Wafer cleaning device and wafer thinning equipment comprising same

Abstract

The invention provides a wafer cleaning device and wafer thinning equipment comprising the same. The wafer cleaning device comprises a plurality of clamping rotating wheels used for clamping and limiting a wafer to be cleaned; the back cleaning rolling brush assembly comprises a back cleaning rolling brush and a back cleaning rolling brush support, the back cleaning rolling brush is installed on the back cleaning rolling brush support, and the back cleaning rolling brush support is used for supporting the back cleaning rolling brush and enabling the back cleaning rolling brush to be attached to the back of the wafer. The back cleaning rolling brush is a segmented rolling brush passing through the circle center of the wafer and is composed of a first rolling brush half part and a second rolling brush half part which are independent, and when the back of the wafer is cleaned, the first rolling brush half part and the second rolling brush half part are opposite in rotation direction. The wafer back cleaning device is suitable for cleaning the back of the wafer after the dicing process, cleaning of the back of the wafer and the cleaning device can be achieved, and damage of the cleaning device to the wafer is reduced.

Description

[0001] This application is a divisional of the application for patent with application number 202411849228.8, titled "Wafer cleaning device and wafer thinning equipment comprising the same", filed on December 16, 2024. TECHNICAL FIELD

[0002] The present application relates to the field of semiconductor manufacturing; more particularly, the present application relates to a wafer cleaning device and wafer thinning equipment comprising the same. BACKGROUND

[0003] After the scribe process is completed, the wafer needs to be cleaned on the back after edge thinning. The main contaminants (silicon slurry) on the back of the wafer after the scribe process are mainly distributed at the edge and bottom positions of the wafer. Since the contaminants cannot be removed during the handling process, residual contaminants are formed during the process of clamping the wafer with the clamping runner. During the back cleaning process, the residual contaminants clamped between the wafer and the clamping runner will be ground with each other due to the rotation of the clamping runner and the wafer, causing scratches on the wafer and wear on the clamping runner. SUMMARY

[0004] Therefore, the present application provides a wafer cleaning device and wafer thinning equipment comprising the same, so as to solve or at least alleviate one or more of the above-mentioned problems and other aspects in the prior art.

[0005] In order to achieve the foregoing purposes, the first aspect of the present application provides a wafer cleaning device, wherein the wafer cleaning device comprises:

[0006] a plurality of clamping runners for clamping and limiting the wafer to be cleaned; and

[0007] a back cleaning roller brush assembly comprising a back cleaning roller brush and a back cleaning roller brush support, the back cleaning roller brush being installed on the back cleaning roller brush support, the back cleaning roller brush support being used to support the back cleaning roller brush and fit the back cleaning roller brush with the back of the wafer,

[0008] wherein the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of independent first and second roller brush halves, and the first and second roller brush halves rotate in opposite directions during wafer back cleaning.

[0009] In the wafer cleaning device as described above, optionally, the back cleaning roller brush extends over the entire length of the back cleaning roller brush support, the first and second roller brush halves move in opposite directions with the wafer positions contacted by the first and second roller brush halves respectively, and the length of the first roller brush half is greater than the length of the second roller brush half.

[0010] In the wafer cleaning device as described above, optionally, the wafer cleaning device further comprises an edge cleaning brush assembly, the edge cleaning brush assembly comprising an edge cleaning brush and an edge cleaning brush support, the edge cleaning brush being mounted on the edge cleaning brush support, the edge cleaning brush support being used to support the edge cleaning brush and to fit the edge cleaning brush with the edge of the wafer.

[0011] In the wafer cleaning device as described above, optionally, the back cleaning brush support and the edge cleaning brush support are integrally formed in a cross shape, the edge cleaning brush comprising a first edge cleaning brush and a second edge cleaning brush, the first edge cleaning brush and the second edge cleaning brush being respectively arranged at two ends of the edge cleaning brush support.

[0012] In the wafer cleaning device as described above, optionally, the edge cleaning brush is movably mounted at the end of the edge cleaning brush support, the rotating direction of the edge cleaning brush being opposite to the rotating direction of the wafer, and: when the wafer edge cleaning is performed, the edge cleaning brush fits with the edge of the wafer; when the wafer edge cleaning is finished, the edge cleaning brush is separated from the edge of the wafer.

[0013] In the wafer cleaning device as described above, optionally, the edge cleaning brush comprises a first edge cleaning brush and a second edge cleaning brush, the first edge cleaning brush and the second edge cleaning brush being respectively pivotally connected at two ends of the edge cleaning brush support, the clamping cleaning contact points of the first edge cleaning brush and the second edge cleaning brush being connected through the center of the wafer, and the first edge cleaning brush and the second edge cleaning brush are respectively connected with a wafer edge cleaning brush sleeve rod and a wafer edge cleaning brush guide rod, the wafer edge cleaning brush sleeve rod being sleeved with the wafer edge cleaning brush guide rod and being capable of relative movement under the drive of a wafer edge cleaning brush cylinder, so as to respectively drive the first edge cleaning brush and the second edge cleaning brush to switch between fitting with the edge of the wafer and being separated from the edge of the wafer.

[0014] In the wafer cleaning device as described above, optionally:

[0015] The first end of the edge cleaning brush support is provided with a first lever, the upper end of the first lever being fixed with the first edge cleaning brush, the lower end of the first lever being pivotally connected to the outer end of the wafer edge cleaning brush sleeve rod, the second end of the edge cleaning brush support being provided with a second lever, the upper end of the second lever being fixed with the second edge cleaning brush, the lower end of the second lever being pivotally connected to the outer end of the wafer edge cleaning brush guide rod.

[0016] In the wafer cleaning device as described above, optionally, the wafer cleaning device has a mounting base plate, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base plate through a cleaning mechanism support seat.

