Auxiliary welding device for chip packaging

By designing a chip packaging auxiliary welding device, the problem of welding position displacement caused by welding gun wobbling is solved by using the cooperation of driving components and spring electric push rods, thus realizing high-precision welding and efficient chip packaging.

CN121156618APending Publication Date: 2025-12-19江苏润鹏半导体有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202511281904.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2025-12-19

AI Technical Summary

Technical Problem

In existing technologies, the shaking of the soldering gun during chip packaging can cause the soldering position to shift, affecting the soldering effect and easily leading to missed soldering.

Method used

A chip packaging auxiliary welding device is adopted. The support plate and the turntable are driven by the driving component to move the chip under the welding gun. The welding gun is ensured to be welded in a stationary state by the cooperation of the spring and the electric push rod, so as to avoid shaking.

Benefits of technology

It effectively prevents the soldering gun from shifting from the chip soldering point, improves soldering accuracy, avoids missing solder joints, and facilitates four-sided soldering of the chip, saving adjustment time and improving soldering efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121156618A_ABST
    Figure CN121156618A_ABST
Patent Text Reader

Abstract

The invention discloses a chip packaging auxiliary welding device which comprises an operation table, supporting legs are vertically fixed to the four corners of the bottom face of the operation table respectively, a supporting plate is longitudinally and slidably connected to the top face of the operation table, a driving piece is arranged on the bottom face of the supporting plate and arranged on the top face of the supporting plate, and a base is transversely and slidably connected to the top face of the supporting plate. The top face of the base is rotationally connected with a rotary table, a centering piece is arranged on the top face of the rotary table, the top face of the base is connected with a pressing plate in a lifting mode, the pressing plate is located above the centering piece, and a welding piece is arranged on the top face of the operation table and located above the centering piece. According to the chip welding and packaging device, returning is carried out, meanwhile, the welding gun carries out welding and packaging on the chip on the top face of the movable base, welding and packaging are carried out by moving the chip, the welding gun is made to be in a static state, and the situation that when the chip is welded and packaged by moving the welding gun, the welding gun shakes, and the welding efficiency is improved is avoided. Therefore, the welding gun of the welding gun and the welding point of the chip are prevented from deviating, and the problem of missing welding at the welding position of the chip is avoided.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a chip packaging auxiliary welding device. Background Technology

[0002] A chip, also known as a microcircuit, microchip, or integrated circuit, refers to a silicon wafer containing integrated circuits. It is very small and often part of a computer or other electronic device. Before installation and use, chips need to be packaged for protection. Chip packaging technology is a process that encapsulates memory chips to prevent them from contacting the outside world and causing damage. Impurities and harmful gases in the air, even water vapor, can corrode the delicate circuitry on the chip, leading to a decline in electrical performance. Different packaging technologies vary greatly in manufacturing processes and procedures, and the packaging process plays a crucial role in ensuring the optimal performance of the memory chip.

[0003] Because of the small size of the chip, in order to facilitate chip packaging and soldering, the chip is fixed on the soldering station by a clamp, and then the soldering head of the soldering gun is fixed on a movable bracket. The soldering gun on the bracket is moved by the drive unit to package and solder the chip. However, when the drive unit starts the bracket to move, the bracket will shake, which will also cause the soldering gun to shake. This will cause the soldering position between the soldering gun and the chip to deviate, which can easily lead to missed soldering and affect the soldering effect of chip packaging. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip packaging auxiliary welding device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip packaging auxiliary welding device, comprising an operating table, with a support leg vertically fixed at each of the four corners of the bottom surface of the operating table, a support plate longitudinally slidably connected to the top surface of the operating table, a driving component provided on the bottom surface of the support plate, the driving component being disposed on the top surface of the support plate, a base slidably connected to the top surface of the support plate, a turntable rotatably connected to the top surface of the base, a centering component provided on the top surface of the turntable, a pressure plate being vertically connected to the top surface of the base, the pressure plate being located above the centering component, and a welding component provided on the top surface of the operating table, the welding component being located above the centering component.

