A semiconductor surface heat dissipation structure based on diamond film

Abstract

The application relates to the technical field of semiconductor heat dissipation structures, and particularly provides a semiconductor surface heat dissipation structure based on a diamond film, which comprises a heat dissipation bottom plate, the heat dissipation bottom plate is connected with a semiconductor chip, a diamond film is arranged on the heat dissipation bottom plate, the diamond film is attached to the semiconductor surface, can quickly absorb the heat generated by the chip and transfer to a heat dissipation frame, solves the problem of insufficient heat conduction capacity of a traditional metal heat conduction plate, and is simultaneously provided with the heat dissipation frame, a conical flow guide block is arranged in the heat dissipation frame, the conical flow guide block is matched with a first collecting pipe, water vapor is condensed into small water droplets on the conical surface, the small water droplets enter the first collecting pipe along the tip of the conical flow guide block and directly reach the bottom of cooling liquid, the process avoids heat dissipation loss caused by the fact that cooling liquid drops on the surface of the cooling liquid and exchanges heat with rising water vapor in a traditional structure, guarantees low-temperature backflow of the cooling liquid, and avoids affecting the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor heat dissipation structure, and particularly relates to a semiconductor surface heat dissipation structure based on a diamond film. BACKGROUND

[0002] The diamond material has super-high heat dissipation performance, for example, the thermal conductivity of single crystal diamond at room temperature is generally greater than 2000 W / (m2K), which is 5 times that of copper; meanwhile, the thermal expansion coefficient of diamond is extremely low, which is 1.0*10-6 / K at room temperature. 6 These excellent thermal properties make diamond have very important application prospects in the thermal management of semiconductor optoelectronic devices, which cannot be compared with other functional materials, and the traditional semiconductor heat dissipation mode mostly adopts a metal heat conduction plate to conduct the heat of the semiconductor to the cooling liquid, and the heat is taken away with the vaporization of the cooling liquid, and the condensed liquid drops are reflowed into the cooling liquid, the heat conduction performance of the metal heat conduction plate is much worse than that of the diamond material, and meanwhile, the condensed liquid drops in the existing structure fall on the upper surface of the cooling liquid, so that the heat absorption efficiency is low and the chip temperature cannot be rapidly increased in the high-frequency working environment. SUMMARY

[0003] Therefore, it is necessary to provide a semiconductor surface heat dissipation structure based on a diamond film in view of the low heat dissipation efficiency of the existing semiconductor heat dissipation structure.

[0004] The above-mentioned purpose is realized by the following technical scheme:

[0005] A semiconductor surface heat dissipation structure based on a diamond film comprises:

[0006] A heat dissipation bottom plate connected to the periphery of a semiconductor chip, wherein a diamond film is arranged on the heat dissipation bottom plate, and the diamond film is attached to the surface of the semiconductor chip;

[0007] A heat dissipation frame detachably connected to the heat dissipation bottom plate, wherein the heat dissipation frame is hollow inside and filled with a cooling liquid, a plurality of conical flow guide blocks are fixedly arranged on the upper end face of the heat dissipation frame inside, and the tips of the conical flow guide blocks are downward;

[0008] A plurality of first collection pipes, the openings of the plurality of first collection pipes are located directly below the plurality of conical flow guide blocks respectively, the plurality of first collection pipes are vertically arranged, and the lower ends of the plurality of first collection pipes extend into the bottom of the cooling liquid;

[0009] A flow guide disc axially and elastically slidably arranged at the lower end of the first collection pipe, a plurality of spiral grooves are arranged on the flow guide disc, and the flow guide disc is configured to open the lower end of the first collection pipe when the mass of the cooling liquid on the flow guide disc reaches a preset value.

[0010] Further, the bottom of the flow guide disc is provided with a first elastic member, and the first elastic member pushes the flow guide disc to abut against the lower end of the first collecting pipe.

[0011] Further, a plurality of floating plates are uniformly arranged in the heat dissipation frame, and the plurality of floating plates are respectively fixedly connected with the first collecting pipes in the axial direction.

