Wiring circuit board

Abstract

A wiring circuit board (1) is provided with a frame (2), a mounting part (3), and a bonding part (4). The frame (2) and the mounting portion (3) each include a base insulating layer (11), a wiring layer (12), a cover insulating layer (13), a second wiring layer (14), and a second cover insulating layer (15). The wiring layer (12) is disposed on one surface of the base insulating layer (11). The cover insulating layer (13) is disposed on one surface of the base insulating layer (11). The second wiring layer (14) is disposed on the other surface of the base insulating layer (11). The second cover insulating layer (15) is disposed on the other surface of the base insulating layer (11). The frame (2) and the mounting portion (3) may each include a support layer (17). The support layer (17) is disposed on the other side of the second cover insulating layer (15). The joint (4) does not comprise a support layer (17). The bonding portion (4) includes a base insulating layer (11), a wiring layer (12), a cover insulating layer (13), a second wiring layer (14), and a second cover insulating layer (15).

Description

Technical Field

[0001] This invention relates to wiring circuit boards. Background Technology

[0002] Wiring circuit boards for mounting imaging elements are known (for example, see Patent Document 1 below). The wiring circuit board described in Patent Document 1 includes a frame, a mounting portion surrounded by the frame, and a support member connecting them. The support member is made of a rigid material, including stainless steel. The wiring circuit board described in Patent Document 1 is disposed in an imaging device with the imaging element mounted on the mounting portion. In the wiring circuit board described in Patent Document 1, the frame elastically supports the mounting portion using the support member.

[0003] When the camera device moves (vibrates), the frame moves (vibrates). Consequently, the mounting part wobbles (shakes) in conjunction with the movement (vibration) of the frame. However, a support member is used to correct this wobbling (shaking) of the mounting part. This correction is called wobbling correction.

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Publication No. 2020-30306 Summary of the Invention

[0005] The problem that the invention aims to solve Depending on the application and purpose of the wiring circuit board, there is a need to correct the wobbling of the mounting part with minimal force. However, the wiring circuit board described in Patent Document 1 has a drawback that fails to meet this requirement.

[0006] In particular, the wiring circuit board having a support layer, a second cover insulating layer, a second wiring layer, a base insulating layer, a wiring layer, and a cover insulating layer sequentially on one side facing the thickness direction is thicker than the second wiring circuit board having a support layer, a base insulating layer, and a wiring layer but lacking a second cover insulating layer and a second wiring layer. Therefore, in the above-described wiring circuit board, the aforementioned requirements cannot be met.

[0007] The present invention provides a wiring circuit board capable of correcting the wobbling of the mounting part with a small force.

[0008] Technical solutions for solving the problem The present invention [1] includes a wiring circuit board comprising: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a joining portion connecting the frame and the mounting portion, wherein the frame and the mounting portion each include: a base insulating layer; a wiring layer disposed on one side of the base insulating layer in the thickness direction; a cover insulating layer disposed on one side of the base insulating layer in the thickness direction and covering a portion of the wiring layer; a second wiring layer disposed on another side of the base insulating layer in the thickness direction; and a second cover insulating layer disposed on another side of the base insulating layer in the thickness direction and covering the second wiring layer, wherein the frame and the mounting portion each include a support layer disposed on the other side of the second cover insulating layer in the thickness direction, and the joining portion does not include the support layer, but includes the base insulating layer, the wiring layer, the cover insulating layer, the second wiring layer and the second cover insulating layer.

[0009] In this wiring circuit board, the joint does not include a support layer. Therefore, the rigidity of the joint is reduced. Specifically, the joint includes a base insulating layer, a wiring layer, a cover insulating layer, a second wiring layer, and a second cover insulating layer. Even if it is thicker, it does not include a support layer as described above, thus reducing the rigidity of the joint. As a result, the mounting portion can be corrected for wobbling with a small force.

[0010] The present invention [2] includes the wiring circuit board described in [1], wherein the support layer is a metal support board.

[0011] In this wiring circuit board, the support layer is a metal support substrate, thus providing excellent rigidity for both the frame and the mounting portion. Therefore, the wiring circuit board can reliably mount components using the mounting portion and reliably support them using the frame.

[0012] The present invention [3] includes the wiring circuit board described in [2], wherein the thickness of the second wiring layer is different from the thickness of the wiring layer.

[0013] In this wiring circuit board, the second wiring layer can be used for a different purpose than the wiring layer.

[0014] The present invention [4] includes the wiring circuit board described in [3], wherein the frame and the mounting portion each further comprises a third adhesive layer, the third adhesive layer bonding the support layer and the second covering insulating layer.

[0015] The present invention [5] includes the wiring circuit board described in [4], wherein the third adhesive layer is a conductive adhesive layer, the second covering insulating layer in the frame and the joint has a second covering through hole, the second wiring layer includes ground wiring, the ground wiring being grounded to the metal support substrate via a portion of the conductive adhesive layer filling the second covering through hole.

[0016] The present invention [6] includes the wiring circuit substrate described in [1], wherein the support layer is a rigid substrate, and the rigid substrate has a rigid third base insulating layer and a third wiring layer sequentially on the other side facing the thickness direction.

[0017] In this wiring circuit board, the support layer is a rigid substrate, thus the frame and mounting portion each possess excellent rigidity. Therefore, the wiring circuit board can reliably mount components using the mounting portion and reliably support them using the frame.

[0018] The present invention [7] includes the wiring circuit board described in [6], wherein the frame and the mounting portion each further include a second rigid substrate, and the second rigid substrate has a rigid fourth base insulating layer, a fourth wiring layer and a fourth cover insulating layer sequentially on one side facing the thickness direction.

[0019] In this wiring circuit board, the rigidity of the frame and the mounting part can be further improved.

[0020] The present invention [8] includes the wiring circuit board described in [1] or [2], wherein the covering insulating layer has an adhesive layer and a covering layer in sequence on one side facing the thickness direction, and the second covering insulating layer has a second adhesive layer and a second covering layer in sequence on the other side facing the thickness direction.

[0021] The present invention [9] includes the wiring circuit board described in [1] or [2], wherein the mounting portion has a generally rectangular shape, has an edge at the outer periphery of the mounting portion, the frame has a generally rectangular frame shape, has an opposing edge opposite to the edge, and a non-opposing edge adjacent to the opposing edge but not opposite to the edge, and the joining portion connects the edge and the non-opposing edge.

[0022] In this wiring circuit board, the joint connects the edge and the non-opposite edge that is not opposite to the edge, thus extending the joint. As a result, the rigidity of the joint is reduced.

[0023] The present invention

[10] includes the wiring circuit board described in [1] or [2], wherein the joint has a curved shape.

[0024] In this wiring circuit board, the joint has a curved shape, which improves the accuracy of wobbling correction compared to a straight and / or bent shape.

[0025] The present invention

[11] includes the wiring circuit board described in [1] or [2], wherein the mounting portion has an edge at the outer periphery of the mounting portion, the joining portion includes a connecting portion for the joining portion to connect on the edge, and the ratio of the length of the connecting portion to the length of the edge (length of the connecting portion / length of the edge) along the direction of the edge is 0.3 or less.

[0026] In this wiring circuit board, the ratio of the length of the connection portion along the edge direction to the length of the edge is 0.3 or less, thus suppressing the expansion of the connection portion. Therefore, the rigidity of the joint can be reliably reduced.

[0027] Furthermore, when the frame moves and the joint flexes, the difference between the force applied to the central part in the width direction and the force applied to one end in the width direction increases when the connecting part expands. Therefore, there is a situation where it is impossible to control the swaying of the mounting part with high precision.

[0028] However, in this wiring circuit board, when the frame moves and the joint flexes, the expansion of the connection is suppressed. Therefore, the difference between the force applied to the central part in the width direction and the force applied to one end in the width direction can be reduced in the joint. Thus, the wobbling of the mounting part can be controlled with high precision.

[0029] The present invention

[12] includes the wiring circuit board described in [1] or [2], wherein the mounting portion has an edge at the outer periphery of the mounting portion, the joining portion is connected to a central region, the central region including a central portion of the edge and having a length of 1 / 2 of the length of the edge.

[0030] In this wiring circuit board, the joint is connected to the central area, thus enabling high-precision control of the wobbling of the mounting part.

[0031] The present invention

[13] includes the wiring circuit board described in

[12] , wherein the joint is connected to the central portion of the edge.

[0032] In this wiring circuit board, the joint is connected to the central part, thus enabling high-precision control of the shaking of the mounting part.

[0033] The present invention

[14] includes the wiring circuit board described in [1] or [2], wherein the mounting portion has a plurality of sides on the outer periphery of the mounting portion, and the joining portion has a plurality of sides corresponding to the plurality of sides, wherein the length difference between the longest joining portion and the shortest joining portion among the plurality of joining portions is less than 3 mm.

