Groove type cleaning machine for wafer production and processing

Abstract

The invention discloses a groove type cleaning machine for wafer production and processing, and relates to the technical field of cleaning machines, the groove type cleaning machine comprises a cleaning assembly, the cleaning assembly is used for spraying and diversion of cleaning liquid during wafer cleaning, the bottom of the cleaning assembly is fixedly provided with a box body, and the surface of the box body is rotatably provided with a protective door. According to the groove type cleaning machine for wafer production and processing, a worker disassembles and separates a placement plate and a limiting piece and places a wafer on the placement plate, and then the worker adjusts the position of the limiting piece according to the type of the wafer, so that the limiting piece is limited on the outer side of the wafer, and the side edge of the wafer is limited and protected; and finally, a worker sleeves the adjusting shaft with a limiting piece, so that the limiting piece is installed below the filter plate and placed in the positioning plate through a clamping ring, at the moment, the worker opens a spraying head, the cleaning liquid is conveyed to the filter plate along the clamping ring, and the cleaning liquid flushes the wafer on the placing plate along a flow guide groove formed in the filter plate.

Description

Technical Field

[0001] This invention relates to the field of cleaning machine technology, specifically to a tank-type cleaning machine for wafer manufacturing. Background Technology

[0002] With continuous technological advancements, the semiconductor industry is experiencing rapid growth, leading to a sustained increase in demand for chips with higher performance, smaller size, and lower power consumption. In semiconductor manufacturing, the cleanliness of the wafer surface, as the fundamental material for chip production, plays a crucial role in the quality and performance of the chip. Any minute impurities or contaminants can cause performance problems such as short circuits, open circuits, and leakage, or even render the chip unusable. Therefore, efficient and precise wafer cleaning equipment has become an indispensable key piece of equipment in the semiconductor manufacturing process.

[0003] During wafer fabrication, wafers undergo multiple complex processes such as photolithography, etching, and deposition. These processes leave various impurities and contaminants on the wafer surface, including organic matter, metal ions, particulate matter, and natural oxide layers. If these impurities are not removed in time, they will have adverse effects on subsequent processes, such as affecting the precision of photolithography, causing uneven etching, and reducing the quality of the deposited thin film, thereby affecting the final performance and yield of the chip. Summary of the Invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a tank-type cleaning machine for wafer manufacturing and processing, comprising: a cleaning component, which is used for spraying and guiding cleaning fluid during wafer cleaning; a housing is fixedly installed at the bottom of the cleaning component; a protective door is rotatably installed on the surface of the housing; and a transparent cover is rotatably installed on the top of the cleaning component. A positioning component is used for positioning the wafer rack during cleaning. Several sets of the positioning components are provided, and all sets of the positioning components are installed inside the cleaning component. A stirring component is used to agitate and mix the cleaning solution. A motor is mounted at the bottom of the stirring component. The stirring component is rotatably mounted inside the cavity of the cleaning component and positioned below the positioning component. The motor is fixedly mounted inside the housing, and its output end extends through the housing and is fixedly connected to the stirring component. During wafer cleaning, the operator first removes the positioning component from the cleaning component, places the wafer within the positioning component, and then activates the valve of the cleaning component to inject the cleaning solution into the cleaning component to clean the wafer within the positioning component. During cleaning, the operator starts the motor, causing its output end to drive the stirring component to rotate within the cleaning component, agitating the cleaning solution and ensuring full contact between the cleaning solution and the wafer, thereby improving wafer cleaning efficiency.

[0005] Preferably, the cleaning assembly includes a mounting frame, a spray head fixedly mounted on the top side of the mounting frame, a liquid storage tank fixedly mounted inside the mounting frame, a positioning plate fixedly mounted at the bottom of the liquid storage tank, guide grooves circumferentially distributed on the outer surface of the positioning plate, a cleaning tank fixedly mounted on the outer surface of the liquid storage tank, a through groove at the center of the bottom of the cleaning tank, and a discharge pipe on one side of the outer surface of the cleaning tank. The operator opens the valve of the spray head to spray cleaning fluid into the liquid storage tank. The cleaning fluid collected in the liquid storage tank flows into the cleaning tank along the positioning assembly mounted inside the positioning plate. As the cleaning fluid flows, it rinses the wafer inside the positioning assembly. After the cleaning fluid collects in the cleaning tank, a rotating agitator agitates the cleaning fluid to ensure full contact between the cleaning fluid and the wafer. After cleaning, the wastewater is discharged through the discharge pipe.

