A solder resist baking device and method for printed circuit boards

Abstract

This invention discloses a solder resist baking device and method for printed circuit boards (PCBs), relating to the technical field of PCB manufacturing. The solder resist baking device includes a housing, a carrier, a feeding device, and a transmission device. The housing has a baking channel and a cooling channel. The transmission device includes a first rack and a linkage mechanism. The linkage mechanism includes a first rotating shaft and a first gear. A first bevel gear is mounted on the first rotating shaft, and a second bevel gear is mounted on the rotating shaft of the rotating frame. The first and second bevel gears mesh, and the first rack meshes with the first gear. This solder resist baking device allows the PCB to be transferred to the cooling channel to cool to room temperature after baking in the baking channel. This ensures that baking and cooling operations do not interfere with each other, avoiding frequent heating and cooling, improving baking efficiency, and ensuring uniform heating of the PCB. Furthermore, it eliminates the need for additional external space for cooling the PCB, saving space resources.

Description

Technical Field

[0001] This invention relates to the technical field of printed circuit board manufacturing, and in particular to a solder resist baking device and method for printed circuit boards. Background Technology

[0002] Printed circuit boards, also known as PCBs, are the carriers of integrated circuits, providing mechanical support and electrical connections for them.

[0003] Solder mask is a layer of solder resist ink that covers the surface of a printed circuit board. Solder mask can play a role in insulation protection, scratch resistance and wear resistance. The most common color of solder mask is green. Printed circuit boards coated with green solder mask are commonly known as green solder mask boards. Solder mask can also be other colors, such as blue, red and black.

[0004] The general process steps for coating solder mask on printed circuit boards include pre-coating cleaning of the printed circuit board, solder mask coating, pre-baking, exposure, development, and final curing.

[0005] The pre-baking step is to evaporate the solder resist ink, so that the solder resist ink forms a semi-cured state on the printed circuit board for subsequent exposure. In addition, in order to avoid the printed circuit board from thermal expansion during the exposure step and causing misalignment, the printed circuit board after baking needs to be cooled to room temperature before exposure.

[0006] In related technologies, the pre-baking of solder resist ink on printed circuit boards is usually done using a hot air circulating oven. Specifically, the printed circuit board (hereinafter referred to as the board) coated with solder resist ink is placed on a carrier, and then the carrier containing the board is placed in a hot air circulating oven. After baking, the board is cooled to a certain temperature in the hot air circulating oven and then taken out and placed to cool to room temperature.

[0007] However, existing solder resist ink pre-baking methods require frequent heating and cooling of the hot air circulating oven during mass production, resulting in low baking efficiency. Furthermore, the boards placed statically in the hot air circulating oven are prone to uneven heating. After the boards are removed from the hot air circulating oven, they also need to occupy space to cool to room temperature, wasting space resources. Summary of the Invention

[0008] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a solder resist baking device for printed circuit boards, which can transfer the board to a cooling channel to cool it to room temperature after baking in the baking channel, so that the baking and cooling operations do not interfere with each other, avoid frequent heating and cooling, improve baking efficiency, and make the board heat evenly. Furthermore, it eliminates the need for the board to occupy additional space outside the device for cooling, saving space resources.

[0009] The present invention also proposes a method for baking the solder resist layer of a printed circuit board using the above-mentioned solder resist baking equipment.

[0010] A solder resist baking apparatus for a printed circuit board according to a first aspect embodiment of the present invention includes:

[0011] The oven has a baking channel and a cooling channel arranged vertically. A blower is provided on one side wall of the baking channel. The blower is used to blow hot air to the board along the width of the baking channel for baking. The cooling channel is used to cool the board. The baking channel has a first inlet and a first outlet at its two ends. The cooling channel has a second inlet and a second outlet at its two ends. The oven also has a transfer channel connecting the first outlet and the second inlet.

[0012] The carrier includes a support frame, a rotating frame rotatably mounted on the support frame, and a clamping mechanism mounted on the rotating frame, the clamping mechanism being used to clamp an upright plate.

[0013] A feeding device, disposed inside the box, includes a first conveying mechanism, a second conveying mechanism, and a transfer mechanism. The first conveying mechanism is used to convey the carrier through the baking channel, the second conveying mechanism is used to convey the carrier through the cooling channel, and the transfer mechanism is used to transfer the carrier from the first conveying mechanism to the second conveying mechanism.

[0014] A transmission device for driving the clamping mechanism to rotate includes a first rack and a linkage mechanism. The first rack is disposed in the baking channel and extends along the length of the baking channel. The linkage mechanism is disposed on the carrier and includes a first rotating shaft rotatably disposed on the support frame and a first gear disposed on the first rotating shaft. The first rotating shaft is perpendicular to the first rack. The rotation axis of the rotating frame is parallel to the first rack. A first bevel gear is disposed on the first rotating shaft, and a second bevel gear is disposed on the rotation axis of the rotating frame. The first bevel gear and the second bevel gear mesh and drive each other. The first rack meshes and drives the first gear.

[0015] When the feeding device drives the carrier to move in the baking channel, the first gear meshes with the first rack to drive the clamping mechanism to rotate.

[0016] A solder resist baking apparatus for printed circuit boards according to an embodiment of the present invention has at least the following beneficial effects:

[0017] 1. This invention features a baking channel and a cooling channel arranged vertically within a housing. One side wall of the baking channel is equipped with an air supply mechanism for supplying hot air to the workpiece along the width of the baking channel. The cooling channel is used to cool the workpiece. The baking channel has a first inlet and a first outlet at each end, and the cooling channel has a second inlet and a second outlet at each end. The baking chamber also has a transfer channel connecting the first outlet and the second inlet. This invention achieves two advantages: First, by utilizing the vertical space of the baking channel to arrange the cooling channel, the workpiece enters the cooling channel for cooling after baking. This integrates the previously separate baking and cooling areas into the housing, fully utilizing the unused vertical space of the baking channel and eliminating the need for additional external space for cooling, thus saving space. Second, after baking the workpiece in the baking channel, transferring it to the cooling channel for cooling to room temperature ensures that baking and cooling operations do not interfere with each other, avoiding frequent heating and cooling and improving baking efficiency.

[0018] 2. This invention, by setting up a carrier and a feeding device, with the feeding device disposed inside the box, includes a first conveying mechanism, a second conveying mechanism, and a transfer mechanism. The first conveying mechanism is used to convey the carrier through the baking channel, the second conveying mechanism is used to convey the carrier through the cooling channel, and the transfer mechanism is used to transfer the carrier from the first conveying mechanism to the second conveying mechanism. It can be understood that the feeding device drives the carrier to move continuously in the baking channel and the cooling channel, achieving the effect of automatic conveying of the carrier by the feeding device, thereby realizing continuous feeding and continuous production in the baking channel and improving production efficiency.

