Honing oilstone with orderly-arranged abrasive particles and manufacturing method of honing oilstone

Abstract

The invention provides a honing oilstone with abrasive particles arranged in order and a manufacturing method of the honing oilstone, and belongs to the technical field of oilstones. Alloy powder, ceramic powder, silicon / tungsten plated diamond, polycrystalline cubic boron nitride and ethyl alcohol are mixed, ball-milled, ultrasonically dispersed uniformly and subjected to hot pressed sintering, a matrix is prepared, and the honing oilstone with abrasive particles arranged in order is prepared through the processes of pretreatment, surface activation, electro-deposition and aftertreatment. The fine honing oilstone is mainly used for machining precise, complex and high-hardness metal workpieces such as automobile engine cylinder bodies, hydraulic oil cylinders and bearing rings, the imported fine honing oilstone is replaced in the oil pump oil nozzle industry for the first time, and localization replacement of the fine honing oilstone is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of oil stone, and particularly relates to a kind of abrasive grain ordered arrangement honing oil stone and its manufacturing method. BACKGROUND

[0002] Honing is a basic precision cutting process, and its technical level is directly related to the upper limit of the performance of high-end equipment. Honing is mainly used for the finish machining of the inner hole surface of super-hard workpieces such as black metal, quenched steel, high-speed steel, stainless steel, nickel-chromium alloy, chromium alloy and titanium alloy. Through rotation and reciprocating motion, a uniform cross-hatch pattern is formed, and the micro-residual amount on the workpiece surface is removed to achieve mirror-level processing effect. Honing is a basis for precision manufacturing, and honing oil stone is a key tool directly involved in cutting during honing. It is composed of abrasive, binder and pore, and its performance directly affects the machining accuracy, surface quality and efficiency.

[0003] The existing super-hard honing oil stone will fail after a long time of work. The reason for failure is that the diamond or cubic boron nitride in the binder loses its grinding effect. There are two reasons for this situation: (1) the bonding force between the diamond or cubic boron nitride and the metal binder is not enough, causing the abrasive particles to fall off during grinding; (2) the self-sharpening property of the metal binder is not enough, and after the surface abrasive particles fall off, the bottom abrasive particles cannot be quickly exposed, and the oil stone loses its grinding performance. To address these two reasons, on the one hand, the abrasive particles need to be pretreated with metal, and on the other hand, the appropriate honing oil stone metal matrix needs to be selected.

[0004] In order to improve the interfacial bonding performance of diamond and metal materials, some technologists have plated a layer of metal on the surface of diamond. For example, Chinese invention patent CN102229097B "Honing abrasive strip" pretreats diamond abrasive particles with Ni plating. Since Ni plating has high activity, it can easily enter the metal matrix of honing oil stone during sintering, such as forming brittle intermetallic compounds with Cu, Sn and other metals in the metal binder. In addition, Ni plating can also cause graphitization of diamond, thereby affecting the honing performance of honing oil stone.

[0005] Chinese invention patent CN103388142B "Method for plating tungsten on surface of diamond" uses tungsten powder as tungsten source to plate tungsten on the surface of diamond in a vacuum furnace or resistance furnace by salt bath method. Since the cleanliness of tungsten atoms is poor during the reaction process, the pretreatment process before plating tungsten is more complex, and the cost of tungsten source is also higher. Moreover, the method does not further sinter the tungsten-plated cubic boron nitride abrasive particles and the metal binder to prepare super-hard honing oil stone, and the effect is not good. SUMMARY

[0006] The purpose of the present application is to provide a kind of abrasive grain ordered arrangement honing oil stone and its manufacturing method, break through the pain points of uneven distribution of abrasive grain of traditional random arrangement oil stone, cutting load disorder, chip removal channel blockage, improve cutting efficiency, machining quality and precision stability, to be applicable to more precise honing environment.

[0007] The technical solution of the present application is realized as follows: The present application provides a kind of abrasive grain ordered arrangement honing oil stone manufacturing method, alloy powder, ceramic powder, plated silicon / tungsten diamond, polycrystalline cubic boron nitride and ethanol are mixed and ball milled, ultrasonic dispersion is uniform, hot-pressing sintering is carried out, the substrate is prepared, the pretreatment, surface activation, electrodeposition, post-processing process is carried out, and the abrasive grain ordered arrangement honing oil stone is prepared.

[0008] As a further improvement of the present application, the following steps are included: S1. Preparation of polycrystalline cubic boron nitride: silicon nitride, aluminum nitride, aluminum oxide, cerium oxide, cubic boron nitride are mixed and ball milled uniformly, pressure sintering under inert gas protection, and cooling to room temperature to prepare polycrystalline cubic boron nitride; S2. Preparation of plated silicon / tungsten diamond: after ball milling treatment of diamond abrasive, immerse in concentrated sulfuric acid, filter, wash, dry, get pretreated diamond, add silicon powder, tungsten powder and mixed powder of calcium chloride, mix uniformly, vacuum sintering, cool to room temperature, sieve, wash, dry, and prepare plated silicon / tungsten diamond; S3. Preparation of substrate: alloy powder, ceramic powder, plated silicon / tungsten diamond, polycrystalline cubic boron nitride and ethanol are mixed and ball milled, ultrasonic dispersion is uniform, hot-pressing sintering is carried out, and cooling to room temperature to prepare the substrate; S4. Pretreatment: the substrate is polished and polished in sequence, the surface roughness of the substrate is reduced, rust, surface dirt and burr, scratch defects are removed, then immersed in lye to remove oil, immersed in acid to activate, taken out, washed, dried, surface coated with electrodeposition protective paint, and the pretreated substrate is prepared; S5. Surface activation: the pretreated substrate is added to the electrodeposition liquid for surface activation, and the surface activated substrate is obtained; S6. Electrodeposition: using sand embedding method, the surface activated substrate is sand coated, the abrasive used in the sand coating is a mixture of polycrystalline cubic boron nitride and plated silicon / tungsten diamond, after sand coating, the substrate is pulled out, washed, dried, and then embedded in sand again, and electrodeposition treatment is continued, and the electrodeposition substrate is obtained; S7. Post-processing: after removing the electrodeposition protective paint of the electrodeposition substrate, immerse in nickel layer passivation liquid, take out, wash, heat drying treatment, and the abrasive grain ordered arrangement honing oil stone is prepared.

[0009] As a further improvement of the present application, the mass ratio of the silicon nitride, aluminum nitride, aluminum oxide, cerium oxide, cubic boron nitride in step S1 is 10-15:5-10:3-7:2-4:50-70, the pressure of the pressure sintering is 25-35 MPa, the temperature is 1300-1500°C, and the time is 15-30 min.

[0010] As a further improvement of the present application, the average diameter of the diamond abrasive in step S2 is 10-20 μm, the time of the ball milling is 20-40 min, the time of the soaking is 20-24 h, the mass ratio of the silicon powder, tungsten powder and mixed powder of calcium chloride is 1:0.2-0.5:3-5; the mass ratio of the pretreated diamond and the mixed powder is 1:4-6; the vacuum degree of the vacuum sintering is 1-3×10 -3 Pa, the temperature is 1100-1200°C, and the time is 30-60 min.

