Hole array laser processing method and system based on AOD and galvanometer cooperation

Abstract

The invention discloses a hole array laser machining method and system based on AOD and galvanometer cooperation. The method comprises the following steps that the laser scanning track of each area to be drilled in an area array to be drilled and the target position of laser pulses on the laser scanning track are determined; determining an AOD scanning breadth covering all the areas to be perforated according to the array shape of the areas to be perforated, and determining a galvanometer scanning track and a galvanometer scanning speed in the AOD scanning breadth; the machining sequence of the laser beams during hole forming is determined; acquiring the AOD displacement of each laser pulse under the AOD coordinate system; and controlling the laser device to output laser pulses, controlling the galvanometer system to scan along the galvanometer scanning track at the galvanometer scanning speed, and controlling the AOD system to deflect each laser pulse according to the AOD displacement so as to form a hole array. Through the synergistic effect of the AOD system and the galvanometer system, efficient and high-quality machining of the hole array structure can be achieved.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, specifically to a method and system for aperture array laser processing based on AOD and galvanometer collaboration. Background Technology

[0002] In the prior art, micro-hole arrays need to be fabricated on the workpiece according to the purpose of the component to achieve specific functions. For example, ambient light sensors need to achieve light transmission by creating a large number of micron-sized micropores on the ink layer of the glass cover.

[0003] Currently, there are technical solutions for manufacturing microporous structures based on laser processing, but this technology mainly uses a galvanometer scanning system to complete laser scanning hole making.

[0004] However, with increasing demands for production efficiency, the repetition frequency of lasers is becoming higher and higher. Due to mechanical inertia, the galvanometer system struggles to maintain a low pulse overlap rate during micro-hole fabrication, leading to excessive heat accumulation and deterioration in processing quality. Furthermore, when fabricating micro-hole array structures using a single galvanometer system, the long idle path length and numerous pauses of the galvanometer result in low processing efficiency. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a laser processing method and system for aperture arrays based on the synergy of AOD and galvanometer systems. This method enables efficient and high-quality processing of aperture array structures through the combined action of the AOD system and the galvanometer system.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] On the one hand, a laser processing method for aperture arrays based on AOD and galvanometer collaboration is provided, which includes the following steps:

[0008] The laser scanning trajectory of each hole region in the array of hole regions to be formed is determined. The laser scanning trajectory is a concentric circle trajectory. The target position of each laser pulse on each laser scanning trajectory is determined in the galvanometer coordinate system.

[0009] Based on the shape of the array of areas to be drilled, determine a number of AOD scanning planes covering all areas to be drilled, and determine the galvanometer scanning trajectory within each AOD scanning plane, and set the galvanometer scanning speed when the galvanometer system scans along the galvanometer scanning trajectory in the current AOD scanning plane.

[0010] Determine the processing sequence when the laser beam creates holes in all areas to be created on each AOD scanning area;

[0011] Obtain the AOD displacement of each laser pulse in the AOD coordinate system;

[0012] The laser outputs laser pulses and the galvanometer system is controlled to scan along the galvanometer scanning trajectory at the galvanometer scanning speed. At the same time, the AOD system is controlled to deflect each laser pulse according to the AOD displacement, so that the laser pulses pass through the AOD system and the galvanometer system in sequence and act on the area to be drilled. The hole structure is processed in the area to be drilled in the current AOD scanning area according to the processing sequence of each AOD scanning area to form a hole array.

[0013] On the other hand, a micro-hole array laser processing system based on AOD and galvanometer collaboration is provided, characterized in that it includes: a laser, a beam expander, an AOD system, a 4f system, a mirror group, a galvanometer system, a lens, and a control system.

[0014] The laser is used to output laser pulses. The laser pulses enter the AOD system after passing through the beam expander. The control system controls the AOD system to deflect each laser pulse according to the AOD displacement. The laser pulses deflected by the AOD system pass through the 4f system and the mirror group in sequence before entering the galvanometer system.

[0015] The control system controls the galvanometer system to scan along the galvanometer scanning trajectory within the AOD scanning area at the galvanometer scanning speed, and deflects the laser pulses.

[0016] The laser pulses deflected by the galvanometer system are output through the lens and applied to the area of ​​the workpiece to be drilled, so as to form a hole array.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention plans several AOD scanning planes and the galvanometer scanning trajectory within each scanning plane to perform large-scale, low-speed, uniform macroscopic positioning through the galvanometer system. At the same time, by leveraging the advantages of the AOD system—no mechanical inertia and high deflection frequency—local, high-speed, and high-precision microscopic laser pulse deflection is achieved through the AOD system. This fundamentally solves the limitation of galvanometer inertia on the processing speed of hole array structures, achieving complementary advantages.

