Design method and system of narrow linewidth laser light source based on temperature and current double closed loop

Abstract

The application provides a temperature and current double closed loop based narrow linewidth laser light source design method and system, obtains a measured temperature value of a laser gain medium; calculates a temperature deviation value between the measured temperature value and a preset target temperature value, and converts the deviation value into a flow rate control signal; drives a heat transfer structure by using the flow rate control signal, generates adjusted temperature distribution data; generates a driving current compensation parameter based on the adjusted temperature distribution data; generates a temperature and current collaborative instruction based on a thermal resistance parameter and a thermal capacity parameter of the heat transfer structure; adjusts a wavelength deviation amount of a lasing wavelength of the laser light source relative to a preset target wavelength according to the temperature and current collaborative instruction, so as to realize temperature and current double closed loop based narrow linewidth laser light source design; and the technical scheme provided by the application realizes high-precision adjustment of the wavelength of the laser light source, and improves the stability and output precision of the narrow linewidth laser light source.

Description

Technical Field

[0001] This application relates to the field of laser physics technology, and in particular to a design method and system for narrow linewidth laser sources based on a dual closed-loop system of temperature and current. Background Technology

[0002] In high-precision optical measurement fields, such as spectral analysis, interferometry, and lidar applications, extremely high requirements are placed on the wavelength stability and linewidth control of laser sources. Especially under operating conditions with large fluctuations in ambient temperature, the thermal effects inside the laser can easily cause lasing wavelength drift and linewidth broadening, thereby affecting measurement accuracy and system performance.

[0003] To address these challenges, current research has proposed laser source control schemes based on a combination of single-loop temperature feedback and fixed current compensation. This scheme integrates a thermoelectric cooler and a distributed temperature sensing network to monitor and regulate the temperature field of the laser gain medium in real time. Simultaneously, a set of empirical current compensation values ​​is preset in the system to offset carrier concentration shifts caused by temperature changes. However, existing schemes have certain limitations. For example, their response speed and control precision to heat distribution are limited, making it difficult to suppress temperature gradient changes within the laser gain medium. Furthermore, the preset current compensation strategy lacks adaptability, failing to dynamically adjust the driving current based on real-time thermal conditions, resulting in incomplete compensation for carrier concentration changes, which in turn leads to wavelength drift and linewidth broadening. Summary of the Invention

[0004] This application provides a design method and system for narrow linewidth laser sources based on temperature and current dual closed loops, in order to solve the problems in the prior art, such as difficulty in suppressing temperature changes inside the laser gain medium; lack of adaptive capability; and easy occurrence of wavelength drift and linewidth broadening.

[0005] In the first aspect, this application provides a design method for narrow-linewidth laser sources based on a dual closed-loop system of temperature and current, including:

[0006] Obtain the measured temperature value of the laser gain medium;

[0007] Calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal;

[0008] The flow rate control signal is used to drive the heat transfer structure to control the heat transfer structure to perform heat exchange operation with the laser gain medium, thereby generating adjusted temperature distribution data.

[0009] Based on the adjusted temperature distribution data, the change in carrier concentration in the laser gain medium is calculated, and the change in concentration is converted into driving current compensation parameters.

[0010] Based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameters are processed in a coordinated manner to generate a temperature-current coordinated command.

[0011] According to the temperature and current coordinated command, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is adjusted to realize the design of a narrow linewidth laser source based on temperature and current dual closed loop.

[0012] Optionally, calculating the temperature deviation between the measured temperature value and the preset target temperature value, and converting the deviation value into a flow rate control signal, includes:

[0013] The temperature deviation value is obtained by subtracting the measured temperature value from the preset target temperature value.

[0014] The sign of the temperature deviation value is used as the flow direction symbol identifier. According to the preset symbol instruction conversion rule, the flow direction symbol identifier is converted into an instruction to obtain the flow control instruction.

[0015] The absolute value of the temperature deviation is compared with a preset flow rate intensity relationship table to determine the flow rate intensity value corresponding to the temperature deviation.

[0016] The initial flow rate adjustment amount is obtained by multiplying the flow rate intensity value and the preset flow rate gain coefficient.

[0017] Based on the thermal inertia time constant of the heat transfer structure, the initial flow rate adjustment is subjected to a first-order low-pass filter to obtain a smooth flow rate adjustment.

[0018] A flow rate control signal is generated based on the flow control command and the smooth flow rate adjustment amount.

[0019] Optionally, the flow rate control signal is used to drive the heat transfer structure to control the heat transfer structure to perform heat exchange operations with the laser gain medium, generating adjusted temperature distribution data, including:

[0020] The analog voltage value of the flow rate control signal is compared with a preset voltage-flow rate relationship table to determine the flow rate value corresponding to the analog voltage value, and the flow rate value is used as the target flow rate value of the heat exchange medium.

[0021] The heat transfer structure is driven by the target flow rate value to transfer the heat exchange medium to the internal circulation channel of the heat transfer structure, thereby obtaining flow state parameters.

[0022] Based on the flow state parameters, the heat transfer structure and the laser gain medium are subjected to heat exchange operation to obtain the temperature distribution data of the laser gain medium;

[0023] Based on the deviation between the temperature distribution data and the preset target distribution, the target flow rate value is adjusted to obtain adjusted temperature distribution data that meets the preset temperature control accuracy.

[0024] Optionally, based on the adjusted temperature distribution data, the change in carrier concentration in the laser gain medium is calculated, and the change in concentration is converted into driving current compensation parameters, including:

[0025] The maximum temperature gradient direction vector in the adjusted temperature distribution data is multiplied by the preset semiconductor band parameters to obtain the conduction band electron concentration offset.

[0026] The maximum temperature gradient value in the adjusted temperature distribution data is multiplied by the preset valence band hole mobility parameter to obtain the valence band hole concentration offset.

[0027] The concentration shift of the conduction band electrons and the concentration shift of the valence band holes are superimposed to obtain the change in carrier concentration in the laser gain medium.

[0028] According to the preset carrier current conversion rule, the concentration change is converted to obtain the equivalent current change.

[0029] The equivalent current change is processed to obtain the drive current compensation parameters.

[0030] Optionally, the equivalent current change is processed to obtain drive current compensation parameters, including:

[0031] According to the semiconductor material type identifier, a sign conversion coefficient is set, and the equivalent current change and the sign conversion coefficient are multiplied to obtain a signed current value. When the semiconductor material type identifier is a first conductivity type identifier, the sign conversion coefficient is set to a positive polarity coefficient, and when the semiconductor material type identifier is a second conductivity type identifier, the sign conversion coefficient is set to a negative polarity coefficient.

[0032] The preset minimum input current value, maximum input current value, minimum control voltage value, and maximum control voltage value are linearly transformed to obtain the current-voltage conversion ratio coefficient and voltage reference offset.