[0019] 3. The present invention provides an air supply mechanism on one side wall of the baking channel. The air supply mechanism is used to deliver hot air to the board along the width direction of the baking channel for baking. Thus, the air supply mechanism delivers hot air on one side along the width direction. Combined with the vertical placement of the board, the penetration path of the hot air into the board is shortened, heat loss is reduced, and thus, baking efficiency is improved.

[0020] 4. This invention incorporates a transmission device to drive the clamping mechanism to rotate. The transmission device includes a first rack and a linkage mechanism. The first rack is disposed within the baking channel and extends along the length of the baking channel. The baking channel is equipped with the first rack. The linkage mechanism is mounted on the carrier and includes a first rotating shaft rotatably mounted on the support frame and a first gear mounted on the first rotating shaft. The first rotating shaft is perpendicular to the first rack. The rotation axis of the rotating frame is parallel to the first rack. A first bevel gear is mounted on the first rotating shaft, and a second bevel gear is mounted on the rotation axis of the rotating frame. The bevel gears, the first bevel gear and the second bevel gear meshing and driving, and the first rack meshing and driving with the first gear, can be understood as follows: when the first conveying mechanism drives the carrier to move in the baking channel, the first gear and the first rack mesh and drive, so that the first gear can rotate with the movement of the carrier. Then the first gear drives the first rotating shaft to rotate, and the first rotating shaft drives the rotating frame to rotate through the meshing of the first bevel gear and the second bevel gear. Thus, the plate on the rotating frame can rotate with the movement of the carrier in the baking channel. Combined with the lateral air supply of the air supply mechanism, the hot air evenly covers the two surfaces and the surrounding area of ​​the plate, avoiding uneven heating of the plate and resulting in uneven curing of the plate.

[0021] According to some embodiments of the present invention, the clamping mechanism includes two opposing pressure bars and a first spring. The pressure bars are provided with guide rods, and the rotating frame is provided with guide holes. The guide rods slide in cooperation with the guide holes. The two ends of the first spring are respectively connected to the rotating frame and the pressure bars. The first spring is used to drive the pressure bars to move closer to the other pressure bar. The two pressure bars cooperate to clamp the plate.

[0022] And / or, the pressure strip is provided with a vertically extending V-shaped groove, which is used to limit the sides of the plate.

[0023] According to some embodiments of the present invention, there are two first racks, which are respectively located on both sides of the carrier, and the first shaft is provided with two first gears, which mesh with the two first racks respectively.

[0024] According to some embodiments of the present invention, the first conveying mechanism is disposed in the baking channel. The first conveying mechanism includes a first slide rail extending along the length direction of the baking channel, a first chain, two first sprockets rotatably disposed on the housing, and a first motor driving one of the first sprockets to rotate. The first slide rail is used to support the movement of the carrier. The two first sprockets mesh with the first chain and support and tension the first chain. A first push rod is disposed on the first chain. A first slot is disposed at the bottom of the carrier. The first push rod can be inserted into the first slot and engage with the slot wall of the first slot. The first motor drives the first chain to move so that the first push rod pushes the carrier to move on the first slide rail.

[0025] And / or, the first slide rail is provided with a first clearance groove that extends vertically through the first slide rail, and the first clearance groove is used to avoid the first chain and / or the first push rod.

[0026] According to some embodiments of the present invention, the transfer mechanism is disposed in the transfer channel. The transfer mechanism includes a vertical frame, a lifting platform that is slidably disposed on the vertical frame, a conveying component disposed on the lifting platform, and a first power component that drives the lifting platform to move up and down. The conveying component is used to drive the carrier into and out of the lifting platform. The lifting platform moves up and down to reciprocate between the first discharge port and the second inlet port.

[0027] According to some embodiments of the present invention, the conveying assembly includes a mounting frame disposed on the lifting platform, an upper roller and a lower roller rotatably disposed on the mounting frame, and a second motor for driving the upper roller or the lower roller to rotate. A first edge is provided on the side of the carrier. The first conveying mechanism is capable of conveying the carrier into the transfer mechanism so that the first edge enters between the upper roller and the lower roller. The upper roller and the lower roller clamp the first edge to drive the carrier into and out of the lifting platform.

[0028] According to some embodiments of the present invention, the conveying assembly further includes a controller and a first sensor. The first sensor is located on the side of the upper roller and the lower roller away from the first conveying mechanism. The second motor and the first sensor are electrically connected to the controller. The first sensor is used to sense the position of the carrier entering the lifting platform. After receiving the sensing signal from the first sensor, the controller controls the second motor to stop driving the upper roller or the lower roller to rotate.

[0029] According to some embodiments of the present invention, the conveying assembly further includes a second sensor located on the upper roller and the side of the upper roller near the first conveying mechanism. The second sensor is electrically connected to the controller and is used to sense the carrier output by the first conveying mechanism. After receiving the sensing signal from the second sensor, the controller controls the second motor to start before the first edge enters between the upper roller and the lower roller to drive the upper roller or the lower roller to rotate.

[0030] A method for baking the solder resist layer of a printed circuit board according to a second aspect embodiment of the present invention, applied to a solder resist layer baking apparatus for a printed circuit board according to a first aspect embodiment of the present invention, includes the following steps:

[0031] S100: Clamp the sheet metal onto the clamping mechanism of the carrier;

[0032] S200: The carrier with the clamped plate is placed on the first conveying mechanism at the first feed port, so that the rotation axis of the rotating frame is parallel to the conveying direction of the first conveying mechanism, and the first gear and the first rack are aligned and meshed. During the process of the first conveying mechanism driving the carrier to move in the baking channel, the rotating frame is driven to rotate through the linkage mechanism between the first rack and the rotating frame, and the air supply mechanism sends hot air to the plate on the carrier for baking.

[0033] S300: After the first conveying mechanism drives the carrier through the baking channel, the transfer mechanism receives the carrier output from the first discharge port and then transfers the carrier to the second inlet, and then transports the carrier to the second conveying mechanism;

[0034] S400: The second conveying mechanism drives the carrier to move to the second discharge port in the cooling channel. The plate on the carrier is cooled during the movement in the cooling channel. Finally, the second conveying mechanism outputs the plate cooled to room temperature from the second discharge port.

[0035] A method for baking the solder resist layer of a printed circuit board according to a third aspect embodiment of the present invention, applied to a solder resist layer baking apparatus for a printed circuit board according to a first aspect embodiment of the present invention, includes the following steps:

[0036] S100: Clamp the sheet metal onto the clamping mechanism of the carrier;

[0037] S200: The carrier with the clamped plate is placed on the first conveying mechanism at the first feed port, so that the rotation axis of the rotating frame is parallel to the conveying direction of the first conveying mechanism. The first push rod is inserted into the first slot, so that the first conveying mechanism pushes the carrier to move through the first push rod, and the first gear and the first rack are aligned and meshed. During the process of the first conveying mechanism driving the carrier to move in the baking channel, the linkage mechanism between the first rack and the rotating frame is used to drive the rotating frame to rotate. The air supply mechanism sends hot air to the plate on the carrier for baking.

