An automatic optimization method for a fully automatic ultrasonic testing process scheme

Abstract

The present disclosure provides an automatic optimization method of a full-automatic ultrasonic detection process scheme, which automatically imports the test block groove parameters and reflector position information, generates an initial focusing rule by computer, accurately positions the mechanical scanner and automatically finds the highest amplitude position of each reflector, then adaptively adjusts the key ultrasonic parameters such as the transmitting / receiving wafer and the angle according to the channel type, so that the main amplitude reaches the standard requirement and is positioned to the center of the time gate, while the coverage amplitude of the adjacent channel is intelligently checked and optimized, and the TOFD channel and the coupling channel are specially set with parameters, finally realizing the full-automatic, high-precision and high-efficiency whole process of test block calibration, effectively avoiding the errors and low efficiency problems caused by the difference in operation experience in the traditional manual calibration, significantly improving the consistency and reliability of the detection, and completely eliminating the detection blind area, providing complete data support for the evaluation of the welding quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of full-automatic ultrasonic detection of pipe girth welds in oil and gas storage and transportation engineering construction, and particularly relates to an automatic optimization method of a full-automatic ultrasonic detection process scheme. BACKGROUND

[0002] In recent years, with the rapid development of pipeline engineering construction in China, more and more large-diameter, high-steel-grade oil and gas pipelines are built, and full-automatic welding technology is widely used. For the detection of the groove area defects easily generated by full-automatic welding, full-automatic ultrasonic detection (AUT) technology has become the preferred detection method and is recognized by the industry at home and abroad.

[0003] With the development of pipeline construction towards digitization and intelligentization, the intelligentization of AUT detection technology is particularly important. The main steps of AUT detection include:

[0004] Focusing rule generation, block calibration and weld detection.

[0005] Block calibration is to adjust the focusing scheme of all channels of AUT to meet the standard requirements, which is the basis of weld detection.

[0006] For different pipe materials, pipe diameters, wall thicknesses and groove forms, separate and different calibration blocks must be used. The signals obtained from each target reflector can help identify the definition of each partition, and the sensitivity of the system will be affected by the position, size, surface quality and angle of the target reflector.

[0007] The process scheme of block calibration includes fusion zone scheme design, volume channel scheme design and coupling channel scheme design. At present, the block calibration in AUT detection of long-distance oil and gas pipelines is still the traditional manual calibration, which requires the operator to repeatedly search for the position of the reflector in the block, adjust the parameters of the phased array ultrasonic and the focusing rule, which is time-consuming and labor-intensive and is easily affected by the experience and skills of the operator. Therefore, the research and application of automatic adjustment of the detection process scheme is the key to improving the precision, efficiency and intelligentization of ultrasonic detection. SUMMARY

[0008] The first aspect of the present disclosure provides an automatic optimization method of a full-automatic ultrasonic detection process scheme, comprising the following steps:

[0009] S1, importing the groove parameters of a to-be-calibrated block and the position information of all partition reflectors;

[0010] S2, calculating the initial focusing rule of all partition channels according to the groove parameters and the preset AUT detection parameters;

[0011] S3, control the mechanical scanner to move to the first reflector position on the test block and set it as the reference zero point, and record the position information in real time through the encoder;

[0012] S4, control the mechanical scanner to move to the area where each reflector is located in sequence, find the highest amplitude position of each reflector by moving the probe and monitoring the reflected amplitude, and record the position as the optimal physical position of the probe;

[0013] S5, automatically adjust the corresponding ultrasonic parameters according to the channel type, so that the amplitude of the main reflector of each channel reaches the predetermined requirement and is located in the center of the time gate;

[0014] S6, under the premise of keeping the detection scheme of the channel unchanged, check the coverage amplitude of the adjacent reflector, and adjust the related parameters to make the coverage amplitude meet the standard requirement;

[0015] S7, automatically set and adjust the parameters of the TOFD channel and the coupling channel respectively;

[0016] S8, after the adjustment of all channels is completed, control the mechanical scanner to return to the reference zero point, and complete the calibration.