[0034] In this wiring circuit board, the difference in length between the longest and shortest joints is less than 3mm, which improves the accuracy of the wobbling correction of the mounting part.

[0035] The present invention

[15] includes the wiring circuit board described in [1] or [2], wherein the bonding portion includes the wiring layer and the second wiring layer, the wiring layer in the bonding portion has bonding portion wiring, the second wiring layer in the bonding portion has second bonding portion wiring, the second bonding portion wiring is spaced apart from the bonding portion wiring when projected along the thickness direction, the base insulating layer, the cover insulating layer and the second cover insulating layer in the bonding portion have slits, the slits being disposed between the bonding portion wiring and the second bonding portion wiring.

[0036] In this wiring circuit board, the base insulating layer, the cover insulating layer and the second cover insulating layer in the joint have slits, which can further reduce the rigidity of the joint.

[0037] The present invention

[16] includes the wiring circuit board of

[15] , wherein the slit extends along the junction wiring and the second junction wiring, the junction having a sub-junction that divides the slit in the direction in which the slit extends and connects the junction wiring and the second junction wiring.

[0038] In this wiring circuit board, the sub-junction can suppress excessive reduction in the rigidity of the junction due to the slit. Therefore, excessive deformation of the junction can be suppressed.

[0039] Invention Effects The wiring circuit board of the present invention can correct the shaking of the mounting part with a small force. Attached Figure Description

[0040] Figure 1 This is a top view of one embodiment of the wiring circuit board of the present invention.

[0041] Figure 2 yes Figure 1 An enlarged view of the wiring circuit board shown.

[0042] Figure 3 It is along Figure 2 A cross-sectional view along line AA in the diagram.

[0043] Figure 4 (A) to (E) are Figure 3 The diagram shown is a part of the manufacturing process of the wiring circuit board. Figure 4 (A) is the process of preparing the three-layer substrate. Figure 4 (B) is the process of forming a through hole. Figure 4(C) is the process of forming vias. Figure 4 (D) is the process of forming the wiring layer and the second wiring layer. Figure 4 (E) is the process of bonding the cover layer and the second cover layer to the base film.

[0044] Figure 5 (A) through (D) are the next... Figure 4 of (E), Figure 3 The diagram shown is a part of the manufacturing process of the wiring circuit board. Figure 5 (A) is the process of forming a protective layer. Figure 5 (B) is the process of forming the joint. Figure 5 (C) is the process of bonding the support layer to the second covering insulation layer. Figure 5 (D) is the process of mounting the camera element and the external substrate onto the wiring circuit board.

[0045] Figure 6 Figures (A) to (E) are manufacturing process diagrams of the wiring circuit board of the first modified example. Figure 6 (A) is the process of attaching the cover layer and the second cover layer to the base film in the frame and mounting part. Figure 6 (B) is the process of applying solder resist to the base film in the joint. Figure 6 (C) is the process of forming a protective layer. Figure 6 (D) is the process of attaching the support layer to the frame and the mounting part. Figure 6 (E) is the process of forming the joint.

[0046] Figure 7 This is a cross-sectional view of the wiring circuit board of the second variation.

[0047] Figure 8 Figures (A) to (E) in the diagram are manufacturing process diagrams of the wiring circuit board in the second variation. Figure 8 (A) is the process of preparing the laminated body. Figure 8 (B) is the process of bonding the rigid substrate and the second rigid substrate to the laminate. Figure 8 (C) is the process of forming a through hole. Figure 8 (D) is the process of forming vias. Figure 8 (E) is the process of forming the fourth substrate insulating layer.

[0048] Figure 9 This is a cross-sectional view of the wiring circuit board of the third variation.

[0049] Figure 10 This is a top view of the wiring circuit board of the fourth variation.

[0050] Figure 11 It is along Figure 10 A cross-sectional view along line AA in the diagram. Detailed Implementation

[0051] 1. One embodiment of the wiring circuit board Reference Figures 1 to 3 An embodiment of the wiring circuit board of the present invention will be described.

[0052] 1.1 Structure of the wiring circuit board like Figure 1 As shown, the wiring circuit board 1 has a sheet shape. Figure 3 As shown, the wiring circuit board 1 has a thickness. Figure 1 As shown, the wiring circuit board 1 extends along the surface direction.

[0053] The surface direction is orthogonal to the thickness direction. The wiring circuit board 1 includes a frame 2, a mounting part 3, and a connecting part 4.

[0054] 1.2 Framework 2 In this embodiment, frame 2 has a generally rectangular shape. Frame 2 includes an inner perimeter 20. In this embodiment, frame 2 has four sides 23A, 23B, 23C, and 23D on its inner perimeter 20. The four sides 23A, 23B, 23C, and 23D are arranged counterclockwise in a top view. Sides 23A and 23C are opposite to each other. Side 23B connects one end of side 23A and one end of side 23C. Side 23D connects the other end of side 23A and the other end of side 23C. Sides 23B and 23D are opposite to each other.

[0055] like Figure 3 As shown, the frame 2 includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, a second cover insulating layer 15, a third adhesive layer 16, and a support layer 17.

[0056] 1.2.1 Substrate insulation layer 11 in frame 2 In frame 2, the base insulating layer 11 extends along the surface direction. The base insulating layer 11 in frame 2 is flexible. The base insulating layer 11 in frame 2 has a plurality of through holes 111. In this embodiment, each of the four through holes 111 is connected to one of the four edges 23A, 23B (see reference 23A, 23B). Figure 1 ), 23C (refer to) Figure 1 ), 23D (refer to Figure 1 Each should be set accordingly.

[0057] Materials used for the base insulating layer 11 in the frame 2 include, for example, resins, preferably polyimide resins.

[0058] The thickness of the base insulating layer 11 in the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 20 μm or less, preferably 15 μm or less.

[0059] 1.2.2 Wiring layer 12 in frame 2 In frame 2, wiring layer 12 is disposed on one side of substrate insulating layer 11 in the thickness direction. Wiring layer 12 is in contact with one side of substrate insulating layer 11. Figure 2 As shown, the wiring layer 12 includes multiple frame terminals 121 and multiple frame wirings 122.

[0060] 1.2.2.1 Frame terminal 121 Multiple frame terminals 121 and four sides 23A, 23B (refer to) Figure 1 ), 23C (refer to) Figure 1 ), 23D (refer to Figure 1 Each of the frame terminals 121 corresponding to edge 23A is set accordingly. The multiple frame terminals 121 corresponding to edge 23A are spaced apart from each other along edge 23A. The multiple frame terminals 121 are arranged along edge 23A.

[0061] The plurality of frame terminals 121 include a plurality of frame differential terminals 121D and a frame ground terminal 121G. In this embodiment, the frame ground terminal 121G is disposed between two frame differential terminals 121D.

[0062] like Figure 3 As shown, the frame terminal 121 has a frame terminal body 1211 and a protective layer 1212 sequentially on the side facing the thickness direction. The protective layer 1212 covers one surface of the frame terminal body 1211 in the thickness direction.

[0063] Although not shown in the diagram, side 23B (refer to...) Figure 1 ), 23C (refer to) Figure 1 ), 23D (refer to Figure 1 Each of the multiple frame terminals 121 has the same structure as the multiple frame terminals 121 corresponding to side 23A.

[0064] 1.2.2.2 Frame wiring 122 like Figure 2 As shown, each of the plurality of frame wirings 122 includes a frame differential wiring 122D. Each of the plurality of frame differential wirings 122D corresponds to a plurality of frame differential terminals 121D. Specifically, each of the plurality of frame differential wirings 122D is connected to a plurality of frame differential terminals 121D. The plurality of frame differential wirings 122D are spaced apart from each other. In this embodiment, the plurality of frame differential wirings 122D extend from each of the plurality of frame terminals 121, bend, converge, and then reach edge 23A.

[0065] Side 23B (refer to) Figure 1 ), 23C (refer to) Figure 1 ), 23D (refer to Figure 1 Each of the corresponding frame wiring 122 has the same structure as the frame wiring 122 corresponding to the aforementioned edge 23A.

[0066] Materials used for the wiring layer 12 (frame terminal body 1211) in frame 2 may include, for example, conductors. Copper is preferably used as a conductor. The protective layer 1212 may be a single layer or multiple layers. Materials used for the protective layer 1212 may include, for example, gold and nickel.

[0067] The thickness of the wiring layer 12 in the frame 2 is, for example, 35 μm or less, preferably 25 μm or less, and also, for example, 1 μm or more, preferably 5 μm or more.