[0006] Preferably, the mounting bracket is fixedly installed on the top of the housing, the through slot is sleeved on the outer surface of the agitator, the agitator is rotatably installed inside the cleaning tank, and the positioning plate is adapted to the positioning component. The storage tank and the cleaning tank are separated into a double-layer structure by the positioning plate. The positioning component is mounted above the cleaning tank via the positioning plate, so that the wafers will not stack in the cleaning tank during cleaning, avoiding friction and collision between the wafers during cleaning. At the same time, after cleaning is completed, the cleaning liquid in the cleaning tank is discharged through the drain pipe, and the positioning component mounted above the cleaning tank can control the cleaning liquid adhering to the wafers to facilitate the separation of the wafers from the cleaning liquid after cleaning.

[0007] Preferably, the positioning component includes a retaining ring, which is engaged inside the positioning plate. A connecting ring is fixedly installed inside the retaining ring, and a filter plate is fixedly installed at the bottom of the connecting ring. A guide groove is formed on the surface of the filter plate, and an adjusting shaft is rotatably installed at the middle of the bottom of the filter plate. A limiting component is sleeved on the outer surface of the adjusting shaft, and a placement plate is threaded onto the bottom of the limiting component. The operator disassembles the placement plate and the limiting component, places the wafer on the placement plate, and then adjusts the position of the limiting component according to the wafer model to limit the wafer's side. Finally, the operator sleeves the limiting component onto the adjusting shaft so that it is installed below the filter plate and placed inside the positioning plate via the retaining ring. At this time, the operator turns on the spray head, allowing the cleaning fluid to flow along the retaining ring onto the filter plate. The cleaning fluid then flows along the guide groove on the filter plate to rinse the wafer on the placement plate.

[0008] Preferably, the limiting component includes a guide frame, the guide frame having a sliding groove inside, four sliding grooves being provided, a sliding rod being fixedly installed inside each of the four sliding grooves, a guide block being slidably installed on the surface of each sliding rod, a limiting arc plate being fixedly installed at the bottom of each guide block, a positioning screw being threaded onto the outer surface of each limiting arc plate, a clamping plate being fixedly installed at the top of each guide block, and a tensioning strip being fixedly installed on the surface of the guide block away from the clamping plate, the clamping plate and the tensioning strip being installed alternately. The operator places the wafer on the placement plate, then twists the positioning screw to connect the limiting arc plate to the placement plate. Next, the operator adjusts the position of the guide block in the slide groove according to the wafer model. The guide block slides on the slide rod to keep the limiting arc plate confined to the outside of the wafer. The limiting arc plate is made of flexible rubber. When the cleaning fluid flows and the wafer wobbles between multiple sets of limiting arc plates, the flexible material of the limiting arc plate protects the wafer, preventing collision damage. After the guide block moves the limiting arc plate, the operator places the tension strip within the adjacent clamping plate. The tension strip and clamping plate work together to position the guide block and prevent it from loosening during cleaning.

[0009] Preferably, the guide frame is detachably mounted on the surface of the adjusting shaft, and the placement plate is threadedly mounted on the bottom of the limiting arc plate via a positioning screw. The limiting arc plate is made of flexible rubber material.

[0010] Preferably, the agitation assembly includes a stirring shaft, an extension shaft fixedly mounted on the top of the stirring shaft, an mounting ring fixedly mounted on the outer surface of the extension shaft, and an extension rod fixedly mounted on the outer surface of the mounting ring. Four extension rods are provided, and limiting supports are fixedly mounted on the surfaces of the four extension rods. Clamping plates are fixedly mounted on both sides of the outer surface of the extension rods, and the clamping plates are engaged with the limiting supports. Several mounting grooves are provided inside the clamping plates, and dispersing components are fixedly mounted inside each of the several mounting grooves. When the operator starts the motor, the output end of the motor drives the stirring shaft to rotate. At this time, the clamping plates mounted on the extension rods drive the dispersing components to rotate, thereby agitating the cleaning liquid. This agitates and rapidly diffuses the cleaning liquid around the wafer, while simultaneously carrying away waste liquid containing contaminants, accelerating the mass transfer process of contaminants, and improving the peeling efficiency. Furthermore, the frictional force of the flowing cleaning liquid on the wafer surface during agitation creates a physical peeling force on the contaminants. Combined with the dissolving, oxidizing, or chelating effects of chemical reagents, stubborn impurities are removed more thoroughly.

