A wafer heat treatment apparatus

Abstract

This invention provides a wafer thermal processing apparatus, belonging to the field of semiconductor processing technology. Specifically, it includes a support platform and a heating area. The heating area is disposed on the support platform, and a heating ring assembly and a wafer support assembly are disposed within the heating area. The wafer support assembly is used to position the wafer, and when the wafer support assembly rotates, it enables the wafer to be vertically flipped. The heating ring assembly includes a positioning frame connected to the wafer support assembly, and when the positioning frame rotates, it drives the wafer support assembly to rotate. Compared with the prior art, this invention, after positioning the wafer, prevents the wafer surface from being covered or obstructed, allowing both the front and back sides of the wafer to contact hot air. Furthermore, during the wafer heating process, the wafer is in a flipped state, ensuring that all parts of the wafer are heated, increasing the heating range and heating uniformity.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, specifically relating to a wafer heat treatment apparatus. Background Technology

[0002] Wafer heating (also known as wafer baking or heat treatment) is a critical step throughout semiconductor manufacturing, requiring multiple heat treatments of the wafer. For example, before applying photoresist, the wafer surface adsorbs water vapor molecules from the environment. These water films can severely affect the adhesion of the photoresist and lead to poor film deposition quality. Therefore, the wafer needs to be heated to about 150°C to effectively evaporate the surface and shallow surface moisture, providing a dry and clean surface for subsequent processes. In the photolithography process, the wafer needs to be baked multiple times. For example, after spin coating the photoresist and before exposure, a soft bake is required, and after development and before etching, a hard bake is required.

[0003] In the existing technology, regardless of when the wafer is heated, the wafer is generally placed on a tray, and then the tray is placed in the heating area. At this time, the temperature in the heating area is raised by the heating component to achieve the heating treatment of the wafer. However, because the back of the wafer is blocked by the tray, the front and back of the wafer are heated differently, which ultimately leads to uneven heating of the wafer and easily causes quality problems such as wafer deformation. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer heat treatment apparatus that can heat the wafer uniformly and improve the wafer quality.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is a wafer heat treatment apparatus, comprising a support platform and a heating area, wherein the heating area is disposed on the support platform, and a heating ring assembly and a wafer support assembly are disposed within the heating area; the wafer support assembly is used to position the wafer, and when the wafer support assembly rotates, it enables the wafer to be vertically flipped.

[0006] The heating ring assembly includes a positioning frame, which is connected to the wafer carrier assembly. When the positioning frame rotates, it drives the wafer carrier assembly to rotate.

[0007] Furthermore, the heating ring assembly also includes several annular heating units, each connected to a positioning frame, through which the distance between adjacent heating units can be adjusted.

[0008] Furthermore, the positioning frame includes a main support arm, a circular ring, a slot, and a positioning clamp. There are two main support arms arranged parallel to each other. The circular ring is connected to the upper ends of the two main support arms. The slot is located on the main support arm and extends vertically. The positioning clamp passes through the slot and is used to connect the heating unit.

[0009] Furthermore, the positioning clamp includes a pull plate, a notch, a clamping bar, and a flat boom. The notch is located on the pull plate; the clamping bar is located within the notch and can move within the notch; the flat boom passes through the strip opening and is connected to the pull plate.

[0010] Furthermore, the positioning clamp is connected to a positioning seat, the positioning seat is connected to a transmission rod, and the transmission rod is connected to the main upright arm. The positioning clamp can be moved by rotating the transmission rod.

[0011] Furthermore, a driving component is connected to the annular body, and a transmission gear is meshed with the driving component. The transmission gear is mounted on the transmission rod, and the transmission rod rotates during the rotation of the driving component.

[0012] Furthermore, the wafer carrier assembly includes a center seat, an assembly socket, and a carrier base. The center seat is connected to the carrier platform, and the positioning frame can drive the center seat to rotate when it rotates. The assembly socket is set on the center seat and vertically penetrates the center seat. The carrier base is installed in the assembly socket and is used to carry the wafer, and can rotate simultaneously with the center seat.