[0068] 1.2.3 Covering insulation layer 13 in frame 2 like Figure 3 As shown, in frame 2, a cover insulating layer 13 is disposed on one surface of the base insulating layer 11 in the thickness direction. The cover insulating layer 13 covers the frame wiring 122 (frame differential wiring 122D, see reference 122D) which is part of the wiring layer 12. Figure 2 The covering insulation layer 13 exposes the frame terminals 121 (frame ground terminal 121G and frame differential terminal 121D), which constitute the remaining portion of the wiring layer 12. The covering insulation layer 13 is flexible. The covering insulation layer 13 has an adhesive layer 131 and a covering layer 132 sequentially on the thickness direction side.

[0069] 1.2.3.1 Adhesive layer 131 The adhesive layer 131 in frame 2 is in contact with the frame wiring 122 and the periphery of the frame wiring 122 in the substrate insulating layer 11. Another side of the adhesive layer 131 in the thickness direction follows the frame wiring 122. One side of the adhesive layer 131 in the thickness direction has a flat shape.

[0070] Materials used as adhesive layer 131 include, for example, adhesive compositions. Examples of adhesive compositions include, for example, polyimide adhesive compositions, epoxy adhesive compositions, silicone adhesive compositions, urethane adhesive compositions, and acrylic adhesive compositions. Polyimide adhesive compositions are preferred as adhesive compositions.

[0071] 1.2.3.2 Covering layer 132 Cover layer 132 is disposed on one side of adhesive layer 131 in the thickness direction. Cover layer 132 is not adhesive. Cover layer 132 is bonded to substrate insulation layer 11 and frame wiring 122 via adhesive layer 131.

[0072] Examples of materials that can be used for the cover layer 132 include polyimide resin, maleimide resin, epoxy resin, polybenzoxazole resin, and polyester resin. Polyimide resin is a preferred material for the cover layer 132.

[0073] The thickness of the covering insulating layer 13 in the frame 2 is, for example, 8 μm or more, preferably 15 μm or more, and also, for example, 100 μm, preferably 60 μm or less. The thickness of the covering insulating layer 13 is the length from one surface of the base insulating layer 11 in the thickness direction to one surface of the covering insulating layer 13 in the thickness direction.

[0074] The thickness of the adhesive layer 131 in the frame 2 is, for example, 3 μm or more, preferably 5 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less. The thickness of the adhesive layer 131 is the length from one surface of the substrate insulating layer 11 in the thickness direction to one surface of the adhesive layer 131 in the thickness direction.

[0075] The thickness of the cover layer 132 in the frame 2 is, for example, 5 μm or more, preferably 10 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less.

[0076] 1.2.4 Second wiring layer 14 in frame 2 In frame 2, the second wiring layer 14 is disposed on the other side of the substrate insulating layer 11 in the thickness direction. The second wiring layer 14 is in contact with the other side of the substrate insulating layer 11 in the thickness direction. Figure 2 As shown by the dashed line, the second wiring layer 14 includes the second frame wiring 142.

[0077] 1.2.4.1 Second Frame Wiring 142 The second frame wiring 142 is projected along the thickness direction alongside multiple frame wirings 122. Specifically, the second frame wiring 142 is positioned between two frame wirings 122 when projected along the thickness direction. The second frame wiring 142 includes a frame ground wiring 142G.

[0078] The frame grounding wiring 142G is connected to the frame grounding terminal 121G. One end 1421 of the frame grounding wiring 142G has a pad shape. For example... Figure 3 As shown, one end 1421 contacts the frame conductive connection portion 1422. The frame conductive connection portion 1422 fills the through hole 111. The frame conductive connection portion 1422 contacts the other side of the frame grounding terminal 121G in the thickness direction.

[0079] The thickness of the second wiring layer 14 in the mounting portion 3 may be the same as or different from the thickness of the wiring layer 12 in the frame 2. Preferably, the thickness of the second wiring layer 14 in the mounting portion 3 is different from the thickness of the wiring layer 12 in the frame 2. In this embodiment, the second wiring layer 14 is thicker than the wiring layer 12. The thickness of the second wiring layer 14 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 20 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less. The ratio of the thickness of the second wiring layer 14 to the thickness of the wiring layer 12 is, for example, 1.1 or more, preferably 1.2 or more, more preferably 1.5 or more, and also, for example, 10 or less.

[0080] 1.2.5 Second Covering Insulation Layer 15 in Frame 2 The second cover insulating layer 15 is disposed on the other side of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second frame wiring 142. In other words, the second cover insulating layer 15 covers the second wiring layer 14. The second cover insulating layer 15 is flexible.

[0081] The second cover insulating layer 15 has a second cover through hole 151. The second cover through hole 151 is included in one end 1421 of the second frame wiring 142 when projected along the thickness direction. The second cover insulating layer 15 has a second adhesive layer 152 and a second cover layer 153 sequentially on the other side of the thickness direction.

[0082] 1.2.5.1 Second adhesive layer 152 The second adhesive layer 152 contacts the second frame wiring 142 and the periphery of the second frame wiring 142 in the substrate insulating layer 11. One side of the second adhesive layer 152 in the thickness direction follows the second frame wiring 142. The other side of the second adhesive layer 152 in the thickness direction has a flat shape. As a material for the second adhesive layer 152, the materials exemplified in adhesive layer 131 can be used.

[0083] 1.2.5.2 Second Covering Layer 153 The second cover layer 153 is disposed on the other side of the second adhesive layer 152 in the thickness direction. The second cover layer 153 is not adhesive. The second cover layer 153 is bonded to the substrate insulating layer 11 and the second frame wiring 142 via the second adhesive layer 152. As a material for the second cover layer 153, the materials exemplified in the cover layer 132 can be used.

[0084] The thickness of the second covering insulating layer 15 in the frame 2 is, for example, 8 μm or more, preferably 15 μm or more, and also, for example, 100 μm, preferably 60 μm or less.

[0085] The thickness of the second covering insulation layer 15 is the length from the other side of the base insulation layer 11 in the thickness direction to the other side of the second covering insulation layer 15 in the thickness direction.

[0086] The thickness of the second adhesive layer 152 in the frame 2 is, for example, 3 μm or more, preferably 5 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less. The thickness of the second adhesive layer 152 is the length from the other side of the substrate insulating layer 11 in the thickness direction to the other side of the second adhesive layer 152 in the thickness direction.

[0087] The thickness of the second cover layer 153 in the frame 2 is, for example, 5 μm or more, preferably 10 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less.

[0088] 1.2.6 Third adhesive layer 16 in frame 2 The third adhesive layer 16 is disposed on the other side of the second cover insulating layer 15 in the thickness direction. A portion of the third adhesive layer 16 fills the second cover through-hole 151. A portion of the third adhesive layer 16 contacts one end 1421 of the frame grounding wiring 142G within the second cover through-hole 151. The other side of the third adhesive layer 16 in the thickness direction has a flat shape.

[0089] In this embodiment, the third adhesive layer 16 is a conductive adhesive layer 161. In other words, a portion of the conductive adhesive layer 161 fills the second covering through-hole 151. Examples of materials for the conductive adhesive layer include compositions comprising metal particles and resin, and compositions comprising conductive polymer particles and resin.

[0090] The thickness of the third adhesive layer 16 is, for example, 5 μm or more, preferably 10 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less. The thickness of the third adhesive layer 16 is the length from the other side of the second covering insulating layer 15 in the thickness direction to the other side of the third adhesive layer 16 in the thickness direction.

[0091] 1.2.7 Support layer 17 in frame 2 The support layer 17 in frame 2 is disposed on the other side of the second covering insulating layer 15 in the thickness direction. In this embodiment, the support layer 17 is in contact with the other side of the third adhesive layer 16 in the thickness direction. Thus, the support layer 17 is bonded to the other side of the second covering insulating layer 15 in the thickness direction via the third adhesive layer 16. In other words, in frame 2, the third adhesive layer 16 bonds the support layer 17 and the second covering insulating layer 15. The support layer 17 extends in the surface direction. The support layer 17 is rigid. In this embodiment, the support layer 17 is a metal support substrate 171. One end 1421 of the frame ground wiring 142G is grounded to the metal support substrate 171 via the conductive adhesive layer 161.

[0092] The material of the metal support substrate 171 is, for example, a rigid material. Examples of rigid materials include stainless steel, alloy 42, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloys. From the viewpoint of ensuring the strength of the frame 2 and the mounting part 3, stainless steel and copper alloys are preferred as rigid materials.

[0093] The thickness of the support layer 17 in the frame 2 is, for example, 30 μm or more, preferably 100 μm or more, and also, for example, 10000 μm or less, preferably 1000 μm or less.