[0011] As a further improvement of the present application, the mass ratio of the alloy powder, ceramic powder, silicon / tungsten plated diamond, polycrystalline cubic boron nitride and ethanol in step S3 is 3-5:5-10:2-4:20-30:30-50, the alloy powder includes copper powder, tin powder and nickel powder, the mass ratio is 3-5:5-7:5-10, the ceramic powder includes aluminum oxide and silicon oxide, the mass ratio is 3-5:6-9, the power of the ultrasonic is 500-1000 W, the time is 20-40 min, the pressure of the hot-press sintering is 400-500 MPa, and the temperature is 900-1000°C.

[0012] As a further improvement of the present application, the alkali solution in step S4 is 5-10 wt% NaOH or KOH solution, and the acid solution is 8-15 wt% HCl solution.

[0013] As a further improvement of the present application, the conditions of the surface activation in step S5 are: surface activation thickness 3-5 μm, current density 0.7-0.8 A / dm 2 , current size 0.1-0.3 A, and surface activation time 15-30 min; the thickness of the sanding in step S6 is 5-10 μm, the current density is 0.3-0.4 A / dm 2 , the current size is 0.05-0.15 A, and the sanding time is 60-80 min; the conditions of the electrodeposition treatment are: coating thickness 30-60 μm, current density 1-1.3 A / dm 2 , current size 0.2-0.4 A, and electrodeposition time 120-150 min.

[0014] As a further improvement of the present application, the electro-deposition liquid formula is: nickel sulfamate 250-350 g / L, nickel sulfate 10-20 g / L, 1,4-butynediol 0.1-0.3 g / L, boric acid 20-40 g / L, sodium dodecyl sulfonate 0.05-0.1 g / L, and sodium saccharin 0.5-1 g / L.

[0015] As a further improvement of the present application, the soaking time in step S7 is 2-4 min, and the temperature of the heating drying treatment is 150-200 DEG C, and the time is 2-4 h.

[0016] The present application further protects an abrasive grain ordered arrangement honing oilstone prepared by the manufacturing method.

[0017] The present application has the following beneficial effects: Si3N4, AlN, Al2O3 high temperature reaction generates Si4Al2O2N6 phase, forms intergranular bridging structure, fills the gap between cubic boron nitride particles, improves the density, and inhibits the expansion of micro-cracks. Al2O3 refines the grain, improves the fracture toughness, CeO2 acts as a sintering aid and purifier, promotes liquid phase sintering, reduces the sintering temperature, purifies the grain boundary, enhances the interface bonding strength of the cubic boron nitride bonding phase, and prepares a dense cubic boron nitride polycrystal sintered body. Boron nitride still maintains cubic structure, has extremely high strength and good mechanical properties.

[0018] Diamond material has been applied in many fields due to its excellent thermophysical properties and continuously reduced production cost, but diamond has high interface energy with most metal matrices and ceramics, the bonding force between diamond particles and the matrix is poor, and diamond particles are prone to early falling off during use. At present, among strong carbide elements, silicon is a semiconductor element, that is, it has the characteristics of both metals and ceramics. In addition, the thermal conductivity and mechanical properties of silicon are better than those of other elements. Therefore, silicon plays an effective role at the interface. Silicon in the plating layer will react with the carbon on the surface of diamond to form silicon carbide, and tungsten will form tungsten carbide. These two compounds have high lattice matching degree with the ceramic binder and can form strong chemical bonds, replacing the physical adsorption of pure diamond, thereby improving the bonding strength. The prepared silicon / tungsten plated diamond abrasive and polycrystalline cubic boron nitride abrasive are added to the matrix preparation in a certain proportion, which can effectively avoid the generation of pores during the sintering process, improve the yield of the matrix preparation, and at the same time, the particle size and distribution of the material after ultrasonic treatment are more uniform, thereby realizing the relatively ordered arrangement of the abrasive grains in the matrix.

[0019] The coefficient of thermal expansion of the ceramic bond and the cubic boron nitride abrasive has a great influence on the strength of the abrasive tool, and the ceramic bond with smaller thermal expansion coefficient and higher strength is more suitable as one of the sintering agents prepared by the base. The metal sintering agent alloy powder includes copper, tin and nickel metal. Low melting point, easy sintering, high liquid phase fluidity, realize densification, anti-falling, toughness and hardness balance, high thermal conductivity and burn prevention become the preferred binder of superhard honing oilstone. The combination of the two can improve the service life and processing precision of the abrasive tool, reduce the comprehensive cost, break through the application limitation of single binder, and improve the overall hardness of the ceramic particles, inhibit the plastic deformation of the metal, resist impact and prevent cracking, uniformly disperse stress and easily process into shape, so that the abrasive tool can adapt to more complex and more severe processing scenes.

[0020] In the electrodeposition process, a thin plating layer is activated on the surface of the substrate after the substrate is activated, and the plating layer does not contain abrasive grains, which ensures the bonding strength of the plating layer and the substrate, and prevents excessive internal stress. After surface activation, a layer of abrasive grains close to the substrate is preliminarily fixed on the surface activation layer by electrodeposition, which improves the bonding force of the two, and further fixes the abrasive grains on the substrate during the thickening process, effectively avoiding the falling of the subsequent abrasive.

[0021] The present application is a superhard polycrystalline component formula (including silicon / tungsten plated diamond, polycrystalline cubic boron nitride combination), which adopts a rich combination of metal binder and ceramic binder to obtain a higher active and pure binder and improve the bonding quality of cubic boron nitride. Two is to adopt high temperature and high pressure synthesis process, adopt ultrasonic process, effectively solve the problem of difficult dispersion of ultrafine powder with particle size of 5 μm and below and difficult ordering arrangement of abrasive grains, and then control the generation of polycrystalline cubic boron nitride intermediate phase and the bonding behavior with cubic boron nitride, realize high-quality diamond polycrystalline synthesis, thereby reduce the performance change caused by closed pores, and obtain high uniformity, high strength, low porosity and high yield of the substrate material. Three is to reduce the deformation technical scheme, which adds silicon / tungsten plated diamond in the two binders to prevent uneven sintering shrinkage caused by inconsistent expansion coefficient and avoid the generation of waste products such as bending deformation, cracks and delamination. Four is that the present application adopts the method of electrodeposition to plate abrasive on the surface layer of the substrate. Under the action of the electric field, the abrasive can be ordered and arranged on the surface layer of the honing oilstone, which breaks through the pain points of uneven distribution of abrasive in traditional random arrangement oilstone, cutting load disorder and blockage of chip removal channel, improves the cutting efficiency, processing quality and precision stability, and is suitable for more precise honing environment.