[0033] Based on the signed current value, the current-to-voltage conversion ratio, and the voltage reference offset, a drive control voltage signal is generated;

[0034] According to the preset digital encoding rules, the drive control voltage signal is encoded into instructions to obtain drive current compensation parameters.

[0035] Optionally, based on the thermal resistance and heat capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameters are processed collaboratively to generate a temperature-current collaborative command, including:

[0036] Based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the heat transfer time constant is calculated, and the heat transfer time constant is multiplied by the maximum temperature gradient value in the adjusted temperature distribution data to obtain the temperature-current coupling factor.

[0037] The temperature-current coupling factor and the driving current compensation parameter are multiplied to obtain the current cooperative correction amount.

[0038] Based on the adjusted temperature distribution data, the average temperature of the space is calculated, and the difference between the average temperature of the space and the preset target temperature is calculated to obtain the average temperature deviation.

[0039] The average temperature deviation and the preset flow compensation coefficient are multiplied to obtain the flow compensation increment of the temperature closed loop.

[0040] The coordinated control parameters are obtained by weighted summing of the current collaborative correction amount and the flow compensation increment.

[0041] The coordinated control parameters are converted into instructions to obtain temperature and current coordinated instructions.

[0042] Optionally, according to the temperature-current coordinated command, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is adjusted to achieve a narrow linewidth laser source design based on temperature and current dual closed loops, including:

[0043] According to the current control parameters in the temperature-current coordination command, the driving current of the laser gain medium is adjusted until the fluctuation amplitude of the driving current within a preset number of detections is less than the first preset threshold, and a current stability indicator is generated.

[0044] According to the flow control parameters in the temperature-current coordinated command, the flow rate of the heat exchange medium is adjusted until the standard deviation of the temperature distribution data is less than the second preset threshold within a preset number of detections, and then a temperature stability indicator is generated.

[0045] When the current stability indicator and temperature stability indicator are generated simultaneously, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is calculated.

[0046] If the wavelength deviation is greater than the preset wavelength locking threshold, the current control parameters and flow control parameters are adjusted until the wavelength deviation is less than the preset wavelength locking threshold, so as to realize the design of a narrow linewidth laser source based on temperature and current dual closed loop.

[0047] Secondly, this application provides a narrow-linewidth laser source design system based on a dual closed-loop system of temperature and current, including:

[0048] The acquisition module is used to acquire the measured temperature value of the laser gain medium;

[0049] The calculation module is used to calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal;

[0050] The control module is used to drive the heat transfer structure using the flow rate control signal to control the heat transfer structure to perform heat exchange operation with the laser gain medium and generate adjusted temperature distribution data.

[0051] The conversion module calculates the change in carrier concentration in the laser gain medium based on the adjusted temperature distribution data, and converts the change in concentration into driving current compensation parameters.

[0052] The coordination module is used to coordinate the adjusted temperature distribution data and the driving current compensation parameters based on the thermal resistance and thermal capacity parameters of the heat transfer structure to generate a temperature-current coordination command.

[0053] The adjustment module is used to adjust the wavelength deviation of the laser source wavelength relative to the preset target wavelength according to the temperature and current coordinated command, so as to realize the narrow linewidth laser source design based on temperature and current dual closed loop.

[0054] Thirdly, this application provides a computing device, including a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are invoked and executed by the processing component to implement the narrow linewidth laser source design method based on temperature and current dual closed loops as described in the first aspect above.

[0055] Fourthly, this application provides a computer storage medium storing a computer program, which, when executed by a computer, implements the narrow linewidth laser source design method based on temperature and current dual closed loops as described in the first aspect.

[0056] In this application, the measured temperature value of the laser gain medium is obtained; the temperature deviation between the measured temperature value and a preset target temperature value is calculated, and the deviation value is converted into a flow rate control signal; the flow rate control signal is used to drive a heat transfer structure to control the heat transfer structure to perform heat exchange operations with the laser gain medium, generating adjusted temperature distribution data; based on the adjusted temperature distribution data, the change in carrier concentration in the laser gain medium is calculated, and the change in concentration is converted into a driving current compensation parameter; based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameter are processed collaboratively to generate a temperature-current collaborative command; according to the temperature-current collaborative command, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is adjusted to achieve a narrow linewidth laser source design based on temperature and current dual closed loops. The technical solution provided in this application obtains the measured temperature value of the laser gain medium, providing basic data support for subsequent precise thermal management. It improves the timeliness and accuracy of thermal response, uses a flow rate control signal to drive the heat transfer structure to perform heat exchange operations, and suppresses heat accumulation and temperature gradient formation caused by environmental disturbances or changes in workload. This allows current regulation to closely follow thermal evolution, achieving dynamic tracking and compensation for carrier distribution imbalances. Furthermore, by combining the thermal resistance and thermal capacity characteristics of the heat transfer structure itself, the temperature regulation results and current compensation parameters are processed collaboratively, avoiding lag or overshoot in control actions. A dual-dimensional linkage frequency stabilization mechanism of temperature and current is achieved, improving the wavelength stability and spectral purity of the laser output. Further, this application analyzes the regulated temperature distribution data, extracts the direction and amplitude of the maximum temperature gradient, calculates the concentration shift of conduction band electrons and valence band holes, and superimposes them to obtain the carrier concentration change. Based on the physical conversion rules between carriers and driving current, this concentration change is converted into an equivalent current change, obtaining the driving current compensation parameters. This solves the technical bottlenecks of thermal and electrical regulation disconnection, response lag, and insufficient compensation under single-loop control in existing technologies.

[0057] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0058] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0059] Figure 1 A flowchart illustrating the narrow-linewidth laser source design method based on temperature and current dual closed loops provided in this application;

[0060] Figure 2 A schematic diagram of the narrow linewidth laser source design system based on temperature and current dual closed loops provided in this application;

[0061] Figure 3 A schematic diagram of the structure of a computing device provided in this application. Detailed Implementation

[0062] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0063] In some of the processes described in the specification, claims, and accompanying drawings of this application, multiple operations appearing in a specific order are included. However, it should be clearly understood that these operations may not be executed in the order they appear herein, or may be executed in parallel. The operation numbers, such as 101, 102, etc., are merely used to distinguish different operations and do not themselves represent any execution order. Furthermore, these processes may include more or fewer operations, and these operations may be executed sequentially or in parallel. It should be noted that the descriptions such as "first," "second," etc., in this document are used to distinguish different messages, devices, modules, etc., and do not represent a chronological order, nor do they limit "first" and "second" to different types.

