Control method and system of laser debonding and film tearing all-in-one machine

Abstract

The invention provides a control method of a laser debonding and film tearing all-in-one machine, and belongs to the technical field of wafer processing, and the method comprises the steps: picking up a wafer substrate through a front-end transmission arm based on the state data of a wafer placement box, and obtaining the wafer positioning data through a positioning measurement module; based on wafer positioning data, a wafer substrate is conveyed to a pretreatment station through a process cavity conveying mechanical arm, pre-cleaning treatment is conducted through an air knife dust removal module, and the wafer substrate is conveyed to a carrying table to be preheated; carrying out bonding layer separation on the wafer substrate based on a laser de-bonding module; a glass carrier plate is separated from a wafer substrate on the basis of a glass shifting module, the separated glass carrier plate is stored in a glass carrier plate placing box through a front-end conveying arm, the wafer substrate is conveyed to a film tearing module to peel off a protective film, and the wafer substrate is transferred back to the wafer placing box after being subjected to secondary cleaning treatment on the basis of an air knife dust removal module. Therefore, the damage to the wafer substrate caused by transmission deviation is avoided, and the repeated utilization rate of the glass carrier plate and the integrity of the wafer substrate are improved.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, and more specifically, relates to a control method and system for an integrated laser debonding and film peeling machine. Background Technology

[0002] In the wafer substrate processing flow, in order to protect its surface circuit structure, it is often necessary to form a temporary support by bonding the bonding layer to the glass substrate. At the same time, a protective film is applied to the surface of the wafer substrate to prevent scratches. Subsequently, the bonding layer separation and protective film peeling need to be completed in sequence.

[0003] Existing laser debonding and film peeling integrated machines lack coordination. The timing between their conveyor arms is preset manually, and the gripping posture is fixed. This can easily lead to misalignment of the wafer substrate due to conveyor offset. Furthermore, the separation of glass substrates often uses rigid clamping methods, which can easily cause damage to the edges of the substrate or the surface of the wafer. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a control method and system for an integrated laser debonding and film-removing machine. This addresses the technical issues in the prior art, where traditional integrated laser debonding and film-removing machines lack coordination, are prone to misalignment of the wafer substrate due to transport offset, and often employ rigid clamping methods for glass carrier separation, which can easily cause damage to the carrier edge or wafer surface.

[0005] The purpose and effectiveness of the control method and system for the laser debonding and film peeling integrated machine of the present invention are achieved by the following specific technical means: The control method for the laser debonding and film-peeling integrated machine includes the following steps: Step S1: Based on the wafer placement box status data, the wafer substrate is picked up from the wafer placement box by the front-end conveyor arm, and the wafer positioning data is obtained by the positioning measurement module; based on the wafer positioning data, the wafer substrate is conveyed to the pre-processing station by the process cavity conveyor robot arm. Step S2: Start the air knife dust removal module to pre-clean the wafer substrate on the pre-processing station, and transfer the wafer substrate to the carrier for preheating; Step S3: Separate the bonding layers of the wafer substrate based on the laser debonding module; Step S4: Based on the glass pick module, the glass carrier is separated from the wafer substrate, and the separated glass carrier is transferred to the buffer platform for temporary storage, and then stored in the glass carrier placement box by the front-end conveyor arm; Step S5: After separating the glass substrate, the wafer substrate is transferred to the film peeling module to peel off the protective film. After secondary cleaning based on the air knife dust removal module, it is transferred by the process cavity transfer robot arm to the wafer substrate buffer platform for temporary storage. Step S6: Transfer the wafer substrate from the wafer substrate buffer platform back into the wafer placement cassette via the front-end transfer arm.

[0006] According to a preferred embodiment, the step of picking up a wafer substrate from the wafer placement cassette via a front-end conveyor arm based on wafer placement cassette status data and acquiring wafer positioning data via a positioning measurement module includes: Based on the material presence signal of the wafer placement box, the vacuum suction cup of the front-end conveyor arm is controlled to adhere to the surface of the wafer substrate and generate negative pressure adsorption. After picking up a single wafer substrate, it is removed from the placement box. The picked-up wafer substrate is then transferred to the positioning and measurement module. The positioning and measurement module uses an industrial camera to capture feature points on the surface of the wafer substrate and calculates the center offset value and rotation angle through image algorithms to obtain wafer positioning data.

