Antenna device and electronic equipment

Abstract

The purpose of the present invention is to improve the gain and efficiency of an antenna included in a rectification antenna. The antenna device includes: a first conductor having an annular shape; a rectifying circuit connected to the first conductor; and a plate-shaped second conductor having a main surface extending in a direction substantially orthogonal to the ring-shaped surface of the first conductor and an outer edge portion of the main surface, in which a length of the ring of the first conductor is greater than 0.15 with respect to a wavelength at a reception frequency, and the minimum length of the outer edge portion of the second conductor is greater than 0.4 with respect to the length of the loop of the first conductor.

Description

TECHNICAL FIELD

[0001] The present technology relates to an antenna device and an electronic device. BACKGROUND

[0002] As a technical trend of wireless power transmission, for example, in Japan, three radio frequency bands of 920 MHz, 2.4 GHz, and 5.7 GHz are used in microwave wireless power transmission, and a wireless power transmission system using the three radio frequency bands was legalized in May 2022. In the future, it is also sought to realize a wave wireless power transmission system that does not use microwaves but uses higher radio frequency bands (for example, a millimeter wave band around 28 GHz or a higher band around 60 GHz). These radio wave frequency bands are also considered for 5G, Beyond 5G, 6G, and the like obtained by developing a fifth-generation mobile communication system (so-called 5G), and a combination of these communication systems and wireless power transmission is also considered. As a power supply system using wireless power transmission, it is expected not only to power Internet of Things (IoT) devices, but also to power mobile devices, and applications to make Universal Serial Bus (USB) wireless.

[0003] One of the technical elements for realizing wireless power transmission is a rectenna. Rectenna is an abbreviation of rectifying antenna. A rectenna is a device that receives electromagnetic wave energy in space through an antenna, converts the electromagnetic wave energy into direct current (DC) voltage through a rectifying circuit, and outputs the DC voltage. For example, the following Non-Patent Literature 1 describes a rectenna mainly for a low frequency band of mainly 920 MHz band. The rectenna has a loop pattern printed on a card-type substrate.

[0004] LIST OF CITATIONS

[0005] PATENT LITERATURE

[0006] Non-Patent Literature 1: Yuki Muramoto, Naoki Sakai, Kenji Ito, “920 MHz Band Rectenna with Impedance-Transformed Small Loop Antenna”. IEICE Technical Report. Institute of Electronics, Information and Communication Engineers, 2021. SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] In a high frequency band such as a millimeter wave band, it is important to improve the gain and efficiency of an antenna included in a rectenna. However, in the configuration of the rectenna described in Non-Patent Literature 1, it is difficult to achieve a high gain required in a high frequency band. Further, in a case where the rectenna is bonded to a metal surface in a device, there is a possibility that the efficiency is greatly reduced.

[0009] An object of the present technology is to provide an antenna device in which the efficiency of an antenna included in a rectenna is improved, and an electronic device having the same.

[0010] Solution to the problem

[0011] The present technology is, for example,

[0012] An antenna device includes:

[0013] a first conductor having a ring shape;

[0014] a rectification circuit connected to the first conductor; and

[0015] a second conductor having a plate shape and including a main surface extending in a direction substantially orthogonal to a ring surface of the first conductor and an outer edge portion of the main surface,

[0016] wherein

[0017] a length of the ring of the first conductor is greater than 0.15 with respect to a wavelength at a reception frequency, and a minimum length of the outer edge portion of the second conductor is greater than 0.4 with respect to the length of the ring of the first conductor.

[0018] The present technology can be an electronic device having such an antenna device. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A and B of FIGS.

[0020] Figure 2 A and B of FIGS.

[0021] Figure 3 A to C of FIGS.

[0022] Figure 4 is a diagram for explaining an antenna device according to a first embodiment.

[0023] Figure 5 is a diagram showing an example of a directivity characteristic of an antenna device according to a first embodiment.

[0024] Figure 6 is a graph showing an example of simulation results showing the relationship between the maximum gain and the loop length.

[0025] Figure 7 is a graph showing an example of simulation results showing the relationship between the maximum gain and the size of the metal plate.

[0026] Figure 8 A and B of FIG. 10 are graphs for explaining the antenna device according to the second embodiment.

[0027] Figure 9 A and B of FIG. 12 are graphs for explaining the antenna device according to the third embodiment.

[0028] Figure 10 A to C of FIG. 14 are graphs for explaining the antenna device according to the fourth embodiment.

[0029] Figure 11 A and B of FIG. 16 are graphs for explaining the antenna device according to the fifth embodiment.

[0030] Figure 12 is simulation results showing the relationship between the maximum gain and the length of the upper surface of the loop.

[0031] Figure 13 A and B of FIG. 18 are graphs for explaining the antenna device according to the sixth embodiment.

[0032] Figure 14 is simulation results showing the relationship between the radiation efficiency and the width of the upper surface of the loop.

[0033] Figure 15 A to C of FIG. 20 are graphs for explaining the antenna device according to the seventh embodiment.

[0034] Figure 16 A and B of FIG. 22 are graphs for explaining a modification of the seventh embodiment.

[0035] Figure 17 is a graph for explaining a modification of the seventh embodiment.

[0036] Figure 18 A and B of FIG. 24 are graphs for explaining the antenna device according to the eighth embodiment.

[0037] Figure 19 A and B of FIG. 26 are graphs for explaining a modification of the eighth embodiment.

[0038] Figure 20 A and B of FIG. 28 are graphs for explaining a modification of the eighth embodiment.

[0039] Figure 21 A to C of FIG. 30 are graphs for explaining the antenna device according to the ninth embodiment.

[0040] Figure 22 Figures A and B are used to illustrate the antenna device according to the tenth embodiment.

[0041] Figure 23 Figures A and B are used to illustrate the modifications of the tenth embodiment.

[0042] Figure 24 Figures A to C are used to illustrate the antenna device according to the eleventh embodiment.

[0043] Figure 25 Figures A to C are used to illustrate the modifications of the eleventh embodiment.

[0044] Figure 26 Figures A to C are used to illustrate the antenna device according to the twelfth embodiment.

[0045] Figure 27 Figures A to C are for illustrating the antenna device according to the thirteenth embodiment.

[0046] Figure 28 This is a diagram illustrating the antenna device according to the fourteenth embodiment.

[0047] Figure 29 This is a diagram used to illustrate the modifications of the fourteenth embodiment.

[0048] Figure 30 Figures A and B are used to illustrate application examples of this technology.

[0049] Figure 31 Figures A and B are used to illustrate the modifications.

[0050] Figure 32 Figures A and B are used to illustrate the modifications.

[0051] Figure 33 Figures A through C are used to illustrate the modifications.

[0052] Figure 34 This is a diagram used to illustrate the modifications.

[0053] Figure 35 This is a diagram used to illustrate the modifications.

[0054] Figure 36 This is a diagram used to illustrate the modifications. Detailed Implementation

[0055] The embodiments of the present technology are described below with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present technology, and the content of the present technology is not limited to these embodiments. Note that for clarity, the dimensions, positional relationships, etc., of the components in each figure have been exaggerated in some cases, and furthermore, to prevent the figures from becoming complex, only a portion of the reference numerals are shown, or the figures are partially simplified. Furthermore, in the following description, the same names or reference numerals denote the same or similar components, and in some cases, repeated descriptions are appropriately omitted.

[0056] The descriptions will be given in the following order.

