High-temperature water-loss plane art embossing device

Abstract

The invention provides a high-temperature water-loss plane art embossing device, and relates to the technical field of embossing equipment, the high-temperature water-loss plane art embossing device comprises a frame assembly, a pressing plate assembly is arranged on the frame assembly, and the pressing plate assembly comprises an upper pressing plate, at least one partition pressing plate and a lower pressing plate which are sequentially arranged from top to bottom; embossing spaces used for containing flower materials are formed between the adjacent pressing plates. Heating modules are arranged on the plate surfaces, facing the embossing space, of the upper pressing plate, the interlayer plate and the lower pressing plate; the upper end of the stress pull rod is connected with the upper pressing plate, the middle of the stress pull rod perpendicularly penetrates through the partition pressing plate and the lower pressing plate, and the lower end of the stress pull rod extends into the frame assembly. The power driving module is in transmission connection with the lower end of the stress pull rod and used for driving the stress pull rod to drive the upper pressing plate to move in the axial direction of the stress pull rod so as to achieve pressing fit and separation of the embossing space. The method can promote the water of the flower material to be quickly vaporized and separated, greatly shortens the drying period, and inhibits the breeding of microorganisms to avoid mildewing at the same time.

Description

TECHNICAL FIELD

[0001] The present application relates to the embossing technical field, and particularly relates to a high-temperature horizontal plane artistic embossing device. BACKGROUND

[0002] In recent years, embossing artworks have gradually become a popular trend category due to their unique artistic charm and emotional value. Such artworks are made of plants or flowers as raw materials, and are processed through steps such as finishing, dehydration and color preservation. Not only the original form and details of the plants are completely preserved, but also the creators can obtain the experience of mental relief in the process of making, realizing the emotional attachment of "keeping the natural moment and condensing the beauty of plants". However, in the process of embossing, the water contained in the plants or flowers becomes a key bottleneck affecting the quality of the finished product. If the dehydration process is not timely or complete, the flower material is prone to mildew due to microbial growth, accompanied by problems such as pigment decomposition and discoloration, which directly leads to the failure of embossing. Even if it is forced to form, it is difficult to maintain the original color saturation and morphological integrity, which seriously restricts the quality stability and ornamental value of embossing artworks. The known embossing devices include book embossing, ordinary embossing device and microwave embossing device.

[0003] In the existing embossing technology system, book embossing is the most traditional process means. Its technical principle is to use natural gravity to apply pressure and use the water absorption of paper to realize the dehydration and drying of the flower material and the fixation of the form. The specific process is as follows: first, the collected plant material is pretreated, and the plant organs with low water content and thin tissue structure are selected as the embossing material. The pretreated flower material is placed in the middle of the water absorption paper and clamped in the book, and a constant weight is applied above the book to ensure uniform distribution of pressure. Finally, it is placed in a well-ventilated and dry environment for pressing treatment. However, this traditional process is easily affected by environmental humidity, pressure distribution uniformity and other factors, and has technical bottlenecks such as low dehydration efficiency, poor color preservation effect and insufficient form stability, which further highlights the necessity and urgency of developing efficient and controllable embossing technology.

[0004] On this basis, the ordinary embosser is widely used as a relatively common embosser. Its structure is composed of upper and lower pressing plates, drying plates, sponges, backing paper, and bandage. The technical principle is to provide uniform pressure through special plates and to accelerate the embossing process by combining the rapid moisture absorption of the water absorption paper. When operating, the flowers are placed in the order of "sponge-drying plate-backing paper-plant-backing paper-sponge", and the embosser is covered and tightened with a bandage. The uniform pressure applied by the bandage and the upper and lower pressing plates keeps the flowers flat. According to the thickness of the plant, the pressing time is generally 1 to 5 days, and if the plant is too thick, the pressing time needs to be appropriately extended. The ordinary embosser can better maintain the shape and integrity of the plant, but the number of one-time pressing is limited, and there are certain limitations for large-scale production. Moreover, the price of some embossers is relatively high, increasing the production cost.