[0017] In combination with the first aspect, the step S4 of finding the highest amplitude position of each reflector specifically includes:

[0018] Control the motor to drive the probe to move forward and backward, monitor the amplitude change of the main reflected wave of the reflector, and when the amplitude reaches the peak value, record the probe position corresponding to the peak value signal as the optimal physical position.

[0019] In combination with the first aspect, in the step S5, for the strip chart channel and the volume channel using the self-emission and self-reception mode, the automatic adjustment of the ultrasonic parameters includes:

[0020] S51a, adjust the emission main crystal piece number until the amplitude reaches the highest and then falls, and then use the emission main crystal piece number corresponding to the highest amplitude;

[0021] S52a, adjust the emission angle until the amplitude reaches the highest and then falls, and then use the emission angle corresponding to the highest amplitude;

[0022] S53a, adjust the amplitude to 80% of the full screen height and move to the center of the time gate.

[0023] In combination with the first aspect, in the step S5, for the strip chart channel using the one-emission and one-reception mode, the automatic adjustment of the ultrasonic parameters includes:

[0024] S51b, adjust the emission main crystal piece number until the amplitude reaches the highest and then falls, and then use the emission main crystal piece number corresponding to the highest amplitude;

[0025] S52b, adjust the receiving main crystal piece number until the amplitude reaches the highest and then falls, then use the receiving main crystal piece number corresponding to the highest amplitude;

[0026] S53b, adjust the emission angle until the amplitude reaches the highest and then falls, then use the emission angle corresponding to the highest amplitude;

[0027] S54b, adjust the receiving angle until the amplitude reaches the highest and then falls, then use the receiving angle corresponding to the highest amplitude;

[0028] S55b, adjust the amplitude to 80% of the full screen height, and move to the time gate center.

[0029] In combination with the first aspect, the step S6 of adjusting the related parameters to make the coverage amplitude meet the standard requirements specifically includes:

[0030] S61, move the probe to the position of the adjacent reflector;

[0031] S62, if the coverage amplitude is higher than 40% or lower than 5%, adjust the emission and receiving main crystal piece numbers until the coverage amplitude is between 5% and 40%;

[0032] S63, if the requirement cannot be met by adjusting the crystal piece numbers, further adjust the emission and receiving angles;

[0033] S64, after the coverage adjustment is completed, move the probe back to the main reflector position, adjust the main reflection wave amplitude to 80% and locate it in the time gate center.

[0034] In combination with the first aspect, the step S7 of automatically setting and adjusting the parameters of the TOFD channel includes:

[0035] S71a, move the probe to the middle position of the Trans ID / OD and TOFD ID / OD;

[0036] S72a, set the initial data acquisition range so that it can acquire the direct wave and bottom reflection wave signals;

[0037] S73a, determine the positions of the direct wave and the bottom reflection wave, and finally set the data acquisition range to 0.5-1 μs before the direct wave to 0.5-1 μs after the bottom reflection wave;

[0038] S74a, adjust the direct wave amplitude value to between 40% and 90%, and save the settings.

[0039] In combination with the first aspect, the step S7 of automatically setting and adjusting the parameters of the coupling channel includes:

[0040] S71b, move the probe to the middle position of the Trans ID / OD and TOFD ID / OD;

[0041] S72b, set the initial data acquisition range to contain multiple bottom surface reflected waves;

[0042] S73b, intercept the second bottom surface reflected wave, and set the final data acquisition range according to the standard requirements;

[0043] S74b, adjust the amplitude to 80%, and save the settings.

[0044] In combination with the first aspect, the calibration process is sequentially performed in the order of upstream root welding, blunt edge, hot welding, filling, volume, cover, coupling, TOFD channel, and then downstream coupling, cover, volume, filling, hot welding, blunt edge, and root welding channel.

[0045] The second aspect of the present disclosure provides an electronic device, comprising:

[0046] One or more processors;

[0047] A storage unit for storing one or more programs, which can enable the one or more processors to implement the automatic optimization method of the full-automatic ultrasonic detection process scheme when the one or more programs are executed by the one or more processors.

[0048] The third aspect of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, which can implement the automatic optimization method of the full-automatic ultrasonic detection process scheme when executed by a processor.