[0011] Preferably, the stirring shaft is fixedly installed at the output end of the motor, and the stirring shaft is rotatably installed inside the cleaning tank.

[0012] Preferably, the dispersing component includes a snap-fit ​​bracket, and two sets of snap-fit ​​brackets are provided. Hollow blocks are fixedly installed on the outer surfaces of the two sets of snap-fit ​​brackets. A flow groove is opened inside the hollow block. An inner ring is fixedly installed between the opposite faces of the hollow block. Segmented arc plates are fixedly installed on both sides of the outer surface of the inner ring.

[0013] Preferably, the card holder is fixedly installed on the outer surface of the mounting groove, and the inner connecting ring and the segmented arc plate are installed inside the mounting groove. The card holder is installed inside the mounting groove, and the perforated blocks extend on both sides of the card plate. When the cleaning fluid is agitated, the densely perforated structure of the perforated blocks and the segmented arc plate allows the cleaning fluid to spread rapidly through the flow channel, fully contacting the wafer in the cleaning tank, thereby improving the wafer cleaning efficiency.

[0014] This invention provides a tank-type cleaning machine for wafer fabrication. It has the following advantages: 1. The tank-type cleaning machine for wafer production and processing operates by having the operator open the valve of the spray head to spray cleaning fluid into the storage tank. The cleaning fluid collected in the storage tank flows into the cleaning tank through the positioning component installed in the positioning plate. As the cleaning fluid flows, it rinses the wafers in the positioning component. After the cleaning fluid is collected in the cleaning tank, the rotating agitator agitates the cleaning fluid to ensure that the cleaning fluid and wafers are in full contact. After cleaning is completed, the wastewater is discharged through the discharge pipe.

[0015] 2. The tank-type cleaning machine for wafer production and processing has a double-layer structure with a positioning plate separating the storage tank and the cleaning tank. The positioning component is mounted above the cleaning tank through the positioning plate, so that the wafers will not stack in the cleaning tank during cleaning, avoiding friction and collision of the wafers during cleaning. At the same time, after cleaning is completed, the cleaning liquid in the cleaning tank is discharged through the discharge pipe, and the positioning component mounted above the cleaning tank can control the cleaning liquid adhering to the wafers to facilitate the separation of the wafers from the cleaning liquid after cleaning.

[0016] 3. The tank-type cleaning machine for wafer production and processing involves workers disassembling and separating the placement plate and the limiting component, placing the wafer on the placement plate, and then adjusting the position of the limiting component according to the wafer model to limit the wafer's side. Finally, the workers put the limiting component on the adjusting shaft so that it is installed below the filter plate and placed inside the positioning plate by a retaining ring. At this time, the workers turn on the spray head, allowing the cleaning fluid to be delivered to the filter plate along the retaining ring. The cleaning fluid then washes the wafer on the placement plate through the guide grooves opened on the filter plate.

[0017] IV. The tank-type cleaning machine for wafer production and processing involves workers placing the wafers on a placement plate, then turning a positioning screw to connect the limiting arc plate to the placement plate. Workers then adjust the position of the guide block within the trough according to the wafer model. The guide block slides on a slide rod to keep the limiting arc plate positioned on the outside of the wafer. The limiting arc plate is made of flexible rubber. When the cleaning fluid flows and the wafer sways between multiple sets of limiting arc plates, the flexible material of the limiting arc plate protects the wafer, preventing collision damage. After the guide block moves the limiting arc plate, workers position a tension strip within an adjacent clamping plate. The tension strip and clamping plate work together to position the guide block and prevent it from loosening during cleaning.

