A circuit board intelligent production parameter control device

Abstract

The application relates to the technical field of circuit board production, and discloses a circuit board intelligent production parameter control device, which comprises a rack, a glue spraying module, a parameter control assembly and a support. The parameter control assembly can realize parameter self-control and parameter master control of the flow channel of photoresist, automatically controls the flow amount of photoresist by using the thickness of the circuit board, and thus controls the thickness of the photoresist attached to the circuit board. The master control device can also realize self-control of the device parameters, so that manual parameter control can be realized according to circuit boards of different specifications or requirements, thereby realizing double-function intelligent parameter control, improving the quality of circuit board production, and avoiding the problem that the thickness of photoresist is not uniform, which finally affects the etching effect of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to an intelligent circuit board manufacturing parameter control device. Background Technology

[0002] With the rapid development of the electronics industry, people have higher and higher requirements for the brightness and resolution of light boards of the same size. As a result, the number of LED beads carried by the circuit on the circuit board increases, which requires the PCB industry to make the circuit more and more refined, the circuit board to generate less heat, have a longer lifespan, and consume less energy.

[0003] Currently, during the production of circuit boards, a certain amount of photoresist is sprayed or coated onto the surface. Positive photoresist dissolves after exposure and retains the unexposed areas during development, forming a pattern opposite to the photomask. Negative photoresist cross-links and cures after exposure and removes the unexposed areas during development, forming a pattern consistent with the photomask. Therefore, the production process varies depending on the product type. However, the thickness of the photoresist is particularly important during the coating process. Some circuit boards have thicker coatings selected based on their thickness, while others are adjusted according to product specifications. These parameter control devices are quite complex, requiring significant initial investment. Furthermore, operation is complex and prone to errors. Many products cannot achieve automatic intelligent parameter control based on their inherent characteristics, leading to deviations in the surface coating thickness after circuit board production, affecting the quality of the circuit board. Therefore, this paper proposes an intelligent production parameter control device for circuit boards to address the aforementioned problems. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides an intelligent production parameter control device for circuit boards, which solves the problem that existing technologies cannot achieve both autonomous and automatic dual control of the adhesive coating parameters in circuit board production, requiring operators to adjust parameters for each product specification, which is extremely inconvenient.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a circuit board intelligent production parameter control device, comprising a frame; a glue spraying module for spraying glue onto the circuit board; a parameter control component for controlling the thickness parameter of the glue spraying; and a support; the parameter control component includes a self-control unit and a main control unit; the self-control unit includes a pressure plate, a support frame connected to the pressure plate, a rotating wheel connected to the support frame, connecting frames connected to both ends of the rotating wheel, a sliding rod slidably connected to the connecting frame, a compression spring sleeved on the surface of the sliding rod, the sliding rod connected to the support, a top rod abutting against the rotating wheel, a sliding plate connected to the top rod, a fixing sleeve slidably connected to the surface of the sliding plate, a through hole in the fixing sleeve, a glue tube connected to the fixing sleeve, one end of the glue tube connected to the glue spraying module, and the other end of the glue tube connected to a glue tank, the photoresist solution in the glue tank entering the glue spraying module through the glue tube and being sprayed onto the surface of the circuit board.

[0008] Preferably, the glue spraying module includes multiple nozzles and a fixing frame. The fixing frame is mounted on the machine frame, and the multiple nozzles are connected to the fixing frame. Multiple glue tubes are provided, and each glue tube is connected to multiple nozzles through a pipeline. An arc-shaped groove is opened on the rotating wheel, and the top rod is located inside the arc-shaped groove.

[0009] Preferably, the main control includes a threaded frame, which is mounted on a fixed sleeve. An adjusting rod is threadedly connected to the threaded frame, and a movable frame is rotatably connected to the bottom of the adjusting rod. Hooks are provided at both ends of the movable frame, and an arc plate abuts against the surface of the hook. The arc plate is fixed on a rotating wheel.

[0010] Preferably, the rotating wheel has a flat groove, the support frame is connected to a positioning wheel, the side of the positioning wheel has a slot, the rotating wheel is connected to a locking strip, the locking strip is made of rubber, and the support frame slides up and down on the frame.