[0012] Further, a through hole is arranged at the middle position of the heat dissipation frame, the diameter of the through hole is greater than the diameter of the second collecting pipe, the outer periphery of the second collecting pipe is horizontally and sealingly connected in the through hole, and a balance assembly is arranged on the outer periphery of the second collecting pipe.

[0013] Further, the balance assembly comprises a plurality of elastic telescopic rods, one end of the plurality of elastic telescopic rods is fixedly connected with the outer periphery of the second collecting pipe and extends in the radial direction of the second collecting pipe, and the other end of the plurality of elastic telescopic rods is provided with a wedge-shaped block.

[0014] Further, the elastic telescopic rod comprises a fixed rod and a sleeve, the fixed rod is slidingly inserted into the sleeve, and a second elastic member is arranged between the fixed rod and the sleeve.

[0015] Further, a sealing ring groove is coaxially arranged on the side wall of the through hole, and a sealing ring plate is coaxially and fixedly arranged on the outer periphery of the second collecting pipe.

[0016] Further, a plurality of flow guide grooves are arranged on the conical surface of the conical flow guide block along the generatrix direction, one end of the plurality of flow guide grooves is located at the large end of the conical flow guide block, and the other end of the plurality of flow guide grooves converges at the conical tip of the conical flow guide block.

[0017] Further, a plurality of heat conduction ribs are arranged on the corresponding area of the outer side upper end surface of the heat dissipation frame and the conical flow guide block, and the heat conduction ribs correspond to the flow guide grooves.

[0018] Further, a plurality of heat dissipation fins are vertically and fixedly arranged on the outer side upper end surface of the heat dissipation frame.

[0019] The beneficial effects of the present application are as follows:

[0020] This invention directly adheres a diamond film to the surface of a semiconductor chip, enabling rapid absorption of heat generated by the chip and transfer to the heat dissipation frame. This improves thermal conductivity from the source, solving the problem of insufficient thermal conductivity in traditional metal heat-conducting plates. Simultaneously, a conical guide block is set inside the heat dissipation frame. The conical guide block cooperates with the first collection tube, allowing water vapor to condense into small water droplets on the conical surface, which then enter the first collection tube along the tip of the conical guide block and reach the bottom of the coolant. This process avoids the heat loss caused by coolant dripping onto the coolant surface and exchanging heat with rising water vapor, as is common in traditional structures. It ensures low-temperature coolant reflux and avoids affecting heat dissipation efficiency.

[0021] The present invention provides a guide plate at the bottom of the first collection pipe, and the guide plate has a spiral groove. When the mass of the coolant in the pipe reaches a preset value, the coolant forms a rotating flow along the spiral groove and is injected into the coolant body in the form of a vortex. This vortex effect can break the static stratification of the coolant, avoid the accumulation of heat in local areas, promote the uniform mixing of the coolant, and maintain the overall heat absorption capacity.

[0022] This invention provides a floating plate that floats on the surface of the coolant and is fixedly connected to a first collecting tube. When the semiconductor chip generates a lot of heat, the floating plate can drive the first collecting tube to move upward, thereby reducing the force of the first elastic element on the guide plate. This allows the first collecting tube to overcome the force of the first elastic element and open its bottom when there is less coolant in it, thus increasing the frequency of coolant return.

[0023] This invention provides a second collection tube that can move closer to areas of severe heat generation. The second collection tube is linked to a floating plate via a balancing component. When a floating plate rises due to high temperature, the second inclined surface of the floating plate slides relative to the first inclined surface of the wedge block, breaking the force balance of the elastic telescopic rod and pushing the second collection tube to move towards the high-temperature area. This allows the coolant discharged from the second collection tube to be preferentially replenished to the high-temperature area, thereby specifically enhancing the local heat dissipation capacity and preventing the chip from being damaged due to excessively high local temperatures. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a semiconductor surface heat dissipation structure based on a diamond thin film according to an embodiment of the present invention.