[0038] S300: After the first conveying mechanism drives the carrier through the baking channel, the first conveying mechanism pushes the carrier between the upper and lower rollers of the transfer mechanism. Before the first edge of the carrier enters between the upper and lower rollers of the transfer mechanism, the second sensor senses the carrier and transmits the sensing signal to the controller. After receiving the sensing signal from the second sensor, the controller controls the second motor to drive the upper roller or the lower roller to rotate. When the first edge enters between the upper roller and the lower roller, the upper roller and the lower roller clamp the first edge and convey the carrier into the lifting platform. Then, the first sensor senses that the carrier has entered the position and transmits the sensing signal to the controller. After receiving the sensing signal from the first sensor, the controller controls the second motor to stop driving the upper roller or the lower roller to rotate. Then, the first power unit drives the lifting platform to descend to the second feed port. The second motor drives the upper roller and the lower roller to push the carrier into the second conveying mechanism.

[0039] S400: The second conveying mechanism drives the carrier to move to the second discharge port in the cooling channel. The plate on the carrier is cooled during the movement in the cooling channel. Finally, the second conveying mechanism outputs the plate cooled to room temperature from the second discharge port.

[0040] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the structure of a solder resist baking device for a printed circuit board according to an embodiment of the present invention;

[0043] Figure 2 for Figure 1 The diagram shows the internal structure of the box.

[0044] Figure 3 for Figure 2 The enlarged view at point A is shown;

[0045] Figure 4 for Figure 2 The diagram shows the structural design of the vehicle.

[0046] Figure 5 for Figure 2 The diagram shown is a structural schematic of a vehicle without input status.

[0047] Figure 6 for Figure 5 The enlarged view at point B is shown;

[0048] Figure 7 This is a flowchart of a method for baking the solder mask layer of a printed circuit board according to an embodiment of the present invention;

[0049] Figure 8 This is a flowchart of a method for baking the solder resist layer of a printed circuit board according to another embodiment of the present invention.

[0050] Reference numerals: 100-Box body, 110-Baking channel, 120-Cooling channel, 130-Air supply mechanism, 140-Panel, 150-First feed inlet, 160-First discharge outlet, 170-Second feed inlet, 180-Second discharge outlet, 190-Transfer channel, 200-Carrier, 210-Support frame, 220-Rotating frame, 230-Clamping mechanism, 240-First conveying mechanism, 250-Second conveying mechanism, 260-Transfer mechanism, 270-First rack, 280-Linkage mechanism, 290-First rotating shaft, 300-First gear, 310-First bevel gear, 320-Second bevel gear, 330-Pressure bar, 340-First spring, 350-Guide rod 360-V-groove, 370-First slide rail, 380-First chain, 390-First sprocket, 400-First motor, 410-First push rod, 420-First slot, 430-First clearance slot, 440-Vertical frame, 450-Lifting platform, 460-Conveying assembly, 470-First power assembly, 480-Mounting bracket, 490-Upper roller, 500-Lower roller, 510-Second motor, 520-First edge, 530-Controller, 540-First sensor, 550-Second sensor, 560-Exhaust pipe, 570-Support rod, 580-Guide part, 590-First ball bearing, 600-Limiting strip, 610-Second ball bearing, 620-Third sensor. Detailed Implementation

[0051] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0052] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0053] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, this is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0054] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0055] The following is in conjunction with the appendix Figure 1 - Appendix Figure 8 This invention describes a solder resist baking apparatus and method for a printed circuit board according to an embodiment of the present invention.

[0056] Printed circuit boards, also known as PCBs, are the carriers of integrated circuits, providing mechanical support and electrical connections for them.

[0057] Solder mask is a layer of solder resist ink that covers the surface of a printed circuit board. Solder mask can play a role in insulation protection, scratch resistance and wear resistance. The most common color of solder mask is green. Printed circuit boards coated with green solder mask are commonly known as green solder mask boards. Solder mask can also be other colors, such as blue, red and black.

[0058] The general process steps for coating solder mask on printed circuit boards include pre-coating cleaning of the printed circuit board, solder mask coating, pre-baking, exposure, development, and final curing.

[0059] The pre-baking step is to evaporate the solder resist ink, so that the solder resist ink forms a semi-cured state on the printed circuit board for subsequent exposure. In addition, in order to avoid the printed circuit board from thermal expansion during the exposure step and causing misalignment, the printed circuit board after baking needs to be cooled to room temperature before exposure.

[0060] The pre-baking temperature is usually between 75℃ and 85℃.

[0061] In related technologies, the pre-baking of solder resist ink on printed circuit boards is usually carried out using a hot air circulating oven. Specifically, the printed circuit board (hereinafter referred to as board 140) coated with solder resist ink is placed on a carrier 200, and then the carrier 200 containing board 140 is placed into a hot air circulating oven. After baking, board 140 is cooled to a certain temperature in the hot air circulating oven and then taken out and placed to cool to room temperature.

[0062] However, existing solder resist ink pre-baking methods require frequent heating and cooling of the hot air circulating oven during mass production, resulting in low baking efficiency. Furthermore, the board 140 is prone to uneven heating when placed statically in the hot air circulating oven. After the board 140 is removed from the hot air circulating oven, it still occupies space to cool to room temperature, wasting space resources.

[0063] Therefore, this invention provides an embodiment of a solder resist baking apparatus and method for printed circuit boards to solve the above-mentioned problems.

[0064] Reference Figures 1-6 The present invention provides an embodiment of a solder resist baking apparatus for printed circuit boards.

[0065] In this embodiment, a solder resist baking device for printed circuit boards mainly includes a housing 100, a carrier 200, a feeding device, and a transmission device.

[0066] Reference Figure 1 , Figure 2 and Figure 3For the box body 100, the box body 100 has a baking channel 110 and a cooling channel 120 arranged vertically. A blower mechanism 130 is provided on one side wall of the baking channel 110. The blower mechanism 130 is used to blow hot air to the plate 140 for baking along the width direction of the baking channel 110. The cooling channel 120 is used to cool the plate 140. The two ends of the baking channel 110 are respectively provided with a first inlet 150 and a first outlet 160. The two ends of the cooling channel 120 are respectively provided with a second inlet 170 and a second outlet 180. The baking box also has a transfer channel 190 connecting the first outlet 160 and the second inlet 170.