[0094] 1.2.8 Dimensions of Frame 2 like Figure 1 As shown, the intervals between edges 23A and 23C, and between edges 23B and 23D, are each, for example, 5mm or more, preferably 8mm or more, and also, for example, 50mm or less, preferably 30mm or less. The lengths of edges 23A, 23B, 23C, and 23D are each, for example, 5mm or more, preferably 8mm or more, and also, for example, 50mm or less, preferably 30mm or less. The width of frame 2 is, for example, 0.1mm or more, preferably 0.3mm or more, and also, for example, 50mm or less, preferably 30mm or less. The width of frame 2 is the length between the inner perimeter 20 and the outer perimeter.

[0095] like Figure 2 As shown, the width of each of the plurality of frame terminals 121 is, for example, 10 μm or more, preferably 30 μm or more, and also, for example, 3000 μm or less, preferably 1000 μm or less. The width of the frame wiring 122 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 3000 μm or less, preferably 1000 μm or less.

[0096] The width of one end 1421 of the second frame wiring 142 is, for example, 10 μm or more, preferably 30 μm or more, and also, for example, 3000 μm or less, preferably 1000 μm or less. The width of the second frame wiring 142 other than one end 1421 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 3000 μm or less, preferably 1000 μm or less.

[0097] 1.3 Mounting Unit 3 like Figure 1 As shown, the mounting portion 3 is surrounded by the frame 2. The mounting portion 3 is spaced apart from the frame 2. In this embodiment, the mounting portion 3 has a generally rectangular shape. Preferably, the mounting portion 3 has a generally rectangular shape, specifically, a generally rectangular frame shape. The mounting portion 3 includes an outer periphery 30 and an inner periphery 39. In this embodiment, the mounting portion 3 includes four sides 33A, 33B, 33C, and 33D on the outer periphery 30.

[0098] The four sides 33A, 33B, 33C, and 33D are arranged counterclockwise in sequence when viewed from above. The sides 33A, 33B, 33C, and 33D of the mounting part 3 are each opposite to the sides 23A, 23B, 23C, and 23D of the frame 2.

[0099] In other words, edge 33B of mounting part 3 is opposite to edge 23B of frame 2. In other words, edge 23B is the opposite edge to edge 33B. Edge 33B extends in the same direction as edge 23B.

[0100] The edge 33B of the mounting part 3 is not opposite to the edge 23A of the frame 2 (not opposed). In other words, edge 23A is a non-opposite edge relative to edge 33B. Edge 33B is adjacent to edge 33A. Edge 33B extends in a direction intersecting edge 23A. Preferably, edge 33B extends in a direction orthogonal to edge 23A.

[0101] Edge 33C runs in the same direction as edge 33A. Edge 33B connects one end of edge 33A and one end of edge 33C. Edge 33D connects the other end of edge 33A and the other end of edge 33C. Edge 33D runs in the same direction as edge 33B.

[0102] like Figure 3 As shown, the mounting part 3 includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, a second cover insulating layer 15, a third adhesive layer 16, and a support layer 17.

[0103] 1.3.1 The base insulating layer 11 in the mounting part 3 In the mounting portion 3, the base insulating layer 11 extends along the surface direction. The base insulating layer 11 in the mounting portion 3 has a plurality of through holes 112. In this embodiment, each of the four through holes 112 is connected to one of the four edges 33A (see reference). Figure 1 ), 33B, 33C (refer to) Figure 1 ), 33D (refer to Figure 1 Each is provided accordingly. The base insulation layer 11 in the mounting part 3 is flexible. The material and thickness of the base insulation layer 11 in the mounting part 3 are the same as those of the base insulation layer 11 in the frame 2.

[0104] 1.3.2 Wiring layer 12 in mounting unit 3 In the mounting section 3, the wiring layer 12 is disposed on one surface of the substrate insulating layer 11 in the thickness direction. The wiring layer 12 is in contact with one surface of the substrate insulating layer 11. Figure 2 As shown, the wiring layer 12 in the mounting section 3 has a plurality of terminals 123 and a plurality of wirings 124.

[0105] 1.3.2.1 Terminal 123 Multiple terminals 123 each connect to four sides 33A (see reference) Figure 1 ), 33B, 33C (refer to) Figure 1 ), 33D (refer to Figure 1 Each terminal 123 is configured accordingly. Specifically, the multiple terminals 123 corresponding to edge 33B are spaced apart from each other in the direction along edge 33B. The multiple terminals 123 are arranged in the direction along edge 33B.

[0106] The plurality of terminals 123 include a plurality of differential terminals 123D and a ground terminal 123G. In this embodiment, the ground terminal 123G is disposed between two differential terminals 123D.

[0107] Although not shown in the diagram, side 33A (refer to...) Figure 1 ), 33C (refer to) Figure 1 ), 33D (refer to Figure 1 Each of the multiple terminals 123 has the same structure as the terminal 123 corresponding to edge 33B.

[0108] like Figure 3 As shown, the terminal 123 has a terminal body 1231 and a protective layer 1232 on the side facing the thickness direction. The protective layer 1232 covers one surface of the terminal body 1231 in the thickness direction.

[0109] 1.3.2.2 Wiring 124 like Figure 2As shown, each of the plurality of wirings 124 includes a differential wiring 124D. Each of the plurality of differential wirings 124D corresponds to a plurality of differential terminals 123D. Specifically, each of the plurality of differential wirings 124D is connected to a plurality of differential terminals 123D. The plurality of differential wirings 124D are spaced apart from each other. In this embodiment, each of the plurality of differential wirings 124D extends from a plurality of differential terminals 123D, then converges to each other, and then reaches edge 33B.

[0110] Side 33A (refer to) Figure 1 ), 33C (refer to) Figure 1 ), 33D (refer to Figure 1 Each of the corresponding wiring 124 has the same structure as the wiring 124 corresponding to the edge 33B mentioned above.

[0111] The material and thickness of the wiring 124 in the mounting part 3 are the same as those of the wiring 124 in the frame 2.

[0112] 1.3.3 Covering insulation layer 13 in mounting part 3 Although not shown in the figure, in the mounting part 3, the covering insulating layer 13 is disposed on one side of the base insulating layer 11 in the thickness direction. The covering insulating layer 13 covers the wiring 124 (differential wiring 124D, see reference 124) which is part of the wiring layer 12. Figure 2 The insulating layer 13 covers the remaining portion of the wiring layer 12, including terminals 123 (differential terminal 123D, ground terminal 123G, see reference 123D). Figure 2 The insulating layer 13 is exposed. The insulating layer 13 is flexible. The insulating layer 13 has an adhesive layer 131 and a covering layer 132 in sequence on the side facing the thickness direction.

[0113] 1.3.3.1 Adhesive layer 131 The adhesive layer 131 (not shown) in the mounting part 3 is in contact with the wiring 124 and the periphery of the wiring 124 in the base insulating layer 11. Another side of the adhesive layer 131 in the thickness direction follows the wiring 124. One side of the adhesive layer 131 in the thickness direction has a flat shape. The material and thickness of the adhesive layer 131 in the mounting part 3 are the same as those of the adhesive layer 131 in the frame 2.

[0114] The cover layer 132 (not shown) in the mounting part 3 is disposed on one side of the adhesive layer 131 in the thickness direction. The cover layer 132 is bonded to the base insulating layer 11 and the wiring 124 via the adhesive layer 131. The material and thickness of the cover layer 132 in the mounting part 3 are the same as those of the cover layer 132 in the frame 2.

[0115] The thickness of the insulating layer 13 in the mounting part 3 is the same as the thickness of the covering layer 132 in the frame 2.

[0116] 1.3.4 Second wiring layer 14 in mounting unit 3 In the mounting portion 3, the second wiring layer 14 is disposed on the other side of the substrate insulating layer 11 in the thickness direction. The second wiring layer 14 is in contact with the other side of the substrate insulating layer 11 in the thickness direction. Figure 2 As shown by the dashed line, the second wiring layer 14 includes the second wiring 143.

[0117] 1.3.4.1 Second wiring 143 The second wiring 143 is projected along the thickness direction alongside the plurality of wirings 124. Specifically, the second wiring 143 is positioned between the two wirings 124 when projected along the thickness direction.

[0118] The second wiring 143 includes grounding wiring 143G.

[0119] Grounding wiring 143G is connected to grounding terminal 123G. One end 1431 of the second wiring 143 has a pad shape. For example... Figure 3 As shown, one end 1431 contacts the conductive connection portion 1432. The conductive connection portion 1432 fills the through hole 112. The conductive connection portion 1432 contacts the grounding terminal 123G.

[0120] The thickness of the second wiring layer 14 in the mounting part 3 is the same as the thickness of the second wiring layer 14 in the frame 2.

