caused by the consumption of the target material, making the sputtering particle rate and area of each region of the target material in the early and middle-late stages of sputtering relatively close, making the deposition of the deposited film relatively uniform, and effectively controlling the periodical fluctuation problem of the film thickness uniformity.

[0041] In addition, since the central area of the magnet is surrounded by a plurality of magnets 8, during a long period of work, a relatively wide annular groove 23 will be formed on the surface of the target material corresponding to each magnet 8. Each annular groove 23 is arranged concentrically with the center pivot 16 as the center, and the diameter increases from the inside to the outside. The edges of each annular groove 23 are connected to each other, thereby making each groove 23 on the surface of the target material tend to be flat, further reducing the divergence of the sputtering atom angle, and enhancing the uniformity of the film thickness.

[0042] The working principle of the magnetron sputtering device provided by the present application is summarized as follows: The magnetron sputtering device provided by the application is used, the rotating motor 7 drives the outer rotating sleeve 3 to rotate around the center support 19 through the transmission belt 6, the outer rotating sleeve 3 is fixedly connected with the center rotating shaft 16, the outer rotating sleeve 3 drives the center rotating shaft 16 to rotate synchronously when rotating, and further drives the base 9 in the mounting shell 5 to rotate. When the base 9 rotates around the axis of the center rotating shaft 16, each magnet 8 on the base 9 also rotates synchronously, and each magnet 8 moves synchronously along the radial direction of the magnet center area under the drive of each cylinder 11 corresponding to the magnet 8.

[0043] Compared with the single rotation mode of the magnet 8 in the prior art, the magnet 8 in the device can move reciprocatingly on the mounting surface while rotating, thereby expanding the coverage area of the magnetic field of a single magnet 8 on the surface of the target material. Under the joint action of the magnetic fields of the plurality of magnets 8, the shape of the groove 23 generated on the surface of the target material tends to be gentle, thereby improving the uniformity of the sputtered atoms on the surface of the substrate, and the magnetic field covers a large area of the target material, thereby improving the utilization rate of the target material.

[0044] Embodiment 2 of the magnetron sputtering device provided by the application: The main difference between the embodiment 2 and the embodiment 1 is that in the embodiment 1, one cylinder is arranged for each magnet to drive the magnet to reciprocate, and in the embodiment 2, one cylinder can be arranged in the magnet center area, the telescopic end of the cylinder is fixedly assembled with a driving ring, the driving ring is arranged parallel to the back plate, the cylinder controls the driving ring to perform telescopic action along the direction perpendicular to the back plate, a connecting rod is arranged between the driving ring and each mounting base on which a magnet is mounted, one end of each connecting rod is hinged to the driving ring, and the other end of the connecting rod is hinged to the corresponding mounting base. In the process that the cylinder drives the driving ring to reciprocate, each mounting base with a magnet can be driven to reciprocate through the connecting rod, and the magnets are controlled to reciprocate synchronously.

[0045] Embodiment 3 of the magnetron sputtering device provided by the application: The main difference between the embodiment 3 and the embodiment 1 is that in the embodiment 1, the cylinders are arranged inside the mounting shell as power sources to drive each magnet to reciprocate. In the embodiment 3, each cylinder can be replaced by a servo motor or an electric push rod, and the sliding position of the magnet is accurately controlled through accurate control of the servo motor or the electric push rod, and then the position is adjusted according to the groove shape formed by the target material.

[0046] Correspondingly, if the power source is replaced by a servo motor, the magnetic sealing protection of the motor should be done well to avoid the influence of the magnetic field of the motor on the magnetic field of the target material. Meanwhile, the center rotating shaft can be provided with a through hole to pass through the power supply circuit.

[0047] Embodiment 4 of the magnetron sputtering device provided by the application: The main difference between the embodiment 1 and the embodiment 2 is that, in the embodiment 1, the outer circumferential surface of the outer rotating sleeve is provided with a circumferentially extending rack, and the rotary motor is drivingly connected with the rack through a transmission belt to drive the outer rotating sleeve to rotate.

[0048] Embodiment 5 of the magnetron sputtering device provided by the present application: The main difference between the embodiment 1 and the embodiment 5 is that, in the embodiment 1, each magnet is circumferentially distributed on the magnet center area and reciprocally moves along the radial direction of the magnet center area, while in the embodiment 5, each magnet is linearly and uniformly arranged or linearly and staggered arranged outwardly along the radial direction of the central rotating shaft and reciprocally moves along the radial direction of the central rotating shaft.

[0049] In other embodiments, the magnets can also adopt other arrangement shapes such as ellipse or rectangle, and the magnetic field of the magnets can uniformly cover the target material.

[0050] According to the above description of the present specification, those skilled in the art can also understand that the terms used such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings of the present specification, and the above orientation or positional relationship terms cannot be understood or interpreted as a limitation on the present application.

[0051] In addition, in the description of the present specification, the meaning of "a plurality of" is at least two, such as two, three or more, etc., unless otherwise specifically limited.

Claims

1. A magnetron sputtering apparatus, comprising a mounting housing having a back plate for arranging a magnetron sputtering target, a base rotating about a central axis perpendicular to the back plate within the mounting housing, and a magnet mounted on the base, the magnetic field of which acts on the magnetron sputtering target as the magnet rotates with the base, characterized in that... The magnet is reciprocally slidably mounted on the base along a direction parallel to the back plate. The base is provided with a sliding drive mechanism, which drives the magnet to reciprocate as the base rotates.

2. The magnetron sputtering apparatus according to claim 1, characterized in that, A magnet central area is arranged on the base next to the central axis, and multiple magnets are evenly distributed around the magnet central area. The reciprocating sliding direction of the magnets on the base extends radially along the magnet central area.

3. The magnetron sputtering apparatus according to claim 2, characterized in that, The sliding drive mechanism includes cylinders arranged one for each magnet, and each cylinder drives the corresponding magnet to slide back and forth.

4. The magnetron sputtering apparatus according to claim 3, characterized in that, The base has sliding seats arranged one-to-one with each magnet, and the magnets are fixedly installed on the sliding seats.

5. The magnetron sputtering apparatus according to claim 3, characterized in that, Each of the cylinders is located on the side of the corresponding magnet facing the center region of the magnet.

6. The magnetron sputtering apparatus according to claim 5, characterized in that, The magnet's central area is equipped with a distribution plate, which has a main air inlet for connecting to the main air circuit and a branch air inlet for corresponding communication with each cylinder.

7. The magnetron sputtering apparatus according to claim 3, characterized in that, The base is provided with sliding tracks that extend radially along the central area of ​​each magnet, and each magnet is slidably mounted on each sliding track so that each magnet is slidably mounted on the base.

8. The magnetron sputtering apparatus according to any one of claims 3 to 7, characterized in that, A central support base is fixed on the mounting housing. An outer rotating sleeve is rotatably fitted around the central support base. The outer rotating sleeve is driven to rotate by a driver. A through hole is provided in the central support base. A central rotating shaft is rotatably fitted in the through hole. The central rotating shaft is driven to rotate by the outer rotating sleeve. The mounting end of the central rotating shaft extends into the mounting housing. The base is fixedly fitted to the mounting end of the central rotating shaft so that the base can be driven to rotate by the central rotating shaft.

9. The magnetron sputtering apparatus according to claim 8, characterized in that, The central rotating shaft is provided with a ventilation passage for supplying air to the cylinder to control the cylinder's extension and retraction.

10. The magnetron sputtering apparatus according to claim 9, characterized in that, The outer rotating sleeve is fitted with a pneumatic slip ring at the end facing away from the mounting shell via an adapter.

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