[0006] As a further description of the above technical solution: the centering component includes four fixed blocks arranged in an equidistant ring array on the top surface of the turntable, and a clamping block is telescopically connected to the inner side of each fixed block. The top surface of the turntable is provided with a top material component.

[0007] As a further description of the above technical solution: the welding component includes a first cylinder vertically fixed to the top surface of the operating table, a lifting block is fixedly connected to the end of the piston rod of the first cylinder, an installation block is provided at the end of the lifting block, a through hole is provided on the top surface of the installation block, and a welding torch is sleeved in the through hole.

[0008] As a further description of the above technical solution: a guide plate is slidably connected to one side of the top surface of the operating table, the guide plate is fixedly connected to the side of the support plate, a first electric push rod is fixedly connected to the top surface of the guide plate, the movable end of the first electric push rod is in contact with the side of the base, two first sliding grooves are symmetrically provided on the bottom surface of the base, a first slider is slidably connected in each first sliding groove, the two first sliders are symmetrically fixed to the top surface of the support plate, and a first spring is fixed between the inner wall of each first sliding groove and the first slider.

[0009] As a further description of the above technical solution: the driving component includes a guide block fixed to the bottom surface of the support plate, a guide groove is provided on the top surface of the operating table, the guide block is slidably connected in the guide groove, a support block is fixedly connected to each side of the guide block, a guide rod is slidably sleeved inside each of the two support blocks, the two guide rods are symmetrically fixed in the guide groove, a screw is threaded through the inside of the guide block, one end of the screw is rotatably connected to the inner wall of one side of the guide groove, and the other end rotatably passes through the guide groove, a first drive motor is horizontally fixed to the front side of the operating table, the output end of the first drive motor is drivenly connected to the end of the screw, an L-shaped support rod is fixedly connected to the top surface of the operating table, and a first pressure sensor is fixedly connected to the end of the L-shaped support rod.

[0010] As a further description of the above technical solution: the inner side of the fixing block is provided with a horizontal storage groove, and two third sliding grooves are symmetrically provided in the storage groove. A fourth slider is slidably connected in each of the third sliding grooves. A connecting rod is fixed between the two fourth sliders. The connecting rod is slidably sleeved in the storage groove. A second spring is fixed between the inner wall of the storage groove and the connecting rod.

[0011] As a further description of the above technical solution: the top material component includes a third cylinder embedded in the center of the top surface of the turntable, the end of the piston rod of the third cylinder is fixedly connected to a push plate, the top surface of the base is embedded with a second drive motor, the output end of the second drive motor is connected to a rotating shaft, the end of the rotating shaft is fixedly connected to the bottom surface of the turntable, the bottom surface of the pressure plate is symmetrically fixed with two second cylinders, and the two second cylinders are symmetrically fixed on the top surface of the base.

[0012] As a further description of the above technical solution: a second electric push rod is horizontally embedded at the end of the lifting block, the mounting block is fixedly connected to the movable end of the second electric push rod, and a sleeve is fixedly sleeved on the outer edge of the welding gun, the sleeve being slidably connected in the through hole.

[0013] As a further description of the above technical solution: the inner wall of the through hole is symmetrically provided with two second sliding grooves, and a second slider is slidably connected in each second sliding groove. The two second sliders are symmetrically fixed to the outer edge of the sleeve. A second pressure sensor is fixed on the top surface of each of the two second sliders. An elastic limiting member is provided in each of the two second sliding grooves. The elastic limiting member is provided on the top wall of the second sliding groove and is located above the second pressure sensor.

[0014] As a further description of the above technical solution: the elastic limiting member includes a third spring that is vertically fixed in the second slide groove, the end of the third spring is fixedly connected to a third slider, and the third slider is slidably connected in the second slide groove.