[0011] Preferably, the parameter control component further includes a shielding component for shielding external splashes during the glue spraying process. The shielding component includes a baffle plate with a contact strip connected to the bottom of the baffle plate. A shielding ring is connected to the bracket with an opening. The baffle plate is slidably connected to the shielding ring.

[0012] Preferably, the side of the baffle is connected to two pull rods, which are slidably connected to the shielding ring, and a support spring is sleeved on the pull rod.

[0013] Preferably, there are two baffles and contact strips, and the two contact strips are arranged in a V-shape. When the circuit board is transported, its surface will contact the two contact strips and be stretched open by the inclined surfaces, controlling the opening of the baffles and forming a glue spraying area.

[0014] Preferably, the conveying module includes a driving component, which is connected to a track via a transmission component. The track has multiple slots, and the circuit board is located inside the slots.

[0015] Preferably, the track has two tracks, with a limit rod slidably connected inside the track. A limit spring is sleeved on the surface of the limit rod, and the limit spring is located between the track and the bracket. One end of the limit rod is connected to a ball, and one side of the bracket has a spherical groove. The ball is slidably connected inside the spherical groove.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the present invention provides a circuit board intelligent production parameter control device, which has the following beneficial effects:

[0018] 1. This intelligent production parameter control equipment for circuit boards, through its parameter control components, enables automatic and master parameter control of the photoresist flow path. It automatically controls the photoresist flow rate by utilizing the thickness of the circuit board itself, thereby indirectly controlling the thickness of the photoresist adhered to the circuit board. Simultaneously, the master control unit also allows for autonomous adjustment of equipment parameters, enabling manual parameter adjustment based on different specifications or requirements of the circuit board. This dual-function intelligent parameter control improves the quality of circuit board production, preventing inconsistent photoresist thickness that could ultimately affect the etching effect.

[0019] 2. This intelligent production parameter control equipment for circuit boards, through the setting of shielding components, can prevent the adhesive from splashing into the external space when the circuit board is coated with film, and can autonomously control the spraying space range parameters according to the width of the circuit board, ultimately achieving intelligent and automated shielding and improving the ease of operation of the equipment. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a circuit board intelligent production parameter control device proposed in this invention;

[0021] Figure 2 This is a schematic diagram of the self-controller structure of an intelligent production parameter control device for circuit boards proposed in this invention;

[0022] Figure 3 This is a schematic diagram of the hose connection structure of an intelligent production parameter control device for circuit boards proposed in this invention.

[0023] Figure 4 This is a schematic diagram of the main control structure of a circuit board intelligent production parameter control device proposed in this invention;

[0024] Figure 5This is a schematic diagram of the shielding component structure of an intelligent production parameter control device for circuit boards proposed in this invention;

[0025] Figure 6 This is a schematic diagram of the connection structure of the baffle in a circuit board intelligent production parameter control device proposed in this invention;

[0026] Figure 7 This is a schematic diagram of the cross-sectional structure of the spherical return groove of a circuit board intelligent production parameter control device proposed in this invention;

[0027] Figure 8 This is a schematic diagram of the conveying module structure of an intelligent circuit board production parameter control device proposed in this invention.

[0028] In the diagram: 1. Frame; 2. Parameter control component; 201. Rotary wheel; 202. Slide rod; 203. Compression spring; 204. Connecting frame; 205. Pressure plate; 206. Support frame; 207. Hose; 208. Top rod; 209. Fixing sleeve; 210. Sliding plate; 211. Perforation; 212. Arc groove; 213. Flat groove; 214. Adjusting rod; 215. Threaded frame; 216. Arc plate; 217. Hook; 218. Positioning wheel; 219. Clamping strip; 220. Clamping slot; 221. Shielding ring; 222. Baffle; 223. Pull rod; 224. Support spring; 225. Contact strip; 226. Moving frame; 3. Glue spraying module; 4. Conveying module; 41. Track; 42. Slot; 43. Limiting rod; 44. Limiting spring; 45. Ball; 5. Bracket. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-8 A circuit board intelligent production parameter control device includes a frame 1, a glue spraying module 3 for spraying glue onto the circuit board; a parameter control component 2 for controlling the thickness parameter of the glue spraying; and a support 5. The parameter control component 2 includes a self-controller and a main controller.

