System and method for Map merging and yield management and control of silicon-based OLED products

Abstract

The invention discloses a silicon-based OLED product Map merging system and method, the system comprises a Wafer Map management module, a Glass Map management module and an ODF Map management module, by setting a Map merging rule and a site Map recursive merging algorithm, automatic merging of CP Map and Wafer Map, Wafer Map and Wafer Map, Glass Map and Glass Map and Wafer Map and Glass Map can be realized, and the merging process is real-time and efficient; the invention also discloses a silicon-based OLED product yield management and control system and method, the batch yield of the site is calculated according to the merged Map information generated by merging the site Map and the batch yield calculation rule, and when the batch yield of the site is smaller than the target yield of the site, the current batch is Hold in time and people are reminded to pay attention, so that the quality of the silicon-based OLED product is improved. And real-time monitoring and abnormity interception of the batch yield of the product can be realized.

Description

Technical Field

[0001] This invention belongs to the field of silicon-based OLED technology, and particularly relates to a silicon-based OLED product map merging and yield control system and method. Background Technology

[0002] In silicon-based OLED manufacturing, wafers and glasses undergo different processes before being bonded together (ODF, One Drop Filling). Before bonding, the wafers and glasses pass through multiple manual review stations, generating multiple wafer and glass maps. After bonding, a new ODF map is generated. The calculation and management of wafer, glass, and ODF involve the merging of wafer and glass maps. Due to industry and process differences, current technologies only address the merging of wafer maps in the semiconductor industry, without proposing solutions for glass maps or the merging of wafer and glass maps, and without clearly defining yield calculation and management schemes. Some solutions propose merging multiple maps at once, but this is inefficient and lacks real-time performance.

[0003] A search revealed Chinese Patent Publication No. CN110377770A, which discloses a method and system for merging wafer MAP files from different test sites. The method includes the following steps: selecting MAP files from different test sites; displaying the filenames of the MAP files from different test sites; comparing the filenames of the displayed MAP files from each test site for correctness and whether the batch number, serial number, and quantity of the MAP files from different test sites are consistent; if yes, proceed to the next step; otherwise, report an error and exit; merging the wafer MAP files from different test sites. This method and system provides a way to batch merge wafer MAP files generated by different test sites, which is more efficient than manual merging. Furthermore, the prior art recalculates the yield after merging the wafer MAP files, ensuring the correctness of subsequent die retrieval during packaging and avoiding losses. It can more accurately complete the merging of wafer MAP files from different test sites and improve packaging efficiency. However, the prior art has the following problems: 1. The existing technology uses wafer MAP maps generated by different test sites for batch merging, which has low efficiency and real-time performance; 2. The above-mentioned existing technologies only address the merging of wafer maps. For silicon-based OLED product scenarios, they cannot achieve a MAP merging scheme for wafer and glass, as well as the ODF after their combination. 3. The above-mentioned existing technologies do not involve the control of batch yield.

[0004] Based on this, the present invention designs a silicon-based OLED product map merging and yield control system and method. Summary of the Invention

[0005] To address the aforementioned issues, this invention discloses a silicon-based OLED product map merging and yield control system and method, providing a Wafer Map merging submodule, a Glass Map merging submodule, and a Wafer and Glass Map merging and yield control scheme.

[0006] A silicon-based OLED product map merging and yield control system includes: Wafer Map Management Module; The Wafer Map Management Module includes a CP Map Management Submodule, a Wafer Map Merging Submodule, a Wafer Yield Calculation Submodule, and a Wafer Yield Control Submodule; Glass Map Management Module; The Glass Map Management Module includes a Glass Map Merging Submodule, a Glass Yield Calculation Submodule, and a Glass Yield Control Submodule; The ODF Map management module includes an ODF Map merging submodule, an ODF yield calculation submodule, and an ODF yield control submodule.

[0007] In the aforementioned silicon-based OLED product Map merging and yield control system, the CP Map management submodule is used to parse the CP Map file content, using the wafer back marking T7Code as the identifier, row and column coordinates to identify the chip position, and Bin level to identify the chip level, and store it in the database. The Wafer Map merging submodule is used to store Wafer Map information for each manual review site; The Wafer yield calculation submodule calculates the Wafer batch yield based on the newly generated Wafer Map information and yield calculation rules; The Wafer yield control submodule is used to set Wafer yield control rules and determine whether the Wafer batch is in normal flow or hold based on the calculated Wafer batch yield.