[0017] In the wafer cleaning device as described above, optionally, the plurality of clamping rollers include a first clamping roller, a second clamping roller, a third clamping roller and a fourth clamping roller, the first clamping roller and the second clamping roller are respectively mounted on a first support cross arm, the third clamping roller and the fourth clamping roller are respectively mounted on a second support cross arm, the first support cross arm and the second support cross arm are respectively mounted on a first wafer clamping mechanism bearing slide and a second wafer clamping mechanism bearing slide in a self-adaptive torsion adjusting manner, the first wafer clamping mechanism bearing slide and the second wafer clamping mechanism bearing slide are slidably connected to a clamping guide rail, the clamping guide rail is fixed on the mounting base plate, and the first wafer clamping mechanism bearing slide and the second wafer clamping mechanism bearing slide are respectively located on both sides of the cleaning mechanism support seat and move towards each other along the clamping guide rail under the action of a clamping cylinder to clamp and position the wafer.

[0018] In the wafer cleaning device as described above, optionally, the first clamping roller and the second clamping roller are slidably mounted on the first support cross arm through a first roller support, and the third clamping roller and the fourth clamping roller are slidably mounted on the second support cross arm through a second roller support.

[0019] In the wafer cleaning device as described above, optionally, a guide rail protective cover is arranged on the clamping guide rail between the cleaning mechanism support seat and the first wafer clamping mechanism bearing slide and between the cleaning mechanism support seat and the second wafer clamping mechanism bearing slide.

[0020] In the wafer cleaning device as described above, optionally, the cleaning mechanism support seat is in an inverted U shape, and the clamping guide rail passes through the cleaning mechanism support seat between the two legs of the inverted U shape.

[0021] In the wafer cleaning device as described above, optionally, the wafer cleaning device further comprises a wheel edge cleaning mechanism arranged at each clamping roller for cleaning the clamping roller.

[0022] In the wafer cleaning device as described above, optionally, the wheel edge cleaning mechanism includes a wheel edge spray pipe having a curved portion facing the clamping roller, a plurality of nozzles are arranged on the side of the curved portion close to the clamping roller, and the spray directions of the nozzles converge to the clamping portion of the clamping roller.

[0023] In the wafer cleaning apparatus described above, optionally, the wafer cleaning apparatus is equipped with two wheel-side nozzles for each of the clamping rollers, which clean the clamping rollers at different angle positions.

[0024] To achieve the aforementioned objective, a second aspect of the present invention provides a wafer thinning apparatus, wherein the wafer thinning apparatus has a wafer cleaning apparatus as described in any one of the preceding first aspects.

[0025] This invention is applicable to the back cleaning of wafers after the dicing process, and can achieve cleaning of both the back of the wafer and the cleaning device itself, thereby reducing the damage to the wafer caused by the cleaning device itself.

[0026] In some technical solutions of the present invention, a segmented bottom roller brush is used to clean the back of the wafer. By using a combination of axially opposite forward and reverse roller brushes to adapt to the wafer's rotation direction, it is possible to achieve efficient cleaning of the bottom of the wafer.

[0027] In a further technical solution of the present invention, the wafer contour can be cleaned by an edge cleaning roller brush.

[0028] In a further technical solution of the present invention, the clamping wheel can be self-cleaned by a side wheel cleaning mechanism to prevent contamination particles from scratching the outer contour of the wafer after the clamping wheel is contaminated. Attached Figure Description

[0029] The disclosure of this invention will become more apparent from the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings:

[0030] Figure 1 A schematic perspective view of one embodiment of the wafer cleaning apparatus according to the present invention is shown;

[0031] Figure 2 yes Figure 1 A schematic perspective view of a wafer cleaning apparatus, showing wafers to be cleaned in situ;

[0032] Figure 3 yes Figure 1 A schematic side view of the wafer cleaning unit;

[0033] Figure 4 yes Figure 3 A partial side sectional view of the back cleaning roller and edge cleaning roller of the wafer cleaning unit cleaning wafer;

[0034] Figure 5 yes Figure 1 A schematic diagram of the wheel-side cleaning mechanism of the wafer cleaning device, which also shows a partial enlarged view of the wheel-side nozzle;

[0035] Figures 6 to 8 schematically shows Figure 1 the state change process of the edge cleaning brush assembly of the wafer cleaning device; and

[0036] Figure 9 and Figure 10 a schematic diagram showing the influence of the relative motion direction of the wafer and the cleaning brush on the cleaning effect.

[0037] Reference signs: 1-wafer cleaning device; 2-clamping rotary wheel; 3-wafer; 4-back cleaning brush assembly; 5-back cleaning brush; 51-first brush half; 52-second brush half; 6-back cleaning brush support; 7-edge cleaning brush assembly; 8-edge cleaning brush; 81-first edge cleaning brush; 82-second edge cleaning brush; 9-edge cleaning brush support; 10-wafer edge cleaning brush sleeve rod; 11-wafer edge cleaning brush guide rod; 12-wafer edge cleaning brush cylinder; 13-mounting bottom plate; 14-cleaning mechanism support seat; 15-first support cross arm; 16-second support cross arm; 17-first wafer clamping mechanism bearing slide block; 18-second wafer clamping mechanism bearing slide block; 19-clamping guide rail; 20-clamping cylinder; 21-first clamping rotary wheel; 22-second clamping rotary wheel; 23-third clamping rotary wheel; 24-fourth clamping rotary wheel; 27-rail guard cover; 28-wheel edge cleaning mechanism; 29-bent part; 30-nozzle; 31-wheel edge nozzle fixing seat; 32-rotary wheel support; 33-clamping rotary wheel motor assembly; 34-clamping cylinder support; 35-self-adaptive torsion adjusting disc; 36-first brush half motor assembly; 37-second brush half motor assembly; 38-back cleaning brush assembly cylinder; 39-first lever. DETAILED DESCRIPTION

[0038] With reference to the drawings and specific embodiments, the structure, composition, features and advantages of the wafer cleaning device of the present application and the wafer thinning equipment comprising the same will be described in an exemplary manner below, however, all the descriptions shall not be used to form any limitation on the present application.