[0018] 5. The tank-type cleaning machine for wafer production and processing is started by the operator, so that the output end of the motor drives the stirring shaft to rotate. At this time, the clamping plate installed on the outside of the stirring shaft through the extension rod drives the dispersing component to rotate, so as to agitate the cleaning solution. This agitates and spreads the cleaning solution around the wafer, while timely carrying away the waste liquid containing contaminants, accelerating the mass transfer process of contaminants and improving the peeling efficiency. In addition, the friction of the cleaning solution flowing on the wafer surface during agitation can form a physical peeling force on the contaminants. Combined with the dissolving, oxidizing or chelating effect of chemical reagents, stubborn impurities are removed more thoroughly. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the external structure of a tank-type cleaning machine for wafer manufacturing according to the present invention. Figure 2This is a schematic diagram of the cleaning assembly of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the cleaning component of the present invention; Figure 4 This is a cross-sectional structural diagram of the cleaning component and the agitation component of the present invention; Figure 5 This is a schematic diagram of the agitation component of the present invention; Figure 6 This is a schematic diagram of the disassembled structure of the stirring component of the present invention; Figure 7 This is a schematic diagram of the structure of the dispersion component of the present invention; Figure 8 This is a cross-sectional structural diagram of the cleaning assembly and positioning component of the present invention; Figure 9 This is a schematic diagram of the disassembled structure of the positioning component of the present invention; Figure 10 A schematic diagram of the structure of the limiting component of this invention; Figure 11 This is a bottom view of the limiting component of the present invention; Figure 12 This is a schematic diagram of the disassembled structure of the limiting component of the present invention; Figure 13 This is an enlarged structural schematic diagram of the guide block of the present invention; Figure 14 This is a schematic diagram of the disassembled structure of the limiting arc plate of the present invention.

[0020] In the diagram: 1. Housing; 2. Cleaning assembly; 21. Mounting bracket; 22. Liquid storage tank; 23. Spray head; 24. Positioning plate; 25. Guide channel; 26. Cleaning tank; 27. Through channel; 3. Transparent cover; 4. Protective door; 5. Positioning assembly; 51. Limiting component; 511. Guide frame; 512. Slide groove; 513. Slide rod; 514. Tensioning strip; 515. Limiting arc plate; 516. Guide block; 517. Clamping plate; 518. Positioning screw 52. Snap ring; 53. Connecting ring; 54. Filter plate; 55. Guide channel; 56. Placement plate; 57. Adjusting shaft; 6. Motor; 7. Agitator assembly; 71. Snap plate; 72. Mounting ring; 73. Stirring shaft; 74. Extension shaft; 75. Limiting support block; 76. Mounting groove; 77. Extension rod; 78. Dispersing component; 781. Segmented arc plate; 782. Inner connecting ring; 783. Snap-fit ​​bracket; 784. Flow channel; 785. Hollow block. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] First embodiment, such as Figures 1 to 14 As shown, the present invention provides a technical solution: a tank-type cleaning machine for wafer manufacturing and processing, comprising: a cleaning component 2, which is used for spraying and guiding the cleaning liquid during wafer cleaning; a housing 1 is fixedly installed at the bottom of the cleaning component 2; a protective door 4 is rotatably installed on the surface of the housing 1; and a transparent cover 3 is rotatably installed on the top of the cleaning component 2. Positioning component 5, which is used for positioning the wafer rack during cleaning, and several sets of positioning components 5 are provided, with each set of positioning components 5 installed inside the cleaning component 2; A stirring component 7 is used to agitate and mix the cleaning solution. A motor 6 is mounted at the bottom of the stirring component 7. The stirring component 7 is rotatably mounted inside the cavity of the cleaning component 2 and is positioned below the positioning component 5. The motor 6 is fixedly mounted inside the housing 1, and its output end extends through the housing 1 and into the cleaning component 2, where it is fixedly connected to the stirring component 7. During wafer cleaning, the operator first removes the positioning component 5 from the cleaning component 2, places the wafer within the positioning component 5, and then activates the valve of the cleaning component 2 to inject the cleaning solution into it, thus cleaning the wafer within the positioning component 5. During cleaning, the operator activates the motor 6, causing its output end to drive the stirring component 7 to rotate within the cleaning component 2, agitating the cleaning solution and ensuring sufficient contact between the solution and the wafer, thereby improving wafer cleaning efficiency.