[0015] The present invention has the following beneficial effects:

[0016] 1. Compared with existing technologies, this chip packaging auxiliary welding device clamps the chip to be welded and packaged in a centering component on the top surface of a turntable. A drive unit drives a support plate to move longitudinally, moving the chip on the turntable below the welding torch. A first electric push rod pushes a base to move laterally, causing the chip on the turntable to move as well. This ensures the starting point of the chip welding joint is below the welding torch. Simultaneously, a first spring is compressed, then the first electric push rod returns to its original position, and the compressed first spring resets. When the first spring resets, it moves the base back to its original position. At the same time, the welding torch welds and packages the chip on the moving top surface of the base. By moving the chip to perform welding and packaging, the welding torch remains stationary, preventing the torch from shaking during welding and packaging. This prevents the welding point between the torch and the chip from shifting, thus avoiding incomplete soldering at the chip's weld joint.

[0017] 2. Compared with the existing technology, the chip packaging auxiliary welding device, the centering component and the pressure plate play a role in clamping and fixing the chip during the welding and packaging process, preventing the chip from shifting on the top surface of the turntable during the moving welding process.

[0018] 3. Compared with existing technologies, this chip packaging auxiliary welding device rotatably connects the turntable to the top surface of the base, which facilitates the welding and packaging of the chip on all four sides. It eliminates the need to remove the chip from the turntable, adjust its position, and re-clamp it, thereby saving time spent on readjusting the chip's position and improving the chip welding efficiency. Attached Figure Description

[0019] Figure 1 This is a three-dimensional view of the overall structure of a chip packaging auxiliary welding device proposed in this invention;

[0020] Figure 2 This is a main sectional view of the overall structure of a chip packaging auxiliary welding device proposed in this invention;

[0021] Figure 3 This is a perspective view of the overall structure of the turntable of the chip packaging auxiliary welding device proposed in this invention;

[0022] Figure 4 This is a main sectional view of the overall structure of the turntable of the chip packaging auxiliary welding device proposed in this invention;

[0023] Figure 5 This invention provides a chip packaging auxiliary welding device. Figure 1 Enlarged view of the structure at point A in the middle;

[0024] Figure 6 This invention provides a chip packaging auxiliary welding device. Figure 1 Enlarged view of the structure at point B;

[0025] Figure 7 This is a side sectional view of the connection between the lifting block and the mounting block of a chip packaging auxiliary welding device proposed in this invention;

[0026] Figure 8 This is a side sectional view of the connection between the sleeve and the mounting block of a chip packaging auxiliary welding device proposed in this invention.

[0027] Legend:

[0028] 1. Operating platform; 2. Support leg; 3. First drive motor; 4. Support plate; 5. Base; 6. First electric push rod; 7. L-shaped support rod; 8. First cylinder; 9. Lifting block; 10. Pressure plate; 11. Second cylinder; 12. Turntable; 13. First slider; 14. First spring; 15. Guide groove; 16. Guide block; 17. Support block; 18. First slide groove; 19. Second drive motor; 20. Fixing block; 21. Connecting rod; 22. Clamping block; 23. Push plate; 24. Third cylinder; 25. Storage groove; 26. Second spring; 27. First pressure sensor; 28. Welding torch; 29. ​​Sleeve; 30. Through hole; 31. Mounting block; 32. Second electric push rod; 33. Second slide groove; 34. Second slider; 35. Second pressure sensor; 36. Third slider; 37. Third spring. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Reference Figures 1 to 8 This invention provides a chip packaging auxiliary welding device, comprising an operating table 1, with a support leg 2 vertically fixed at each of the four corners of the bottom surface of the operating table 1, a support plate 4 longitudinally slidably connected to the top surface of the operating table 1, a driving component provided on the bottom surface of the support plate 4, the driving component being disposed on the top surface of the support plate 4, a base 5 slidably connected to the top surface of the support plate 4, a guide plate slidably connected to one side of the top surface of the operating table 1, the guide plate being fixedly connected to the side surface of the support plate 4, and a first electric push rod 6 fixedly connected to the top surface of the guide plate, the movable end of the first electric push rod 6 being in contact with the side surface of the base 5. The bottom surface of the base 5 is symmetrically provided with two first sliding grooves 18, and a first slider 13 is slidably connected in each first sliding groove 18. The two first sliders 13 are symmetrically fixed on the top surface of the support plate 4. A first spring 14 is fixed between the inner wall of each first sliding groove 18 and the first slider 13. The top surface of the base 5 is rotatably connected to a turntable 12. The top surface of the turntable 12 is provided with a centering component. The top surface of the base 5 is lifted and connected to a pressure plate 10. The pressure plate 10 is located above the centering component. The top surface of the operating table 1 is provided with a welded component. The welded component is located above the centering component.