[0049] Beneficial effects: The automatic optimization method of the full-automatic ultrasonic detection process scheme provided by the present application automatically imports the block groove parameters and reflector position information, generates initial focusing rules by computer, accurately positions the mechanical scanner and automatically finds the highest amplitude position of each reflector, and then adjusts the key ultrasonic parameters such as transmission / reception wafer and angle according to the channel type to make the main amplitude meet the standard requirements and be positioned to the center of the time gate, while intelligently checking and optimizing the coverage amplitude of adjacent channels, and performing special parameter setting for TOFD channels and coupling channels, finally realizing the full-automatic, high-precision and high-efficiency whole process of block calibration, effectively avoiding the errors and low efficiency problems caused by the difference in operation experience in traditional manual calibration, significantly improving the consistency and reliability of detection, completely eliminating the detection blind area, providing complete data support for welding quality evaluation, and promoting the development of full-automatic ultrasonic detection technology towards intelligence and digitization. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 A flowchart of the automatic optimization method of the full-automatic ultrasonic detection process scheme of the embodiment of the present disclosure;

[0051] Figure 2 An electronic device of embodiments of the present disclosure. DETAILED DESCRIPTION

[0052] Exemplary embodiments will be described in detail with reference to the drawings, of which examples are shown. In the following description, the same numbers are used to denote the same or similar elements unless otherwise described. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with embodiments of the present disclosure.

[0053] The terminology used in the present disclosure is merely for the purpose of describing particular embodiments and is not intended to limit the present disclosure. As used in the present disclosure and the appended claims, singular forms "a," "an," and "the" are intended to include plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0054] As Figure 1 shown, a flowchart of an automatic optimization method of a full-automatic ultrasonic testing process scheme of embodiments of the present disclosure, comprising:

[0055] S1, importing the groove parameters of a test block to be calibrated and the position information of all partition reflectors;

[0056] The implementation of this step relies on the pre-constructed digital workpiece model interface of the system. Specifically, the operator or the upstream process system will provide digital information containing groove detailed geometric dimensions, angles, depths, and other parameters, as well as the theoretical coordinate positions of each partition reflector accurately determined according to the test block design drawing, following a standardized data format (such as XML or JSON configuration file).

[0057] The system automatically reads and verifies the integrity and rationality of these information by calling the data parsing module. The groove parameters usually include groove form, angle, blunt edge size, partition height, and other key features, while the reflector position information accurately describes the preset positions of artificial defects in the root, blunt edge, heat welding, filling area, and cover area. These data constitute the benchmark and input conditions for the subsequent automatic optimization algorithm, ensuring that the entire calibration process is based on an accurate object model.

[0058] S2, calculating the initial focusing rule of all partition channels according to the groove parameters and the preset AUT detection parameters;

[0059] In step S2, the system automatically calculates initial focusing rules for all sub-zone channels according to the bevel parameters imported in S1 and the pre-set AUT core parameters in the system, through the built-in acoustic calculation model.

[0060] The system first processes the parameters of the bevel geometry (such as angle, depth), wall thickness, etc., and combines the pre-set AUT hardware and physical parameters such as probe model, wafer quantity, wedge angle, sound speed, detection frequency, etc. The calculation core is based on the physical principles of sound wave propagation (such as Snell's law) and the delay rules of phased array, simulates and calculates the initial theoretical values of key parameters such as excitation wafer group, receiving wafer group, transmission angle, receiving angle, focusing depth, etc. for each detection channel (including root weld, hot weld, filling, volume, TOFD, etc.).

[0061] These calculation-generated initial focusing rules constitute the starting point for subsequent automatic optimization adjustment, which ensures that before the automatic scanning starts, the ultrasonic beam can be directed and focused on the target reflector of each sub-zone in the theoretically optimal way, laying a solid foundation for subsequent precise fine-tuning, thereby avoiding completely blind search and greatly improving the efficiency and reliability of the entire optimization process.

[0062] S3, control the mechanical scanner to move to the first reflector position on the test block and set it as the reference zero point, and record the position information in real time through the encoder;

[0063] In step S3, the calculation module first calculates the absolute coordinates of the first reflector on the test block according to the reflector position information imported in S1. Then, the system sends instructions to the motor driver that controls the mechanical scanner to drive the scanner carrying the probe array to move to the calculated target position.

