High-reliability wiring method for aerospace large-aperture micro-optical system

Abstract

This invention discloses a high-reliability wiring method for aerospace large-aperture micro-optical systems, primarily addressing the technical problem of the inapplicability of existing wiring methods. This wiring method includes assembling wiring clips, internal optical path wiring, and external optical path wiring. Internal optical path wiring effectively prevents cables from obstructing the optical path, while external optical path wiring accommodates conventional cable wiring, temporary fixed cable wiring, wiring of cables exceeding the outer envelope size of the large-aperture micro-optical system, wiring of cables in high-voltage areas, and wiring of pyrotechnic cables. This achieves high-reliability wiring for aerospace large-aperture micro-optical systems, ensuring their operational stability.

Description

Technical Field

[0001] This invention relates to wiring methods for optical systems, and more specifically to a high-reliability wiring method for aerospace large-aperture micro-optical systems. Background Technology

[0002] Large-aperture micro-optical systems refer to optical systems that use micro- and nano-structures to control the light field, with apertures reaching centimeters or even larger. They have important applications in fields such as space target observation and near-eye displays. Cabling, as a fundamental technology in the electronics assembly and electrical industries, has a long history and numerous related industry standards. With the development of technology and the emergence of new technologies, large-aperture micro-optical systems are incorporating more and more electronic products, making their structures and functions increasingly complex. Therefore, the reliability requirements for cabling are also increasing.

[0003] Existing large-aperture micro-optical systems are commonly used in terrestrial environments, where conventional wiring has little impact on their performance. However, in the dynamic, electrical, thermal, magnetic, vacuum, and microgravity environments of space, the compact layout required by the large aperture of the micro-optical system, the leakage of micro-optical components within the system, and other special requirements must be considered, while ensuring its reliability. Therefore, higher demands are placed on its wiring.

[0004] Chinese invention patent CN114330204A discloses a "Three-Dimensional Wiring Design Method and System for Satellite Thermocouples," which uses a complete satellite design model as the basis for three-dimensional thermocouple wiring design, fully utilizing the information from the three-dimensional model to improve the accuracy of cable length calculations in thermocouple wiring design. However, this wiring design method is designed for satellites, whose structure is completely different from that of large-aperture micro-optical systems. The corresponding cables and their positions are also completely different. Therefore, this wiring method is not applicable to large-aperture micro-optical systems at all. Currently, there are no published documents on wiring methods for large-aperture micro-optical systems. Therefore, there is an urgent need to develop a suitable wiring method for large-aperture micro-optical systems used in aerospace applications. Summary of the Invention

[0005] The purpose of this invention is to solve the technical problem that existing wiring methods are not suitable for large-aperture micro-optical systems used in aerospace, and to provide a highly reliable wiring method for aerospace large-aperture micro-optical systems.

[0006] To achieve the above objectives, the technical solution provided by this invention is as follows:

[0007] A highly reliable wiring method for aerospace large-aperture micro-optical systems, characterized by the following steps:

[0008] Step 1: Assemble the line clips

[0009] Multiple main holes are set in the circumference and back plate of the large-aperture micro-optical system, and a main line card is installed on each main hole;

[0010] Step 2: Internal wiring of the optical path

[0011] The outer surface of each cable in the optical path is treated with a matte finish, and then shaped and bound to prevent it from passing through the optical path.

[0012] Step 3: External wiring of the optical path

[0013] 3.1 For conventional cables outside the optical path, integrate multiple cables into a cable bundle according to the cable routing and fix it to the nearest main cable card;

[0014] 3.2 For cables that need to be temporarily fixed outside the optical path, at least one fixing clamp should be placed at intervals according to the cable route;

[0015] 3.3 For cables that exceed the outer envelope size of the large-aperture micro-optical system, the cables exceeding the outer envelope size are bundled together in multiple strands and flattened, and then bonded to the surface of the large-aperture micro-optical system with silicone rubber.

[0016] 3.4 For cables in high-voltage areas, isolation measures shall be taken in accordance with the environmental conditions they are subject to;

[0017] 3.5 For cables of pyrotechnic products, coil them around the back plate and set multiple binding points at intervals, and the binding points should avoid the burst points on the cable.