[0005] The microwave embosser is a device that uses the heat effect and pressure of microwaves to accelerate the evaporation of water from the plant and fix the shape of the flower. It is mainly composed of upper and lower pressing plates with air holes, water absorption cotton, backing paper, and buckles. During operation, the flowers are placed in the water absorption paper and then placed in the embosser container in the microwave oven. The embosser is heated for a short time to complete the pressing. The microwave can make the water molecules vibrate and generate heat, which can accelerate the evaporation of water from the inside of the flower. At the same time, the pressure applied by the embosser container helps to fix the shape of the flower. The pressing time is generally 1 to 3 minutes, and even complex flowers like roses and fruits can be pressed. Compared with the natural drying of the ordinary embosser, the microwave embosser greatly shortens the drying time, which is of great benefit to improving the quality of dried flowers, especially for plant materials with high water content. However, not all plants are suitable for this method. Some plant materials are not resistant to high temperatures, and the pigments can easily change color during the microwave heating process, affecting the color presentation of the embossed flowers. On the other hand, the price of the microwave embosser is 4 to 10 times higher than that of the ordinary embosser, significantly increasing the production cost, which to some extent limits its popularization and application.

[0006] In summary, the existing embosser has its own shortcomings in improving production efficiency, expanding the range of plant applications, controlling costs, and ensuring the quality of embossed products. Therefore, it is of great practical significance and necessity to develop a new type of plant flat embossing device to solve the above problems and improve the overall benefits of plant flat embossing. SUMMARY

[0007] The present application overcomes the shortcomings of the prior art and provides a high-temperature loss flat artistic embossing device that can accelerate the rapid vaporization of water from the flowers, significantly shorten the drying period, and inhibit the growth of microorganisms to prevent mold growth.

[0008] To solve the above technical problems, the present application is realized by the following technical scheme:

[0009] The utility model provides a kind of high-temperature loss level plane art embossing device, including frame assembly, the frame assembly is provided with platen assembly, the platen assembly includes upper platen, at least one interlayer platen and lower platen sequentially arranged from top to bottom, and embossing space for accommodating flower material is formed between adjacent platen;Heating module is provided on the board surface of upper platen, interlayer platen and lower platen facing embossing space;

[0010] Further include force link, the upper end of the force link is connected with upper platen, the middle part is vertically through the interlayer platen and lower platen, and the lower end extends to the inside of the frame assembly;

[0011] The frame assembly is provided with power drive module, the lower end of the force link is drivingly connected with the power drive module, for driving the force link to drive the upper platen to move along its axial direction, to realize the compression and separation of the embossing space.

[0012] Further, the heating module includes silica gel heating plate and water-absorbing buffer layer, the silica gel heating plate is electrically connected with control system;The water-absorbing buffer layer is laid on the surface of the silica gel heating plate.

[0013] Further, the surface of the water-absorbing buffer layer is provided with lining paper to avoid damage caused by direct contact between flower material and water-absorbing buffer layer.

[0014] Further, it further includes elastic pressure adjusting mechanism, the elastic pressure adjusting mechanism includes a plurality of compression springs sleeved on the force link, and the compression springs are arranged between adjacent platen to fix and adjust the distance between platen.

[0015] Further, the board surface of the upper platen, interlayer platen and lower platen is provided with embedding groove, the size of the silica gel heating plate is matched with the embedding groove, and the silica gel heating plate is fixed in the embedding groove by pasting.

[0016] Further, the silica gel heating plate is provided with heating wire in the form of snake shape inside, and the board surface of the silica gel heating plate is provided with dense first air-permeable hole.

[0017] Further, the material of the heating wire is iron-chromium-aluminum alloy;And / or, the material of the upper platen, interlayer platen and lower platen is aluminum-magnesium alloy, and the embedding groove of the upper platen, interlayer platen and lower platen is provided with uniformly distributed second air-permeable hole.