[0013] Furthermore, the support seat is provided with a support bracket, which is equipped with a roller assembly. The roller assembly is located on the center seat. When the support seat is docked with the center seat, the support bracket is connected to the roller assembly.

[0014] Furthermore, the support frame includes a support arm, a strut, a short shaft, and an annular positioning seat. The strut is connected to the upper end of the support arm; the short shaft is horizontally positioned and passes through the strut, and a mating gear is fixed to the outer end of the short shaft, which is connected to the chuck assembly; the annular positioning seat is mated to the inner end of the short shaft for positioning the wafer.

[0015] Furthermore, a track bar is provided on the bearing platform. The track bar is arc-shaped and the center of the arc is located on the central axis of the central seat. During the rotation of the central seat, the chuck assembly makes a circular motion. After the chuck assembly is coupled with the track bar, the annular positioning seat flips.

[0016] Compared with the prior art, the beneficial effects of the present invention are that after positioning the wafer, the surface of the wafer will not be covered or obstructed, and both the front and back sides of the wafer can be in contact with hot air. Moreover, during the heating process of the wafer, the wafer is in a flipped state, so that all parts of the wafer can be heated, increasing the heating range and heating uniformity. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention;

[0019] Figure 3 This is a schematic diagram of the positioning frame structure of the present invention;

[0020] Figure 4 This is a schematic cross-sectional view of the positioning frame structure of the present invention;

[0021] Figure 5 This is a schematic diagram of the positioning clip structure of the present invention;

[0022] Figure 6 This is a schematic diagram of the support platform structure of the present invention;

[0023] Figure 7 This is a schematic diagram of the central seat structure of the present invention;

[0024] Figure 8 This is a schematic diagram of the bearing structure of the present invention;

[0025] Figure 9 This is a schematic diagram of the central ring structure of the present invention;

[0026] Figure 10 This is a schematic diagram of the locking ring structure of the present invention;

[0027] Among them, 1-bearing platform, 2-heating cover, 3-support component, 4-placement base, 6-ring limiting plate, 7-heating unit, 8-main arm, 9-ring body, 10-transmission rod, 11-intermediate positioning seat, 12-upper positioning seat, 13-lower positioning seat, 14-pull plate, 15-clamping bar, 16-locking pin, 17-track groove, 18-slot, 19-transmission gear, 20-transmission disc, 21-internal gear ring, 22-lifting cylinder body, 23-lifting bracket, 24-drive motor, 25-reducer, 26-pallet, 27-outer cover cylinder, 28-guide ring, 29-internal drive gear, 30-bottom gear ring, 31- Assembly socket, 32-bearing seat, 33-base plate, 34-upper limit plate, 35-lower limit plate, 36-track bar, 37-straight rod, 38-side support plate, 39-longitudinal groove, 40-flat shaft, 41-external drive gear, 42-support arm, 43-bracing frame, 44-ring positioning seat, 45-short shaft, 46-mating gear, 47-center ring body, 48-locking ring, 49-locking pin, 50-inner support rod, 51-slip ring, 52-protruding strip, 53-displacement port, 54-radial support arm, 55-arc-shaped hanging plate, 56-baffle, 57-lifting plate, 58-inner pressing strip, 59-support rod, 60-flat lifting arm. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] See Figures 1 to 2 As shown, a wafer heat treatment apparatus includes a support platform 1, a heating cover 2 is provided on the support platform 1, and a placement base 4 is connected to the support platform 1 through a support component 3. The heating cover 2 covers a heating area on the support platform 1. A heating ring component and a wafer support component are provided in the heating area. After the wafer is positioned by the wafer support component, the wafer is heated by the heating ring component.

[0031] The heating ring assembly described above includes a positioning frame and a heating unit 7. The heating unit 7 is mounted on the positioning frame. The heating cover 2 has a transparent observation area. The positioning frame is connected to a driving device. The driving device can control the heating ring assembly to rotate. The wafer carrier assembly is surrounded by the heating ring assembly, thereby enabling the heating of the wafer.