[0121] 1.3.5 The second covering insulating layer 15 in the mounting part 3 The second cover insulating layer 15 in the mounting portion 3 is disposed on the other side of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second wiring 143. In other words, the second cover insulating layer 15 covers the second wiring layer 14. The second cover insulating layer 15 is flexible. The second cover insulating layer 15 has a second cover through hole 154. The second cover through hole 154 is included in one end 1431 of the second wiring 143 when projected in the thickness direction. The second cover insulating layer 15 in the mounting portion 3 has a second adhesive layer 152 and a second cover layer 153 sequentially disposed on the other side in the thickness direction.

[0122] 1.3.5.1 Second adhesive layer 152 The second adhesive layer 152 contacts the second wiring 143 and the periphery of the second wiring 143 in the base insulating layer 11. One side of the second adhesive layer 152 in the thickness direction follows the ground wiring 143G. The other side of the second adhesive layer 152 in the thickness direction has a flat shape. The material and thickness of the second adhesive layer 152 in the mounting part 3 are the same as those of the second adhesive layer 152 in the frame 2.

[0123] 1.3.5.2 Second Covering Layer 153 The second cover layer 153 is disposed on the other side of the second adhesive layer 152 in the thickness direction. The second cover layer 153 is bonded to the base insulating layer 11 and the second wiring 143 via the second adhesive layer 152. In other words, the second adhesive layer 152 bonds the second cover layer 153 to the base insulating layer 11 and the second wiring 143. The material and thickness of the second cover layer 153 in the mounting part 3 are the same as those of the second cover layer 153 in the frame 2.

[0124] The thickness of the second covering insulation layer 15 in the mounting part 3 is the same as the thickness of the second covering insulation layer 15 in the frame 2.

[0125] 1.3.6 The third adhesive layer 16 in the mounting part 3 The third adhesive layer 16 is disposed on the other side of the second cover insulating layer 15 in the thickness direction. A portion of the third adhesive layer 16 fills the second cover through hole 154. A portion of the third adhesive layer 16 contacts one end 1431 of the second wiring 143 within the second cover through hole 154.

[0126] One side of the third adhesive layer 16 follows the shape of the second covering insulating layer 15 in the thickness direction.

[0127] The third adhesive layer 16 has a flat shape on the other side in the thickness direction.

[0128] In this embodiment, the third adhesive layer 16 is a conductive adhesive layer 162. In other words, a portion of the conductive adhesive layer 162 fills the second covering through-hole 154. The material and thickness of the third adhesive layer 16 in the mounting part 3 are the same as those of the third adhesive layer 16 in the frame 2.

[0129] 1.3.7 Support layer 17 in mounting part 3 The support layer 17 in the mounting portion 3 is disposed on the other side of the second covering insulating layer 15 in the thickness direction. In this embodiment, the support layer 17 is in contact with the other side of the third adhesive layer 16 in the thickness direction. Thus, the support layer 17 is bonded to the other side of the second covering insulating layer 15 in the thickness direction via the third adhesive layer 16. In other words, in the mounting portion 3, the third adhesive layer 16 bonds the support layer 17 and the second covering insulating layer 15. One end 1431 of the grounding wiring 143G is grounded to the metal support substrate 171 via the conductive adhesive layer 162. The support layer 17 extends in the surface direction. The support layer 17 is rigid. In this embodiment, the support layer 17 is the metal support substrate 172. The material and thickness of the support layer 17 in the mounting portion 3 are the same as those of the support layer 17 in the frame 2.

[0130] 1.3.8 Dimensions of Mounting Unit 3 like Figure 1 As shown, the interval between sides 33A and 33C, and the interval between sides 33B and 33D, are each, for example, 3mm or more, preferably 5mm or more, and also, for example, 50mm or less, preferably 30mm or less. The length of each of sides 33A, 33B, 33C, and 33D is, for example, 3mm or more, preferably 5mm or more, and also, for example, 50mm or less, preferably 30mm or less.

[0131] The width of the mounting portion 3 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and also, for example, 30 mm or less, preferably 20 mm or less. The width of the mounting portion 3 is the length between the outer periphery 30 and the inner periphery 39.

[0132] like Figure 2 As shown, the width of each of the plurality of terminals 123 is the same as the width of each of the plurality of frame terminals 121 described above. The width of the wiring 124 is the same as the width of the frame wiring 122 described above. The width of the second wiring 143 is the same as the width of the second frame wiring 142 described above.

[0133] 1.4 Joint 4 A joint 4 is disposed between the frame 2 and the mounting part 3. The joint 4 connects the frame 2 and the mounting part 3. Multiple joints 4 are provided corresponding to multiple edges 33 in the mounting part 3. Figure 1 As shown, in this embodiment, each of the plurality of joints 4A, 4B, 4C, and 4D corresponds to a plurality of edges 33B, 33C, 33D, and 33A in the mounting part 3. Specifically, joint 4A connects edge 23A in the frame 2 to edge 33B in the mounting part 3. Joint 4B connects edge 23B in the frame 2 to edge 33C in the mounting part 3. Joint 4C connects edge 23C in the frame 2 to edge 33D in the mounting part 3. Joint 4D connects edge 23D in the frame 2 to edge 33A in the mounting part 3.

[0134] The details of joint 4A are described below. Joints 4B, 4C, and 4D have the same structure as joint 4A, and their details are omitted.

[0135] 1.4.1 Shape of joint 4A like Figure 2As shown, in this embodiment, the joint 4A has a curved shape when viewed from above. Preferably, the joint 4A does not have a straight shape and / or a bent shape, but only a curved shape. Specifically, the joint 4A has an S-shaped or hook-shaped shape. If the joint 4A has a curved shape, stress will not be locally concentrated and can be evenly mitigated, thus improving the accuracy of the sway correction of the mounting part 3.

[0136] 1.4.2 Connection of joint 4 to mounting part 3 The joint 4A is connected to the converging portion 32 in the mounting portion 3. In the converging portion 32, multiple wirings 124 converge.

[0137] The joint 4A includes a connecting portion 45. For example... Figure 1 As shown, for example, the connecting portion 45 is connected to the central region 34 of the edge 33B in the mounting portion 3.

[0138] The central region 34 is the region containing the central portion 35 in the edge 33B. The central portion 35 is the central point and its vicinity in the edge 33B. The central region 34 has a length of 1 / 2 the length of the edge 33B. Preferably, the central region 34 has a length of 1 / 3 the length of the edge 33B, more preferably, it has a length of 1 / 4 the length of the edge 33B.

[0139] Preferably, the joint 4A is connected to the central part 35 of the edge 33B.

[0140] The ratio of the length of the connecting portion 45 along the direction of edge 33B to the length of edge 33B (length of connecting portion 45 / length of edge 33B) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and also, for example, 0.01 or more.

[0141] If the ratio of the length of the connecting portion 45 along the direction of edge 33B to the length of edge 33B is below the aforementioned upper limit, then the expansion of the connecting portion 45 in the direction in which edge 33B extends is suppressed. Therefore, the rigidity of the joint 4A can be reliably reduced.

[0142] 1.4.3 Connection of joint 4 to frame 2 like Figure 2 As shown, the joint 4A is connected to the frame convergence portion 26 in the frame 2. The joint 4A includes a second connecting portion 46. Figure 1 As shown, for example, the second connecting part 46 is connected to the second central region 29 of the edge 23A in the frame 2.

[0143] The second central region 29 is the region containing the second central portion 28 within edge 23A. The second central portion 28 is the central point of edge 23A and its vicinity. The second central region 29 has a length of 1 / 2 that of edge 23A. Preferably, the second central region 29 has a length of 1 / 3 that of edge 23A. More preferably, the second central region 29 has a length of 1 / 4 that of edge 23A.

[0144] Preferably, the joint 4A is connected to the second central portion 28 of the edge 23A.

[0145] The ratio of the length of the second connecting portion 46 along the direction of edge 23A to the length of edge 23A (length of the second connecting portion 46 / length of edge 23A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and also, for example, 0.01 or more.

[0146] If the ratio of the length of the second connecting portion 46 along the direction of edge 23A to the length of edge 23A is below the aforementioned upper limit, then the expansion of the second connecting portion 46 in the direction in which edge 23A extends is suppressed. Therefore, the rigidity of the joint 4A can be reliably reduced.

[0147] 1.4.4. Layer structure of joint 4A like Figure 3 As shown, the joint 4A includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, and a second cover insulating layer 15.

[0148] The joint 4A does not include the support layer 17 at least. In this embodiment, the joint 4A does not include the third adhesive layer 16 and the support layer 17.

[0149] 1.4.5 The base insulating layer 11 in the joint 4A like Figure 2 As shown, the base insulating layer 11 in the joint 4A includes slits 411 and 412. Slits 411 and 412 are respectively along the wiring layer 12 and the second wiring layer 14. The material and thickness of the base insulating layer 11 in the joint 4A are the same as those of the base insulating layer 11 in the frame 2.