[0023] The cleaning assembly 2 includes a mounting frame 21. A spray head 23 is fixedly installed on the top side of the mounting frame 21. A liquid storage tank 22 is fixedly installed inside the mounting frame 21. A positioning plate 24 is fixedly installed at the bottom of the liquid storage tank 22. A guide groove 25 is formed on the side of the outer surface of the positioning plate 24. The guide groove 25 is distributed in a circumferential shape on the surface of the positioning plate 24. A cleaning tank 26 is fixedly installed on the outer surface of the liquid storage tank 22. A through groove 27 is formed in the middle of the bottom of the cleaning tank 26. A discharge pipe is formed on one side of the outer surface of the cleaning tank 26. The operator opens the valve of the spray head 23 to spray cleaning fluid into the storage tank 22. The cleaning fluid collected in the storage tank 22 flows into the cleaning tank 26 through the positioning component 5 installed in the positioning plate 24. As the cleaning fluid flows, it rinses the wafers in the positioning component 5. After the cleaning fluid is collected in the cleaning tank 26, the rotating agitator 7 agitates the cleaning fluid to ensure that the cleaning fluid comes into full contact with the wafers. After cleaning is completed, the wastewater is discharged through the drain pipe.

[0024] The mounting bracket 21 is fixedly installed on the top of the housing 1. The through groove 27 is sleeved on the outer surface of the agitator 7. The agitator 7 is rotatably installed inside the cleaning tank 26. The positioning plate 24 is adapted to the positioning component 5. The storage tank 22 and the cleaning tank 26 are separated into a double-layer structure by the positioning plate 24. The positioning component 5 is mounted above the cleaning tank 26 through the positioning plate 24, so that the wafers will not stack in the cleaning tank during cleaning, avoiding friction and collision of the wafers during cleaning. At the same time, after cleaning, the cleaning liquid in the cleaning tank 26 is discharged through the discharge pipe. The positioning component 5 mounted above the cleaning tank 26 can control the cleaning liquid adhering to the wafers, so as to facilitate the separation of the wafers from the cleaning liquid after cleaning.

[0025] The second embodiment is based on the first embodiment; please refer to [link / reference]. Figures 4 to 7As shown, the stirring assembly 7 includes a stirring shaft 73, an extension shaft 74 is fixedly installed on the top of the stirring shaft 73, an installation ring 72 is fixedly installed on the outer surface of the extension shaft 74, an extension rod 77 is fixedly installed on the outer surface of the installation ring 72, four extension rods 77 are provided, a limiting support block 75 is fixedly installed on the surface of the four extension rods 77, a clamping plate 71 is fixedly installed on both sides of the outer surface of the extension rod 77, the clamping plate 71 is engaged and adapted with the limiting support block 75, an installation groove 76 is opened inside the clamping plate 71, a plurality of installation grooves 76 are provided, and a dispersing component 78 is fixedly installed inside each of the plurality of installation grooves 76. The operator starts the motor 6, causing the output end of the motor 6 to drive the stirring shaft 73 to rotate. At this time, the clamping plate 71 installed on the outside of the stirring shaft 73 through the extension rod 77 drives the dispersing component 78 to rotate, so as to agitate the cleaning solution, so that the cleaning solution around the wafer is agitated and spreads rapidly. At the same time, the waste liquid containing contaminants is carried away in time, accelerating the mass transfer process of contaminants and improving the peeling efficiency. In addition, the friction force of the cleaning solution flowing on the wafer surface during agitation can form a physical peeling force on the contaminants. Combined with the dissolving, oxidizing or chelating effect of chemical reagents, stubborn impurities are removed more thoroughly.

[0026] The stirring shaft 73 is fixedly installed at the output end of the motor 6, and the stirring shaft 73 is rotatably installed inside the cleaning tank 26.

[0027] The dispersing component 78 includes a snap-fit ​​bracket 783, which is provided in two sets. A hollow block 785 is fixedly installed on the outer surface of the two sets of snap-fit ​​brackets 783. A flow groove 784 is opened inside the hollow block 785. An inner ring 782 is fixedly installed between the opposite faces of the hollow block 785. Segmented arc plates 781 are fixedly installed on both sides of the outer surface of the inner ring 782.

[0028] The card holder 783 is fixedly installed on the outer surface of the mounting groove 76, and the inner ring 782 and the segmented arc plate 781 are installed inside the mounting groove 76. The card holder 783 is installed inside the mounting groove 76, and the hollow block 785 extends on both sides of the card plate 71. When the cleaning fluid is agitated, the densely hollowed-out hollow block 785 and the segmented arc plate 781 allow the cleaning fluid to spread rapidly through the flow channel 784 and fully contact the wafer in the cleaning tank 26, thereby improving the wafer cleaning efficiency.