[0064] To achieve precise positioning, the system adopts a closed-loop control strategy. A high-precision photoelectric encoder or magnetic grid encoder monitors the rotation angle of the motor or the linear displacement of the scanner in real time and continuously feeds back the position feedback signal to the central controller. The controller compares the real-time position with the target position and dynamically adjusts the speed and direction of the motor through PID control algorithm, until the scanner is stably parked at the theoretical position of the first reflector, and this point is established as the reference zero point (i.e. the coordinate origin) of the entire detection coordinate system.

[0065] After that, all movements of the scanner during the entire calibration process are measured and recorded based on this zero point as the reference, and the encoder continuously provides high-resolution position feedback, ensuring the uniformity and accuracy of the spatial and temporal reference of all probe positioning and subsequent reflector searching operations during the entire process.

[0066] S4, control the mechanical scanner to move to the area where each reflector is located in turn, find the highest amplitude position of each reflector by moving the probe and monitoring the reflected amplitude, and record the position as the optimal physical position of the probe;

[0067] The finding of the highest amplitude position of each reflector in step S4 specifically includes:

[0068] The motor is controlled to drive the probe to move forward and backward, the amplitude change of the main reflected wave of the reflector is monitored, and when the amplitude reaches a peak value, the probe position corresponding to the peak value signal is recorded as the optimal physical position.

[0069] In step S4, the system performs a core automated optimization process, i.e., accurately finding the optimal detection point of each reflector in the physical space. The implementation of this step deeply integrates mechanical control, data acquisition and real-time signal processing.

[0070] Firstly, the system controls the mechanical scanner to carry the probe to move to the theoretical area of the current target reflector according to the pre-stored reflector position map. However, due to the small deviation of mechanical assembly, test block processing and theoretical calculation itself, the theoretical position is often not the optimal position for obtaining the strongest ultrasonic signal.

[0071] Therefore, the system sends instructions to the motor controlling the movement of the probe, so that the motor performs reciprocating scanning within a small range before and after the theoretical position of the reflector. During the entire scanning process, the ultrasonic board continuously excites the probe and collects the echo signal returned from the test block, and the signal processing algorithm in the system monitors and extracts the reflected amplitude value in the specific monitoring gate in real time.

[0072] The system continuously compares the real-time amplitude with the previously recorded amplitude peak value. When the amplitude value continuously rises with the movement of the probe, it indicates that the probe is approaching the optimal response point of the reflector; when the amplitude value reaches the maximum value and starts to decrease, it indicates that the probe has passed the optimal point. At this time, the system will immediately record the accurate physical coordinates fed back by the encoder when the peak amplitude appears.

[0073] This position found by automatic scanning and feedback confirmation, which can obtain the highest echo signal, is determined by the system as the "optimal physical position" of the reflector for the current detection channel. This position data is accurately stored as the spatial reference for subsequent parameter fine-tuning (such as wafer, angle adjustment) and final process scheme development. This process is completely controlled by the computer, eliminating the uncertainty, subjectivity and fatigue errors in manual searching, ensuring the reproducibility and high precision of the detection scheme.

[0074] S5, automatically adjusting the corresponding ultrasonic parameters according to the channel type, so that the amplitude of the main reflector of each channel reaches the predetermined requirement and is located at the center of the time gate;

[0075] In step S5, for the strip chart channel and the volume channel using the self-excitation and self-reception mode, the automatic adjustment of the ultrasonic parameters includes:

[0076] S51a, adjust the emission main crystal number until the amplitude reaches the highest and then falls back, then use the emission main crystal number corresponding to the highest amplitude;

[0077] S52a, adjust the emission angle until the amplitude reaches the highest and then falls back, then use the emission angle corresponding to the highest amplitude;

[0078] S53a, adjust the amplitude to 80% of the full screen height and move to the center of the time gate.

