Heat pump assembly

Abstract

A heat pump module is provided with a compressor (21), structural devices (22, 23, 25, 26, 27, 28), and a flow path forming member (10). The compressor compresses and discharges the refrigerant. The structural equipment circulates the refrigerant discharged from the compressor, and constitutes a heat pump cycle (20). The flow path forming member forms refrigerant flow paths (11, 12) and heat medium flow paths (13, 14), and has a compressor and structural equipment attached thereto. The flow path forming member (10) has high-temperature-side flow paths (11, 13), low-temperature-side flow paths (12, 14), and heat transfer suppressing sections (16, 16A, 16B). The high-temperature-side flow path circulates the refrigerant or the heat medium which is displayed at a high temperature by the heat of the high-pressure refrigerant in the refrigerant flow path and the heat medium flow path. The low-temperature-side flow path circulates a refrigerant or a heat medium, which has a lower temperature than the high-temperature-side flow path, in the refrigerant flow path and the heat medium flow path. The heat transfer suppression unit suppresses heat transfer between the refrigerant flow path and the heat medium flow path.

Description

[0001] Cross Reference to Related Applications

[0002] This application is based on Japanese Patent Application No. 2023-048387 filed March 24, 2023, and the contents thereof are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to a heat pump assembly that integrates at least a part of a structural device of a heat pump cycle device. BACKGROUND

[0004] In the past, as a technology related to a heat pump assembly that integrates at least a part of a structural device of a heat pump cycle device, the technology described in Patent Literature 1 is known. In the technology described in Patent Literature 1, a heat exchanger, an expansion valve, a reservoir, and the like are integrated with respect to a flow path forming member to constitute an assembly.

[0005] Prior Art Documents

[0006] Patent Literature

[0007] Patent Literature 1: Japanese Patent Application Publication No. 2021-047000

[0008] Here, in order to further miniaturize the heat pump cycle device and improve productivity, it is desirable to integrate more structural devices. However, if most of the structural devices are integrated, it is considered that the structural devices on the high-temperature side that are affected by high-pressure refrigerant and the structural devices on the low-temperature side that are affected by low-pressure refrigerant are mounted with respect to the flow path forming member. In this case, the flow path forming member is arranged in close proximity to a high-temperature side flow path through which a fluid on the high-temperature side flows and a low-temperature side flow path through which a fluid on the low-temperature side flows.

[0009] In addition, in recent years, in a heat pump cycle device, a structure having a heat medium circuit that circulates a heat medium whose heat is adjusted by heat exchange with a refrigerant in addition to a heat pump cycle that circulates the refrigerant has been developed.

[0010] In the case of applying a heat pump assembly to such a heat pump cycle device, it is assumed that, in the flow path forming member, a temperature difference caused by a fluid flowing in a flow path is generated between a refrigerant flow path and a heat medium flow path in addition to between refrigerant flow paths and between heat medium flow paths. Since each flow path including the refrigerant flow path and the heat medium flow path is arranged in close proximity to the flow path forming member, there is a concern that heat damage due to heat transfer between each flow path causes a decrease in the operation efficiency of the cycle and a decrease in the performance of the heat pump system. SUMMARY

[0011] The present disclosure, in view of the above, aims to provide a heat pump assembly that suppresses thermal damage between flow paths of a flow path forming member and suppresses a decrease in operational efficiency in a heat pump cycle.

[0012] A heat pump assembly according to an embodiment of the present disclosure includes a compressor, a structure device, and a flow path forming member. The compressor compresses and discharges refrigerant. The structure device allows the refrigerant discharged from the compressor to pass therethrough and constitutes a heat pump cycle. The flow path forming member has a refrigerant flow path and a heat medium flow path and has the compressor and the structure device mounted thereto. The refrigerant flow path allows refrigerant to pass between the flow path forming member and at least one of the compressor and the structure device. The heat medium flow path allows a heat medium that exchanges heat with the refrigerant in the structure device to pass therethrough.

[0013] The flow path forming member has a high-temperature-side flow path, a low-temperature-side flow path, and a heat transfer suppression portion. The high-temperature-side flow path allows refrigerant or a heat medium that exhibits a high temperature due to heat of a high-pressure refrigerant among the refrigerant flow path and the heat medium flow path to pass therethrough. The low-temperature-side flow path allows refrigerant or a heat medium that exhibits a temperature lower than that of the high-temperature-side flow path among the refrigerant flow path and the heat medium flow path to pass therethrough. The heat transfer suppression portion suppresses transfer of heat between the refrigerant flow path and the heat medium flow path.

[0014] Accordingly, according to the heat pump assembly, by integrating the compressor, the structure device, and the flow path forming member, the refrigerant flow path and the heat medium flow path are formed in the flow path forming member, and it is possible to concentrate a part of the heat pump cycle and the heat medium circuit in the heat pump assembly. Also, in the heat pump assembly, since the high-temperature-side flow path and the low-temperature-side flow path are formed in the flow path forming member, there is a possibility that a temperature difference is generated between the refrigerant flow path and the heat medium flow path. The temperature difference generated between the refrigerant flow path and the heat medium flow path becomes a main cause of thermal damage in the refrigerant and the heat medium, and there is a concern that the performance of the heat pump cycle and the heat medium circuit is reduced.

[0015] In this regard, in the heat pump assembly, the heat transfer suppression portion is formed between the refrigerant flow path and the heat medium flow path in the flow path forming member, and transfer of heat between the refrigerant flow path and the heat medium flow path is suppressed. Accordingly, according to the heat pump assembly, by the heat transfer suppression portion, it is possible to suppress generation of thermal damage in the refrigerant and the heat medium and prevent a decrease in the performance of the heat pump cycle and the heat medium circuit. BRIEF DESCRIPTION OF DRAWINGS

[0016] The above objects, other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:

[0017] Figure 1 is an external perspective view of a heat pump assembly according to a first embodiment.

[0018] Figure 2 is a configuration view of a heat pump system including the heat pump assembly.

[0019] Figure 3 is a configuration diagram of an indoor air conditioning unit in a heat pump system.

[0020] Figure 4 is a block diagram showing a control system of a heat pump system.

[0021] Figure 5 is a front view of a heat pump assembly according to the first embodiment.

[0022] Figure 6 is a plan view of a heat pump assembly according to the first embodiment.

[0023] Figure 7 is an explanatory diagram showing a flow path structure in a flow path forming member of a heat pump assembly according to the first embodiment.

[0024] Figure 8 is an explanatory diagram showing a flow path structure in a flow path forming member of a heat pump assembly according to the second embodiment. DETAILED DESCRIPTION

[0025] Hereinafter, a plurality of modes for implementing the present disclosure will be described with reference to the drawings. In each embodiment, there is a case where the same reference sign is annotated to a portion corresponding to the matter already explained in the preceding embodiment and the repeated explanation is omitted. In each embodiment, there is a case where only a part of the constitution is explained, and with respect to the other part of the constitution, the other embodiment explained previously can be applied. Not only in each embodiment, the part which can be combined can be combined with each other as long as there is no particular obstacle to the combination, and even if it is not explicitly expressed, the embodiments can be partially combined with each other.

[0026] (First Embodiment)

[0027] Reference Figures 1-7 The first embodiment in the present disclosure will be described. In the first embodiment, a heat pump assembly 1 according to the present disclosure is applied to a heat pump system 100 mounted on an electric vehicle. The electric vehicle is a vehicle which obtains a driving force for running from an electric motor. The heat pump system 100 has a heat pump cycle 20 and a plurality of heat medium circuits, performs air conditioning of a vehicle interior as an air conditioning target space, and performs temperature adjustment of a vehicle-mounted device. Therefore, the heat pump system 100 can be called an air conditioning device with a vehicle-mounted device cooling function or a vehicle-mounted device cooling device with an air conditioning function.

[0028] More specifically, the heat pump system 100 performs cooling of a battery as a vehicle-mounted device. The battery is a secondary battery which accumulates electric power supplied to a plurality of vehicle-mounted devices which operate by electric power. The battery is a battery pack formed by connecting a plurality of battery cells arranged in layers in series or in parallel. The battery cell of the first embodiment is a lithium ion battery.

[0029] The battery generates heat during operation (i.e., during charging and discharging). Batteries are characterized by a tendency for output to decrease at low temperatures and for degradation to progress rapidly at high temperatures. Therefore, the battery temperature must be maintained within a suitable temperature range (15°C or higher and 55°C or lower in the first embodiment). Therefore, in the heat pump system 100 of the first embodiment, battery cooling is performed as the battery temperature rises.

[0030] Therefore, in the heat pump system 100, the battery can be cooled by the heat generated by the heat pump cycle 20. In the heat pump system 100 of the first embodiment, the objects to be cooled are air and the battery.

[0031] like Figure 1 As shown, the heat pump assembly 1 according to the first embodiment is an integrated assembly of multiple structural devices constituting a heat pump cycle 20, which are assembled on a flow path forming member 10 formed in the shape of a flat plate. A refrigerant flow path and a heat transfer medium flow path are formed in the flow path forming member 10.

[0032] In the first embodiment, the structural device assembled in the flow path forming component 10 for the heat pump cycle 20 may include a compressor 21, a heat medium refrigerant heat exchanger 22, a receiver 23, a first expansion valve 25, a second expansion valve 26, a first chiller 27, and a second chiller 28. By assembling the heat pump cycle 20 including the compressor 21 into the flow path forming component 10, a portion of the structure of the heat pump system 100 can be modularized.

[0033] Hereinafter, the configuration of each structural device in the heat pump assembly 1 relative to the flow path forming member 10 and the configuration of each flow path formed inside the flow path forming member 10 will be described in detail with reference to the accompanying drawings.

[0034] Furthermore, when using the directions of front, back, left, right, up, and down in the following description, the reference is the left-right extension of the long side of the heat pump assembly 1 (i.e., the long side of the flow path forming component 10). Figure 1 The state indicated by the middle arrow is defined. The same definition is used for arrows appropriately represented in each diagram.

[0035] Next, a schematic structure of the heat pump system 100 including the heat pump assembly 1 according to the first embodiment will be described with reference to the accompanying drawings. Furthermore, in Figure 2 In the diagram, the portion of the heat pump system 100 consisting of the heat pump assembly 1 of the first embodiment is shown with dashed lines surrounding it.

[0036] like Figure 2As shown, the heat pump system 100 according to the first embodiment is configured to have a heat pump cycle 20, a high-temperature-side heat medium circuit 30, a first low-temperature-side heat medium circuit 40, and a second low-temperature-side heat medium circuit 50. The heat pump system 100 also has an indoor air conditioning unit 60 for supplying air-conditioned air that has been temperature-adjusted by warm heat and cool heat generated by the heat pump cycle 20, and a control device 70 for controlling the structures of the heat pump system 100.

[0037] First, the structure of the heat pump cycle 20 in the heat pump system 100 will be described. The heat pump cycle 20 is a vapor compression type chiller that is provided with a compressor 21, a heat medium refrigerant heat exchanger 22, a receiver 23, a first expansion valve 25, a second expansion valve 26, a first cold machine 27, and a second cold machine 28.

[0038] In the heat pump cycle 20 according to the first embodiment, a Freon-based refrigerant is used as the refrigerant, and a subcritical refrigeration cycle in which the refrigerant pressure on the high-pressure side does not exceed the critical pressure of the refrigerant is configured. Refrigeration oil for lubricating the compressor 21 is mixed in the refrigerant. A part of the refrigeration oil circulates in the cycle together with the refrigerant.