[0022] The product of the present application is mainly used for processing of precise and complex and high hardness metal workpieces such as automobile engine cylinder body, hydraulic oil cylinder and bearing ring, and replaces imported precision honing oilstone in oil pump nozzle industry, realizes the localization of precision honing oilstone. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only represent some of the embodiments of the present application, and all other drawings that can be obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0024] Figure 1 The photo of the honing oilstone with ordered arrangement of abrasive particles prepared in Example 1. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments only represent some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0026] Diamond abrasive, average diameter 10-20 μm.

[0027] Example 1 The present embodiment provides a manufacturing method of a honing oilstone with ordered arrangement of abrasive particles, comprising the following steps: S1. Preparation of polycrystalline cubic boron nitride: 10 g of silicon nitride, 5 g of aluminum nitride, 3 g of aluminum oxide, 2 g of cerium oxide, and 50 g of cubic boron nitride are mixed and ball milled for 2 h, pressure sintering is performed under nitrogen protection at a pressure of 25 MPa and a temperature of 1300 ℃ for 15 min, and then cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten plated diamond: after the diamond abrasive is treated by ball milling for 20 min, it is soaked in concentrated sulfuric acid for 20 h, filtered, washed, and dried to obtain pretreated diamond. Silicon powder, tungsten powder, and calcium chloride mixed powder are added, the mass ratio of the silicon powder, tungsten powder, and calcium chloride mixed powder is 1:0.2:3, the mass ratio of the pretreated diamond and the mixed powder is 1:4, and then mixed uniformly. Vacuum sintering is performed at a vacuum degree of 1×10 -3 Pa and a temperature of 1100 ℃ for 30 min, and then cooled to room temperature, sieved, washed, and dried to obtain silicon / tungsten plated diamond; S3. Preparation of the base: 3 g of alloy powder, 5 g of ceramic powder, 2 g of silicon / tungsten plated diamond, 20 g of polycrystalline cubic boron nitride, and 30 g of ethanol are mixed and ball milled for 1 h, ultrasonically dispersed at 500 W for 20 min, and hot-press sintered at a pressure of 400 MPa and a temperature of 900 ℃ for 1 h, and then cooled to room temperature to obtain the base; The alloy powder comprises copper powder, tin powder, and nickel powder, and the mass ratio is 3:5:5, and the ceramic powder comprises aluminum oxide and silicon oxide, and the mass ratio is 3:6. S4. Pre-treatment: the substrate is polished and then polished, and then immersed in a 5wt% NaOH solution for 20 min, immersed in an 8wt% HCl solution for 2 min, taken out, washed, dried, and the surface is coated with an electrodeposition protective paint to obtain a pre-treated substrate; S5. Surface activation: the pre-treated substrate is added to the electrodeposition liquid for surface activation to obtain a surface-activated substrate; The surface activation conditions are: surface activation thickness 3 μm, current density 0.7 A / dm 2 , current size 0.1 A, surface activation time 15 min; The electrodeposition liquid formulation is: nickel sulfamate 250 g / L, nickel sulfate 10 g / L, 1,4-butynediol 0.1 g / L, boric acid 20 g / L, sodium dodecyl sulfonate 0.05 g / L, and sodium saccharin 0.5 g / L.

[0028] S6. Electrodeposition: the surface-activated substrate is sand-embedded using the sand-embedding method, the sand-embedding thickness is 5 μm, the current density is 0.3 A / dm 2 , the current size is 0.05 A, and the sand-embedding time is 60 min. The abrasive used in the sand-embedding is a mixture of polycrystalline cubic boron nitride and silicon / tungsten plated diamond with a mass ratio of 30:5. After the sand-embedding is completed, the substrate is pulled out, washed, dried, re-embedded in the sand, and the electrodeposition treatment is continued. The electrodeposition treatment conditions are: plating layer thickness 30 μm, current density 1 A / dm 2 , current size 0.2 A, and sand-embedding time 120 min to obtain an electrodeposited substrate; The electrodeposition liquid formulation is: nickel sulfamate 250 g / L, nickel sulfate 10 g / L, 1,4-butynediol 0.1 g / L, boric acid 20 g / L, sodium dodecyl sulfonate 0.05 g / L, and sodium saccharin 0.5 g / L.

[0029] S7. Post-treatment: after the electrodeposited substrate is removed from the electrodeposition protective paint, it is immersed in a nickel layer passivation liquid for 2 min, taken out, washed, heated to 150°C, and dried for 2 h to obtain a honing oilstone with ordered arrangement of abrasive particles, the photograph of which is as shown in Figure 1 .

[0030] Example 2 The present embodiment provides a method for manufacturing a honing oilstone with ordered arrangement of abrasive particles, comprising the following steps: S1. Preparation of polycrystalline cubic boron nitride: 15 g of silicon nitride, 10 g of aluminum nitride, 7 g of aluminum oxide, 4 g of cerium oxide, and 70 g of cubic boron nitride are mixed and ball milled for 2 h, pressure sintered at 35 MPa and 1500°C for 30 min under nitrogen protection, and cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten plated diamond: after ball milling the diamond abrasive for 40 min, immerse it in concentrated sulfuric acid for 24 h, filter, wash, dry, and obtain the pretreated diamond. Add the mixed powder of silicon powder, tungsten powder and calcium chloride, the mass ratio of which is 1:0.5:5. The mass ratio of the pretreated diamond and the mixed powder is 1:6. Mix uniformly, vacuum sinter, the vacuum degree is 3x10 -3 Pa, the temperature is 1200℃, the time is 60 min, cool to room temperature, sieve, wash, dry, and obtain the silicon / tungsten plated diamond; S3. Preparation of the substrate: mix 5 g of alloy powder, 10 g of ceramic powder, 4 g of silicon / tungsten plated diamond, 30 g of polycrystalline cubic boron nitride and 50 g of ethanol by ball milling for 1 h, and disperse by ultrasonic for 40 min at 1000 W. Hot-press sintering is performed at a pressure of 500 MPa and a temperature of 1000℃ for 1 h, and then cool to room temperature to obtain the substrate; The alloy powder comprises copper powder, tin powder and nickel powder, and the mass ratio is 5:7:10. The ceramic powder comprises alumina and silica, and the mass ratio is 5:9; S4. Pretreatment: polish and polish the substrate in sequence, and then immerse it in 10wt% KOH solution for 20 min and 15wt% HCl solution for 2 min. Take out, wash, dry, and coat the surface with electrodeposition protective paint to obtain the pretreated substrate; S5. Surface activation: add the pretreated substrate into the electrodeposition liquid for surface activation to obtain the surface-activated substrate; The surface activation conditions are as follows: surface activation thickness is 5 μm, current density is 0.8 A / dm 2 , current size is 0.3 A, and surface activation time is 30 min; The electrodeposition liquid formula is as follows: nickel sulfamate 2350 g / L, nickel sulfate 20 g / L, 1,4-butynediol 0.3 g / L, boric acid 40 g / L, sodium dodecyl sulfonate 0.1 g / L, and sodium saccharin 1 g / L.