[0018] Further, the power drive module includes motor, driving shaft and driven shaft, the driving shaft and the driven shaft are both provided with chain wheel, and two chain wheels are connected by transmission chain to realize synchronous linkage;

[0019] The output end of the motor is connected with the driving shaft; the driving gear is fixedly connected on the driving shaft and the driven shaft respectively; the rack part engaged with the driving gear is arranged on the rod body of the stress pull rod;

[0020] The motor drives the driving shaft and the driven shaft to rotate synchronously, and then drives the driving gear to rotate, and drives the stress pull rod to drive the upper pressing plate to move along the vertical direction through the engagement of the rack part.

[0021] Further, the fixed screw rod is provided with the first nut for limiting the lower pressing plate, and the lower pressing plate is provided with the gasket; the top of the stress pull rod is provided with the second nut for limiting the upper pressing plate.

[0022] Further, the bottom of the fixed screw rod is connected with the bearing seat, and the driving shaft and the driven shaft are connected on the bearing seat; the frame assembly comprises the supporting base at the bottom.

[0023] Compared with the prior art, the beneficial effects of the present application are:

[0024] The high-temperature action of the silicone heating plate of the present application promotes the rapid vaporization of the water content of the flower material, and the high-efficiency water absorption performance of the water-absorbing cotton greatly shortens the drying period and eliminates the dependence of ordinary embossing machines on the environment; and the design of the multiple layers, the upper pressing plate and the lower pressing plate further improves the batch processing efficiency; the water-absorbing cotton and the lining paper are convenient to replace, the distance between the pressing plates is flexible to adjust, and different types and thicknesses of flower materials are adapted; by using high temperature to inhibit the growth of microorganisms, mold growth is avoided from the source, and the embossing quality stability is improved; and no special microwave-resistant parts are needed, the manufacturing cost is lower than that of a microwave embossing machine, the service life is long, and the long-term maintenance cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present application, together with the embodiments of the present application, to explain the present application, and do not constitute a limitation on the present application, in which:

[0026] Figure 1 is a front view of the high-temperature loss horizontal plane artistic embossing device of the present application;

[0027] Figure 2 is Figure 1 is an enlarged view of the A circle in the figure;

[0028] Figure 3 is a perspective view of the high-temperature loss horizontal plane artistic embossing device of the present application;

[0029] Figure 4 is a structural schematic view of the high-temperature loss horizontal plane artistic embossing device of the present application with the frame assembly removed;

[0030] Figure 5 This is a schematic diagram showing the separation of the interlayer pressure plate from the silicone heating plate, the absorbent buffer layer, and the liner paper;

[0031] Figure 6 This is a top view of the interlayer pressure plate.

[0032] In the diagram: 1. Frame assembly; 101. Support base; 2. Pressure plate assembly; 201. Upper pressure plate; 202. Partition pressure plate; 2021. Insert groove; 20211. Second vent hole; 203. Lower pressure plate; 3. Embossing space; 4. Force-bearing tie rod; 401. Rack section; 5. Silicone heating plate; 6. Water-absorbing buffer layer; 7. Lining paper; 8. Compression spring; 9. Motor; 10. Drive shaft; 11. Driven shaft; 12. Sprocket; 13. Transmission chain; 14. Transmission gear; 15. Fixing screw; 16. First nut; 17. Washer; 18. Second nut; 19. Bearing seat. Detailed Implementation

[0033] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0034] This invention provides a device for high-temperature dehydration surface art pressing, which mainly uses a high-temperature environment to promote the rapid vaporization and removal of moisture from the floral materials, significantly shortening the drying cycle, while inhibiting microbial growth to prevent mold. Combined with the uniform and stable pressure applied by the pressure structure, the original shape of the floral materials (such as petal spread and leaf texture) can be fixed, avoiding wrinkles and deformation caused by uneven tissue shrinkage during dehydration.