[0031] The centering component includes four fixed blocks 20 arranged in an equidistant ring on the top surface of the turntable 12. Each fixed block 20 has a clamping block 22 telescopically connected to its inner side. The inner side of the fixed block 20 is provided with a horizontal storage groove 25. Two third sliding grooves are symmetrically arranged in the storage groove 25. A fourth slider is slidably connected in each third sliding groove. A connecting rod 21 is fixed between the two fourth sliders. The connecting rod 21 is slidably sleeved in the storage groove 25. A second spring 26 is fixed between the inner wall of the storage groove 25 and the connecting rod 21. The top surface of the turntable 12 is provided with a top material component.

[0032] The top material component includes a third cylinder 24 embedded in the center of the top surface of the turntable 12. The end of the piston rod of the third cylinder 24 is fixedly connected to a push plate 23. A second drive motor 19 is embedded in the top surface of the base 5. The output end of the second drive motor 19 is connected to a rotating shaft. The end of the rotating shaft is fixedly connected to the bottom surface of the turntable 12. Two second cylinders 11 are symmetrically fixed on the bottom surface of the pressure plate 10. The two second cylinders 11 are symmetrically fixed on the top surface of the base 5.

[0033] The welding component includes a first cylinder 8 vertically fixed to the top surface of the operating table 1. A lifting block 9 is fixedly connected to the end of the piston rod of the first cylinder 8. A mounting block 31 is provided at the end of the lifting block 9. A through hole 30 is provided on the top surface of the mounting block 31. A welding torch 28 is fitted inside the through hole 30. A second electric push rod 32 is horizontally embedded at the end of the lifting block 9. The mounting block 31 is fixedly connected to the movable end of the second electric push rod 32. A sleeve 29 is fixedly fitted onto the outer edge of the welding torch. The sleeve 29 is slidably connected within the through hole 30. Two second sliding grooves 33 are symmetrically provided on the inner wall of the through hole 30. Each second sliding groove 33... Two second sliders 34 are slidably connected to each other inside the sleeve 29. The two second sliders 34 are symmetrically fixed to the outer edge of the sleeve 29. A second pressure sensor 35 is fixed to the top surface of each of the two second sliders 34. An elastic limiting member is provided in each of the two second slide grooves 33. The elastic limiting member is located on the top wall of the second slide groove 33 and above the second pressure sensor 35. The elastic limiting member includes a third spring 37 vertically fixed in the second slide groove 33. The end of the third spring 37 is fixedly connected to a third slider 36. The third slider 36 is slidably connected in the second slide groove 33.

[0034] The driving component includes a guide block 16 fixed to the bottom surface of the support plate 4. The top surface of the operating table 1 is provided with a guide groove 15. The guide block 16 is slidably connected in the guide groove 15. A support block 17 is fixedly connected to each side of the guide block 16. A guide rod is slidably fitted inside each of the two support blocks 17. The two guide rods are symmetrically fixed in the guide groove 15. A screw is threaded through the inside of the guide block 16. One end of the screw is rotatably connected to the inner wall of one side of the guide groove 15, and the other end rotatably passes through the guide groove 15. A first drive motor 3 is horizontally fixed to the front side of the operating table 1. The output end of the first drive motor 3 is connected to the end of the screw. An L-shaped support rod 7 is fixedly connected to the top surface of the operating table 1. A first pressure sensor 27 is fixedly connected to the end of the L-shaped support rod 7.