[0007] According to a preferred embodiment, the step of transferring the wafer substrate to the pre-processing station via a process cavity transfer robot based on wafer positioning data includes: Based on wafer positioning data, the control system adjusts the gripping posture of the process cavity transfer robot arm and transports the wafer substrate to the pre-processing station along the circular track.

[0008] According to a preferred embodiment, the method further includes: The air knife dust removal module generates a high-pressure clean airflow through the air knife, which scans and blows along the surface of the wafer substrate at a uniform speed. After purging, the wafer substrate is transferred to the stage for preheating. The heating module on the stage uses a PID temperature control algorithm to heat the wafer substrate to the process temperature.

[0009] According to a preferred embodiment, the separation of the bonding layer of the wafer substrate based on the laser debonding module includes: The preheated wafer substrate is transferred to the laser debonding module, which is then controlled to scan along the bonding interface between the wafer substrate and the glass carrier along a preset path to decompose the bonding layer and achieve initial separation.

[0010] According to a preferred embodiment, the process of separating the glass carrier from the wafer substrate using a glass pick module, transferring the separated glass carrier to a buffer platform for temporary storage, and then storing it in a glass carrier placement box via a front-end conveyor arm includes: The Bernoulli suction head is controlled by the glass pick module to approach the surface of the glass substrate, and compressed air is introduced to form a negative pressure air film. After adsorbing the glass substrate, it is lifted and separated from the wafer substrate. Based on the separation signal of the glass substrate after separation, the front-end conveying arm is controlled to switch to the glass adapter suction cup, grab the glass substrate and convey it to the glass substrate buffer platform for temporary storage. Then, the front-end conveying arm is controlled to convey the glass substrate along the circular track to the designated cell of the glass substrate placement box.

[0011] According to a preferred embodiment, the process of transferring the wafer substrate after separating the glass carrier to the film-peeling module to remove the protective film, performing secondary cleaning based on the air knife dust removal module, and then transferring it by the process chamber transfer robot arm to the wafer substrate buffer platform for temporary storage includes: After the glass carrier is separated, the wafer substrate is conveyed to the film peeling module. The vacuum suction cup is controlled to fix the edge of the wafer substrate, and the film peeling roller descends to adhere to the surface of the protective film and generate pre-adhesive force. The film peeling module is controlled to peel off the residual film according to the angle, speed and tension curve set in the program, and the residual film is wound up by the knurling spindle. The wafer substrate is then conveyed to the air knife dust removal module. The air knife is controlled to adjust to the preset airflow intensity, scans and blows away the residual film debris on the surface of the wafer substrate, and obtains the wafer substrate position data. Based on the wafer substrate position data, the process cavity transfer robot arm is controlled to grasp the wafer substrate, transport it along a circular track to the wafer substrate buffer platform for placement, and obtain temporary data based on the wafer substrate buffer platform.

[0012] According to a preferred embodiment, the method further includes: controlling the front-end transmission arm to switch back to the wafer substrate adapter suction cup based on the temporary data, grabbing the wafer substrate on the buffer platform; transferring the wafer substrate to the wafer placement box, and outputting a processing completion signal.