[0019] Furthermore, this invention optimizes the hole processing sequence by using an optimized AOD scanning area division and scan line proximity sorting algorithm to minimize the length of the galvanometer's idle jump path and the number of pauses, thereby minimizing non-processing time and significantly improving the hole array processing efficiency while ensuring the processing quality of the hole array structure. Attached Figure Description

[0020] Figure 1 This is a flowchart of the steps of the aperture array laser processing method based on AOD and galvanometer collaboration of the present invention;

[0021] Figure 2 This is a schematic diagram of the array of areas to be drilled and the distribution of laser pulses on the areas to be drilled in this invention;

[0022] Figure 3 This is a schematic diagram of the AOD scanning area, galvanometer scanning trajectory and scanning lines of the array of holes to be made in this invention, wherein (a) is a circular array of holes to be made and (b) is a rectangular array of holes to be made.

[0023] Figure 4 This is a schematic diagram of the galvanometer scanning trajectory lead and jump path in this invention, wherein (a) is a circular array of areas to be drilled, and (b) is a rectangular array of areas to be drilled.

[0024] Figure 5 This is a flowchart of the steps in the present invention for obtaining the processing sequence when drilling a hole in an area to be drilled.

[0025] Figure 6 This is a schematic diagram of the displacement vector of the laser pulse under the combined action of the AOD system and the galvanometer system in this invention;

[0026] Figure 7 This is a schematic diagram illustrating the steps of determining the transformation matrix M(α,β), rotation transformation matrix R(θ), and scaling factor K based on theoretical and actual graphics in this invention.

[0027] Figure 8 The hole array structure obtained by the present invention is shown in (a) as an overall view of the circular hole array and (b) as a partial view of the circular hole array.

[0028] Figure 9 This is a schematic diagram of the aperture array laser processing system based on AOD and galvanometer collaboration in this invention. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1:

[0031] like Figure 1 As shown, this embodiment provides a laser processing method for aperture arrays based on AOD and galvanometer collaboration, which includes the following steps:

[0032] S1. Determine the laser scanning trajectory of each hole region P in the array of hole regions to be formed. The laser scanning trajectory is a concentric circle trajectory, and the galvanometer coordinate system O is determined. G -X G Y G Below, the target position (x, y) of each laser pulse on each laser scanning trajectory;

[0033] In this embodiment, as Figure 2 As shown, the array of areas to be drilled is a circular array or a rectangular array. Each area to be drilled, P, is circular with the same radius. The laser scanning trajectory of each area to be drilled, P, is the same. The concentric circular trajectories of the laser scanning trajectory contain n circular trajectories. The distance between two adjacent circular trajectories is d. On the same circular trajectory, the angular interval between two adjacent laser pulses is Δθ.

[0034] For example, such as Figure 2 As shown in part (b), in this embodiment, each laser scanning trajectory contains three concentric circles, and circular trajectories l1, l2, and l3 are distributed from the inside out. There are a total of 28 laser pulses p on the three circular trajectories, and the laser pulses on each circular trajectory are evenly spaced.

[0035] Furthermore, Figure 2 As shown, (a) is the array of areas to be drilled in the galvanometer coordinate system O. G -X G Y G The positional distribution below, (b) part is the laser pulse p on all circular trajectories within a certain area P to be drilled, relative to the center O of that area. h Location distribution;

[0036] Based on this, establish a system with the current area to be drilled, centered at point O. h O, the origin h -X h Y h A coordinate system is established such that the first laser pulse on each circular trajectory lies on the same coordinate axis half-axis (e.g., X). h positive half axis or Y h On the positive half-axis of the axis; for example, in this embodiment, the first laser pulses p11, p21, and p31 of the circular trajectories l1, l2, and l3 of the current area to be drilled are all located on the Y-axis. h Positive half-axis;

[0037] Since the radius of each circular trajectory and the angular interval between two adjacent laser pulses on the same circular trajectory are known, the relative position of each laser pulse on each circular trajectory to the center O of the area to be drilled can be calculated. h Position coordinates;

[0038] For example, the circular trajectory l1 of the area to be drilled is located in the innermost layer, and its radius is r1. Since the distance between two adjacent circular trajectories is d, the radii r2 and r3 of the circular trajectories l2 and l3 are r1+d and r1+2d, respectively. Furthermore, for the circular trajectory l1, the coordinates of its first laser pulse p11 are (0, r1), and the coordinates of its second laser pulse p12 are (r1cos(90-Δθ), r1sin(90-Δθ)), where r1 and Δθ are known values. By analogy, the position coordinates of each laser pulse on the circular trajectory l1 can be determined.