[0031] S6. Electrodeposition: use the sand embedding method to embed the surface-activated substrate, the embedding thickness is 10 μm, the current density is 0.4 A / dm 2 , the current size is 0.15 A, and the embedding time is 80 min. The embedding abrasive is a mixture of polycrystalline cubic boron nitride and silicon / tungsten plated diamond, and the mass ratio is 30:5. After the embedding is completed, take out the substrate, wash, dry, embed again, and continue the electrodeposition treatment. The electrodeposition treatment conditions are as follows: coating thickness is 60 μm, current density is 1.3 A / dm 2 , current size is 0.4 A, and embedding time is 150 min to obtain the electrodeposited substrate; Electrodeposition liquid formula: nickel sulfamate 350 g / L, nickel sulfate 20 g / L, 1,4-butynediol 0.3 g / L, boric acid 40 g / L, sodium dodecyl sulfonate 0.1 g / L, sodium saccharin 1 g / L.

[0032] S7. Post-processing: after removing the electrodeposition protective paint from the electrodeposition matrix, immerse it in a nickel layer passivation solution for 4 min, take it out, wash it, and perform a heating treatment to 200℃ for 4h, to obtain the abrasive grain ordered arrangement honing oil stone.

[0033] Example 3 The present embodiment provides a method for manufacturing an abrasive grain ordered arrangement honing oil stone, comprising the following steps: S1. Preparation of polycrystalline cubic boron nitride: mix 12 g of silicon nitride, 7 g of aluminum nitride, 5 g of aluminum oxide, 3 g of cerium oxide, and 60 g of cubic boron nitride, ball mill for 2 h, pressure sintering under nitrogen protection at a pressure of 30 MPa and a temperature of 1400℃ for 22 min, and cool to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten plated diamond: after ball milling the diamond abrasive for 30 min, immerse it in concentrated sulfuric acid for 22 h, filter, wash, and dry to obtain pretreated diamond, add a mixture of silicon powder, tungsten powder, and calcium chloride, the mass ratio of the silicon powder, tungsten powder, and calcium chloride being 1:0.35:4, the mass ratio of the pretreated diamond and the mixture being 1:5, mix uniformly, vacuum sintering at a vacuum degree of 2×10 -3 Pa, a temperature of 1150℃, and a time of 45 min, sieve, wash, and dry to obtain silicon / tungsten plated diamond; S3. Preparation of matrix: mix 4 g of alloy powder, 7 g of ceramic powder, 3 g of silicon / tungsten plated diamond, 25 g of polycrystalline cubic boron nitride, and 40 g of ethanol, ball mill for 1 h, ultrasonic dispersion at 700 W for 30 min, hot-press sintering at a pressure of 450 MPa and a temperature of 950℃ for 1 h, and cool to room temperature to obtain the matrix; The alloy powder comprises copper powder, tin powder, and nickel powder, the mass ratio being 4:6:8, and the ceramic powder comprises aluminum oxide and silicon oxide, the mass ratio being 4:7; S4. Pre-treatment: polish and polish the matrix in sequence, then immerse it in an 8wt% NaOH solution for 20 min, immerse it in a 10wt% HCl solution for 2 min, take it out, wash it, dry it, and coat the surface with electrodeposition protective paint to obtain the pre-treated matrix; S5. Surface activation: add the pre-treated matrix to the electrodeposition liquid to perform surface activation to obtain the surface-activated matrix; The surface activation conditions are: surface activation thickness of 4 μm, current density of 0.75 A / dm 2, the current size is 0.2A, the surface activation time is 20min; The formula of the electrodeposition solution is: 300g / L of nickel sulfamate, 15g / L of nickel sulfate, 0.2g / L of 1,4-butynediol, 30g / L of boric acid, 0.07g / L of sodium dodecyl sulfonate, and 0.7g / L of sodium saccharin.

[0034] S6. Electrodeposition: sanding is performed on the surface-activated substrate by using the sand-embedding method, the sanding thickness is 7μm, the current density is 0.35A / dm 2 , the current size is 0.1A, the sanding time is 70min, the abrasive used in the sanding is a mixture of polycrystalline cubic boron nitride and silicon / tungsten plated diamond with a mass ratio of 30:5, after the sanding is completed, the substrate is pulled out, washed, dried, and then embedded in the sand again, and the electrodeposition treatment is continued, the electrodeposition treatment conditions are: the coating thickness is 45μm, the current density is 1.15A / dm 2 , the current size is 0.3A, the sanding time is 135min, and the electrodeposited substrate is obtained; The formula of the electrodeposition solution is: 300g / L of nickel sulfamate, 15g / L of nickel sulfate, 0.2g / L of 1,4-butynediol, 30g / L of boric acid, 0.07g / L of sodium dodecyl sulfonate, and 0.7g / L of sodium saccharin.

[0035] S7. Post-treatment: after the electrodeposited substrate is removed from the electrodeposition protective paint, it is soaked in a nickel layer passivation solution for 3min, taken out, washed, heated to 170℃, and dried for 3h, and a honing oilstone with ordered arrangement of abrasive particles is prepared.

[0036] Comparative Example 1 Compared with Example 3, the difference is that the polycrystalline cubic boron nitride is replaced by cubic boron nitride with equal mass.

[0037] Comparative Example 2 Compared with Example 3, the difference is that no tungsten powder is added in step S2.

[0038] The specific process is as follows: S1. Preparation of polycrystalline cubic boron nitride: 12g of silicon nitride, 7g of aluminum nitride, 5g of aluminum oxide, 3g of cerium oxide, and 60g of cubic boron nitride are mixed and ball-milled for 2h, pressure-sintered at a pressure of 30MPa and a temperature of 1400℃ for 22min under nitrogen protection, and cooled to room temperature, and polycrystalline cubic boron nitride is prepared; S2. Preparation of silicon-plated diamond: after ball milling the diamond abrasive for 30 min, immerse in concentrated sulfuric acid for 22 h, filter, wash, dry, obtain pretreated diamond, add mixed powder of silicon powder and calcium chloride, the mass ratio of the mixed powder of silicon powder and calcium chloride is 1.35:4; the mass ratio of the pretreated diamond and the mixed powder is 1:5, mix uniformly, vacuum sintering, vacuum degree is 2x10 -3 Pa, temperature is 1150℃, time is 45 min, cool to room temperature, sieve, wash, dry, prepare silicon-plated diamond; S3. Preparation of substrate: mix 4g alloy powder, 7g ceramic powder, 3g silicon-plated / tungsten diamond, 25g polycrystalline cubic boron nitride and 40g ethanol by ball milling for 1h, ultrasonic dispersion at 700W for 30 min, hot-press sintering, pressure is 450MPa, temperature is 950℃, time is 1h, cool to room temperature, prepare substrate; The alloy powder includes copper powder, tin powder and nickel powder, the mass ratio is 4:6:8, the ceramic powder includes alumina and silica, the mass ratio is 4:7; S4. Pretreatment: polish and polish the substrate in sequence, then immerse in 8wt% NaOH solution for 20 min, immerse in 10wt% HCl solution for 2 min, take out, wash, dry, coat with electrodeposition protective paint, prepare pretreated substrate; S5. Surface activation: add the pretreated substrate into electrodeposition liquid for surface activation, obtain surface-activated substrate; The conditions of surface activation: surface activation thickness is 4μm, current density is 0.75A / dm 2 , current size is 0.2A, surface activation time is 20 min; The formula of electrodeposition liquid: nickel sulfamate 300g / L, nickel sulfate 15g / L, 1,4-butynediol 0.2g / L, boric acid 30g / L, sodium dodecyl sulfonate 0.07g / L, sodium saccharin 0.7g / L.