[0018] Further, in step 1, the installation method of the main line card is as follows: prepare a heat insulation ring, the inner diameter of which is larger than the main hole diameter and the outer diameter is smaller than the maximum radial dimension of the main line card; pre-fix the heat insulation ring coaxially to the corresponding main hole, and then pre-fix the main line card to the corresponding heat insulation ring; finally, fasten the main line card to the corresponding main hole with screws; the pre-fixing is done with silicone rubber, and a washer is installed at the connection between the screw and the main line card;

[0019] The thickness of the heat insulation ring H Must meet: Where B is the maximum dimension of the contact surface between the main line card and the heat insulation ring. R The aperture of the main line card.

[0020] Furthermore, step 1 also includes setting at least one backup hole near each main hole, and assembling a backup line card on the backup hole; the backup hole has the same diameter as the main hole, and the backup line card has the same structure and assembly method as the main line card.

[0021] Furthermore, in step 1, two backup holes are provided near each main hole, one backup hole being 1-2 cm away from the corresponding main hole, and the other backup hole being 10-20 cm away from the corresponding main hole.

[0022] Further, step 2 specifically involves threading a black sleeve through each cable in the optical path and integrating multiple cables into a bundle; then using continuous binding to fix the routing shape of the bundle so that it avoids the optical path; finally, fixing the bundle to the light-inlet end of the large-aperture micro-optical system with black wrapping tape.

[0023] The binding wire used for continuous binding is black binding wire, and the knots in the binding wire are reinforced with black adhesive; the length of the binding wire is more than twice the length of the bundle being bound; there is at least one bundle, and each bundle contains 5 to 10 cables.

[0024] Furthermore, in step 3.2, the cable that needs to be temporarily fixed refers to a cable with a length exceeding 16cm and for which there is no readily available main cable clip along its route. The cable clip is installed by adhesive bonding.

[0025] Further, in step 3.2, the specific method of bonding is as follows: clean the bonding part of the large-aperture micro-optical system, apply the fixing adhesive to the bottom of the fixing wire clip, press the fixing wire clip to the corresponding position, pre-fix it with tape, and finally apply a ring of silicone rubber to the joint surface to form a sealed ring strip. After the strip cures, the bonding of the fixing wire clip is completed.

[0026] The thickness of the fixing adhesive coating h for: , D This is to fix the thickness of the wire clip.

[0027] Furthermore, in step 3.3, the multiple cable bundles and flattening process refers to at least one group of cable bundles that are bundled together and arranged side by side to form a flat structure; the binding method is to use binding wires to sequentially interweave and wrap between the cable bundles, and finally tie a knot to finish.

[0028] Further, step 3.4 specifically involves the following steps: for cables in high-voltage areas, to cope with the electric particle field, the cables are enclosed in a metal shell for electrical isolation; to cope with the environmental force field, soft binding wire or silicone rubber tape is wrapped around the surface of the cable; to cope with the radiant heat field, the outer insulation layer of the cable is subjected to high-voltage insulation treatment, and the cable is enclosed in a metal shell; to cope with the vacuum field, the cable is fitted with a heat-shrink tubing.

[0029] Furthermore, in step 3.5, the cable binding requirement for the pyrotechnic product is loose binding. The standard for loose binding is that the cable is attached to the back plate and there are no binding marks on the cable surface.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0031] 1. This invention adopts the method of assembling wire clips, internal optical path wiring, and external optical path wiring. The internal optical path wiring can effectively avoid cables blocking the optical path, while the external optical path wiring takes into account the wiring of conventional cables, temporary fixed cables, cables exceeding the outer envelope size of large-diameter micro-optical systems, cables in high-voltage areas, and cables for pyrotechnic devices. This achieves high-reliability wiring for aerospace large-diameter micro-optical systems and ensures their operational stability.

[0032] 2. In the assembly of the wire clip, the present invention uses a heat insulation ring as the installation tool between the wire clip and the main hole. The design of the heat insulation ring not only improves the reliability of the wire clip assembly, but also improves the heat insulation effect of the wire clip, ensuring that the working performance of the cable it connects to is not affected, thereby ensuring the reliability of the large-diameter micro-optical system.

[0033] 3. The present invention also provides at least one backup hole near the main hole as a redundancy design, thereby overcoming the uncertainty of the existing wiring process, reducing temporary measures, and improving the stability and uniformity of the wiring.

[0034] 4. This invention performs light-reducing treatment on the cables within the optical path, and combines this with shaping and binding to ensure that they can avoid the optical path, effectively solving the problem of wiring within the optical path and reducing the risk of stray light affecting the energy of the main optical path; at the same time, the continuous binding method realizes autonomous control of the cable direction, which is beneficial for the precise control of structural accuracy, position, and optical path deviation of large-aperture micro-optical systems.