[0035] The chip to be soldered and packaged is clamped in the centering component on the top surface of the turntable 12. A drive unit drives the support plate 4 to move longitudinally, moving the chip on the turntable 12 below the soldering torch 28. The first electric push rod 6 pushes the base 5 to move laterally, causing the chip on the turntable 12 to move, so that the starting point of the chip soldering point is below the soldering torch 28. Simultaneously, the first spring 14 is compressed, then the first electric push rod 6 returns to its original position, and the compressed first spring 14 resets. When the first spring 14 resets, it moves the base 5 back to its original position. At the same time, the soldering torch 28 solders and packages the chip on the moving top surface of the base 5. By moving the chip, the soldering and packaging process is achieved, allowing the soldering torch 28 to... The 8 is stationary, preventing the soldering gun 28 from shaking during chip soldering and encapsulation. This prevents the soldering point between the soldering gun 28 and the chip from shifting, thus avoiding incomplete soldering. The centering component and pressure plate 10 clamp and fix the chip during soldering and encapsulation, preventing the chip from shifting on the top surface of the turntable 12 during moving soldering. The turntable 12 is rotatably connected to the top surface of the base 5, facilitating soldering and encapsulation of the chip on all four sides. There is no need to remove the chip from the turntable 12, adjust its position, and re-clamp it, thus saving time spent on readjusting the chip's position and improving the chip soldering efficiency.