[0064] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0065] To address the technical challenge of wavelength drift and linewidth broadening in lasers caused by ambient temperature fluctuations in high-precision optical measurement scenarios, existing solutions combining single-loop temperature control with fixed current compensation suffer from insufficient thermal response speed, difficulty in suppressing temperature gradients within the gain medium, and a lack of real-time tracking capability for dynamic thermally induced carrier changes, resulting in inadequate compensation and limited stability. Therefore, this application constructs an active thermal control loop that uses real-time temperature deviation to drive flow rate adjustment, achieving rapid and precise control of the thermal distribution in the laser gain region. Based on the adjusted temperature field, it dynamically calculates carrier concentration changes and generates adaptive current compensation parameters, comprehensively improving the wavelength stability and spectral purity of the laser output.

[0066] Figure 1 A flowchart of a narrow-linewidth laser source design method based on a dual closed-loop system of temperature and current is provided for embodiments of this application, such as... Figure 1As shown, the method includes:

[0067] Step 101: Obtain the measured temperature value of the laser gain medium.

[0068] In this step, the laser gain medium refers to the semiconductor material that generates laser light, used to convert electrical energy into coherent light. The measured temperature value refers to the set of surface temperature data of the laser gain medium acquired through a contact thermocouple array.

[0069] In this embodiment, the measured temperature values ​​of multiple detection points of the laser gain medium are acquired in real time.

[0070] Step 102: Calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal.

[0071] In this step, the preset target temperature value refers to the temperature reference value set according to the laser wavelength stability requirements. The temperature deviation value refers to the difference between the average measured temperature and the target temperature value, used to drive the cooling system. The flow rate control signal is an analog signal used to control the micro-pump flow rate to achieve heat exchange rate regulation.

[0072] Step 103: Use the flow rate control signal to drive the heat transfer structure to control the heat transfer structure to perform heat exchange operation with the laser gain medium, and generate adjusted temperature distribution data.

[0073] In this step, the heat transfer structure refers to a composite component containing microchannels and a copper heat sink for rapid heat dissipation. The conditioned temperature distribution data refers to a structured dataset encapsulating the maximum temperature gradient value and the maximum eigenvector.

[0074] Step 104: Based on the adjusted temperature distribution data, calculate the change in carrier concentration in the laser gain medium, and convert the change in concentration into driving current compensation parameters.

[0075] In this step, the change in carrier concentration refers to the sum of the changes in the concentrations of conduction band electrons and valence band holes caused by the temperature gradient. The driving current compensation parameter refers to a digital command signal used to compensate for thermally induced carrier concentration fluctuations.

[0076] Step 105: Based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameters are processed together to generate a temperature-current coordinated command.

[0077] In this step, the thermal resistance parameter refers to the thermal resistance value of the heat transfer structure, reflecting the resistance to heat transfer. The heat capacity parameter refers to the heat capacity value of the heat transfer structure, characterizing the heat storage capacity. The temperature-current coordinated command refers to a multi-dimensional control vector containing current control and temperature control sections.

[0078] Step 106: According to the temperature and current coordination command, adjust the wavelength deviation of the laser source wavelength relative to the preset target wavelength to realize the design of a narrow linewidth laser source based on temperature and current dual closed loop.

[0079] In this step, the laser source refers to a distributed feedback laser. The lasing wavelength refers to the actual output wavelength of the laser, modulated by temperature and carrier concentration. The preset target wavelength refers to the nominal operating wavelength of the laser. The wavelength deviation refers to the difference between the lasing wavelength and the target wavelength, used for closed-loop feedback. Narrow linewidth laser source design refers to a light source system architecture that achieves stable laser linewidth through dual closed-loop control of temperature and current.

[0080] This application embodiment suppresses thermal frequency shift by dynamically regulating the flow rate of the heat exchange medium through a temperature closed loop, and suppresses electro-induced noise by compensating for carrier concentration changes through a current closed loop; the dual closed-loop collaborative processing overcomes the thermo-electric coupling bottleneck and improves the stability of the laser wavelength; based on the quantification of the interaction between temperature and current based on the heat transfer structure parameters, the lasing wavelength is rapidly locked, ultimately achieving the goal of high-precision control of the narrow linewidth laser source.

[0081] This application provides a specific embodiment. Step 102 involves calculating the temperature deviation between the measured temperature value and the preset target temperature value, and converting the deviation value into a flow rate control signal. This specifically includes the following steps:

[0082] Step 201: Subtract the measured temperature value from the preset target temperature value to obtain the temperature deviation value.

[0083] In this step, the preset symbol instruction conversion rules refer to the pre-stored symbol action mapping table, which is used to convert mathematical symbols into physical control actions.

[0084] In this embodiment, an arithmetic logic unit performs a subtraction operation between the measured temperature value and the preset target temperature value to generate a signed temperature deviation value, wherein a positive deviation indicates that cooling needs to be enhanced and a negative deviation indicates that cooling needs to be weakened.

[0085] Step 202: Use the sign of the temperature deviation value as the flow direction symbol identifier, and convert the flow direction symbol identifier into a flow control instruction according to the preset symbol instruction conversion rule.

[0086] In this step, the flow control command refers to the control quantity that characterizes the flow direction of the cooling medium.

[0087] In this embodiment, the mathematical symbol of the temperature deviation value is extracted as the flow direction symbol identifier; by querying the preset symbol instruction conversion rule, the positive symbol identifier is converted into an increase cooling instruction, and the negative symbol identifier is converted into a decrease cooling instruction. The increase cooling instruction and the decrease cooling instruction are aggregated to obtain the flow control instruction.

[0088] Step 203: Compare the absolute value of the temperature deviation with the preset flow rate intensity relationship table to determine the flow rate intensity value corresponding to the temperature deviation.

[0089] In this step, the preset flow rate intensity relationship table refers to a two-dimensional table that defines a piecewise linear correspondence between the absolute value of the temperature deviation and the flow rate intensity value, reflecting the non-linear demand of the deviation on the cooling intensity. The flow rate intensity value refers to a dimensionless proportionality coefficient used to quantify the cooling intensity demand.

[0090] In this embodiment of the application, the absolute value of the temperature deviation is taken, and the corresponding flow rate intensity value is matched in a preset flow rate intensity relationship table according to the numerical range in which the absolute value is located.

[0091] Step 204: Multiply the flow rate intensity value and the preset flow gain coefficient to obtain the initial flow rate adjustment amount.

[0092] In this step, the preset flow gain coefficient refers to a physical constant determined by the microchannel cross-sectional area and the medium viscosity, used to convert the flow velocity intensity value into the actual flow rate value. The initial flow velocity adjustment amount refers to the signed flow rate setpoint.

[0093] In this embodiment, the flow rate intensity value is multiplied by a preset flow rate gain coefficient to generate an initial flow rate adjustment amount, wherein the flow rate gain coefficient is determined by the geometric parameters of the heat transfer structure and the medium characteristics, and is used to convert the intensity value into a physical flow rate value.

[0094] Step 205: Based on the thermal inertia time constant of the heat transfer structure, perform a first-order low-pass filter on the initial flow rate adjustment to obtain a smooth flow rate adjustment.