[0057] [Physics Background]

[0058] [First Embodiment]

[0059] [Second Embodiment]

[0060] [Third Embodiment]

[0061] [Fourth Embodiment]

[0062] [Fifth Embodiment]

[0063] [Sixth Embodiment]

[0064] [Seventh Embodiment]

[0065] [Eighth Embodiment]

[0066] [Ninth Embodiment]

[0067] [Tenth Embodiment]

[0068] [Eleventh Embodiment]

[0069] [Twelfth Embodiment]

[0070] [Thirteenth Embodiment]

[0071] [Fourteenth Embodiment]

[0072] [Application Example]

[0073] [Revise]

[0074] [Physics Background]

[0075] First, to facilitate understanding of this technology, reference will be made to... Figure 1 and Figure 2 To describe the physical background, when a circular current is generated in a surface perpendicular to one of the metal surfaces, the metal surface acts like a mirror, and a current component flowing at a symmetrical position is also generated in a surface perpendicular to the other metal surface. This phenomenon is called the mirror effect.

[0076] like Figure 1 A and Figure 1 As shown in Figure B, an example of a dipole antenna 2 arranged close to the metal surface 1 of a metal will be considered. The dipole antenna 2 has a rod-shaped element (antenna element) 2A arranged close to the metal surface 1, and a high-frequency signal source 2B is connected to element 2A. Figure 1 As shown in Figure A, when element 2A is arranged perpendicular to metal surface 1, due to the mirror effect, a current component is also generated at a position symmetrical with respect to metal surface 1 (in Figure 1 (As indicated by the arrow in A), thus the radiation of radio waves in a particular direction becomes dominant (mutually reinforcing). On the other hand, as... Figure 1 As shown in Figure B, when element 2A is arranged parallel to metal surface 1, the current component generated at a position symmetrical to metal surface 1 due to the mirror effect is in the opposite direction to the current component flowing through element 2A. That is, the current flowing in the horizontal direction is canceled out by the current flowing in opposite directions, and they are mutually weakened.

[0077] Next, as Figure 2 A, Figure 2 As shown in Figure B, an example of a loop antenna 3 arranged close to a metal surface 1 is considered. The loop antenna 3 includes, for example, an element 3A forming a circular annular surface, and a high-frequency signal source 3B is connected to the element 3A.

[0078] like Figure 2 As shown in Figure A, when the loop antenna 3 is arranged such that the loop surface of element 3A is parallel to the metal surface 1 and current flows through element 3A, a magnetic flux component is generated in a manner that penetrates the loop surface. Furthermore, due to the mirror effect, magnetic flux components in opposite directions are generated at symmetrical positions on opposite sides of the metal surface 1. The magnetic flux components generated on both sides of the metal surface 1 are opposite in direction and cancel each other out, causing the magnetic flux components to weaken each other.

[0079] On the other hand, such as Figure 2 As shown in B, when the annular surface of element 3A is arranged to be perpendicular to the metal surface 1, magnetic flux components in the same direction are generated at symmetrical positions on opposite sides of the metal surface 1 due to the mirror effect, and the magnetic flux components are mutually reinforced.

[0080] That is, by arranging the loop surface of the loop antenna perpendicular to the metal surface, high gain (antenna gain) can be obtained while suppressing the reduction in efficiency. In other words, the gain and efficiency of the antenna can be improved, and thus an antenna device suitable as a rectifier antenna can be obtained. Note that antenna efficiency refers to the ratio of the power that can be output to the power input to the antenna, and an antenna with higher gain refers to an antenna that radiates radio waves in a more specific direction. Based on the above, specific embodiments of this technology will be described.

[0081] [First Embodiment]

[0082] (Example of antenna device configuration)

[0083] Reference Figure 3 A, Figure 3 B Figure 3 C and Figure 4 An example configuration of the antenna device (antenna device 10A) according to the first embodiment is described below. Note that each embodiment and modification of the antenna device described below is a device that operates as a rectifier antenna.

[0084] Figure 3 A is a perspective view of antenna device 10A. Figure 3 B is along Figure 3 A cross-sectional view of the antenna device 10A with the AA-AA cut line in A, and Figure 3 C is magnification Figure 3 A partially enlarged view of a portion of B. Note that in this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other; the X-axis and Y-axis are axes in a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. This also applies to other embodiments and modifications.

[0085] like Figure 3 As shown in Figure A, the antenna device 10A includes a first conductor 20 and a metal plate 30 arranged close to the first conductor 20. For example, the metal plate 30 corresponds to a second conductor.

[0086] The first conductor 20 is, for example, a loop antenna. The material used for the first conductor 20 can be a conductive metal such as copper or gold, but the material is not limited to these, as long as it has relatively high conductivity. The first conductor 20 is formed, for example, by laser processing or laser direct forming (LDS). Figure 3 As shown in C, the first conductor 20 includes, for example, a first element 21, a second element 22 arranged to face the first element 21, a third element 23 extending in a direction substantially orthogonal to the extending directions of the first element 21 and the second element 22 (the Z direction in this example), and a fourth element 24 arranged to face the third element 23.

[0087] The first element 21 and the second element 22 have, for example, a thin plate shape. Furthermore, the third element 23 and the fourth element 24 have, for example, a cylindrical shape. For example, the first element 21, the second element 22, the third element 23, and the fourth element 24 are integrally and continuously formed. Using this arrangement, an annular surface LS is formed as a surface defined by each element. According to this embodiment, the annular surface LS has, for example, a rectangular shape; however, the shape of the annular surface LS is not limited to a rectangular shape, and can also be a circular shape, an elliptical shape, a polygonal shape, etc.

[0088] like Figure 3 As shown in Figure C, the length (length in the X direction) of the first element 21 in the ring of the annular surface LS is set to W1. The second element 22 has a gap GA near the center and has a total length set to be slightly smaller than W1. Furthermore, the lengths (lengths in the Z direction) of the third element 23 and the fourth element 24 are set to W2. In this example, the length of each of the first element 21 and the second element 22 in the ring of the annular surface LS is set to be greater than the length of each of the third element 23 and the fourth element 24. Therefore, the height of the antenna device 10A can be reduced.

[0089] The rings formed by the first conductor 20 are connected in an alternating current (AC) manner. Here, the AC connection includes forming gaps in the pattern of the rings that are sufficiently smaller than the wavelength. Figure 3 The case of a gap (GA) in C, and the case where DC current does not flow, such as when a component such as a capacitor or varactor diode is inserted into the ring.

[0090] The metal plate 30 is a metal having a sheet shape. The material of the metal plate 30 may include the same material as the first conductor 20. However, the materials of the metal plate 30 and the first conductor 20 may be different from each other.

[0091] The metal plate 30 has a first main surface 31 and a second main surface 32. The first main surface 31 is disposed on the +Z direction side, and the second main surface 32 is disposed on the -Z direction side opposite to the first main surface 31. Note that in the following description, with respect to other constituent elements, in some cases, the surface disposed on the +Z direction side is referred to as the first main surface, and the surface disposed on the -Z direction side is referred to as the second main surface, relative to other components. The first main surface 31 extends at least in a direction substantially orthogonal to the annular surface LS of the first conductor 20 (the Y direction in this example). The first main surface 31 and the second main surface 32 have a rectangular shape when viewed from above. The first main surface 31 and the second main surface 32 of the metal plate 30 have rectangular outer edge portions 33. The outer edge portions 33 have a first side portion 33A and a second side portion 33B disposed facing each other in the Y direction, and a third side portion 33C and a fourth side portion 33D disposed facing each other in the X direction. The lengths of the first side portion 33A and the second side portion 33B are set to be greater than the lengths of the third side portion 33C and the fourth side portion 33D.

[0092] The first conductor 20 and the metal plate 30 are arranged close to each other. For example, as Figure 3 As shown in Figure C, the first conductor 20 and the metal plate 30 are arranged such that a space SP is formed between the second main surface 22A and the first main surface 31 of the second element 22 of the first conductor 20. Note that in Figure 3 A to Figure 3 In Figure C, the first conductor 20 is shown floating relative to the first main surface 31 of the metal plate 30, but the first conductor 20 is supported by a suitable support member (e.g., an insulating support member) not shown. This also applies to the other figures. The first conductor 20 and the metal plate 30 are electrically insulated from each other.