[0035] 5. In cases where the cable is too long but there is no readily available main or backup cable card, this invention uses an adhesive method to install the fixed cable card in a suitable position, thereby ensuring the overall reliability of the cable installation.

[0036] 6. This invention addresses the issue of cables exceeding the outer envelope size of large-aperture micro-optical systems by bundling and flattening multiple cables and attaching them to the surface of the large-aperture micro-optical system. This design effectively solves the design challenge of the outer contour size of large-aperture micro-optical systems.

[0037] 7. For cables in high-voltage areas, the present invention adopts corresponding isolation treatment schemes according to the environmental conditions they are dealing with, thereby improving their applicability and reliability under the environmental conditions.

[0038] 8. The present invention adopts a circumferential layout and loose binding method for pyrotechnic cables, which ensures that the impact force during the explosion of pyrotechnics is released along the circumference of the large-diameter micro-optical system, effectively protecting the optical and mechanical components of the large-diameter micro-optical system; at the same time, the centrifugal force of high-speed ignition and the expansion force of the cable during the explosion of pyrotechnics can be weakened and canceled out by the circumferential direction. Compared with the traditional method, this method has a higher ability to withstand mechanical and explosive impacts. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the structure for installing the mainline card in step 1 of an embodiment of the present invention.

[0040] Figure 2 This is a schematic diagram of marking the places where light passes through in step 2 of an embodiment of the present invention, wherein (a) is a marking method for a circular surface and (b) is a marking method for a square surface.

[0041] Figure 3 This is a schematic diagram illustrating the bundling of cables exceeding the outer envelope size in step 3.3 of this embodiment of the invention, using a method of multiple bundles and flattening.

[0042] Figure 4 This is a schematic diagram of the structure for bundling the ends of the cable to be placed in the vacuum field in step 3.4 of an embodiment of the present invention.

[0043] Figure 5 This is a schematic diagram of the binding method for the pyrotechnic cable in step 3.5 of an embodiment of the present invention.

[0044] The attached figures are labeled as follows:

[0045] 1-Main cable clip, 2-Insulation ring, 3-Screw, 4-Washer, 5-Exhaust port, 6-Pyrotechnic cable, 7-Binding point. Detailed Implementation

[0046] To make the objectives, advantages, and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0047] Existing cabling technologies, based on standardization requirements, primarily adhere to compliance, but their methods cannot meet the special requirements of large-aperture micro-optics. For example, they do not require surface matting properties of wire harnesses, nor do they have corresponding treatment methods; they require ample space, bundled wire harnesses, limited turning radii for pyrotechnic cables, secure wire clamps, and bundled cables in high-voltage areas. This invention, based on existing technologies, creatively proposes several unique processing methods to solve the above problems.

[0048] This embodiment provides a high-reliability wiring method for aerospace large-aperture micro-optical systems, including the following steps:

[0049] Step 1: Assemble the line clips

[0050] Multiple main holes are set in the circumference and backplane of the aerospace large-aperture micro-optical system, and a main cable clip 1 is installed in each main hole. The circumference and backplane of the large-aperture micro-optical system are generally made of high-strength and lightweight silicon carbide material for load-bearing purposes, so as to facilitate the wiring design.

[0051] The overall structure of the large-aperture micro-optical system is cylindrical, with a backplate mounted on its light-emitting end in a disc shape. The main holes on the backplate are distributed circumferentially. The size and spacing of all the main holes are determined by the dimensions of the large-aperture micro-optical system. In this embodiment, the distance between two adjacent main holes is no greater than 16 cm.

[0052] like Figure 1 As shown, the main line card 1 in this embodiment is a U-shaped line card with a rectangular bottom. The installation method of the main line card 1 is as follows: prepare a heat insulation ring 2, which is made of epoxy glass cloth. Its inner diameter is larger than the main hole diameter, and its outer diameter is smaller than the maximum radial dimension (i.e., the width of the short side) of the main line card 1. Pre-fix the heat insulation ring 2 coaxially to the corresponding main hole, and then pre-fix the main line card 1 to the corresponding heat insulation ring 2. Finally, fasten the main line card 1 to the corresponding main hole with screws 3.