[0150] 1.4.6 Wiring layer 12 in joint 4A The wiring layer 12 in the joint 4A includes joint wiring 125. In this embodiment, the wiring layer 12 in the joint 4A only includes joint wiring 125. Figure 3As shown, the joint wiring 125 is disposed on one surface of the base insulating layer 11 in the thickness direction. The joint wiring 125 contacts one surface of the base insulating layer 11 in the thickness direction. Both ends of the joint wiring 125 are respectively connected to the frame differential wiring 122D and differential wiring 124D. In this embodiment, the two joint wirings 125 can function as differential wirings. For example, the two joint wirings 125 operate as a differential pair. The material and thickness of the wiring layer 12 in the joint 4A are the same as those of the wiring layer 12 in the frame 2.

[0151] 1.4.7 Covering insulation layer 13 in joint 4A The covering insulating layer 13 in the joint 4A extends along the direction in which the wiring layer 12 and the second wiring layer 14 extend. The covering insulating layer 13 is disposed on one surface of the base insulating layer 11 in the thickness direction. The covering insulating layer 13 in the joint 4A covers the wiring layer 12. The covering insulating layer 13 in the joint 4A includes slits 411, 412 and the base insulating layer 11. The structure, material, and thickness of the covering insulating layer 13 in the joint 4A are the same as those of the covering insulating layer 13 in the frame 2. It should be noted that the covering insulating layer 13 in the joint 4A has an adhesive layer 131 and a covering layer 132 sequentially on the side facing the thickness direction.

[0152] 1.4.8 Second wiring layer 14 in joint 4A The second wiring layer 14 in the joint 4A includes a second joint wiring 144. In this embodiment, the second wiring layer 14 in the joint 4A includes only the second joint wiring 144. The second joint wiring 144 is disposed on the other side of the substrate insulating layer 11 in the thickness direction. The second joint wiring 144 is in contact with the other side of the substrate insulating layer 11 in the thickness direction. The second joint wiring 144 is spaced apart from the joint wiring 125 when projected along the thickness direction. It is disposed between the second joint wiring 144 and the joint wiring 125. Both ends of the joint wiring 125 are respectively connected to the frame ground wiring 142G and the ground wiring 143G. Therefore, the second joint wiring 144 functions as the joint ground wiring 144G. The material and thickness of the second wiring layer 14 in the joint 4A are the same as those of the second wiring layer 14 in the frame 2.

[0153] 1.4.9 Second covering insulation layer 15 in joint 4A The second cover insulating layer 15 in the joint 4A extends along the direction in which the wiring layer 12 and the second wiring layer 14 extend. The second cover insulating layer 15 is disposed on the other side of the base insulating layer 11 in the thickness direction. The second cover insulating layer 15 covers the second wiring 143. The cover insulating layer 13 in the joint 4A includes slits 411, 412 and the base insulating layer 11 and the cover insulating layer 13. The material and thickness of the second cover insulating layer 15 in the joint 4A are the same as those of the second cover insulating layer 15 in the frame 2.

[0154] The width of each of the joint wiring 125 and the second joint wiring 144 is, for example, 10 μm or more, preferably 30 μm or more, and also, for example, 3000 μm or less, preferably 1000 μm or less.

[0155] 1.4.10 Slits 411 and 412 like Figure 2 As shown, the multiple slits 411 and 412 are spaced apart from each other in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction).

[0156] Multiple slits 411 and 412 are each disposed in the joint 4 along the direction in which the joint 4 extends. The multiple slits 411 and 412 are arranged sequentially in the intersecting direction. When projected along the thickness direction, the multiple slits 411 and 412 separate the wiring layer 12 and the second wiring layer 14. Specifically, the joint wiring 125, slits 411, the second joint wiring 144, slits 412, and the joint wiring 125 are arranged sequentially in the intersecting direction. In other words, slits 411 and 412 are each disposed between the joint wiring 125 and the second joint wiring 144.

[0157] The width of each of the slits 411 and 412 is, for example, 5 μm or more, preferably 10 μm or more, and also, for example, 500 μm or less, preferably 300 μm or less.

[0158] The lengths of the multiple joints 4A, 4B, 4C, and 4D can be the same or different. When the lengths of the multiple joints 4A, 4B, 4C, and 4D are different, the difference between the length of the longest joint 4 and the shortest joint 4 is, for example, 3 mm or less, preferably 2 mm or less, and more preferably 1.5 mm or less. If the difference between the lengths of the longest joint 4 and the shortest joint 4 is below the aforementioned upper limit, the accuracy of the sway correction of the mounting part 3 can be improved.

[0159] 1.5 Manufacturing method of wiring circuit board 1 Next, refer to Figure 4 (A) to Figure 5(D) describes the manufacturing method of the wiring circuit board 1 and the mounting of the camera element 5.

[0160] like Figure 4 As shown in (A), in this method, firstly, a three-layer substrate 6 is prepared. The three-layer substrate 6 extends along the surface direction. The three-layer substrate 6 includes a base film 61, a conductor foil 62, and a second conductor foil 63.

[0161] The base film 61 extends along the surface direction.

[0162] The conductor foil 62 is disposed on one side of the base film 61 in the thickness direction. The conductor foil 62 is in full contact with one side of the base film 61.

[0163] The second conductor foil 63 is disposed on the other side of the base film 61 in the thickness direction. The second conductor foil 63 is in full contact with the other side of the base film 61.

[0164] like Figure 4 As shown in (B), in this method, through holes 111 and 112 are then formed in the three-layer substrate 6. The through holes 111 and 112 are formed, for example, using laser processing. The through holes 111 and 112 each penetrate the three-layer substrate 6 in the thickness direction.

[0165] like Figure 4 As shown in (C), in this method, vias 113 and 114 are then formed within the through holes 111 and 112, respectively. In forming the vias 113 and 114, through-hole plating is used, for example.

[0166] The via 113 includes a frame conductive connection portion 1422 at its middle portion in the thickness direction. The frame conductive connection portion 1422 fills the through hole 111 in the base film 61.

[0167] The via 114 includes a conductive connection portion 1432 at its middle portion in the thickness direction. The conductive connection portion 1432 fills the through hole 112 in the base film 61.

[0168] like Figure 4 As shown in (D), in this method, a wiring layer 12 is then formed from a conductor foil 62, and a second wiring layer 14 is formed from a second conductor foil 63.

[0169] In the formation of wiring layer 12 and second wiring layer 14, conductor foil 62 and second conductor foil 63 are etched respectively. During etching, an etching resist (not shown) is used. The etching resist is prepared by exposure and development of a dry film resist (not shown).

[0170] like Figure 4As shown in (E), in this method, the covering insulating layer 13 and the second covering insulating layer 15 are then formed on one side and the other side of the base film 61 in the thickness direction, respectively.

[0171] For example, the cover layer 132 is adhered to one side of the base film 61 in the thickness direction and one side of the conductor foil 62 in the thickness direction via the adhesive layer 131. Then, the cover layer 132 and the adhesive layer 131 are shaped to expose the frame terminals 121 and 123. In the shaping of the cover layer 132 and the adhesive layer 131, for example, laser processing is used.

[0172] For example, the second cover layer 153 is adhered to the other side of the base film 61 in the thickness direction and the other side of the second conductor foil 63 in the thickness direction via the second adhesive layer 152. Then, second cover through holes 151 and 154 are formed in the second cover layer 153 and the second adhesive layer 152. The formation of the second cover through holes 151 and 154 is, for example, using laser processing.

[0173] like Figure 5 As shown in (A), in this method, protective layers 1212 and 1232 are then formed on the frame terminal body 1211 and the terminal body 1231, respectively. In forming the protective layers 1212 and 1232, plating is used, for example. Thus, the frame terminal 121 and the terminal 123 are formed, respectively.

[0174] like Figure 5 As shown in (B), in this method, slits 411 and 412 are then formed on the base insulating layer 11, the cover insulating layer 13, and the second cover insulating layer 15. The slits 411 and 412 are formed, for example, using laser processing.

[0175] like Figure 5 As shown in (C), the support layer 17 is bonded to the other side of the second cover insulating layer 15 in the thickness direction via the third adhesive layer 16. At this time, a portion of the third adhesive layer 16 fills the second cover through holes 151 and 154. Thus, one end 1421 of the frame grounding wiring 142G is grounded to the metal support substrate 171 via the third adhesive layer 16, and one end 1431 of the grounding wiring 143G is grounded to the metal support substrate 172 via the third adhesive layer 16.

[0176] Thus, a wiring circuit board 1 is manufactured.

[0177] Then, as Figure 5 As shown in (D), the camera element 5 is mounted on the mounting section 3. The electrodes 51 of the camera element 5 are electrically connected to a plurality of terminals 123 in the mounting section 3. It should be noted that the camera element 5 can be mounted on the mounting section 3 via a mounting substrate (not shown).