[0067] Understandably, on the one hand, by utilizing the vertical space of the baking channel 110 to arrange the cooling channel 120, the plate 140 enters the cooling channel 120 for cooling after baking in the baking channel 110. Thus, the oven and cooling area, which were originally set up separately, are integrated into the cabinet 100, making full use of the idle space in the vertical direction of the baking channel 110 and eliminating the need for the plate 140 to occupy additional space outside the device for cooling, thereby saving space resources. On the other hand, after baking the plate 140 in the baking channel 110, the plate 140 is transferred to the cooling channel 120 to cool down to room temperature, so that the baking and cooling operations do not interfere with each other, avoiding frequent heating and cooling, and improving baking efficiency.

[0068] Meanwhile, in this embodiment, an air supply mechanism 130 is provided on one side wall of the baking channel 110. The air supply mechanism 130 is used to supply hot air to the plate 140 for baking along the width direction of the baking channel 110. Thus, the air supply mechanism 130 supplies hot air on one side along the width direction. Combined with the vertical placement of the plate 140, the penetration path of the hot air to the plate 140 is shortened, heat loss is reduced, and thus, baking efficiency is improved.

[0069] Specifically, the box body 100 is rectangular in shape. The baking channel 110 and the cooling channel 120 both extend along the length of the box body 100. The first inlet 150 of the baking channel 110 and the second outlet 180 of the cooling channel 120 are located at one end of the box body 100, and the first outlet 160 of the baking channel 110 and the second inlet 170 of the cooling channel 120 are located at the other end of the box body 100. Thus, the first inlet 150 of the baking channel 110 and the second outlet 180 of the cooling channel 120 are located at the same end of the box body 100, which makes it convenient for workers to load and unload materials at one end of the box body 100, eliminating the need to set up workers at both ends of the box body 100 for loading and unloading, thereby reducing the number of personnel required for loading and unloading.

[0070] In some specific embodiments, the baking channel 110 is provided with a heat insulation layer on its four sides, which is beneficial to the heat preservation of the baking channel 110 and improves the temperature stability inside the baking channel 110.

[0071] In some specific embodiments, in order to reduce heat loss in the baking channel 110, insulated curtains can be provided at the first inlet 150 and the first outlet 160, thereby helping to prevent heat from overflowing from the first inlet 150 and the first outlet 160 in the baking channel 110.

[0072] In some specific embodiments, the air supply mechanism 130 supplies hot air from the left or right side of the baking channel 110 toward the plate 140, and an exhaust pipe 560 is provided at the top of the baking channel 110.

[0073] In some specific embodiments, the air supply mechanism 130 includes multiple air nozzles, which are arranged sequentially in the baking channel 110 along the conveying direction of the conveying device. The baking channel 110 includes a preheating section and a constant temperature section, which are arranged sequentially along the conveying direction of the conveying device. The wind speed of the multiple air nozzles in the preheating section increases sequentially along the conveying direction of the conveying device, while the wind speed of the multiple air nozzles in the constant temperature section remains constant.

[0074] Understandably, when the conveying device moves the plate 140 within the baking channel 110, the plate 140 passes through the preheating section and the constant temperature section in sequence. The preheating section delivers hot air to the plate 140 through multiple air nozzles with progressively increasing wind speeds, allowing the plate 140 to be baked in stages through a gradually heating environment. This avoids the plate 140 from suddenly entering a high-temperature environment for baking when its own temperature is low, which could cause a large number of bubbles to be generated inside the solder resist coating or result in poor appearance of the solder coating, thus improving the baking yield.

[0075] Reference Figure 4 For the carrier 200, the carrier 200 includes a support frame 210, a rotating frame 220 rotatably mounted on the support frame 210, and a clamping mechanism 230 mounted on the rotating frame 220. The clamping mechanism 230 is used to clamp the upright plate 140.

[0076] In some specific embodiments, the clamping mechanism 230 includes two opposing pressure bars 330 and a first spring 340. The pressure bars 330 are provided with guide rods 350, and the rotating frame 220 is provided with guide holes. The guide rods 350 slide in cooperation with the guide holes. The two ends of the first spring 340 are respectively connected to the rotating frame 220 and the pressure bars 330. The first spring 340 is used to drive the pressure bars 330 closer to the other pressure bar 330. The two pressure bars 330 cooperate to clamp the plate 140. Thus, the first spring 340 provides a constant clamping force to adapt to plates 140 of different thicknesses. At the same time, the guiding cooperation of the guide rods 350 and the guide holes ensures that the pressure bars 330 move in parallel, avoiding the risk of deformation caused by uneven force on the plate 140.

[0077] Furthermore, the pressure strip 330 is provided with a vertically extending V-shaped groove 360, which is used to limit the sides of the edge of the plate 140.

[0078] Understandably, the V-groove 360 ​​limits the movement of the plate on both sides, preventing the plate 140 from slipping or vibrating during rotation, thus making the plate 140 more stable on the clamping mechanism 230.

[0079] In some specific embodiments, the rotating frame 220 is provided with a support rod 570, which is perpendicular to the pressure strip 330. The support rod 570 is located at one end of the pressure strip 330 and is used to support the bottom edge of the plate 140. The end of the pressure strip 330 away from the support rod 570 is provided with a guide portion 580, which is inclined outward and is used to guide the plate 140 into the clamping area between the two pressure strips 330.

[0080] In some specific embodiments, the rotating frame 220 is provided with a plurality of clamping mechanisms 230, which are arranged along the rotation axis of the rotating frame 220, thereby enabling the carrier 200 to clamp a plurality of plates 140 at the same time, thereby increasing the loading capacity of the carrier 200.

[0081] In some specific embodiments, in order to reduce the length of the carrier 200, the plate 140 clamped on the clamping mechanism 230 is perpendicular to the rotation axis of the rotating frame 220, so that multiple plates 140 on the carrier 200 are arranged side by side along the plate surface direction.

[0082] In some specific embodiments, the distance between two adjacent clamping mechanisms 230 is not less than 50mm, thereby preventing hot air from being blocked between the two plates 140 and causing uneven heating of the plates 140.

[0083] Reference Figure 5 The feeding device is located inside the housing 100. The feeding device includes a first conveying mechanism 240, a second conveying mechanism 250, and a transfer mechanism 260. The first conveying mechanism 240 is used to convey the carrier 200 through the baking channel 110. The second conveying mechanism 250 is used to convey the carrier 200 through the cooling channel 120. The transfer mechanism 260 is used to transfer the carrier 200 from the first conveying mechanism 240 to the second conveying mechanism 250.

[0084] Understandably, the feeding device drives the carrier 200 to move continuously in the baking channel 110 and the cooling channel 120, achieving the effect of automatic conveying of the carrier 200 by the feeding device. Thus, continuous feeding and continuous production are realized in the baking channel 110, improving production efficiency.