[0029] The third embodiment is based on embodiments one and two; please refer to [link / reference]. Figures 8 to 14As shown, the positioning component 5 includes a retaining ring 52, which is engaged inside the positioning plate 24. A connecting ring 53 is fixedly installed inside the retaining ring 52. A filter plate 54 is fixedly installed at the bottom of the connecting ring 53. A guide groove 55 is formed on the surface of the filter plate 54. An adjusting shaft 57 is rotatably installed at the middle of the bottom of the filter plate 54. A limiting member 51 is sleeved on the outer surface of the adjusting shaft 57. A placement plate 56 is threadedly installed at the bottom of the limiting member 51. The staff disassembled the placement plate 56 and the limiting member 51, and placed the wafer on the placement plate 56. Then, the staff adjusted the position of the limiting member 51 according to the wafer model so that the limiting member 51 was limited to the outside of the wafer to limit and protect the side of the wafer. Finally, the staff put the limiting member 51 on the adjusting shaft 57 so that the limiting member 51 was installed below the filter plate 54 and placed inside the positioning plate 24 through the retaining ring 52. At this time, the staff turned on the spray head 23 so that the cleaning fluid was delivered to the filter plate 54 along the retaining ring 52. The cleaning fluid rinsed the wafer on the placement plate 56 along the guide groove 55 opened on the filter plate 54.

[0030] The limiting component 51 includes a guide frame 511, with four sliding grooves 512 inside each groove 512. A sliding rod 513 is fixedly installed inside each of the four sliding grooves 512. A guide block 516 is slidably installed on the surface of each sliding rod 513. A limiting arc piece 515 is fixedly installed at the bottom of each guide block 516. A positioning screw 518 is threaded onto the outer surface of the limiting arc piece 515. A clamping plate 517 is fixedly installed on the top of each guide block 516. A tensioning strip 514 is fixedly installed on the surface of the guide block 516 away from the clamping plate 517. The clamping plate 517 and the tensioning strip 514 are installed alternately. The operator places the wafer on the placement plate 56, then twists the positioning screw 518 to connect the limiting arc plate 515 to the placement plate 56. Next, the operator adjusts the position of the guide block 516 within the slide groove 512 according to the wafer model. The guide block 516 slides on the slide rod 513 to limit the limiting arc plate 515 to the outside of the wafer. The limiting arc plate 515 is made of flexible rubber. When the cleaning fluid flows and the wafer wobbles between multiple sets of limiting arc plates 515, the flexible material of the limiting arc plate 515 protects the wafer, preventing collision damage. After the guide block 516 moves the limiting arc plate 515, the operator limits the tension strip 514 within the adjacent clamping plate 517. The tension strip 514 and clamping plate 517 work together to position the guide block 516, preventing it from loosening during cleaning.

[0031] The guide frame 511 is detachably mounted on the surface of the adjusting shaft 57, and the placement plate 56 is threaded onto the bottom of the limiting arc plate 515 via the positioning screw 518. The limiting arc plate 515 is made of flexible rubber material.

[0032] In use, when cleaning the wafer, the operator first removes the positioning component 5 from the cleaning component 2, installs the wafer limiter inside the positioning component 5, and then places the positioning component 5 inside the cleaning component 2. The operator then activates the valve of the cleaning component 2 to inject cleaning fluid into the cleaning component 2 to clean the wafer inside the positioning component 5. During cleaning, the operator starts the motor 6, causing the output of the motor 6 to drive the agitator 7 to rotate inside the cleaning component 2 to agitate the cleaning fluid, ensuring that the cleaning fluid comes into full contact with the wafer, thereby improving the wafer cleaning efficiency.

[0033] The operator opens the valve of the spray head 23 to spray cleaning fluid into the storage tank 22. The cleaning fluid collected in the storage tank 22 flows into the cleaning tank 26 through the positioning component 5 installed in the positioning plate 24. As the cleaning fluid flows, it rinses the wafers in the positioning component 5. After the cleaning fluid is collected in the cleaning tank 26, the rotating agitator 7 agitates the cleaning fluid to ensure that the cleaning fluid comes into full contact with the wafers. After cleaning is completed, the wastewater is discharged through the drain pipe.