[0032] The positioning frame is movably connected to the heating cover 2 so as not to affect the rotation of the positioning frame. For example, a limiting groove is provided on the inner wall of the heating cover 2, and an annular limiting plate 6 that fits in the limiting groove is provided on the positioning frame, so that the positioning frame has a certain stability when rotating. The heating unit 7 is annular and there are several of them. The several heating units 7 are arranged vertically and are all connected to the positioning frame.

[0033] See Figures 2 to 4As shown, the positioning frame includes two main upright arms 8, both extending vertically. The two main upright arms 8 are connected by a ring body 9. An annular limiting plate 6 is connected to both main upright arms 8. Both ends of the ring body 9 are flat, meaning that the upper end of each main upright arm 8 is connected to the ring body 9. Vertically extending strip-shaped openings are provided on the main upright arms 8. Two positioning plates are also provided on the main upright arms 8, located near both ends of the main upright arms 8. Each main upright arm 8 is connected to a transmission rod 10 through the positioning plate. The transmission rod 10 is rotatable and is connected to the main upright arm 8. Arm 8 is parallel, and transmission rod 10 passes through positioning plate. Intermediate positioning seat 11, upper positioning seat 12 and lower positioning seat 13 are connected to transmission rod 10, and all three are connected to positioning clamps. The annular heating unit 7 is connected to the positioning clamps. The intermediate positioning seat 11 is movably connected to transmission rod 10. When transmission rod 10 rotates, it will not move intermediate positioning seat 11, but it will move upper positioning seat 12 and lower positioning seat 13 up and down respectively. Thus, the distance between two adjacent heating units 7 can be adjusted by rotating transmission rod 10.

[0034] Specifically, the aforementioned transmission rod 10 is a bidirectional threaded screw, with an annular groove provided in the middle position of the bidirectional threaded screw. The intermediate positioning seat 11 is located in the annular groove, meaning that the intermediate positioning seat 11 can rotate relative to the bidirectional threaded screw. The upper positioning seat 12 and the lower positioning seat 13 are both provided with through holes, and screw nuts are provided in the through holes. The screw nuts are connected to the bidirectional threaded screw. When the bidirectional threaded screw rotates, it can drive the upper positioning seat 12 and the lower positioning seat 13 to move. There are several upper positioning seats 12 and several lower positioning seats 13, thereby enabling the positioning of several heating units 7.

[0035] See Figure 5 As shown, the positioning clamp includes a pull plate 14 with a notch. An arc-shaped clamping strip 15 is fitted inside the notch. The clamping strip 15 can slide inside the notch and moves in an arc-shaped trajectory. However, the clamping strip 15 cannot be completely removed from the notch. Specifically, a locking pin 16 is screwed onto the pull plate 14. The lower end of the locking pin 16 is located inside the notch. A trajectory groove 17 is provided on the clamping strip 15. After the clamping strip 15 is connected to the pull plate 14, the lower end of the locking pin 16 is located inside the trajectory groove 17. When the clamping strip 15 moves to the point where the end of the locking pin 16 contacts the end of the trajectory groove 17, the clamping strip 15 cannot continue to move. By screwing the locking pin 16, the lower end of the locking pin 16 can be pressed against the clamping strip 15, thus achieving the positioning of the clamping strip 15.

[0036] A slot 18 is provided on the inner arc surface of the clamping bar 15. The outer arc surface of the heating unit 7 can fit into the slot 18. When positioning and installing the heating unit 7, the clamping bar 15 is moved first so that the locking pin 16 contacts the end of the track groove 17. Then the heating unit 7 and the clamping bar 15 are engaged. At this time, the clamping bar 15 can make arc-shaped trajectory movement and the center of the arc coincides with the center of the heating unit 7. When the clamping bar 15 makes arc-shaped trajectory movement until the locking pin 16 is located at the two equal parts of the length of the clamping bar 15, the movement of the clamping bar 15 is stopped. The clamping bar 15 is positioned by turning the locking pin 16. At this time, the clamping bar 15 and the pull plate 14 cannot move relative to each other.