[0035] Specifically, such as Figures 1 to 6 As shown, the device for high-temperature flat surface art embossing according to the present invention includes a frame assembly 1, a pressure plate assembly 2, a force-bearing tie rod 4, and a power drive module. The frame assembly 1 provides a supporting structure for the entire device, including a support base 101 at the bottom, laying the foundation for stable operation. The pressure plate assembly 2 is mounted on the frame assembly 1 and includes, from top to bottom, an upper pressure plate 201, at least one partition pressure plate 202, and a lower pressure plate 203. An embossing space 3 is formed between adjacent pressure plates to accommodate the floral materials, which are placed in the embossing space 3 for compression.

[0036] The upper end of the tension rod 4 is connected to the upper pressure plate 201, the middle part vertically penetrates the interlayer pressure plate 202 and the lower pressure plate 203, and the lower end extends into the frame assembly 1. The power drive module is connected to the lower end of the tension rod 4 for driving the tension rod 4 to move the upper pressure plate 201 along its axial direction, thereby realizing the pressing and separating action of the embossing space 3.

[0037] The heating module is installed on the surfaces of the upper pressure plate 201, the partition pressure plate 202, and the lower pressure plate 203 facing the embossing space 3. Specifically, the heating module includes a silicone heating plate 5 and a water-absorbing buffer layer 6. The silicone heating plate 5 is electrically connected to the control system, which can control parameters such as heating temperature. The water-absorbing buffer layer 6 is laid on the surface of the silicone heating plate 5. Its function is to absorb moisture from the flowers during the heating process and to provide a certain buffering effect to avoid excessive compression or damage to the flowers. In this embodiment, the water-absorbing buffer layer 6 is absorbent cotton or an absorbent board.

[0038] The length and width of the absorbent buffer layer 6 are the same as those of the silicone heating plate 5, and the thickness is 2 to 3 cm. In addition, in order to avoid damage caused by direct contact between the flowers and the absorbent buffer layer 6, a backing paper 7 is provided on the surface of the absorbent buffer layer 6. The size of the backing paper 7 is the same as that of the absorbent buffer layer 6.

[0039] The upper pressure plate 201, the partition pressure plate 202, and the lower pressure plate 203 all have recessed grooves 2021 on their surfaces. The size of the silicone heating plate 5 is adapted to the recessed grooves 2021. The silicone heating plate 5 is fixed in the recessed grooves 2021 by using high-temperature resistant adhesive. This design makes the heating plate securely installed and easy to replace or maintain. The silicone heating plate 5 has serpentine heating wires inside, which makes the heating more uniform. In addition, the surface of the silicone heating plate 5 has dense first vent holes, which helps to evenly dissipate heat and remove moisture.

[0040] In this embodiment, the heating wire is made of iron-chromium-aluminum alloy, which has high resistivity and good oxidation resistance, ensuring heating effect and service life. Its maximum operating temperature can reach 1200℃, which is far higher than the temperature control limit of 200℃ of this device. It has excellent high temperature oxidation resistance and thermal fatigue resistance, and its service life is 3 to 5 times longer than that of ordinary nickel-chromium alloy heating wire, reducing the later maintenance cost.

[0041] The upper pressure plate 201, the partition pressure plate 202, and the lower pressure plate 203 are made of aluminum-magnesium alloy. Aluminum-magnesium alloy has advantages such as light weight, high strength, and good thermal conductivity, which are beneficial to the overall performance and ease of operation of the device. Compared with ordinary alloys, it has a lower density, which can reduce the overall weight of the device while ensuring compressive strength, making it easier to transport and install; moreover, the thermal conductivity of aluminum-magnesium alloy is as high as 150 to 200 W / (m·K), which can assist the silicone heating plate 5 in achieving uniform heat conduction and avoid uneven heating of the floral materials.

[0042] Meanwhile, the grooves 2021 of the upper pressure plate 201, the partition pressure plate 202 and the lower pressure plate 203 are provided with uniformly distributed second vent holes 20211. The number of second vent holes 20211 is at least dozens, which further enhances the air permeability and helps to remove water vapor and distribute heat evenly during the heating process.