[0095] In this step, the thermal inertia time constant refers to a parameter characterizing the thermal response delay of the heat transfer structure and is used to determine the filter cutoff frequency. The smoothed flow rate adjustment refers to the flow rate setpoint after low-pass filtering, eliminating abrupt noise and ensuring the stability of flow rate regulation.

[0096] In this embodiment, the cutoff frequency of a first-order low-pass filter is constructed based on the thermal inertia time constant of the heat transfer structure to filter the initial flow rate adjustment amount and obtain a smooth flow rate adjustment amount.

[0097] Step 206: Generate a flow rate control signal according to the flow control command and the smooth flow rate adjustment amount.

[0098] In this embodiment, if the flow control command is to increase cooling, a positive smooth flow rate adjustment amount is output; if it is to decrease cooling, a negative smooth flow rate adjustment amount is output; the positive or negative smooth flow rate adjustment amount is converted into an analog voltage signal by a digital-to-analog converter to generate a flow rate control signal.

[0099] This application embodiment achieves precise mapping of temperature deviation direction to flow action through symbol instruction conversion rules, matches nonlinear cooling requirements through flow rate intensity relationship table, and suppresses flow rate mutations by combining thermal inertia filtering, generating a smooth and executable flow rate control signal, thereby improving the response speed and stability of temperature closed loop.

[0100] This application provides a specific embodiment. Step 103 involves using the flow rate control signal to drive the heat transfer structure, thereby controlling the heat transfer structure to perform heat exchange operations with the laser gain medium, and generating adjusted temperature distribution data. This specifically includes the following steps:

[0101] Step 301: Compare the analog voltage value of the flow rate control signal with a preset voltage-flow rate relationship table to determine the flow rate value corresponding to the analog voltage value, and use the flow rate value as the target flow rate value of the heat exchange medium.

[0102] In this step, the simulated voltage value refers to the amplitude of the flow rate control signal, reflecting the strength of the flow rate command. The preset voltage-flow rate relationship table is a two-dimensional data table storing the mapping relationship between voltage and flow rate values, used to convert electrical signals into physical flow rate values. The flow rate value refers to the volumetric flow rate of the heat exchange medium, characterizing the volume of medium flowing through the channel per unit time. The heat exchange medium refers to the working fluid used for heat transfer, possessing high specific heat capacity and low viscosity characteristics. The target flow rate value refers to the ideal flow rate reference value set by the system.

[0103] In this embodiment, the analog voltage value of the flow rate control signal is read, the flow rate value corresponding to the analog voltage value is looked up in a preset voltage-flow rate relationship table, and the flow rate value is set as the target flow rate value of the heat exchange medium.

[0104] Step 302: Drive the heat transfer structure using the target flow rate value to transfer the heat exchange medium to the internal circulation channel of the heat transfer structure to obtain flow state parameters.

[0105] In this step, the internal circulation channel refers to the microscale flow channel network in the heat transfer structure, with a rectangular cross-section, used to constrain the flow path of the medium. Flow state parameters refer to a set of data including real-time flow velocity and pipeline pressure, reflecting the stability of the medium flow.

[0106] In this embodiment, the power output is adjusted according to the target flow rate value to drive the heat exchange medium to flow through the internal circulation channel of the heat transfer structure at a set flow rate, so as to detect the actual flow rate and pressure and generate flow state parameters including flow rate and pressure values.

[0107] Step 303: Based on the flow state parameters, perform a heat exchange operation between the heat transfer structure and the laser gain medium to obtain the temperature distribution data of the laser gain medium.

[0108] In this step, the temperature distribution data refers to the spatial distribution dataset of the surface temperature of the laser gain medium.

[0109] In this embodiment, based on flow state parameters, under stable flow conditions, the contact surface of the heat transfer structure is kept in thermal conduction contact with the laser gain medium to collect the surface temperature reading of the laser gain medium and output the temperature distribution data of the laser gain medium.

[0110] Step 304: Adjust the target flow rate value according to the deviation between the temperature distribution data and the preset target distribution to obtain adjusted temperature distribution data that meets the preset temperature control accuracy.

[0111] In this step, the preset target distribution refers to the ideal temperature field model data. The deviation value refers to the root mean square error between the actual temperature distribution and the target distribution. The preset temperature control accuracy refers to the maximum allowable temperature deviation threshold, which determines the control convergence criterion.

[0112] In this embodiment of the application, the sum of squares of the temperature difference between the temperature distribution data and the corresponding points of the preset target distribution is calculated as the deviation value. If the deviation value exceeds the preset temperature control accuracy, the target flow rate value is adjusted proportionally and the heat exchange operation is re-executed until the adjusted temperature distribution data that meets the preset temperature control accuracy is output.

[0113] This application embodiment achieves accurate conversion of electrical signals to physical flow through voltage-flow mapping, ensures the stability of the heat exchange process through flow state monitoring, and dynamically optimizes flow rate control by combining temperature distribution feedback, generating high-precision temperature field data and improving the thermal management efficiency of the laser.

[0114] This application provides a specific embodiment. Step 104 involves calculating the change in carrier concentration in the laser gain medium based on the adjusted temperature distribution data, and converting the change in concentration into driving current compensation parameters. This specifically includes the following steps:

[0115] Step 401: Multiply the maximum temperature gradient direction vector in the adjusted temperature distribution data with the preset semiconductor band parameters to obtain the conduction band electron concentration offset.

[0116] In this step, the maximum temperature gradient direction vector refers to the spatial direction of the most drastic temperature change, reflecting the dominant conduction direction of heat flow. The preset semiconductor band structure parameters are physical quantities characterizing the thermal diffusivity of conduction band electrons, experimentally determined based on the material's band structure. The conduction band electron concentration shift refers to the change in conduction band electron concentration caused by the temperature gradient.

[0117] In this embodiment, the maximum temperature gradient direction vector in the adjusted temperature distribution data is extracted; it is then multiplied by a preset semiconductor bandgap parameter to obtain the conduction band electron concentration offset.

[0118] Step 402: Multiply the maximum temperature gradient value in the adjusted temperature distribution data with the preset valence band hole mobility parameter to obtain the valence band hole concentration offset.

[0119] In this step, the maximum temperature gradient value refers to the peak value of the spatial rate of change in the temperature distribution, quantifying the intensity of thermal field inhomogeneity. The preset valence band hole mobility parameter refers to a physical quantity reflecting the migration rate of holes in the temperature field, obtained by Hall effect testing. The valence band hole concentration shift refers to the change in valence hole concentration caused by the temperature gradient.

[0120] In this embodiment of the application, the maximum temperature gradient value in the adjusted temperature distribution data is extracted and multiplied by a preset valence band hole mobility parameter to obtain the valence band hole concentration offset.