[0037] A horizontally extending flat lifting arm 60 is fixed on the aforementioned pull plate 14. The flat lifting arm 60 passes through the strip-shaped opening and is fixed on the corresponding positioning seat. At this time, the positioning clamp and the corresponding positioning seat are connected to form a positioning assembly.

[0038] See Figures 2 to 4 As shown, a transmission gear 19 is fixed at the upper end of the transmission rod 10, and a rotatable drive component is connected to the ring body 9. The drive component meshes with the transmission gear 19. When the drive component rotates, it can cause the transmission rod 10 to rotate, thereby adjusting the vertical movement of the heating unit 7.

[0039] The aforementioned transmission component includes an annular transmission disk 20. A mating groove is provided on the bottom surface of the transmission disk 20. The mating groove is annular and extends so that the upper end of the annular body 9 can fit into the mating groove. At this time, the transmission disk 20 can rotate. An internal gear ring 21 is provided below the transmission disk 20. The internal gear ring 21 meshes with the transmission gear 19. The transmission disk 20 and the internal gear ring 21 are connected by a hanging cylinder 22, so that there is a certain vertical distance between the internal gear ring 21 and the transmission disk 20. When the transmission disk 20 is controlled to rotate, it can drive the internal gear ring 21 to rotate, and then drive the transmission rod 10 to rotate through the transmission gear 19. Since the transmission rod 10 is a bidirectional threaded screw, it can move the upper positioning seat 12 and the lower positioning seat 13 respectively, and the two move in opposite directions, thereby adjusting the distance between two adjacent heating units 7 and changing the ambient temperature of the wafer.

[0040] To facilitate the adjustment of the position of the heating unit 7, the heating cover 2 is provided with an arc-shaped opening at the same level as the transmission disk 20, allowing a hand or tool to pass through the arc-shaped opening and contact the transmission disk 20. A handle for easy operation can be provided on the transmission disk 20, which, together with the observation area on the heating cover 2, allows observation of the heating unit 7. After the position of the heating unit 7 is adjusted, a radially extending threaded hole is provided on the transmission disk 20, which is connected to a mating groove. A locking screw is screwed into the threaded hole. By tightening the locking screw, the transmission disk 20 can be tightly connected to the ring 9, and the ring 9 and the transmission disk 20 can rotate simultaneously.

[0041] The aforementioned positioning frame also includes a hanger 23, which is connected to the annular body 9. The aforementioned driving device includes a drive motor 24 and a reducer 25, which are connected to each other. Both are installed at the top of the heating cover 2. The output shaft of the reducer 25 passes through the heating cover 2 and docks with the hanger 23. When the drive motor 24 is working, it can make the hanger 23 rotate, thereby making the annular body 9 and the transmission disc 20 and other components rotate. That is, at this time, the top positioning frame can rotate.

[0042] See Figures 1 to 2 As shown, a tray 26 and an outer cover 27 are also connected to the heating cover 2. The tray 26 is fixedly connected to the heating cover 2, while the outer cover is movably connected to the heating cover 2. For example, an external thread area is provided on the heating cover 2, and an internal thread is provided near the upper end of the outer cover 27, so that the outer cover 27 is screwed to the heating cover 2. When the outer cover rotates, it can move vertically. When the lower end of the outer cover abuts against the tray 26, the outer cover covers the arc-shaped opening on the heating cover 2. At this time, the heat inside the heating cover 2 will not dissipate quickly from the arc-shaped opening.

[0043] In this technical solution, the wafer carrier assembly can also rotate. The wafer carrier assembly is movably connected to the carrier platform 1 and is connected to the positioning frame. When the positioning frame rotates, it can drive the wafer carrier assembly to rotate.