[0043] It also includes an elastic pressure adjustment mechanism, which comprises multiple compression springs 8 sleeved on the force-bearing rod 4. These compression springs 8 are positioned between adjacent pressure plates, and their function is to fix the distance between the pressure plates. Furthermore, springs with different elastic forces can be selected according to actual needs to adjust the pressure between the pressure plates. By adjusting the compression degree of the compression springs 8, the pressure of the upper pressure plate 201 on the lower pressure plate 203 and the floral materials can be changed to adapt to the pressing requirements of different floral materials, ensuring the consistency and stability of the pressing effect.

[0044] The power drive module includes a motor 9, a drive shaft 10, and a driven shaft 11. Both the drive shaft 10 and the driven shaft 11 are equipped with sprockets 12, and the two sprockets 12 are connected by a transmission chain 13 to achieve synchronous linkage. The output end of the motor 9 is connected to the drive shaft 10, and the motor 9 drives the drive shaft 10 to rotate, which in turn drives the driven shaft 11 to rotate synchronously.

[0045] In this design, drive shaft 10 and driven shaft 11 are respectively fixedly connected to transmission gears 14, and the rod of the force-bearing tie rod 4 is provided with a rack portion 401 that meshes with the transmission gears 14. The motor 9 drives the drive shaft 10 and driven shaft 11 to rotate synchronously, thereby driving the transmission gears 14 to rotate. Through the meshing action with the rack portion 401, the force-bearing tie rod 4 drives the upper pressure plate 201 to move in the vertical direction, realizing the pressing and separating action of the embossing space 3.

[0046] It also includes a fixing screw 15, on which a first nut 16 is provided for limiting the lower pressure plate 203, and a washer 17 is provided between the lower pressure plate 203 and the frame assembly 1, the washer 17 serving as a buffer. The top of the force-bearing tie rod 4 is provided with a second nut 18 for limiting the upper pressure plate 201. Through the cooperation of these second nuts 18 and the washer 17, the lower pressure plate 203 can be further fixed, improving stability.

[0047] The bottom of the fixed screw 15 is connected to a bearing housing 19. The drive shaft 10 and the driven shaft 11 are connected to the bearing housing 19. The bearing housing 19 allows the drive shaft 10 and the driven shaft 11 to rotate flexibly, reducing frictional resistance, improving power transmission efficiency, and ensuring the smooth operation of the device.

[0048] The working principle of this high-temperature delamination surface art embossing device is as follows: First, the floral material is placed in the embossing space 3 formed by the upper pressure plate 201, the partition pressure plate 202, and the lower pressure plate 203. The power drive module is activated, and the motor 9 drives the drive shaft 10, which in turn causes the driven shaft 11 to rotate synchronously through the chain of the sprocket 12. The transmission gear 14 meshes with the rack part 401 on the force-bearing rod 4, driving the upper pressure plate 201 to press down, thus pressing the embossing space 3. At this time, the heating module works, and the silicone heating plate 5 is energized and heated. The iron-chromium-aluminum alloy heating wires distributed in a serpentine pattern inside heat up evenly and dissipate heat through the first vent hole. The water-absorbing buffer layer 6 absorbs the moisture of the floral material, preventing it from dehydrating and deforming, thereby completing the high-temperature delamination surface art embossing.

[0049] The high temperature of the silicone heating plate 5 in this invention promotes rapid vaporization of moisture in the floral materials. Combined with the high water absorption performance of the absorbent cotton, the drying cycle is significantly shortened, eliminating the dependence of ordinary flower embossing machines on the environment. Furthermore, the multi-layered design with the upper pressure plate 201 and lower pressure plate 203 further improves batch processing efficiency. It facilitates the replacement of absorbent cotton and backing paper 7, and the flexible adjustment of the pressure plate spacing adapts to different types and thicknesses of floral materials. By using high temperature to inhibit the growth of microorganisms, mold is prevented from the source, improving the stability of embossing quality. Moreover, no special microwave-resistant components are required, resulting in lower manufacturing costs than microwave flower embossing machines. In addition, the core components (such as heating wire and compression spring 8) have a long service life, reducing long-term maintenance costs.