[0039] S6. Electrodeposition: use sand embedding method to embed the surface-activated substrate, the embedding thickness is 7μm, the current density is 0.35A / dm 2 , the current size is 0.1A, the embedding time is 70 min, the embedding abrasive is the mixed material of polycrystalline cubic boron nitride and silicon-plated / tungsten diamond, the mass ratio is 30:5, after the embedding is completed, pull out the substrate, wash, dry, continue to embed in sand, continue to carry out electrodeposition treatment, the conditions of electrodeposition treatment: coating thickness is 45μm, the current density is 1.15A / dm 2 , the current size is 0.3A, the embedding time is 135 min, obtain electrodeposited substrate; Electrodeposition liquid formula: nickel sulfamate 300 g / L, nickel sulfate 15 g / L, 1,4-butynediol 0.2 g / L, boric acid 30 g / L, sodium dodecyl sulfonate 0.07 g / L, sodium saccharin 0.7 g / L.

[0040] S7. Post-processing: after removing the electrodeposition matrix from the electrodeposition protective paint, immerse it in a nickel layer passivation solution for 3 min, take it out, wash it, and perform a drying treatment at 170°C for 3 h to obtain a grit ordered arrangement honing stone.

[0041] Comparative Example 3 Compared with Example 3, the difference is that no silicon powder is added in step S2.

[0042] Specifically as follows: S1. Preparation of polycrystalline cubic boron nitride: 12 g of silicon nitride, 7 g of aluminum nitride, 5 g of aluminum oxide, 3 g of cerium oxide, and 60 g of cubic boron nitride are mixed and ball milled for 2 h, pressure sintered under nitrogen protection at a pressure of 30 MPa and a temperature of 1400°C for 22 min, and cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of tungsten-plated diamond: after the diamond abrasive is treated by ball milling for 30 min, it is immersed in concentrated sulfuric acid for 22 h, filtered, washed, and dried to obtain pretreated diamond, which is mixed with a mixture of tungsten powder and calcium chloride at a mass ratio of 3.5:4, and the mass ratio of the pretreated diamond and the mixture is 1:5, and the mixture is uniformly mixed and vacuum sintered at a vacuum degree of 2×10 -3 Pa, a temperature of 1150°C, and a time of 45 min, sieved, washed, and dried to obtain tungsten-plated diamond; S3. Preparation of matrix: 4 g of alloy powder, 7 g of ceramic powder, 3 g of silicon / tungsten-plated diamond, 25 g of polycrystalline cubic boron nitride, and 40 g of ethanol are mixed and ball milled for 1 h, ultrasonically dispersed at 700 W for 30 min, hot-pressed and sintered at a pressure of 450 MPa and a temperature of 950°C for 1 h, and cooled to room temperature to obtain the matrix; The alloy powder includes copper powder, tin powder, and nickel powder at a mass ratio of 4:6:8, and the ceramic powder includes aluminum oxide and silicon oxide at a mass ratio of 4:7; S4. Pre-treatment: the matrix is polished and polished in sequence, then immersed in an 8wt% NaOH solution for 20 min, immersed in a 10wt% HCl solution for 2 min, taken out, washed, dried, and coated with an electrodeposition protective paint to obtain a pre-treated matrix; S5. Surface activation: the pre-treated matrix is added to the electrodeposition liquid for surface activation to obtain a surface-activated matrix; The surface activation conditions are as follows: surface activation thickness 4 μm, current density 0.75 A / dm 2, the current size is 0.2A, the surface activation time is 20min; The formula of the electrodeposition solution is: 300g / L of nickel sulfamate, 15g / L of nickel sulfate, 0.2g / L of 1,4-butynediol, 30g / L of boric acid, 0.07g / L of sodium dodecyl sulfonate, and 0.7g / L of sodium saccharin.

[0043] S6. Electrodeposition: sanding is performed on the surface-activated substrate by using the sand-embedding method, the sanding thickness is 7μm, the current density is 0.35A / dm 2 , the current size is 0.1A, the sanding time is 70min, the abrasive used in the sanding is a mixture of polycrystalline cubic boron nitride and silicon / tungsten plated diamond, the mass ratio is 30:5, after the sanding is completed, the substrate is pulled out, washed, dried, and then embedded in the sand again, and the electrodeposition treatment is continued, the electrodeposition treatment conditions are: the coating thickness is 45μm, the current density is 1.15A / dm 2 , the current size is 0.3A, the sanding time is 135min, and the electrodeposited substrate is obtained; The formula of the electrodeposition solution is: 300g / L of nickel sulfamate, 15g / L of nickel sulfate, 0.2g / L of 1,4-butynediol, 30g / L of boric acid, 0.07g / L of sodium dodecyl sulfonate, and 0.7g / L of sodium saccharin.

[0044] S7. Post-treatment: after the electrodeposited substrate is removed from the electrodeposition protective paint, it is soaked in a nickel layer passivation solution for 3min, taken out, washed, heated to 170℃, and dried for 3h, and a honing oilstone with ordered arrangement of abrasive grains is prepared.

[0045] Comparative Example 4 Compared with Example 3, the difference is that step S2 is not performed.

[0046] The details are as follows: S1. Preparation of polycrystalline cubic boron nitride: 12g of silicon nitride, 7g of aluminum nitride, 5g of aluminum oxide, 3g of cerium oxide, and 60g of cubic boron nitride are mixed and ball-milled for 2h, pressure-sintered at a pressure of 30MPa and a temperature of 1400℃ for 22min under nitrogen protection, and cooled to room temperature to prepare polycrystalline cubic boron nitride; S2. Preparation of the substrate: 4g of alloy powder, 7g of ceramic powder, 3g of diamond abrasive, 25g of polycrystalline cubic boron nitride, and 40g of ethanol are mixed and ball-milled for 1h, ultrasonically dispersed at 700W for 30min, hot-pressed and sintered at a pressure of 450MPa and a temperature of 950℃ for 1h, and cooled to room temperature to prepare the substrate; The alloy powder includes copper powder, tin powder, and nickel powder, and the mass ratio is 4:6:8, and the ceramic powder includes aluminum oxide and silicon oxide, and the mass ratio is 4:7; S3. Pretreatment: the substrate was polished and polished in sequence, then immersed in 8wt% NaOH solution for 20 min, immersed in 10wt% HCl solution for 2 min, taken out, washed, dried, and coated with electrodeposition protective paint to obtain a pretreated substrate; S4. Surface activation: the pretreated substrate was added to the electrodeposition solution for surface activation to obtain a surface-activated substrate; The surface activation conditions were: surface activation thickness 4 μm, current density 0.75 A / dm 2 , current size 0.2 A, surface activation time 20 min; The electrodeposition solution formulation was: nickel sulfamate 300 g / L, nickel sulfate 15 g / L, 1,4-butynediol 0.2 g / L, boric acid 30 g / L, sodium dodecyl sulfonate 0.07 g / L, and sodium saccharin 0.7 g / L.