[0121] Step 403: The conduction band electron concentration shift and the valence band hole concentration shift are superimposed to obtain the carrier concentration change in the laser gain medium.

[0122] In this embodiment, an arithmetic addition operation is performed on the conduction band electron concentration offset and the valence band hole concentration offset to output the total carrier concentration change.

[0123] Step 404: According to the preset carrier current conversion rule, the concentration change is converted to obtain the equivalent current change.

[0124] In this step, the preset carrier current conversion rule defines the relationship between changes in carrier concentration and current conversion. The equivalent current change refers to the amount of current adjustment required to compensate for changes in carrier concentration.

[0125] In this embodiment, a preset carrier current conversion rule is invoked; the concentration change is multiplied by the conversion coefficient to obtain the equivalent current change.

[0126] Step 405: Process the equivalent current change to obtain the drive current compensation parameters.

[0127] In this embodiment, the polarity symbol is selected according to the semiconductor doping type identifier; the equivalent current change is multiplied by the polarity symbol and then input into the range adapter module, which generates the drive current compensation parameters in digital instruction format through analog-to-digital conversion.

[0128] In this embodiment, the temperature gradient direction is quantified into electron concentration shift using semiconductor band parameters, and the temperature gradient amplitude is quantified into hole concentration shift using hole mobility parameters. These are then superimposed to generate the total carrier change. Based on the carrier current conversion rule, an equivalent current compensation is output to generate high-precision driving current compensation parameters, thereby improving the physical accuracy of carrier concentration control.

[0129] This application provides a specific embodiment. Step 405 involves processing the equivalent current change to obtain the drive current compensation parameters, specifically including the following steps:

[0130] Step 411: Based on the semiconductor material type identifier, set the sign conversion coefficient, and multiply the equivalent current change and the sign conversion coefficient to obtain the signed current value. When the semiconductor material type identifier is the first conductivity type identifier, the sign conversion coefficient is set to the positive polarity coefficient. When the semiconductor material type identifier is the second conductivity type identifier, the sign conversion coefficient is set to the negative polarity coefficient.

[0131] In this step, the semiconductor material type identifier refers to the identification information used to distinguish the conductivity type of the semiconductor material. The sign conversion coefficient refers to the coefficient determined based on the semiconductor material type identifier, used to adjust the sign of the equivalent current change, ensuring that the current change conforms to the characteristic requirements of different conductivity types. The signed current value refers to the current value with a positive or negative sign obtained by multiplying the equivalent current change by the sign conversion coefficient. The positive polarity coefficient refers to the sign conversion coefficient set when the semiconductor material type identifier is the first conductivity type identifier; its value is positive, used to maintain the original sign of the equivalent current change. The negative polarity coefficient refers to the sign conversion coefficient set when the semiconductor material type identifier is the second conductivity type identifier; its value is negative, used to change the original sign of the equivalent current change.

[0132] In this embodiment, the semiconductor material type identifier corresponding to the semiconductor material used in the laser gain medium is obtained. The sign conversion coefficient is set according to the specific type of the semiconductor material type identifier. When the semiconductor material type identifier is a first conductivity type identifier, the sign conversion coefficient is set to a positive polarity coefficient; when the semiconductor material type identifier is a second conductivity type identifier, the sign conversion coefficient is set to a negative polarity coefficient. The equivalent current change and the set sign conversion coefficient are multiplied to obtain the signed current value.

[0133] Step 412: Perform a linear transformation on the preset minimum input current value, maximum input current value, minimum control voltage value, and maximum control voltage value to obtain the current-voltage conversion ratio coefficient and voltage reference offset.

[0134] In this step, the preset minimum input current value refers to the minimum current value input to the laser gain medium, used to determine the lower limit of current adjustment. The maximum input current value refers to the maximum current value input to the laser gain medium, used to determine the upper limit of current adjustment. The minimum control voltage value refers to the minimum voltage value that can drive the laser gain medium, used to determine the lower limit of voltage adjustment. The maximum control voltage value refers to the maximum voltage value that can drive the laser gain medium, used to determine the upper limit of voltage adjustment. The current-to-voltage conversion ratio coefficient refers to the ratio coefficient used to convert the current value to the corresponding voltage value. The voltage reference offset refers to the offset voltage value used as a reference during the current-to-voltage conversion process.

[0135] In this embodiment, the preset minimum input current value, maximum input current value, minimum control voltage value, and maximum control voltage value are linearly converted. The conversion formula is: current-voltage conversion ratio coefficient = (maximum control voltage value - minimum control voltage value) ÷ (maximum input current value - minimum input current value), to obtain the current-voltage conversion ratio coefficient; voltage reference offset = minimum control voltage value - (minimum input current value × current-voltage conversion ratio coefficient).

[0136] Step 413: Generate a drive control voltage signal based on the signed current value, the current-to-voltage conversion ratio, and the voltage reference offset.

[0137] In this step, the drive control voltage signal refers to the voltage signal used to drive the laser gain medium.

[0138] In this embodiment, based on the signed current value, the current-to-voltage conversion ratio coefficient, and the voltage reference offset, the calculation formula is: drive control voltage signal = signed current value × current-to-voltage conversion ratio coefficient + voltage reference offset, thus obtaining the drive control voltage signal.

[0139] Step 414: According to the preset digital encoding rules, the drive control voltage signal is encoded into instructions to obtain drive current compensation parameters.

[0140] In this step, the preset digital encoding rule refers to the pre-set rules for converting analog voltage signals into digital instructions, which are used to convert drive control voltage signals into a digital form that can be recognized by the control system.

[0141] In this embodiment, the drive control voltage signal is encoded into a digital instruction according to a preset digital encoding rule, and the drive control voltage signal is converted into a digital instruction conforming to a specific format to obtain drive current compensation parameters. For example, the numerical range of the drive control voltage signal is divided into multiple intervals, each interval corresponding to a unique digital code. The interval in which the drive control voltage signal is located is determined, and the digital code corresponding to that interval is found, thereby converting the drive control voltage signal into a digital instruction conforming to a specific format to obtain drive current compensation parameters.

[0142] This application embodiment adjusts the current sign by semiconductor material type to perform linear conversion between current and voltage, and then encodes the voltage signal into digital instructions to obtain drive current compensation parameters, thereby achieving precise compensation of drive current. By combining the characteristics of different semiconductor materials, it improves the accuracy and applicability of current compensation and provides a reliable basis for current adjustment for the stable operation of laser light sources.

[0143] This application provides a specific embodiment. Step 105 involves co-processing the adjusted temperature distribution data and the driving current compensation parameters based on the thermal resistance and heat capacity parameters of the heat transfer structure to generate a temperature-current coordinated command. This specifically includes the following steps:

[0144] Step 501: Calculate the heat transfer time constant based on the thermal resistance and heat capacity parameters of the heat transfer structure, and multiply the heat transfer time constant with the maximum temperature gradient value in the adjusted temperature distribution data to obtain the temperature-current coupling factor.