[0008] In the aforementioned silicon-based OLED product map merging and yield control system, the Glass Map merging submodule is used to store the Glass Map information of each manual review station into the database; The Glass yield calculation submodule calculates the Glass batch yield based on the newly generated Glass Map information and yield calculation rules; The Glass yield control submodule is used to set Glass yield control rules and determine whether the Glass batch is in normal flow or hold based on the calculated Glass batch yield.

[0009] In the aforementioned silicon-based OLED product Map merging and yield control system, the ODF Map merging submodule merges the maps of the laminated wafer and glass by setting ODF Map merging rules, generates a new ODF Map, and stores it in the database. The ODF yield calculation submodule calculates the ODF batch yield based on the newly generated ODF Map information and yield calculation rules; The ODF yield control submodule sets ODF yield control rules and determines whether the ODF batch is in normal flow or hold based on the calculated ODF batch yield.

[0010] In the aforementioned silicon-based OLED product map merging and yield control system, the Wafer Map is identified by Wafer ID and site Step ID, the chip position is identified by row and column coordinates, and the chip level is identified by Bin level. By setting Wafer Map merging rules, Wafer Map is merged with CP Map or Wafer Map with Wafer Map to generate new Wafer Map information, which is then stored in the database.

[0011] In the aforementioned silicon-based OLED product map merging and yield control system, the Wafer Map merging rules include: dividing the Bin grade into three levels: P, N, and T, where P represents Good grains, N represents Bad grains, and T represents uncertain grains; when all merged grains are of the P grade, the merged result is of the P grade; when one of the merged grains is of the N grade, the merged result is of the N grade; otherwise, the merged result is of the T grade. Furthermore, based on the product and site configuration, the site information that needs to be merged is configured. When a new Wafer Map is generated by manual review of a site, the merging logic is triggered to merge the Wafer Map of the current site with the Wafer Map of the configured site. When merging the Wafer Map with the CP Map, the Wafer ID and T7Code relationship is matched.

[0012] In the aforementioned silicon-based OLED product map merging and yield control system, the Wafer batch yield calculation rule is as follows:

[0013] in, This represents the sum of the number of grains of grade P in the batch. This represents the sum of the number of grains of grade N in the batch. This represents the sum of the number of grains of grade T in the batch; Furthermore, the calculation is triggered when the Wafer batch leaves the station.

[0014] In the aforementioned silicon-based OLED product map merging and yield control system, the wafer yield control rules include: setting target yields based on product and site type. When the batch yield is greater than or equal to the target yield, the batch flows normally; when the batch yield is less than the target yield, the batch is held.

[0015] In the aforementioned silicon-based OLED product map merging and yield control system, the Glass Map is identified by Glass ID and Site Step ID, the position of the crystal is identified by row and column coordinates, and the crystal level is identified by Bin level. By setting Glass Map merging rules, Glass Maps are merged to generate new Glass Map information, which is then stored in the database.

[0016] In the aforementioned silicon-based OLED product map merging and yield control system, the Glass Map merging rule, the Glass yield calculation rule, and the Glass yield control rule are the same as the Wafer Map merging rule, the Wafer yield calculation rule, and the Wafer yield control rule, respectively.

[0017] In the aforementioned silicon-based OLED product map merging and yield control system, the ODF map merging rules include: when both the wafer and glass wafer have a Bin grade of P, the merged result is a P grade; when one of the wafer and glass wafer has a Bin grade of N, the merged result is an N grade; otherwise, the merged result is a T grade.

[0018] In the aforementioned silicon-based OLED product map merging and yield control system, the ODF yield calculation rule and the ODF yield control rule are the same as the Wafer yield calculation rule and the Wafer yield control rule, respectively.