[0093] like Figure 3 As shown, in the antenna device 10A, the rectifier circuit 40 is connected to the first conductor 20. For example, the two ends of the gap GA of the second element 22 of the first conductor 20 are connected to the input terminal (not shown) of the rectifier circuit 40.

[0094] The rectifier circuit 40 can be configured as an integrated circuit (IC). Known rectifier circuits can be used as the rectifier circuit 40. For example, bridge circuits, voltage multiplier circuits, single shunt circuits, etc., can be used as the rectifier circuit 40. Semiconductor components used in these rectifier circuits can be optionally selected. Semiconductor components include, for example, Schottky barrier diodes, complementary metal-oxide-semiconductor (CMOS), high electron mobility transistors (HEMT), etc.

[0095] (operate)

[0096] An operational example of antenna device 10A will be described. The first conductor 20 of antenna device 10A receives electromagnetic wave energy in space. Then, rectifier circuit 40 converts the received electromagnetic wave energy into a DC voltage and outputs this DC voltage (direct current (DC) output). The DC voltage output from rectifier circuit 40 is provided to an appropriate load connected to rectifier circuit 40.

[0097] (Pointing characteristics)

[0098] It has been described that gain can be improved by arranging a loop antenna such that the loop surface of the antenna is perpendicular to the metal surface. In antenna device 10A, the first conductor 20 is arranged such that the magnetic current component penetrating the loop surface LS formed by the first conductor 20 in cross-section is orthogonal to the first main surface 31 of the metal plate 30. Using this arrangement, the gain of antenna device 10A can be improved. Figure 4 As shown, in the antenna device 10A with improved gain, the radiation of radio waves in a specific direction (e.g., in the direction perpendicular to the metal plate 30) has strong directional characteristics.

[0099] (Loop length and outer edge portion)

[0100] Although the gain of antenna device 10A can be improved by the above-described arrangement of the first conductor 20 and the metal plate 30, the gain of antenna device 10A can be further improved by optimizing the length of the loop of the first conductor 20 (hereinafter also appropriately referred to as the loop length) and the minimum length of the outer edge portion 33. This will be described below. Note that in this embodiment, the length of the loop of the first conductor 20 is defined by the length (length in the X direction) excluding the gap GA from the sum of the lengths of the first element 21, the second element 22, the third element 23, and the fourth element 24. In addition, the minimum length of the outer edge portion 33 of the metal plate 30 is defined by the length of the third side portion 33C or the fourth side portion 33D.

[0101] Figure 5 This is a graph showing an example of simulation results illustrating the relationship between maximum gain and loop length. Figure 6In the simulation results shown, the horizontal axis indicates the loop length normalized to the wavelength of the receiving frequency, and the vertical axis indicates the maximum gain (dBi). Generally, an antenna device can be considered to have good characteristics when the maximum gain is greater than 4 dBi. From this perspective, it can be seen that when the loop length normalized to the wavelength of the receiving frequency is greater than 0.15, the maximum gain becomes greater than 4 dBi, and the antenna device characteristics are good. Furthermore, it can be seen that when the loop length normalized to the wavelength of the receiving frequency is greater than 0.2, the maximum gain becomes greater than 6 dBi, further improving the antenna device characteristics. For example, when the receiving frequency of the electromagnetic wave to be received by antenna device 10A is 2.4 GHz, since its wavelength is approximately 10 cm, the loop length is set to a value where the ratio to the wavelength becomes "1.5". Note that within the above range, the loop length of the first conductor 20 is set to an appropriate upper limit based on the application of the antenna device, storage space of the antenna device, etc.

[0102] Figure 6 This is a graph showing an example of simulation results illustrating the relationship between maximum gain and the size of the metal plate. Figure 7 In the simulation results shown, the horizontal axis indicates the minimum length of the outer edge portion of the metal plate normalized to the ring length, and the vertical axis indicates the maximum gain (dBi). As mentioned above, the antenna device can be said to have good characteristics when the maximum gain is greater than 4 dBi. From this perspective, it can be seen that the antenna device has good characteristics when the minimum length of the outer edge portion of the metal plate normalized to the ring length is greater than 0.4 (2 / 5 of the ring length). Furthermore, from this perspective, it can be seen that when the minimum length of the outer edge portion of the metal plate normalized to the ring length is greater than 0.5 (1 / 2 of the ring length), the maximum gain becomes greater than 6 dBi, and the characteristics as an antenna device are further improved. Note that within the above range, the size of the metal plate is set to an appropriate upper limit according to the application of the antenna device, storage space, etc.

[0103] Based on the above description, preferably, by making the length of the loop of the first conductor 20 greater than 0.15 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion 33 of the metal plate 30 greater than 0.4 relative to the length of the loop of the first conductor 20, the characteristics of the antenna device can be improved. More preferably, by making the length of the loop of the first conductor 20 greater than 0.2 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion 33 of the metal plate 30 greater than 0.5 relative to the length of the loop of the first conductor 20, the characteristics of the antenna device can be further improved.

[0104] [Second Embodiment]

[0105] Next, a second embodiment will be described. Note that in the description of the second embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, the matters described in the first embodiment can be applied to the second embodiment.

[0106] Figure 7 A is a perspective view of the antenna device (antenna device 10B) according to the second embodiment, and Figure 8 B is along Figure 8 A cross-sectional view of the antenna device 10B with the BB-BB cut line in A.

[0107] Antenna device 10B includes a substrate 50. The substrate 50 can be a flexible printed circuit (FPC) or a rigid substrate. At least a portion of the first conductor 20 is formed as a metallic pattern on the surface of the substrate 50. Figure 8 As shown in Figure B, for example, a first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. Furthermore, a through-hole 53 and a through-hole 54, different from the through-hole 53, are formed in the substrate 50. A third element 23 is disposed in the through-hole 53, and a fourth element 24 is disposed in the through-hole 54.

[0108] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, by forming at least a portion of the first conductor 20 as a metal pattern on the substrate 50, an antenna device 10B with a three-dimensional configuration can be easily formed. Additionally, interference between the first conductor 20 and components and wiring mounted around the substrate 50 can be reduced.

[0109] [Third Embodiment]

[0110] Next, a third embodiment will be described. Note that in the description of the third embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0111] Figure 8 A is a perspective view of an antenna device (antenna device 10C) according to a third embodiment, and Figure 9 B is along Figure 9 A cross-sectional view of the antenna device 10C with the CC-CC cut line in A.

[0112] The antenna device 10C according to this embodiment includes a substrate 50, similar to that in the antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0113] Antenna device 10C includes a substrate 60 (an example of other substrates) that is different from substrate 50. Substrate 60 has a first main surface 61 and a second main surface 62. Figure 9 As shown in Figure B, substrates 50 and 60 are stacked such that a first main surface 61 of substrate 60 is stacked on a second main surface 52 of substrate 50. Then, a metal plate 30 is formed on the second main surface 62 of substrate 60. The metal plate 30 is formed in a laminated manner relative to the second main surface 62 (as a metal layer).

[0114] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, in this embodiment, since the antenna device can be manufactured using general substrate manufacturing methods, it can be easily manufactured at low cost. Moreover, since the entire antenna device 10C, which serves as a rectifier antenna, is included in a single substrate, the antenna device 10C can be easily mounted on a device.

[0115] Note that in this embodiment, a two-layer multilayer substrate (substrate 50 and substrate 60) is described as an example, but a three-layer or more multilayer substrate can be used.

[0116] [Fourth Embodiment]

[0117] Next, a fourth embodiment will be described. Note that in the description of the fourth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0118] Figure 9 A is a perspective view of the antenna device (antenna device 10D) according to the fourth embodiment. Figure 10 B is along Figure 10 A cross-sectional view of the DDA-DDA cut antenna device 10D in case of cut line in A, and Figure 10 C is along Figure 10 A cross-sectional view of the DDB-DDB cut antenna device 10D in A.