[0013] The control system of the laser debonding and film-peeling integrated machine includes: The robotic arm scheduling module is used to control the front-end conveyor arm to switch the suction cup type and perform wafer substrate gripping and glass carrier gripping actions according to the wafer placement box status data. According to the wafer positioning data and wafer position data, the module controls the process cavity conveyor robotic arm to adjust the gripping posture and convey the wafer substrate along the circular track to the pre-processing station, laser debonding station, film peeling station and buffer platform. The positioning and measurement module is used to control the industrial camera to capture feature points on the surface of the wafer substrate, calculate the center offset value and rotation angle through image algorithms, generate and output wafer positioning data to the robotic arm scheduling module; The pretreatment module controls the air knife dust removal module to generate a high-pressure clean airflow of preset intensity, which performs a uniform scanning and blowing action along the surface of the wafer substrate. At the same time, it controls the heating module on the stage to use a PID temperature control algorithm to heat the wafer substrate to the process temperature. The laser debonding module is used to perform scanning along the bonding interface between the wafer substrate and the glass carrier along a preset path, so as to decompose the bonding layer and achieve preliminary separation. The carrier separation module is used to control the Bernoulli adsorption head on the glass pick module to approach the surface of the glass carrier to form a negative pressure air film according to the bonding layer separation signal, and perform adsorption separation action; at the same time, according to the glass carrier separation signal, the front-end conveying arm is controlled to convey the glass carrier to the glass carrier buffer platform for temporary storage, and then transferred to the designated compartment of the glass carrier placement box. The film peeling module is used to perform the protective film peeling action according to the preset angle, speed and tension curve, and to wind up the residual film by the knurled spindle.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Positioning data is acquired through the positioning measurement module and transmitted to the robotic arm scheduling module. Based on this positioning data, the robotic arm scheduling module dynamically adjusts the gripping posture of the process cavity conveying robotic arm to ensure that the relative position of the robotic arm and the wafer substrate is matched. Then, it controls the robotic arm to be accurately conveyed along the circular track to the pre-processing station. This ensures that the wafer substrate can maintain alignment with each module when entering subsequent stations such as pre-processing, laser debonding, and film peeling, avoiding process parameter failure or wafer substrate damage caused by conveying offset.

[0015] 2. The carrier separation module controls the glass pick-up module to use a Bernoulli suction head to approach the surface of the glass carrier. Compressed air is introduced to form a negative pressure air film. The suction force of the air film is used to gently pick up the glass carrier, avoiding hard contact with the edge of the carrier or the surface of the wafer substrate, thus reducing problems such as carrier edge damage and wafer surface scratches. After separation, the carrier separation module simultaneously triggers the front-end transfer arm to switch to the glass adapter suction cup, transferring the glass carrier to the glass carrier buffer platform for temporary storage, and then transferring it to the designated slot in the placement box. This avoids secondary damage during manual transfer or hard clamping and transportation, improving the reusability of the glass carrier and the surface integrity of the wafer substrate. Attached Figure Description

[0016] Figure 1 This is a flowchart of the control method for the laser debonding and film peeling integrated machine of the present invention. Detailed Implementation

[0017] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0018] Example:

[0019] As attached Figure 1 As shown: This invention provides a control method for a laser debonding and film-peeling integrated machine, comprising the following steps: Step S1: Based on the wafer placement box status data, the wafer substrate is picked up from the wafer placement box by the front-end conveyor arm, and the wafer positioning data is obtained by the positioning measurement module; based on the wafer positioning data, the wafer substrate is conveyed to the pre-processing station by the process cavity conveyor robot arm. Specifically, photoelectric sensors within the wafer placement cassette detect the presence of wafer substrates in each compartment, acquiring a material presence signal and sending the compartment coordinates to the front-end conveyor arm. This controls the vacuum suction cup at the end of the front-end conveyor arm to descend and contact the wafer substrate surface. A vacuum generator activates, creating negative pressure. After the suction cup adheres to the wafer substrate, the front-end conveyor arm moves the wafer substrate out of the wafer placement cassette along a preset path. Next, the front-end conveyor arm transfers the grasped wafer substrate to a positioning and measurement module. At least two industrial cameras in the positioning and measurement module capture images of feature points on the wafer substrate surface. These images are transmitted to an image processing unit, where edge detection algorithms extract the coordinates of the feature points. The offset between the actual center coordinates of the wafer substrate and the stage reference center is calculated using the least squares method. The rotation angle is calculated using the angle between the line connecting the feature points and the reference axis, thus obtaining the wafer positioning data. Based on the acquired wafer positioning data, the system sends adjustment instructions to the process cavity transfer robot arm. The end effector of the robot arm rotates by a corresponding angle according to the rotation angle and fine-tunes the gripping position according to the center offset value to ensure that the gripping center of the actuator is aligned with the actual center of the wafer substrate. Subsequently, the robot arm holds the wafer substrate and moves it along the guide groove of the circular track. The position encoder on the track provides real-time feedback on the position of the robot arm and places the wafer substrate on the pre-processing station.