[0039] The compressor 21 is an electric compressor that is driven by electric power, and sucks, compresses, and discharges the refrigerant that circulates in the heat pump cycle 20. The compressor 21 houses a compression mechanism portion 21B that compresses the gaseous refrigerant in the heat pump cycle 20 and a drive portion 21C that drives the compression mechanism portion 21B, in the inside of a housing 21A that is formed in a substantially cylindrical shape. As shown in FIG. 2, the compressor 21 is provided with a motor 21D that is a drive source of the drive portion 21C. Figure 1 As shown, the compressor 21 according to the first embodiment constitutes a part of the heat pump assembly 1, and is mounted to the lower surface of the flow path forming member 10 that is a flat plate.

[0040] The discharge port side of the compressor 21 is connected to the refrigerant inlet side of the heat medium refrigerant heat exchanger 22 via the high-pressure-side flow path 11 and the first connection portion 15A that are formed as refrigerant flow paths in the flow path forming member 10. Here, the high-pressure-side flow path 11 is a flow path through which the high-pressure refrigerant discharged from the compressor 21 flows. Thus, the high-pressure-side flow path 11 corresponds to an example of the refrigerant flow path, and also corresponds to an example of the high-temperature-side flow path. That is, the high-pressure-side flow path 11 corresponds to the high-temperature-side refrigerant flow path.

[0041] The heat medium refrigerant heat exchanger 22 has a refrigerant passage 22A through which the high-pressure refrigerant discharged from the compressor 21 flows, and a heat medium passage 22B through which the high-temperature-side heat medium that circulates in the high-temperature-side heat medium circuit 30 flows.

[0042] The heat medium refrigerant heat exchanger 22 is a condenser that exchanges heat between the high-pressure refrigerant flowing in the refrigerant passage 22A and the high-temperature side heat medium flowing in the heat medium passage 22B to condense the high-pressure refrigerant. That is, the heat medium refrigerant heat exchanger 22 radiates heat possessed by the high-pressure refrigerant discharged from the compressor 21 to the high-temperature side heat medium circulating in the high-temperature side heat medium circuit 30 to heat the high-temperature side heat medium. The heat medium refrigerant heat exchanger 22 according to the first embodiment constitutes a part of the heat pump assembly 1 and is installed on the upper surface of the flow path forming member 10.

[0043] The refrigerant outlet side of the heat medium refrigerant heat exchanger 22 is connected to the receiver 23 via the high-pressure side flow path 11 of the flow path forming member 10 and the second connection portion 15B. The receiver 23 is a gas-liquid separation portion that separates the refrigerant flowing out of the refrigerant passage 22A of the heat medium refrigerant heat exchanger 22 into a gas phase and a liquid phase, causes the liquid phase refrigerant to flow to the downstream side, and stores the remaining refrigerant circulating. The receiver 23 according to the first embodiment constitutes a part of the heat pump assembly 1 and is installed on the lower surface of the flow path forming member 10.

[0044] The refrigerant branch portion 24A is connected to the flow outlet of the receiver 23. In the refrigerant branch portion 24A, one of the three inflow flow outlets is used as a refrigerant inflow outlet, and the remaining two are used as refrigerant outflow outlets. That is, the refrigerant branch portion 24A is a branch portion that branches the flow of the liquid phase refrigerant flowing out of the receiver 23.

[0045] The refrigerant outflow outlet of one of the refrigerant branch portion 24A is connected to the refrigerant inlet side of the first expansion valve 25 via the high-pressure side flow path 11 of the flow path forming member 10. Also, the refrigerant outflow outlet of the other of the refrigerant branch portion 24A is connected to the refrigerant inlet side of the second expansion valve 26 via the high-pressure side flow path 11 of the flow path forming member 10.

[0046] The first expansion valve 25 is a pressure reducing portion that pressure-reducingly expands the liquid phase refrigerant flowing out of the flow outlet of one of the refrigerant branch portion 24A. The first expansion valve 25 is an electrically driven variable throttle mechanism that has a valve core and an electrically driven actuator. The valve core is configured to be able to change the opening degree (in other words, the throttle opening degree) of the flow path of the refrigerant. The electrically driven actuator has a stepping motor that changes the throttle opening degree of the valve core.

[0047] The first expansion valve 25 is configured by a variable throttle mechanism that has a full-closing function that fully closes the flow path of the refrigerant. The first expansion valve 25 according to the first embodiment constitutes a part of the heat pump assembly 1 and is installed with respect to the upper surface of the flow path forming member 10. The operation of the first expansion valve 25 is controlled by a control signal output from the control device 70 shown in FIG. 1. Figure 4

[0048] ​The refrigerant outlet of the first expansion valve 25 is connected to the refrigerant inlet side of the first chiller 27 via the low-pressure side flow path 12 of the flow path forming component 10 and the third connecting portion 15C. Here, the low-pressure side flow path 12 is a flow path for low-pressure refrigerant after pressure reduction by the first expansion valve 25 and other pressure reducing components. Therefore, the low-pressure side flow path 12 is equivalent to an example of a refrigerant flow path, and also to an example of a low-temperature side flow path. That is, the low-pressure side flow path 12 is equivalent to a low-temperature side refrigerant flow path.

[0049] The first chiller 27 has a refrigerant passage 27A through which low-pressure refrigerant, after being depressurized by the first expansion valve 25, flows, and a heat medium passage 27B through which low-temperature heat medium circulating in the first low-temperature heat medium circuit 40 flows. The first chiller 27 is an evaporator that allows heat exchange between the low-pressure refrigerant flowing in the refrigerant passage 27A and the low-temperature heat medium flowing in the heat medium passage 27B, thereby causing the low-pressure refrigerant to evaporate and perform an endothermic function.

[0050] The outlet side of the refrigerant passage 27A in the first chiller 27 is connected to the refrigerant confluence section 24B via the low-pressure side flow path 12 of the flow path forming component 10 and the fourth connecting portion 15D. In the refrigerant confluence section 24B, two of the three inflow outlets are used as refrigerant inlets, and the remaining one is used as a refrigerant outlet. That is, the refrigerant confluence section 24B is a confluence section that merges the flows of refrigerant branched at the refrigerant branch section 24A.

[0051] like Figure 2 As shown, a second expansion valve 26 is connected to the refrigerant outlet on the other side of the refrigerant branch 24A. The second expansion valve 26 is a pressure-reducing section that causes the liquid refrigerant flowing out from the outlet on the other side of the receiver 23 to expand under reduced pressure. Like the first expansion valve 25, the second expansion valve 26 is configured to change the opening degree of the refrigerant flow path (in other words, the throttling opening degree).

[0052] Furthermore, the second expansion valve 26 is configured with a variable throttling mechanism that has a fully closed function to completely close the refrigerant flow path. The second expansion valve 26 according to the first embodiment is part of the heat pump assembly 1. The second expansion valve 26 is mounted on the upper surface of the flow path forming member 10 and is configured in the heat pump assembly 1 adjacent to the first expansion valve 25. The operation of the second expansion valve 26 is controlled by a control signal output from the control device 70.

[0053] The refrigerant outlet side of the second expansion valve 26 is connected to the refrigerant inlet side of the second cold machine 28 via the low-pressure side flow path 12 of the flow path forming member 10 and the fifth connection portion 15E. The second cold machine 28 has a refrigerant passage 28A through which the low-pressure refrigerant after being depressurized by the second expansion valve 26 flows, and a heat medium passage 28B through which the low-temperature side heat medium circulating in the second low-temperature side heat medium circuit 50 flows. The second cold machine 28 is an evaporator that exchanges heat between the low-pressure refrigerant flowing in the refrigerant passage 28A and the low-temperature side heat medium flowing in the heat medium passage 28B, and evaporates the low-pressure refrigerant to perform a heat absorbing function.

[0054] The outlet side of the refrigerant passage 28A in the second cold machine 28 is connected to the refrigerant confluence portion 24B via the low-pressure side flow path 12 of the flow path forming member 10 and the sixth connection portion 15F. Thus, the refrigerant confluence portion 24B confluences the flow of the refrigerant flowing out of the first cold machine 27 and the flow of the refrigerant flowing out of the second cold machine 28. Also, the flow outlet of the refrigerant confluence portion 24B is connected to the suction inlet side of the compressor 21 via the low-pressure side flow path 12 of the flow path forming member 10.

[0055] Further, in the heat pump cycle 20 of the first embodiment, the refrigerant is pressurized by the compressor 21, and after being depressurized by the first expansion valve 25 or the second expansion valve 26, is sucked into the compressor 21. Thus, the refrigerant flow path from the discharge outlet of the compressor 21 to the flow inlet of the first expansion valve 25 or the second expansion valve 26 can be referred to as a high-pressure side flow path. Also, the refrigerant flow path from the flow outlet of the first expansion valve 25 or the second expansion valve 26 to the suction inlet of the compressor 21 can be referred to as a low-pressure side flow path.

[0056] Next, the high-temperature side heat medium circuit 30 of the heat pump system 100 will be described. The high-temperature side heat medium circuit 30 is a circuit that circulates a high-temperature side heat medium. In the high-temperature side heat medium circuit 30, as the high-temperature side heat medium, an aqueous ethylene glycol solution is used. In the high-temperature side heat medium circuit 30, the heat medium passage 22B of the heat medium refrigerant heat exchanger 22, a high-temperature side pump 31, and a heater core 32 are arranged.

[0057] Further, the high-temperature side heat medium can be any fluid that can transfer heat heated by the heat medium refrigerant heat exchanger 22, and various kinds can be used. For example, as the high-temperature side heat medium, a liquid containing at least ethylene glycol, dimethyl polysiloxane, or a nanofluid, or an antifreeze liquid can be used.

[0058] The high-temperature side pump 31 is a heat medium pressurizing portion in the high-temperature side heat medium circuit 30 that sucks and pressurizes the high-temperature side heat medium. The discharge outlet side of the high-temperature side pump 31 is connected to the inlet side of the heat medium passage 22B in the heat medium refrigerant heat exchanger 22 via the high-temperature side heat medium flow path 13 of the flow path forming member 10 and the seventh connection portion 15G.

[0059] Therefore, the high-temperature side pump 31 pressurizes the high-temperature side heat medium toward the inlet side of the heat medium passage 22B of the heat medium refrigerant heat exchanger 22. The high-temperature side pump 31 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0060] Here, the high-temperature side heat medium flow path 13 is a flow path for the high-temperature side heat medium in the high-temperature side heat medium circuit 30 to flow in the flow path forming member 10. That is, the high-temperature side heat medium flow path 13 corresponds to an example of the heat medium flow path, and also corresponds to an example of the high-temperature side flow path.

[0061] The outlet side of the heat medium passage 22B in the heat medium refrigerant heat exchanger 22 is connected to the heat medium inlet side of the heater core 32 via the high-temperature side heat medium flow path 13 of the flow path forming member 10 and the eighth connection portion 15H. The heater core 32 is disposed in the housing 61 of the room air conditioning unit 60 as described later, and is a heating heat exchange portion that exchanges heat between the high-temperature side heat medium heated by the heat medium refrigerant heat exchanger 22 and the supply air. In the heater core 32, heat possessed by the high-temperature side heat medium is radiated to the supply air, and the supply air is heated. The heat medium outlet of the heater core 32 is connected to the suction inlet side of the high-temperature side pump 31.

[0062] Therefore, in the heat pump system 100 according to the first embodiment, by the respective structural devices of the heat medium refrigerant heat exchanger 22 and the high-temperature side heat medium circuit 30, the high-pressure refrigerant discharged from the compressor 21 can be used as a heat source to heat the supply air, and thus the air conditioning air can be heated.