[0031] In this embodiment, the self-control system includes a pressure plate 205, a support frame 206 connected to the pressure plate 205, a rotating wheel 201 connected to the support frame 206, a connecting frame 204 connected to both ends of the rotating wheel 201, a sliding rod 202 slidably connected to the connecting frame 204, a compression spring 203 sleeved on the surface of the sliding rod 202, the sliding rod 202 connected to the bracket 5, a top rod 208 abutting against the rotating wheel 201, a sliding piece 210 connected to the top rod 208, a fixing sleeve 209 slidably connected to the surface of the sliding piece 210, a through hole 211 opened on the fixing sleeve 209, a glue tube 207 connected to the fixing sleeve 209, one end of the glue tube 207 connected to the glue spraying module 3, and the other end of the glue tube 207 connected to the glue tank. The photoresist solution in the glue tank enters the glue spraying module 3 through the glue tube 207 and is sprayed onto the surface of the circuit board. The purpose of the self-control system is mainly to achieve intelligent control that automatically adjusts the thickness of the adhesive spraying according to the thickness of the circuit board. The pressure plate 205 is located above the feed end of the equipment, and its lower surface is in direct contact with the circuit board being conveyed. When the circuit board passes by, the pressure plate 205 is lifted according to the actual thickness of the circuit board, thereby driving the support frame 206 fixedly connected to it to move upward together. The upper end of the support frame 415 is connected to the roller 201, so the roller 201 will also change position accordingly. The fixed sleeve 209 is fixed on the frame 1 or the bracket 5, and its interior has a through hole 211, which corresponds to the channel of the adhesive tube 207. One end of the adhesive tube 207 is connected to the adhesive spraying module 3, and the other end leads to the photoresist jar. When the circuit board is thick, the pressure plate 205 is lifted higher, which pushes the roller 201 upward through the support frame 206, and then pushes the slider 210 upward within the fixed sleeve 209 through the push rod 208. The movement of the slider 210 changes the overlap area between the through-hole 211 and the adhesive tube 207 channel, thereby adjusting the photoresist flow rate: the higher the slider 210, the larger the overlap area, the greater the adhesive flow rate, and the greater the adhesive thickness; conversely, the flow rate decreases and the adhesive thickness becomes thinner. Through this series of mechanical linkages, the self-control system automatically and in real-time adjusts the adhesive thickness according to the circuit board thickness, without the need for external power or complex sensors. The structure is reliable and responsive, significantly improving the automation level and process consistency of production, and achieving intelligent automatic parameter control.

[0032] Furthermore, the adhesive spraying module 3 includes multiple nozzles and a mounting bracket. The mounting bracket is installed on the frame 1, and the multiple nozzles are connected to the mounting bracket. Multiple adhesive tubes 207 are provided, and each tube 207 is connected to a multiple nozzle via a conduit. An arc-shaped groove 212 is formed on the rotating wheel 201, and the push rod 208 is located inside the arc-shaped groove 212. As the core execution unit of this intelligent production parameter control equipment, the adhesive spraying module 3 has a carefully designed structure and connection method to ensure that the photoresist can be uniformly and controllably sprayed onto the circuit board surface. This module mainly consists of multiple nozzles and a mounting bracket for integrated fixation.

[0033] The mounting bracket is securely installed on the main frame 1 of the equipment via bolts or welding, providing a stable support foundation for the entire adhesive spraying module. Multiple nozzles are mounted on the mounting bracket in a specific arrangement, such as a linear array or matrix distribution. The number and spacing of the nozzles can be designed according to the common dimensions of the circuit board and the requirements of the spraying process to ensure uniform and comprehensive coating coverage.

[0034] Photoresist delivery is achieved through multiple independent adhesive tubes 207. One end of each tube 207 converges and connects to the outlet of the fixed sleeve 209 located within the parameter control assembly 2, while the other end is connected to each nozzle via a branch piping system. This multi-path parallel supply design ensures a stable supply of photoresist to each nozzle, a prerequisite for achieving uniform spraying over large areas. The photoresist is pumped from the tank, flows through the adhesive tubes 207, and is finally atomized and sprayed out by the nozzles.