[0044] For details, please refer to Figures 6 to 8As shown, a central opening and an annular guide groove are provided on the support platform 1. The guide groove is coaxially arranged with the central opening. The wafer support assembly includes a central seat and a support base 32. The central seat is assembled in the central opening and can rotate within the central opening. A guide ring 28 is assembled in the guide groove. The guide ring 28 has external and internal convex teeth. The guide ring 28 meshes with the lower end of the positioning frame through the external convex teeth. An internal drive gear 29 is provided on the support platform 1. The internal drive gear 29 meshes with the internal convex teeth, and the central seat meshes with the internal drive gear 29. A bottom gear ring 30 is fixed at the lower end of the positioning frame. When the positioning frame rotates... The center seat can be rotated by the cooperation of the guide ring 28 and the internal drive gear 29. The center seat is provided with an assembly socket 31, which vertically passes through the center seat and connects the center seat to the carrier seat 32. The wafer is placed on the carrier seat 32, and then the carrier seat 32 is docked with the center seat. During the process of heating the wafer, the heating unit 7 starts to rotate, and at the same time, the carrier seat 32 rotates, so that the wafer and the heating unit 7 move relative to each other, forming a dynamic rotating heat source. The rotating heat source means that the heat field is no longer static, thus averaging the heat input in time and space.

[0045] See Figure 6 and Figure 7 As shown, the central seat includes a cylindrical base plate 33, and an assembly socket 31 is located at the center of the base plate 33. The cross-section of the assembly socket 31 is square or circular. A threaded blind hole is provided on the lower surface of the base plate 33. A fixing plate is provided at the bottom of the bearing seat 32. A through hole is provided on the fixing plate, which can be aligned with the threaded blind hole. Then, the fixing plate is connected to the reference plate by screws, thereby connecting the bearing seat 32 to the central seat. The rotation of the central seat drives the bearing seat 32 to rotate.

[0046] To increase the uniformity of heating of the wafer, the wafer can not only be rotated horizontally, but also flipped vertically during the process, so that both the front and back sides of the wafer can be heated.

[0047] The base plate 33 has an upper limit plate 34 and a lower limit plate 35 on its circumferential surface. The bearing platform 1 is located between the upper limit plate 34 and the lower limit plate 35. The upper limit plate 34 has toothed grooves on its circumferential surface, allowing it to mesh with the internal drive gear 29. An arc-shaped track bar 36 is provided in the area between the guide ring 28 and the center seat. The center of the arc of the track bar 36 is located on the central axis of the center seat. The track bar 36 is connected to the bearing platform 1 by a straight rod 37. Two roller assemblies are provided on the upper surface of the base plate 33. The components are symmetrically arranged, and a support frame is provided on the carrier 32 to connect the wafer to the support frame and realize the positioning of the wafer. After the carrier 32 is inserted through the assembly socket 31 and the fixing plate is docked with the base plate 33, the support frame can cooperate with the chuck assembly. When the base plate 33 rotates, the chuck assembly can make a circumferential trajectory movement. During this process, the chuck assembly cooperates with the track bar 36 to make the wafer on the support frame vertically flip, thereby realizing the multi-dimensional flipping and movement of the wafer, so that both the front and back sides can be heated.

[0048] Specifically, the upper surface of the track bar 36 is provided with protruding teeth, which are arranged along the length of the track bar 36. The chuck assembly includes a side support plate 38, the inner side of which is provided with a longitudinal groove 39. A flat shaft 40 passes through the side support plate 38, the inner end of which is located in the longitudinal groove 39, and the outer end of which is located outside the side support plate 38. A small gear is provided at the inner end of the flat shaft 40, and an external drive gear 41 is fixed at the outer end of the flat shaft 40. When the base plate 33 rotates, the external drive gear 41 performs a circular motion. During the movement of the external drive gear 41, it can mesh with the track bar 36, thereby causing the small gear at the inner end of the flat shaft 40 to rotate.

[0049] See Figure 8 As shown, the aforementioned support frame includes a support arm 42, the lower end of which is fixed to the bearing seat 32, and the upper end of which is connected to a support frame 43. The support frame 43 is U-shaped and is connected to an annular positioning seat 44 via a short shaft 45. A mating gear 46 is fixed at the outer end of the short shaft 45. The mating gear 46 can mesh with a pinion. The longitudinal groove 39 on the side support plate 38 is connected to the mounting socket 31 on the base plate 33. After the bearing seat 32 is inserted into the mounting socket 31, the mating gear 46 can enter the longitudinal groove 39. Finally, when the fixed plate is connected to the base plate 33, the mating gear 46 located at the outer end of the short shaft 45 meshes with the external drive gear 41. When the external drive gear 41 rotates, it can drive the mating gear 46 to rotate, thereby driving the annular positioning seat 44 to rotate around the short shaft 45. Since the wafer is clamped and positioned by the annular positioning seat 44, the wafer is vertically flipped.