[0079] In step S5, for the strip chart channel using the one emission and one reception mode, the automatic adjustment of the ultrasonic parameters includes:

[0080] S51b, adjust the emission main crystal number until the amplitude reaches the highest and then falls back, then use the emission main crystal number corresponding to the highest amplitude;

[0081] S52b, adjust the reception main crystal number until the amplitude reaches the highest and then falls back, then use the reception main crystal number corresponding to the highest amplitude;

[0082] S53b, adjust the emission angle until the amplitude reaches the highest and then falls back, then use the emission angle corresponding to the highest amplitude;

[0083] S54b, adjust the reception angle until the amplitude reaches the highest and then falls back, then use the reception angle corresponding to the highest amplitude;

[0084] S55b, adjust the amplitude to 80% of the full screen height and move to the center of the time gate.

[0085] In step S5, the system performs a deeper ultrasonic parameter optimization fine-tuning at the determined optimal physical position of the probe. The core of this step is that even if the probe position is optimal, the excitation and reception characteristics of the ultrasonic beam also need to be accurately matched with the geometric characteristics of the reflector to capture the strongest echo signal. The system will intelligently call different optimization algorithms according to the currently activated channel type.

[0086] For self-transmitting and self-receiving channels (such as volume channels), the optimization is a gradual one-way adjustment process. The system first keeps other parameters unchanged, automatically traverses and switches different transmitting main crystal numbers (S51a). Each time it is switched, the echo signal is collected and the amplitude is recorded. The system accurately identifies the transmitting crystal that can make the amplitude reach the absolute maximum by comparing the amplitude trend. After locking the best transmitting crystal, the system then fine-tunes the transmitting angle (S52a), and also finds the best transmitting angle that produces the highest echo by iterative attempts and feedback comparison. Finally (S53a), the system adjusts the instrument gain to standardize the optimized maximum amplitude to the standard quantization level of 80% full screen height, and adjusts the starting point and width of the time gate to ensure that the echo signal is accurately framed in the center of the time gate. All these adjustments are automatically completed by the algorithm to ensure consistency and repeatability of the results.

[0087] For more complex one-transmitting and one-receiving channel (such as some strip chart channels), the optimization is a two-way collaborative adjustment process. Because it involves independent transmitting and receiving crystals and angles, the system needs to optimize both the transmitting and receiving ends. Based on the self-transmitting and self-receiving adjustment, the process adds independent optimization cycles for the receiving main crystal number (S52b) and the receiving angle (S54b). The system will find the combination of the best transmitting crystal, receiving crystal, transmitting angle, and receiving angle in a similar iterative search manner, so that the transmitted ultrasonic energy and the received echo signal sensitivity reach the peak state. Finally (S55b), the amplitude standardization and signal gate placement operations are also performed.

[0088] Through step S5, the system realizes the deepening from "physical position alignment" to "acoustic parameter optimization", ensuring that the detection sensitivity of each channel is calibrated to the best state, laying an accurate foundation for subsequent coverage verification.

[0089] S6, under the premise of keeping the detection scheme of the current channel unchanged, check the coverage amplitude of the adjacent reflector, and adjust the related parameters to make the coverage amplitude meet the standard requirements;

[0090] The adjustment of the related parameters to make the coverage amplitude meet the standard requirements in step S6 specifically includes:

[0091] S61, move the probe to the position of the adjacent reflector;

[0092] S62, if the coverage amplitude is higher than 40% or lower than 5%, adjust the transmitting and receiving main crystal numbers until the coverage amplitude is between 5% and 40%;

[0093] S63, if the requirement cannot be met by adjusting the crystal numbers, further adjust the transmitting and receiving angles;

[0094] S64, after the completion of the adjustment of the coverage, the probe is moved back to the main reflector position, the main reflected wave amplitude is adjusted to 80% and located in the center of the time gate.

[0095] In step S6, the system performs a crucial operation, the channel coverage verification and optimization, which aims to ensure that each detection channel not only effectively detects the main reflector it is responsible for, but also provides effective detection coverage for the adjacent area, thereby eliminating the detection blind area and ensuring the continuity of the weld detection.

[0096] The implementation of this step begins with the system controlling the mechanical scanner to move the probe from the current main reflector optimal position to the adjacent reflector position (S61). At this time, the system keeps all the ultrasonic parameters of the current channel (i.e. the wafer, angle scheme optimized in step S5) completely unchanged, and collects the echo signal at this new position, measures its amplitude value, which is the "coverage amplitude".