[0039] Similarly, the first laser pulse p21 of circular trajectory l2, the first laser pulse p31 of circular trajectory l3, the radii r2 and r3 of circular trajectories l2 and l3, and the angular interval Δθ between two adjacent laser pulses on the same circular trajectory are all known. Therefore, the position coordinates of each laser pulse can also be calculated.

[0040] This allows us to obtain the position coordinates (x, y) of each laser pulse relative to the center of the area to be drilled within the current area to be drilled. p1 ,y p1 ), (x p2 ,y p2 ), ..., (x pm ,y pm ), where m is the total number of laser pulses in the current area to be drilled, that is, the sum of the number of laser pulses on all circular trajectories in the current area to be drilled;

[0041] Furthermore, the position coordinates (x, y) of each laser pulse relative to the center of the area to be drilled are... p1 ,y p1 ), (x p2 ,y p2 ), ..., (x pm ,y pm ) respectively with the center O of the current area to be drilled h In the galvanometer coordinate system O G -X G Y G coordinates below (x) OG ,y OG Add (e.g., (x)) p1 ,y p1 )+(x OG ,y OG This allows us to obtain the position of each laser pulse in the galvanometer coordinate system O. G -X G Y G The target location below;

[0042] S2. Determine a number of AOD (AcoustoOptical Deflectors) scanning planes covering all the areas P to be drilled according to the shape of the array of areas to be drilled, and determine the galvanometer scanning trajectory in each AOD scanning plane, and set the galvanometer scanning speed when the galvanometer system scans along the galvanometer scanning trajectory in the current AOD scanning plane.

[0043] In this embodiment, as Figure 3 As shown in part (a), if the shape of the array of areas to be drilled is circular, the AOD scanning area includes: an inner circular scanning area C1 and an annular scanning area C2 surrounding the inner circular scanning area C1, and the centers of the inner circular scanning area C1 and the annular scanning area C2 coincide. The inner circular scanning area C1 is used to cover a number of areas to be drilled P, and the annular scanning area C2 is used to cover all remaining areas to be drilled P.

[0044] Preferably, in this embodiment, there can be multiple annular scanning surfaces C2, and they are concentric annular structures, that is, the centers of each annular scanning surface C2 and the inner circular scanning surface C1 coincide, and the widths of each annular scanning surface C2 can be equal or unequal.

[0045] Furthermore, if the array of areas to be drilled is circular, the corresponding galvanometer scanning trajectory includes: a straight scanning trajectory L1 located within the inner circular scanning area C1, passing through the center of the inner circular scanning area C1, and having a length equal to the diameter of the inner circular scanning area C1; an arc-shaped scanning trajectory L2 located within the annular scanning area C2, wherein the center of the arc-shaped scanning trajectory L2 coincides with that of the inner circular scanning area C1, the arc of the arc-shaped scanning trajectory L2 is 359.0-360°, preferably 359.0-359.9°, and the arc-shaped scanning trajectory L2 is located at the middle position of the annular scanning area C2;

[0046] In this embodiment, when there are multiple annular scanning surfaces C2, there are also multiple arc-shaped scanning trajectories L2, and each annular scanning surface C2 has only one arc-shaped scanning trajectory L2. At the same time, each arc-shaped scanning trajectory L2 is located in the middle of its annular scanning surface C2.

[0047] The scanning direction of all arc-shaped scan trajectories L2 (e.g.) Figure 3 The arrows in part (a) are the same, such as both being clockwise or counterclockwise;

[0048] Therefore, as Figure 4As shown in part (a), when the arc of the arc scanning trajectory L2 is 359.0-359.9° and there are multiple arc scanning trajectories L2, tangent leads can be added at the start and end points of the straight scanning trajectory L1 and at the start and end points of each arc scanning trajectory L2. This allows the galvanometer system to jump from the end point of the previous scanning trajectory lead to the start point of the next scanning trajectory lead along the jump path. This allows the acceleration and deceleration process of the galvanometer system from the change of jump speed to the change of scanning speed to be carried out along the lead, so as to ensure that the galvanometer system can perform at a constant speed throughout the scanning process along the scanning trajectory.