[0050] See Figures 8 to 10As shown, when the wafer is positioned by the annular positioning seat 44, the wafer is in a state that is almost "mechanically suspended". That is, the wafer is positioned by contacting the wafer through several tiny contact points. Specifically, the annular positioning seat 44 includes a central ring body 47, which is connected to a short axis 45. Several radial holes are provided on the central ring body 47. A locking ring 48 and locking pins 49 are connected to the central ring body 47. There are several locking pins 49, and each locking pin 49 is located in a corresponding radial hole. By rotating the locking ring 48, the locking pins 49 can be moved. The inner end of the locking pin 49 abuts against the wafer. As the locking ring 48 rotates gradually, the squeezing force of the locking pin 49 on the wafer gradually increases.

[0051] Specifically, the locking ring 48 is connected to a slip ring 51 via an inner support rod 50. The slip ring 51 is sleeved on the central ring body 47, at which point the slip ring 51 is located to the side of the radial hole. A protruding strip 52 is provided on the inner side of the locking ring 48. The two ends of the protruding strip 52 have different thicknesses, that is, the thickness of the protruding strip 52 gradually increases from one end to the other. A long strip-shaped displacement port 53 is provided on the locking ring 48, which passes through both the locking ring 48 and the protruding strip 52. The aforementioned locking needle 49 includes a needle bar, which passes through the radial hole and the displacement port 53. A guide sleeve is fixed on the central ring body 47, and the guide sleeve is sleeved on the needle bar. The rod is equipped with a pressure pad and a support pad. The support pad is fixedly connected to the needle rod, and the pressure pad is sleeved on the needle rod. A compression return spring is provided between the pressure pad and the support pad. The compression return spring is sleeved on the needle rod. The pressure pad is located inside the locking ring 48. When the locking ring 48 rotates, it can apply force to the needle rod through the protruding strip 52, so that the inner end of the needle rod abuts against the circumferential surface of the wafer. The needle rod is provided with an external thread, and a locking nut is screwed on through the external thread. The locking nut is located outside the locking ring 48. After the locking ring 48 is rotated to the required position (so that the needle rod abuts against the wafer), the locking nut is rotated to lock the locking ring 48.

[0052] A plurality of radial support arms 5442 are provided on the aforementioned central ring 47. Each radial support arm 5442 has an arc-shaped hanging plate 55 fixed to its outer end. The center of the arc of the hanging plate 55 is located on the central axis of the central ring 47. A side notch is provided on the arc-shaped hanging plate 55, with a convex cross-section. A baffle 56 is connected to the arc-shaped hanging plate 55, and the baffle 56 can pass through the side notch. At this time, the baffle 56 is slidably connected to the arc-shaped hanging plate 55. A lifting plate 57 is fixed to the outer end of the plate 56. The lifting plate 57 is also arc-shaped and the center of the arc is located on the central axis of the central ring body 47. An inner pressing strip 58 is fixed to the inner surface of the lifting plate 57. The two ends of the inner pressing strip 58 have different thicknesses. A support rod 59 is provided on the locking ring 48. The support rod 59 extends along the axial direction of the locking ring 48. The baffle 56 can slide by rotating the locking ring 48. After rotating the locking ring 48 in the opposite direction, the baffle 56 can be reset and moved.