[0063] Next, the first low-temperature side heat medium circuit 40 that constitutes the heat pump system 100 will be described. The first low-temperature side heat medium circuit 40 is a circuit that circulates a low-temperature side heat medium. In the first low-temperature side heat medium circuit 40, the same kind of fluid as the high-temperature side heat medium is used as the low-temperature side heat medium. In the first low-temperature side heat medium circuit 40, the heat medium passage 27B of the first cold machine 27, the first low-temperature side pump 41, and the battery heat exchange portion 42 are disposed.

[0064] The first low-temperature side pump 41 is a heat medium pressurizing portion that sucks and pressurizes the low-temperature side heat medium circulating in the first low-temperature side heat medium circuit 40. The discharge outlet side of the first low-temperature side pump 41 is connected to the inlet side of the heat medium passage 27B of the first cold machine 27 via the low-temperature side heat medium flow path 14 of the flow path forming member 10 and the ninth connection portion 15I.

[0065] Accordingly, the first low-temperature-side pump 41 pressurizes the low-temperature-side heat medium toward the inlet side of the heat medium passage 27B in the first cold machine 27. The first low-temperature-side pump 41 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0066] Here, the low-temperature-side heat medium flow path 14 is a flow path in the flow path forming member 10 for the low-temperature-side heat medium circulating in the first low-temperature-side heat medium circuit 40 or the second low-temperature-side heat medium circuit 50 to flow. That is, the low-temperature-side heat medium flow path 14 corresponds to an example of the heat medium flow path, and also corresponds to an example of the low-temperature-side flow path.

[0067] The outlet side of the heat medium passage 27B in the first cold machine 27 is connected to the heat medium inlet side of the battery heat exchange portion 42 via the low-temperature-side heat medium flow path 14 of the flow path forming member 10 and the tenth connection portion 15J. The battery heat exchange portion 42 is a heat exchange portion that exchanges heat between a plurality of battery cells constituting a battery and the low-temperature-side heat medium. The battery heat exchange portion 42 is configured to form a flow path for the low-temperature-side heat medium to flow through in a battery case that houses the plurality of battery cells. Further, the heat medium outlet of the battery heat exchange portion 42 is connected to the suction inlet side of the first low-temperature-side pump 41.

[0068] Accordingly, in the heat pump system 100 according to the first embodiment, the temperature adjustment function of adjusting the temperature of the battery can be achieved by the respective structural devices of the first cold machine 27 and the first low-temperature-side heat medium circuit 40.

[0069] Next, the second low-temperature-side heat medium circuit 50 constituting the heat pump system 100 will be described. The second low-temperature-side heat medium circuit 50 is a circuit that circulates the low-temperature-side heat medium. In the second low-temperature-side heat medium circuit 50, the same kind of fluid as the high-temperature-side heat medium can be used as the low-temperature-side heat medium. The second low-temperature-side heat medium circuit 50 is provided with the heat medium passage 28B of the second cold machine 28, the second low-temperature-side pump 51, and the cooler core 52.

[0070] The second low-temperature-side pump 51 is a heat medium pressurizing portion that sucks and pressurizes the low-temperature-side heat medium circulating in the second low-temperature-side heat medium circuit 50. The discharge outlet side of the second low-temperature-side pump 51 is connected to the inlet side of the heat medium passage 28B of the second cold machine 28 via the low-temperature-side heat medium flow path 14 of the flow path forming member 10 and the eleventh connection portion 15K. Accordingly, the second low-temperature-side pump 51 pressurizes the low-temperature-side heat medium toward the inlet side of the heat medium passage 28B in the second cold machine 28. The second low-temperature-side pump 51 is an electric water pump whose rotational speed (i.e., pressurizing capacity) is controlled by a control voltage output from the control device 70.

[0071] The outlet side of the heat medium passage 28B in the second chiller 28 is connected to the heat medium inlet side of the cooler core 52 via the low-temperature-side heat medium passage 14 of the flow path forming member 10 and the twelfth connection portion 15L. The cooler core 52 is a cooling heat exchange portion that exchanges heat between the low-temperature-side heat medium circulating in the second low-temperature-side heat medium circuit 50 and the supply air supplied to the vehicle cabin as an air conditioning target space, and cools the supply air. The cooler core 52 is disposed inside the indoor air conditioning unit 60 described later, and absorbs heat from the supply air blown to the vehicle cabin to the low-temperature-side heat medium. Therefore, the cooler core 52 corresponds to an example of a cooling portion that takes the supply air as a cooling target. The heat medium outlet side of the cooler core 52 is connected to the suction inlet side of the second low-temperature-side pump 51.

[0072] Therefore, in the heat pump system 100 according to the first embodiment, by the respective structural devices of the second chiller 28 and the second low-temperature-side heat medium circuit 50, the low-pressure refrigerant depressurized by the second expansion valve 26 can be used as a cold heat source to cool the supply air.

[0073] Next, the indoor air conditioning unit 60 of the heat pump system 100 will be described with reference to Figure 3 The indoor air conditioning unit 60 is a unit that integrates a plurality of structural devices in order to blow out the supply air adjusted to an appropriate temperature for air conditioning in the vehicle cabin of an electric vehicle to an appropriate position in the vehicle cabin. The indoor air conditioning unit 60 is disposed inside the instrument panel (instrument panel surface) at the most front portion of the vehicle cabin of the electric vehicle.

[0074] The indoor air conditioning unit 60 is formed by housing the indoor supply fan 62, the cooler core 52, the heater core 32, and the like in a housing 61 that forms an air passage of the supply air. The housing 61 is formed of a resin (for example, polypropylene) that has a certain degree of elasticity and excellent strength.

[0075] The indoor-outdoor air switching device 63 is disposed at the most upstream side of the flow of the supply air in the housing 61. The indoor-outdoor air switching device 63 switches the introduction of indoor air (that is, air in the vehicle cabin) and outdoor air (that is, air outside the vehicle cabin) into the housing 61. The operation of the indoor-outdoor air switching device 63 is controlled by a control signal output from the control device 70.

[0076] The indoor supply fan 62 is disposed at the downstream side of the flow of the supply air in the indoor-outdoor air switching device 63. The indoor supply fan 62 blows out the air sucked in via the indoor-outdoor air switching device 63 to the vehicle cabin. The rotation speed (that is, the supply capacity) of the indoor supply fan 62 is controlled by a control voltage output from the control device 70.

[0077] Downstream of the air supply airflow of the indoor air supply fan 62, the cooler core 52 and the heater core 32 are arranged in this order with respect to the air supply airflow. That is, the cooler core 52 is arranged on the upstream side of the air supply airflow compared to the heater core 32. A cool air bypass passage 65 is formed in the housing 61 to make the air supply air after passing through the cooler core 52 flow around the heater core 32.

[0078] Downstream of the air supply airflow of the cooler core 52 in the housing 61, and on the upstream side of the air supply airflow of the heater core 32 and the cool air bypass passage 65, an air mixing door 64 is arranged. The air mixing door 64 adjusts the air volume ratio of the air supply air passing through the side of the heater core 32 and the air volume of the air supply air passing through the cool air bypass passage 65 in the air supply air after passing through the cooler core 52. The operation of the drive portion of the air mixing door 64 is controlled by the control signal output from the control device 70.

[0079] Downstream of the air supply airflow of the heater core 32 and the cool air bypass passage 65, a mixing space is arranged. The mixing space is a space in which the air supply air heated by the heater core 32 and the air supply air passing through the cool air bypass passage 65 and not heated are mixed. Therefore, in the indoor air conditioning unit 60, by adjusting the opening degree of the air mixing door 64, the temperature of the air supply air (i.e., air conditioning air) mixed in the mixing space can be adjusted.

[0080] At the most downstream portion of the air supply airflow of the housing 61, a plurality of opening holes for blowing air conditioning air to various parts in the vehicle cabin are formed. At the plurality of opening holes, blow-out mode doors that open and close each opening hole are arranged. The operation of the drive portion of the blow-out mode door is controlled by the control signal output from the control device 70. Therefore, in the indoor air conditioning unit 60, by switching the opening hole of the blow-out mode door that is opened and closed, air conditioning air adjusted to an appropriate temperature can be blown to an appropriate part in the vehicle cabin.

[0081] According to the heat pump system 100 thus configured, by controlling the operation of the heat pump cycle 20, the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50, the air conditioning of the vehicle cabin and the temperature adjustment of the on-vehicle equipment can be appropriately performed.

[0082] Next, the operation of the heat pump system 100 will be described. Figure 4 The outline of the electric control portion of the heat pump system 100 will be described. The control device 70 is configured by a well-known microcomputer including a CPU, a ROM, a RAM, and the like, and a peripheral circuit thereof. The control device 70 performs various operations and processes according to a control program stored in the ROM, and controls the operation of various control target devices connected to the output side. The control device 70 corresponds to an example of the control portion.

[0083] Various control target devices include the compressor 21, the first expansion valve 25, the second expansion valve 26, the high-temperature side pump 31, the first low-temperature side pump 41, the second low-temperature side pump 51, the indoor blower 62, the inside / outside air switching device 63, the air mixing door 64, and the like. Among them, the compressor 21, the first expansion valve 25, and the second expansion valve 26 are structural devices of the heat pump assembly 1, and thus control commands from the control device 70 are transmitted to the heat pump assembly 1.

[0084] Also, as shown in FIG. 1, various control sensors are connected to the input side of the control device 70. As the control sensors, an inside air temperature sensor 72A, an outside air temperature sensor 72B, a solar radiation sensor 72C, and an air conditioning air temperature sensor 72D are connected. In addition, as the control sensors, a first refrigerant temperature sensor 73A, a second refrigerant temperature sensor 73B, a third refrigerant temperature sensor 73C, a first heat medium temperature sensor 74A, a second heat medium temperature sensor 74B, and a third heat medium temperature sensor 74C are connected. Figure 4

[0085] Also, the inside air temperature sensor 72A is an inside air temperature detection portion that detects an inside air temperature Tr that is a temperature of the vehicle cabin. The outside air temperature sensor 72B is an outside air temperature detection portion that detects an outside air temperature Tam that is a temperature of the vehicle cabin outside. The solar radiation sensor 72C is a solar radiation amount detection portion that detects a solar radiation amount As that is an amount of solar radiation that is radiated into the vehicle cabin. The air conditioning air temperature sensor 72D is an air conditioning air temperature detection portion that detects a blow-out air temperature TAV that is a temperature of blow-out air that is blown out from the mixing space into the vehicle cabin.

[0086] The first refrigerant temperature sensor 73A is a refrigerant temperature detection portion that detects a temperature of high-pressure refrigerant that is discharged from the compressor 21. The first refrigerant temperature sensor 73A is, for example, disposed on the inlet side in a refrigerant passage 22A of the heat medium refrigerant heat exchanger 22.

[0087] The second refrigerant temperature sensor 73B is a refrigerant temperature detection portion that detects a temperature of low-pressure refrigerant that flows out from the first cold machine 27. The second refrigerant temperature sensor 73B is, for example, disposed on the outlet side in a refrigerant passage 27A of the first cold machine 27.

[0088] The third refrigerant temperature sensor 73C is a refrigerant temperature detection portion that detects a temperature of low-pressure refrigerant that flows out from the second cold machine 28. The third refrigerant temperature sensor 73C is, for example, disposed on the outlet side in a refrigerant passage 28A of the second cold machine 28.

[0089] Also, the first refrigerant temperature sensor 73A to the third refrigerant temperature sensor 73C are assembled to the heat pump assembly 1, and detection results of the respective sensors are output from the heat pump assembly 1 to the control device 70.