[0049] like Figure 3 As shown in part (b), if the shape of the array of areas to be drilled is rectangular, then the AOD scanning area includes: several parallel rectangular scanning areas C3, and each rectangular scanning area C3 is used to cover several areas to be drilled P, and all rectangular scanning areas C3 cover all areas to be drilled P; the number of areas to be drilled P covered by each rectangular scanning area C3 may be equal or unequal, and the length and width of each rectangular scanning area C3 are equal.

[0050] If the array of areas to be drilled is rectangular, then its corresponding galvanometer scanning trajectory includes: a straight scanning trajectory L3 located within the rectangular scanning area C3. When there are multiple rectangular scanning areas C3, there are also multiple straight scanning trajectories L3. Each rectangular scanning area C3 contains only one straight scanning trajectory L3. Furthermore, each straight scanning trajectory L3 is located in the middle of its respective rectangular scanning area C3. All straight scanning trajectories L3 are parallel to each other and have the same scanning direction (e.g., ...). Figure 3 (as indicated by the arrow in section (b)).

[0051] Similarly, such as Figure 4 As shown in part (b), tangent leads can be added to the start and end points of each straight scanning trajectory L3, so that the galvanometer system can jump from the end point of the lead at the end point of the previous straight scanning trajectory L3 to the start point of the lead at the start point of the next straight scanning trajectory L3 along the jump path, thus ensuring that the galvanometer system scans at a constant speed.

[0052] Furthermore, the galvanometer scanning speed V is set when the galvanometer system scans along the galvanometer scanning trajectory within the current AOD scanning area (i.e., the inner circular scanning area C1, the annular scanning area C2, or the rectangular scanning area C3). mark (k), where the galvanometer scanning speed V mark (k) Calculated according to the following formula:

[0053]

[0054] Where S(k) is the length of the galvanometer scanning trajectory within the current AOD scanning area k; f laser T is the pulse repetition rate of the laser; N(k) is the total number of laser pulses within the current AOD scanning area k, which is also the sum of laser pulses on the laser scanning trajectory of all areas P to be drilled within the current AOD scanning area k; T Laser (k) represents the time consumed by the laser to output N(k) laser pulses;

[0055] S3. Determine the processing sequence for drilling holes in all areas P to be drilled on each AOD scanning area using the laser beam, such as... Figure 5 As shown, it specifically includes the following steps:

[0056] S31. Obtain the coordinate system O of the galvanometer system. G -X G Y G Below, within the current AOD scanning area, the center coordinates P of each area P to be created are... i (i.e., the center O of the area to be drilled) h In the galvanometer coordinate system O G -X G Y G (the coordinates below), and define the galvanometer scanning trajectory R(t)=(x(t),y(t)) within the current AOD scanning plane, t∈[t s ,t e ], t s t e These represent the start and end times of scanning along the galvanometer scanning trajectory R(t), respectively.

[0057] S32, such as Figure 3 As shown, the normal line of the current point on the galvanometer scanning trajectory R(t) within the current AOD scanning area is defined as the scanning line Ls, which moves along the galvanometer scanning trajectory R(t).

[0058] For example, Figure 3 As shown, when the galvanometer scanning trajectory R(t) is a straight line (such as straight scanning trajectories L1 and L3), the scanning line Ls is a straight line perpendicular to the galvanometer scanning trajectory R(t), as shown in the figure. Figure 3 As shown in part (a), when the galvanometer scanning trajectory R(t) is an arc-shaped trajectory (such as the arc-shaped scanning trajectory L2), the scanning line Ls is a straight line in the radial direction of the arc-shaped trajectory;

[0059] S33. Obtain the first contact time between the center of each area to be scanned and the scan line Ls within the current AOD scanning area using the following formula. :

[0060]

[0061] Where T(t) is the unit tangent vector of the galvanometer scanning trajectory R(t) at time t; i represents the i-th region to be drilled;

[0062] S34. Based on the time of first contact Arrange all areas P to be created within the current AOD scanning area in ascending order;

[0063] If the initial contact time between the center of all areas to be created within the current AOD scanning area and the scanning line Ls is different, then the initial contact time will be used directly. All hole regions P to be drilled within the current AOD scanning area are sorted in ascending order. The sorting result is the processing order during hole drilling. For example, if there are K hole regions P to be drilled within the current AOD scanning area, and the first contact time of all hole regions P is different, then the ascending sorting result is {P1, P2, ..., P...}. K};

[0064] If at least two current AOD scan areas have the same initial contact time with the scan line Ls (e.g.) Figure 3 In the areas P1 and P2 to be drilled, the first step is to determine the time of first contact. Sort all areas P to be created within the current AOD scanning area in ascending order to obtain the ascending sort result, such as {P1, P2, ..., P...} K};