[0119] Antenna device 10D according to this embodiment includes a substrate 50, similar to antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0120] On the second main surface 52 of the substrate 50, a metal plate 30 is formed using the same metal layer as the second element 22. Furthermore, on the second main surface 52, a removal portion 57 is formed where the metal layer is partially removed in order to electrically insulate the second element 22 and the metal plate 30 from each other. The second main surface 52 of the substrate 50 is exposed at the portion of the removal portion 57.

[0121] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, in this embodiment, since the antenna device can be manufactured using conventional substrate manufacturing methods, it can be easily manufactured at low cost. Moreover, according to this embodiment, since the metal plate 30 can be formed without forming a multilayer substrate, the height of the antenna device 10D can be reduced.

[0122] [Fifth Embodiment]

[0123] Next, a fifth embodiment will be described. Note that in the description of the fifth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0124] Figure 10 A is a perspective view of the antenna device (antenna device 10E) according to the fifth embodiment, and Figure 11 B is along Figure 11 A cross-sectional view of the antenna device 10E with the cut line EE-EE cut in A.

[0125] Antenna device 10E according to this embodiment includes a substrate 50, similar to antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0126] Furthermore, from the viewpoint of the distance from the substrate 50 to the metal plate 30 in the thickness direction (Z direction), the first element 21 is arranged at a position where the distance to the metal plate 30 is greater than the distance from the second element 22 to the metal plate, that is, closer to the +Z direction (upper side).

[0127] This embodiment illustrates an example where the area of ​​the first element 21 is larger than the area of ​​the second element 22. For example, when each of the first element 21 and the second element 22 has a rectangular shape, the lengths of the first element 21 and the second element 22 in the lateral direction (length in the Y direction) are the same, and the length of the first element 21 in the longitudinal direction (length in the X direction) is set to be greater than the length of the second element 22 in the longitudinal direction (excluding the length of the gap GA in the X direction). As an example, the length of the first element 21 in the longitudinal direction is set to be in the range of 1.4 times to 2 times (preferably about 1.6 times) the length of the second element 22 in the longitudinal direction.

[0128] Figure 11 The simulation results show the relationship between the maximum gain and the length of the upper surface of the ring (here, the length of the first element 21 in the X direction). Figure 12 In the simulation results shown, the horizontal axis indicates the length of the upper surface of the ring normalized to the wavelength of the received frequency, and the vertical axis indicates the maximum gain (dBi). Figure 12 As shown, the maximum gain is increased by increasing the length of the upper surface of the ring, which is normalized by the wavelength of the received frequency. This is because, by increasing the area of ​​the first element 21, electromagnetic waves in the air can be received more effectively, allowing for an increase in the current flowing through the first conductor 20, and this arrangement can increase the magnetic flux component penetrating the ring surface LS. That is, according to the configuration of the antenna device 10E, effects similar to those described in the first embodiment can be obtained, and furthermore, a greater increase in the required gain at high frequencies can be achieved.

[0129] [Sixth Embodiment]

[0130] Next, a sixth embodiment will be described. Note that in the description of the sixth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0131] Figure 12 A is a perspective view of the antenna device (antenna device 10F) according to the sixth embodiment, and Figure 13 B is along Figure 13 A cross-sectional view of the FF-FF cut antenna device 10F in A.

[0132] This embodiment also illustrates an example where the area of ​​the first element 21 is larger than the area of ​​the second element 22. For example, when each of the first element 21 and the second element 22 has a rectangular shape, the lengths of the first element 21 and the second element 22 in the longitudinal direction (length in the X direction; however, in this example, the length of the second element 22 in the X direction includes the length of the gap GA in the X direction) are the same, and the length of the first element 21 in the transverse direction (length in the Y direction) is set to be greater than the length of the second element 22 in the transverse direction. As an example, the length of the first element 21 in the transverse direction is set to be in the range of 1.2 to 3 times the length of the second element 22 in the transverse direction.

[0133] Figure 13 These are simulation results illustrating the relationship between radiation efficiency and the width (length in the Y direction) of the upper surface of the ring. Figure 14 In the simulation results shown, the horizontal axis indicates the width of the upper surface of the ring normalized to the wavelength of the received frequency, and the vertical axis indicates the radiation efficiency (dB). Figure 14 As shown, radiation efficiency is improved by increasing the width of the upper surface of the ring, which is normalized to the wavelength of the received frequency. For example, since very high efficiency is required from the viewpoint of power transmission, a radiation efficiency lower than approximately -0.10 dB is not preferred. That is, the width of the upper surface of the ring, normalized to the wavelength, is preferably approximately 0.04 or greater. According to the configuration of the antenna device 10F described above, effects similar to those described in the first embodiment can be obtained, and furthermore, radiation efficiency can be improved.

[0134] [Seventh Embodiment]

[0135] Next, a seventh embodiment will be described. Note that in the description of the seventh embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0136] Figure 14 A is a perspective view of the antenna device (antenna device 10G) according to the seventh embodiment, and Figure 15 B is along Figure 15 A cross-sectional view of the antenna device 10G with the cut line GG-GG cut in A. Furthermore, Figure 15 C is a view of the substrate 50 included in the antenna device 10G viewed from the second main surface 52 side.

[0137] The antenna device 10G according to this embodiment includes a substrate 50, similar to that in the antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0138] In this embodiment, a missing portion as a tiny space is formed in the ring of the first conductor 20. For example, as Figure 15 As shown in Figure C, two missing portions 25A and 25B are formed in the second element 22. Missing portions 25A and 25B can be formed by partially removing the second element 22. Missing portions 25A and 25B each have, for example, a linear shape extending in the Y direction.

[0139] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, by providing missing portions 25A and 25B, short circuits caused by DC current flowing through the entire loop of the first conductor 20 can be prevented (however, at high frequencies, current flows across missing portions 25A and 25B). Additionally, the missing portions function as impedance matching portions. Note that by minimizing the areas of the missing portions 25A and 25B as much as possible to maintain adequate electrical connection, the reduction in radiation efficiency and gain is only limited.

[0140] Note that the shapes of the missing portions 25A and 25B are not limited to linear shapes. For example, as... Figure 15 A and Figure 16 As shown in Figure B, each of the missing portions 25A and 25B can be shaped like a comb (a structure in which recesses and protrusions are arranged substantially alternately). By forming the missing portions 25A and 25B into a comb shape, the process of forming the missing portions can be facilitated, and the AC connection can also be strengthened. Furthermore, from the viewpoint of preventing DC current from being reflected by the ring of the first conductor 20, as... Figure 16 As shown, the matching circuit 41 for impedance matching can be connected between the first conductor 20 and the rectifier circuit 40. That is, in this technology, the connection between the rectifier circuit 40 and the first conductor 20 means that the rectifier circuit 40 can be directly electrically connected to the first conductor 20, or the rectifier circuit 40 can be connected via other circuits.

[0141] [Eighth Embodiment]

[0142] Next, an eighth embodiment will be described. Note that in the description of the eighth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0143] Figure 17 A is a perspective view of the antenna device (antenna device 10H) according to the eighth embodiment, and Figure 18 B is along Figure 18 A cross-sectional view of the antenna device 10H with the cutting line HH-HH cut by A.

[0144] Antenna device 10H according to this embodiment includes a substrate 50, similar to antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0145] The antenna device 10H according to this embodiment includes a metal pattern 65 that is separated from the first conductor 20 in the DC direction. The metal pattern 65 includes, for example, two metal patterns 65A and 65B. The two metal patterns 65A and 65B are formed, for example, on the same surface as the first main surface 51 of the substrate 50 on which the first conductor 20 (specifically, the first element 21) is formed. The two metal patterns 65A and 65B are, for example, positioned to the left and right of the first conductor 20 in the X direction. The metal pattern 65 has, for example, a rectangular shape. The thickness of the metal pattern 65 is not particularly limited, but is, for example, substantially the same as the thickness of the first element 21.