[0047] S5. Electrodeposition: sanding was performed on the surface-activated substrate using the sand embedding method, the sanding thickness was 7 μm, the current density was 0.35 A / dm 2 , the current size was 0.1 A, and the sanding time was 70 min. The abrasive used in the sanding was a mixture of polycrystalline cubic boron nitride and plated silicon / tungsten diamond at a mass ratio of 30:5. After the sanding was completed, the substrate was pulled out, washed, dried, and then embedded in sand again for continued electrodeposition treatment. The electrodeposition treatment conditions were: coating thickness 45 μm, current density 1.15 A / dm 2 , current size 0.3 A, and sanding time 135 min, to obtain an electrodeposited substrate; The electrodeposition solution formulation was: nickel sulfamate 300 g / L, nickel sulfate 15 g / L, 1,4-butynediol 0.2 g / L, boric acid 30 g / L, sodium dodecyl sulfonate 0.07 g / L, and sodium saccharin 0.7 g / L.

[0048] S6. Post-treatment: after the electrodeposited substrate was removed from the electrodeposition protective paint, it was immersed in a nickel layer passivation solution for 3 min, taken out, washed, heated to 170℃, and dried for 3 h to obtain a honing stone with ordered arrangement of abrasive particles.

[0049] Comparative Example 5 The difference compared with Example 3 was that plated silicon / tungsten diamond was not added in step S3.

[0050] The details are as follows: S1. Preparation of polycrystalline cubic boron nitride: 12 g of silicon nitride, 7 g of aluminum nitride, 5 g of aluminum oxide, 3 g of cerium oxide, and 60 g of cubic boron nitride were mixed and ball milled for 2 h. Pressure sintering was performed under nitrogen protection at a pressure of 30 MPa and a temperature of 1400℃ for 22 min, and then cooled to room temperature to obtain polycrystalline cubic boron nitride. S2. Preparation of the substrate: 4 g of alloy powder, 7 g of ceramic powder, 28 g of polycrystalline cubic boron nitride and 40 g of ethanol were mixed and ball-milled for 1 h, 700 W ultrasonic dispersion for 30 min, hot-pressing sintering, pressure 450 MPa, temperature 950℃, time 1 h, cooling to room temperature, to obtain the substrate; The alloy powder comprises copper powder, tin powder and nickel powder, with a mass ratio of 4:6:8, and the ceramic powder comprises alumina and silicon oxide, with a mass ratio of 4:7; S3. Pretreatment: the substrate was polished and polished in sequence, then soaked in 8wt% NaOH solution for 20 min, soaked in 10wt% HCl solution for 2 min, taken out, washed, dried, and the surface was coated with electrodeposition protective paint to obtain a pretreated substrate; S4. Surface activation: the pretreated substrate was added to the electrodeposition solution for surface activation to obtain a surface-activated substrate; The surface activation conditions were: surface activation thickness 4μm, current density 0.75A / dm 2 , current size 0.2A, surface activation time 20min; The electrodeposition solution formulation was: nickel sulfamate 300g / L, nickel sulfate 15g / L, 1,4-butynediol 0.2g / L, boric acid 30g / L, sodium dodecyl sulfonate 0.07g / L, and sodium saccharin 0.7g / L.

[0051] S5. Electrodeposition: sand embedding method was used to sand the surface-activated substrate, with a sanding thickness of 7μm, a current density of 0.35A / dm 2 , a current size of 0.1A, and a sanding time of 70min. The abrasive used in the sanding was a mixture of polycrystalline cubic boron nitride and silicon / tungsten plated diamond, with a mass ratio of 30:5. After sanding, the substrate was pulled out, washed, dried, and then re-embedded in the sand for further electrodeposition treatment. The electrodeposition treatment conditions were: coating thickness 45μm, current density 1.15A / dm 2 , current size 0.3A, and sanding time 135min, to obtain an electrodeposited substrate; The electrodeposition solution formulation was: nickel sulfamate 300g / L, nickel sulfate 15g / L, 1,4-butynediol 0.2g / L, boric acid 30g / L, sodium dodecyl sulfonate 0.07g / L, and sodium saccharin 0.7g / L.

[0052] S6. Post-treatment: after removing the electrodeposition protective paint from the electrodeposited substrate, it was soaked in a nickel layer passivation solution for 3min, taken out, washed, heated to 170℃, and dried for 3h to obtain a abrasive grain ordered arrangement honing oilstone.

[0053] Comparative Example 6 Compared with Example 3, the difference is that steps S4 to S7 are not performed.

[0054] Specifically as follows: S1. Preparation of polycrystalline cubic boron nitride: 12 g of silicon nitride, 7 g of aluminum nitride, 5 g of aluminum oxide, 3 g of cerium oxide, and 60 g of cubic boron nitride are mixed and ball milled for 2 h, pressure sintered under nitrogen protection at a pressure of 30 MPa and a temperature of 1400℃ for 22 min, and cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten plated diamond: after the diamond abrasive is treated by ball milling for 30 min, it is soaked in concentrated sulfuric acid for 22 h, filtered, washed, and dried to obtain pretreated diamond. Silicon powder, tungsten powder, and calcium chloride mixed powder are added, and the mass ratio of the silicon powder, tungsten powder, and calcium chloride mixed powder is 1:0.35:4. The mass ratio of the pretreated diamond and the mixed powder is 1:5, and they are uniformly mixed and vacuum sintered at a vacuum degree of 2x10 -3 Pa, a temperature of 1150℃, and a time of 45 min. After being sieved, washed, and dried, silicon / tungsten plated diamond is obtained. S3. Preparation of the substrate: 4 g of alloy powder, 7 g of ceramic powder, 3 g of silicon / tungsten plated diamond, 25 g of polycrystalline cubic boron nitride, and 40 g of ethanol are mixed and ball milled for 1 h, ultrasonically dispersed at 700 W for 30 min, and hot-pressed and sintered at a pressure of 450 MPa and a temperature of 950℃ for 1 h. After being cooled to room temperature, a abrasive grain ordered arrangement honing oilstone is obtained. The alloy powder includes copper powder, tin powder, and nickel powder, and the mass ratio is 4:6:8. The ceramic powder includes aluminum oxide and silicon oxide, and the mass ratio is 4:7.

[0055] Comparative Example 7 Compared with Example 3, the difference is that no ultrasonic treatment is performed in step S3, and steps S4 to S7 are not performed.