[0053] This embodiment innovatively incorporates a heat insulation ring 2 design and adopts corresponding installation measures, thereby improving the reliability of the micro-optical system. The thickness of the heat insulation ring 2... H Must meet: Wherein, B is the maximum dimension of the short side of the contact surface between the main line card 1 and the heat insulation ring 2. R The aperture of the main line clip 1 is used. If the heat insulation ring 2 is too thick, its preload cannot be applied to the corresponding line clip; if it is too thin, the heat insulation effect will be poor.

[0054] The purpose of pre-fixation is to meet the requirements of large-aperture micro-optical systems for preventing volatile contamination, and pre-fixation also allows for strict control of torque. In this embodiment, GD414C silicone rubber is used for fixing. GD414C silicone rubber has a low efflux rate and is not easily volatile, making it suitable for large-aperture micro-optical systems in vacuum environments. Furthermore, a gasket 4 is installed at the connection between the screw 3 and the main cable 1. The gasket 4 not only ensures that the main cable 1 is not damaged during installation, but also further improves the sealing performance.

[0055] Due to the large aperture and ample space of the large-aperture micro-optical system, and considering the requirements of multiple physical field factors such as electricity, force, heat, and vacuum field, this embodiment also incorporates a "dual backup" redundancy design. This means that at least one backup hole is provided near each main hole, and a backup cable clip is mounted on each backup hole. The backup holes have the same diameter as the main holes and are both threaded holes. The backup cable clips have the same structure and assembly method as the main cable clip 1. The selection of backup holes takes into account the influence of multiple physical fields such as electricity, force, and heat. In this embodiment, two backup holes are provided near each main hole, one backup hole being 1.6 cm away from the corresponding main hole, and the other backup hole being 20 cm away. This "dual backup" redundancy design overcomes the uncertainties of existing wiring processes, reduces temporary measures, and improves the stability and uniformity of the wiring process.

[0056] Step 2: Internal wiring of the optical path

[0057] Each cable in the optical path is blackened to eliminate light. Specifically, a black sleeve is inserted through the outer surface of each cable, and multiple cables are integrated into a bundle. Then, black cable ties are used to continuously bind the bundle to fix its routing shape, so that it avoids the optical path, and the knots are reinforced with black adhesive. Finally, the bundle is fixed to the light-inlet end of the large-aperture micro-optical system with black tape.

[0058] This embodiment utilizes a continuous binding method to achieve shape-fixing of long cables in large-aperture micro-optical systems, taking into account their characteristics. Continuous binding involves using a single binding wire, stretching, binding, and knotting along the length of the cable bundle, then stretching, binding, and knotting again, and so on. The pulling action between each knot fixes the shape of the cable bundle within the optical path, ensuring controllable cable shape and preventing obstruction of the light path. Furthermore, this method allows for finer spacing between knots, enabling autonomous control of the cable's direction, which is beneficial for precise control of structural accuracy, position, and optical path deviation in large-aperture micro-optical systems. In addition, the length of the binding wire is quantified; it should generally be greater than twice the length of the bound cable bundle. There is at least one cable bundle, and each bundle contains 5-10 cables.

[0059] Generally, before shaping and binding the wires within the optical path, other tools can be used to mark the areas through which the light passes, such as... Figure 2 As shown, if the area through which the light passes is a circular surface, then mark along the edge of the circular surface; if the area through which the light passes is a square surface, then mark with at least one set of intersecting straight lines to ensure that the cable can effectively avoid the light path during actual binding.

[0060] The surface matte finish and unobstructed wiring methods are more suitable for optical systems than existing technologies. The processing method fills a gap in this area. Wiring within the optical path has always been a difficult problem in optical system wiring. This method effectively solves this problem and reduces risks.

[0061] Step 3: External wiring of the optical path

[0062] 3.1 For conventional cables outside the optical path, integrate multiple cables into a bundle according to the cable routing and fix it on the nearest main cable card 1 or backup cable card to ensure that the bundle routing is neat.

[0063] 3.2 For cables that need to be temporarily fixed outside the optical path, at least one fixing clip should be flexibly set according to the cable routing.