[0065] Then, calculate the normal vector s from the galvanometer scanning trajectory R(t) of each hole-making region P with the same initial contact time in the ascending sorted results according to the following formula. i :

[0066]

[0067] in, For the galvanometer scanning trajectory R(t) in time The position at that time; for The unit normal vector at that location;

[0068] According to the normal vector s i For drilling regions P with the same initial contact time, sort them in descending order. The final sorted result is the processing order during drilling. If only drilling regions P1 and P2 have the same initial contact time, and their normal vectors are calculated to be s1 and s2 respectively, with s2 > s1, then sort the drilling regions P1 and P2 in descending order. The final sorted result is {P2, P1, ..., P2}. K};

[0069] It should be noted that, alternatively, the regions P to be drilled with the same initial contact time can be sorted in descending order according to their normal vectors, and then sorted according to their initial contact time. All areas P to be drilled within the current AOD scanning area are sorted in ascending order, which can yield the same sorting result and can also be used as the processing order when drilling holes.

[0070] S35. Repeat steps S31-S34 to obtain the processing sequence for drilling holes in all areas P to be drilled on each AOD scanning area.

[0071] S4. Obtain the coordinate system O of each laser pulse in the AOD coordinate system according to the following formula. A -X A Y A AOD displacement :

[0072]

[0073] in, The homogeneous transformation matrix The inverse matrix; t(i) is the time of the i-th laser pulse output, which is the resultant of the laser repetition frequency f. laser A given discrete-time series, where t(i) = i / f laser ; Let be the displacement of the i-th laser pulse from the origin of the galvanometer coordinate system to the target position of the laser pulse in the galvanometer coordinate system. Let be the galvanometer displacement of the i-th laser pulse, that is, the displacement of the i-th laser pulse from the origin of the galvanometer coordinate system to the position of the galvanometer scanning trajectory R(t(i)) at time t(i) in the galvanometer coordinate system.

[0074] Furthermore, the homogeneous transformation matrix Obtain it using the following formula:

[0075]

[0076] Where M(α,β) is the mirror transformation matrix, and α and β are the Y-axis mirror coefficient and X-axis mirror coefficient, respectively. α = 1 or -1, β = 1 or -1. When α = -1, it indicates that the AOD coordinate system O... A -X A Y A Regarding its Y A When the axis is mirrored, β=-1 indicates that the AOD coordinate system is mirrored about its X axis. A When the axes are mirrored, α=β=1 indicates that no mirror transformation is performed on the AOD coordinate system; R(θ) is the rotation transformation matrix, and θ is the coordinate system O of AOD. A -X A Y A Relative galvanometer coordinate system O G -X G Y G The rotation angle; K is the graphic scaling factor;

[0077] like Figure 6 As shown, in the AOD-galvanometer cooperative laser scanning system of this embodiment, the displacement of the laser pulse from the origin of the galvanometer coordinate system to the target position of the laser pulse is... It can be described as the galvanometer coordinate system O G -X G Y G The laser pulse, under the action of the galvanometer system, moves from the origin of the galvanometer coordinate system to the current position of the galvanometer scanning trajectory, resulting in galvanometer displacement. and the galvanometer coordinate system O G -X G Y G Below, the AOD displacement generated under the action of the AOD system The vector sum, that is:

[0078]

[0079] Furthermore, due to the AOD coordinate system O A -X A Y A With the galvanometer coordinate system O G -X G Y G Inconsistent posture and proportions lead to AOD displacement under the action of the AOD system. (i.e., AOD displacement in the AOD coordinate system) relative to the AOD displacement in the galvanometer coordinate system Scaling, rotation, and changes about the AOD coordinate system O occur. A -X A Y A Since its own coordinate axes undergo a mirror transformation, a homogeneous transformation matrix is ​​required. Perform a coordinate transformation so that the AOD coordinate system O A -X A Y A With the galvanometer coordinate system O G -X G Y G Alignment, that is, by adjusting the AOD coordinate system O A -X A Y A Perform scaling, rotation, and mirror transformations to align it with the galvanometer coordinate system O. G -X G YG The pose (i.e., the X-axis and Y-axis directions of the two coordinate systems) and scale are consistent;

[0080] Specifically, the mirror transformation matrix M(α,β), the rotation transformation matrix R(θ), and the scaling factor K can be determined as follows:

[0081] like Figure 7 As shown, in the galvanometer coordinate system O G -X G Y G The theoretical pattern is set below. The theoretical pattern refers to the processing pattern generated by the laser beam only under the action of the galvanometer system. The theoretical pattern includes a cross shape M1 and an arc M2, wherein the intersection point of the cross shape M1 and the center of the arc M2 are both connected to the origin O of the galvanometer coordinate system. G The vertical and horizontal lines of the cross-shaped figure M1 overlap with X. G Axis, Y G The axes coincide, the arc M2 has a direction pointing mark (such as a triangular arrow pointing in the clockwise direction), and the radius r of the arc M2 is known, such as 0.16mm;

[0082] Based on the processing parameters of the theoretical pattern, only the AOD system is controlled to deflect the laser beam to form a shape on the workpiece located in the galvanometer coordinate system O. G -X G Y G The actual graphic below includes: an actual cross shape M1' and an actual arc M2', wherein the intersection point of the actual cross shape M1' and the center of the actual arc M2' coincide, and the actual arc M2' has directional markings (such as arrows).

[0083] Simultaneously, the actual line segment M3' is generated only under the action of the galvanometer system, and the actual line segment M3' is in the galvanometer coordinate system O. G -X G Y G X G The axes are parallel or coincident;

[0084] Calculate the angle between the actual and theoretical figures to form the AOD coordinate system O. A -X A Y A Relative galvanometer coordinate system O G -X G Y G The rotation angle θ can be used to calculate the rotation transformation matrix R(θ); for example, the rotation angle θ can be determined based on the angle between the horizontal lines of the actual line segment M3' and the actual cross shape M1'.

[0085] The scaling factor K is calculated based on the size ratio of the actual graphic and the theoretical graphic. The size ratio includes one of the following: radius ratio, length ratio, area ratio, etc. For example, in this embodiment, the scaling factor K is calculated based on K=r' / r, where r' is the radius of the actual arc M2'. After measurement, r'=0.18mm, so K=0.18 / 0.16=1.125.

[0086] Furthermore, based on the rotation transformation matrix R(θ) and the scaling factor K, the actual graphic is rotated and scaled so that the actual graphic is in the galvanometer coordinate system O. G -X G Y G The bottom is aligned with the theoretical figure, and the proportions are consistent;

[0087] Then, based on the actual graphic obtained after rotation and scaling transformation (i.e. Figure 7 In the "scaling + rotation transformation of graphics" (in the text), the direction of the actual "+" shaped graphic M1' or the actual arc M2' is marked to determine the mirror relationship between the actual graphic and the theoretical graphic;

[0088] If the actual graphic (such as) Figure 7 (As shown in the "scaling + rotation transformation graph" in the image), the theoretical graph about Y... G If we mirror the axis, then we take α = -1 and β = 1. If we consider the relationship with respect to X... G If we want to mirror the axis, we take α=1 and β=-1, and thus determine the mirror transformation matrix M(α,β).

[0089] Therefore, it is possible to use the homogeneous transformation matrix AOD displacement in galvanometer coordinate system Convert to AOD coordinate system O A -X A Y A AOD displacement In order to obtain Based on this, we have:

[0090]

[0091] Where t(i) is the moment when the i-th laser pulse is output, which is determined by the laser repetition frequency f. laser A defined discrete time series;

[0092] S5. Determine the position of each laser pulse in the AOD coordinate system O. A -X A Y A AOD displacement If the scan area exceeds the AOD scanning area, return to step S2; otherwise, proceed to step S6.

[0093] In addition, S6 controls the laser output pulses and controls the galvanometer system to scan along the galvanometer scanning trajectory at the galvanometer scanning speed, while simultaneously controlling the AOD system according to the AOD displacement. Each laser pulse is deflected so that it passes through the AOD system and the galvanometer system in sequence and then acts on the area to be drilled. The hole structure is processed in the area to be drilled in the current AOD scanning area according to the processing sequence of each AOD scanning area to form a hole array.

[0094] When the laser operates at a repetition frequency f laser When periodically emitting laser pulses, the AOD system, due to its lack of mechanical inertia, has a deflection frequency far exceeding the repetition frequency f. laser Therefore, each independent laser pulse, under the coordinated action of the AOD system and the galvanometer system, moves according to the AOD displacement. galvanometer displacement Deflect to the target position to complete the hole array machining.

[0095] like Figure 8 As shown, the aperture array obtained by the aperture array laser processing method in this embodiment has a uniform and neat arrangement (e.g., Figure 8 As shown in part (a), the pore structure morphology is highly consistent and the edges of individual pore structures are neat.