[0090] ​Further, the sensors incorporated in the control sensors of the heat pump assembly 1 are not limited to the first to third refrigerant temperature sensors 73A to 73C. As the control sensors incorporated in the heat pump assembly 1, a refrigerant pressure sensor that detects the pressure of the refrigerant circulating in the heat pump cycle 20 can be provided. In this case, a structure in which a plurality of refrigerant pressure sensors are incorporated in the heat pump assembly 1 can be employed.

[0091] The first heat medium temperature sensor 74A is a heat medium temperature detecting portion that detects the temperature of the high-temperature-side heat medium circulating in the high-temperature-side heat medium circuit 30. The first heat medium temperature sensor 74A is provided, for example, at the outlet side of the heat medium passage 22B in the heat medium refrigerant heat exchanger 22.

[0092] The second heat medium temperature sensor 74B is a heat medium temperature detecting portion that detects the temperature of the low-temperature-side heat medium circulating in the first low-temperature-side heat medium circuit 40. The second heat medium temperature sensor 74B is provided, for example, at the outlet side of the heat medium passage 27B in the first cold machine 27.

[0093] The third heat medium temperature sensor 74C is a heat medium temperature detecting portion that detects the temperature of the low-temperature-side heat medium circulating in the second low-temperature-side heat medium circuit 50. The third heat medium temperature sensor 74C is provided, for example, at the outlet side of the heat medium passage 28B in the second cold machine 28.

[0094] Further, the flow path forming member 10 of the heat pump assembly 1 is formed with a portion of the heat medium flow path constituting the high-temperature-side heat medium circuit 30, the first low-temperature-side heat medium circuit 40, and the second low-temperature-side heat medium circuit 50. Therefore, the first to third heat medium temperature sensors 74A to 74C can be employed as the control sensors constituting the heat pump assembly 1 and integrated as the heat pump assembly 1.

[0095] Further, an operation panel 71 provided in the vicinity of the instrument panel in the front portion of the passenger compartment of the electric automobile is connected to the input side of the control device 70. Operation signals from various operation switches provided in the operation panel 71 are input to the control device 70.

[0096] As the various operation switches provided in the operation panel 71, specifically, there are an automatic switch, an air conditioning switch, an air volume setting switch, a temperature setting switch, and the like. The automatic switch is an operation switch that sets or cancels automatic control operation of the heat pump cycle 20.

[0097] The air conditioning switch is an operation switch that requests cooling of the supply air by the cooler core 52. The air volume setting switch is an operation switch that is operated when the air volume of the indoor blower 62 is manually set. The temperature setting switch is an operation switch that sets the target temperature Tset of the passenger compartment.

[0098] Also, the control device 70 of the first embodiment is a structure in which a control section that controls various control target devices connected to the output side thereof is integrated. Therefore, the structure (i.e., hardware and software) that controls the operation of each control target device constitutes the control section that controls the operation of each control target device.

[0099] For example, the structure in the control device 70 that controls the refrigerant discharge capacity (e.g., rotational speed) of the compressor 21 in the heat pump cycle 20 corresponds to a compressor control section. Also, the structure in the control device 70 that controls the pressure reduction amount (i.e., throttle opening degree) of the first expansion valve 25 and the second expansion valve 26 of the heat pump cycle 20 corresponds to a pressure reduction control section.

[0100] Next, the specific structure of the heat pump assembly 1 related to the first embodiment will be described with reference to Figures 5-7 The specific structure of the heat pump assembly 1 related to the first embodiment will be described with reference to

[0101] First, the structure of the compressor 21 that constitutes the heat pump assembly 1 will be described. As shown in Figure 5 The compressor 21 has a housing 21A, a compression mechanism section 21B, a driving section 21C, a discharge port section 21D, a discharge flow path 21E, a suction port section 21F, and a suction flow path 21G.

[0102] The compressor 21 houses, inside the housing 21A that is formed in a substantially cylindrical shape, the compression mechanism section 21B that compresses the gas-phase refrigerant of the heat pump cycle 20 and the driving section 21C that causes the compression mechanism section 21B to operate.

[0103] As the compression mechanism section 21B, for example, a fixed displacement type compression mechanism in which the discharge capacity is fixed can be used. As the specific mechanism of the compression mechanism section 21B, various compression mechanisms that can suck, compress, and discharge refrigerant can be used.

[0104] The driving section 21C is, for example, composed of an electric motor and generates a driving force for causing the compression mechanism section 21B to operate. The driving section 21C is arranged side by side with the compression mechanism section 21B in the longitudinal direction of the substantially cylindrical housing 21A. As shown in Figure 5 The compression mechanism section 21B is arranged in the left side portion of the housing 21A of the compressor 21, and the driving section 21C is arranged adjacent to the right side of the compression mechanism section 21B.

[0105] Furthermore, the compressor 21 includes a discharge port 21D, a discharge flow path 21E, a suction port 21F, and a suction flow path 21G. The discharge port 21D is configured to have a discharge port for discharging high-pressure refrigerant compressed by the compression mechanism 21B and a discharge chamber associated with the refrigerant discharged from the discharge port. The discharge port 21D is disposed, for example, inside the housing 21A on the left side of the compression mechanism 21B.

[0106] The discharge flow path 21E is a refrigerant flow path formed in the housing 21A that guides the high-pressure refrigerant discharged through the discharge port 21D to the outside of the compressor 21. The end of the discharge flow path 21E is connected to the high-pressure side flow path 11 formed in the flow path forming member 10. Therefore, the discharge flow path 21E is connected to the inlet side of the refrigerant passage 22A of the heat medium refrigerant heat exchanger 22 via the high-pressure side flow path 11 of the flow path forming member 10 and the first connecting portion 15A.

[0107] The suction port 21F has a suction port for drawing in low-pressure refrigerant, which is the object of compression in the compression mechanism 21B, and a suction chamber associated with the low-pressure refrigerant guided to the suction port. The suction port 21F is disposed, for example, inside the housing 21A on the right side of the drive unit 21C.

[0108] The suction flow path 21G is a refrigerant flow path formed in the housing 21A that guides the low-pressure refrigerant flowing through the low-pressure side flow path 12 of the flow path forming member 10 to the suction port 21F inside the compressor 21. The end of the suction flow path 21G is connected to the outlet side of the refrigerant passage 27A of the first refrigerator 27 and the outlet side of the refrigerant passage 28A of the second refrigerator 28 via the low-pressure side flow path 12, the fourth connection 15D and the sixth connection 15F of the flow path forming member 10.

[0109] like Figure 5 , Figure 6 As shown, each structural component of the heat pump assembly 1 is configured with the position of the center of gravity of the compressor 21 (hereinafter referred to as the compressor center of gravity G) as a reference, so that the center of gravity of the heat pump assembly 1 does not shift significantly.

[0110] Furthermore, in the flow path forming component 10 of each structural device on which the heat pump assembly 1 is installed, a discharge side region Ro and a suction side region Ri are defined. The discharge side region Ro and the suction side region Ri in the flow path forming component 10 are determined by the relative positional relationship between the compressor 21 constituting the heat pump assembly 1 and the flow path forming component 10.

[0111] Specifically, the discharge side region Ro and the suction side region Ri in the flow path forming component 10 are configured to be adjacent in the left-right direction when viewed from one side of the flat surface constituting the upper surface of the flow path forming component 10, via a reference line KL determined based on the compressor's center of gravity G.

[0112] The reference line KL is determined as passing through the center of gravity of the compressor 21, i.e., the compressor center of gravity G, in a case where the flat surface of the flow path forming member 10 in the heat pump assembly 1 is viewed from the vertical direction. The reference line KL in the first embodiment is determined as a straight line passing through the compressor center of gravity G and extending in the front-rear direction.

[0113] Further, the discharge side region Ro and the suction side region Ri divided by the reference line KL need not be the same plane as the flat surface of the flow path forming member 10, and have an extension in the up-down direction. Therefore, the heat pump assembly 1 includes the reference line KL passing through the compressor center of gravity G, and is divided into the discharge side region Ro and the suction side region Ri according to the reference plane extending in the up-down direction.

[0114] The discharge side region Ro of the flow path forming member 10 is located on one side (left side in the drawing) with respect to the reference line KL in the flow path forming member 10. As described later, the high-pressure side flow path 11 for the flow of high-pressure refrigerant in the heat pump cycle 20 is provided in the discharge side region Ro of the flow path forming member 10. Since the high-pressure side flow path 11 is connected to the discharge port portion 21D side of the compressor 21, the discharge side region Ro of the flow path forming member 10 can be referred to as a portion on the discharge port portion 21D side of the compressor 21 in the flow path forming member 10, which exhibits a high temperature accompanying compression of the refrigerant and flow of the high-pressure refrigerant.

[0115] Further, the suction side region Ri of the flow path forming member 10 is located on the other side (right side in the drawing) with respect to the reference line KL of the flow path forming member 10. The low-pressure side flow path 12 for the flow of low-pressure refrigerant in the heat pump cycle 20 is provided in the suction side region Ri of the flow path forming member 10. Since the low-pressure side flow path 12 is connected to the suction port portion 21F side of the compressor 21, the suction side region Ri of the flow path forming member 10 can be referred to as a portion on the suction port side of the compressor 21 in the flow path forming member 10, which exhibits a lower temperature than the discharge side region Ro accompanying flow of the low-pressure refrigerant.

[0116] As shown in FIG. 1, the heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, and the second expansion valve 26 are installed as structural devices on the discharge side region Ro side of the flow path forming member 10 in the heat pump assembly 1. Figure 5 , Figure 6 The heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, and the second expansion valve 26 are structural devices in the heat pump cycle 20 in which high-pressure refrigerant flows. Therefore, the heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, and the second expansion valve 26 correspond to an example of the high-pressure side refrigerant device.

[0117] As described above, the heat exchanger 22, which is the heat medium refrigerant heat exchanger, functions as a condenser in the heat pump cycle 20. Figure 5 , Figure 6 As shown, the heat medium refrigerant heat exchanger 22 is installed at the leftmost position on the upper surface of the flow path forming component 10 and is disposed in the discharge side region Ro.

[0118] Furthermore, the heat medium refrigerant heat exchanger 22 has a refrigerant passage 22A and a heat medium passage 22B. The refrigerant passage 22A of the heat medium refrigerant heat exchanger 22 is connected to the high-pressure side flow path 11 formed in the flow path forming member 10 via the first connecting portion 15A and the second connecting portion 15B of the flow path forming member 10.

[0119] The inlet side of the heat medium passage 22B of the heat medium refrigerant heat exchanger 22 is connected to the outlet side of the high-temperature side pump 31 via the high-temperature side heat medium flow path 13 formed in the flow path forming member 10 and the seventh connection portion 15G. Conversely, the outlet side of the heat medium passage 22B of the heat medium refrigerant heat exchanger 22 is connected to the heat medium inlet side of the heater core 32 via the high-temperature side heat medium flow path 13 formed in the flow path forming member 10 and the eighth connection portion 15H.

[0120] Receiver 23 is a gas-liquid separation section that separates the refrigerant flowing from the heat medium refrigerant heat exchanger 22, allowing the liquid refrigerant to flow downstream, and stores the remaining refrigerant in the cycle. For example... Figure 5 , Figure 6 As shown, receiver 23 is installed on the leftmost position on the lower surface of flow path forming component 10 (i.e., to the left of compressor 21), and is disposed in the discharge side region Ro.

[0121] The first expansion valve 25 is a pressure-reducing section that reduces the pressure of the high-pressure refrigerant flowing out from the refrigerant outlet on one side of the refrigerant branch 24A. Because of the inflow of high-pressure refrigerant, the first expansion valve 25 is equivalent to an example of the high-pressure side refrigerant device in the first embodiment. The first expansion valve 25 is disposed adjacent to the right side of the heat medium refrigerant heat exchanger 22 on the upper surface of the flow path forming member 10, located on the rearward side in the front-rear direction.