[0035] Furthermore, the main control includes a threaded bracket 215, which is mounted on the fixed sleeve 209. An adjusting rod 214 is threadedly connected to the threaded bracket 215. A movable bracket 226 is rotatably connected to the bottom of the adjusting rod 214. Hooks 217 are provided at both ends of the movable bracket 226. An arc plate 216 abuts against the surface of the hook 217. The arc plate 216 is fixed on the rotating wheel 201. In addition, a flat groove 213 is provided on the rotating wheel 201, and a positioning wheel 218 is connected to the support frame 206. A bayonet 220 is provided on the side of the positioning wheel 218, and a retaining strip 219 is connected to the rotating wheel 201. The retaining strip 219 is made of rubber. The support frame 206 slides up and down on the frame 1 and is engaged with the retaining strip 219 in the bayonet 220, which can achieve the initial positioning of the rotating wheel 201 and prevent the rotating wheel 201 from swinging during operation. The rubber retaining strip 219 also has a certain degree of extensibility, and the operator can forcefully rotate the rotating wheel 201 to control the retaining strip 219 to disengage from the bayonet 220. The fine control of the glue flow rate is achieved through a purely mechanical method. This component mainly includes a threaded frame 215, an adjusting rod 214, a moving frame 226, a hook 217, and an arc plate 216. The components work together to provide users with a stable and reliable manual parameter intervention capability.

[0036] The threaded bracket 215 serves as the mounting base and motion guide mechanism for the entire main control system. It is securely mounted on the outside of the fixed sleeve 209 via welding or fasteners. The adjusting rod 214, as the user's direct operating object, has precision external threads machined on its body, forming a high-precision helical transmission pair with the internal threads on the threaded bracket 215. By manually rotating the adjusting rod 214, its rotational motion can be converted into precise linear lifting and lowering motion.

[0037] At the bottom of the adjusting rod 214, its end is rotatably connected to the movable frame 226 via a pin or bearing. This design ensures that the adjusting rod 214 does not cause the movable frame 226 to rotate with it when rotating, preventing the mechanism from jamming and ensuring that the movable frame 226 can only move strictly vertically up and down. The movable frame 226 is typically a U-shaped or portal frame structure, with inwardly curved hooks 217 at the ends of its two arms.

[0038] The concave surface of hook 217 precisely abuts against the convex surface of arc plate 216 fixedly mounted on the side of rotating wheel 201. Arc plate 216 can be considered as a specific cam or drive point on rotating wheel 201. When the operator rotates adjusting lever 214 clockwise or counterclockwise, moving frame 226 is driven to rise or fall. Through the abutment action between hook 217 and arc plate 216, the linear motion of moving frame 226 is converted into a lifting action on rotating wheel 201, thereby forcibly changing the absolute height of rotating wheel 201.

[0039] The height change of the rotary wheel 201 pushes the push rod 208 and the connected slider 210, ultimately changing the overlap area between the perforation 211 on the slider 210 and the channel of the adhesive tube 207, thus achieving manual stepless adjustment of the adhesive flow rate. This main control mechanism allows operators to set and lock the required adhesive thickness parameters directly and intuitively according to the process requirements of specific products, completely independently of the automatic thickness sensing system, providing crucial flexibility for the production of circuit boards with special specifications.

[0040] In addition, parameter control component 2 also includes a shielding component used to block external splashing during the glue spraying process. The shielding component includes a baffle 222, with a contact strip 225 connected to the bottom of the baffle 222. A shielding ring 221 is connected to the bracket 5, and an opening is provided on the shielding ring 221. The baffle 222 is slidably connected to the shielding ring 221. Two pull rods 223 are connected to the side of the baffle 222, and the pull rods 223 are slidably connected to the shielding ring 221. A support spring 224 is sleeved on the pull rod 223. There are two baffles 222 and two contact strips 225, and the two contact strips 225 are arranged in a V-shape. When the circuit board is transported, its surface will contact the two contact strips 225 and open up at an angle, controlling the opening of the baffle 222 to form the glue spraying area. The purpose of the shielding device is to effectively prevent photoresist from splashing, spreading, or atomizing and escaping into the external space during high-pressure spraying, thereby ensuring the cleanliness of the working environment, reducing adhesive waste, and avoiding contamination of other equipment components. The main body of the shielding device is a shielding ring 221 fixedly mounted on the bracket 5. This ring structure is usually made of metal or high-strength engineering plastic, and an open opening is designed in the middle of the ring, which forms the channel for the spraying module 3 to perform the spraying operation.