[0085] Refer again Figure 2and Figure 3 For the transmission device, the transmission device is used to drive the clamping mechanism 230 to rotate. The transmission device includes a first rack 270 and a linkage mechanism 280. The first rack 270 is disposed in the baking channel 110 and extends along the length direction of the baking channel 110. The linkage mechanism 280 is disposed on the carrier 200. The linkage mechanism 280 includes a first rotating shaft 290 rotatably disposed on the support frame 210 and a first gear 300 disposed on the first rotating shaft 290. The first rotating shaft 290 is perpendicular to the first rack 270. The rotation axis of the rotating frame 220 is parallel to the first rack 270. A first bevel gear 310 is disposed on the first rotating shaft 290 and a second bevel gear 320 is disposed on the rotation axis of the rotating frame 220. The first bevel gear 310 and the second bevel gear 320 mesh and drive each other. The first rack 270 meshes and drives the first gear 300.

[0086] When the feeding device drives the carrier 200 to move in the baking channel 110, the first gear 300 meshes with the first rack 270 to drive the clamping mechanism 230 to rotate.

[0087] Understandably, when the first conveying mechanism 240 drives the carrier 200 to move in the baking channel 110, the first gear 300 and the first rack 270 mesh and drive each other, so that the first gear 300 can rotate with the movement of the carrier 200. Then the first gear 300 drives the first rotating shaft 290 to rotate. The first rotating shaft 290 drives the rotating frame 220 to rotate through the meshing of the first bevel gear 310 and the second bevel gear 320. Thus, the plate 140 on the rotating frame 220 can rotate with the movement of the carrier 200 in the baking channel 110. Combined with the lateral air supply of the air supply mechanism 130, the hot air evenly covers the two surfaces and the surrounding area of ​​the plate 140, avoiding uneven heating of the plate 140 and resulting in uneven local curing of the plate 140.

[0088] In some specific embodiments, there are two first racks 270, which are located on both sides of the carrier 200. The first rotating shaft 290 is provided with two first gears 300, which mesh with the two first racks 270 respectively. Thus, the double-sided meshing of the first gears 300 and the first racks 270 can offset the eccentric load torque when meshing on one side, preventing the carrier 200 from deviating or jamming.

[0089] In some specific embodiments, a first conveying mechanism 240 is disposed in the baking channel 110. The first conveying mechanism 240 includes a first slide rail 370 extending along the length of the baking channel 110, a first chain 380, two first sprockets 390 rotatably disposed on the housing 100, and a first motor 400 driving one of the first sprockets 390 to rotate. The first slide rail 370 is used to support the movement of the carrier 200. The two first sprockets 390 mesh with the first chain 380 and support and tension the first chain 380. A first push rod 410 is disposed on the first chain 380. A first slot 420 is disposed at the bottom of the carrier 200. The first push rod 410 can be inserted into the first slot 420 and engage with the slot wall of the first slot 420. The first motor 400 drives the first chain 380 to move so that the first push rod 410 pushes the carrier 200 to move on the first slide rail 370.

[0090] It is understood that in this embodiment, by setting a first push rod 410 in the first chain 380 and inserting it into the bottom slot of the carrier 200 to form a rigid connection, the carrier 200 and the first chain 380 move synchronously with zero speed difference. This ensures that the first conveying mechanism 240 has sufficient driving force to drive the carrier 200 to move while driving the plate 140 to rotate, thus avoiding the problem of insufficient driving force for the carrier 200 caused by traditional friction conveying, which leads to slippage of the carrier 200.

[0091] Furthermore, the first slide rail 370 is provided with a first clearance groove 430 that extends vertically. The first clearance groove 430 extends along the length of the first slide rail 370 and is used to avoid the first chain 380 and / or the first push rod 410.

[0092] In this embodiment, by providing a first clearance groove 430 in the first slide rail 370, the interference of the first slide rail 370 with the first chain 380 or the first push rod 410, or the interference of the first slide rail 370 with both the first chain 380 and the first push rod 410, is avoided.

[0093] In some specific embodiments, a plurality of first ball bearings 590 are provided on the first slide rail 370. The first ball bearings 590 support the movement of the carrier 200, thereby reducing the frictional resistance between the carrier 200 and the first slide rail 370, making it easier for the carrier 200 to slide on the first slide rail 370.

[0094] In some specific embodiments, two limiting strips 600 are also provided on the first slide rail 370. The two limiting strips 600 are used to limit the sides of the carrier 200 to guide the sliding of the carrier 200.

[0095] Reference Figure 5 and Figure 6In some specific embodiments, the transfer mechanism 260 is arranged in the transfer channel 190. The transfer mechanism 260 includes a vertical frame 440, a lifting platform 450 that is slidably arranged on the vertical frame 440, a conveying component 460 arranged on the lifting platform 450, and a first power component 470 that drives the lifting platform 450 to move up and down. The conveying component 460 is used to drive the carrier 200 into and out of the lifting platform 450. The lifting platform 450 moves up and down to reciprocate between the first discharge port 160 and the second inlet port 170.

[0096] It is understood that in this embodiment, the lifting platform 450 is raised and lowered by the first power component 470 to transfer the carrier 200 from the first discharge port 160 to the second inlet port 170, thus solving the docking problem caused by the height difference between the baking channel 110 and the cooling channel 120.

[0097] Specifically, the conveying assembly 460 includes a mounting bracket 480 mounted on the vertical frame 440, an upper roller 490 and a lower roller 500 rotatably mounted on the lifting platform 450, and a second motor 510 for driving the upper roller 490 or the lower roller 500 to rotate. A first edge 520 is provided on the side of the carrier 200. The first conveying mechanism 240 can convey the carrier 200 into the transfer mechanism 260 so that the first edge 520 enters between the upper roller 490 and the lower roller 500. The upper roller 490 and the lower roller 500 clamp the first edge 520 to drive the carrier 200 into and out of the lifting platform 450.

[0098] It is understood that in this embodiment, the first edge 520 is clamped between the upper roller 490 and the lower roller 500 to transport the carrier 200. Thus, the carrier 200 is moved by the friction between the upper roller 490 and the lower roller 500 and the first edge 520. The carrier 200 can be gripped by the conveying component 460 as long as the first edge 520 enters the gap between the upper roller 490 and the lower roller 500, which reduces the gripping and positioning requirements. At the same time, the upper roller 490 and the lower roller can both transport the carrier 200 and position the carrier 200, which simplifies the structure of the conveying component 460.

[0099] In some specific embodiments, the conveying assembly 460 further includes a controller 530 and a first sensor 540. The first sensor 540 is located on the side of the upper roller 490 and the lower roller 500 away from the first conveying mechanism 240. The second motor 510 and the first sensor 540 are electrically connected to the controller 530. The first sensor 540 is used to sense the position of the carrier 200 entering the lifting platform 450. After receiving the sensing signal from the first sensor 540, the controller 530 controls the second motor 510 to stop driving the upper roller 490 or the lower roller 500 to rotate.