[0025] Figure 2 for Figure 1 A left view of a semiconductor surface heat dissipation structure based on a diamond thin film provided in one embodiment;

[0026] Figure 3 for Figure 1 A top view of a semiconductor surface heat dissipation structure based on a diamond thin film provided in one embodiment;

[0027] Figure 4 forFigure 3 A cross-sectional view along AA of a semiconductor surface heat dissipation structure based on a diamond thin film provided in one embodiment;

[0028] Figure 5 for Figure 3 A cross-sectional view along BB of a semiconductor surface heat dissipation structure based on a diamond thin film provided in one embodiment;

[0029] Figure 6 An exploded view of a semiconductor surface heat dissipation structure based on a diamond thin film according to an embodiment of the present invention;

[0030] Figure 7 A schematic diagram of a heat dissipation frame structure for a semiconductor surface heat dissipation structure based on a diamond thin film, provided in an embodiment of the present invention;

[0031] Figure 8 An exploded view of the heat dissipation frame of a semiconductor surface heat dissipation structure based on a diamond thin film provided in an embodiment of the present invention;

[0032] Figure 9 for Figure 7 A top view of a heat dissipation frame for a semiconductor surface heat dissipation structure based on a diamond thin film, provided in one embodiment;

[0033] Figure 10 for Figure 9 A cross-sectional view along CC of a semiconductor surface heat dissipation structure based on a diamond thin film provided in one embodiment.

[0034] Figure 11 This is a schematic diagram of the floating plate, the first collecting tube, and the flow guiding disk of a semiconductor surface heat dissipation structure based on a diamond thin film provided in an embodiment of the present invention.

[0035] in:

[0036] 100. Semiconductor chip; 110. Heat sink base plate;

[0037] 200. Heat dissipation frame; 210. Conical guide block; 211. Guide groove; 220. First collection pipe; 230. Guide plate; 231. Spiral groove; 240. First elastic element; 250. Connecting frame; 260. Second collection pipe; 261. Sealing ring plate; 262. Guide rod; 263. Sliding plate; 270. Partition plate; 280. Connecting plate; 281. Through hole; 282. Sealing ring groove;

[0038] 300. Space; 310. Floating plate; 320. Waterproof and breathable membrane; 330. Elastic telescopic rod; 331. Fixed rod; 332. Second elastic element; 333. Sleeve; 340. Wedge block;

[0039] 400. Thermal fins; 410. Heat dissipation fins. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0041] The component designations used in this document, such as "first" and "second," are merely for distinguishing the described objects and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] The following reference Figures 1-11 This invention describes a semiconductor surface heat dissipation structure based on a diamond thin film.

[0044] A semiconductor surface heat dissipation structure based on a diamond thin film, suitable for heat dissipation of a semiconductor chip 100, includes a heat dissipation base plate 110 for connecting the perimeter of the semiconductor chip 100. A diamond thin film (not shown in the figure) is disposed on the heat dissipation base plate 110. The diamond thin film has extremely high heat dissipation performance, equivalent to five times that of metallic copper. The diamond thin film adheres to the surface of the semiconductor chip 100, thereby absorbing the heat generated by the semiconductor chip 100 and transferring it to other areas. A heat dissipation frame 200 is detachably disposed on the heat dissipation base plate 110. The heat absorbed by the diamond thin film... The heat is transferred to the heat dissipation frame 200, which is hollow and filled with coolant. When the heat absorbed by the diamond film is transferred to the coolant, the coolant absorbs the heat and vaporizes into water vapor. The water vapor moves upward inside the heat dissipation frame 200 and gradually condenses into small water droplets when it encounters cold air, thus flowing back into the coolant. Since the small water droplets fall directly above the coolant and come into contact with the rising water vapor during their fall, heat exchange occurs. As a result, the small water droplets carry some heat when they flow back into the coolant, thus affecting the heat dissipation efficiency of the semiconductor chip 100.