[0097] Subsequently, the system automatically compares and judges the coverage amplitude value with the preset standard requirement (usually 5% to 40% of the full screen height) (S62). If the amplitude is not within this range (i.e. higher than 40% or lower than 5%), the system will start an automatic adjustment cycle. It first attempts to adjust the transmission and reception main wafer number, by changing the activated wafer group to fine-tune the focusing characteristics and width of the sound beam, so as to adjust the coverage amplitude to the qualified interval.

[0098] If the target cannot be achieved by adjusting the wafer number only (S63), indicating that more precise sound beam steering control is needed, the system will further automatically fine-tune the transmission and reception angles to change the projection direction of the sound beam, so that it can better cover the adjacent reflector.

[0099] After the completion of the coverage adjustment (S64), the system will control the scanner to move the probe back to the original main reflector position. Since the parameters adjusted for optimization of coverage may slightly affect the signal of the main reflector, the system will finally perform a confirmation and fine-tuning to ensure that the amplitude of the main reflected wave remains stable at 80% and located in the center of the time gate. This process ensures that while expanding the channel coverage capability, its main detection capability precision is never sacrificed, achieving the best balance between "point" and "area" detection effects.

[0100] S7, automatic setting and adjustment of parameters for TOFD channel and coupling channel respectively;

[0101] The automatic setting and adjustment of parameters for the TOFD channel in step S7 include:

[0102] S71a, moving the probe to the middle position of Trans ID / OD and TOFD ID / OD;

[0103] S72a, set initial data acquisition range to capture direct wave and bottom reflection wave signals;

[0104] S73a, determine the position of direct wave and bottom reflection wave, and finally set data acquisition range to 0.5-1 μs before direct wave to 0.5-1 μs after bottom reflection wave;

[0105] S74a, adjust direct wave amplitude to 40%-90%, save settings.

[0106] The automatic parameter setting and adjustment of the coupling channel in step S7 includes:

[0107] S71b, move the probe to the middle position of Trans ID / OD and TOFD ID / OD;

[0108] S72b, set initial data acquisition range to contain multiple bottom reflection waves;

[0109] S73b, intercept the second bottom reflection wave, and set the final data acquisition range according to the standard requirements;

[0110] S74b, adjust the amplitude to 80%, save settings.

[0111] In step S7, the system performs a special automatic parameter setting process for the special TOFD (Time of Flight Diffraction) channel and the coupling monitoring channel. The calibration targets of these two channels are different from the conventional fusion zone or volume type channel. They do not pursue the highest amplitude of a single reflector, but need to ensure that a specific reference signal (such as a direct wave or a multiple bottom reflection wave) is clearly and completely acquired and standardized for subsequent defect discrimination and coupling state monitoring in detection.

[0112] For the setting of the TOFD channel (S71a-S74a), the system first moves a pair of transmitting and receiving probes to a predetermined middle position of Trans ID / OD and TOFD ID / OD (S71a). Then, the system sets a relatively wide initial data acquisition time range (S72a) to ensure that the key reference signals, the direct wave from the transmitting probe to the receiving probe and the bottom reflection wave reflected from the inner wall (or outer wall) of the test block, can be captured. Next, the system automatically identifies and locates the precise positions of these two characteristic waves on the time axis by algorithm (S73a). According to the standard process, the system will finally set the time gate of data acquisition to start from 0.5-1 μs before the arrival of the direct wave signal and end 0.5-1 μs after the bottom reflection wave signal, so as to ensure that all possible diffraction signals can be recorded completely. Finally, the system adjusts the gain to standardize the direct wave amplitude to an optimal level between 40%-90% and saves all settings (S74a).