[0039] For any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or implied in the drawings, the present application still allows any combination or deletion to be continued between these technical features (or their equivalents) without any technical obstacles, so it should be considered that more embodiments according to the present application are also within the scope of the description herein.

[0040] Furthermore, the terms "first", "second", etc. are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or an ordered sequence. Thus, features having a "first", "second" designation can implicitly or explicitly comprise at least one of each such feature.

[0041] The present application relates to the back cleaning of wafers after a scribe process. The back of a wafer is contaminated by silicon slurry after a scribe process. The present application uses a segmented bottom brush mechanism to clean the back of the wafer. The brush mechanism is composed of axially opposite brushes that rotate in opposite directions to adapt to the self-rotation direction of the wafer, thereby efficiently cleaning the bottom of the wafer. The wafer edge cleaning mechanism can be used to clean the profile of the wafer. The clamping rotary wheel side edge cleaning mechanism can be used to clean the clamping rotary wheel, thereby preventing the clamping rotary wheel from being contaminated and scratching the wafer profile, thereby achieving the cleaning of the back of the wafer and the cleaning device itself, and reducing the damage of the cleaning device itself to the wafer.

[0042] Figure 1 A schematic perspective view of an embodiment of a wafer cleaning device according to the present application is shown. Figure 2 Figure 1 A schematic perspective view of a wafer cleaning device according to the present application is shown, wherein a wafer to be cleaned is shown in position.

[0043] As shown in the figure, the wafer cleaning device 1 comprises a plurality of clamping rotary wheels 2, a back cleaning brush assembly 4, an edge cleaning brush assembly 7, and a wheel edge cleaning mechanism 28, which are all mounted on a mounting base plate 13.

[0044] When the wafer cleaning device is used to clean the back of a wafer, the plurality of clamping rotary wheels 2 hold the wafer 3 in position and drive the wafer 3 to rotate, the back cleaning brush assembly 4 cleans the back of the wafer, the edge cleaning brush assembly cleans the edge of the wafer, and the wheel edge cleaning mechanism cleans the clamping rotary wheel. The plurality of clamping rotary wheels 2 are in the same plane. When cleaning, the relative rotation direction between each rotary cleaning mechanism and the wafer is set such that, at the contact between each rotary cleaning mechanism and the back of the wafer, the movement direction of the contact point of each rotary cleaning mechanism and the contact point of the back of the wafer is opposite. In the illustrated example, the rotary cleaning mechanisms include a back cleaning brush, an edge cleaning brush, etc. The wafer cleaning device can effectively and quickly remove contaminants from the clamping rotary wheel and the wafer dead angle position, effectively prevent and avoid scratching and wear of the wafer edge and the clamping rotary wheel group, reduce the replacement frequency of the clamping rotary wheel group, and improve the yield of the wafer.

[0045] As can be seen from the figure, the clamping rotary wheel 2 is used to clamp and position the wafer 3 to be cleaned, and the wafer 3 is held in position by the clamping rotary wheel 2. Figure 3 ​As shown in the figures, each chucking runner 2 is formed with a chucking portion at the top thereof, the outer circumference of the chucking portion being in the shape of an inverted truncated cone, the inclined outer peripheral edge of each chucking runner being used to chuck the wafer and hold the wafer in place, preventing the wafer from falling off during cleaning.

[0046] In Figure 1 two sets of chucking runners 2 are shown, a first set of chucking runners including two chucking runners located at the first side of the back cleaning roller brush assembly 4, and a second set of chucking runners including two chucking runners located at the second side of the back cleaning roller brush assembly 4. The first set of chucking runners and the second set of chucking runners are relatively movable, and when a wafer 3 is to be chucked, the two sets of chucking runners 2 are moved apart to increase the distance between the two sets of chucking runners, so that the wafer can be placed between the chucking runners. After the wafer is placed between the chucking runners, the two sets of chucking runners can be moved towards each other to decrease the distance between the two sets of chucking runners, so that the wafer is chucked between the four chucking runners. In an alternative embodiment, the two sets of chucking runners 2 can be independently controlled to move to different positions. By controlling both sets of chucking runners simultaneously, efficiency and flexibility can be improved.

[0047] In the four chucking runners 2 shown in the figures, at least one of the chucking runners 2 can be a driving runner, and the remaining chucking runners 2 can be driven runners. When a wafer 3 is placed between the chucking runners 2 and chucked in place by the chucking runners 2, the driving runner can be started, and the four chucking runners 2 rotate in the same direction, driving the chucked wafer to rotate, and the wafer back cleaning roller brushes and edge cleaning roller brushes at the bottom of the wafer, the wheel edge cleaning mechanism, and the like start to work, and the wafer back is cleaned.

[0048] More specifically, as shown in Figure 1 the first set of chucking runners and the second set of chucking runners can include a first chucking runner 21, a second chucking runner 22, a third chucking runner 23, and a fourth chucking runner 24. It should be noted that in an alternative embodiment, these first chucking runner 21, second chucking runner 22, third chucking runner 23, and fourth chucking runner 24 can be independently provided, and each can be independently controlled to adjust the position to chuck the wafer, and should also fall within the scope of the present application.

[0049] According to the embodiment in Figure 1 the first chucking runner 21 and the second chucking runner 22 are respectively mounted on a first support cross arm 15, and the third chucking runner 23 and the fourth chucking runner 24 are respectively mounted on a second support cross arm 16. At this time, the first support cross arm 15 and the second support cross arm 16 are respectively movable and / or rotatable.

[0050] Specifically, the first support cross arm 15 and the second support cross arm 16 are respectively mounted to the first wafer clamping mechanism bearing slide 17 and the second wafer clamping mechanism bearing slide 18 in a self-adapting torsion-adjustable manner. The self-adapting torsion-adjustable disc is shown in the figure, which provides the first support cross arm 15 and the second support cross arm 16 with a self-adapting rotation degree of freedom. When the first support cross arm 15 and the second support cross arm 16 move towards the wafer, once each clamping runner 2 reaches the wafer, it will be self-adaptively rotated to adjust so that the four clamping runners 2 all engage the wafer periphery. The self-adapting torsion-adjustable disc is composed of two relatively rotatable disc components that are vertically butted.