[0178] Furthermore, the outer substrate 7 is mounted on the frame 2. The electrodes 71 of the outer substrate 7 are electrically connected to a plurality of frame terminals 121 in the frame 2. The outer edge 24 of the frame 2 (refer to...) Figure 1 It can also be supported on external components (not shown).

[0179] 2. Effects of one implementation method In this wiring circuit board 1, the joint 4 does not include the support layer 17. Therefore, the rigidity of the joint 4 is reduced. Specifically, the joint 4 includes a base insulating layer 11, a wiring layer 12, a cover insulating layer 13, a second wiring layer 14, and a second cover insulating layer 15, and the joint 4 is thicker. However, as described above, the joint 4 does not include the support layer 17, therefore the rigidity of the joint 4 is reduced. As a result, the wobbling of the mounting part 3 can be corrected with a small force.

[0180] Furthermore, the wiring circuit board 1 has wiring layers 12 and second wiring layers 14 on both sides of the covering insulating layer 13 in the thickness direction, thereby increasing the winding (configuration freedom) of the circuit (wiring pattern).

[0181] In this wiring circuit board 1, the support layer 17 is a metal support substrate 171, thus the frame 2 and the mounting portion 3 each have excellent rigidity. Therefore, the wiring circuit board 1 can reliably mount the camera element 5 using the mounting portion 3 and reliably support it using the frame 2.

[0182] In this wiring circuit board 1, since the second wiring layer 14 and the wiring layer 12 have different thicknesses, the second wiring layer 14 can be used for a different purpose than the wiring layer 12. Specifically, the second wiring layer 14 can be made thicker than the wiring layer 12, so that it functions as a ground layer capable of carrying large currents.

[0183] In this wiring circuit board 1, the joint 4A connects the edge 33B and the non-opposite edge 23A that is not opposite to the edge 33B, thus extending the joint 4A. As a result, the rigidity of the joint 4A is reduced.

[0184] In this wiring circuit board, the joint 4A has a curved shape, which improves the accuracy of wobbling correction compared to a straight shape and / or a bent shape.

[0185] In this wiring circuit board 1, the ratio of the length of the connection portion 45 along the direction of edge 33B to the length of edge 33B is 0.3 or less, thus suppressing the expansion of the connection portion 45. Therefore, the rigidity of the joint portion 4A can be reliably reduced.

[0186] In this wiring circuit board 1, the joint 4A is connected to the central region 34, so the shaking of the mounting part 3 can be controlled with high precision.

[0187] In this wiring circuit board 1, the joint 4 is connected to the central part 35, so the shaking of the mounting part 3 can be controlled with high precision.

[0188] In this wiring circuit board, the base insulating layer 11, the cover insulating layer 13 and the second cover insulating layer 15 in the joint 4A have slits 411 and 412, which can further reduce the rigidity of the joint 4A.

[0189] 3. Variations In the following variations, the same reference numerals are used to mark the same components and processes as in the first embodiment described above, and detailed descriptions are omitted. Furthermore, unless otherwise specified, each variation achieves the same effect as the first embodiment. Moreover, the first embodiment and its variations can be appropriately combined.

[0190] 3.1 First Variation like Figure 6 As shown in (E), the cover insulation layer 13 and the second cover insulation layer 15 may also include solder resist 8. At least in the joint 4A, the cover insulation layer 13 and the second cover insulation layer 15 each include only solder resist 8, excluding adhesive layer 131 and second adhesive layer 152.

[0191] Reference Figure 6 (A) to (E) describe the manufacturing method of the wiring circuit board 1 of the first modified example.

[0192] like Figure 6 As shown in (A), a cover layer 132 and an adhesive layer 131 are disposed on one side of the base film 61 in the frame 2 and the mounting portion 3. A second cover layer 153 and a second adhesive layer 152 are disposed on the other side of the base film 61 in the frame 2 and the mounting portion 3.

[0193] like Figure 6 As shown in (B), solder resist 8 is disposed on one side and the other side of the base film 61 in the joint 4. The solder resist 8 is patterned by optical processing.

[0194] like Figure 6 As shown in (C), protective layers 1212 and 1232 are respectively formed on the frame terminal body 1211 and the terminal body 1231.

[0195] like Figure 6 As shown in (D), the support layer 17 and the third adhesive layer 16 are disposed on the frame 2 and the mounting part 3.

[0196] like Figure 6 As shown in (E), slits 411 and 412 are formed in solder resist 8.

[0197] 3.1.1 Effects of the First Variation In the first modified example, the solder resist 8 in the joint 4A does not include the adhesive layer 131 and the second adhesive layer 152, thus allowing the joint 4A to be thinner. Therefore, the rigidity of the joint 4A is further reduced. As a result, the mounting part 3 can be corrected for wobbling with a small force.

[0198] 3.2 Second variation like Figure 7 As shown, in the second variation, the support layer 17 is a rigid substrate 173. The rigid substrate 173 is bonded to the second covering insulating layer 15 via a fourth adhesive layer 174.

[0199] The rigid substrate 173 has a third base insulating layer 1731 and a third wiring layer 1732 on the other side facing the thickness direction.

[0200] The third substrate insulating layer 1731 extends along the surface direction. The third substrate insulating layer 1731 is rigid. Examples of materials for the third substrate insulating layer 1731 include glass-epoxy resin. The third substrate insulating layer 1731 has through-holes 1735. Through-holes 1735 are also formed in the fourth adhesive layer 174. The thickness of the third substrate insulating layer 1731 is, for example, 30 μm or more, and also, for example, 1000 μm or less.

[0201] The third wiring layer 1732 is electrically connected to the second wiring layer 14 via vias 175. Each of the plurality of vias 175 fills a plurality of through-holes 1735. The vias 175 are in contact with both the third wiring layer 1732 and the second wiring layer 14. Copper can be used as a material for the third wiring layer 1732. The thickness of the third wiring layer 1732 is, for example, 5 μm or more, and also, for example, 1000 μm or less.

[0202] In addition to the rigid substrate 173 described above, both the frame 2 and the mounting part 3 have a second rigid substrate 176. The second rigid substrate 176 is bonded to the covering insulating layer 13 via a fifth adhesive layer 177.

[0203] The second rigid substrate 176 has a fourth base insulating layer 1761, a fourth wiring layer 1762 and a fourth cover insulating layer 1763 sequentially on the side facing the thickness direction.

[0204] The fourth substrate insulating layer 1761 covers a portion of the fourth wiring layer 1762.

[0205] The fourth substrate insulating layer 1761 has a through hole 1760. The material of the fourth substrate insulating layer 1761 is the same as that of the third substrate insulating layer 1731.

[0206] The fourth wiring layer 1762 is made of the same material as the third wiring layer 1732. The fourth wiring layer 1762 is electrically connected to the wiring layer 12 via via 178. Via 178 fills the through-hole 1760.

[0207] Solder resist can be cited as a material for the fourth covering insulating layer 1763.

[0208] Reference Figure 8 In sections (A) to (E), the manufacturing method of the wiring circuit board 1 of the second modified example will be described.

[0209] like Figure 8 As shown in (A), firstly, a cover layer 132 and a second cover layer 153 are bonded to a base film 61 on which wiring layer 12 and second wiring layer 14 are provided, in order to prepare a laminate 10.

[0210] like Figure 8 As shown in (B), the rigid substrate 173 and the second rigid substrate 176 (the fourth base insulating layer 1761 and the fourth wiring layer 1762) are then respectively bonded to one side and the other side of the laminate 10. Specifically, the rigid substrate 173 is bonded to the other side of the laminate 10 in the frame 2 and the mounting portion 3 via the fourth adhesive layer 174. The second rigid substrate 176 is bonded to one side of the laminate 10 in the frame 2 and the mounting portion 3 via the fifth adhesive layer 177.

[0211] like Figure 8 As shown in (C), through holes 1735 and 1760 are then formed. Through hole 1735 is formed on the rigid substrate 173, the fourth adhesive layer 174, and the second cover insulating layer 15. Through hole 1760 is formed on the second rigid substrate 176, the fifth adhesive layer 177, and the cover insulating layer 13. Drilling is used, for example, to form the through holes 1735 and 1736.

[0212] like Figure 8 As shown in (D), vias 175 and 178 are then formed in through holes 1735 and 1760, respectively. In the formation of vias 175 and 178, through-hole plating is used, for example.

[0213] like Figure 8 As shown in (E), a fourth cover insulating layer 1763 is then formed on one surface of the fourth base insulating layer 1761 in the thickness direction. The fourth cover insulating layer 1763 is patterned by optical processing.