[0053] Specifically, a return spring is connected between the baffle 56 and the arc-shaped hanging plate 55. The return spring has a restoring force after compression. A positioning strip is fixed on the baffle 56, and the two ends of the return spring are connected to the positioning strip and the arc-shaped hanging plate 55, respectively. At this time, an outward pushing space is formed between the lifting plate 57 and the arc-shaped hanging plate 55. When the locking ring 48 rotates, the support rod 59 can enter the outward pushing space. As the locking ring 48 gradually rotates, the baffle 56 moves away from the center of the central ring 47. During this process, the return spring is compressed. When positioning the wafer, the central ring 47 is adjusted to a horizontal state. At this time, the inner end of the baffle 56 is located in the area surrounded by the central ring 47, which can support the wafer. After the wafer is placed in the central ring 47, the locking pin 49 can lock the wafer by rotating the locking ring 48. Then, by continuing to rotate the locking ring 48, the baffle 56 can move away from the center of the central ring 47, so that the baffle 56 no longer partially covers the wafer, which is beneficial to the subsequent heating of the wafer.

[0054] This technical solution enables the back side of the wafer to be fully exposed to a uniform thermal radiation field. Furthermore, during the wafer heating process, the wafer can be rotated in both horizontal and vertical directions, ultimately achieving uniform heating, reducing wafer deformation, and improving yield.

[0055] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer heat treatment apparatus, characterized in that, include: Platform (1); A heating area is set on the support platform (1), and a heating ring assembly and a wafer support assembly are provided in the heating area; The wafer carrier assembly is used to position the wafer, and when the wafer carrier assembly rotates, it enables the wafer to be vertically flipped. The heating ring assembly includes a positioning frame, which is connected to the wafer carrier assembly. When the positioning frame rotates, it drives the wafer carrier assembly to rotate. The heating ring assembly also includes a ring-shaped heating unit (7), which consists of several units and is connected to a positioning frame. The distance between adjacent heating units (7) can be adjusted through the positioning frame. The positioning frame includes: Main support arms (8), there are two of them and they are set in parallel to each other; The annular body (9) is connected to the upper ends of the two main vertical arms (8); A strip-shaped opening is provided on the main vertical arm (8) and extends vertically; A positioning clip passes through a strip-shaped opening and is used to connect the heating unit (7); The wafer carrier assembly includes: The center seat is connected to the bearing platform (1), and the positioning frame can drive the center seat to rotate when it rotates; The assembly socket (31) is set on the center seat and extends vertically through the center seat; The support base (32) is installed in the assembly socket (31) to support the wafer and can rotate simultaneously with the center base.

2. The wafer heat treatment apparatus according to claim 1, characterized in that, The positioning clip includes: The pull plate (14) has a notch; A clamping bar (15) is provided within the notch and is movable within the notch; The flat boom (60) passes through the strip opening and is connected to the pull plate (14).

3. The wafer heat treatment apparatus according to claim 1, characterized in that, The positioning clamp is connected to a positioning seat, and the positioning seat is connected to a transmission rod (10). The transmission rod (10) is connected to the main upright arm (8). The positioning clamp can be moved by rotating the transmission rod (10).

4. The wafer heat treatment apparatus according to claim 3, characterized in that, A driving component is connected to the annular body (9), and a transmission gear (19) is meshed with the driving component. The transmission gear (19) is set on the transmission rod (10). During the rotation of the driving component, the transmission rod (10) is rotated.

5. The wafer heat treatment apparatus according to claim 1, characterized in that, The support seat (32) is provided with a support frame, and the support frame is equipped with a roller assembly. The roller assembly is set on the center seat. When the support seat (32) is connected to the center seat, the support frame is connected to the roller assembly.

6. The wafer heat treatment apparatus according to claim 5, characterized in that, The support frame includes: Support arm (42); A support frame (43) is connected to the upper end of a support arm (42); A short shaft (45) is horizontally set and passes through the support frame (43). The outer end of the short shaft (45) is fixed with a mating gear (46), which is connected to the chuck assembly through the mating gear (46). The annular positioning seat (44) is aligned with the inner end of the short axis (45) for positioning the wafer.

7. The wafer heat treatment apparatus according to claim 6, characterized in that, The bearing platform (1) is provided with a track bar (36). The track bar (36) is arc-shaped and the center of the arc is located on the central axis of the central seat. During the rotation of the central seat, the chuck assembly makes a circular motion. After the chuck assembly is coupled with the track bar (36), the annular positioning seat (44) flips.

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