[0020] Furthermore, the vacuum suction cup gripping method of the front-end transfer arm can avoid scratches on the surface of the wafer substrate caused by mechanical clamping, and the stability of negative pressure adsorption ensures that the wafer substrate will not fall off during the transfer process; the positioning measurement module uses positioning data acquired by dual cameras to provide an adjustment basis for the process cavity transfer robot arm, avoiding misalignment in subsequent processes due to wafer substrate placement misalignment; the process cavity transfer robot arm moves along a circular track, which can reduce the space occupied by the equipment.

[0021] Step S2: Start the air knife dust removal module to pre-clean the wafer substrate on the pre-processing station, and transfer the wafer substrate to the carrier for preheating; Specifically, the air knife dust removal module generates a high-pressure clean airflow through the air knife, which scans the wafer substrate radially from the edge to the center at a uniform speed. The impurities generated by the blowing are sucked away by the negative pressure dust suction port below with the airflow, preventing the impurities from re-adhering to the surface of the wafer substrate.

[0022] After purging, the process chamber transfer robot moves the wafer substrate along a circular track to the preheating stage, placing it stably on the stage surface. Multiple evenly distributed heating tubes are embedded inside the stage, connected to temperature sensors. The temperature sensors collect the wafer substrate's temperature in real time and transmit it to the control unit. The control unit uses a PID temperature control algorithm to adjust the heating tube power: when the collected temperature is lower than the process temperature setpoint, the heating tube power is increased; when the temperature is higher than the setpoint, the heating tube power is reduced or cut off, raising the wafer substrate to the process temperature and ensuring that the bonding layer between the wafer substrate and the glass substrate reaches a suitable softening state.

[0023] Furthermore, the function of air knife dust removal is to remove tiny impurities on the surface of the wafer substrate, so as to avoid impurities affecting the adsorption capacity between the platform and the wafer in the later stage, inconsistent laser beam process intensity during laser debonding, or embedding of the bonding layer during heating, affecting the separation effect; the function of using PID temperature control algorithm for stage preheating is to ensure temperature stability and prevent uneven softening of the bonding layer due to temperature fluctuations, which would affect the consistency of debonding.

[0024] Step S3: Separate the bonding layer of the wafer substrate based on the laser debonding module. The laser energy acts on the bonding layer to destroy the intermolecular bonding force, thereby achieving the initial separation of the wafer substrate from the glass carrier.

[0025] Specifically, after preheating, the robotic arm in the process chamber, based on the preheating completion signal from the stage, again grasps the wafer substrate and transports it along the circular track to the platform at the bottom of the laser debonding module. The platform's vacuum chuck adheres to and fixes the bottom of the wafer substrate, ensuring that it does not shift during scanning. The laser generator of the laser debonding module is adjusted to preset parameters, and after the laser beam is focused by the optical lens, the focal point is aligned with the bonding layer between the wafer substrate and the glass carrier. The laser head is controlled to scan at a uniform speed along the bonding interface along a preset path, ensuring that the laser energy is concentrated on the bonding layer without damaging the surface of the wafer substrate or the glass carrier. After absorbing the laser energy, the molecular chains of the bonding layer break, gradually losing their adhesiveness, creating a tiny gap between the wafer substrate and the glass carrier, completing the initial separation.

[0026] Step S4: The glass carrier is completely separated from the wafer substrate using the glass pick module, and the glass carrier is temporarily stored and collected by the front-end conveyor arm to avoid damage or contamination caused by random placement of the separated glass carrier.