[0146] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, even without electrical connection to the first conductor 20, the antenna device 10H can also have, for example, increased gain at high frequencies by arranging a metal pattern 65 around the annular surface LS of the first conductor 20.

[0147] The location where the metal pattern 65 is formed is not limited to the first main surface 51 of the substrate 50. For example, as... Figure 18 As shown, the metal pattern 65 can be arranged above the first conductor 20 (in the +Z direction). Figure 19 The metal pattern 65 shown has, for example, a rectangular shape, which has a vertical direction in the X direction and a horizontal direction in the Y direction. Note that in Figure 19In the configuration shown, the metal pattern 65 is supported by, for example, a suitable support member (not shown) disposed on the first main surface 51.

[0148] In addition, such as Figure 19 As shown, two metal patterns (metal patterns 65A and 65B) can be formed on the first main surface 51 of the substrate 50, and additionally, a metal pattern (metal pattern 65C) can also be formed on the second main surface 52 of the substrate 50 on which the second element 22 is formed. Similarly, using these configurations, the gain of the antenna device 10H can be improved.

[0149] Note that the shapes of the metal patterns 65A, 65B, and 65C do not have to be rectangular; they can be any shape such as circular, elliptical, or polygonal. Furthermore, the number of metal patterns 65 can be appropriately varied. Additionally, the number of metal patterns formed on each of the first main surface 51 and the second main surface 52 of the substrate 50 can be the same or different from each other. The metal patterns can constitute a metamaterial.

[0150] [Ninth Embodiment]

[0151] Next, the ninth embodiment will be described. Note that in the description of the ninth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0152] Figure 20 A is a perspective view of the antenna device (antenna device 10J) according to the ninth embodiment. Figure 21 B is along Figure 21 A cross-sectional view of the antenna device 10J with the cut line JJA-JJA in A, and Figure 21 C is along Figure 21 A cross-sectional view of the antenna device 10J with the cutting line JJB-JJB in A.

[0153] Antenna device 10J according to this embodiment includes a substrate 50, similar to antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50.

[0154] Furthermore, the antenna device 10J according to this embodiment includes a plurality of third elements and a plurality of fourth elements. For example... Figure 21 As shown in B, the antenna device 10J includes, for example, three third elements (third element 23A, third element 23B, and third element 23C). Furthermore, as... Figure 21As shown in C, the antenna device 10J includes, for example, three fourth elements (fourth element 24A, fourth element 24B and fourth element 24C).

[0155] Six through holes are formed in the substrate 50. Then, three third elements and three fourth elements are arranged for each of the different through holes. The ends of the third elements 23A, 23B and 23C are respectively connected to the first element 21 and the second element 22. Similarly, the ends of the fourth elements 24A, 24B and 24C are respectively connected to the first element 21 and the second element 22.

[0156] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, by arranging each of the plurality of third elements and the plurality of fourth elements in a corresponding through-hole among the plurality of through-holes to form a loop, the conductivity of the first conductor 20 is increased, and the efficiency and gain of the antenna device 10J can be improved. Note that, as described above, the number of third elements and the number of fourth elements can be the same or different from each other.

[0157] [Tenth Embodiment]

[0158] Next, the tenth embodiment will be described. Note that in the description of the tenth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0159] Figure 21 A is a perspective view of an antenna device (antenna device 10K) according to the tenth embodiment, and Figure 22 B is along Figure 22 A cross-sectional view of the antenna device with cut line KK-KK in A, in the case of 10K.

[0160] Antenna device 10K according to this embodiment includes a substrate 50, similar to antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0161] The antenna device 10K includes a heat dissipation component 70. The heat dissipation component 70 is, for example, connected to and stacked on top of the substrate 50. Figure 22As shown in B, the heat dissipation component 70 has a first main surface 71 and a second main surface 72, and is stacked on the substrate 50 such that the second main surface 72 contacts the first main surface 51 of the substrate 50.

[0162] As the heat dissipation component 70, metals such as copper or aluminum, graphite, ceramics, etc., can be used. The size of the heat dissipation component 70 can be the same as the size of the substrate 50, or it can be larger or smaller than the size of the substrate 50. In addition, the heat dissipation component 70 can be formed into a suitable shape, and the heat dissipation component 70 can also have a thickness appropriately set based on the shape and size of the antenna device 10K.

[0163] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, by providing the heat dissipation member 70, heat generated by the antenna device 10K and heat generated by surrounding ICs, etc., can be effectively released. In particular, because relatively large amounts of power are transmitted in high-frequency bands such as millimeter-wave bands, it is assumed that heat generation will increase; however, the presence of the heat dissipation member 70 can reduce the impact of heat generation.

[0164] Note that, as Figure 22 A and Figure 23 As shown in Figure B, the heat dissipation component 70 can be stacked on the underside of the substrate 50. That is, the heat dissipation component 70 can be stacked on the substrate 50 such that the second main surface 52 of the substrate 50 and the first main surface 71 of the heat dissipation component 70 are in contact with each other. Furthermore, in the above... Figure 23 A and Figure 22 In the configuration shown in B, the first element 21 may be formed on the first main surface 71 of the heat dissipation member 70. In this case, the third element 23 and the fourth element 24 extend further upward and connect to the first element 21 formed on the first main surface 71. Furthermore, in Figure 22 A and Figure 23 In the configuration shown in B, the second element 22 may be formed on the second main surface 72 of the heat dissipation member 70. In this case, the third element 23 and the fourth element 24 extend further downward and connect to the second element 22 formed on the second main surface 72.

[0165] [Eleventh Embodiment]

[0166] Next, the eleventh embodiment will be described. Note that in the description of the eleventh embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0167] Figure 23 A is a perspective view of the antenna device (antenna device 10L) according to the eleventh embodiment, and Figure 24 B is along Figure 24 A cross-sectional view of the antenna device 10L with the LL-LL cut line in A. Furthermore, Figure 24 C is a view of the substrate 50 included in the antenna device 10L, viewed from the second main surface 52.

[0168] The antenna device 10L according to this embodiment includes a substrate 50, similar to that in the antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0169] The antenna device 10L also includes fixing portions for fixing the substrate 50 and the metal plate 30. According to this embodiment, the fixing portions include, for example, four fixing portions (fixing portions 75A, 75B, 75C, and 75D). Note that, unless it is necessary to distinguish between the individual fixing portions, the fixing portions are appropriately referred to collectively as fixing portions 75. Fixing portions 75 are, for example, spherical solder bumps. In this embodiment, the substrate 50 and the metal plate 30 are fixed using solder bumps. Each of the four fixing portions 75 is located near each of the four corners. When the substrate 50 and the metal plate 30 are fixed by the fixing portions 75, a space SP (example of a space portion) corresponding to the thickness of the fixing portion 75 is formed between the second main surface 52 of the substrate 50 and the first main surface 31 of the metal plate 30. A rectifier circuit 40 is arranged in this space SP. The rectifier circuit 40 arranged in the space SP is connected to a second element 22 of the first conductor 20.

[0170] Note that the fixing part is not limited to solder bumps. The fixing part can be solder paste. For example, such as... Figure 24 A, Figure 25 B and Figure 25 As shown in Figure C, solder pastes 76A, 76B, 76C, and 76D are applied near the four corners between the substrate 50 and the metal plate 30. By curing each solder paste, the substrate 50 and the metal plate 30 are fixed in place.

[0171] Note that, although in Figure 25 A, Figure 25 B and Figure 25Although not shown in diagram C, the rectifier circuit 40 can be arranged in the space SP formed by fixing the substrate 50 and the metal plate 30 with solder paste near the four corners. Furthermore, the locations for forming the solder bumps and applying the solder paste are not limited to the four corners and can be set to appropriate positions. Additionally, the fixing portion can be a bonding material or an adhesive material.