[0064] In this embodiment, the cable requiring temporary fixation refers to a cable with a length exceeding 16cm and for which there is no readily available main cable clip 1 along its route. In this case, the cable clip is fixed by adhesive bonding. The specific bonding method is as follows: Wipe the area to be bonded on the large-diameter micro-optical system with a non-woven cloth soaked in anhydrous ethanol. Apply 2216 adhesive to the bottom of the cable clip, flatten it, and the thickness of the adhesive application should be... h for: , D The thickness of the adhesive layer is fixed. If the adhesive layer is too thin, the adhesion will be insufficient; if the adhesive layer is too thick, there will be adhesive contamination. Therefore, in this embodiment, the adhesive layer thickness is... h The thickness should be controlled between 0.5mm and 1mm. This thickness ensures that the adhesive thickness on the bonding surface and the thickness of the adhesive around the edges after overflow are both moderate. Then, press the fixing clip into the corresponding position, pre-fix it with polyimide tape, and finally apply a ring of silicone rubber to the joint surface to form a sealed ring strip. After the strip cures (generally about 72 hours), the fixing clip is complete. In this embodiment, the fixing clips required for temporary fixing are matte metal clips, made of either aluminum or steel, with a blackened oxidized surface. The specific size can be selected according to requirements. These fixing clips are easy to install, flexible in use, lightweight, have a good matte finish, and high strength.

[0065] 3.3 As Figure 3 As shown, for cables that exceed the outer envelope size of the large-aperture micro-optical system, the cables exceeding the outer envelope size are bundled together in multiple strands and flattened, and then bonded to the surface of the large-aperture micro-optical system with silicone rubber.

[0066] Large-aperture micro-optical systems have stringent requirements for their outer envelope dimensions, aiming for the smallest possible size. Therefore, cables exceeding the outer envelope dimensions of large-aperture micro-optical systems are flattened to meet these requirements. In this embodiment, the multiple-cable bundle and flattening process refers to bundling multiple cables together and arranging them side-by-side to form at least one bundle with a flat structure. The binding method involves sequentially weaving and wrapping binding wires between the bundles, finally tying a knot to secure the ends. This effectively solves the design challenge of the outer contour dimensions of large-aperture micro-optical systems. Similarly, each bundle contains 5 to 10 cables, which can be flexibly selected based on the cable thickness and time requirements.

[0067] 3.4 A key feature of large-aperture micro-optical systems is their high-voltage characteristics. In this regard, an isolation design is proposed under multiple physical fields, including electric particle fields, environmental force fields, radiative thermal fields, and vacuum fields. Based on the initial design margin, an isolation zone is defined to provide an isolation foundation for cables within the high-voltage area. Specifically:

[0068] To cope with electric particle fields, the cable is enclosed in a metal shell for electrical isolation.

[0069] To cope with environmental force fields, choose soft binding wires or silicone rubber wrapping tape to wrap around the surface of the cable;

[0070] To cope with the radiant heat field, the outer insulation layer of the cable is subjected to high-voltage insulation treatment, and the cable is enclosed in a metal shell;

[0071] To cope with a vacuum field, heat shrink tubing should be used on the cable. In practical applications, the two ends of the heat shrink tubing should be not closed, that is, a venting port of less than 1 / 4 turn should be left. Figure 4 (As shown).

[0072] 3.5 such as Figure 5 As shown, for the pyrotechnic cable 6, this embodiment proposes a circumferential wiring and loose binding method, that is, the pyrotechnic cable 6 is coiled on the back plate, and binding points 7 are set every 15cm, and the binding points 7 avoid the burst points on the cable.

[0073] The binding force required for the pyrotechnic cable 6 is a loose binding. The standard for loose binding is: the pyrotechnic cable 6 is in close contact with the backing plate, and there are no binding marks on the outer insulation layer of the cable surface. While ensuring that the outer insulation layer of the pyrotechnic cable 6 is not deformed, slowly tighten the binding wire. If the binding wire is completely in close contact with the outer insulation layer of the pyrotechnic cable 6, stop tightening; if there is a dent in the outer sheath, it indicates that the binding is too tight. Record the length of the binding wire at this point and remove it. Use the same binding wire to tighten it again until a loose binding is achieved. Alternatively, the tightness of the binding wire can be measured by the setting of the wire pliers. A fixed setting can be preset to measure whether the binding force of each binding wire meets the requirements.

[0074] The pyrotechnic cable 6, with its circumferential layout and loose binding, ensures that the impact force during the pyrotechnic explosion is released circumferentially, effectively protecting the optical and mechanical components of the large-diameter micro-optical system. Simultaneously, the centrifugal force from the high-speed ignition and the cable expansion force during the pyrotechnic explosion are weakened and canceled out circumferentially. Compared to traditional methods, this wiring method has a higher resistance to mechanical forces and explosive impacts.

[0075] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein, and such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the present invention.