[0045] Based on this, the present invention has a plurality of conical guide blocks 210 fixedly arranged on the upper surface inside the heat dissipation frame 200. The conical guide blocks 210 have conical tips and are arranged downwards. A plurality of first collection tubes 220 are arranged directly below the plurality of conical guide blocks 210. The openings of the plurality of first collection tubes 220 are directly facing the conical tips of the conical guide blocks 210. The plurality of first collection tubes 220 are arranged vertically and the bottom ends of the plurality of first collection tubes 220 extend into the bottom of the coolant. This allows the water vapor formed after the coolant absorbs the heat generated by the semiconductor chip 100 to condense into small water droplets on the conical guide blocks 210. The small water droplets are guided by the conical tips of the conical guide blocks 210 and enter the first collection tubes 220. The small water droplets enter the bottom of the coolant through the first collection tubes 220, thereby preventing the small water droplets from exchanging heat with the rising water vapor during the falling process, thereby reducing the impact on the heat dissipation efficiency of the semiconductor chip 100.

[0046] Meanwhile, to improve the heat dissipation efficiency of the semiconductor chip 100, the present invention provides a flow guide disk 230 axially and elastically sliding at the bottom of the first collection tube 220. The flow guide disk 230 has multiple spiral grooves 231, and its overall structure resembles a frustum of a cone. Figure 11As shown, multiple spiral grooves 231 are formed on the side between the large and small ends of the frustum, and the small end of the guide plate 230 abuts against the bottom of the first collection tube 220. When no external force is applied, the guide plate 230 remains closed to the bottom of the first collection tube 220. When the mass of coolant accumulated inside the first collection tube 220 reaches a preset value, the guide plate 230 will open the bottom of the first collection tube 220, and the coolant will enter the coolant body below through the multiple spiral grooves 231 on the guide plate 230. During the flow process, the coolant will form a spiral rotating flow when flowing in the spiral grooves 231, and finally be injected into the coolant body in the heat dissipation frame 200 in the form of vortex. This vortex effect can disrupt the static stratification of the coolant, avoid uneven heat distribution in local areas of the heat dissipation frame 200 due to long-term stasis of the coolant, and promote the full mixing of coolant in different areas of the heat dissipation frame 200, so that the overall coolant temperature tends to be uniform, thereby improving the continuous heat absorption capacity of the coolant for the semiconductor chip 100.

[0047] Specifically, to ensure that the guide plate 230 opens the bottom of the first collection pipe 220 when the coolant mass inside the first collection pipe 220 reaches a preset value, a first elastic element 240, which is a compression spring, is provided at the bottom of the guide plate 230. The first elastic element 240 pushes the guide plate 230 against the bottom of the first collection pipe 220. When the weight of the coolant inside the first collection pipe 220 exceeds the force of the first elastic element 240, it pushes the guide plate 230 downwards, opening the bottom of the first collection pipe 220 and allowing the coolant inside to drain. To facilitate the axial movement of the guide plate 230, a connecting frame 250 is fixedly installed on the lower end face of the heat dissipation frame 200, directly opposite the guide plate 230. The connecting frame 250 is axially slidably connected to the bottom of the guide plate 230. Figure 10 As shown, the first elastic element 240 is disposed between the bottom of the guide plate 230 and the top of the connecting frame 250.

[0048] In a further embodiment, to improve the local heat dissipation capability of the heat dissipation frame 200 for the semiconductor chip 100, the present invention provides a plurality of evenly distributed floating plates 310 within the heat dissipation frame 200. This embodiment uses four floating plates 310 as an example. The material density of the four floating plates 310 is less than the density of the coolant, thus allowing them to float on the surface of the coolant. The four floating plates 310 are axially fixed to the outer periphery of the first collecting pipe 220. Each of the four floating plates 310 is provided with a waterproof and breathable membrane 320. The waterproof and breathable membrane 320 only allows water vapor to pass through, but not coolant. When the semiconductor chip 100 locally heats up, it can cause localized heat generation near the most severely heated area. The coolant evaporates quickly. Since the waterproof and breathable membrane 320 on the float 310 only allows water vapor to pass through, and the evaporation rate is too fast, the coolant at this position evaporates and surges. Therefore, a large amount of water vapor is discharged upward through the waterproof and breathable membrane 320. At the same time, the coolant below generates an upward evaporation force due to continuous evaporation, which pushes the float 310 at this position to fluctuate upward. In order to improve the local heat dissipation capacity at this position, the present invention provides a second collection pipe 260 in the middle position of the heat dissipation frame 200. The second collection pipe 260 can move in the horizontal direction and is configured to move towards the float 310 with the highest floating height among the multiple floats 310.