[0027] Specifically, after the laser debonding module completes the initial separation, the Bernoulli adsorption head of the glass pick module slowly descends from above the glass substrate until it stops 1-2 mm from the surface of the glass substrate. Compressed air is introduced into the adsorption head, and the air flows out evenly along the edge of the adsorption head, forming a negative pressure air film between the adsorption head and the glass substrate. The adsorption force generated by the air pressure difference adsorbs the glass substrate. Subsequently, the adsorption head completely separates the glass substrate from the wafer substrate, avoiding edge cracking of the glass substrate or scratches on the surface of the wafer substrate. After separation, it is conveyed to the glass substrate buffer platform, where the front-end conveying arm grabs the glass substrate and, according to the slot availability signal of the glass substrate placement box, conveys it to the designated slot in the placement box, releases and resets, completing the storage of the glass substrate.

[0028] Step S5: After the glass substrate is separated, the process chamber transfer robot arm grabs the separated wafer substrate according to the separation completion signal of the glass pick module and transfers it to the film peeling module along the circular track. Then, the protective film on the surface of the wafer substrate is peeled off by the film peeling module. After peeling, it is transferred to the air knife dust removal module for secondary cleaning to remove residual film debris. Finally, the process chamber transfer robot arm moves it to the wafer substrate buffer platform for temporary storage, waiting for subsequent transfer.

[0029] Specifically, the wafer substrate is held in place by a vacuum suction cup on the bottom platform of the film-peeling module, which generates negative pressure to adhere and fix the edges of the wafer substrate, ensuring that it does not slip or warp during the film-peeling process. The silicone film-peeling roller of the film-peeling module descends to contact the surface of the protective film, and the pressure applied by the cylinder generates a pre-adhesive force, causing the film-peeling roller to adhere to the protective film. Then, the film-peeling roller is controlled to move at a uniform speed along the tangent direction of the wafer substrate at a programmed tilt angle and speed. At the same time, a preset tension curve is called according to the adhesive parameters of the protective film to avoid sudden tension changes that could cause the wafer substrate to bend or the protective film to break and remain. The peeled protective film is wound up by a knurled spindle at a speed matched to that of the film-peeling roller to prevent the protective film from falling randomly and causing contamination.

[0030] After the film is removed, the process chamber transfer robot arm grabs the wafer substrate again and transfers it to the cleaning station of the air knife dust removal module. The air knife dust removal module performs secondary cleaning, sucking away the film debris and tiny impurities generated by the blowing, and acquiring the wafer substrate position data. Based on this position data, the system sends an adjustment command to the process chamber transfer robot arm. The robot arm fine-tunes the gripping angle and position to ensure that the center of the wafer substrate is aligned with the gripping center of the robot arm. Then, it is smoothly transferred to the wafer substrate buffer platform along the circular track.

[0031] Step S6: While the wafer substrate is temporarily stored on the buffer platform, the system acquires the grid status of the wafer placement box again. When it detects that there is an empty grid in the placement box and no other wafers to be processed, the front-end transfer arm is activated to transfer the wafer substrate on the wafer substrate buffer platform back to the wafer placement box, completing the end of the entire processing flow.

[0032] Specifically, the system calls upon the temporary data uploaded by the wafer substrate buffer platform. Based on this data, it sends instructions to the front-end delivery arm, controlling its end effector to switch back to the wafer substrate-compatible suction cup. This adapts to the surface curvature of common wafer substrates, avoiding damage caused by hard contact. The front-end delivery arm fine-tunes its movement path according to the position coordinates in the temporary data, ensuring that the center of the suction cup is aligned with the actual center of the wafer substrate. Subsequently, the suction cup slowly descends to contact the surface of the wafer substrate. The vacuum generator activates to generate negative pressure. After the suction cup adsorbs the wafer substrate, the system receives real-time position feedback signals from the front-end delivery arm. The placement box's grid indicator lights up, indicating the specific location of the vacant grid. The front-end delivery arm adjusts its posture to keep the wafer substrate horizontal, descending above the support platform within the grid. After confirming no offset, it shuts off the vacuum generator, releasing the negative pressure to place the wafer substrate stably in the grid. The arm rises and exits the placement box, simultaneously sending a placement completion signal to the system. The system binds the wafer substrate's processing number, processing time, detection status, and other information to the placement grid, stores it in the database, and triggers the output of a processing completion signal.