[0056] Specifically as follows: S1. Preparation of polycrystalline cubic boron nitride: 12 g of silicon nitride, 7 g of aluminum nitride, 5 g of aluminum oxide, 3 g of cerium oxide, and 60 g of cubic boron nitride are mixed and ball milled for 2 h, pressure sintered under nitrogen protection at a pressure of 30 MPa and a temperature of 1400℃ for 22 min, and cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten plated diamond: after the diamond abrasive is treated by ball milling for 30 min, it is soaked in concentrated sulfuric acid for 22 h, filtered, washed, and dried to obtain pretreated diamond. Silicon powder, tungsten powder, and calcium chloride mixed powder are added, and the mass ratio of the silicon powder, tungsten powder, and calcium chloride mixed powder is 1:0.35:4. The mass ratio of the pretreated diamond and the mixed powder is 1:5, and they are uniformly mixed and vacuum sintered at a vacuum degree of 2x10 -3Pa, temperature 1150℃, time 45min, cooling to room temperature, sieving, washing, drying, to obtain silicon / tungsten plated diamond; S3. Preparation of the substrate: 4g of alloy powder, 7g of ceramic powder, 3g of silicon / tungsten plated diamond, 25g of polycrystalline cubic boron nitride and 40g of ethanol were mixed and ball-milled for 1h, and then hot-pressed and sintered at a pressure of 450MPa and a temperature of 950℃ for 1h, and then cooled to room temperature to obtain a honing stone; The alloy powder comprises copper powder, tin powder and nickel powder in a mass ratio of 4:6:8, and the ceramic powder comprises alumina and silica in a mass ratio of 4:7.

[0057] Comparative Example 8 Compared with Example 3, the difference lies in that no alloy powder is added in step S3.

[0058] The specific process is as follows: S3. Preparation of the substrate: 11g of ceramic powder, 3g of silicon / tungsten plated diamond, 25g of polycrystalline cubic boron nitride and 40g of ethanol were mixed and ball-milled for 1h, and then ultrasonically dispersed at 700W for 30min, and then hot-pressed and sintered at a pressure of 450MPa and a temperature of 950℃ for 1h, and then cooled to room temperature to obtain a substrate; The ceramic powder comprises alumina and silica in a mass ratio of 4:7.

[0059] Comparative Example 9 Compared with Example 3, the difference lies in that no ceramic powder is added in step S3.

[0060] The specific process is as follows: S3. Preparation of the substrate: 11g of alloy powder, 3g of silicon / tungsten plated diamond, 25g of polycrystalline cubic boron nitride and 40g of ethanol were mixed and ball-milled for 1h, and then ultrasonically dispersed at 700W for 30min, and then hot-pressed and sintered at a pressure of 450MPa and a temperature of 950℃ for 1h, and then cooled to room temperature to obtain a substrate; The alloy powder comprises copper powder, tin powder and nickel powder in a mass ratio of 4:6:8.

[0061] Test Example 1 The substrates prepared in Examples 1-3 and Comparative Examples 1-5 and 7-9 were subjected to performance testing, and the results are shown in Table 1.

[0062] Wear resistance: a UMT-2 type friction and wear tester was used to characterize the wear resistance of the sample by wear ratio, which is the ratio of the volume loss of the sample to the volume loss of the ground sample, and can reflect the strength of the processing capacity of the sample. The smaller the value, the stronger the processing capacity of the sample.

[0063] Bending strength: tested by DDL-100 universal testing machine, the result is bending strength, the greater the value, the greater the bending strength of the sample.

[0064] Table 1

[0065] From the above table, it can be seen that the matrix prepared by examples 1-3 has good wear resistance and bending strength.

[0066] Test example 2 The honing stones prepared by examples 1-3 and comparative examples 1-9 are used to process the same hydraulic cylinder barrel (45 steel / cylinder diameter 210 mm) on the market, and 8 honing stones are evenly embedded on each honing head. The results are shown in table 2.

[0067] Table 2

[0068] From the above table, it can be seen that the honing stones prepared by examples 1-3 are more fine and have higher surface processing quality.

[0069] In comparative example 1, the polycrystalline cubic boron nitride is replaced by cubic boron nitride with equal mass, and the wear ratio and bending strength decrease. Si3N4, AlN and Al2O3 react at high temperature to form Si4Al2O2N6 phase, form intergranular bridging structure, fill the gap between cubic boron nitride particles, improve density and inhibit microcrack propagation. Al2O3 refines the grain and improves the fracture toughness. CeO2 acts as a sintering aid and purifier, promotes liquid phase sintering, reduces sintering temperature, purifies grain boundary, enhances the bonding strength of cubic boron nitride bonding phase interface, and prepares a dense cubic boron nitride polycrystalline sintered body. Boron nitride still maintains cubic structure, has extremely high strength and good mechanical properties.

[0070] In Comparative Examples 2 and 3, no tungsten powder or silicon powder was added in step S2, in Comparative Example 4, step S2 was not performed, and in Comparative Example 5, no silicon / tungsten plated diamond was added in step S3, and the wear ratio, bending strength, machining precision, and service life were all reduced. Diamond materials have been applied in many fields due to their excellent thermophysical properties and continuously decreasing production cost, but diamond has a high interfacial energy with most metal matrices and ceramics, and the bonding force between diamond particles and the matrix is poor, and diamond particles are prone to early shedding during use. At present, among strong carbide elements, silicon is a semiconductor element, that is, it has the characteristics of both metals and ceramics, and the thermal conductivity and mechanical properties of silicon are superior to those of other elements, and therefore, silicon plays an effective role at the interface. Silicon in the plating layer reacts with the carbon on the surface of the diamond to form silicon carbide, and tungsten forms tungsten carbide, and these two compounds have a high lattice matching degree with the ceramic binder and can form strong chemical bonds to replace the physical adsorption of pure diamond, thereby improving the bonding strength. The silicon / tungsten plated diamond abrasive and the polycrystalline cubic boron nitride abrasive are added to the matrix in a certain proportion, which can effectively avoid the generation of pores during the sintering process and improve the yield of the matrix preparation. At the same time, after ultrasonic treatment of the material, the particle size and distribution of the base material are more uniform, thereby realizing the ordered arrangement of the abrasive particles in the matrix.

[0071] In Comparative Example 6, steps S4 to S7 were performed, and the surface roughness and machining precision were reduced. After the activation treatment of the matrix in the electrodeposition process, a thin plating layer was formed on the surface of the matrix, and the plating layer did not contain abrasive particles, which ensured the bonding strength of the plating layer and the matrix and prevented the generation of excessive internal stress. By using the electrodeposition method to plate the abrasive on the surface layer of the matrix, the abrasive can be ordered arranged on the surface layer of the honing stone under the action of the electric field, which breaks through the pain points of the traditional random arrangement of the abrasive particles, such as uneven distribution of abrasive particles, chaotic cutting load, and blocked chip removal channel, and improves the cutting efficiency, machining quality, and precision stability, thereby being suitable for more precise honing environment.