[0145] In this step, the heat transfer time constant is a parameter reflecting the magnitude of the thermal inertia of the heat transfer structure, used to characterize the response speed of the heat transfer structure to temperature changes under thermal disturbances. The temperature-current coupling factor is a parameter used to reflect the interaction between temperature changes and current changes.

[0146] In this embodiment, the thermal resistance and thermal capacity parameters of the heat transfer structure are obtained. The heat transfer time constant is calculated by multiplying the thermal resistance and thermal capacity parameters. The calculation formula is: heat transfer time constant = thermal resistance parameter × thermal capacity parameter. Then, the heat transfer time constant is multiplied by the maximum temperature gradient value in the adjusted temperature distribution data to obtain the temperature-current coupling factor. The calculation formula is: temperature-current coupling factor = heat transfer time constant × maximum temperature gradient value in the adjusted temperature distribution data.

[0147] Step 502: Multiply the temperature-current coupling factor and the driving current compensation parameter to obtain the current collaborative correction amount.

[0148] In this step, the current co-correction amount refers to the amount by which the drive current compensation parameters are corrected, so as to make the current regulation more adaptable to temperature changes.

[0149] In this embodiment, the obtained temperature-current coupling factor and driving current compensation parameter are multiplied to obtain the current collaborative correction amount. The calculation formula is: Current collaborative correction amount = Temperature-current coupling factor × Driving current compensation parameter.

[0150] Step 503: Calculate the spatial average temperature based on the adjusted temperature distribution data, and calculate the difference between the spatial average temperature and the preset target temperature to obtain the average temperature deviation.

[0151] In this step, the spatial average temperature refers to the average temperature of the laser gain medium at different spatial locations, reflecting the overall temperature level of the laser gain medium. The preset target temperature refers to the ideal temperature value that the laser gain medium needs to achieve, used as a benchmark for temperature adjustment. The average temperature deviation refers to the difference between the spatial average temperature and the preset target temperature, reflecting the degree of deviation between the overall temperature and the target temperature.

[0152] In this embodiment of the application, based on the adjusted temperature distribution data, the spatial average temperature is obtained by arithmetically averaging the temperature values ​​distributed in different spatial locations. Then, the spatial average temperature is subtracted from the preset target temperature to obtain the average temperature deviation. The calculation formula is: average temperature deviation = spatial average temperature - preset target temperature.

[0153] Step 504: Multiply the average temperature deviation and the preset flow compensation coefficient to obtain the flow compensation increment of the temperature closed loop.

[0154] In this step, the preset flow compensation coefficient refers to the pre-set coefficient used to convert the average temperature deviation into flow regulation, which is used to determine the degree of compensation for the flow of the heat exchange medium based on the temperature deviation; the flow compensation increment of the temperature closed loop refers to the increment value used to regulate the flow of the heat exchange medium calculated based on the temperature deviation.

[0155] In this embodiment of the application, the calculated average temperature deviation and the preset flow compensation coefficient are multiplied to obtain the flow compensation increment of the temperature closed loop. The calculation formula is: flow compensation increment of temperature closed loop = average temperature deviation × preset flow compensation coefficient.

[0156] Step 505: The current collaborative correction amount and the flow compensation increment are weighted and summed to obtain the collaborative control parameters.

[0157] In this step, the coordinated control parameters refer to parameters that comprehensively consider current regulation and temperature regulation, and are used to generate the final coordinated control command.

[0158] In this embodiment, based on the dynamic response characteristics of the heat transfer structure and the wavelength stability requirements of the laser source, a weighting coefficient for the current collaborative correction and a weighting coefficient for the flow compensation increment of the temperature closed loop are preset. The collaborative control parameter is obtained by multiplying the current collaborative correction by its corresponding weighting coefficient and the flow compensation increment of the temperature closed loop by its corresponding weighting coefficient, and then adding the two products together. The calculation formula is: Collaborative control parameter = flow compensation increment of temperature closed loop × weighting coefficient of preset flow compensation increment of temperature closed loop + current collaborative correction × weighting coefficient of preset current collaborative correction.

[0159] Step 506: Convert the coordinated control parameters into commands to obtain temperature and current coordinated commands.

[0160] According to the preset instruction conversion rules, the coordinated control parameters are first decomposed into parameter components of the corresponding current regulation and flow regulation parts. Then, based on the numerical range of the parameter components, each component is converted into a corresponding digital code through a preset digital mapping table. Subsequently, the digital codes are combined to generate a control instruction that conforms to the recognition format of the control system. The control instruction is the temperature and current coordinated instruction.

[0161] This application embodiment combines the thermal resistance and thermal capacity parameters of the heat transfer structure, performs a series of calculations and combination processes on the adjusted temperature distribution data and driving current compensation parameters, generates temperature and current coordinated commands, realizes coordinated control of temperature and current, improves the stability and wavelength control accuracy of the laser source, and provides a reliable control basis for the design of narrow linewidth laser sources.

[0162] This application provides a specific embodiment. Step 106 involves adjusting the wavelength deviation of the laser source relative to a preset target wavelength according to the temperature-current coordinated command, in order to achieve a narrow linewidth laser source design based on a temperature and current dual closed loop. This specifically includes the following steps:

[0163] Step 601: Adjust the driving current of the laser gain medium according to the current control parameters in the temperature-current coordination command until the fluctuation amplitude of the driving current within a preset number of detections is less than the first preset threshold, and generate a current stability indicator.

[0164] In this step, the current control parameter refers to the parameter used in the temperature-current coordinated command to regulate the driving current of the laser gain medium. The driving current refers to the current used to drive the laser gain medium to generate laser light. The preset detection count refers to the pre-set number of consecutive detections used to determine whether the current or temperature is stable, ensuring the reliability of the detection results and avoiding the influence of random factors. The first preset threshold refers to the pre-set upper limit of the fluctuation range used to determine whether the driving current is stable; the current stability indicator refers to the indicator information generated when the driving current meets the stability condition, indicating that the driving current of the laser gain medium is in a stable state.

[0165] In this embodiment, current control parameters are extracted from the temperature-current coordination command. Based on these current control parameters, the driving current of the laser gain medium is adjusted in real time. At the same time, the value of the driving current is continuously detected. The maximum absolute value of the difference between each detected value and the average value within a preset number of detections is calculated as the fluctuation amplitude. When the fluctuation amplitude is less than a first preset threshold, a current stability indicator is generated.

[0166] Step 602: Adjust the flow rate of the heat exchange medium according to the flow control parameters in the temperature-current coordination command until the standard deviation of the temperature distribution data is less than the second preset threshold within a preset number of detections, and generate a temperature stability indicator.