[0122] like Figure 6 As shown, the first expansion valve 25 is positioned near the baseline KL within the discharge-side region Ro of the flow path forming member 10. The inlet side of the first expansion valve 25 is connected to the outlet side of the receiver 23 via the high-pressure side flow path 11 formed in the flow path forming member 10. Furthermore, the outlet side of the first expansion valve 25 is connected to the inlet side of the refrigerant passage 27A of the first chiller 27 via the low-pressure side flow path 12 of the flow path forming member 10 and the third connection portion 15C.

[0123] The second expansion valve 26 is a pressure-reducing section that reduces the pressure of the high-pressure refrigerant flowing out of the refrigerant outlet on the other side of the refrigerant branch 24A. Because of the inflow of high-pressure refrigerant, the second expansion valve 26 corresponds to an example of the high-pressure side refrigerant device in the first embodiment. The second expansion valve 26 is disposed adjacent to the right side of the heat medium refrigerant heat exchanger 22 in the upper surface of the flow path forming member 10, and is adjacent to the front of the first expansion valve 25.

[0124] like Figure 6 As shown, the second expansion valve 26 is arranged side-by-side with the first expansion valve 25 in the discharge side region Ro of the flow path forming member 10, near the reference line KL. The inlet side of the second expansion valve 26 is connected to the outlet side of the receiver 23 via the high-pressure side flow path 11 formed in the flow path forming member 10. In addition, the outlet side of the second expansion valve 26 is connected to the inlet side of the refrigerant passage 28A of the second chiller 28 via the low-pressure side flow path 12 of the flow path forming member 10 and the fifth connection portion 15E.

[0125] On the other hand, a first refrigerant 27 and a second refrigerant 28 are installed on the suction side region Ri of the flow path forming component 10 in the heat pump assembly 1, constituting a machine. The first refrigerant 27 and the second refrigerant 28 are structural devices for supplying low-pressure refrigerant in the heat pump cycle 20. Therefore, the first refrigerant 27 and the second refrigerant 28 are examples of low-pressure side refrigerant devices.

[0126] As described above, the first chiller 27 is a heat exchanger that functions as an evaporator in the heat pump cycle 20. Figure 5 , Figure 6 As shown, the first chiller 27 is installed on the rightmost position on the upper surface of the flow path forming component 10, and is disposed in the suction side region Ri.

[0127] Furthermore, the first chiller 27 has a refrigerant passage 27A and a heat medium passage 27B. The inlet side of the refrigerant passage 27A of the first chiller 27 is connected to the low-pressure side flow passage 12 formed in the flow passage forming member 10 via the third connecting portion 15C of the flow passage forming member 10. Furthermore, the outlet side of the refrigerant passage 27A of the first chiller 27 is connected to the suction port 21F side of the compressor 21 via the low-pressure side flow passage 12 formed in the flow passage forming member 10 and the fourth connecting portion 15D.

[0128] Furthermore, the inlet side of the heat medium passage 27B of the first chiller 27 is connected to the outlet side of the first low-temperature pump 41 via the low-temperature side heat medium flow path 14 formed in the flow path forming member 10 and the ninth connecting portion 15I. Also, the outlet side of the heat medium passage 27B of the first chiller 27 is connected to the heat medium inlet side of the battery heat exchanger 42 via the low-temperature side heat medium flow path 14 formed in the flow path forming member 10 and the tenth connecting portion 15J.

[0129] Like the first refrigeration unit 27, the second chiller 28 is a heat exchanger that functions as an evaporator in the heat pump cycle 20. For example... Figure 5 , Figure 6 As shown, the second chiller 28 is mounted on the upper surface of the flow path forming component 10 in a manner adjacent to the left side of the first chiller 27 and is disposed within the suction side region Ri.

[0130] Furthermore, the second chiller 28 has a refrigerant passage 28A and a heat medium passage 28B. The inlet side of the refrigerant passage 28A of the second chiller 28 is connected to the low-pressure side flow passage 12 formed in the flow passage forming member 10 via the fifth connecting portion 15E. Furthermore, the outlet side of the refrigerant passage 28A of the second chiller 28 is connected to the suction port 21F side of the compressor 21 via the low-pressure side flow passage 12 formed in the flow passage forming member 10 and the sixth connecting portion 15F.

[0131] Furthermore, the inlet side of the heat medium passage 28B of the second chiller 28 is connected to the outlet side of the second low-temperature pump 51 via the low-temperature side heat medium flow path 14 formed in the flow path forming member 10 and the eleventh connection portion 15K. Also, the outlet side of the heat medium passage 28B of the second chiller 28 is connected to the heat medium inlet side of the cooler core 52 via the low-temperature side heat medium flow path 14 formed in the flow path forming member 10 and the twelfth connection portion 15L.

[0132] And, as Figure 5 As shown, the relative positional relationship between the compressor 21 and the flow path forming member 10 is determined with the compression mechanism 21B of the compressor 21 located on the discharge side region Ro and the drive part 21C of the compressor 21 located on the suction side region Ri. Figure 5 , Figure 6 The configuration of the various structural devices in the heat pump assembly 1 shown enables weight balance between the exhaust side (Ro side) and the intake side (Ri side).

[0133] That is, the center of gravity of the heat pump assembly 1 will not shift significantly from the center of gravity of the compressor 21 (i.e., the compressor center of gravity G) towards either the discharge side or the suction side, thus enabling the heat pump assembly 1 to be configured. Therefore, the heat pump assembly 1 can suppress the reduction in installability to other devices (electric vehicles in the first embodiment).

[0134] Also, in the heat pump assembly 1 according to the first embodiment, the high-pressure side refrigerant devices, such as the heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, the second expansion valve 26, and the like, are arranged on the discharge side region Ro side of the flow path forming member 10. These high-pressure side refrigerant devices are all structural devices for the inflow of high-pressure refrigerant that shows a high temperature, and thus the temperature zone of each of the high-pressure side refrigerant devices also indicates a relatively high state.

[0135] Therefore, by arranging the high-pressure side refrigerant devices in the heat pump cycle 20 on the discharge side region Ro side of the flow path forming member 10, the temperature zones of the high-pressure side refrigerant devices can be brought close to each other. Thus, according to the heat pump assembly 1, by arranging the high-pressure side refrigerant devices on the discharge side region Ro of the flow path forming member 10, heat damage between the high-pressure side refrigerant devices can be suppressed.

[0136] In addition, in the heat pump assembly 1, the low-pressure side refrigerant devices, such as the first cold machine 27 and the second cold machine 28, are arranged on the suction side region Ri side of the flow path forming member 10. These low-pressure side refrigerant devices are structural devices for the flow-through of low-pressure refrigerant that shows a low temperature, and thus the temperature zone of each of the structural devices also indicates a relatively low state.

[0137] Therefore, by arranging the low-pressure side refrigerant devices in the heat pump cycle 20 on the suction side region Ri side of the flow path forming member 10, the temperature zones of the low-pressure side refrigerant devices can be brought close to each other. Thus, according to the heat pump assembly 1, by arranging the low-pressure side refrigerant devices on the suction side region Ri of the flow path forming member 10, heat damage between the low-pressure side refrigerant devices can be suppressed.

[0138] Furthermore, on the upper surface of the flow path forming member 10, the first expansion valve 25 and the second expansion valve 26 are arranged between the heat medium refrigerant heat exchanger 22 as the high-pressure side refrigerant device and the first cold machine 27 and the second cold machine 28 as the low-pressure side refrigerant devices.

[0139] The first expansion valve 25 and the second expansion valve 26 are both devices for the inflow of high-pressure refrigerant from the refrigerant branch portion 24A, and are also devices for the outflow of low-pressure refrigerant that has been depressurized. Therefore, it can be considered that the first expansion valve 25 and the second expansion valve 26 show a temperature zone that is closer to the low-pressure side refrigerant devices than the heat medium refrigerant heat exchanger 22 and the receiver 23 among the high-pressure side refrigerant devices.

[0140] As Figure 5As shown, by arranging a first expansion valve 25 and a second expansion valve 26 between the heat medium refrigerant heat exchanger 22 and the first chiller 27 and the second chiller 28, thermal damage generated between the heat medium refrigerant heat exchanger 22 and the first chiller 27 and the second chiller 28 can be suppressed.

[0141] Next, refer to Figure 7 The specific structure of the flow path forming member 10 in the heat pump assembly 1 will be described below. As described above, the flow path forming member 10 is formed in the shape of a flat plate and has a portion of the heat medium flow path in the heat pump cycle 20, the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50. Furthermore, a heat transfer suppression section 16 for suppressing heat transfer between the refrigerant flow path and the heat medium flow path is formed in the flow path forming member 10.

[0142] The heat transfer suppression section 16 according to the first embodiment is composed of a slit 16A formed in the flow path forming member 10. The slit 16A is disposed between the refrigerant flow path and the heat medium flow path, around either the refrigerant flow path or the heat medium flow path, and has a hollow internal space. Since the internal space of the slit 16A is filled with air, which has a lower thermal conductivity than the constituent material of the flow path forming member 10, the heat transfer between the refrigerant flow path and the heat medium flow path can be blocked by the slit 16A separating the refrigerant flow path and the heat medium flow path.

[0143] Furthermore, it is preferable to set the formation range of the slit 16A in the vertical direction (i.e., the thickness direction) of the flow path forming member 10 to be wider than the range of the refrigerant flow path and the heat medium flow path formed in the flow path forming member 10. This is because the heat transfer between the refrigerant flow path and the heat medium flow path can be reliably blocked through the slit 16A, thereby suppressing heat damage.

[0144] like Figure 7 As shown, a high-pressure side flow path 11 and a high-temperature side heat medium flow path 13 are formed in the discharge side region Ro of the flow path forming member 10. Specifically, in the discharge side region Ro of the flow path forming member 10, the high-pressure side flow path 11 is formed by extending from the first connecting portion 15A and the second connecting portion 15B. In addition, in the discharge side region Ro of the flow path forming member 10, the high-temperature side heat medium flow path 13 is formed by extending from the seventh connecting portion 15G and the eighth connecting portion 15H.

[0145] Further, in the heat pump cycle 20 according to the first embodiment, in the heat medium refrigerant heat exchanger 22, heat possessed by the high-pressure refrigerant flowing through the refrigerant passage 22A is radiated with respect to the high-temperature side heat medium flowing through the heat medium passage 22B. Therefore, the temperature of the high-pressure refrigerant is in a state of being higher than the temperature of the high-temperature side heat medium.

[0146] The high-pressure side flow path 11 extending from the first connection portion 15A is formed in the discharge side region Ro of the flow path forming member 10, and is disposed on the front side of the left end of the flow path forming member 10. The high-temperature side heat medium flow path 13 extending from the seventh connection portion 15G is formed in the discharge side region Ro of the flow path forming member 10, and is disposed in a straight line shape extending from the rear side toward the front side along the left end portion of the flow path forming member 10.

[0147] Here, the slit 16A as the heat transfer suppression portion 16 is formed in the right side portion and the rear side portion of the high-pressure side flow path 11 extending from the first connection portion 15A. The slit 16A is disposed between the high-pressure side flow path 11 extending from the first connection portion 15A disposed in the front-rear direction and the high-temperature side heat medium flow path 13 extending from the seventh connection portion 15G. Thus, it is possible to suppress the generation of heat damage between the high-pressure side flow path 11 extending from the first connection portion 15A disposed in the front-rear direction and the high-temperature side heat medium flow path 13 extending from the seventh connection portion 15G.