[0100] It is understood that, in this embodiment, by setting a first sensor 540 and a controller 530, the first sensor 540 can sense and detect the positioning status of the vehicle 200 on the lifting platform 450 in real time, accurately triggering the second motor 510 to stop, so as to prevent the vehicle 200 from colliding with other structures or falling off the lifting platform 450.

[0101] In some specific embodiments, the conveying assembly 460 further includes a second sensor 550, which is located on the upper roller 490 and on the side of the upper roller 490 close to the first conveying mechanism 240. The second sensor 550 is electrically connected to the controller 530 and is used to sense the carrier 200 output by the first conveying mechanism 240. After receiving the sensing signal from the second sensor 550, the controller 530 controls the second motor 510 to start before the first edge 520 enters between the upper roller 490 and the lower roller 500 to drive the upper roller 490 or the lower roller 500 to rotate.

[0102] It is understood that in this embodiment, by setting a second sensor 550, the second sensor 550 senses and detects the carrier 200 before the first edge 520 of the carrier 200 enters the gap between the upper roller 490 and the lower roller 500. This allows the controller 530 to control the start of the second motor 510 before the carrier 200 enters the gap between the upper roller 490 and the lower roller 500, so that the upper roller 490 or the lower roller 500 can reach the working speed before the first edge 520 is reached. This eliminates the conveying delay caused by the acceleration phase and makes the transfer of the carrier 200 between the first conveying mechanism 240 and the transfer mechanism 260 more stable.

[0103] In some specific embodiments, the conveying assembly 460 may also include a third sensor 620. The third sensor 620 is located at the bottom of the transfer channel 190 and is electrically connected to the controller 530. The third sensor 620 is used to sense whether the lifting platform 450 is aligned with the second conveying mechanism 250 when the lifting platform 450 descends. When the third sensor 620 senses that the lifting platform 450 is aligned with the second conveying mechanism 250, the third sensor 620 transmits the sensing signal to the controller 530. After receiving the sensing signal from the third sensor 620, the controller 530 controls the second motor 510 to drive the upper roller 490 or the lower roller 500 to rotate in the opposite direction, so that the upper roller 490 and the lower roller 500 cooperate to push the carrier 200 into the second sensor 550.

[0104] In some specific embodiments, the first power assembly 470 may include a third motor and an upright first screw. The first screw is rotatably connected to the housing 100 and threadedly connected to the lifting platform 450. The third motor is fixed on the housing 100 and is used to drive the first screw to rotate, thereby driving the lifting platform 450 to rise and fall.

[0105] In some other specific embodiments, the first power assembly 470 may include a first cylinder, which is fixed on the housing 100. The telescopic rod of the first cylinder is connected to the lifting platform 450, and the first cylinder drives the lifting platform 450 to rise and fall.

[0106] In some specific embodiments, the lifting platform 450 is provided with a plurality of second ball bearings 610, which are used to support the sliding of the carrier 200, thereby reducing the frictional resistance between the carrier 200 and the lifting platform 450, making the sliding of the carrier 200 on the lifting platform 450 more effortless.

[0107] In some specific embodiments, the second conveying mechanism 250 can be configured as a conventional conveyor line, such as a high-temperature resistant conveyor belt or a conveyor chain, which will not be described in detail here.

[0108] Reference Figure 7 This invention provides an embodiment of a method for baking the solder resist layer of a printed circuit board, applied to a solder resist layer baking device for a printed circuit board according to this invention, comprising the following steps:

[0109] S100: The plate 140 is clamped onto the clamping mechanism 230 of the carrier 200.

[0110] S200: The carrier 200 with the clamped plate 140 is placed on the first conveying mechanism 240 at the first feed port 150, so that the rotation axis of the rotating frame 220 is parallel to the conveying direction of the first conveying mechanism 240, and the first gear 300 and the first rack 270 are aligned and meshed. During the process of the first conveying mechanism 240 driving the carrier 200 to move in the baking channel 110, the linkage mechanism 280 between the first rack 270 and the rotating frame 220 is used to drive the rotating frame 220 to rotate. The air supply mechanism 130 sends hot air to the plate 140 on the carrier 200 for baking.

[0111] S300: After the first conveying mechanism 240 drives the carrier 200 through the baking channel 110, the transfer mechanism 260 receives the carrier 200 output from the first discharge port 160 and then transfers the carrier 200 to the second feed port 170, and then transports the carrier 200 to the second conveying mechanism 250.

[0112] S400: The second conveying mechanism 250 drives the carrier 200 to move to the second discharge port 180 within the cooling channel 120. The plate 140 on the carrier 200 is cooled during the movement of the cooling channel 120. Finally, the second conveying mechanism 250 outputs the plate 140 cooled to room temperature from the second discharge port 180.

[0113] This embodiment enables continuous production of the baking equipment by allowing the plate 140 to complete baking and cooling in continuous motion, which is beneficial to improving production efficiency.

[0114] In this embodiment, by setting the transmission between the first rack 270 and the linkage mechanism 280, the carrier 200 moves in the baking channel 110 and simultaneously drives the plate 140 to rotate. Combined with the air supply mechanism 130 sending hot air to the plate 140 on the carrier 200 for baking, it is beneficial to improve the heating uniformity of the plate 140.

[0115] In some specific embodiments, the air supply mechanism 130 includes multiple air nozzles, which are arranged sequentially in the baking channel 110 along the conveying direction of the conveying device. The baking channel 110 includes a preheating section and a constant temperature section, which are arranged sequentially along the conveying direction of the conveying device. The wind speed of the multiple air nozzles in the preheating section increases sequentially along the conveying direction of the conveying device, while the wind speed of the multiple air nozzles in the constant temperature section remains constant.

[0116] Specifically, the length ratio of the preheating section to the constant temperature section is 3:5.

[0117] Let the length of the baking channel 110 be L, and the wind speed of the air nozzle in the constant temperature section be X.

[0118] The air velocity y at the air nozzle located at position a in the preheating section satisfies the following formula:

[0119] ,in, , where 'a' is the distance from the starting point of the preheating section.

[0120] Understandably, when the conveying device moves the plate 140 within the baking channel 110, the plate 140 passes through the preheating section and the constant temperature section in sequence. The preheating section delivers hot air to the plate 140 through multiple air nozzles with progressively increasing wind speeds, allowing the plate 140 to be baked in stages through a gradually heating environment. This avoids the plate 140 from suddenly entering a high-temperature environment for baking when its own temperature is low, which could cause a large number of bubbles to be generated inside the solder resist coating or result in poor appearance of the solder coating, thus improving the baking yield.

[0121] Reference Figure 8 The present invention also provides another embodiment of the solder resist baking method for printed circuit boards, which is applied to a solder resist baking device for printed circuit boards according to the present invention, and includes the following steps:

[0122] S100: The plate 140 is clamped onto the clamping mechanism 230 of the carrier 200.