[0041] The core shielding action is performed by a pair of baffles 222. The baffles 222 are typically made of corrosion-resistant, easy-to-clean materials such as stainless steel or Teflon-coated plates, and their shape is precisely designed to fit well with the inner wall or guide rail of the shielding ring 221. The two baffles 222 are symmetrically connected to the shielding ring 221 through the grooves or guide rails on their sides. Their movement trajectory is strictly restricted, and they can only open or close along the radial direction of the shielding ring 221, like two automatically opening and closing "doors".

[0042] A contact strip 225 is vertically fixed to the bottom edge of each baffle 222. The contact strip 225 is a sensing component that triggers the automatic operation of the shielding mechanism. Its installation position is precisely calculated to ensure that when the circuit board is conveyed to the glue spraying station by the conveyor module 4, the side edge of the circuit board will preferentially contact the two contact strips 225 arranged at a certain angle, such as a V-shape.

[0043] A contact strip 225 is vertically fixed to the bottom edge of each baffle 222. The contact strip 225 is a sensing component that triggers the automatic action of the masking mechanism. Its installation position is precisely calculated to ensure that when the circuit board is conveyed to the glue spraying station by the conveyor module 4, the side edge of the circuit board will preferentially contact the two contact strips 225 arranged at a certain angle, such as a V-shape. The physical size of the circuit board directly determines the opening size of the spraying window. When a wider circuit board is fed in, its side will push open the contact strip 225 earlier, causing the baffle 222 to slide open a larger opening to accommodate its width. Conversely, a narrower circuit board will only push the baffle 222 open a smaller gap. This purely mechanical adaptive design cleverly transforms the production parameter of "circuit board width" into the control parameter of "spraying area" in real time, realizing intelligent and automated control of the masking range.

[0044] It is worth noting that the conveying module 4 includes a drive unit, which is connected to a track 41 via a transmission component. Multiple slots 42 are provided on the track 41, and the circuit board is located inside the slots 42. Two tracks 41 are provided, with limit rods 43 slidably connected inside each track 41. Limit springs 44 are fitted onto the surface of the limit rods 43 and are located between the track 41 and the support 5. One end of the limit rod 43 is connected to a ball 45. A spherical groove is located on one side of the support 5, and the ball 45 is slidably connected inside the spherical groove. Multiple sets of limit springs 44 are arranged in an array on the track 41. As the material transfer hub of the entire equipment, the core function of the conveying module 4 is to accurately, stably, and adaptively transport circuit boards of different sizes to the designated workstation below the glue spraying module 3. This module adopts an innovative flexible clamping conveying design, ensuring that the circuit boards do not slip or vibrate during transport and can automatically adapt to changes in board width.

[0045] The module is powered by a drive unit, usually a servo motor or a stepper motor. This drive unit transmits power efficiently and precisely to two parallel tracks 41 through a set of transmission components, such as a synchronous belt pulley mechanism or a gear set, driving them to rotate synchronously.

[0046] Each track 41 has a specially designed working surface with multiple equally spaced slots 42 along its length. The shape of these slots 42 matches the edge of the circuit board to support and position the circuit board, preventing it from shifting back and forth during transport and ensuring that each circuit board is accurately delivered to the glue spraying area.

[0047] To achieve adaptive clamping and conveying of circuit boards of different widths, the two tracks 41 are not rigidly fixed, but are designed as a movable structure that can be finely adjusted laterally. The core technology lies in a limiting mechanism that integrates guiding, elastic clamping and repositioning.

[0048] The limiting rod 43 passes through the guide sleeve inside the track 41, forming a sliding connection with it, allowing the track 41 to slide laterally along the limiting rod 43 with the circuit board. The limiting spring 44 is sleeved on the surface of the limiting rod 43, with its two ends abutting against the inner side of the track 41 and the bracket 5, respectively. The spring continuously provides an inward preload to the track 41, forcing the two tracks 41 to tend to move closer together.