[0148] Specifically, according to the heat pump assembly 1, it is possible to suppress the temperature of the high-pressure refrigerant flowing in the high-pressure side flow path 11 extending from the first connection portion 15A from decreasing due to the heat of the high-temperature side heat medium flowing in the high-temperature side heat medium flow path 13 related to the seventh connection portion 15G. Also, according to the heat pump assembly 1, it is possible to suppress the temperature of the high-temperature side heat medium flowing in the high-temperature side heat medium flow path 13 related to the seventh connection portion 15G from increasing due to the heat of the high-pressure refrigerant flowing in the high-pressure side flow path 11 of the first connection portion 15A.

[0149] In addition, in the discharge side region Ro of the flow path forming member 10, the high-temperature side heat medium flow path 13 extending from the eighth connection portion 15H is formed on the right side of the high-pressure side flow path 11 extending from the first connection portion 15A. The high-temperature side heat medium flow path 13 extending from the eighth connection portion 15H extends from the front side toward the rear side on the right side of the high-pressure side flow path 11 extending from the first connection portion 15A and the high-temperature side heat medium flow path 13 extending from the seventh connection portion 15G.

[0150] As Figure 7As shown, in the right side portion of the high-pressure side flow path 11 extending from the first connection portion 15A, a slit 16A is formed between the high-temperature side heat medium flow path 13 extending from the eighth connection portion 15H. Thus, in the discharge side region Ro of the flow path forming member 10, the generation of thermal damage between the high-pressure side flow path 11 related to the first connection portion 15A and the high-temperature side heat medium flow path 13 related to the eighth connection portion 15H arranged in the left-right direction can be suppressed.

[0151] Also, in the discharge side region Ro of the flow path forming member 10, the second connection portion 15B is formed in the rear of the high-temperature side heat medium flow path 13 extending from the right side of the seventh connection portion 15G and from the eighth connection portion 15H. The high-pressure side flow path 11 extending from the second connection portion 15B is formed so as to extend toward the reference line KL in the rear of the high-temperature side heat medium flow path 13 related to the eighth connection portion 15H and so as to extend toward the front between the high-temperature side heat medium flow path 13 related to the eighth connection portion 15H and the reference line KL.

[0152] Here, between the high-pressure side flow path 11 extending from the second connection portion 15B and the high-temperature side heat medium flow path 13 extending from the eighth connection portion 15H, a slit 16A as a heat transfer suppression portion 16 is formed. Specifically, the slit 16A is formed along the high-pressure side flow path 11 in the right side of the high-pressure side flow path 11 extending from the second connection portion 15B. Thus, the generation of thermal damage between the high-pressure side flow path 11 extending from the second connection portion 15B and the high-temperature side heat medium flow path 13 extending from the eighth connection portion 15H arranged adjacent can be suppressed.

[0153] Thus, in the discharge side region Ro of the flow path forming member 10, a portion of the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13 in the heat pump assembly 1 is arranged concentratedly. In the heat pump assembly 1 related to the first embodiment, since it is considered that the portion of the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13 formed in the discharge side region Ro of the flow path forming member 10 belongs to the same temperature zone, the thermal damage generated between the fluid flow paths formed in the discharge side region Ro can be suppressed.

[0154] Also, in the discharge side region Ro of the flow path forming member 10, a slit 16A as a heat transfer suppression portion 16 is formed between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13. Thus, the influence of heat between the high-pressure refrigerant flowing in the high-pressure side flow path 11 and the high-temperature side heat medium flowing in the high-temperature side heat medium flow path 13 can be reduced, and the generation of thermal damage between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13 can be suppressed.

[0155] As Figure 7As shown, the low-pressure-side flow passage 12 and the low-temperature-side heat medium flow passage 14 are formed in the suction-side region Ri of the flow passage forming member 10. Specifically, in the suction-side region Ri of the flow passage forming member 10, as the low-pressure-side flow passage 12, the low-pressure-side flow passage 12 extending from the third connection portion 15C, the low-pressure-side flow passage 12 extending from the fourth connection portion 15D are formed. Further, in the suction-side region Ri, the low-pressure-side flow passage 12 extending from the fifth connection portion 15E, the low-pressure-side flow passage 12 extending from the sixth connection portion 15F are formed.

[0156] Further, in the suction-side region Ri of the flow passage forming member 10, as the low-temperature-side heat medium flow passage 14, the low-temperature-side heat medium flow passage 14 extending from the ninth connection portion 15I, the low-temperature-side heat medium flow passage 14 extending from the tenth connection portion 15J are formed. Further, in the suction-side region Ri, the low-temperature-side heat medium flow passage 14 extending from the eleventh connection portion 15K, the low-temperature-side heat medium flow passage 14 extending from the twelfth connection portion 15L are formed.

[0157] Further, in the heat pump cycle 20 according to the first embodiment, in the first cold machine 27 or the second cold machine 28, heat of the low-temperature-side heat medium flowing through the heat medium passage is absorbed by the low-pressure refrigerant flowing through the refrigerant passage. Therefore, the temperature of the low-pressure refrigerant is in a state lower than the temperature of the low-temperature-side heat medium.

[0158] The fifth connection portion 15E is formed in the front portion of the suction-side region Ri of the flow passage forming member 10 on the reference line KL side (i.e., the left side). The low-pressure-side flow passage 12 extending from the fifth connection portion 15E is formed so as to extend in the right direction from the fifth connection portion 15E.

[0159] The eleventh connection portion 15K is formed in the rear portion of the suction-side region Ri of the flow passage forming member 10 on the reference line KL side (i.e., the left side). The low-temperature-side heat medium flow passage 14 extending from the eleventh connection portion 15K is formed so as to extend toward the front from the rear and then extend in the right direction. Therefore, a portion of the low-temperature-side heat medium flow passage 14 extending from the eleventh connection portion 15K is adjacent to the low-pressure-side flow passage 12 extending from the fifth connection portion 15E.

[0160] Here, in the flow passage forming member 10 of the heat pump assembly 1 according to the first embodiment, the slit 16A as the heat transfer inhibiting portion 16 is formed along the reference line KL. As shown, the low-pressure-side flow passage 12 related to the fifth connection portion 15E formed on the suction-side region Ri side and the low-temperature-side heat medium flow passage 14 related to the eleventh connection portion 15K are adjacent across the reference line KL with respect to the high-pressure-side flow passage 11 of the second connection portion 15B formed on the discharge-side region Ro side. Figure 7

[0161] ​By forming the slit 16A along the reference line KL between the discharge-side region Ro and the suction-side region Ri, heat damage between the high-pressure-side flow path 11 involved by the second connection portion 15B and the high-temperature-side heat medium flow path 13 involved by the fifth connection portion 15E can be suppressed. In addition, the heat pump assembly 1 can suppress heat damage between the high-pressure-side flow path 11 involved by the second connection portion 15B and the low-temperature-side heat medium flow path 14 involved by the eleventh connection portion 15K.

[0162] Also, in the suction-side region Ri of the flow path forming member 10, the slit 16A as the heat transfer suppression portion 16 is formed on the right side and the rear side of the low-pressure-side flow path 12 involved by the fifth connection portion 15E. As shown in FIG. 6, the low-pressure-side flow path 12 involved by the fifth connection portion 15E is adjacent to the low-temperature-side heat medium flow path 14 involved by the eleventh connection portion 15K on the rear side of the flow path forming member 10 via the slit 16A. Thus, in the suction-side region Ri of the flow path forming member 10, generation of heat damage between the low-pressure-side flow path 12 involved by the fifth connection portion 15E and the low-temperature-side heat medium flow path 14 involved by the eleventh connection portion 15K arranged in the left-right direction can be suppressed. Figure 7

[0163] Specifically, according to the heat pump assembly 1, an increase in the temperature of the low-pressure refrigerant flowing in the low-pressure-side flow path 12 extending from the fifth connection portion 15E due to the heat of the low-temperature-side heat medium flowing in the low-temperature-side heat medium flow path 14 involved by the eleventh connection portion 15K can be suppressed. Likewise, according to the heat pump assembly 1, a decrease in the temperature of the low-temperature-side heat medium flowing in the low-temperature-side heat medium flow path 14 involved by the eleventh connection portion 15K due to the heat of the low-pressure refrigerant flowing in the low-pressure-side flow path 12 involved by the fifth connection portion 15E can be suppressed.

[0164] The twelfth connection portion 15L is formed on the right side of the fifth connection portion 15E on the front side of the suction-side region Ri of the flow path forming member 10. The low-temperature-side heat medium flow path 14 extending from the twelfth connection portion 15L is formed to extend to the right side from the twelfth connection portion 15L and has a portion curved in a crank shape in an intermediate portion of the flow path extending to the right side. The low-temperature-side heat medium flow path 14 extending from the twelfth connection portion 15L is located on the front side of a portion extending to the right side in the low-temperature-side heat medium flow path 14 extending from the eleventh connection portion 15K and is adjacent to a portion of the low-temperature-side heat medium flow path 14 extending from the eleventh connection portion 15K.

[0165] ​The sixth connection portion 15F is formed in the left side of the twelfth connection portion 15L in the suction side region Ri of the flow path forming member 10. The low-pressure-side flow path 12 extending from the sixth connection portion 15F is formed so as to be adjacent to the low-temperature-side refrigerant flow path 14 extending from the twelfth connection portion 15L.

[0166] As shown in FIG. 6, the slit 16A as the heat transfer inhibiting portion 16 is formed around the low-pressure-side flow path 12 extending from the sixth connection portion 15F. The slit 16A is disposed between the low-temperature-side refrigerant flow path 14 extending from the twelfth connection portion 15L and the left side of the low-pressure-side flow path 12 in which the sixth connection portion 15F is involved. Thus, in the suction side region Ri of the flow path forming member 10, the generation of heat damage between the low-pressure-side flow path 12 in which the sixth connection portion 15F is involved and the low-temperature-side refrigerant flow path 14 in which the twelfth connection portion 15L is involved can be inhibited. Figure 7

[0167] The third connection portion 15C is formed in the right side of the twelfth connection portion 15L in the front side of the suction side region Ri of the flow path forming member 10. The low-pressure-side flow path 12 extending from the third connection portion 15C is formed so as to be adjacent to the low-temperature-side refrigerant flow path 14 extending from the twelfth connection portion 15L and extend to the right side.

[0168] The ninth connection portion 15I is formed in the right side of the twelfth connection portion 15L in the suction side region Ri of the flow path forming member 10. The low-temperature-side refrigerant flow path 14 extending from the ninth connection portion 15I is formed so as to extend to the right side after extending forward from the ninth connection portion 15I.

[0169] The slit 16A as the heat transfer inhibiting portion 16 is formed between the twelfth connection portion 15L and the left side of the low-pressure-side flow path 12 in which the third connection portion 15C is involved. Thus, in the suction side region Ri of the flow path forming member 10, the generation of heat damage between the low-pressure-side flow path 12 in which the third connection portion 15C is involved and the low-temperature-side refrigerant flow path 14 in which the twelfth connection portion 15L is involved can be inhibited.