[0033] This invention also provides a control system for a laser debonding and film-peeling integrated machine, comprising: The robotic arm scheduling module is electrically connected to the photoelectric sensors, positioning measurement module, and signal sensors at each workstation of the wafer placement cassette. It receives real-time data on the wafer placement cassette status, wafer positioning, and wafer position. During operation, based on the material presence signal in the wafer placement cassette, the robotic arm scheduling module sends commands to the front-end arm, controlling its end effector to switch suction cup types. Simultaneously, based on the wafer positioning data transmitted by the positioning measurement module and the wafer position data fed back from each workstation, it sends posture adjustment commands to the robotic arm in the process cavity. This controls the joints of the robotic arm to rotate by the corresponding angle and fine-tune the gripping position, ensuring that the gripping center is aligned with the actual center of the wafer substrate. The robotic arm then moves along the guide groove of the circular track, precisely transferring the wafer substrate to the pre-processing station, laser debonding station, film peeling station, and buffer platform. Its function is to achieve coordinated action and path planning between the two robotic arms, avoiding offset and collisions during the transfer process.

[0034] The positioning and measurement module connects to two industrial cameras and an image processing unit. In operation, the industrial cameras first capture images of the wafer substrate placed on the stage, covering feature points on the substrate surface. After the images are transmitted to the image processing unit, the module uses an edge detection algorithm to extract the pixel coordinates of the feature points. Then, it calculates the offset between the actual center of the wafer substrate and the reference center of the stage using the least squares method. The rotation angle is calculated by the angle between the line connecting the feature points and the reference axis, generating wafer positioning data with specific values, which is then transmitted in real-time to the robotic arm scheduling module. Its function is to provide precise positional information for the robotic arm's grasping and conveying, solving the workstation alignment problem caused by wafer placement misalignment.

[0035] The positioning and measurement module also includes a step sensor, which is used to distinguish the height difference between the inner and outer rings of the wafer and obtain the height difference data. This data is then used to adjust the height of the inner and outer rings of the platform so that it can correspond to the wafer to be processed and better match the state of the wafer.

[0036] The pre-processing module is connected to the air compressor, filter, heating tube, and temperature sensor of the air knife dust removal module. During operation, it first receives a wafer arrival signal from the robotic arm scheduling module, then controls the air knife dust removal module to start generating a high-pressure clean airflow. The air knife scans the wafer substrate radially from the edge to the center at a uniform speed, while the negative pressure suction port below simultaneously removes impurities. After purging, the module sends a transfer command to the robotic arm in the process chamber, transferring the wafer substrate to the preheating stage. Subsequently, it controls the heating tubes within the stage to be energized and heated. The temperature sensor collects the stage surface temperature in real time and feeds it back to the module. The module uses a PID temperature control algorithm to adjust the heating tube power. Its function is to remove impurities from the wafer surface and soften the bonding layer, preparing for subsequent debonding.

[0037] The laser debonding module connects to the laser generator, optical lens assembly, and vacuum chuck of the work platform. During operation, it receives a preheating completion signal from the preprocessing module. First, it controls the vacuum chuck of the work platform to initiate adsorption and fixation of the wafer substrate. Then, it controls the laser generator to emit ultraviolet laser light. After the laser beam is focused by the optical lens assembly, the focal point is aligned with the bonding layer between the wafer substrate and the glass substrate. Subsequently, the module controls the laser head to move along a preset spiral path, ensuring that the laser energy is concentrated on the bonding layer. Its function is to break the molecular chains of the bonding layer through laser energy, achieving the initial separation of the wafer from the glass substrate.