[0051] Meanwhile, the first wafer clamping mechanism bearing slide 17 and the second wafer clamping mechanism bearing slide 18 slidably engage the clamping guide rail 19. The clamping guide rail 19 is fixed to the mounting base plate 13. The first wafer clamping mechanism bearing slide 17 and the second wafer clamping mechanism bearing slide 18 are respectively located on the two sides of the cleaning mechanism support seat 14, and move towards each other along the clamping guide rail 19 under the action of the clamping cylinder 20 to clamp and limit the wafer 3. The clamping cylinder 20 can be fixed to the mounting base plate 13 through the clamping cylinder support 34, and the clamping cylinder 20 is installed on the clamping cylinder support 34. As shown in the figure, the first set of clamping runners and the second set of clamping runners are respectively provided with support cross arms, self-adapting torsion-adjustable discs, and bearing slides on both ends of the mounting base plate 13.

[0052] Optionally, the first clamping runner 21 and the second clamping runner 22 are respectively slidably mounted to the first support cross arm 15 through the first runner support, and the third clamping runner 23 and the fourth clamping runner 24 are respectively slidably mounted to the second support cross arm 16 through the second runner support. In order to clearly show the positions of the first runner support and the second runner support, a runner support 32 is shown in the figure. Through such arrangement, the clamping runners can be adjusted as needed to adapt to wafers of different sizes.

[0053] As can be seen from the figure, the back cleaning roller brush assembly 4 comprises a back cleaning roller brush 5 and a back cleaning roller brush support 6, the back cleaning roller brush 5 is installed on the back cleaning roller brush support 6, the back cleaning roller brush support 6 is used to support the back cleaning roller brush 5 and make the back cleaning roller brush 5 adhere to the back of the wafer 3. After the back cleaning roller brush 5 adheres to the back of the wafer 3, the back cleaning roller brush 5 and the wafer 3 start to rotate when the cleaning starts, and the reverse relative movement between the two is generated, so that the back cleaning roller brush removes the contaminants on the back of the wafer. The motor assembly of the back cleaning roller brush is arranged at the end thereof and coaxially with the back cleaning roller brush, and the diameter thereof is smaller than that of the back cleaning roller brush, so as not to interfere with the wafer during cleaning.

[0054] The back cleaning roller brush 5 is a segmented roller brush passing through the center of the wafer, i.e. aligning with the diameter of the wafer, and is composed of an independent first roller brush half 51 and a second roller brush half 52. In an optional embodiment, the central rotating shaft of the first roller brush half 51 and the central rotating shaft of the second roller brush half 52 can be connected with each other, or can be the same central rotating shaft. When the back of the wafer is cleaned, the first roller brush half 51 and the second roller brush half 52 rotate in opposite directions. The first roller brush half 51 and the second roller brush half 52 are respectively driven by a first roller brush half motor assembly 36 and a second roller brush half motor assembly 37 located at the end. As shown in the figure, the first roller brush half motor assembly 36 and the second roller brush half motor assembly 37 respectively extend axially outward from the ends of the first roller brush half 51 and the second roller brush half 52, and the diameters thereof are respectively smaller than the diameters of the first roller brush half 51 and the second roller brush half 52, so as not to interfere with the wafer during cleaning.

[0055] In an optional embodiment, the first roller brush half 51 and the second roller brush half 52 can be arranged to move in opposite directions with the respective contacted wafer parts, and: the lengths of the first roller brush half 51 and the second roller brush half 52 are equal and located on both sides of the rotation center of the back cleaning roller brush support 6, or the length of the first roller brush half 51 is greater than that of the second roller brush half 52. As can be seen from the figure, the first roller brush half 51 and the second roller brush half 52 are separated from each other, the diameters of the first roller brush half 51 and the second roller brush half 52 are the same and the centers thereof are aligned, so that the back cleaning of the wafer can be simultaneously implemented. By such arrangement, the contaminants that cannot be cleaned at the center can be avoided, even if part of the wafer is not cleaned by the second roller brush half 52, the first roller brush half 51 can still effectively clean, which is beneficial to guarantee the cleaning quality of the back of the wafer.

[0056] The wafer cleaning device cleans the back of the wafer by the segmented wafer back cleaning brush and the reverse differential rotation opposite to the self-rotation direction of the wafer to ensure the cleaning effect and the cleaning of dead angles, and to ensure the effective cleaning area and the cleaning effect of the back of the wafer. Meanwhile, the edge cleaning mechanism realizes the reverse cleaning of the edge of the wafer relative to the self-rotation direction of the wafer, and improves the cleaning effect in the same operation space.

[0057] In optional embodiments, the shorter second brush half 52 can also be omitted as needed, and only the longer first brush half 51 is retained, so that the overall structure of the wafer cleaning device 1 is simpler.

[0058] As can be seen from the figure, the edge cleaning brush assembly 7 includes an edge cleaning brush 8 and an edge cleaning brush support 9, the edge cleaning brush 8 is installed on the edge cleaning brush support 9, and the edge cleaning brush support 9 is used to support the edge cleaning brush 8 and fit the edge cleaning brush 8 with the edge of the wafer 3, so as to clean the outer edge of the wafer.

[0059] The edge cleaning brush 8 is movably installed at the end of the edge cleaning brush support 9, the rotation direction of the edge cleaning brush 8 is opposite to the rotation direction of the wafer 3, and when the edge cleaning of the wafer is performed, the edge cleaning brush 8 fits the edge of the wafer 3; when the edge cleaning of the wafer is finished, the edge cleaning brush 8 is separated from the edge of the wafer 3. In this way, the edge cleaning brush 8 can be moved away when the wafer is taken out or placed; when cleaning is performed, the edge cleaning brush 8 is moved to the cleaning position, which can effectively prevent accidents from occurring when the wafer is taken out or placed, such as wafer dropping, clamping deviation, broken pieces, etc.