[0096] The reason is that this embodiment is based on an AOD-galvanometer collaborative laser scanning system. By planning several AOD scanning planes and the galvanometer scanning trajectory within each scanning plane, the galvanometer system performs large-scale, low-speed, uniform macroscopic positioning. At the same time, by taking advantage of the AOD system's lack of mechanical inertia and high deflection frequency, the advantages of the AOD system and the galvanometer system are complemented. This reduces the pulse overlap rate caused by high repetition frequency scanning of a single galvanometer system, significantly reduces heat accumulation during processing, and avoids defects such as melting and splashing caused by material overheating, thus ensuring the processing quality of the array structure.

[0097] Example 2:

[0098] This embodiment provides a micro-hole array laser processing system based on AOD and galvanometer collaboration, such as Figure 9 As shown, it includes: laser 1, beam expander 2, AOD system 3, 4f system 4, mirror group 5, galvanometer system 6, lens 7, and control system;

[0099] The laser 1 is used to output laser pulses, which enter the AOD system 3 after passing through the beam expander 2. The control system controls the AOD system 3 according to the AOD displacement. Each laser pulse is deflected, and the laser pulse deflected by the AOD system 3 passes through the 4f system 4 and the mirror group 5 in sequence before entering the galvanometer system 6.

[0100] The control system controls the galvanometer system 6 to scan along the galvanometer scanning trajectory within the AOD scanning area at the galvanometer scanning speed, and deflects the laser pulses.

[0101] The laser pulses deflected by the galvanometer system 6 are output through the lens 7 and applied to the area of ​​the workpiece to be drilled to form a hole array.

[0102] In summary, this invention, based on the AOD-galvanometer collaborative laser scanning system, utilizes several AOD scanning planes and galvanometer scanning trajectory planning within each scanning plane to perform large-scale, low-speed, uniform macroscopic positioning via the galvanometer system. Simultaneously, leveraging the advantages of the AOD system—no mechanical inertia and high deflection frequency—it achieves localized, high-speed, and high-precision microscopic laser pulse deflection. This extends the high dynamic characteristics of the AOD system from a limited field of view to the entire processing area, fundamentally solving the limitation of galvanometer inertia on the processing speed of hole array structures, thus achieving complementary advantages.

[0103] Furthermore, this invention optimizes the hole processing sequence by using an optimized AOD scanning area division and scan line proximity sorting algorithm to minimize the length of the galvanometer's idle jump path and the number of pauses, thereby minimizing non-processing time and significantly improving the hole array processing efficiency while ensuring the processing quality of the hole array structure.

[0104] It should be noted that the technical features in embodiments 1 and 2 above can be combined arbitrarily, and the resulting technical solutions all fall within the protection scope of this application. Furthermore, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0105] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A laser processing method for aperture arrays based on the synergy of AOD and galvanometer, characterized in that, Includes the following steps: The laser scanning trajectory of each hole region in the array of hole regions to be formed is determined. The laser scanning trajectory is a concentric circle trajectory. The target position of each laser pulse on each laser scanning trajectory is determined in the galvanometer coordinate system. Based on the shape of the array of areas to be drilled, determine a number of AOD scanning planes covering all areas to be drilled, and determine the galvanometer scanning trajectory within each AOD scanning plane, and set the galvanometer scanning speed when the galvanometer system scans along the galvanometer scanning trajectory in the current AOD scanning plane. Determine the processing sequence when the laser beam creates holes in all areas to be created on each AOD scanning area; Obtain the AOD displacement of each laser pulse in the AOD coordinate system; The laser outputs laser pulses and the galvanometer system is controlled to scan along the galvanometer scanning trajectory at the galvanometer scanning speed. At the same time, the AOD system is controlled to deflect each laser pulse according to the AOD displacement, so that the laser pulses pass through the AOD system and the galvanometer system in sequence and act on the area to be drilled. The hole structure is processed in the area to be drilled in the current AOD scanning area according to the processing sequence of each AOD scanning area to form a hole array.

2. The aperture array laser processing method as described in claim 1, characterized in that, If the array of areas to be drilled is circular, the AOD scanning area includes: an inner circular scanning area and an annular scanning area surrounding the inner circular scanning area, with the centers of the inner circular scanning area and the annular scanning area coinciding. The inner circular scanning area is used to cover several areas to be drilled, and the annular scanning area is used to cover all remaining areas to be drilled.