[0172] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, since the substrate 50 and the metal plate 30 are fixed by solder bumps, metal paste, etc., a process that integrally forms the substrate and metal plate with the semiconductor can be used, and the antenna device 10L can be easily manufactured using conventional substrate processes. As an example, the configuration of the antenna device 10L according to this embodiment is applicable to cases where the receiving frequency is in the 28 GHz band.

[0173] [Twelfth Embodiment]

[0174] Next, the twelfth embodiment will be described. Note that in the description of the twelfth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0175] Figure 25 A is a perspective view of the antenna device (antenna device 10M) according to the twelfth embodiment, and Figure 26 B is along Figure 26 A cross-sectional view of the MM-MM cut antenna device with a cut line in A, in the case of 10M. Furthermore, Figure 26 C is a view of the metal plate 30 included in the antenna assembly 10M, observed from the second main surface 32. Note that in Figure 26 In C, the constituent elements on the first main surface 31 side are indicated by dashed lines.

[0176] The antenna device 10M includes a rectifier IC 80. The rectifier IC 80 has, for example, a box-shaped housing 81, and the rectifier circuit (not shown) is housed within the housing 81. The housing 81 is formed using an insulating material such as resin. The housing 81 is fixed to a metal plate 30. For example, solder bumps 82A, 82B, 82C, and 82D are formed near the four corners of the housing 81, and the housing 81 is connected to the metal plate 30 via these solder bumps.

[0177] A portion of the first conductor 20 is formed on the surface of the housing 81. For example, a first element 21 of the first conductor 20 is formed on a first main surface 81A of the housing 81, and a second element 22 of the first conductor 20 is formed on a second main surface 81B of the housing 81. A third element 23 and a fourth element 24 are each disposed in a hole, for example, penetrating the housing 81 (e.g., a semiconductor in the housing 81). The third element 23 and the fourth element 24 may be formed on a side surface of the housing 81.

[0178] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. As an example, the configuration of the antenna device 10M according to this embodiment is applicable to situations where the receiving frequency is in the 60 GHz band.

[0179] [Thirteenth Embodiment]

[0180] Next, the thirteenth embodiment will be described. Note that in the description of the thirteenth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0181] Figure 26 A is a perspective view of the antenna device (antenna device 10N) according to the thirteenth embodiment, and Figure 27 B is along Figure 27 A cross-sectional view of the antenna device 10N with the NN-NN cut line in A. Furthermore, Figure 27 C is a view of the substrate 50 included in the antenna device 10N viewed from the first main surface 51 side.

[0182] The antenna device 10N according to this embodiment includes a substrate 50, similar to that in the antenna device 10B. A first element 21 is formed on a first main surface 51 of the substrate 50, and a second element 22 is formed on a second main surface 52 of the substrate 50. In addition, a third element 23 is arranged in a through hole 53, and a fourth element 24 is arranged in a through hole 54.

[0183] The antenna device 10N includes a conductor portion 85 (an example of a third conductor) disposed within the substrate 50. The conductor portion 85 is, for example, a conductive metal and has a thin plate shape. Figure 27 A, Figure 27 B and Figure 27 As shown in C, the conductor portion 85 is configured to penetrate the annular surface LS of the first conductor 20.

[0184] The length of the loop of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. According to this embodiment, effects similar to those of the first embodiment can be obtained. Furthermore, because the conductor portion 85 penetrates the loop surface LS, the gain of the antenna device 10N can be improved.

[0185] Note that the shape and size of the conductor portion 85 can be appropriately changed, as long as the conductor portion penetrates the annular surface LS.

[0186] [Fourteenth Embodiment]

[0187] Next, the fourteenth embodiment will be described. Note that in the description of the fourteenth embodiment, the same or similar configurations described above are indicated by the same reference numerals, and repeated descriptions will be omitted as appropriate. Furthermore, unless otherwise stated, matters described in other embodiments such as the first embodiment can be applied to this embodiment.

[0188] Figure 27 This is a perspective view of an antenna device (antenna device 10P) according to the fourteenth embodiment. Antenna device 10P has the same characteristics as antenna device 10B according to the second embodiment (see...). Figure 28 The configuration is basically similar to that of the first conductor 20, but the difference is that it includes multiple first conductors 20.

[0189] Multiple first conductors 20 are arranged, for example, in an array. A rectifier circuit 40 is connected to the multiple first conductors 20. By using an array antenna with multiple first conductors 20 arranged in an array, the characteristics of the antenna device 10P can be improved. In particular, by connecting a rectifier circuit 40 to the multiple first conductors 20, the gain of the antenna device 10P can be improved.

[0190] In the case where the antenna device has multiple first conductors 20, the orientation of each first conductor 20 constituting the array can be optionally adjusted. For example, as Figure 8 As shown, a portion of the first conductor (the first conductor indicated by reference numeral 20A in the figure) is arranged such that the annular surface LS of that portion of the first conductor is arranged along the X direction (an example of a first direction). Furthermore, the other portions of the first conductor (the first conductor indicated by reference numeral 20B in the figure) are arranged such that the other annular surfaces LS of the first conductor are arranged along a Y direction orthogonal to the X direction (an example of a second direction). With this configuration, electromagnetic waves of various polarizations can be received.

[0191] In antenna devices comprising multiple first conductors 20, the first conductors can be arranged with different loop lengths. Using this arrangement, an antenna device capable of supporting multiple frequencies assumed to be a wireless power transmission standard can be realized. Examples of multiple frequencies include, for example, 24 GHz and 28 GHz. For each receiving frequency, the loop length of the first conductor 20 and the minimum length of the outer edge portion 33 of the metal plate 30 are set within the same range as in the first embodiment. Using this arrangement, an antenna device optimized for each receiving frequency can be obtained.

[0192] In an antenna device comprising a plurality of first conductors 20 and a rectifier circuit 40 connected to the plurality of first conductors 20, a phase shifter can be connected between each first conductor 20 and the rectifier circuit 40. With this configuration, directivity can be controlled, and the effect of receiving electromagnetic waves from all directions can be achieved.

[0193] Note that the number and position of the first conductor 20 are not limited to the example shown, and can be any number, etc.

[0194] [Application Example]

[0195] Application examples of this technology will be described. For example... Figure 29 As shown in Figure A, rectifier circuit 40 is connected to first conductor 20, and load 90 is connected to rectifier circuit 40. The DC voltage output from rectifier circuit 40 is supplied to load 90. Examples of load 90 include batteries, sensors, communication modules, speakers (e.g., small speakers used in wireless headphones), displays, etc. Load 90 is connected to an antenna device including first conductor 20 and rectifier circuit 40 to constitute electronic device 100.

[0196] The rectifier circuit 40 and the load 90 do not necessarily need to be directly connected to each other. For example, as Figure 30 As shown in B, a DC-DC converter 91 that performs boost and buck conversion and a known power supply circuit 92 that controls the input power can be connected between the load 90 and the rectifier circuit 40.

[0197] For example, if the height of the antenna device can be reduced as in the fourth embodiment, the height of the electronic device 100 on which the antenna device is mounted can be further reduced. That is, since the device can be made less conspicuous than required, the appearance of the electronic device 100 can be improved. Furthermore, if the electronic device 100 is a wearable device worn by a user, the user's experience with the electronic device 100 can be improved.

[0198] [Revise]

[0199] Although embodiments of the present technology have been specifically described to date, the present technology is not limited to the above embodiments, and various modifications can be made based on the technical concept of the present technology.

[0200] (First revision)

[0201] The above embodiments can be appropriately combined with each other. Figure 30 A is a perspective view of the antenna device (antenna device 10Q) according to this modification, and Figure 31 B is along Figure 31 A cross-sectional view of the QQ-QQ cut antenna device 10Q in A.