[0019] A control method based on the above-mentioned silicon-based OLED product map merging and yield control system includes wafer, glass, and ODF map merging and yield control methods, wherein the wafer merging and yield control method includes the following steps: S1: Configure Wafer Map merging rules through product configuration, including Bin level merging rules and site merging rules; configure yield control benchmarks through site configuration; S2: Import Wafer incoming material CP Map, the system parses the CP Map content and stores it in the database; S3: When a manual review site StepN generates a Wafer Map, the Wafer Map information for that site is recorded in the database. The site StepN-1 that needs to be merged is found through the site merging rules, and the corresponding Wafer Map is found through Wafer ID and Step ID. The merge is performed to generate a new Wafer Merge Map, and the merge map information is recorded in the database. ,Right now: = +

[0020] The "+" sign indicates the meaning of merging, thus forming a recursive merging scheme, namely: = + + ... + + +

[0021] S4: When a wafer batch leaves the station, check the Merge Map information for all wafers in the batch; if all wafers have corresponding Merge Map information, calculate the batch yield. Otherwise, hold the batch and remind personnel to confirm; S5: Check the site's target yield rate. ,if If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0022] The Glass Map merging and batch yield control method includes the following steps: S1: Configure Glass Map merging rules through product settings, including Bin level merging rules and site merging rules; configure yield control benchmarks through site settings; S2: When a manual review station StepM generates a Glass Map, the Glass Map information for that station is recorded in the database. The site StepM-1 that needs to be merged is found through the site merging rules, and the corresponding Glass Map is found by using the Glass ID and Step ID. The merge is performed to generate a new Glass Merge Map, and the merged Glass Map information is recorded in the database. ,Right now: = +

[0023] The "+" sign indicates the meaning of merging; thus, a recursive merging scheme is formed, namely: = + +...+ +

[0024] S3: When a glass batch leaves the station, check the Merge Map information for all glasses in the batch; if all glasses have corresponding Merge Map information, calculate the batch yield. Otherwise, hold the batch and remind personnel to confirm; S4: Check the yield rate of the site's control targets. ,if If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0025] The ODF Map merging and batch yield control method includes the following steps: S1: Configure ODF Map merging rules and yield control benchmarks through product configuration; S2: Once a wafer and glass are successfully bonded, the Wafer Merge Map and Glass Merge Map are retrieved using the Wafer ID and Glass ID, merged to generate a new ODF Map, and this information is recorded in the database. ,Right now: = +

[0026] The "+" sign indicates a merger. S3: When an ODF batch leaves the ship, check the Map information of all ODFs in the batch; if all ODFs have corresponding Map information, calculate the batch yield. Otherwise, hold the batch and remind personnel to confirm; S4: Check the target yield of this site ,if If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0027] The beneficial effects of this invention are as follows: The silicon-based OLED product map merging and yield control system and method disclosed in this invention provide a map recursive merging scheme, which can realize the automatic merging of Wafer, Glass and ODF Maps, and the merging process is real-time and efficient; at the same time, this invention provides a yield calculation and control scheme, which can realize the monitoring of Wafer, Glass and ODF site-specific yields and the interception and reminder of yield abnormalities. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a silicon-based OLED product map merging and yield control system disclosed in this invention.

[0029] Figure 2 This invention discloses a Bin level merging rule in a silicon-based OLED product Map merging and yield control system.

[0030] Figure 3 This invention discloses a wafer site merging rule and yield control benchmark in a silicon-based OLED product map merging and yield control system.

[0031] Figure 4 This invention discloses a CP Map source file format in a silicon-based OLED product Map merging and yield control system.

[0032] Figure 5 This invention discloses CP Map information in a silicon-based OLED product Map merging and yield control system.

[0033] Figure 6 This is Wafer Map information from the Wafer website.

[0034] Figure 7 This is merged information from Wafer Map on the Wafer site.

[0035] Figure 8 It is the Glass site merging rule and yield control benchmark.

[0036] Figure 9 This is the ODF Bin level merging rule.