[0034] The storage tank 22 and the cleaning tank 26 are separated into a double-layer structure by a positioning plate 24. The positioning component 5 is mounted on the cleaning tank 26 via the positioning plate 24, so that the wafers will not stack in the cleaning tank during cleaning, avoiding friction and collision of the wafers during cleaning. At the same time, after cleaning is completed, the cleaning liquid in the cleaning tank 26 is discharged through the discharge pipe, and the positioning component 5 mounted on the cleaning tank 26 can control the cleaning liquid adhering to the wafers to facilitate the separation of the wafers from the cleaning liquid after cleaning.

[0035] The staff disassembled the placement plate 56 and the limiting member 51, and placed the wafer on the placement plate 56. Then, the staff adjusted the position of the limiting member 51 according to the wafer model so that the limiting member 51 was limited to the outside of the wafer to limit and protect the side of the wafer. Finally, the staff put the limiting member 51 on the adjusting shaft 57 so that the limiting member 51 was installed below the filter plate 54 and placed inside the positioning plate 24 through the retaining ring 52. At this time, the staff turned on the spray head 23 so that the cleaning fluid was delivered to the filter plate 54 along the retaining ring 52. The cleaning fluid rinsed the wafer on the placement plate 56 along the guide groove 55 opened on the filter plate 54.

[0036] The operator places the wafer on the placement plate 56, then twists the positioning screw 518 to connect the limiting arc plate 515 to the placement plate 56. Next, the operator adjusts the position of the guide block 516 within the slide groove 512 according to the wafer model. The guide block 516 slides on the slide rod 513 to limit the limiting arc plate 515 to the outside of the wafer. The limiting arc plate 515 is made of flexible rubber. When the cleaning fluid flows and the wafer wobbles between multiple sets of limiting arc plates 515, the flexible material of the limiting arc plate 515 protects the wafer, preventing collision damage. After the guide block 516 moves the limiting arc plate 515, the operator limits the tension strip 514 within the adjacent clamping plate 517. The tension strip 514 and clamping plate 517 work together to position the guide block 516, preventing it from loosening during cleaning.

[0037] The operator starts the motor 6, causing the output end of the motor 6 to drive the stirring shaft 73 to rotate. At this time, the clamping plate 71 installed on the outside of the stirring shaft 73 through the extension rod 77 drives the dispersing component 78 to rotate, so as to agitate the cleaning solution, so that the cleaning solution around the wafer is agitated and spreads rapidly. At the same time, the waste liquid containing contaminants is carried away in time, accelerating the mass transfer process of contaminants and improving the peeling efficiency. In addition, the friction force of the cleaning solution flowing on the wafer surface during agitation can form a physical peeling force on the contaminants. Combined with the dissolving, oxidizing or chelating effect of chemical reagents, stubborn impurities are removed more thoroughly.

[0038] The card holder 783 is installed inside the mounting slot 76, and the hollow block 785 extends on both sides of the card plate 71. When the cleaning fluid is agitated, the hollow block 785 with its dense hollow structure and the segmented arc plate 781 enable the cleaning fluid to spread quickly through the flow channel 784 and fully contact the wafer in the cleaning tank 26, thereby improving the wafer cleaning efficiency.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A tank-type cleaning machine for wafer fabrication, characterized in that, include: Cleaning assembly (2), which is used for spraying and guiding cleaning fluid during wafer cleaning, has a housing (1) fixedly installed at the bottom of the cleaning assembly (2), a protective door (4) rotatably installed on the surface of the housing (1), and a transparent cover (3) rotatably installed on the top of the cleaning assembly (2). Positioning component (5) is used for positioning the wafer during cleaning. Several sets of positioning components (5) are provided, and several sets of positioning components (5) are installed inside the cleaning component (2). A stirring component (7) is used to stir and mix the cleaning liquid. A motor (6) is installed at the bottom of the stirring component (7). The stirring component (7) is rotatably installed inside the cavity of the cleaning component (2). The stirring component (7) is located below the positioning component (5). The motor (6) is fixedly installed inside the housing (1). The output end of the motor (6) extends through the housing (1) and the cleaning component (2) and is fixedly connected to the stirring component (7).