[0036] Working principle: In use, the chip to be soldered is first clamped between four clamping blocks 22. These four clamping blocks 22, via a second spring 26 and a connecting rod 21, retract when the chip is clamped on the top surface of the turntable 12, thus holding the chip around its perimeter. This allows the turntable 12 to clamp chips of different sizes. Next, the second cylinder 11 drives the pressure plate 10 to descend, pressing it against the top surface of the chip to fix it. Then, the first drive motor 3 drives the screw to rotate, causing the guide block 16 to slide longitudinally within the guide groove 15. The guide block 16 causes the support plate 4 to move longitudinally on the top surface of the operating table 1. The support plate 4 then moves the base 5 towards the first pressure sensor 27, causing the chip... One side of the chip contacts the first pressure sensor 27. When the first pressure sensor 27 detects pressure, the first drive motor 3 stops. Then, the first electric push rod 6 drives the base 5 to move laterally. The base 5 drives the chip on the turntable 12 to move. At the same time, the first spring 14 in the first slide groove 18 is compressed, so that the chip on the top surface of the turntable 12 moves below the welding torch 28. Then, the second electric push rod 32 drives the support block 17 to move longitudinally. The support block 17 drives the welding torch 28 to move longitudinally, so that the center of the welding torch 28 is located at the starting point directly above the chip welding point. Then, the welding wire is laid on the chip welding point. Then, the first cylinder 8 drives the lifting block 9 to descend. The lifting block 9 drives the mounting block 31 to descend. The mounting block 31... The welding torch 28 is lowered, causing it to fit against the outer edge of the welding starting point. The second slider 34 outside the sleeve 29 slides within the second groove 33, causing the lifting block 9 to continue moving downwards until the second pressure sensor 35 on the top surface of the second slider 34 fits against the bottom surface of the third slider 36. This ensures that the end of the welding torch 28 is firmly attached to the welding wire. Simultaneously, the elastic force of the third spring 37 prevents excessive force from contacting the chip with the end of the welding torch 28, which could damage the chip. This improves the fit between the welding torch 28 and the welding wire without damaging the chip. Then, the first electric push rod 6 returns to its original position, and the compressed first spring 14 resets. When the first spring 14 resets, it drives the base 5 to return to its original position. At the same time, the welding torch 28 presses against the top surface of the moving base 5. During chip soldering and packaging, once one side of the chip is soldered, the first cylinder 8 raises the lifting block 9, causing the soldering gun 28 to rise. Then, the second cylinder 11 raises the pressure plate 10, separating it from the chip. Next, the first drive motor 3 drives the screw to rotate in the opposite direction, causing the guide block 16 to move in the opposite direction. The guide block 16 then moves the base 5 on the support plate 4 in the opposite direction, separating the chip on the top surface of the turntable 12 from the first pressure sensor 27. Then, the second drive motor 19 rotates the shaft, causing the turntable 12 to rotate, bringing the second soldering point on the chip below the soldering gun 28. Finally, the second cylinder 11 lowers the pressure plate 10, pressing it back onto the top surface of the chip.Then, the first drive motor 3 drives the turntable 12 to move in the direction of the first pressure sensor 27 via a screw, so that the second side of the chip is in contact with the first pressure sensor 27. Then, the first electric push rod 6 drives the base 5 to move laterally, and the base 5 drives the chip on the turntable 12 to move. At the same time, the first spring 14 in the first slide groove 18 is compressed, so that the chip on the top surface of the turntable 12 moves below the welding torch 28. Then, the second electric push rod 32 drives the support block 17 to move longitudinally, and the support block 17 drives the welding torch 28 to move longitudinally, so that the center of the welding torch 28 is located at the starting point directly above the chip welding point. Then, the welding wire is laid on the chip welding point. Then, the first cylinder 8 drives the lifting block 9 to descend, the lifting block 9 drives the mounting block 31 to descend, and the mounting block 31 drives the welding torch 28 to descend, so that the welding torch 28 is in contact with the outer edge of the welding starting point. The second slider 34 outside the sleeve 29 slides in the second slide groove 33, so that the lifting block 9 continues to move downward until the second pressure sensor 35 on the top surface of the second slider 34 and the third slider 36 are in contact. The bottom surfaces are aligned, ensuring a firm fit between the welding torch 28 and the welding wire. Then, the first electric push rod 6 returns to its original position, and the compressed first spring 14 resets. As the first spring 14 resets, it moves the base 5 back to its original position. Simultaneously, the welding torch 28 welds and encapsulates the chip on the top surface of the moving base 5. This process is repeated until all four welding points on the chip are welded. Then, the first cylinder 8 raises the lifting block 9, causing the welding torch 28 to rise. Next, the second cylinder 11 raises the pressure plate 10, separating it from the chip. Then, the first drive motor 3 drives the screw to rotate in the opposite direction. The screw drives the guide block 16 to move in the opposite direction, and the guide block 16 drives the base 5 on the support plate 4 to move in the opposite direction. This separates the chip on the top surface of the turntable 12 from the first pressure sensor 27. Next, the third cylinder 24 drives the push plate 23 to rise. The push plate 23 pushes the chip that has been soldered and packaged on the turntable 12 upwards, separating the chip from the four clamping blocks 22. This completes the unloading of the soldered and packaged chip, preventing the chip from getting stuck between the four clamping blocks 22 and making it difficult to remove.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip packaging auxiliary welding device, comprising an operating table (1), wherein a support leg (2) is vertically fixed at each of the four corners of the bottom surface of the operating table (1), characterized in that: The top surface of the operating table (1) is longitudinally slidably connected to a support plate (4). The bottom surface of the support plate (4) is provided with a driving component. The driving component is located on the top surface of the support plate (4). The top surface of the support plate (4) is laterally slidably connected to a base (5). The top surface of the base (5) is rotatably connected to a turntable (12). The top surface of the turntable (12) is provided with a centering component. The top surface of the base (5) is vertically connected to a pressure plate (10). The pressure plate (10) is located above the centering component. The top surface of the operating table (1) is provided with a welding component. The welding component is located above the centering component.

2. The chip packaging auxiliary welding device according to claim 1, characterized in that: The centering component includes four equidistant ring arrays of fixed blocks (20) distributed on the top surface of the turntable (12). Each fixed block (20) has a clamping block (22) telescopically connected to its inner side. The top surface of the turntable (12) is provided with a top material component.

3. The chip packaging auxiliary welding device according to claim 1, characterized in that: The welding component includes a first cylinder (8) vertically fixed to the top surface of the operating table (1). The end of the piston rod of the first cylinder (8) is fixedly connected to a lifting block (9). The end of the lifting block (9) is provided with a mounting block (31). The top surface of the mounting block (31) is provided with a through hole (30). A welding torch (28) is sleeved in the through hole (30).