[0060] The edge cleaning brush 8 can include a first edge cleaning brush 81 and a second edge cleaning brush 82, the first edge cleaning brush 81 and the second edge cleaning brush 82 are respectively pivoted at both ends of the edge cleaning brush support 9, and the clamping cleaning contact points of the first edge cleaning brush 81 and the second edge cleaning brush 82 are connected through the center of the wafer. It should be noted that in different embodiments, other numbers of edge cleaning brushes can be provided, for example but not limited to one, three, four or even more.

[0061] In the illustrated example, the first edge cleaning brush 81 and the second edge cleaning brush 82 are respectively connected to a wafer edge cleaning brush sleeve rod 10 and a wafer edge cleaning brush guide rod 11, the wafer edge cleaning brush sleeve rod 10 is sleeved with the wafer edge cleaning brush guide rod 11 and both can move relatively under the drive of a wafer edge cleaning brush cylinder 12, so as to respectively drive the first edge cleaning brush 81 and the second edge cleaning brush 82 to switch between abutting against the edge of the wafer 3 and separating from the edge of the wafer 3. It can be understood that in alternative embodiments, the position switching of each edge cleaning brush can also be controlled independently; in the illustrated example, the sleeve rod and the guide rod are used to associate different edge cleaning brushes, so that the positions of the edge cleaning brushes can be switched synchronously, avoiding operation accidents due to the asynchronous switching of different edge cleaning brushes and affecting the normal production.

[0062] As shown in the figure, the back cleaning brush support 6 and the edge cleaning brush support 9 are integrally formed in a cross shape. The wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 are parallel to the edge cleaning brush support 9 and are located below the plane where the aforesaid cross is located in space. It can also be seen that the back cleaning brush 5 extends over the entire length of the back cleaning brush support 6, while the edge cleaning brush 8 includes a first edge cleaning brush 81 and a second edge cleaning brush 82, which are respectively arranged at the two ends of the edge cleaning brush support 9.

[0063] Further, as can be seen from the figure, the first end of the edge cleaning brush support 9 is provided with a first lever 39, the upper end of the first lever 39 is fixed with the first edge cleaning brush 81, and the lower end of the first lever 39 is pivotally connected to the outer end of the wafer edge cleaning brush sleeve rod 10. The second end of the edge cleaning brush support 9 is provided with a second lever (not marked), the upper end of the second lever is fixed with the second edge cleaning brush 82, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning brush guide rod 11.

[0064] In alternative embodiments, according to specific needs, a separate back cleaning brush support and a separate edge cleaning brush support can be provided. At this time, the back cleaning brush support and the edge cleaning brush support can be in different horizontal planes and spaced apart vertically to avoid interference with each other.

[0065] In combination Figure 2 and Figure 5The main function of the chucking rotary wheel 2 is to clamp and limit the wafer, and in this example, the clamping is performed in pairs. The chucking rotary wheel motor assembly 33 provides the rotation power for the chucking rotary wheel 2, and the unit is waterproof. During the self-rotation of the chucking rotary wheel 2, the wafer back and edge roller brush cannot clean the chucking rotary wheel 2, which will cause the wafer to clamp the contaminants in the dead angle position in contact with it in the initial state without cleaning, and will scratch the wafer edge and body during the self-rotation of the wafer. By adding a wheel edge cleaning mechanism 28 such as a wheel edge spray pipe to clean the chucking rotary wheel 2. As shown in Figure 5 The wheel edge spray position is located at the diagonal outside, which does not affect the wafer handling system, and sprays the chucking rotary wheel 2. The spray angle is shown in Figure 5 The I-I partial enlargement in the figure shows that the chucking rotary wheel 2 is fully covered by the spray, which effectively prevents and removes the contaminants remaining in the dead angle position and avoids scratching the wafer edge and the chucking rotary wheel.

[0066] As can be seen from the figure, the wheel edge cleaning mechanism 28 is arranged at each chucking rotary wheel 2 for cleaning the chucking rotary wheel 2. In the illustrated example, four wheel edge cleaning mechanisms 28 are shown, each of which cleans each chucking rotary wheel 2. The wheel edge cleaning mechanism 28 can have different forms, such as but not limited to cleaning liquid cleaning, cleaning gas purging, roller brush contact cleaning, etc. In the illustrated embodiment, each wheel edge cleaning mechanism 28 includes two wheel edge spray pipes, as shown in Figure 1 Each wheel edge spray pipe can spray cleaning liquid to the chucking rotary wheel 2 for cleaning the chucking rotary wheel.

[0067] The wafer cleaning device prevents wafer edge scratching, which can effectively and quickly remove the contaminants in the dead angle position between the chucking rotary wheel and the wafer through the wheel edge cleaning mechanism, effectively prevent and avoid wafer edge scratching and chucking rotary wheel set scratching and wear, reduce the replacement frequency of the chucking rotary wheel set and improve the yield of the wafer.

[0068] The wafer cleaning device 1 has a mounting bottom plate 13.

[0069] The back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are mounted on the mounting base plate 13 via a cleaning mechanism support 14. As shown in the figure, the cleaning mechanism support 14 is inverted U-shaped, and the clamping guide rail 19 passes through the cleaning mechanism support 14 between the two legs of the inverted U-shape. The wafer cleaning device 1 can be mounted to a wafer thinning device (not shown) via this mounting base plate 13. The cleaning mechanism support 14 can be fixed to the mounting base plate 13; in an optional embodiment, it can also be configured to be movable and adjustable along the clamping guide rail 19. Both the back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are mounted on the cleaning mechanism support 14.

[0070] The clamping rollers 2 are mounted on the mounting base plate 13 via a support crossarm, an adaptive torsion adjustment disk 35, a first wafer clamping mechanism carrier slider 17, and a second wafer clamping mechanism carrier slider 18, and are located on both sides of the back cleaning roller assembly 4 and the edge cleaning roller assembly 7. The clamping cylinders 20 located on the clamping guide rails 19 can adjust the position of the clamping rollers 2 along the clamping guide rails 19, and the adaptive torsion adjustment disk 35 enables the clamping rollers 2 to adaptively hold the wafer in place.