Claims

1. A high-reliability wiring method for aerospace large-aperture micro-optical systems, characterized in that, Includes the following steps: Step 1: Assemble the line clips Multiple main holes are set in the circumference and back plate of the large-aperture micro-optical system, and a main line card is installed on each main hole; Step 2: Internal wiring of the optical path The outer surface of each cable in the optical path is treated with a matte finish, and then shaped and bound to prevent it from passing through the optical path. Step 3: External wiring of the optical path 3.1 For conventional cables outside the optical path, integrate multiple cables into a cable bundle according to the cable routing and fix it to the nearest main cable card; 3.2 For cables that need to be temporarily fixed outside the optical path, at least one fixing clamp should be placed at intervals according to the cable route; 3.3 For cables that exceed the outer envelope size of the large-aperture micro-optical system, the cables exceeding the outer envelope size are bundled together in multiple strands and flattened, and then bonded to the surface of the large-aperture micro-optical system with silicone rubber. 3.4 For cables in high-voltage areas, isolation measures shall be taken in accordance with the environmental conditions they are subject to; 3.5 For cables of pyrotechnic products, coil them around the back plate and set multiple binding points at intervals, and the binding points should avoid the burst points on the cable.

2. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: In step 1, the main line card is installed as follows: a heat insulation ring is prepared, the inner diameter of which is larger than the main hole diameter and the outer diameter is smaller than the maximum radial dimension of the main line card; the heat insulation ring is coaxially pre-fixed to the corresponding main hole, and then the main line card is pre-fixed to the corresponding heat insulation ring; finally, the main line card is fastened to the corresponding main hole with screws; the pre-fixing is done with silicone rubber, and a washer is installed at the connection between the screw and the main line card; The thickness of the heat insulation ring H Must meet: Where B is the maximum dimension of the contact surface between the main line card and the heat insulation ring. R The aperture of the main line card.

3. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 2, characterized in that: Step 1 also includes setting at least one backup hole near each main hole and assembling a backup line card on the backup hole; the backup hole has the same diameter as the main hole, and the backup line card has the same structure and assembly method as the main line card.

4. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 3, characterized in that: In step 1, two backup holes are provided near each main hole. One backup hole is 1-2 cm away from the corresponding main hole, and the other backup hole is 10-20 cm away from the corresponding main hole.

5. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: Step 2 specifically involves threading a black sleeve through each cable in the optical path and integrating multiple cables into a bundle; then using continuous binding to fix the routing shape of the bundle so that it avoids the optical path; finally, fixing the bundle to the light-inlet end of the large-aperture micro-optical system with black wrapping tape. The binding wire used for continuous binding is black binding wire, and the knots in the binding wire are reinforced with black adhesive; the length of the binding wire is more than twice the length of the bundle being bound; there is at least one bundle, and each bundle contains 5 to 10 cables.

6. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: In step 3.2, the cable that needs to be temporarily fixed refers to a cable with a length exceeding 16cm and for which there is no readily available main cable clip along its route. The cable clip is installed by adhesive bonding.

7. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 6, characterized in that: In step 3.2, the specific method of bonding is as follows: clean the bonding part of the large-aperture micro-optical system, apply the fixing adhesive to the bottom of the fixing wire clip, press the fixing wire clip to the corresponding position, pre-fix it with tape, and finally apply a ring of silicone rubber to the joint surface to form a sealed ring strip. After the strip cures, the bonding of the fixing wire clip is completed. The thickness of the fixing adhesive coating h for: , D This is to fix the thickness of the wire clip.

8. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: In step 3.3, the multiple cable bundles and flattening process refers to bundling multiple cables together and arranging them side by side to form at least one set of cable bundles in a flat structure; the binding method is to use binding wires to sequentially interweave and wrap between the cable bundles, and finally tie a knot to finish.

9. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: Step 3.4 specifically involves the following steps: For cables in high-voltage areas, if the electric particle field needs to be addressed, the cable should be enclosed in a metal shell for electrical isolation; if the environmental force field needs to be addressed, soft binding wire or silicone rubber tape should be wrapped around the cable surface; if the radiant heat field needs to be addressed, the outer insulation layer of the cable should be treated with high-voltage insulation and the cable should be enclosed in a metal shell; if the vacuum field needs to be addressed, the cable should be fitted with a heat-shrink tubing.

10. The high-reliability wiring method for aerospace large-aperture micro-optical systems according to claim 1, characterized in that: In step 3.5, the cable binding requirement for the pyrotechnic product is loose binding. The standard for loose binding is that the cable is attached to the back plate and there are no binding marks on the cable surface.

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