4. The chip packaging auxiliary welding device according to claim 1, characterized in that: A guide plate is slidably connected to one side of the top surface of the operating table (1). The guide plate is fixedly connected to the side of the support plate (4). A first electric push rod (6) is fixedly connected to the top surface of the guide plate. The movable end of the first electric push rod (6) is in contact with the side of the base (5). Two first sliding grooves (18) are symmetrically provided on the bottom surface of the base (5). A first slider (13) is slidably connected in each first sliding groove (18). The two first sliders (13) are symmetrically fixed to the top surface of the support plate (4). A first spring (14) is fixed between the inner wall of each first sliding groove (18) and the first slider (13).

5. The chip packaging auxiliary welding device according to claim 1, characterized in that: The driving component includes a guide block (16) fixed to the bottom surface of the support plate (4). The top surface of the operating table (1) is provided with a guide groove (15). The guide block (16) is slidably connected in the guide groove (15). A support block (17) is fixedly connected to each side of the guide block (16). A guide rod is slidably sleeved inside each of the two support blocks (17). The two guide rods are symmetrically fixed in the guide groove (15). A screw is threaded through the inside of the guide block (16). One end of the screw is rotatably connected to the inner wall of one side of the guide groove (15), and the other end rotatably passes through the guide groove (15). A first drive motor (3) is horizontally fixed to the front side of the operating table (1). The output end of the first drive motor (3) is connected to the end of the screw. An L-shaped support rod (7) is fixedly connected to the top surface of the operating table (1). A first pressure sensor (27) is fixedly connected to the end of the L-shaped support rod (7).

6. The chip packaging auxiliary welding device according to claim 2, characterized in that: The inner side of the fixing block (20) is provided with a horizontal storage groove (25). Two third sliding grooves are symmetrically provided in the storage groove (25). A fourth slider is slidably connected in each of the third sliding grooves. A connecting rod (21) is fixed between the two fourth sliders. The connecting rod (21) is slidably sleeved in the storage groove (25). A second spring (26) is fixed between the inner wall of the storage groove (25) and the connecting rod (21).

7. The chip packaging auxiliary welding device according to claim 2, characterized in that: The top material component includes a third cylinder (24) embedded in the center of the top surface of the turntable (12). The end of the piston rod of the third cylinder (24) is fixedly connected to a push plate (23). The top surface of the base (5) is embedded with a second drive motor (19). The output end of the second drive motor (19) is connected to a rotating shaft. The end of the rotating shaft is fixedly connected to the bottom surface of the turntable (12). The bottom surface of the pressure plate (10) is symmetrically fixed with two second cylinders (11). The two second cylinders (11) are symmetrically fixed to the top surface of the base (5).

8. The chip packaging auxiliary welding device according to claim 3, characterized in that: The end of the lifting block (9) is horizontally embedded with a second electric push rod (32). The mounting block (31) is fixedly connected to the movable end of the second electric push rod (32). The outer edge of the welding gun is fixedly fitted with a sleeve (29), and the sleeve (29) is slidably connected in the through hole (30).

9. The chip packaging auxiliary welding device according to claim 8, characterized in that: The inner wall of the through hole (30) is symmetrically provided with two second sliding grooves (33), and a second slider (34) is slidably connected in each second sliding groove (33). The two second sliders (34) are symmetrically fixed to the outer edge of the sleeve (29). A second pressure sensor (35) is fixed on the top surface of each of the two second sliders (34). An elastic limiting member is provided in each of the two second sliding grooves (33). The elastic limiting member is provided on the top wall of the second sliding groove (33) and is located above the second pressure sensor (35).

10. The chip packaging auxiliary welding device according to claim 9, characterized in that: The elastic limiting member includes a third spring (37) that is vertically fixed in the second slide groove (33), and the end of the third spring (37) is fixedly connected to a third slider (36), which is slidably connected in the second slide groove (33).