2. The tank-type cleaning machine for wafer manufacturing according to claim 1, characterized in that: The cleaning assembly (2) includes a mounting frame (21), a spray head (23) is fixedly installed on the top side of the mounting frame (21), a liquid storage tank (22) is fixedly installed inside the mounting frame (21), a positioning plate (24) is fixedly installed at the bottom of the liquid storage tank (22), a guide groove (25) is provided on the side of the outer surface of the positioning plate (24), the guide groove (25) is distributed in a circumferential shape on the surface of the positioning plate (24), a cleaning tank (26) is fixedly installed on the outer surface of the liquid storage tank (22), a through groove (27) is provided in the middle of the bottom of the cleaning tank (26), and a discharge pipe is provided on one side of the outer surface of the cleaning tank (26).

3. The tank-type cleaning machine for wafer manufacturing according to claim 2, characterized in that: The mounting bracket (21) is fixedly installed on the top of the box (1). The through groove (27) is sleeved on the outer surface of the agitator (7). The agitator (7) is rotatably installed inside the cleaning tank (26). The positioning plate (24) is adapted to the positioning component (5).

4. The tank-type cleaning machine for wafer manufacturing according to claim 1, characterized in that: The positioning component (5) includes a retaining ring (52), which is engaged inside the positioning plate (24). A connecting ring (53) is fixedly installed inside the retaining ring (52). A filter plate (54) is fixedly installed at the bottom of the connecting ring (53). A guide groove (55) is provided on the surface of the filter plate (54). An adjusting shaft (57) is rotatably installed at the middle of the bottom of the filter plate (54). A limiting member (51) is sleeved on the outer surface of the adjusting shaft (57). A placement plate (56) is threaded onto the bottom of the limiting member (51).

5. A tank-type cleaning machine for wafer manufacturing according to claim 4, characterized in that: The limiting component (51) includes a guide frame (511), and the guide frame (511) has a sliding groove (512) inside. There are four sliding grooves (512), and a sliding rod (513) is fixedly installed inside each of the four sliding grooves (512). A guide block (516) is slidably installed on the surface of each sliding rod (513). A limiting arc piece (515) is fixedly installed at the bottom of each guide block (516). A positioning screw (518) is threaded on the outer surface of the limiting arc piece (515). A clamping plate (517) is fixedly installed on the top of the guide block (516). A tensioning strip (514) is fixedly installed on the surface of the guide block (516) away from the clamping plate (517). The clamping plate (517) and the tensioning strip (514) are installed alternately.

6. A tank-type cleaning machine for wafer manufacturing according to claim 5, characterized in that: The guide frame (511) is detachably mounted on the surface of the adjusting shaft (57), and the placement plate (56) is threaded onto the bottom of the limiting arc plate (515) by the positioning screw (518). The limiting arc plate (515) is made of flexible rubber material.

7. A tank-type cleaning machine for wafer manufacturing according to claim 1, characterized in that: The stirring assembly (7) includes a stirring shaft (73), an extension shaft (74) is fixedly installed on the top of the stirring shaft (73), an installation ring (72) is fixedly installed on the outer surface of the extension shaft (74), an extension rod (77) is fixedly installed on the outer surface of the installation ring (72), four extension rods (77) are provided, a limiting support block (75) is fixedly installed on the surface of the four extension rods (77), a clamping plate (71) is fixedly installed on both sides of the outer surface of the extension rod (77), the clamping plate (71) is engaged and adapted with the limiting support block (75), an installation groove (76) is opened inside the clamping plate (71), a plurality of installation grooves (76) are provided, and a dispersion component (78) is fixedly installed inside each of the plurality of installation grooves (76).

8. A tank-type cleaning machine for wafer manufacturing according to claim 7, characterized in that: The stirring shaft (73) is fixedly installed at the output end of the motor (6), and the stirring shaft (73) is rotatably installed inside the cleaning tank (26).

9. A tank-type cleaning machine for wafer manufacturing according to claim 8, characterized in that: The dispersing component (78) includes a snap-fit ​​bracket (783), which is provided in two sets. The outer surfaces of the two sets of snap-fit ​​brackets (783) are fixedly mounted with hollow blocks (785). The hollow blocks (785) have flow grooves (784) inside. The inner rings (782) are fixedly mounted between the opposite faces of the hollow blocks (785). The two sides of the outer surface of the inner rings (782) are fixedly mounted with segmented arc plates (781).

10. A tank-type cleaning machine for wafer manufacturing according to claim 9, characterized in that: The clip bracket (783) is fixedly installed on the outer surface of the mounting groove (76), and the inner ring (782) and the segmented arc plate (781) are installed inside the mounting groove (76).

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