[0214] Then, as Figure 7 As shown, slits 421 and 422 are formed on the base insulating layer 11, the cover insulating layer 13 and the second cover insulating layer 15.

[0215] 3.2.1 Effects of the Second Modification In this wiring circuit board 1, the support layer 17 is a rigid substrate 173, thus the frame 2 and the mounting portion 3 each have excellent rigidity. The wiring circuit board 1 can reliably mount the camera element 5 using the mounting portion 3 and reliably support it using the frame 2.

[0216] The frame 2 and the mounting part 3 each also have a second rigid substrate 176, which can further improve the rigidity of the frame 2 and the mounting part 3.

[0217] 3.3 Third variation like Figure 9 As shown, in the third variation, the rigid substrate 173 further includes an additional insulating layer 1737 and an additional wiring layer 1738.

[0218] An additional insulating layer 1737 covers a portion of the third wiring layer 1732. The additional insulating layer 1737 has an opening 1739.

[0219] An additional wiring layer 1738 is disposed on the other side of the additional covering insulating layer 1737. A portion of the additional wiring layer 1738 fills the opening 1739.

[0220] 3.4 Fourth Variation Example like Figure 10 as well as Figure 11 As shown, in the fourth modified example, the joint 4A has sub-joints 4211, 4212, 4221, and 4222.

[0221] Sub-joints 4211 and 4212 each divide the slit 411 in the direction in which the slit 411 extends. Sub-joints 4211 and 4212 are spaced apart in the direction in which the slit 411 extends.

[0222] Sub-joints 4221 and 4222 divide the slit 412 in the direction in which the slit 412 extends. Sub-joints 4221 and 4222 are spaced apart in the direction in which the slit 412 extends.

[0223] like Figure 10 As shown, sub-joints 4211 and 4221 are arranged in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction). Sub-joints 4212 and 4222 are arranged in a direction that intersects the direction in which the joint 4 extends (intersecting direction, preferably orthogonal direction).

[0224] Sub-joints 4211 and 4212 each connect the joint wiring 125 and the second joint wiring 144. For example... Figure 11 As shown, sub-joints 4212 and 4222 each connect the joint wiring 125 and the second joint wiring 144.

[0225] Sub-junctions 4211, 4212, 4221, and 4222 include a base insulating layer 11, a cover insulating layer 13, and a second cover insulating layer 15. Specifically, sub-junctions 4211, 4212, 4221, and 4222 include only the base insulating layer 11, the cover insulating layer 13, and the second cover insulating layer 15, excluding the wiring layer 12 and the second wiring layer 14.

[0226] According to the fourth modified example, the sub-joints 4211, 4212, 4221, and 4222 can suppress the excessive reduction in rigidity of the joint 4 caused by the slits 411 and 421. Therefore, excessive deformation of the joint 4 can be suppressed.

[0227] It should be noted that the above-described invention is provided as an illustrative embodiment of the present invention, but this is merely illustrative and should not be interpreted as limiting. Modifications of the invention that are obvious to those skilled in the art are included within the scope of protection of the technical solutions described below.

[0228] Industrial availability The wiring circuit board of the present invention is suitable, for example, for use in the manufacture of camera devices.

[0229] Symbol Explanation 1: Wiring circuit board 2: Framework 3: Mounting Unit 4, 4A, 4B, 4C, 4D: Joints 11: Substrate Insulation Layer 12: Wiring layer 121: Frame terminal 122: Frame wiring 123: Terminal 124: Wiring 125: Joint wiring 13: Cover with insulation layer 131: Adhesive layer 132: Overlay 14: Second wiring layer 142: Second frame wiring 143: Second wiring 1432: Conductive connection part 144: Wiring at the second joint 15: Second Cover Insulation Layer 151: Second covering through hole 152: Second adhesive layer 153: Second Covering Layer 154: Second covering through hole 16: Third adhesive layer 161, 162: Conductive adhesive layer 17: Support layer 171, 172: Metal support substrate 20: Inner circumference 23A, 23B, 23C, 23D: Edges 26: Framework Convergence Section 28: Second Central Division 29: Second Central Region 30: Peripheral edge 33, 33A, 33B, 33C, 33D: Edges 34: Central Region 35: Central Department 39: Inner circumference 173: Rigid substrate 1731: Third base insulating layer 1732: Third wiring layer 1735, 1736: Through holes 174: Fourth adhesive layer 175: Via 176: Second rigid substrate 1761: Fourth base insulating layer 1762: Fourth wiring layer 1763: Fourth Cover Insulation Layer 177: Fifth adhesive layer 178: Via 411, 412, 421, 422: Slits 4211, 4212, 4221, 4222: Sub-joints.

Claims

1. A wiring circuit board, comprising: a frame; and a mounting portion surrounded by the frame and spaced apart from the frame; And a joint that connects the frame and the mounting portion, The frame and the mounting portion each include: a base insulating layer; a wiring layer disposed on one side of the base insulating layer in the thickness direction; a cover insulating layer disposed on one side of the base insulating layer in the thickness direction and covering a portion of the wiring layer; a second wiring layer disposed on the other side of the base insulating layer in the thickness direction; and a second cover insulating layer disposed on the other side of the base insulating layer in the thickness direction and covering the second wiring layer. The frame and the mounting portion each may include a support layer disposed on the other side of the second cover insulating layer in the thickness direction. The joint does not include the support layer, but includes the base insulating layer, the wiring layer, the cover insulating layer, the second wiring layer, and the second cover insulating layer.

2. The wiring circuit board according to claim 1, wherein, The support layer is a metal support substrate.

3. The wiring circuit board according to claim 2, wherein, The thickness of the second wiring layer is different from the thickness of the wiring layer.

4. The wiring circuit board according to claim 3, wherein, The frame and the mounting portion each also have a third adhesive layer, which bonds the support layer and the second covering insulating layer together.

5. The wiring circuit board according to claim 4, wherein, The third adhesive layer is a conductive adhesive layer. The second covering insulation layer in the frame and the joint has a second covering through hole. The second wiring layer includes grounding wiring. The grounding wiring is grounded to the metal support substrate via a portion of the conductive adhesive layer that fills the second covering through-hole.

6. The wiring circuit board according to claim 1, wherein, The support layer is a rigid substrate, and the rigid substrate has a rigid third base insulating layer and a third wiring layer sequentially on the other side facing the thickness direction.

7. The wiring circuit board according to claim 6, wherein, The frame and the mounting portion each also have a second rigid substrate, and the second rigid substrate has a rigid fourth base insulating layer, a fourth wiring layer and a fourth cover insulating layer sequentially on one side facing the thickness direction.

8. The wiring circuit board according to claim 1 or 2, wherein, The covering insulation layer has an adhesive layer and a covering layer sequentially on the side facing the thickness direction. The second covering insulating layer has a second adhesive layer and a second covering layer sequentially on the other side in the thickness direction.

9. The wiring circuit board according to claim 1 or 2, wherein, The mounting portion has a generally rectangular shape, and has edges on its outer periphery. The frame has a generally rectangular shape, with opposite sides that are opposite to the said sides, and non-opposite sides that are adjacent to the opposite sides but not opposite to the said sides. The joint connects the edge and the non-opposite edge.

10. The wiring circuit board according to claim 1 or 2, wherein, The joint has a curved shape.

11. The wiring circuit board according to claim 1 or 2, wherein, The mounting portion has an edge at its outer periphery. The joint includes a connecting portion for connecting the joint to the edge. The ratio of the length of the connecting portion along the direction of the edge to the length of the edge, i.e., the length of the connecting portion / the length of the edge, is 0.3 or less.

12. The wiring circuit board according to claim 1 or 2, wherein, The mounting portion has an edge at its outer periphery. The joint is connected to the central region, which includes the central portion of the edge and has a length of 1 / 2 the length of the edge.

13. The wiring circuit board according to claim 12, wherein, The joint is connected to the central portion of the edge.

14. The wiring circuit board according to claim 1 or 2, wherein, The mounting portion has multiple sides on its outer periphery. The plurality of joint portions are provided corresponding to the plurality of edges. The difference in length between the longest and shortest of the plurality of joints is less than 3 mm.

15. The wiring circuit board according to claim 1 or 2, wherein, The joint includes the wiring layer and the second wiring layer. The wiring layer in the joint has joint wiring. The second wiring layer in the joint has a second joint wiring, which is spaced apart from the joint wiring when projected along the thickness direction. The base insulating layer, the cover insulating layer, and the second cover insulating layer in the joint have slits disposed between the joint wiring and the second joint wiring.

16. The wiring circuit board according to claim 15, wherein, The slit extends along the joint wiring and the second joint wiring. The joint has a sub-joint that divides the slit in the direction in which the slit extends and connects the joint wiring and the second joint wiring.

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