[0170] A part of the low-temperature-side refrigerant flow path 14 extending from the ninth connection portion 15I is adjacent to a part of the low-pressure-side flow path 12 extending from the sixth connection portion 15F in the left-right direction. In addition, a part of the low-temperature-side refrigerant flow path 14 extending from the ninth connection portion 15I extends to the right side along a part of the low-temperature-side refrigerant flow path 14 extending from the eleventh connection portion 15K and is adjacent to the rear side of the low-temperature-side refrigerant flow path 14 extending from the eleventh connection portion 15K.​

[0171] like Figure 7 As shown, the slit 16A formed around the low-pressure side flow path 12 involved in the sixth connection 15F is disposed on the right side of the low-pressure side flow path 12 involved in the sixth connection 15F between the low-temperature side heat medium flow path 14 involved in the ninth connection 15I. Therefore, in the suction side region Ri of the flow path forming member 10, the generation of thermal damage between the low-pressure side flow path 12 involved in the sixth connection 15F and the low-temperature side heat medium flow path 14 involved in the ninth connection 15I can be suppressed.

[0172] The tenth connection 15J is formed on the right side of the third connection 15C, in front of the suction-side region Ri in the flow path forming member 10. The low-temperature side heat medium flow path 14 extending from the tenth connection 15J is adjacent to the right side of the low-pressure side flow path 12 extending from the third connection 15C. Furthermore, the low-temperature side heat medium flow path 14 extending from the tenth connection 15J is adjacent in front of the low-temperature side heat medium flow path 14 extending from the twelfth connection 15L.

[0173] Here, a portion of the slit 16A formed around the low-pressure side flow path 12 involved in the third connection 15C extends between the slit 16A and the low-temperature side heat medium flow path 14 involved in the tenth connection 15J. That is, the slit 16A can suppress the generation of thermal damage between the low-pressure side flow path 12 involved in the third connection 15C and the low-temperature side heat medium flow path 14 involved in the tenth connection 15J.

[0174] The fourth connection portion 15D is formed in the suction-side region Ri of the flow path forming member 10, to the right of the ninth connection portion 15I and located behind the tenth connection portion 15J. That is, the fourth connection portion 15D is formed in the right rear corner portion of the suction-side region Ri of the flow path forming member 10. The low-pressure side flow path 12 extending from the fourth connection portion 15D is formed such that after extending to the right from the fourth connection portion 15D, it extends forward and then to the left. The low-pressure side flow path 12 extending from the fourth connection portion 15D is located to the right rear of the low-temperature side heat medium flow path 14 extending from the ninth connection portion 15I, and is therefore adjacent to a portion of the low-temperature side heat medium flow path 14 extending from the ninth connection portion 15I.

[0175] A slit 16A, serving as a heat transfer suppression section 16, is formed on the right side of the ninth connection portion 15I. The slit 16A is formed along the right side of the low-temperature side heat medium flow path 14 extending from the ninth connection portion 15I. Therefore, the slit 16A, located on the right side of the low-temperature side heat medium flow path 14 involved in the ninth connection portion 15I, is positioned between it and the low-pressure side flow path 12 involved in the fourth connection portion 15D. Consequently, in the suction-side region Ri of the flow path forming member 10, the generation of thermal damage between the low-pressure side flow path 12 involved in the fourth connection portion 15D and the low-temperature side heat medium flow path 14 involved in the ninth connection portion 15I can be suppressed.

[0176] like Figure 7 As shown, a portion of the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14 of the heat pump assembly 1 are concentrated in the suction side region Ri of the flow path forming member 10. In the heat pump assembly 1, since the low-pressure side flow path 12 and the portion of the low-temperature side heat medium flow path 14 formed in the suction side region Ri of the flow path forming member 10 are considered to belong to the same temperature zone, thermal damage generated between the fluid flow paths formed in the suction side region Ri can be suppressed.

[0177] Furthermore, a slit 16A is formed between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14 in the suction side region Ri, serving as a heat transfer suppression section 16. As a result, heat transfer between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14 can be blocked by the slit 16A, thus more reliably suppressing thermal damage between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14.

[0178] As described above, the heat pump assembly 1 according to the first embodiment includes structural equipment such as a compressor 21, a heat medium refrigerant heat exchanger 22, and a flow path forming component 10. The flow path forming component 10 forms a refrigerant flow path consisting of a high-pressure side flow path 11 and a low-pressure side flow path 12, and a heat medium flow path consisting of a high-temperature side heat medium flow path 13 and a low-temperature side heat medium flow path 14, and the compressor 21 and structural equipment are installed thereon.

[0179] like Figure 7 As shown, the flow path forming member 10 may also have a high-temperature side flow path consisting of a high-pressure side flow path 11 and a high-temperature side heat medium flow path 13, and a low-temperature side flow path consisting of a low-pressure side flow path 12 and a low-temperature side heat medium flow path 14. Here, a slit 16A is formed in the flow path forming member 10 as a heat transfer suppression part 16, which suppresses the heat transfer between the refrigerant flow path and the heat medium flow path.

[0180] Therefore, according to the heat pump assembly, the compressor 21, the heat medium refrigerant heat exchanger 22 and other structural equipment, and the flow path forming component 10 can be integrated into one unit, and the refrigerant flow path and the heat medium flow path can be formed in the flow path forming component 10, so that a part of the heat pump cycle 20 and the heat medium circuit are concentrated.

[0181] Furthermore, in the heat pump assembly 1, since a high-temperature side flow path and a low-temperature side flow path are formed in the flow path forming component 10, there is a possibility that a temperature difference may occur between the refrigerant flow path and the heat medium flow path. The temperature difference generated between the refrigerant flow path and the heat medium flow path becomes a major cause of thermal damage in the refrigerant and heat medium, raising concerns about a reduction in the performance of the heat pump cycle 20 and the heat medium circuit.

[0182] In this respect, in the heat pump assembly 1, a slit 16A, serving as a heat transfer suppression section 16, is formed between the refrigerant flow path and the heat medium flow path in the flow path forming component 10 to suppress heat transfer between the refrigerant flow path and the heat medium flow path. Therefore, according to the heat pump assembly 1, the heat transfer suppression section 16 can suppress the generation of thermal damage in the refrigerant and heat medium, and prevent the performance degradation of the heat pump cycle and the heat medium circuit.

[0183] like Figure 7 As shown, in the flow path forming member 10 of the heat pump assembly 1 according to the first embodiment, a slit 16A as a heat transfer suppression part 16 is formed between a plurality of refrigerant flow paths and heat medium flow paths.

[0184] For example, in the flow path forming member 10, a slit 16A, which serves as a heat transfer suppression part 16, is formed between the high-pressure side flow path 11 extending from the second connection part 15B and the high-temperature side heat medium flow path 13 extending from the eighth connection part 15H.

[0185] In the heat pump system 100, in the heat exchanger 22, since the high-temperature side heat medium is heated by the high-pressure refrigerant, the temperature of the high-pressure refrigerant flowing in the high-pressure side flow path 11 is considered to be higher than the temperature of the high-temperature side heat medium flowing in the high-temperature side heat medium flow path 13. Therefore, by forming a slit 16A between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13, heat transfer between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13 can be suppressed, and the performance degradation of the heat pump cycle 20 and the high-temperature side heat medium circuit 30 caused by heat damage can be suppressed.

[0186] Furthermore, in the flow path forming member 10, a slit 16A, serving as a heat transfer suppression member 16, is formed between the low-pressure side flow path 12 extending from the fourth connection portion 15D and the low-temperature side heat medium flow path 14 extending from the ninth connection portion 15I.

[0187] In the heat pump system 100, in the first cold machine 27 or the second cold machine 28, since the low-pressure refrigerant absorbs heat of the low-temperature-side heat medium, it is considered that the temperature of the low-pressure refrigerant flowing in the low-pressure-side flow path 12 is lower than the temperature of the low-temperature-side heat medium flowing in the low-temperature-side heat medium flow path 14. Therefore, by forming the slit 16A between the low-pressure-side flow path 12 and the low-temperature-side heat medium flow path 14, it is possible to suppress the transfer of heat between the low-pressure-side flow path 12 and the low-temperature-side heat medium flow path 14. Thus, the heat pump assembly 1 can suppress the performance of the heat pump cycle 20, the first low-temperature-side heat medium circuit 40, and the second low-temperature-side heat medium circuit 50 from decreasing due to heat damage.

[0188] As shown in FIG. 1, in the heat pump assembly 1 according to the first embodiment, the flow path forming member 10 is provided with the high-pressure-side flow path 11, the low-pressure-side flow path 12, the low-temperature-side heat medium flow path 14, and the slit 16A as the heat transfer suppression portion 16. Figure 8

[0189] Here, regarding the temperature difference of the fluid in the refrigerant flow path and the heat medium flow path, the temperature difference between the high-pressure refrigerant flowing in the high-pressure-side flow path 11 and the low-temperature-side heat medium flowing in the low-temperature-side heat medium flow path 14 becomes a relatively large value. That is, it is considered that the heat damage generated between the refrigerant flow path and the heat medium flow path means that the influence of the heat damage between the high-pressure-side flow path 11 and the low-temperature-side heat medium flow path 14 is large.

[0190] In the heat pump assembly 1 according to the first embodiment, the transfer of heat between the high-pressure-side flow path 11 and the low-temperature-side heat medium flow path 14 is suppressed by the slit 16A. As a result, the heat pump assembly 1 can reliably suppress the performance of the heat pump cycle 20 and the second low-temperature-side heat medium circuit 50 from decreasing due to heat damage.

[0191] (Second Embodiment)

[0192] Next, a second embodiment different from the above-described first embodiment will be described with reference to FIG. 2. In the heat pump assembly 1 according to the second embodiment, the structure of the flow path forming member 10 and the heat transfer suppression portion 16 is different from that of the above-described first embodiment. Regarding other structures in the second embodiment (for example, the structure of the heat pump system 100, the compressor 21, and details of each structural device in the heat pump assembly 1), since they are the same as those of the above-described first embodiment, the description thereof will be omitted. Figure 8

[0193] ​​The heat pump assembly 1 according to the second embodiment is configured to be a part of the heat pump cycle 20 and the high-temperature-side heat medium circuit 30, the first low-temperature-side heat medium circuit 40, the second low-temperature-side heat medium circuit 50, and the like, similarly to the first embodiment. The heat pump assembly 1 according to the second embodiment is configured by assembling the compressor 21, the heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, the second expansion valve 26, the first cold machine 27, and the second cold machine 28 with respect to the flat flow path forming member 10.

[0194] In the heat pump assembly 1 according to the second embodiment, as shown in FIG. 2, the flow path forming member 10 is configured by a first flow path forming member 10A and a second flow path forming member 10B. In the second embodiment, the first flow path forming member 10A and the second flow path forming member 10B correspond to members obtained by dividing the flow path forming member 10 according to the first embodiment into two with the reference line KL as a reference. Figure 8

[0195] The first flow path forming member 10A is a flow path forming member 10 having a structure corresponding to the discharge-side region Ro in the heat pump assembly 1. The first flow path forming member 10A is formed with the first connecting portion 15A, the second connecting portion 15B, the seventh connecting portion 15G, and the eighth connecting portion 15H, and has the high-pressure-side flow path 11 and the high-temperature-side heat medium flow path 13 extending from each connecting portion.

[0196] In the first flow path forming member 10A, a slit 16A as the heat transfer suppression portion 16 is formed between the high-pressure-side flow path 11 and the high-temperature-side heat medium flow path 13. As shown in FIG. 3, the slit 16A is formed between the high-pressure-side flow path 11 of the first connecting portion 15A and the high-temperature-side heat medium flow path 13 of the seventh connecting portion 15G, and between the high-pressure-side flow path 11 of the second connecting portion 15B and the high-temperature-side heat medium flow path 13 of the eighth connecting portion 15H. Figure 8

[0197] Therefore, the slit 16A in the first flow path forming member 10A, similarly to the first embodiment, can suppress the transfer of heat between the high-pressure-side flow path 11 and the high-temperature-side heat medium flow path 13, and suppress the generation of heat damage between the high-pressure-side flow path 11 and the high-temperature-side heat medium flow path 13.