[0123] S200: The carrier 200 with the clamped plate 140 is placed on the first conveying mechanism 240 at the first feed port 150, so that the rotation axis of the rotating frame 220 is parallel to the conveying direction of the first conveying mechanism 240. The first push rod 410 is inserted into the first slot 420, so that the first conveying mechanism 240 pushes the carrier 200 to move through the first push rod 410, and aligns and meshes the first gear 300 and the first rack 270. During the process of the first conveying mechanism 240 driving the carrier 200 to move in the baking channel 110, the linkage mechanism 280 between the first rack 270 and the rotating frame 220 drives the rotating frame 220 to rotate. The air supply mechanism 130 sends hot air to the plate 140 on the carrier 200 for baking.

[0124] S300: After the first conveying mechanism 240 drives the carrier 200 through the baking channel 110, the first conveying mechanism 240 pushes the carrier 200 between the upper roller 490 and the lower roller 500 of the transfer mechanism 260. Before the first edge 520 of the carrier 200 enters the space between the upper roller 490 and the lower roller 500 of the transfer mechanism 260, the second sensor 550 senses the carrier 200 and transmits the sensing signal to the controller 530. After receiving the sensing signal from the second sensor 550, the controller 530 controls the second motor 510 to drive the upper roller 490 or the lower roller 500 to rotate. When the first edge 520 enters the space between the upper roller 490 and the lower roller 500... When the upper roller 490 and the lower roller 500 are between the upper roller 490 and the lower roller 500, the upper roller 490 and the lower roller 500 clamp the first edge 520 and transport the carrier 200 into the lifting platform 450. Then, the first sensor 540 senses that the carrier 200 has entered the position and transmits the sensing signal to the controller 530. After receiving the sensing signal from the first sensor 540, the controller controls the second motor 510 to stop driving the upper roller 490 or the lower roller 500 to rotate. Then, the first power unit 470 drives the lifting platform 450 to descend to the second feed port 170. The second motor 510 drives the upper roller 490 and the lower roller 500 to push the carrier 200 into the second conveying mechanism 250.

[0125] S400: The second conveying mechanism 250 drives the carrier 200 to move to the second discharge port 180 within the cooling channel 120. The plate 140 on the carrier 200 is cooled during the movement of the cooling channel 120. Finally, the second conveying mechanism 250 outputs the plate 140 cooled to room temperature from the second discharge port 180.

[0126] This embodiment enables continuous production of the baking equipment by allowing the plate 140 to complete baking and cooling in continuous motion, which is beneficial to improving production efficiency.

[0127] In this embodiment, by setting the transmission between the first rack 270 and the linkage mechanism 280, the carrier 200 moves in the baking channel 110 and simultaneously drives the plate 140 to rotate. Combined with the air supply mechanism 130 sending hot air to the plate 140 on the carrier 200 for baking, it is beneficial to improve the heating uniformity of the plate 140.

[0128] This embodiment utilizes the coordinated control of the second motor 510 by setting up a first sensor 540, a second sensor 550, and a controller 530. The second sensor 550 can detect the carrier 200 before the first edge 520 enters the space between the upper roller 490 and the lower roller 500, triggering the controller 530 to pre-start either the upper roller 490 or the lower roller 500. This allows the upper roller 490 or the lower roller 500 to reach its operating speed before the first edge 520 arrives, eliminating the conveying delay caused by the acceleration phase. This makes the transfer of the carrier 200 between the first conveying mechanism 240 and the transfer mechanism 260 more stable. Furthermore, the first sensor 540 uses real-time sensing to detect the carrier 200's position on the lifting platform 450, accurately triggering the second motor 510 to stop, preventing the carrier 200 from colliding with other structures or detaching from the lifting platform 450.

[0129] In some specific embodiments, the air supply mechanism 130 includes multiple air nozzles, which are arranged sequentially in the baking channel 110 along the conveying direction of the conveying device. The baking channel 110 includes a preheating section and a constant temperature section, which are arranged sequentially along the conveying direction of the conveying device. The wind speed of the multiple air nozzles in the preheating section increases sequentially along the conveying direction of the conveying device, while the wind speed of the multiple air nozzles in the constant temperature section remains constant.

[0130] Specifically, the length ratio of the preheating section to the constant temperature section is 3:5.

[0131] Let the length of the baking channel 110 be L, and the wind speed of the air nozzle in the constant temperature section be X.

[0132] The air velocity y at the air nozzle located at position a in the preheating section satisfies the following formula:

[0133] ,in, , where 'a' is the distance from the starting point of the preheating section.

[0134] Understandably, when the conveying device moves the plate 140 within the baking channel 110, the plate 140 passes through the preheating section and the constant temperature section in sequence. The preheating section delivers hot air to the plate 140 through multiple air nozzles with progressively increasing wind speeds, allowing the plate 140 to be baked in stages through a gradually heating environment. This avoids the plate 140 from suddenly entering a high-temperature environment for baking when its own temperature is low, which could cause a large number of bubbles to be generated inside the solder resist coating or result in poor appearance of the solder coating, thus improving the baking yield.

[0135] In the description of this specification, the references to terms such as "an embodiment, some embodiments, illustrative embodiments, example, specific example, or examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0136] The terms "first," "second," "third," "fourth," etc. (if applicable) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein.

[0137] It should also be noted that, in the description of this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0138] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may also include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or apparatus.

[0139] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0140] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A solder resist baking device for printed circuit boards, characterized in that, include: The oven body has a baking channel and a cooling channel arranged vertically. A blower mechanism is provided on one side wall of the baking channel. The blower mechanism is used to blow hot air to the board along the width of the baking channel for baking. The cooling channel is used to cool the board. The two ends of the baking channel have a first inlet and a first outlet, respectively. The two ends of the cooling channel have a second inlet and a second outlet, respectively. The baking equipment also has a transfer channel connecting the first outlet and the second inlet. The carrier includes a support frame, a rotating frame rotatably mounted on the support frame, and a clamping mechanism mounted on the rotating frame, the clamping mechanism being used to clamp an upright plate. A feeding device, disposed inside the box, includes a first conveying mechanism, a second conveying mechanism, and a transfer mechanism. The first conveying mechanism is used to convey the carrier through the baking channel, the second conveying mechanism is used to convey the carrier through the cooling channel, and the transfer mechanism is used to transfer the carrier from the first conveying mechanism to the second conveying mechanism. A transmission device for driving the clamping mechanism to rotate includes a first rack and a linkage mechanism. The first rack is disposed in the baking channel and extends along the length of the baking channel. The linkage mechanism is disposed on the carrier and includes a first rotating shaft rotatably disposed on the support frame and a first gear disposed on the first rotating shaft. The first rotating shaft is perpendicular to the first rack. The rotation axis of the rotating frame is parallel to the first rack. A first bevel gear is disposed on the first rotating shaft, and a second bevel gear is disposed on the rotation axis of the rotating frame. The first bevel gear and the second bevel gear mesh and drive each other. The first rack meshes and drives the first gear. When the feeding device drives the carrier to move in the baking channel, the first gear meshes with the first rack to drive the clamping mechanism to rotate.