[0038] The carrier plate separation module connects to the Bernoulli adsorption head, air pressure valve, and front-end conveying arm of the glass pick module. During operation, it receives a bond layer separation signal from the laser debonding module. First, it controls the Bernoulli adsorption head to descend 1-2mm above the glass carrier plate. Then, it opens the air pressure valve to introduce compressed air, creating a negative pressure air film between the adsorption head and the glass carrier plate. After adsorbing the glass carrier plate, it slowly rises to complete the separation. After separation, the module sends a switching command to the front-end conveying arm, controlling it to switch to a glass-adaptive suction cup. This cup picks up the glass carrier plate and conveys it to the glass carrier plate buffer platform. Once the buffer platform sensor confirms stable placement, the module again controls the front-end conveying arm to convey the glass carrier plate along a circular track to an empty slot in the glass carrier plate placement box. Its function is to achieve non-destructive separation and orderly storage of the glass carrier plates, avoiding damage caused by hard contact.

[0039] The film peeling module is used to perform the protective film peeling action according to the preset angle, speed and tension curve, and to wind up the residual film by the knurled spindle.

[0040] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A control method of a laser debonding and film tearing all-in-one machine, characterized in that, The method comprises the following steps: Step S1: based on wafer placement box state data, pick up the wafer substrate from the wafer placement box through the front-end conveying arm, and obtain the wafer positioning data through the positioning measurement module; Based on the wafer positioning data, the wafer substrate is conveyed to the pretreatment station by the process cavity conveying mechanical arm; Step S2: start the air knife dust removal module to perform pre-cleaning treatment on the wafer substrate on the pretreatment station, and convey the wafer substrate to the stage for preheating; Step S3: based on the laser debonding module, the wafer substrate is subjected to bond layer separation; Step S4: based on the glass sheet module, the glass carrier plate is separated from the wafer substrate, and the separated glass carrier plate is transferred to the buffer platform for temporary storage, and is received into the glass carrier plate placement box through the front-end conveying arm; Step S5: after separating the glass carrier plate, the wafer substrate is conveyed to the film peeling module to peel off the protective film, and after secondary cleaning treatment based on the air knife dust removal module, the wafer substrate is conveyed to the wafer substrate buffer platform for temporary storage by the process cavity conveying mechanical arm; Step S6: the wafer substrate on the wafer substrate buffer platform is transferred back to the wafer placement box by the front-end conveying arm.

2. The control method of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that, Based on the wafer placement box state data, the wafer substrate is picked up from the wafer placement box by the front-end conveying arm, and the wafer positioning data is obtained by the positioning measurement module, which comprises: Based on the material existence signal of the wafer placement box, the vacuum chuck of the front-end conveying arm is controlled to adhere to the surface of the wafer substrate and generate negative pressure adsorption, and after grabbing the single wafer substrate, the wafer placement box is moved out; the grabbed wafer substrate is conveyed to the positioning measurement module, the positioning measurement module captures the feature points on the surface of the wafer substrate based on the industrial camera, calculates the center offset value and the rotation angle through the image algorithm, and obtains the wafer positioning data.

3. The control method of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that, Based on the wafer positioning data, the wafer substrate is conveyed to the pretreatment station by the process cavity conveying mechanical arm, which comprises: Based on the wafer positioning data, the process cavity conveying mechanical arm is controlled to adjust the grabbing posture, and the wafer substrate is conveyed to the pretreatment station along the annular track.

4. The control method of the laser debonding and film tearing all-in-one machine according to claim 3, characterized in that, The method further comprises: The air knife dust removal module generates a high-pressure clean airflow through the air knife, and uniformly scans and blows along the surface of the wafer substrate at a constant speed; After the blowing is completed, the wafer substrate is conveyed to the stage for preheating, and the heating module on the stage adopts the PID temperature control algorithm to heat the wafer substrate to the process temperature.