[0049] It should be noted that the increased floating height of the float 310 is due to the higher temperature at that location, resulting in a faster evaporation rate of the coolant. The float 310 with the highest floating height indicates the highest temperature at that location. At this time, the second collecting pipe 260 will move towards this location, allowing most of the coolant in the second collecting pipe 260 to enter this location, improving the heat dissipation effect of the coolant on the semiconductor chip 100 and preventing the semiconductor chip 100 from overheating locally. Simultaneously, in this embodiment, the second collecting pipe 260 has the same structure as the first collecting pipe 220, and the bottom of the second collecting pipe 260 is also provided with a guide plate 230 and a first elastic element 240. This allows the coolant accumulated in the second collecting pipe 260 to overcome the force of the first elastic element 240, opening the bottom of the second collecting pipe 260 and allowing the coolant to drain out. However, in this embodiment, the guide plate 230 at the bottom of the second collection pipe 260 can slide on the lower end surface inside the heat dissipation frame 200, and multiple guide rods 262 are vertically and fixedly arranged on the upper end surface of the guide plate 230. The multiple guide rods 262 slide in contact with the inner wall of the second collection pipe 260, thereby preventing the guide plate 230 from detaching from the second collection pipe 260 when the bottom of the second collection pipe 260 is opened. In order to facilitate the synchronous movement of the first elastic member 240 below the second collection pipe 260, a sliding plate 263 is fixedly connected to the lower end of the first elastic member 240, and the sliding plate 263 slides in contact with the upper end surface inside the heat dissipation frame 200.

[0050] It should also be noted that when the height of the float plate 310 increases, it indicates that the semiconductor chip 100 generates a lot of heat. Since the float plate 310 is axially fixed to the first collection pipe 220, when the height of the float plate 310 increases, it will simultaneously drive the first collection pipe 220 to rise. At this time, the guide plate 230 at the bottom of the first collection pipe 220 will also move upward under the action of the first elastic member 240, which reduces the force of the first elastic member 240 on the guide plate 230. As a result, when there is less coolant in the first collection pipe 220, it can overcome the force of the first elastic member 240 and push the guide plate 230. The guide plate 230 opens the bottom of the first collection pipe 220, making it easier to open the bottom of the first collection pipe 220 when the semiconductor chip 100 generates a lot of heat, thereby increasing the frequency of coolant return to adapt to the situation where the semiconductor chip 100 generates a lot of heat.

[0051] Specifically, to enable the second collection pipe 260 to move towards the highest floating plate 310, a partition 270 is fixedly installed in the heat dissipation frame 200 in this embodiment, such as... Figure 8 As shown, there are four partitions 270, which are vertically fixedly installed on the lower end face of the heat dissipation frame 200. A connecting plate 280 is fixedly installed in the middle of the heat dissipation frame 200. The connecting plate 280 is horizontally installed, and its four sides are fixedly connected to the four partitions 270 respectively. A through groove is opened at the bottom of the four partitions 270. The four partitions 270 divide the interior of the heat dissipation frame 200 into four interconnected spaces 300. Four floating plates 310 are located in the four spaces 300 respectively, and the outer periphery of the four floating plates 310 is slidably sealed to the inner sidewall of the four spaces 300. To facilitate the horizontal movement of the second collection pipe 260, as shown... Figure 5 As shown, a through hole 281 is provided at the center of the connecting plate 280. The diameter of the through hole 281 is larger than the diameter of the second collecting pipe 260. The second collecting pipe 260 is located inside the through hole 281 and is horizontally slidably sealed inside the through hole 281. Since the diameter of the through hole 281 is larger than the diameter of the second collecting pipe 260, the second collecting pipe 260 has a margin for horizontal movement. A balancing component is provided on the outer periphery of the second collecting pipe 260. When the heights of the four floats 310 are the same, the balancing component on the outer periphery of the second collecting pipe 260 keeps the second collecting pipe 260 in the middle position of the through hole 281. When the heights of the four floats 310 are not the same, the balancing component on the outer periphery of the second collecting pipe 260 will push the second collecting pipe 260 towards the float 310 with the highest height.