2. The solder resist baking equipment for printed circuit boards according to claim 1, characterized in that, The clamping mechanism includes two opposing pressure bars and a first spring. The pressure bars are provided with guide rods, and the rotating frame is provided with guide holes. The guide rods slide in cooperation with the guide holes. The two ends of the first spring are respectively connected to the rotating frame and the pressure bars. The first spring is used to drive the pressure bars to move closer to the other pressure bar. The two pressure bars cooperate to clamp the plate. And / or, the pressure strip is provided with a vertically extending V-shaped groove, which is used to limit the sides of the plate.

3. The solder resist baking equipment for printed circuit boards according to claim 1, characterized in that, There are two first racks, which are located on both sides of the vehicle. The first shaft is provided with two first gears, which mesh with the two first racks respectively.

4. The solder resist baking equipment for printed circuit boards according to claim 1, characterized in that, The first conveying mechanism is disposed in the baking channel. The first conveying mechanism includes a first slide rail extending along the length direction of the baking channel, a first chain, two first sprockets rotatably disposed on the housing, and a first motor driving one of the first sprockets to rotate. The first slide rail is used to support the movement of the carrier. The two first sprockets mesh with the first chain and support and tension the first chain. A first push rod is disposed on the first chain. A first slot is disposed at the bottom of the carrier. The first push rod can be inserted into the first slot and engage with the slot wall of the first slot. The first motor drives the first chain to move so that the first push rod pushes the carrier to move on the first slide rail. And / or, the first slide rail is provided with a first clearance groove that extends vertically through the first slide rail, and the first clearance groove is used to avoid the first chain and / or the first push rod.

5. The solder resist baking equipment for printed circuit boards according to claim 1, characterized in that, The transfer mechanism is located in the transfer channel. The transfer mechanism includes a vertical frame, a lifting platform that slides up and down on the vertical frame, a conveying component located on the lifting platform, and a first power component that drives the lifting platform to move up and down. The conveying component is used to drive the carrier into and out of the lifting platform. The lifting platform moves up and down to reciprocate between the first discharge port and the second inlet port.

6. The solder resist baking equipment for printed circuit boards according to claim 5, characterized in that, The conveying assembly includes a mounting frame disposed on the lifting platform, an upper roller and a lower roller rotatably disposed on the mounting frame, and a second motor for driving the upper roller or the lower roller to rotate. A first edge is provided on the side of the carrier. The first conveying mechanism can convey the carrier into the transfer mechanism so that the first edge enters between the upper roller and the lower roller. The upper roller and the lower roller clamp the first edge to drive the carrier into and out of the lifting platform.

7. The solder resist baking equipment for printed circuit boards according to claim 6, characterized in that, The conveying assembly further includes a controller and a first sensor. The first sensor is located on the side of the upper roller and the lower roller away from the first conveying mechanism. The second motor and the first sensor are electrically connected to the controller. The first sensor is used to sense the position of the vehicle entering the lifting platform. After receiving the sensing signal from the first sensor, the controller controls the second motor to stop driving the upper roller or the lower roller to rotate.

8. The solder resist baking equipment for printed circuit boards according to claim 7, characterized in that, The conveying assembly further includes a second sensor located on the upper roller and the side of the upper roller near the first conveying mechanism. The second sensor is electrically connected to the controller and is used to sense the carrier output by the first conveying mechanism. After receiving the sensing signal from the second sensor, the controller controls the second motor to start before the first edge enters between the upper roller and the lower roller to drive the upper roller or the lower roller to rotate.

9. A method for baking the solder resist layer of a printed circuit board, characterized in that, A solder resist baking apparatus for a printed circuit board according to any one of claims 1-3 includes the following steps: S100: Clamp the sheet metal onto the clamping mechanism of the carrier; S200: The carrier with the clamped plate is placed on the first conveying mechanism at the first feed port, so that the rotation axis of the rotating frame is parallel to the conveying direction of the first conveying mechanism, and the first gear and the first rack are aligned and meshed. During the process of the first conveying mechanism driving the carrier to move in the baking channel, the rotating frame is driven to rotate through the linkage mechanism between the first rack and the rotating frame, and the air supply mechanism sends hot air to the plate on the carrier for baking. S300: After the first conveying mechanism drives the carrier through the baking channel, the transfer mechanism receives the carrier output from the first discharge port and then transfers the carrier to the second inlet, and then transports the carrier to the second conveying mechanism; S400: The second conveying mechanism drives the carrier to move to the second discharge port in the cooling channel. The plate on the carrier is cooled during the movement in the cooling channel. Finally, the second conveying mechanism outputs the plate cooled to room temperature from the second discharge port.

10. A method for baking the solder resist layer of a printed circuit board, characterized in that, The solder resist baking equipment applied to the printed circuit board according to claim 8 includes the following steps: S100: Clamp the sheet metal onto the clamping mechanism of the carrier; S200: The carrier with the clamped plate is placed on the first conveying mechanism at the first feed port, so that the rotation axis of the rotating frame is parallel to the conveying direction of the first conveying mechanism. The first push rod is inserted into the first slot, so that the first conveying mechanism pushes the carrier to move through the first push rod, and the first gear and the first rack are aligned and meshed. During the process of the first conveying mechanism driving the carrier to move in the baking channel, the linkage mechanism between the first rack and the rotating frame is used to drive the rotating frame to rotate. The air supply mechanism sends hot air to the plate on the carrier for baking. S300: After the first conveying mechanism drives the carrier through the baking channel, the first conveying mechanism pushes the carrier between the upper and lower rollers of the transfer mechanism. Before the first edge of the carrier enters between the upper and lower rollers of the transfer mechanism, the second sensor senses the carrier and transmits the sensing signal to the controller. After receiving the sensing signal from the second sensor, the controller controls the second motor to drive the upper roller or the lower roller to rotate. When the first edge enters between the upper roller and the lower roller, the upper roller and the lower roller clamp the first edge and convey the carrier into the lifting platform. Then, the first sensor senses that the carrier has entered the position and transmits the sensing signal to the controller. After receiving the sensing signal from the first sensor, the controller controls the second motor to stop driving the upper roller or the lower roller to rotate. Then, the first power unit drives the lifting platform to descend to the second feed port. The second motor drives the upper roller and the lower roller to push the carrier into the second conveying mechanism. S400: The second conveying mechanism drives the carrier to move to the second discharge port in the cooling channel. The plate on the carrier is cooled during the movement in the cooling channel. Finally, the second conveying mechanism outputs the plate cooled to room temperature from the second discharge port.

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