[0198] The second flow path forming member 10B is a flow path forming member 10 having a structure corresponding to the suction-side region Ri in the heat pump assembly 1. The second flow path forming member 10B is formed with the third connecting portion 15C to the sixth connecting portion 15F, the ninth connecting portion 15I to the twelfth connecting portion 15L, and has the low-pressure-side flow path 12 and the low-temperature-side heat medium flow path 14 extending from each connecting portion.

[0199] ​​Furthermore, in the second flow path forming component 10B, a slit 16A, serving as a heat transfer suppression section 16, is formed between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14. For example... Figure 8 As shown, slits 16A are formed between the low-pressure side flow path 12 involved in the fifth connection 15E and the low-temperature side heat medium flow path 14 involved in the eleventh connection 15K, and between the low-pressure side flow path 12 involved in the sixth connection 15F and the low-temperature side heat medium flow path 14 involved in the eleventh connection 15K. In addition, slits 16A are also formed between the low-pressure side flow path 12 involved in the third connection 15C and the low-temperature side heat medium flow path 14 involved in the twelfth connection 15L, and between the low-pressure side flow path 12 involved in the fourth connection 15D and the low-temperature side heat medium flow path 14 involved in the ninth connection 15I.

[0200] Therefore, the slit 16A in the second flow path forming component 10B, like in the first embodiment, can suppress the heat transfer between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14, and suppress the generation of heat damage between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14.

[0201] Here, in the heat pump assembly 1 according to the second embodiment, such as Figure 8 As shown, the housing 21A of the compressor 21 is fixed in such a way that a gap 16B is created between the first flow path forming member 10A and the second flow path forming member 10B. An air layer with a lower heat transfer rate than the constituent materials of the first flow path forming member 10A and the second flow path forming member 10B is sandwiched between the gap 16B. Therefore, the gap 16B corresponds to an example of the heat transfer suppression section 16.

[0202] In the second embodiment, a portion of a high-pressure side flow path 11 extending from the second connecting portion 15B is disposed at the right end of the first flow path forming member 10A, and a portion of a low-temperature side heat medium flow path 14 extending from the eleventh connecting portion 15K is disposed at the left end of the second flow path forming member 10B. Figure 1 As shown, the gap 16B, which serves as the heat transfer suppression section 16, is located between the high-pressure side flow path 11 involved in the second connection section 15B and the low-temperature side heat medium flow path 14 involved in the eleventh connection section 15K.

[0203] As described above, regarding the temperature difference between the fluids in the refrigerant flow path and the heat medium flow path, the temperature difference between the high-pressure refrigerant flowing through the high-pressure side flow path 11 and the low-temperature side heat medium flowing through the low-temperature side heat medium flow path 14 is expressed as a relatively large value. That is, it is considered that the thermal damage generated between the refrigerant flow path and the heat medium flow path means that the thermal damage between the high-pressure side flow path 11 and the low-temperature side heat medium flow path 14 has a greater impact.

[0204] According to the heat pump assembly 1 according to the second embodiment, the heat transfer between the high-pressure side flow path 11 and the low-temperature side heat medium flow path 14 is suppressed by the gap 16B. Therefore, the heat pump assembly 1 according to the second embodiment can reliably suppress the performance of the heat pump cycle 20 and the second low-temperature side heat medium circuit 50 from being reduced due to heat damage.

[0205] As described above, according to the second embodiment, the structure of the flow path forming member 10 is changed, and even in the case where the heat transfer suppression portion 16 is configured by the slit 16A and the gap 16B, the effects of the same structure and operation as the above-described embodiment can be obtained.

[0206] The present disclosure is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist of the present disclosure.

[0207] The heat pump assembly 1 according to the above-described embodiments is applied to the heat pump system 100 having the heat pump cycle 20, the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50, but is not limited to this. For example, the circuit structure of the heat pump cycle 20 in the heat pump system 100 can also be changed from the structure of the above-described embodiments. In this case, according to the structure of the changed heat pump cycle 20, the flow path structure in the flow path forming member 10, the types and arrangement of the structure devices mounted to the flow path forming member 10 can be changed.

[0208] In addition, the structures of the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50 in the heat pump system 100 to which the heat pump assembly 1 is applied are not limited to the above-described embodiments. For example, in the above-described embodiments, the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50 are structures in which heat media are independently circulated, but are not limited to this. That is, at least two of the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50 can also be structures in which the heat media can flow in and out.

[0209] In addition, the structure devices arranged in the high-temperature side heat medium circuit 30, the first low-temperature side heat medium circuit 40, and the second low-temperature side heat medium circuit 50 are not limited to the above-described embodiments. Depending on the circuit structure of each heat medium circuit, the structure devices of the heat medium circuit can be added or changed. For example, in the high-temperature side heat medium circuit 30, in addition to the heater core 32, a high-temperature side radiator and a flow rate adjusting valve can be added, and in the heat of the heat medium of the high-temperature side heat medium circuit 30, the heat remaining in the heating of the heater core 32 can also be radiated in the high-temperature side radiator.

[0210] In the above-described embodiment, the heat medium refrigerant heat exchanger 22, the receiver 23, the first expansion valve 25, and the second expansion valve 26 are cited as the high-pressure side structural devices in the heat pump assembly, but the present application is not limited to this. The high-pressure side structural devices are devices into which high-pressure refrigerant flows in the heat pump cycle 20, in other words, devices disposed between the discharge port portion 21D of the compressor 21 and the inlet of the pressure-reducing portion (for example, the first expansion valve 25 and the like) in the heat pump cycle 20. If the structural devices satisfy this condition, various structural devices can be employed in the high-pressure side structural devices of the heat pump assembly 1.

[0211] Also, in the above-described embodiment, the first cold machine 27 and the second cold machine 28 are cited as the low-pressure side structural devices in the heat pump assembly 1, but the present application is not limited to this. The low-pressure side structural devices are devices into which low-pressure refrigerant flows in the heat pump cycle 20, in other words, devices disposed between the outlet of the pressure-reducing portion (for example, the first expansion valve 25 and the like) and the suction port portion 21F of the compressor 21 in the heat pump cycle 20. If the structural devices satisfy this condition, various structural devices can be employed in the low-pressure side structural devices of the heat pump assembly 1.

[0212] In the above-described embodiment, as shown in FIG. 1, the heat medium refrigerant heat exchanger 22, the first cold machine 27, and the like are disposed in this order from above to below, but the present application is not limited to this. For example, the compressor 21, the flow path forming member 10, and the structural devices can be disposed in this order from above to below. ​

[0213] In the flow path forming member 10 of the above-described embodiment, the heat transfer inhibiting portion 16 is disposed between the high-pressure side flow path 11 and the low-temperature side heat medium flow path 14, between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13, and between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14, but the present application is not limited to this.

[0214] For example, in the arrangement of the flow paths in the flow path forming member 10, when the low-pressure side flow path 12 and the high-temperature side heat medium flow path 13 are adjacent to each other, the heat transfer inhibiting portion 16 can be disposed between the low-pressure side flow path 12 and the high-temperature side heat medium flow path 13.

[0215] Accordingly, the low-pressure refrigerant flowing through the low-pressure side flow path 12 can be inhibited from being heated by the heat of the high-temperature side heat medium flowing through the high-temperature side heat medium flow path 13, and the heat pump cycle 20 can be efficiently operated. Also, since the heat of the high-temperature side heat medium flowing through the high-temperature side heat medium flow path 13 can be inhibited from being absorbed by the low-pressure refrigerant flowing through the low-pressure side flow path 12, a loss in the heat movement of the high-temperature side heat medium can be reduced. ​

[0216] In addition, the heat transfer inhibiting portion 16 is not limited to being provided at a plurality of locations between the high-pressure side flow path 11 and the low-temperature side heat medium flow path 14, between the low-pressure side flow path 12 and the high-temperature side heat medium flow path 13, between the high-pressure side flow path 11 and the high-temperature side heat medium flow path 13, and between the low-pressure side flow path 12 and the low-temperature side heat medium flow path 14. The heat transfer inhibiting portion 16 can be provided at at least one of the above four locations.

[0217] In addition, in the above-described embodiment, in order to inhibit the transfer of heat between the refrigerant flow path and the heat medium flow path, as the heat transfer inhibiting portion 16, a structure in which air is interposed, which has a lower heat transfer rate than the constituent material of the flow path forming member 10, is used, but the present disclosure is not limited to this. For example, if a material having a lower heat transfer rate than the structural material of the flow path forming member 10 is filled, rather than a structure in which air is filled in the internal space of the slit 16A, various materials can be filled.

[0218] While the present disclosure is described based on the embodiment, it should be understood that the present disclosure is not limited to the embodiment, the configuration. The present disclosure also includes various modifications, modifications within the equivalent range. Furthermore, various combinations, modes, and other combinations, modes including only one element, one or more elements or less than a plurality of elements are also within the scope, the idea range of the present disclosure.

Claims

1. A heat pump assembly, comprising: Compressor (21), which compresses and discharges refrigerant; Structural devices (22, 23, 25, 26, 27, 28) that allow refrigerant discharged from the compressor to circulate and constitute a heat pump cycle (20); as well as A flow path forming component (10) forms a refrigerant flow path (11, 12) and a heat medium flow path (13, 14). The refrigerant flow path allows refrigerant to flow between the flow path forming component and at least one of the compressor and the structural device. The heat medium flow path provides a heat medium for heat exchange between the structural device and the refrigerant. The flow path forming component is equipped with the compressor and the structural device. The flow path forming component has: High-temperature side flow path (11, 13), which allows the refrigerant or heat medium that is heated by the high-pressure refrigerant to flow in the refrigerant flow path and the heat medium flow path; Low-temperature side flow path (12, 14), which allows refrigerant or heat medium in the refrigerant flow path and the heat medium flow path to flow at a temperature lower than that in the high-temperature side flow path; as well as A heat transfer suppression section that suppresses heat transfer between the refrigerant flow path and the heat medium flow path.

2. The heat pump assembly according to claim 1, characterized in that, The high-temperature side flow path has a high-temperature side refrigerant flow path (11) for high-pressure refrigerant to flow through and a high-temperature side heat medium flow path (13) for heat medium to flow through heat exchange with high-pressure refrigerant. The low-temperature side flow path has a low-temperature side refrigerant flow path (12) for the flow of low-pressure refrigerant and a low-temperature side heat medium flow path (14) for the flow of heat medium that is at a lower temperature than the high-temperature side heat medium flow path due to heat exchange with the low-pressure refrigerant. The heat transfer suppression units (16, 16A, 16B) suppress heat transfer between the refrigerant flow path and the heat medium flow path at at least one of the following locations: between the high-temperature refrigerant flow path and the low-temperature refrigerant flow path, between the low-temperature refrigerant flow path and the high-temperature heat medium flow path, between the high-temperature refrigerant flow path and the high-temperature heat medium flow path, and between the low-temperature refrigerant flow path and the low-temperature heat medium flow path.

3. The heat pump assembly according to claim 1 or 2, characterized in that, The high-temperature side flow path has a high-temperature side refrigerant flow path (11) for high-pressure refrigerant to flow through. The low-temperature side flow path has a low-temperature side heat medium flow path (14) for the flow of a heat medium that exhibits a lower temperature than the high-temperature side flow path due to heat exchange with the low-pressure refrigerant. The heat transfer suppression section (16, 16A, 16B) suppresses the heat transfer between the high-temperature side refrigerant flow path and the low-temperature side heat medium flow path.

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