[0052] More specifically, the balancing assembly in this embodiment includes multiple elastic telescopic rods 330. Taking four elastic telescopic rods 330 as an example, one end of each rod is fixedly disposed on the outer periphery of the second collecting pipe 260. The four elastic telescopic rods 330 extend radially along the second collecting pipe 260, and the other end is fixedly connected to a wedge-shaped block 340. Figure 4 As shown, the wedge block 340 has a first inclined surface, and the four float plates 310 have a second inclined surface at one end near the four wedge blocks 340. The first and second inclined surfaces slide against each other, and the four elastic telescopic rods 330 are perpendicular to each other. Figure 3 and Figure 4 As shown, four elastic telescopic rods 330 are respectively arranged along the diagonal of the heat dissipation frame 200. When the four floats 310 are at the same height, the four floats 310 slide against the wedge blocks 340 at one end of the four elastic telescopic rods 330, and abut at the same position on the first inclined surface of the wedge blocks 340. The four elastic telescopic rods 330 are of the same length. If the height of one of the four floats 310 increases, the float 310 slides relative to the abutting wedge block 340, causing the length of the corresponding elastic telescopic rod 330 to change. At the same time, the force exerted by the other three elastic telescopic rods 330 on the second collection pipe 260 changes, thereby pushing the second collection pipe 260 towards the float 310 with the increased height. This allows most of the coolant accumulated in the second collection pipe 260 to enter the location of the float 310, increasing the heat dissipation effect on the semiconductor chip 100 at that location.

[0053] It should be noted that the elastic telescopic rod 330 in this embodiment includes a fixed rod 331 and a sleeve 333. The fixed rod 331 and the sleeve 333 are slidably inserted together. A second elastic element 332 is provided between the fixed rod 331 and the sleeve 333. The second elastic element 332 is also a compression spring. The second elastic element 332 has a tendency to push the fixed rod 331 out of the sleeve 333. One end of the fixed rod 331 is fixedly connected to the outer periphery of the second collecting tube 260, and a wedge block 340 is fixedly connected to one end of the sleeve 333. Figure 4 As shown, the second inclined surface and the first inclined surface slide in contact. When the heights of the four floats 310 are the same, the four second elastic elements 332 exert the same force on the fixed rod 331, which makes the contact position between the wedge block 340 and the float 310 the same. When the heights of the four floats 310 are different, the contact position between the second inclined surface of the float 310 with the wedge is lower. At this time, the second elastic element 332 at this position will extend. When the second elastic element 332 extends, the force decreases, which causes the other three second elastic elements 332 to push the fixed rod 331, thereby causing the second collecting pipe 260 to move a distance toward the float 310 with the highest height until the four second elastic elements 332 are balanced again.

[0054] It should also be noted that, in order to facilitate the horizontal movement of the second collecting pipe 260 within the heat dissipation frame 200, a sealing ring groove 282 is coaxially provided on the side wall of the through hole 281 of the connecting plate 280. At the same time, a sealing ring plate 261 is coaxially and fixedly provided on the outer periphery of the second collecting pipe 260. The sealing ring plate 261 is slidably disposed within the sealing ring groove 282. Furthermore, the plane on the connecting plate 280 where the sealing ring groove 282 is located is below the liquid surface of the coolant in the four spaces 300, thereby separating the liquid surfaces of the four spaces 300 from those of the connecting plate 280 and the partition plate 270. When the semiconductor chip 100 locally heats up, the liquid surface height of the coolant in the four spaces 300 is different due to the different evaporation rates of the coolant. If the liquid surfaces in the four spaces 300 are connected, the liquid surface height will be the same, making it impossible for the second collecting pipe 260 to move horizontally. Furthermore, the connecting plate 280 in this embodiment is relatively thick, so that its four outer walls act as the side walls of the four spaces 300. The floating plate 310 in this embodiment has a special shape, such as... Figure 11 As shown, it is a rectangle with a right angle cut off to accommodate four spaces 300 and a connecting plate 280.