[0037] Figure 10 It is the benchmark for ODF yield control. Detailed Implementation

[0038] See attached document Figures 1-10This invention discloses a map merging and yield control system and method for silicon-based OLED products, providing wafer map merging, glass map merging, and wafer and glass map merging and yield control schemes. A recursive merging strategy is employed to improve merging efficiency. This invention also provides a site-specific yield calculation and control scheme, enabling real-time monitoring and anomaly interception of product batch yields. This scheme differs from semiconductor product schemes and is particularly suitable for silicon-based OLED products. The technical solution adopted by this invention is as follows: This invention discloses a silicon-based OLED product map merging and yield control system and method. The invention will be described in detail below with reference to the accompanying drawings. In this embodiment, the English technical terms and their corresponding Chinese translations are as follows: CP Map: Chip Probing Map, referring to the incoming wafer probing map in this context; Wafer: a type of wafer; Wafer Map: A map used to record the test results of each chip on a wafer, and to track chip yield through physical arrangement and logical identification (such as bin code); Glass: In this invention, it refers to glass that has undergone color filter technology. Glass Map: Similar to wafer map, it is used to record test results of various regions on the glass and to track glass yield. ODF: One Drop Filling, is an English term for the bonding process in panel display factories. Here, it refers to the general term for products after the bonding process is completed. ODF Map: ODF map, also known as wafer map, refers to the wafer map after the ODF process is completed.

[0039] This invention discloses a silicon-based OLED product map merging and yield control system, comprising: Wafer Map Management Module; The Wafer Map Management Module includes a CP Map Management Submodule, a Wafer Map Merging Submodule, a Wafer Yield Calculation Submodule, and a Wafer Yield Control Submodule; The CP Map management submodule is used to parse the CP Map file content, using the wafer back marking T7Code as the identifier, the row and column coordinates to identify the die position, the Bin level to identify the die level, and store it in the database. The Wafer Map merging submodule is used to store Wafer Map information for each manual review site. The Wafer Map is identified by Wafer ID and site Step ID, the grain position is identified by row and column coordinates, and the grain level is identified by Bin level. By setting Wafer Map merging rules, Wafer Map is merged with CP Map or Wafer Map with Wafer Map to generate new Wafer Map information and store it in the database. The Wafer yield calculation submodule calculates the Wafer batch yield based on the newly generated Wafer Map information and yield calculation rules; The Wafer yield control submodule is used to set Wafer yield control rules and determine whether the Wafer batch is in normal flow or hold based on the calculated Wafer batch yield.

[0040] Glass Map Management Module; The Glass Map Management Module includes a Glass Map Merging Submodule, a Glass Yield Calculation Submodule, and a Glass Yield Control Submodule; The Glass Map merging submodule is used to store the Glass Map information of each manual review site into the database. The Glass Map is identified by Glass ID and site Step ID, the grain position is identified by row and column coordinates, and the grain level is identified by Bin level. By setting Glass Map merging rules, Glass Maps are merged to generate new Glass Map information and stored in the database. The Glass yield calculation submodule calculates the Glass batch yield based on the newly generated Glass Map information and yield calculation rules; The Glass yield control submodule is used to set Glass yield control rules and determine whether the Glass batch is in normal flow or hold based on the calculated Glass batch yield.

[0041] ODF Map Management Module; The ODF Map Management Module includes an ODF Map Merging Submodule, an ODF Yield Calculation Submodule, and an ODF Yield Control Submodule; The ODF Map merging submodule merges the pasted Wafer and Glass maps by setting ODF Map merging rules, generates a new ODF Map, and stores it in the database. The ODF yield calculation submodule calculates the ODF batch yield based on the newly generated ODF Map information and yield calculation rules; The ODF yield control submodule sets ODF yield control rules and determines whether the ODF batch is in normal flow or hold based on the calculated ODF batch yield.