[0072] In Comparative Example 7, no ultrasonic treatment was performed in step S3, and steps S4 to S7 were not performed, and the surface roughness and machining precision were reduced, and the wear ratio of the matrix was reduced. Because the particle size and distribution of the base material are more uniform after ultrasonic treatment of the material, the ordered arrangement of the abrasive particles in the matrix is realized.

[0073] The processing precision, mechanical strength and service life of Comparative Examples 8 and 9 are reduced due to the use of single ceramic powder or alloy powder. The matching of the thermal expansion coefficient of the ceramic binder and the cubic boron nitride abrasive has a great influence on the strength of the abrasive tool. The ceramic binder with a smaller thermal expansion coefficient and higher strength is more suitable as one of the sintering agents prepared by the substrate. The metal sintering agent alloy powder includes copper, tin and nickel metal. The low melting point is easy to sinter, the high liquid phase fluidity realizes the densification of the filling anti-shedding, the toughness and hardness balance anti-impact, the high thermal conductivity prevents burn and becomes the preferred binder of the superhard honing oilstone. The combination of the two improves the service life and processing precision of the abrasive tool, reduces the comprehensive cost, breaks through the application limitation of single binder, the ceramic particles improve the overall hardness of the binder, inhibit the plastic deformation of the metal, the metal substance is anti-impact and does not crack, uniformly disperses the stress and is easy to process, so that the abrasive tool can adapt to more complex and more severe processing scenes.

[0074] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing a honing stone with ordered abrasive grain arrangement, characterized in that, Alloy powder, ceramic powder, silicon / tungsten diamond, polycrystalline cubic boron nitride, and ethanol are mixed and ball-milled, ultrasonically dispersed, and hot-pressed and sintered to obtain a matrix. After pretreatment, surface activation, electrodeposition, and post-treatment processes, a honing stone with ordered abrasive grain arrangement is obtained.

2. The manufacturing method according to claim 1, characterized in that, Includes the following steps: S1. Preparation of polycrystalline cubic boron nitride: Silicon nitride, aluminum nitride, aluminum oxide, cerium oxide and cubic boron nitride are mixed and ball-milled until uniform, sintered under pressure under inert gas protection, and cooled to room temperature to obtain polycrystalline cubic boron nitride; S2. Preparation of silicon / tungsten diamond: After ball milling, diamond abrasive is immersed in concentrated sulfuric acid, filtered, washed, and dried to obtain pretreated diamond. It is then added to a mixture of silicon powder, tungsten powder, and calcium chloride powder, mixed evenly, vacuum sintered, cooled to room temperature, sieved, washed, and dried to obtain silicon / tungsten diamond. S3. Preparation of the matrix: The alloy powder, ceramic powder, silicon / tungsten diamond, polycrystalline cubic boron nitride and ethanol are mixed and ball-milled, ultrasonically dispersed evenly, hot-pressed and sintered, and cooled to room temperature to obtain the matrix; S4. Pretreatment: The substrate is ground and polished in sequence to reduce the surface roughness of the substrate, remove rust, remove surface dirt and remove burrs and scratches, then soak in alkaline solution to remove oil, soak in acid solution to activate, take out, wash, dry, and coat the surface with electrodeposition protective paint to obtain the pretreated substrate. S5. Surface activation: The pretreated substrate is added to the electrodeposition solution for surface activation to obtain a surface-activated substrate; S6. Electrodeposition: The surface-activated substrate is coated with abrasive using the buried sand method. The abrasive used for this coating is a mixture of polycrystalline cubic boron nitride and silicon / tungsten diamond. After the coating is completed, the substrate is pulled out, washed, dried, and then buried in sand again for further electrodeposition treatment to obtain the electrodeposition substrate. S7. Post-treatment: After removing the electrodeposition protective coating from the electrodeposition substrate, immerse it in a nickel passivation solution, remove it, wash it, and perform a heating and drying treatment to obtain a honing stone with ordered abrasive grain arrangement.

3. The manufacturing method according to claim 2, characterized in that, In step S1, the mass ratio of silicon nitride, aluminum nitride, aluminum oxide, cerium oxide, and cubic boron nitride is 10-15:5-10:3-7:2-4:50-70. The pressure of the pressure sintering is 25-35 MPa, the temperature is 1300-1500℃, and the time is 15-30 min.

4. The manufacturing method according to claim 2, characterized in that, In step S2, the average diameter of the diamond abrasive is 10-20 μm; the ball milling time is 20-40 min; the soaking time is 20-24 h; the mass ratio of the mixed powder of silicon powder, tungsten powder, and calcium chloride is 1:0.2-0.5:3-5; the mass ratio of the pretreated diamond to the mixed powder is 1:4-6; and the vacuum degree of the vacuum sintering is 1-3 × 10⁻⁶. -3 Pa, temperature 1100-1200℃, time 30-60min.

5. The manufacturing method according to claim 2, characterized in that, In step S3, the mass ratio of the alloy powder, ceramic powder, silicon / tungsten diamond plating, polycrystalline cubic boron nitride, and ethanol is 3-5:5-10:2-4:20-30:30-50. The alloy powder includes copper powder, tin powder, and nickel powder in a mass ratio of 3-5:5-7:5-10. The ceramic powder includes alumina and silicon oxide in a mass ratio of 3-5:6-9. The ultrasonic power is 500-1000W, the time is 20-40min, and the hot pressing sintering pressure is 400-500MPa and the temperature is 900-1000℃.

6. The manufacturing method according to claim 2, characterized in that, The alkaline solution in step S4 is a 5-10 wt% NaOH or KOH solution, and the acid solution is an 8-15 wt% HCl solution.

7. The manufacturing method according to claim 2, characterized in that, The surface activation conditions described in step S5 are: surface activation thickness 3-5 μm, current density 0.7-0.8 A / dm². 2 The current is 0.1-0.3A, and the surface activation time is 15-30 min; in step S6, the thickness of the sand coating is 5-10 μm, and the current density is 0.3-0.4 A / dm. 2 The current is 0.05-0.15A, the sand application time is 60-80 minutes, and the electrodeposition conditions are: coating thickness 30-60μm, current density 1-1.3A / dm³. 2 The current is 0.2-0.4A, and the sand application time is 120-150 minutes.

8. The manufacturing method according to claim 7, characterized in that, Electrodeposition solution formulation: Nickel sulfamate 250-350 g / L, nickel sulfate 10-20 g / L, 1,4-butynediol 0.1-0.3 g / L, boric acid 20-40 g / L, sodium dodecyl sulfonate 0.05-0.1 g / L, sodium saccharin 0.5-1 g / L.

9. The manufacturing method according to claim 2, characterized in that, In step S7, the soaking time is 2-4 minutes, and the heating and drying treatment is carried out at a temperature of 150-200℃ for 2-4 hours.

10. A honing stone with ordered abrasive grain arrangement prepared by the manufacturing method according to any one of claims 1-9.

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