[0050] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A device for high-temperature, non-level surface artistic embossing, characterized in that, The device includes a frame assembly, on which a pressure plate assembly is provided. The pressure plate assembly includes an upper pressure plate, at least one partition pressure plate, and a lower pressure plate arranged sequentially from top to bottom, with an embossing space for accommodating floral materials formed between adjacent pressure plates. Heating modules are provided on the surfaces of the upper pressure plate, partition pressure plate, and lower pressure plate facing the embossing space. It also includes a tension rod, the upper end of which is connected to the upper pressure plate, the middle part of which vertically penetrates the partition pressure plate and the lower pressure plate, and the lower end extends into the interior of the frame assembly; The frame assembly is equipped with a power drive module, which is connected to the lower end of the force-bearing tie rod. The power drive module is used to drive the force-bearing tie rod to move the upper pressure plate along its axial direction, so as to realize the pressing and separating of the embossing space.

2. The device for high-temperature horizontal surface embossing according to claim 1, characterized in that, The heating module includes a silicone heating plate and a water-absorbing buffer layer. The silicone heating plate is electrically connected to the control system. The water-absorbing buffer layer is laid on the surface of the silicone heating plate.

3. The device for high-temperature horizontal surface embossing according to claim 2, characterized in that, The surface of the absorbent buffer layer is provided with a backing paper.

4. The apparatus for high-temperature horizontal surface embossing according to any one of claims 3, characterized in that, It also includes an elastic pressure adjustment mechanism, which includes multiple compression springs sleeved on the force-bearing tie rod. The compression springs are arranged between adjacent pressure plates to fix and adjust the distance between the pressure plates.

5. The device for high-temperature horizontal surface embossing according to claim 2, characterized in that, The upper pressure plate, the partition pressure plate, and the lower pressure plate are all provided with grooves. The size of the silicone heating plate is adapted to the grooves, and the silicone heating plate is fixed in the grooves by adhesive.

6. The device for high-temperature horizontal surface embossing according to claim 2, characterized in that, The silicone heating plate has heating wires arranged in a serpentine pattern inside, and dense first vent holes are provided on the surface of the silicone heating plate.

7. The device for high-temperature horizontal surface embossing according to claim 5, characterized in that, The heating wire is made of iron-chromium-aluminum alloy; And / or, the upper pressure plate, the partition pressure plate and the lower pressure plate are made of aluminum-magnesium alloy; The upper pressure plate, the partition pressure plate, and the lower pressure plate have evenly distributed second vent holes in their grooves.

8. The apparatus for high-temperature horizontal surface embossing according to any one of claims 1 to 7, characterized in that, The power drive module includes a motor, a drive shaft, and a driven shaft. Both the drive shaft and the driven shaft are equipped with sprockets, and the two sprockets are connected by a transmission chain to achieve synchronous linkage. The output end of the motor is connected to the drive shaft; transmission gears are fixedly connected to the drive shaft and the driven shaft respectively; a rack portion that meshes with the transmission gear is provided on the body of the force-bearing tie rod; The motor drives the drive shaft and driven shaft to rotate synchronously, thereby driving the transmission gear to rotate. Through meshing with the rack, the motor drives the force-bearing rod to move the upper pressure plate in the vertical direction.

9. The apparatus for high-temperature horizontal surface embossing according to claim 8, characterized in that, It also includes a fixing screw, on which a first nut is provided for limiting the lower pressure plate, and a washer is provided between the lower pressure plate and the frame assembly; a second nut is provided at the top of the tension rod for limiting the upper pressure plate.

10. The apparatus for high-temperature horizontal surface embossing according to claim 9, characterized in that, The bottom of the fixing screw is connected to a bearing seat, and the driving shaft and the driven shaft are connected to the bearing seat; the frame assembly includes a support base located at the bottom.

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