[0042] The methods for Wafer Map merging and batch yield control include: 1. Rule Maintenance Step 1: As Figure 2 The Bin level merging rules shown are configured through the Product. Step 2: As Figure 3 The site merging rules and yield control benchmarks shown are configured through the product. 2. Import CP Map Import the Wafer incoming material CP Map file, such as Figure 4 The CP Map source file data format shown (supports .csv / .xls / .xlsx formats) traverses cells sequentially from bottom to top and left to right. When a cell has a value belonging to {P, N, T}, it records the corresponding Bin level and coordinates (CoorX, CoorY) information and saves it in the database. Figure 5 The CP Map information shown records the wafer incoming material bin level information, with T7Code, X coordinate, and Y coordinate as references. 3. Map merging Step 1: Wafer ID Generation. When a wafer is put into service, the system generates a unique factory code, i.e., a Wafer ID, for each wafer according to the factory's naming rules, and binds the T7Code to the Wafer ID; Step 2: Map Merging Step 1 Site: After the Wafer completes the re-evaluation at the Step 1 site, the system records the Map information for that site. ,like Figure 6 The Step 1 site Wafer Map information is shown; query based on Product ID and Current Step ID, as follows: Figure 3 The Wafer site merging rules shown require that the Step 1 site map needs to be merged with the CP map. The corresponding CP map information is obtained through the T7Code information bound to the Wafer ID. ; Query based on Product ID, such as Figure 2 The Bin level merging rules shown will... Merge with CP Map to generate new Wafer Map merge information. Recorded in the database, such as Figure 7The Step 1 site Wafer Map merge information is shown below; Step 2 Site: After the Wafer completes the re-evaluation at the Step 2 site, the system records the Map information for that site. ; Query based on Product ID and Current Step ID, such as Figure 3 The Wafer site merging rules shown require that the Step 2 site map needs to be merged with the Step 1 site map. The Step 1 site map merging information is obtained through the Wafer ID. ; Query based on Product ID, such as Figure 2 The Bin level merging rules shown will... and Merge and generate new Wafer Map merge information. Recorded in the database; StepN Site: After the Wafer completes the re-evaluation at the StepN site, the system records the site's Map information. Based on the Product ID and Current Step ID, query as follows: Figure 3 The Wafer site merging rules shown require that the Step N site map needs to be merged with the Step N-1 site map. The Step N-1 site map merging information is obtained through the Wafer ID. ; Query based on Product ID, such as Figure 2 The Bin level merging rules shown will... and Merge and generate new Wafer Map merge information. Recorded in the database; 4. Yield calculation and control Step 1: Wafer Map Check. When a wafer batch leaves the site, check the Merge Map information for all wafers in the batch. If all wafers have Merge Map information for the current site, calculate the batch yield. Otherwise, hold the batch and remind personnel to confirm; Step 2: Batch Yield Calculation. Query all Wafer IDs in the batch, and use these Wafer IDs to retrieve the Merge Map information for each Wafer. Count the number of wafers at each level (P, N, T). Calculate the batch yield according to the Wafer batch yield calculation rules. ; Step 3: Batch Control. Query the target yield for this site based on the Product ID and Current Step ID. If the batch yield If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0043] Glass Map merging and batch yield control methods include: 1. Rule Maintenance Step 1: Configure Bin level merging rules through the Product (Product) configuration, refer to... Figure 2 As shown; Step 2: Configure site merging rules and yield control benchmarks through the product (Product) configuration, refer to... Figure 3 As shown; 2. Map merging Step 1 Site: After Glass completes the review at Step 1 site, the system records the site's Map information. ; Query based on Product ID and Current Step ID, such as Figure 8 The Glass site merging rules shown indicate that if Map merging is not required, the Map information of the current site will be used as the merged Map information. Recorded in the database; Step 2 Site: After Glass completes the review at the Step 2 site, the system records the Map information for that site. ; Query based on Product ID and Current Step ID, such as Figure 8 The Glass site merging rules shown require that the Step 2 site map needs to be merged with the Step 1 site map. The Step 1 site map merging information is obtained via the Glass ID. ; Based on Product ID, query the Bin level merging rules (see reference). Figure 2 As shown), and Merge and generate new Glass Map merge information. Recorded in the database; StepN Site: After Glass completes the review at the StepN site, the system records the site's Map information. ; Query based on Product ID and Current Step ID, such as Figure 8 The Glass site merging rules shown require that the StepN site map needs to be merged with the StepN-1 site map. The StepN-1 site map merging information is obtained through the Glass ID. ; Based on Product ID, query the Bin level merging rules (see reference). Figure 2 As shown), and Merge to generate a new one Map merge information Recorded in the database; 3. Yield calculation and control Step 1: Map check. When When a batch leaves the station, inspect all items in the batch. Merge Map information, if all If the Merge Map information for the current site is available, then the batch yield is calculated. Otherwise, hold the batch and remind personnel to confirm; Step 2: Batch yield calculation. Query all yields in the batch. ID, via ID lookup for each piece Merge Map information, count the number of each level (P, N, T), based on Batch yield calculation rules, calculating batch yield ; Step 3: Batch Control. Query the target yield for this site based on the Product ID and Current Step ID. If the batch yield If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0044] ODF Map merging and batch yield control methods include: 1. Rule Maintenance Step 1: As Figure 9 The ODF Bin level merging rules shown are configured through the product. Step 2: As Figure 10 The ODF yield control benchmark shown is configured through the product. 2. Map merging Step 1: Binding Wafer ID and Glass ID. Once a wafer and glass are properly bonded, the system records the matching relationship between the wafer ID and glass ID. Step 2: Map Merging. Based on Wafer ID and Glass ID, find the corresponding Wafer Merge Map and Glass Merge Map respectively; based on Product ID, query... Figure 8 The ODF Bin level merging rules shown are used to merge the data and generate new ODF Map records in the database. 3. Yield calculation and control Step 1: ODF Map Check. When an ODF batch leaves the factory, check the map information of all ODFs in the batch. If all ODFs have map information, calculate the batch yield. Otherwise, hold the batch and remind personnel to confirm; Step 2: Batch Yield Calculation. Query all ODF IDs in the batch, retrieve the Map information for each ODF using its ODF ID, count the quantity of each level (P, N, T), and calculate the batch yield according to the ODF batch yield calculation rules. ; Step 3: Batch Control. Query the target yield for this site based on the Product ID and Current Step ID. If the batch yield If the batch passes inspection, it will be shipped out normally; otherwise, hold the batch and remind personnel to confirm.