[0202] Antenna device 10Q has a configuration where substrate 60 is stacked on the underside of substrate 50, as described in the third embodiment. Additionally, antenna device 10Q includes a metal pattern 65 as described in the eighth embodiment. The metal pattern 65 is disposed within substrate 60. In this way, each of the above embodiments can be suitably combined with other embodiments.

[0203] (Second revision)

[0204] Figure 31 A is a perspective view of the antenna device (antenna device 10R) according to this modification, and Figure 32 B is along Figure 32 A cross-sectional view of the RR-RR cut antenna device 10R in A.

[0205] like Figure 32 A and Figure 32 As shown in Figure B, the first conductor 20 has a configuration in which the ends of a first element 21 and a second element 22 are fixed (connected) to each other by solder bumps 23E and 24E. The annular surface LS is formed by being divided by the first element 21, the second element 22, the solder bumps 23E and 24E. In this way, the first conductor 20 is not limited to a configuration in which each element is integrally and continuously connected to other elements by the same component.

[0206] (Third revision)

[0207] Figure 32 A is a perspective view of the antenna device (antenna device 10S) according to this modification, and Figure 33 B is in Figure 33 A partial enlarged view of the antenna device 10S shown in Figure A, where a portion is magnified. Furthermore, Figure 33 Figure C is a schematic diagram showing the connection pattern between the first conductor of the antenna device 10S and the rectifier circuit 40.

[0208] Antenna device 10S includes, for example, two first conductors (first conductor 201 and first conductor 202) connected to each other. First conductor 201, formed as a loop antenna, forms a loop surface LSA, and first conductor 202, also formed as a loop antenna, forms a loop surface LSB. Second element 211 of first conductor 201 includes elements 211A and 211B separated to the left and right, with a gap GA inserted between them. Furthermore, second element 212 of first conductor 202 includes elements 212A and 212B separated to the left and right, with a gap GA inserted between them. Elements 211B of first conductor 201 and elements 212A of first conductor 202 are connected to each other. A rectifier circuit 40 is connected, for example, to the end near the center of element 211A and the end near the center of element 211B. The rectifier circuit 40 is connected to each element via solder bumps, etc. According to this modification, the magnetic field generated inside the plurality of loop surfaces becomes stronger, and the gain of antenna device 10S is improved. Note that the number of loops is not limited to two as in this modification, and can be three or more.

[0209] (Fourth revision)

[0210] This modification relates to the shape of the metal plate 30. In the above embodiment, the metal plate 30 has a rectangular shape in the plan view, but this modification is not limited to this. Figure 33 This is a diagram illustrating the metal plate (metal plate 301) according to the present modification. The metal plate 301 has a base 301A, which has a plate-like shape and is arranged facing the second main surface 52 of the substrate 50. The base 301A has boundary portions 302A and 302B at both ends in the X direction. Furthermore, the metal plate 301 has a curved portion 303A that bends upwards along the boundary portion 302A. Additionally, the metal plate 301 has a curved portion 303B that bends upwards along the boundary portion 302B. The substrate 50 is surrounded on its left and right sides in the X direction by the curved portions 303A and 303B. Note that in... Figure 34 In the example, the minimum length of the outer edge portion of the metal plate 301 corresponds to the length of the end 304A of the bent portion 303A or the length of the end 304B of the bent portion 303B.

[0211] Figure 34 This is a diagram used to illustrate another example of metal plate 30. Figure 35 The metal plate 305 shown has a curved shape that protrudes downwards (in the -Z direction) relative to the substrate 50. The substrate 50 is surrounded by the metal plate 305 on its left and right sides in the X direction. Note that in Figure 35 In the example, the minimum length of the outer edge portion of the metal plate 305 corresponds to the length of the respective linearly shaped end portion 305A or end portion 305B of the metal plate 305.

[0212] exist Figure 34 and Figure 34 In the example shown, the metal plate has a shape that partially covers the periphery of the first conductor 20. This arrangement prevents electrical coupling between the first conductor 20 and other components and suppresses the reduction in gain of the entire antenna assembly.

[0213] Figure 35 This is a diagram illustrating another example of metal plate 30. (See diagram for example.) Figure 36 Figure 36 As shown, the metal plate 30 may have a missing portion 310 formed by partially cutting off the metal plate. Even in this case, since the missing portion 310 is not the outer edge, the minimum length of the outer edge portion of the metal plate 305 corresponds to the length of the third side 33C or the fourth side 33D of the metal plate 30. By providing the missing portion 310, interference between the metal plate 30 and wiring and other components can be avoided.

[0214] (Other modifications)

[0215] The annular surface formed by the first conductor does not need to be strictly perpendicular to the metal plate. That is, the first conductor can be configured such that the annular surface is slightly inclined relative to the metal plate.

[0216] Furthermore, for example, multiple technologies related to this technology can be implemented independently as a single entity, provided there are no contradictions. It goes without saying that any multiple technologies can be implemented in combination. For example, part or all of the technologies described in any embodiment can be implemented in combination with part or all of the technologies described in other embodiments. Furthermore, any part or all of the technologies described above can be implemented together with other technologies not described above.

[0217] Furthermore, the configurations, methods, steps, shapes, materials, values, etc., described in the embodiments and modifications are merely examples, and different configurations, methods, steps, shapes, materials, values, etc., may be used as needed. Additionally, unless otherwise stated, the materials exemplified in the above embodiments and modifications may be used alone or in combination of two or more. Furthermore, the constituent elements described in the embodiments and modifications may be appropriately combined.

[0218] Note that the effects described in this manual are merely examples and not limitations, and other effects can be achieved.

[0219] This technology can also be configured as follows. (1)

[0221] An antenna device, comprising:

[0222] The first conductor has a ring shape;

[0223] A rectifier circuit connected to the first conductor; and

[0224] The second conductor has a plate-like shape and includes a main surface extending in a direction substantially orthogonal to the annular surface of the first conductor and an outer edge portion of the main surface, wherein...

[0225] The length of the loop of the first conductor is greater than 0.15 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion of the second conductor is greater than 0.4 relative to the length of the loop of the first conductor. (2)

[0227] According to the antenna device described in (1), wherein,

[0228] The length of the loop of the first conductor is greater than 0.2 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion of the second conductor is greater than 0.5 relative to the length of the loop of the first conductor. (3)

[0230] The antenna device according to (1) or (2) further includes:

[0231] Substrate, wherein,

[0232] At least a portion of the first conductor is formed on the surface of the substrate. (4)

[0234] According to the antenna device described in (3), wherein,

[0235] The first conductor includes a first element, a second element arranged facing the first element, a third element extending in a direction substantially orthogonal to the extending directions of the first and second elements, and a fourth element arranged facing the third element.

[0236] The annular surface is formed by a first element, a second element, a third element, and a fourth element, and

[0237] The length of each of the first and second elements in the ring of the annular surface is greater than the length of each of the third and fourth elements. (5)

[0239] According to the antenna device described in (4), wherein,

[0240] The third and fourth elements are each arranged in a through hole formed in the substrate. (6)

[0242] The antenna device according to (5) further includes:

[0243] Multiple third elements and multiple fourth elements, wherein,

[0244] The plurality of third elements and the plurality of fourth elements are each disposed in different through holes. (7)

[0246] The antenna device according to any one of (4) to (6), wherein,

[0247] A first element is formed on a first main surface of the substrate, and a second element is formed on a second main surface opposite to the first main surface.

[0248] The substrate is stacked with other substrates such that the first main surface of the other substrates contacts the second main surface of the substrate.

[0249] The second conductor is formed on the second main surface of the other substrate, opposite to the first main surface. (8)

[0251] The antenna device according to any one of (4) to (6), wherein,

[0252] A first element is formed on a first main surface of the substrate, and a second element is formed on a second main surface opposite to the first main surface.