[0055] In a further embodiment, as small water droplets roll along the conical surface of the conical guide block 210 towards the conical tip, they are easily detached from the conical surface and fall directly onto the float plate 310 due to airflow disturbances or their own mass. This prevents the small water droplets from participating in the coolant circulation, wasting condensate resources and affecting subsequent heat absorption efficiency due to water accumulation on the surface of the float plate 310. To reduce the frequency of this phenomenon and improve the flow guiding effect of the conical guide block 210, the present invention provides multiple flow guiding grooves 211 along the generatrix direction on the conical surface of the outer periphery of the conical guide block 210. The flow guiding grooves 211 have a V-shaped or U-shaped cross-section, and the width of the groove opening needs to be similar to the average size of the condensed water droplets to avoid the groove opening size being too large or too small, which would affect the flow guiding effect. One end of the multiple guide channels 211 is located on the large end of the conical guide block 210, and the other end of the multiple guide channels 211 converges at the conical tip of the conical guide block 210. At the same time, the inner wall of the multiple guide channels 211 is coated with a hydrophilic material. The guide channels 211 can adsorb small water droplets adsorbed on the conical surface of the conical guide block 210 into the guide channels 211. The small water droplets move along the guide channels 211 under the action of gravity, thereby preventing the small water droplets on the conical surface from falling directly onto the float plate 310 after detaching.

[0056] In a further embodiment, to improve the condensation efficiency of water vapor, such as Figure 5 and Figure 10As shown, multiple heat-conducting ribs 400 are provided in the area corresponding to the conical guide block 210 on the outer upper surface of the heat dissipation frame 200. The heat-conducting ribs 400 correspond to the guide groove 211, thereby improving the condensation efficiency of water vapor when it comes into contact with the guide groove 211.

[0057] Specifically, multiple heat dissipation fins 410 are provided on the upper outer surface of the heat dissipation frame 200. The heat dissipation fins 410 can increase the heat dissipation efficiency of the upper outer surface of the heat dissipation frame 200, thereby improving the overall heat dissipation efficiency of the heat dissipation frame 200 for the semiconductor chip 100.

[0058] The specific working process of a semiconductor surface heat dissipation structure based on diamond thin film provided by the present invention will be described in conjunction with the above embodiments:

[0059] Normal heat dissipation:

[0060] When the semiconductor chip 100 is working normally, the semiconductor chip 100 heats up uniformly. The diamond film (not shown in the figure) in contact with the semiconductor chip 100 can quickly transfer the heat generated by the semiconductor chip 100 to the heat dissipation frame 200. The coolant filled in the four spaces 300 inside the heat dissipation frame 200 absorbs heat and evaporates. The floating plates 310 in the four spaces 300 are at similar heights. At this time, the four elastic telescopic rods 330 on the outer periphery of the second collection tube 260 in the middle of the heat dissipation frame 200 are balanced by forces, so that the second collection tube 260 is located in the middle position. After the coolant vaporizes into water vapor, it moves upward within the heat dissipation frame 200 and passes through the waterproof and breathable membrane 320 on the float plate 310. When the water vapor comes into contact with the conical guide block 210 on the upper surface of the heat dissipation frame 200, it condenses into small water droplets. The small water droplets adhere to the conical surface of the conical guide block 210. As the small water droplets roll, they are absorbed by the guide groove 211 and roll along the guide groove 211. Finally, they enter the first collection pipe 220 or the second collection pipe 260 from the conical tip of the conical guide block 210. This prevents the evaporated water vapor from exchanging heat with the condensed water droplets when it rises, thereby avoiding affecting the heat dissipation effect of the coolant on the semiconductor chip 100.

[0061] When the weight of the coolant accumulated in the first collection pipe 220 or the second collection pipe 260 is greater than the elastic force of the first elastic element 240, the bottom of the first collection pipe 220 and the second collection pipe 260 can be opened, and the accumulated coolant enters the coolant body from the spiral groove 231 of the guide plate 230, thereby mixing evenly with the coolant body.