[0049] At the end of the limiting rod 43, a ball 45 is connected. This ball 45 is machined into a spherical groove on the side of the bracket 5 to form a sliding connection, constituting a spherical pair. This design is crucial, as it not only provides flexible, low-resistance guidance for the sliding of the track 41 in the horizontal direction, but also allows the track assembly to produce a slight deflection when subjected to lateral forces, thereby compensating for possible installation errors or circuit board size deviations and ensuring a uniform distribution of clamping force.

[0050] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0051] Working principle: First, during the coating process, a robot places the semi-finished circuit board into the slot 42 on the track 41. The width of the two tracks 41 can be autonomously adjusted because the sides of the two tracks 41 are connected by limit springs 44, providing inward thrust to clamp and hold the circuit board. Then, a drive unit controls a transmission unit to rotate the tracks 41. The drive unit is typically a motor, while the transmission unit usually uses gears or belts to control the rotation of the tracks 41. When the circuit board is about to enter the area below the glue spraying module 3, the upper surface of the circuit board will slide against the pressure plate 205, lifting the pressure plate 205. The pressure plate 205 is then lifted by the support frame 206, thus... The rotating wheel 201 is raised slightly, and through the abutment of the arc groove 212, the rotating wheel 201 indirectly drives the push rod 208. The upward movement of the push rod 208 causes the sliding piece 210 inside the fixed sleeve 209 to move. At its maximum position, the perforation 211 perfectly matches the diameter of the adhesive tube 207, allowing the photoresist solution in the glue tank to flow into the glue spraying module 3 at maximum flow rate through the adhesive tube 207. This increases the instantaneous spray volume of the glue spraying module 3, resulting in a thicker adhesive layer on the circuit board surface. Therefore, this method directly controls the photoresist thickness parameters based on the circuit board's thickness, as thicker circuit boards generally require a thicker adhesive layer. This method achieves intelligent and autonomous parameterized control of the adhesive layer without manual intervention, improving the automation and intelligence of the equipment. Of course, it is inevitable that the adhesive thickness requirements and specifications of some circuit boards are not proportional to the thickness of the circuit board. Therefore, a main control is also set up. The main control can be used to control the thickness of the adhesive. First, the rotating wheel 201 needs to be rotated 180 degrees so that the flat groove 213 faces upward. The arc plate 216 will be hung on the hook 217. Then, the rotation of the adjusting rod 214 is manually controlled. The adjusting rod 214 is connected to the threaded frame 215 by the thread, which drives the bottom moving frame 226 to rise. The two hooks 217 are connected to the arc plate 216 by hanging, which drives the rotating wheel 201 to actively lift. The top rod 208 is now located in the flat groove 213. At the same time, the moving frame 226 is connected to the slider 210 by the connecting rod. So the slider 210 will actively lift a certain height, thereby controlling the degree of overlap between the through hole 211 and the hole diameter of the adhesive tube 207. The flow parameters of the adhesive inside the adhesive tube 207 are controlled by the hole misalignment, thereby finely controlling the production and processing of the circuit board.To prevent photoresist splattering and exposure, a masking element is used to limit the area and width of the photoresist application. During the circuit board transport phase, its surface gradually enters the masking ring 221. When the circuit board makes contact with the two contact strips 225, the conveying force of the conveyor belt 41 will cause the side of the circuit board to squeeze and slide against the two contact strips 225, thereby causing the two baffles 222 to open, ultimately exposing the hollow area above the masking ring 221. Therefore, at this time, the adhesive spraying module 3 will control the adhesive to be applied from the opened opening. The adhesive application area is shielded to prevent splashing and exposure. This technical solution automatically controls the parameters of the adhesive application zone based on the width of the circuit board. The connection position of the two contact strips 225 can also be designed with an adjustable distance. Because the adhesive application zone of some circuit boards does not match their width, when the relative distance between the two contact strips 225 increases, the circuit board slides against the contact strips 225. At this time, the space opened by the two baffles 222 decreases, forming a smaller spray nozzle, thus changing the spatial parameters of the adhesive application. The entire equipment and solution can control both the adhesive thickness and the parameters of the adhesive application zone, combining automated and proactive control. Furthermore, the overall equipment has low investment costs, fewer electronic components, and achieves production parameter control through structural actions, avoiding the vulnerability of electronic components due to prolonged use.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A circuit board intelligent production parameter control device, characterized in that, include: Rack (1); The adhesive spraying module (3) is used to spray adhesive onto the circuit board; Parameter control component (2) is used to control the thickness parameter of the adhesive spray; support (5); The parameter control component (2) includes a self-control and a main control; The self-control device includes a pressure plate (205), a support frame (206) connected to the pressure plate (205), a rotating wheel (201) connected to the support frame (206), connecting frames (204) connected to both ends of the rotating wheel (201), a sliding rod (202) slidably connected to the connecting frame (204), a compression spring (203) sleeved on the surface of the sliding rod (202), the sliding rod (202) connected to the bracket (5), and a top rod (208) abutting against the rotating wheel (201). A slider (210) is connected to the top rod (208). A fixing sleeve (209) is slidably connected to the surface of the slider (210). A through hole (211) is opened on the fixing sleeve (209). A glue tube (207) is connected to the fixing sleeve (209). One end of the glue tube (207) is connected to the glue spraying module (3), and the other end of the glue tube (207) is connected to the glue box. The photoresist solution in the glue box enters the glue spraying module (3) through the glue tube (207) and is sprayed onto the surface of the circuit board. The main control includes a threaded frame (215), which is mounted on a fixed sleeve (209). An adjusting rod (214) is threadedly connected to the threaded frame (215). A movable frame (226) is rotatably connected to the bottom of the adjusting rod (214). Hooks (217) are provided at both ends of the movable frame (226). An arc plate (216) abuts against the surface of the hook (217). The arc plate (216) is fixed on the rotating wheel (201). The rotating wheel (201) has a flat groove (213), the support frame (206) is connected to a positioning wheel (218), the side of the positioning wheel (218) has a slot (220), the rotating wheel (201) is connected to a locking strip (219), the locking strip (219) is made of rubber, and the support frame (206) slides up and down on the frame (1).