[0253] The second conductor is formed on the second main surface of the substrate using the same metal layer as the second element, and

[0254] The metal layer between the second element and the second conductor is removed. (9)

[0256] According to the antenna device described in (4), wherein,

[0257] The first element is arranged at a position where the distance from the second conductor along the thickness direction of the substrate is greater than the distance from the second element, and

[0258] The area of ​​the first element is larger than the area of ​​the second element. (10)

[0260] According to the antenna device described in (9), wherein,

[0261] The first and second elements each have a rectangular shape.

[0262] The first element and the second element have the same length in the transverse direction, and the first element has a longer length in the longitudinal direction than the second element. (11)

[0264] According to the antenna device described in (9), wherein,

[0265] The first and second elements each have a rectangular shape.

[0266] The first element and the second element have the same length in the longitudinal direction, and the first element has a greater length in the transverse direction than the second element. (12)

[0268] The antenna device according to any one of (3) to (11) further includes:

[0269] Metal pattern separated from the first conductor. (13)

[0271] According to the antenna device described in (12), wherein,

[0272] The metal pattern is formed on the same surface as the surface of the substrate where the first conductor is formed. (14)

[0274] According to the antenna device described in (13), wherein,

[0275] A first conductor is formed on the first and second main surfaces of the substrate, and

[0276] The metal pattern is formed on the first and second main surfaces of the substrate. (15)

[0278] According to the antenna device described in (14), wherein,

[0279] The substrate is stacked with other substrates such that the first main surface of the other substrates contacts the second main surface of the substrate.

[0280] The second conductor is formed on the second main surface of the other substrate. (16)

[0282] The antenna device according to any one of (3) to (13) further includes:

[0283] A fixing part that fixes the substrate and the second conductor to each other. (17)

[0285] The antenna device according to any one of (1) to (16), wherein,

[0286] A first conductor is formed on the surface of the housing containing the rectifier circuit. (18)

[0288] The antenna device according to any one of (1) to (16) further includes:

[0289] Matching circuit, wherein,

[0290] The rectifier circuit is connected to the first conductor via the matching circuit. (19)

[0292] The antenna device according to any one of (3) to (13), wherein,

[0293] The substrate is connected to the heat dissipation component. (20)

[0295] An electronic device, comprising:

[0296] The antenna device according to any one of (1) to (19); and

[0297] The load is connected to the rectifier circuit. (twenty one)

[0299] According to the antenna device described in (16), wherein,

[0300] The rectifier circuit is arranged in the space formed between the substrate and the second conductor. (twenty two)

[0302] The antenna device according to any one of (1) to (21), wherein,

[0303] The first conductor has a shape that forms a missing portion in a part of the ring. (twenty three)

[0305] According to the antenna device described in (22), wherein,

[0306] The missing portion has a linear shape or a comb-like shape. (twenty four)

[0308] According to the antenna device described in (5), wherein,

[0309] The substrate has a third conductor disposed inside, and the third conductor is configured to penetrate the annular surface. (25)

[0311] The antenna device according to any one of (1) to (24) further includes:

[0312] Multiple first conductors; and

[0313] The rectifier circuit is connected to each of the first conductors, wherein,

[0314] The second conductor has a main surface extending in a direction substantially orthogonal to all the annular surfaces of the plurality of first conductors. (26)

[0316] According to the antenna device of claim (25), wherein,

[0317] In the plurality of first conductors, a portion of the first conductors is arranged such that the annular surface of that portion of the first conductor is arranged along a first direction, and the others of the first conductors are arranged such that the other annular surfaces of the first conductors are arranged along a second direction orthogonal to the first direction.

[0318] Reference tag list

[0319] 10A to 10S Antenna Device

[0320] 20 First Conductor

[0321] 21 First Component

[0322] 22 Second Element

[0323] 23 Third Component

[0324] 24. Fourth Component

[0325] 30 Metal Plate

[0326] 33 Outer edge portion

[0327] 40 Rectifier Circuit

[0328] 41 Matching Circuit

[0329] 50 substrate

[0330] 53 Through Hole

[0331] 54 Through holes

[0332] 57. Remove part

[0333] 65 Metal Pattern

[0334] 70 Heat dissipation components

[0335] 75 Fixing part

[0336] 85 Conductor section

[0337] 90 load

[0338] 100 Electronic devices

Claims

1. An antenna device, comprising: The first conductor has a ring shape; A rectifier circuit connected to the first conductor; as well as The second conductor has a plate-like shape and includes a main surface extending in a direction substantially orthogonal to the annular surface of the first conductor and an outer edge portion of the main surface, wherein... The length of the loop of the first conductor is greater than 0.15 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion of the second conductor is greater than 0.4 relative to the length of the loop of the first conductor.

2. The antenna device according to claim 1, wherein, The length of the loop of the first conductor is greater than 0.2 relative to the wavelength at the receiving frequency, and the minimum length of the outer edge portion of the second conductor is greater than 0.5 relative to the length of the loop of the first conductor.

3. The antenna device according to claim 1, further comprising: Substrate, wherein, At least a portion of the first conductor is formed on the surface of the substrate.

4. The antenna device according to claim 3, wherein, The first conductor includes a first element, a second element arranged facing the first element, a third element extending in a direction substantially orthogonal to the extending directions of the first and second elements, and a fourth element arranged facing the third element. The annular surface is formed by a first element, a second element, a third element, and a fourth element, and The length of each of the first and second elements in the ring of the annular surface is greater than the length of each of the third and fourth elements.

5. The antenna device according to claim 4, wherein, The third and fourth elements are each arranged in a through hole formed in the substrate.

6. The antenna device according to claim 5, further comprising: Multiple third elements and multiple fourth elements, wherein, The plurality of third elements and the plurality of fourth elements are each disposed in different through holes.

7. The antenna device according to claim 4, wherein, A first element is formed on a first main surface of the substrate, and a second element is formed on a second main surface opposite to the first main surface. The substrate is stacked with other substrates such that the first main surface of the other substrates contacts the second main surface of the substrate. The second conductor is formed on the second main surface of the other substrate, opposite to the first main surface.

8. The antenna device according to claim 4, wherein, A first element is formed on a first main surface of the substrate, and a second element is formed on a second main surface opposite to the first main surface. The second conductor is formed on the second main surface of the substrate using the same metal layer as the second element, and The metal layer between the second element and the second conductor is removed.

9. The antenna device according to claim 4, wherein, The first element is arranged at a position where the distance from the second conductor along the thickness direction of the substrate is greater than the distance from the second element, and The area of ​​the first element is larger than the area of ​​the second element.

10. The antenna device according to claim 9, wherein, The first and second elements each have a rectangular shape. The first element and the second element have the same length in the transverse direction, and the first element has a longer length in the longitudinal direction than the second element.

11. The antenna device according to claim 9, wherein, The first and second elements each have a rectangular shape. The first element and the second element have the same length in the longitudinal direction, and the first element has a greater length in the transverse direction than the second element.

12. The antenna device according to claim 3, further comprising: Metal pattern separated from the first conductor.

13. The antenna device according to claim 12, wherein, The metal pattern is formed on the same surface as the surface of the substrate where the first conductor is formed.

14. The antenna device according to claim 13, wherein, A first conductor is formed on the first and second main surfaces of the substrate, and The metal pattern is formed on the first and second main surfaces of the substrate.

15. The antenna device according to claim 14, wherein, The substrate is stacked with other substrates such that the first main surface of the other substrates contacts the second main surface of the substrate. The second conductor is formed on the second main surface of the other substrate.

16. The antenna device according to claim 3, further comprising: A fixing part that fixes the substrate and the second conductor to each other.

17. The antenna device according to claim 1, wherein, A first conductor is formed on the surface of the housing containing the rectifier circuit.

18. The antenna device according to claim 1, further comprising: Matching circuit, wherein, The rectifier circuit is connected to the first conductor via the matching circuit.

19. The antenna device according to claim 3, wherein, The substrate is connected to the heat dissipation component.

20. An electronic device, comprising: The antenna device according to claim 1; as well as The load is connected to the rectifier circuit.

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