[0167] In this step, the flow control parameter refers to the parameter used in the temperature-current coordinated command to regulate the flow rate of the heat exchange medium. The flow rate refers to the velocity of the heat exchange medium within the circulation channel inside the heat transfer structure. The standard deviation of the temperature distribution data refers to a statistical quantity describing the dispersion of the temperature distribution of the laser gain medium. The second preset threshold refers to a pre-set upper limit of the standard deviation used to determine whether the temperature distribution is stable. The temperature stability indicator refers to the indicator information generated when the temperature distribution meets the stability conditions, used to indicate that the temperature distribution of the laser gain medium has reached a stable state.

[0168] In this embodiment of the application, flow control parameters are extracted from the temperature-current coordinated command. Based on the flow control parameters, the flow rate of the heat exchange medium is adjusted in real time. At the same time, temperature distribution data of the laser gain medium is continuously collected, and the standard deviation of temperature distribution data for each time within a preset number of detections is calculated. When the standard deviation is less than a second preset threshold, a temperature stability indicator is generated.

[0169] Step 603: When the current stability indicator and temperature stability indicator are generated simultaneously, calculate the wavelength deviation of the laser source wavelength relative to the preset target wavelength.

[0170] In this embodiment of the application, when the simultaneous generation of current stability indicator and temperature stability indicator is detected, the actual lasing wavelength of the laser source is obtained through a wavelength detection device, and the difference between the lasing wavelength and the preset target wavelength is calculated to obtain the wavelength deviation of the lasing wavelength of the laser source relative to the preset target wavelength.

[0171] Step 604: If the wavelength deviation is greater than the preset wavelength locking threshold, the current control parameters and flow control parameters are adjusted until the wavelength deviation is less than the preset wavelength locking threshold, so as to realize the narrow linewidth laser source design based on temperature and current dual closed loop.

[0172] In this step, the preset wavelength lock threshold refers to the upper limit of the deviation used to determine whether the laser lasing wavelength has reached the target accuracy.

[0173] In this embodiment, the calculated wavelength deviation is compared with a preset wavelength locking threshold. If the wavelength deviation is greater than the preset wavelength locking threshold, the current control parameters and flow control parameters in the temperature-current coordinated command are returned to readjust the driving current and the flow rate of the heat exchange medium, respectively. The above adjustment and detection process is repeated until the wavelength deviation is less than the preset wavelength locking threshold, thereby realizing the design of a narrow linewidth laser source based on temperature and current dual closed loop.

[0174] This application embodiment adjusts the driving current and the flow rate of the heat exchange medium based on temperature and current coordinated commands, calculates the wavelength deviation after both are stable, and performs closed-loop optimization, thereby achieving precise dual closed-loop control of temperature and current, reducing the wavelength deviation of the laser source, and ensuring the stable output performance of the narrow linewidth laser source.

[0175] Figure 2 A schematic diagram of a narrow-linewidth laser source design system based on a dual closed-loop system of temperature and current is provided for embodiments of this application, as shown below. Figure 2 As shown, the system includes:

[0176] The acquisition module 21 is used to acquire the measured temperature value of the laser gain medium.

[0177] The calculation module 22 is used to calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal.

[0178] The control module 23 is used to drive the heat transfer structure using the flow rate control signal to control the heat transfer structure to perform heat exchange operation with the laser gain medium and generate adjusted temperature distribution data.

[0179] The conversion module 24 calculates the change in carrier concentration in the laser gain medium based on the adjusted temperature distribution data, and converts the change in concentration into driving current compensation parameters.

[0180] The coordination module 25 is used to coordinate the adjusted temperature distribution data and the driving current compensation parameters based on the thermal resistance and thermal capacity parameters of the heat transfer structure to generate a temperature-current coordination command.

[0181] The adjustment module 26 is used to adjust the wavelength deviation of the laser source wavelength relative to the preset target wavelength according to the temperature and current coordinated command, so as to realize the narrow linewidth laser source design based on temperature and current dual closed loop.

[0182] Figure 2 The aforementioned narrow-linewidth laser source design system based on temperature and current dual closed loops can perform... Figure 1 The implementation principle and technical effects of the narrow linewidth laser source design method based on temperature and current dual closed loops described in the illustrated embodiment will not be repeated here. The specific operation methods of each module and unit in the narrow linewidth laser source design system based on temperature and current dual closed loops in the above embodiments have been described in detail in the embodiments related to this method, and will not be elaborated upon here.

[0183] In one possible design, Figure 2 The narrow-linewidth laser source design system based on temperature and current dual closed loops shown in the embodiment can be implemented as a computing device, such as... Figure 3 As shown, the computing device may include a storage component 31 and a processing component 32.

[0184] The storage component 31 stores one or more computer instructions, wherein the one or more computer instructions are invoked and executed by the processing component 32.

[0185] The processing component 32 is used for the above Figure 1 The embodiment describes a narrow-linewidth laser source design method based on a dual closed-loop system of temperature and current.

[0186] The processing component 32 may include one or more processors to execute computer instructions to complete all or part of the steps in the above-described method. Alternatively, the processing component may be implemented as one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above-described method.

[0187] Storage component 31 is configured to store various types of data to support operations at the terminal. The storage component can be implemented from any type of volatile or non-volatile storage device or a combination thereof, such as Random Access Memory (RAM), Static Random-Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Read Only Memory (PROM), Read Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0188] Of course, computing devices may also include other components, such as input / output interfaces, display components, communication components, etc.

[0189] Input / output interfaces provide interfaces between processing components and peripheral interface modules, which can be output devices, input devices, etc.

[0190] The communication components are configured to facilitate wired or wireless communication between computing devices and other devices.

[0191] The computing device can be a physical device or an elastic computing host provided by a cloud computing platform. In this case, the computing device can refer to a cloud server, and the aforementioned processing components, storage components, etc., can be basic server resources rented or purchased from the cloud computing platform.

[0192] This application also provides a computer storage medium storing a computer program, which, when executed by a computer, can perform the above-described functions. Figure 1 The illustrated embodiment presents a narrow-linewidth laser source design method based on a dual closed-loop system of temperature and current.

[0193] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0194] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0195] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0196] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A design method for a narrow-linewidth laser source based on a dual closed-loop system of temperature and current, characterized in that, include: Obtain the measured temperature value of the laser gain medium; Calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal; The flow rate control signal is used to drive the heat transfer structure to control the heat transfer structure to perform heat exchange operation with the laser gain medium, thereby generating adjusted temperature distribution data. Based on the adjusted temperature distribution data, the change in carrier concentration in the laser gain medium is calculated, and the change in concentration is converted into driving current compensation parameters. Based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameters are processed in a coordinated manner to generate a temperature-current coordinated command. According to the temperature and current coordinated command, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is adjusted to realize the design of a narrow linewidth laser source based on temperature and current dual closed loop.