[0071] Combination Figure 1 and Figure 2 According to this embodiment, when performing a back cleaning process on wafer 3, the four clamping rollers 2 on both sides move towards each other along the clamping guide rail 19 under the action of the clamping cylinder 20 to clamp and limit the wafer 3. Figure 2 (The middle arrow indicates the clamping action). The back cleaning roller brush assembly cylinder 38 lifts the back cleaning roller brush bracket 6, bringing the first roller brush half 51 and the second roller brush half 52 into contact with the back of the wafer for cleaning. The wheel edge cleaning mechanism 28 continuously sprays the clamping roller 2 to prevent contaminants on the back of the wafer from remaining at the edges of the clamping roller 2, thus preventing cleaning dead corners at the wafer edge. The edge cleaning roller brush 8 is lifted by the wafer edge cleaning roller brush cylinder 12, causing the wafer edge cleaning roller brush sleeve 10 and the wafer edge cleaning roller brush guide rod 11 to move relative to each other, bringing the edge cleaning roller brush 8 into contact with the wafer edge and cleaning the wafer edge contour. The guide rail protective cover 27 below the cleaning mechanism support base 14 is fixed at both ends to the first wafer clamping mechanism carrier slider 17 and the second wafer clamping mechanism carrier slider 18, respectively, and fully covers and protects the clamping guide rail 19 below it, preventing contaminants from splashing onto the guide rail during the cleaning process and causing guide rail jamming. The four clamping rollers 2 rotate in the same direction, causing the clamped wafer to rotate. The bottom cleaning brush and the contour cleaning brush start working to clean the back of the wafer.

[0072] According to the embodiment, when the wafer is cleaned, the wafer rotates, the back cleaning roller brush 5 is attached to the back of the wafer and rotates, and relative movement is generated between the two to remove contaminants. Through the cooperation of the two roller brush halves, the position of the wafer relative to the wafer is fully covered, and there is no cleaning dead angle that cannot be reached. At the same time, the rotation directions of the two sides of the wafer rotation center relative to the roller brush are different, and both sides can be thoroughly cleaned.

[0073] Figure 3 is Figure 1 a schematic side view of a wafer cleaning device.

[0074] Figure 3 The guide rail protective cover 27 is more clearly shown in the figure, which covers the clamping guide rail 19 between the cleaning mechanism support seat 14 and the first wafer clamping mechanism carrying slider 17 and between the cleaning mechanism support seat 14 and the second wafer clamping mechanism carrying slider 18.

[0075] The guide rail protective cover 27 can be an accordion protective cover made of a folding flexible material, and its two ends can be fixed on the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 respectively, which can be extended or retracted as needed and fully cover the clamping guide rail 19 below the cleaning mechanism support seat 14 to prevent liquid and contaminants from splashing onto the clamping guide rail during the cleaning process and causing guide rail jamming. The guide rail protective cover 27 can be integrated and pass from below the cleaning mechanism support seat 14, with both ends fixed to the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 respectively.

[0076] In an optional embodiment, the guide rail protective cover 27 can also be divided into two sections, one connected between the cleaning mechanism support seat 14 and the first wafer clamping mechanism carrying slider 17, and the other connected between the cleaning mechanism support seat 14 and the second wafer clamping mechanism carrying slider 18.

[0077] As can be seen from the figure, the guide rail protective cover 27 maintains a distance from the clamping guide rail 19 to prevent the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 from jamming the guide rail protective cover 27 on the clamping guide rail 19 when they move towards the cleaning mechanism support seat 14.

[0078] In addition, Figure 3 The components of the wafer cleaning device 1 are more clearly shown in the figure. For example, the figure clearly shows two clamping cylinders 20 fixed to the mounting bottom plate 13 at both ends through clamping cylinder supports 34, which respectively manipulate the sliding of the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 on the clamping guide rail 19. In addition, the figure also shows the clamping rotary wheel, the clamping rotary wheel motor assembly, the wheel edge cleaning mechanism, etc.

[0079] Figure 4 is Figure 1 Figure 2 is a partial side view of a wafer cleaning apparatus showing a backside cleaning brush and an edge cleaning brush cleaning a portion of a wafer.

[0080] The figure shows the direction of rotation of the first brush half 51 and the second brush half 52 of the backside cleaning brush 5 along their longitudinal axis, the direction of rotation of the wafer 3 along its axis perpendicular to its center, the direction of rotation of the first edge cleaning brush 81 and the second edge cleaning brush 82 along their longitudinal axis.

[0081] From Figure 4 It can be seen from the figure that in this example, the first brush half 51 and the second brush half 52 of the backside cleaning brush 5 are not of equal length, the first brush half 51 being longer than the second brush half 52. The contact point of the backside cleaning brush 5 with the wafer 3 coincides with a diameter of the wafer, passing through the center of the wafer 3. In addition, the first brush half 51 and the second brush half 52 rotate in opposite directions along the axis, but since the first brush half 51 and the second brush half 52 are mainly located on opposite sides of the center of the wafer 3, the direction of rotation of the wafer 3 is such that the direction of movement of the first brush half 51 and the second brush half 52 at the point of contact with the wafer 3 is substantially opposite to the corresponding point on the wafer 3. Although the first brush half 51 has a portion extending beyond the center of the wafer in the same direction as the movement of the wafer, when the corresponding point on the wafer is cleaned by the other portion of the first brush half 51 which does not extend beyond the center of the wafer, it is cleaned completely and therefore does not leave unwanted residue on the back of the wafer.

[0082] The figure also shows the direction of rotation of the edge cleaning brushes. It can be seen from the figure that the first edge cleaning brush 81, the second edge cleaning brush 82 and the wafer 3 all rotate in a clockwise direction, so that the point of contact of the first edge cleaning brush 81 and the second edge cleaning brush 82 with the wafer 3 is in the opposite direction to the movement of the wafer 3, which is more advantageous for the cleaning effect on the outer circumferential edge of the wafer 3.