[0062] Enhanced local heat dissipation capacity:

[0063] When the semiconductor chip 100 experiences localized heating, for example, if one corner of the semiconductor chip 100 becomes severely heated, the rate at which the coolant inside the corresponding space 300 vaporizes into water vapor increases. This causes the coolant inside the space 300 to swirl and surge, resulting in the float 310 within the space 300 rising in height due to the surging coolant. At this time, the position of the wedge block 340 on one of the four elastic telescopic rods 330 on the outer periphery of the second collecting pipe 260 corresponding to the space 300 changes its contact with the float 310. As the float 310 moves upward, the corresponding elastic telescopic rod 330 extends. Simultaneously, the other three elastic telescopic rods 330 push the second collecting pipe 260 a certain distance closer to the space 300. Most of the coolant discharged from the second collecting pipe 260 mixes with the coolant inside the space 300, thereby improving the heat dissipation efficiency of the coolant inside the space 300 for the semiconductor chip 100.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A semiconductor surface heat dissipation structure based on diamond thin film, characterized in that, include: A heat dissipation base plate is connected to the periphery of the semiconductor chip, and a diamond film is disposed on the heat dissipation base plate and the diamond film is attached to the surface of the semiconductor chip; A heat dissipation frame is detachably connected to the heat dissipation base plate. The heat dissipation frame is hollow and filled with coolant. Multiple conical guide blocks are fixedly arranged on the upper surface of the heat dissipation frame, with the tips of the conical guide blocks facing downwards. Multiple first collection pipes, the openings of which are located directly below multiple conical guide blocks, the multiple first collection pipes are arranged vertically, and the lower ends of the multiple first collection pipes extend into the bottom of the coolant; A guide plate is axially elastically slidably disposed at the lower end of a first collection pipe. The guide plate is provided with multiple spiral grooves. The guide plate is configured to open the lower end of the first collection pipe when the mass of coolant on the guide plate reaches a preset value. The bottom of the guide plate is provided with a first elastic element, which pushes the guide plate against the lower end of the first collection tube. The heat dissipation frame is provided with multiple evenly distributed floating plates, which are axially fixedly connected to the first collection pipe. A waterproof and breathable membrane is provided on the multiple floating plates. A second collection pipe is provided in the middle of the heat dissipation frame. The second collection pipe can move in the horizontal direction and is configured to move toward the floating plate with the highest floating height.

2. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 1, characterized in that, A through hole is provided in the middle of the heat dissipation frame. The diameter of the through hole is larger than the diameter of the second collection tube. The outer periphery of the second collection tube is horizontally slidably sealed within the through hole. A balancing component is provided on the outer periphery of the second collection tube. The balancing component is used to drive the second collection tube to move in the horizontal direction.

3. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 2, characterized in that, The balancing assembly includes multiple elastic telescopic rods. One end of each elastic telescopic rod is fixedly connected to the outer periphery of the second collecting pipe and extends radially along the second collecting pipe. The other end of each elastic telescopic rod is provided with a wedge block. The wedge block has a first inclined surface, and the end of the float plate near the wedge block has a second inclined surface. The first inclined surface and the second inclined surface slide against each other.

4. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 3, characterized in that, The elastic telescopic rod includes a fixed rod and a sleeve. The fixed rod is slidably inserted into the sleeve. A second elastic element is provided between the fixed rod and the sleeve. The second elastic element is used to push the fixed rod out of the sleeve.

5. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 2, characterized in that, A sealing ring groove is coaxially formed on the side wall of the through hole, and a sealing ring plate is coaxially and fixedly provided on the outer periphery of the second collecting tube. The sealing ring plate is slidably and sealingly disposed in the sealing ring groove.

6. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 1, characterized in that, The tapered guide block has multiple guide grooves on its tapered surface along the generatrix direction. One end of each guide groove is located at the large end of the tapered guide block, and the other ends of the guide grooves converge at the tapered tip of the tapered guide block.

7. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 6, characterized in that, A heat-conducting rib is provided on the upper outer surface of the heat dissipation frame in the area corresponding to the conical guide block, and the heat-conducting rib corresponds to the guide groove.

8. The semiconductor surface heat dissipation structure based on diamond thin film according to claim 1, characterized in that, Multiple heat dissipation fins are vertically fixed on the upper outer surface of the heat dissipation frame.

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