2. The method according to claim 1, characterized in that, Calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal, including: The temperature deviation value is obtained by subtracting the measured temperature value from the preset target temperature value. The sign of the temperature deviation value is used as the flow direction symbol identifier. According to the preset symbol instruction conversion rule, the flow direction symbol identifier is converted into an instruction to obtain the flow control instruction. The absolute value of the temperature deviation is compared with a preset flow rate intensity relationship table to determine the flow rate intensity value corresponding to the temperature deviation. The initial flow rate adjustment amount is obtained by multiplying the flow rate intensity value and the preset flow rate gain coefficient. Based on the thermal inertia time constant of the heat transfer structure, the initial flow rate adjustment is subjected to a first-order low-pass filter to obtain a smooth flow rate adjustment. A flow rate control signal is generated based on the flow control command and the smooth flow rate adjustment amount.

3. The method according to claim 1, characterized in that, The heat transfer structure is driven by the flow rate control signal to control the heat exchange operation between the heat transfer structure and the laser gain medium, generating adjusted temperature distribution data, including: The analog voltage value of the flow rate control signal is compared with a preset voltage-flow rate relationship table to determine the flow rate value corresponding to the analog voltage value, and the flow rate value is used as the target flow rate value of the heat exchange medium. The heat transfer structure is driven by the target flow rate value to transfer the heat exchange medium to the internal circulation channel of the heat transfer structure, thereby obtaining flow state parameters. Based on the flow state parameters, the heat transfer structure and the laser gain medium are subjected to heat exchange operation to obtain the temperature distribution data of the laser gain medium; Based on the deviation between the temperature distribution data and the preset target distribution, the target flow rate value is adjusted to obtain adjusted temperature distribution data that meets the preset temperature control accuracy.

4. The method according to claim 1, characterized in that, Based on the adjusted temperature distribution data, the change in carrier concentration in the laser gain medium is calculated, and the change in concentration is converted into driving current compensation parameters, including: The maximum temperature gradient direction vector in the adjusted temperature distribution data is multiplied by the preset semiconductor band parameters to obtain the conduction band electron concentration offset. The maximum temperature gradient value in the adjusted temperature distribution data is multiplied by the preset valence band hole mobility parameter to obtain the valence band hole concentration offset. The concentration shift of the conduction band electrons and the concentration shift of the valence band holes are superimposed to obtain the change in carrier concentration in the laser gain medium. According to the preset carrier current conversion rule, the concentration change is converted to obtain the equivalent current change; the equivalent current change is processed to obtain the driving current compensation parameters.

5. The method according to claim 4, characterized in that, The equivalent current change is processed to obtain the drive current compensation parameters, including: According to the semiconductor material type identifier, a sign conversion coefficient is set, and the equivalent current change and the sign conversion coefficient are multiplied to obtain a signed current value. When the semiconductor material type identifier is a first conductivity type identifier, the sign conversion coefficient is set to a positive polarity coefficient, and when the semiconductor material type identifier is a second conductivity type identifier, the sign conversion coefficient is set to a negative polarity coefficient. The preset minimum input current value, maximum input current value, minimum control voltage value, and maximum control voltage value are linearly transformed to obtain the current-voltage conversion ratio coefficient and voltage reference offset. Based on the signed current value, the current-to-voltage conversion ratio, and the voltage reference offset, a drive control voltage signal is generated; According to the preset digital encoding rules, the drive control voltage signal is encoded into instructions to obtain drive current compensation parameters.

6. The method according to claim 1, characterized in that, Based on the thermal resistance and heat capacity parameters of the heat transfer structure, the adjusted temperature distribution data and the driving current compensation parameters are processed collaboratively to generate a temperature-current coordinated command, including: Based on the thermal resistance and thermal capacity parameters of the heat transfer structure, the heat transfer time constant is calculated, and the heat transfer time constant is multiplied by the maximum temperature gradient value in the adjusted temperature distribution data to obtain the temperature-current coupling factor. The temperature-current coupling factor and the driving current compensation parameter are multiplied to obtain the current cooperative correction amount. Based on the adjusted temperature distribution data, the average temperature of the space is calculated, and the difference between the average temperature of the space and the preset target temperature is calculated to obtain the average temperature deviation. The average temperature deviation and the preset flow compensation coefficient are multiplied to obtain the flow compensation increment of the temperature closed loop. The coordinated control parameters are obtained by weighted summing of the current collaborative correction amount and the flow compensation increment. The coordinated control parameters are converted into instructions to obtain temperature and current coordinated instructions.

7. The method according to claim 1, characterized in that, According to the temperature-current coordinated command, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is adjusted to achieve a narrow linewidth laser source design based on temperature and current dual closed loops, including: According to the current control parameters in the temperature-current coordination command, the driving current of the laser gain medium is adjusted until the fluctuation amplitude of the driving current within a preset number of detections is less than the first preset threshold, and a current stability indicator is generated. According to the flow control parameters in the temperature-current coordinated command, the flow rate of the heat exchange medium is adjusted until the standard deviation of the temperature distribution data is less than the second preset threshold within a preset number of detections, and then a temperature stability indicator is generated. When the current stability indicator and temperature stability indicator are generated simultaneously, the wavelength deviation of the laser source wavelength relative to the preset target wavelength is calculated. If the wavelength deviation is greater than the preset wavelength locking threshold, the current control parameters and flow control parameters are adjusted until the wavelength deviation is less than the preset wavelength locking threshold, so as to realize the design of a narrow linewidth laser source based on temperature and current dual closed loop.

8. A narrow-linewidth laser source design system based on a dual closed-loop system of temperature and current, characterized in that, include: The acquisition module is used to acquire the measured temperature value of the laser gain medium; The calculation module is used to calculate the temperature deviation between the measured temperature value and the preset target temperature value, and convert the deviation value into a flow rate control signal; The control module is used to drive the heat transfer structure using the flow rate control signal to control the heat transfer structure to perform heat exchange operation with the laser gain medium and generate adjusted temperature distribution data. The conversion module calculates the change in carrier concentration in the laser gain medium based on the adjusted temperature distribution data, and converts the change in concentration into driving current compensation parameters. The coordination module is used to coordinate the adjusted temperature distribution data and the driving current compensation parameters based on the thermal resistance and thermal capacity parameters of the heat transfer structure to generate a temperature-current coordination command. The adjustment module is used to adjust the wavelength deviation of the laser source wavelength relative to the preset target wavelength according to the temperature and current coordinated command, so as to realize the narrow linewidth laser source design based on temperature and current dual closed loop.

9. A computing device, characterized in that, It includes a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are invoked and executed by the processing component to implement the narrow linewidth laser source design method based on temperature and current dual closed loop as described in any one of claims 1 to 7.

10. A computer storage medium, characterized in that, The system contains a computer program that, when executed by a computer, implements the narrow-linewidth laser source design method based on a dual closed-loop system of temperature and current as described in any one of claims 1 to 7.

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