[0083] As Figure 4As shown, the cleaning effect on the main area of the back of the wafer 3 is achieved by adjusting the rotation direction of the first brush half 51 and the second brush half 52 relative to the wafer 3. As shown in the figure, when the wafer 3 rotates clockwise, the first brush half 51 rotates counterclockwise and the second brush half 52 rotates clockwise at the same visual angle. When the wafer 3 rotates counterclockwise, the first brush half 51 rotates clockwise and the second brush half 52 rotates counterclockwise at the same visual angle. Meanwhile, the effective cleaning axial distance of the first brush half 51 at the bottom is slightly longer than that of the second brush half 52, and passes through the center of the wafer 3. Through the structure and action of the bottom brush, the purpose of cleaning the main cleaning area without dead angle is achieved. A pair of edge cleaning brushes, i.e., the first edge cleaning brush 81 and the second edge cleaning brush 82, are distributed at the edge of the wafer, and the clamping cleaning contact line thereof passes through the center of the wafer, thereby balancing the stress effect on the wafer 3. The rotation direction of the first edge cleaning brush 81 and the second edge cleaning brush 82 on both sides is opposite to the rotation direction of the wafer 3, and the cleaning operation on the edge contaminants can be achieved.

[0084] Figure 5 is Figure 1 The schematic diagram of the wheel edge cleaning mechanism of the wafer cleaning device is shown in FIG. 4, wherein the partial enlarged view of the wheel edge spray pipe is also shown. Specifically, the wheel edge spray pipe is shown in FIG. 4. Figure 5 The partial I of the wheel edge spray pipe is shown in the enlarged left I-I view in FIG. 5.

[0085] In different embodiments, the wheel edge cleaning mechanism 28 can be a spray cleaning liquid, a cleaning brush, etc. In the illustrated example, the wheel edge spray pipe is included, which can continuously spray cleaning liquid to the clamping position of the clamping wheel, preventing the wafer back contaminants from being left at the clamping wheel edge seam to form a cleaning dead angle at the wafer edge.

[0086] The wafer cleaning device can prevent wafer edge scratching, effectively and quickly prevent and remove the clamping wheel and wafer clamping dead angle position contaminants through the wheel edge cleaning mechanism, and avoid the wafer and clamping wheel from scratching the wafer profile edge and wearing the clamping wheel contact position during the relative rotation process.

[0087] The wheel edge spray pipe has a bending part 29 facing the clamping wheel 2, and a plurality of nozzles 30 are distributed on the side of the bending part 29 close to the clamping wheel 2, and the spray direction of the nozzles 30 is directly opposite to the clamping wheel 2. As shown in the figure, the nozzles 30 form a row, and due to the bending of the bending part 29, all the nozzles converge to spray the clamping part of the clamping wheel. In alternative embodiments, multiple wheel edge spray pipes can be provided for one clamping wheel, and continuous cleaning can be performed at different circumferential positions of different clamping wheels.

[0088] In the illustrated example, the wheel edge spray pipe is combined with the clamping wheel 2. Figure 1It can be seen that the wafer cleaning device 1 is provided with two wheel edge nozzles for each clamping rotating wheel 2, which respectively clean the clamping rotating wheel 2 at different angle positions.

[0089] Figures 6 to 8 The state change process of the edge cleaning brush assembly of the wafer cleaning device is schematically shown. Figure 1 The state change process of the edge cleaning brush assembly of the wafer cleaning device is schematically shown.

[0090] As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received. Figure 6 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received. Figure 7 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received. Figure 8 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received.

[0091] In this example, the operation process of the edge cleaning brush is as follows: when the wafer is transported to the cleaning area of the wafer cleaning device of the present application by the transport mechanism, the wafer edge cleaning mechanism is in the state shown in the figure, the edge cleaning brush 8 moves relative to the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 under the action of the wafer edge cleaning brush cylinder 12, so that the edge cleaning brush 8 performs an avoiding action to prevent interference when the wafer is lowered by the upper transport mechanism. Figure 6 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received. Figure 7 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received. Figure 8 As shown in the figure, the wafer edge cleaning brush cylinder 12 is fixed on the cleaning mechanism support seat 14, and the wafer edge cleaning brush cylinder 12 drives the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 to retract, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are opened by the lever structure at both ends, and the wafer to be cleaned can be received.

[0092] Figure 9 And Figure 10 The figure shows the influence of the relative motion direction of the wafer and the cleaning brush on the cleaning effect.

[0093] The figure shows wafer 3, chucking runner 2 and back cleaning roller brush 5. Wafer 3 rotates in the horizontal plane, the direction of rotation is shown by the arrow above it. Back cleaning roller brush 5 rotates along the axis perpendicular to the paper, the direction of rotation is shown by the arrow at the back cleaning roller brush 5. As can be seen from the figure, the relative operating state of the back cleaning roller brush 5 to the wafer 3 can be Figure 9 both clockwise rotation in Figure 10 and counter-rotating direction. According to the figure, relatively speaking, in the case of opposite relative operating direction, the back surface part of the wafer 3 passing through the back cleaning roller brush 5, such as Figure 9 and Figure 10 the back surface part of the wafer on the right side of the back cleaning roller brush 5, the contaminants can be cleaned more thoroughly, and the situation that there are some residual contaminants on the back surface of the wafer after brushing can be avoided more effectively.

[0094] The present application also provides a wafer thinning device, which can have a wafer cleaning device as described in any one of the preceding embodiments.

[0095] The technical solutions of the present application are suitable for wafer back cleaning after scribing process, which can avoid the contamination of the wafer back by silicon slurry after scribing process. Some technical solutions of the present application clean the wafer back by segmented back cleaning roller brush, and adapt to the self-rotation direction of the wafer by axial relative positive and negative rotation roller brush combination, so as to clean the bottom efficiently. In the further technical solutions of the present application, the wafer contour is cleaned by the wafer edge cleaning mechanism; at the same time, the chucking runner is self-cleaned by the chucking runner side wheel edge cleaning mechanism, so as to prevent the wafer contour from being scratched by contaminated particles after the chucking runner is contaminated, thereby realizing the cleaning of the wafer back and the cleaning device itself, and reducing the damage of the cleaning device itself to the wafer.