[0113] For the setup of the coupling channel (S71b-S74b), the system first moves the probe to a designated intermediate position (S71b). The purpose of this channel is to monitor the stability of the energy transmission of the ultrasonic wave in the coupling medium. The system sets an initial acquisition range long enough to contain several consecutive bottom surface reflected waves (multiple echoes) (S72b). Then, according to the standard specification, the system will intercept the second bottom surface reflected wave as the evaluation reference (S73b), because the earlier echoes can be affected by the initial pulse, while the later echoes are too weak, the second echo is usually the most stable and reliable evaluation index. The system sets the final data acquisition gate accordingly. Finally, the amplitude of the second bottom surface reflected wave is normalized to 80% after gain adjustment and the settings are saved (S74b).

[0114] Through step S7, the system has completed the full-automatic configuration of two functionally special but crucial detection channels, ensuring the standardization of data acquisition and the consistency of evaluation reference in the subsequent actual detection.

[0115] S8, after all the channel adjustments are completed, control the mechanical scanner to return to the reference zero point, complete the calibration.

[0116] In step S8, the system performs the final finishing action of the entire automatic optimization process, marking the completion of the calibration work.

[0117] When the parameters of all channels, including the upstream and downstream various types of fusion zone channels, volume channels, TOFD channels and coupling channels, have been adjusted and optimized according to the standard requirements, the system will generate a final instruction. This instruction controls the mechanical scanner carrying the probe to move smoothly and automatically from its last position to the reference zero point position set in step S3.

[0118] The electronic device 200 can be a desktop computer, a notebook, a palm computer, a cloud server and the like. The electronic device 200 can include but is not limited to a processor 201 and a memory 202. Those skilled in the art can understand that the processor 201 can be a central processing unit (CPU), an application-specific integrated circuit (ASIC), a programmable logic device (PLD) or a digital signal processor (DSP), etc. Figure 2 The electronic device 200 is only an example and does not constitute a limitation on the electronic device 200, and can include more or fewer components than shown, or combine some components, or different components, for example, the electronic device can also include input / output devices, network access devices, buses, etc.

[0119] The processor 201 can be a central processing unit (CPU), or other general purpose processors, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The general purpose processor can be a microprocessor or the processor can be any conventional processor.

[0120] The memory 202 can be an internal storage unit of the electronic device 200, for example, a hard disk or a memory of the electronic device 200. The memory 202 can also be an external storage device of the electronic device 200, for example, a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the electronic device 200. Further, the memory 202 can include both the internal storage unit and the external storage device of the electronic device 200. The memory 202 is used to store the computer program 203 and other programs and data required by the electronic device. The memory 202 can also be used to temporarily store data that has been output or will be output.

[0121] In the embodiments provided by the present disclosure, it should be understood that the disclosed apparatus / electronic device and method can be implemented in other manners. For example, the embodiments of the apparatus / electronic device described above are merely schematic, and the division of the modules or units can be different from the above. For example, one or more units can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0122] The integrated modules / units, if implemented in the form of software functional units and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the above-mentioned embodiment methods can also be completed by instructing related hardware through a computer program, and the computer program can be stored in a computer readable storage medium. When the computer program is executed by a processor, the steps of the above-mentioned various method embodiments can be implemented. The computer program can include computer program code, which can be in the form of source code, object code, executable files or some intermediate forms, etc. The computer readable medium can include any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, magnetic disk, optical disk, computer memory, read only memory (Read Only Memory, ROM), random access memory (Random Access Memory, RAM), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction, for example, in some jurisdictions, according to legislation and patent practice, the computer readable medium does not include electric carrier signal and telecommunication signal.

[0123] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and should be included in the protection scope of the present disclosure.

Claims

1. An automatic optimization method for a fully automated ultrasonic testing process, characterized in that, Includes the following steps: S1. Import the bevel parameters of the test block to be calibrated and the location information of all zone reflectors; S2. Calculate the initial focusing rule for all partition channels based on the bevel parameters and the preset AUT detection parameters; S3. Control the mechanical scanner to move to the position of the first reflector on the test block and set it as the reference zero point; record the position information in real time through the encoder. S4. Control the mechanical scanner to move sequentially to the area where each reflector is located. By moving the probe and monitoring the reflected wave amplitude, find the position of the highest wave amplitude of each reflector and record this position as the optimal physical position of the probe. S5. Automatically adjust the corresponding ultrasound parameters according to the channel type so that the amplitude of the primary reflector of each channel reaches the predetermined requirements and is located at the center of the time gate; S6. While keeping the detection scheme of this channel unchanged, check its coverage amplitude to adjacent reflectors and adjust the relevant parameters to make the coverage amplitude meet the standard requirements. S7. Automatically set and adjust the parameters for the TOFD channel and the coupling channel respectively; S8. After all channels have been adjusted, control the mechanical scanner to return to the reference zero point to complete the calibration.

2. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S4, which involves finding the position of the highest amplitude of each reflector, specifically includes: The motor drives the probe to move back and forth, monitoring the amplitude change of the main reflected wave of the reflector. When the amplitude reaches its peak value, the probe position corresponding to the peak signal is recorded as the optimal physical position.

3. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, In step S5, for the bandgap channel and volumetric channel using the self-transmitting and self-receiving method, the automatic adjustment of ultrasound parameters includes: S51a. Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back. Then use the transmitter master chip number corresponding to the maximum amplitude. S52a. Adjust the emission angle until the amplitude reaches its maximum and then falls back, then use the emission angle corresponding to the maximum amplitude. S53a, Adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

4. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, In step S5, for the bandgap channel using a one-transmit, one-receive method, the automatic adjustment of ultrasound parameters includes: S51b: Adjust the transmitter master chip number until the amplitude reaches its maximum and then falls back, then use the transmitter master chip number corresponding to the maximum amplitude. S52b: Adjust the receiver master chip number until the amplitude reaches its maximum and then falls back, then use the receiver master chip number corresponding to the highest amplitude. S53b: Adjust the transmission angle until the amplitude reaches its maximum and then falls back, then use the transmission angle corresponding to the maximum amplitude; S54b: Adjust the receiving angle until the amplitude reaches its maximum and then falls back, then use the receiving angle corresponding to the maximum amplitude. S55b, adjust the amplitude to 80% of the full screen height and move it to the center of the time gate.

5. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S6, adjusting the relevant parameters to ensure the coverage amplitude meets the standard requirements, specifically includes: S61. Move the probe to the position of the adjacent reflector; S62. If the coverage amplitude is higher than 40% or lower than 5%, adjust the transmitting and receiving main chip numbers until the coverage amplitude is between 5% and 40%. S63. If adjusting the chip number cannot meet the requirements, further adjust the transmission and reception angles; S64. After the coverage adjustment is completed, move the probe back to the position of the main reflector, adjust the amplitude of the main reflected wave to 80% and position it at the center of the time gate.

6. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S7 involves automatically setting and adjusting the parameters of the TOFD channel, including: S71a. Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72a. Set the initial data acquisition range so that it can acquire both direct wave and bottom surface reflected wave signals; S73a. Determine the positions of the direct wave and the bottom reflected wave, and finally set the data acquisition range to 0.5-1μs before the direct wave to 0.5-1μs after the bottom reflected wave; S74a. Adjust the through wave amplitude to between 40% and 90% and save the settings.

7. The automatic optimization method for the fully automated ultrasonic testing process according to claim 1, characterized in that, Step S7, which involves automatically setting and adjusting the parameters of the coupling channel, includes: S71b, Move the probe to the middle position between Trans ID / OD and TOFD ID / OD; S72b: Set the initial data acquisition range to include multiple bottom surface reflected waves; S73b, intercept the second bottom surface reflected wave and set the final data acquisition range according to the standard requirements; S74b, adjust the amplitude to 80%, and save the settings.

8. The automatic optimization method for a fully automated ultrasonic testing process according to any one of claims 1 to 7, characterized in that, The calibration process is performed in the following order: upstream root weld, blunt edge, hot weld, filler, volume, capping, coupling, TOFD channel, and then downstream coupling, capping, volume, filler, hot weld, blunt edge, and root weld channel.

9. An electronic device, characterized in that, include: One or more processors; A storage unit is used to store one or more programs, which, when executed by the one or more processors, enable the one or more processors to implement the automatic optimization method of the fully automated ultrasonic testing process according to any one of claims 1 to 8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it can realize the automatic optimization method of the fully automatic ultrasonic testing process according to any one of claims 1 to 8.

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