2. The intelligent production parameter control equipment for circuit boards according to claim 1, characterized in that: The glue spraying module (3) includes multiple nozzles and a fixing frame. The fixing frame is installed on the frame (1), and the multiple nozzles are connected to the fixing frame. Multiple glue tubes (207) are provided, and the multiple glue tubes (207) are connected to the multiple nozzles through pipelines. An arc groove (212) is opened on the rotating wheel (201), and the top rod (208) is located inside the arc groove (212).

3. The intelligent production parameter control equipment for circuit boards according to claim 1, characterized in that: The parameter control component (2) also includes a shielding component, which is used to shield external splashes during the glue spraying process. The shielding component includes a baffle (222), and a contact strip (225) is connected to the bottom of the baffle (222). A shielding ring (221) is connected to the bracket (5), and an opening is provided on the shielding ring (221). The baffle (222) is slidably connected to the shielding ring (221).

4. The intelligent production parameter control equipment for circuit boards according to claim 3, characterized in that: The side of the baffle (222) is connected to two pull rods (223), which are slidably connected to the shielding ring (221). A support spring (224) is sleeved on the pull rod (223).

5. The intelligent production parameter control equipment for circuit boards according to claim 4, characterized in that: There are two baffles (222) and contact strips (225), and the two contact strips (225) are arranged in a V-shape. When the circuit board is transported, its surface will contact the two contact strips (225) and be opened by inclined contact, controlling the opening of the baffles (222) to form a glue spraying area.

6. The intelligent production parameter control equipment for circuit boards according to claim 1, characterized in that: It also includes a conveying module (4), which includes a driving component. The driving component is connected to a track (41) via a transmission component. The track (41) has multiple slots (42), and the circuit board is located inside the slots (42).

7. The intelligent production parameter control equipment for circuit boards according to claim 6, characterized in that: Two tracks (41) are provided. A limiting rod (43) is slidably connected inside the track (41). A limiting spring (44) is sleeved on the surface of the limiting rod (43). The limiting spring (44) is located between the track (41) and the bracket (5). One end of the limiting rod (43) is connected to a ball (45). A spherical groove is provided on one side of the bracket (5). The ball (45) is slidably connected inside the spherical groove.

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