[0096] The technical scope of the present application is not limited to the above description, and those skilled in the art can make various modifications and modifications to the above embodiments without departing from the technical idea of the present application, and these modifications and modifications should be within the scope of the present application.

Claims

1. A wafer cleaning apparatus, characterized in that, include: Multiple clamping rollers are used to clamp and limit the wafer to be cleaned, including a first clamping roller, a second clamping roller, a third clamping roller and a fourth clamping roller; Back cleaning roller brush assembly, used for cleaning the back of wafers; An edge cleaning roller assembly includes an edge cleaning roller bracket and a first edge cleaning roller and a second edge cleaning roller, which are pivotally connected to its two ends respectively. The clamping and cleaning contact points of the first edge cleaning roller and the second edge cleaning roller are connected through the center of the wafer. The edge cleaning roller bracket is provided with a first lever and a second lever at its two ends respectively. The upper end of the first lever fixes the first edge cleaning roller and the lower end is pivotally connected to the outer end of the wafer edge cleaning roller sleeve. The upper end of the second lever fixes the second edge cleaning roller and the lower end is pivotally connected to the outer end of the wafer edge cleaning roller guide. The wafer edge cleaning roller sleeve is sleeved on the wafer edge cleaning roller guide and the two can move relative to each other, thereby driving the first edge cleaning roller and the second edge cleaning roller to switch between adhering to the wafer edge and detaching from the wafer edge respectively. The first and second clamping rollers are slidably mounted on the first support cross arm, and the third and fourth clamping rollers are slidably mounted on the second support cross arm, so that the clamping rollers can be adjusted to accommodate wafers of different sizes; the first and second support cross arms are respectively mounted on the first wafer clamping mechanism carrier slider and the second wafer clamping mechanism carrier slider in a way that can adaptively adjust the torsion via adaptive torsion adjustment discs; when the first and second support cross arms move toward the wafer, once each clamping roller reaches the wafer, the first and second support cross arms adaptively rotate and adjust so that all four clamping rollers engage the outer periphery of the wafer.

2. The wafer cleaning apparatus as described in claim 1, characterized in that, A clamping portion is formed on the top of each clamping roller. The outer circumference of the clamping portion is in the shape of an inverted truncated cone. The inclined outer peripheral edge of each clamping roller is used to clamp the wafer and keep the wafer in place to prevent the wafer from falling off during cleaning.

3. The wafer cleaning apparatus as described in claim 1, characterized in that, The back cleaning roller brush assembly includes a back cleaning roller brush bracket and a back cleaning roller brush mounted thereon; the back cleaning roller brush bracket is used to support the back cleaning roller brush and to fit the back cleaning roller brush against the back of the wafer; the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half, and during wafer back cleaning, the first roller brush half and the second roller brush half rotate in opposite directions.

4. The wafer cleaning apparatus as described in claim 3, characterized in that, The back cleaning roller brush extends along the entire length of the back cleaning roller brush holder. The first and second roller brush halves move in opposite directions to the wafer portions they contact, and the length of the first roller brush half is greater than the length of the second roller brush half.

5. The wafer cleaning apparatus as described in claim 1, characterized in that, The edge cleaning roller assembly includes an edge cleaning roller; the edge cleaning roller includes a first edge cleaning roller and a second edge cleaning roller, and is movably mounted at the end of the edge cleaning roller support. The rotation direction of the edge cleaning roller is opposite to the rotation direction of the wafer, and: during wafer edge cleaning, the edge cleaning roller is in contact with the edge of the wafer; when wafer edge cleaning is completed, the edge cleaning roller disengages from the edge of the wafer.

6. The wafer cleaning apparatus as described in claim 1, characterized in that, The wafer cleaning apparatus has a mounting base plate, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base plate via a cleaning mechanism support.

7. The wafer cleaning apparatus as described in claim 6, characterized in that, The first wafer clamping mechanism carrier slider and the second wafer clamping mechanism carrier slider are slidably engaged with the clamping guide rail. The clamping guide rail is fixed to the mounting base plate. The first wafer clamping mechanism carrier slider and the second wafer clamping mechanism carrier slider are respectively located on both sides of the cleaning mechanism support. Under the action of the clamping cylinder, they move towards each other along the clamping guide rail to clamp and limit the wafer.

8. The wafer cleaning apparatus as described in claim 7, characterized in that, A guide rail protective cover is provided between the cleaning mechanism support base and the first wafer clamping mechanism carrier slider, and between the cleaning mechanism support base and the second wafer clamping mechanism carrier slider, respectively, for the clamping guide rail. The guide rail protective cover is an accordion-style protective cover made of a folding flexible material.

9. The wafer cleaning apparatus as described in claim 7, characterized in that, The cleaning mechanism support is inverted U-shaped, and the clamping guide rail passes through the cleaning mechanism support between the two legs of the inverted U-shape.

10. The wafer cleaning apparatus as described in claim 1, characterized in that, The wafer cleaning apparatus further includes a wheel-side cleaning mechanism, which is disposed at each of the clamping rollers and is used to clean the clamping rollers.

11. The wafer cleaning apparatus as described in claim 10, characterized in that, The wheel-side cleaning mechanism includes a wheel-side spray pipe with a curved portion facing the clamping wheel. Nozzles are distributed on the side of the curved portion near the clamping wheel, and the spray direction of the nozzles converges to the clamping portion of the clamping wheel.

12. The wafer cleaning apparatus as described in claim 11, characterized in that, The wafer cleaning device is equipped with two wheel-side nozzles for each of the clamping rollers, which clean the clamping rollers at different angles.

13. A wafer thinning apparatus, characterized in that, The wafer thinning equipment includes a wafer cleaning apparatus as described in any one of claims 1 to 12.

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