3. The aperture array laser processing method as described in claim 2, characterized in that, If the array of areas to be drilled is circular, then the corresponding galvanometer scanning trajectory includes: a straight scanning trajectory located within the inner circular scanning area, passing through the center of the inner circular scanning area, and having a length equal to the diameter of the inner circular scanning area; and an arc-shaped scanning trajectory located within the annular scanning area, wherein the center of the arc-shaped scanning trajectory coincides with the center of the inner circular scanning area.

4. The aperture array laser processing method as described in claim 4, characterized in that, The arc of the arc-shaped scanning trajectory is 359.0-360°.

5. The aperture array laser processing method as described in claim 1, characterized in that, If the array of areas to be drilled is rectangular, then the AOD scanning area includes: several parallel rectangular scanning areas, and each rectangular scanning area is used to cover several areas to be drilled, and all rectangular scanning areas cover the entire area to be drilled.

6. The aperture array laser processing method as described in claim 6, characterized in that, If the array of areas to be drilled is rectangular, then the corresponding galvanometer scanning trajectory includes: a straight line scanning trajectory within the rectangular scanning area.

7. The aperture array laser processing method as described in claim 1, characterized in that, The galvanometer scanning speed V mark (k) Calculated according to the following formula: Where S(k) is the length of the galvanometer scanning trajectory within the current AOD scanning area k; f laser N is the pulse repetition frequency of the laser; N(k) is the total number of laser pulses within the current AOD scanning area k; T Laser (k) represents the time consumed by the laser to output N(k) laser pulses.

8. The aperture array laser processing method as described in claim 1, characterized in that, Determine the processing sequence for drilling holes in all areas to be drilled using the laser beam across each AOD scanning area, including the following steps: Obtain the center coordinates P of each area to be drilled within the current AOD scanning area in the galvanometer system coordinate system. i And define the galvanometer scanning trajectory R(t) within the current AOD scanning area; Define the normal to the current point on the galvanometer scanning trajectory R(t) within the current AOD scanning area as the scanning line Ls; The first contact time between the center of each area to be scanned and the scan line Ls within the current AOD scanning area is obtained using the following formula. : Where T(t) is the unit tangent vector of the galvanometer scanning trajectory R(t) at time t; i represents the i-th region to be drilled; If the initial contact time between the center of all areas to be created within the current AOD scanning area and the scanning line Ls is different, then the initial contact time will be used directly. All areas P to be drilled within the current AOD scanning area are sorted in ascending order, and the sorting result is the processing order when drilling holes.

9. The aperture array laser processing method as described in claim 8, characterized in that, If at least two current AOD scan areas have the same initial contact time with the scan line Ls; Then, calculate the normal vector s from the galvanometer scanning trajectory R(t) of each hole-making region P with the same first contact time in the ascending sorted results according to the following formula. i : in, For the galvanometer scanning trajectory R(t) in time The position at that time; for The unit normal vector at that location; According to the normal vector s i The drilling areas with the same initial contact time are arranged in descending order, and the final arrangement result is the processing order during drilling.

10. The aperture array laser processing method as described in claim 1, characterized in that, The AOD displacement of each laser pulse in the AOD coordinate system O is obtained using the following formula. : in, The homogeneous transformation matrix The inverse matrix; t(i) is the moment when the i-th laser pulse is output; Let be the displacement of the i-th laser pulse from the origin of the galvanometer coordinate system to the target position of the laser pulse in the galvanometer coordinate system. Let be the mirror displacement for the i-th laser pulse.

11. The aperture array laser processing method as described in claim 10, characterized in that, The homogeneous transformation matrix Obtain it using the following formula: Where M(α,β) is the mirror transformation matrix, and α and β are the Y-axis mirror coefficients and X-axis mirror coefficients, respectively, where α = 1 or -1 and β = 1 or -1; R(θ) is the rotation transformation matrix, and θ is the rotation angle of the AOD coordinate system relative to the galvanometer coordinate system; K is the scaling factor of the graphic.

12. A micro-hole array laser processing system based on AOD and galvanometer synergy, characterized in that, include: Laser, beam expander, AOD system, 4f system, mirror assembly, galvanometer system, lens and control system; The laser is used to output laser pulses. The laser pulses enter the AOD system after passing through the beam expander. The control system controls the AOD system to deflect each laser pulse according to the AOD displacement. The laser pulses deflected by the AOD system pass through the 4f system and the mirror group in sequence before entering the galvanometer system. The control system controls the galvanometer system to scan along the galvanometer scanning trajectory within the AOD scanning area at the galvanometer scanning speed, and deflects the laser pulses. The laser pulses deflected by the galvanometer system are output through the lens and applied to the area of ​​the workpiece to be drilled, so as to form a hole array.

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