5. The control method of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that, The wafer substrate is conveyed to the laser debonding module after preheating, and the laser debonding module is controlled to scan along the bonding interface between the wafer substrate and the glass carrier plate according to a preset path, so that the bond layer is decomposed to achieve preliminary separation. The glass sheet module separates the glass carrier plate from the wafer substrate, and transfers the separated glass carrier plate to the buffer platform for temporary storage, and receives the glass carrier plate into the glass carrier plate placement box through the front-end conveying arm, which comprises:

6. The control method of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that, ​ The Bernoulli adsorption head of the glass chip module is controlled to be close to the surface of the glass carrier plate, compressed air is introduced to form a negative pressure air film, the glass carrier plate is adsorbed, and the glass carrier plate and the wafer substrate are separated; based on the glass carrier plate separation signal after the separation is completed, the front-end conveying arm is controlled to switch to a glass adaptive suction cup, the glass carrier plate is grabbed and conveyed to a glass carrier plate buffer platform for temporary storage; then the front-end conveying arm is controlled to convey the glass carrier plate along the annular track to a designated position of a glass carrier plate placing box.

7. The control method of the laser debonding and film tearing all-in-one machine according to claim 1, characterized in that, The wafer substrate after the glass carrier plate is separated is conveyed to a film tearing module to peel off the protective film, and after secondary cleaning treatment by the air knife dust removal module, the wafer substrate is conveyed to a wafer substrate buffer platform for temporary storage by a process cavity conveying mechanical arm, including: The wafer substrate after the glass carrier plate is separated is conveyed to a film tearing module, a vacuum suction cup is controlled to fix the edge of the wafer substrate, a film tearing roller is lowered to adhere to the surface of the protective film and generate a pre-adhesion force, the film tearing module is controlled to perform residual film peeling at a preset angle, speed and tension curve, and the residual film is wound by a knurled spindle; the wafer substrate is conveyed to an air knife dust removal module, the air knife is controlled to be adjusted to a preset air flow intensity, the surface of the wafer substrate is scanned and blown to remove residual film dust, and wafer substrate position data is obtained; Based on the wafer substrate position data, the process cavity conveying mechanical arm is controlled to grab the wafer substrate and convey it to the wafer substrate buffer platform along the annular track, and temporary storage data is obtained based on the wafer substrate buffer platform.

8. The control method of the laser debonding and film tearing all-in-one machine according to claim 7, characterized in that, The method further includes: Based on the temporary storage data, the front-end conveying arm is controlled to switch back to the wafer substrate adaptive suction cup to grab the wafer substrate on the buffer platform; the wafer substrate is conveyed to a wafer placing box, and a processing completion signal is output.

9. The control system of the laser debonding and film tearing integrated machine, characterized in that, Including: A mechanical arm scheduling module is configured to control the front-end conveying arm to switch the type of suction cup and perform wafer substrate grabbing and glass carrier plate grabbing actions according to wafer placing box state data, and control the process cavity conveying mechanical arm to adjust the grabbing posture according to wafer positioning data and wafer position data, and convey the wafer substrate to a pretreatment station, a laser debonding station, a film tearing station and a buffer platform along the annular track; A positioning measurement module is configured to control an industrial camera to shoot characteristic points on the surface of the wafer substrate, calculate a center offset value and a rotation angle through image algorithm, and generate and output wafer positioning data to the mechanical arm scheduling module; A pretreatment module is configured to control the air knife dust removal module to generate a high-pressure clean air flow with a preset intensity, and perform uniform-speed scanning and blowing actions along the surface of the wafer substrate, while controlling a heating module on the stage to use a PID temperature control algorithm to heat the wafer substrate to a process temperature; A laser debonding module is configured to perform scanning actions along the bonding interface of the wafer substrate and the glass carrier plate according to a preset path, so that the bonding layer is decomposed to achieve preliminary separation; A carrier plate separation module is configured to control the Bernoulli adsorption head of the glass chip module to form a negative pressure air film close to the surface of the glass carrier plate according to the bonding layer separation signal, and perform adsorption and separation actions; and control the front-end conveying arm to convey the glass carrier plate to the glass carrier plate buffer platform for temporary storage, and then move it to a designated position of a glass carrier plate placing box; A film tearing module is configured to perform protective film peeling actions according to a preset angle, speed and tension curve, and wind the residual film by a knurled spindle.

Images