[0045] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative and not exhaustive. All modifications within the scope of this invention or its equivalents are included in this invention.

Claims

1. A silicon-based OLED product Map merging and yield control system, comprising: Wafer Map management module; The Wafer Map management module includes a CP Map management submodule, a Wafer Map merging submodule, a Wafer yield calculation submodule, and a Wafer yield control submodule; Glass Map management module; the Glass Map management module includes a Glass Map merging submodule, a Glass yield calculation submodule, and a Glass yield control submodule; ODF Map management module; The ODF Map management module includes an ODF Map merging submodule, an ODF yield calculation submodule, and an ODF yield control submodule.

2. The silicon-based OLED product map merging and yield control system of claim 1, wherein, The CP Map management submodule is used to parse the CP Map file content, identify the wafer backside T7Code, identify the die position with row and column coordinates, and identify the die level with Bin level, and store it in the database; The Wafer Map merging submodule is used to save the Wafer Map information of each manual review site; The Wafer yield calculation submodule calculates the Wafer batch yield according to the newly generated Wafer Map information and yield calculation rules; The Wafer yield control submodule is used to set the Wafer yield control rules, and determine the Wafer batch normal Flow or Hold according to the calculated Wafer batch yield.

3. The silicon-based OLED product map merging and yield control system of claim 2, wherein, The Glass Map merging submodule is used to store the Glass Map information of each manual review site in the database; The Glass yield calculation submodule calculates the Glass batch yield according to the newly generated Glass Map information and yield calculation rules; The Glass yield control submodule is used to set the Glass yield control rules, and determine the Glass batch normal Flow or Hold according to the calculated Glass batch yield.

4. The silicon-based OLED product map merging and yield control system of claim 3, wherein, The ODF Map merging submodule merges the Wafer and Glass Maps after bonding by setting the ODF Map merging rules, generates a new ODF Map, and stores it in the database; The ODF yield calculation submodule calculates the ODF batch yield according to the newly generated ODF Map information and yield calculation rules; The ODF yield control submodule sets the ODF yield control rules, and determines the ODF batch normal Flow or Hold according to the calculated ODF batch yield.

5. The silicon-based OLED product map merging and yield control system of claim 2, wherein, The Wafer Map is identified by Wafer ID and site Step ID, the die position is identified by row and column coordinates, and the die level is identified by Bin level. By setting the Wafer Map merging rules, the Wafer Map is merged with the CP Map or the Wafer Map, a new Wafer Map information is generated, and stored in the database.

6. The silicon-based OLED product map merging and yield control system of claim 3, wherein, The GlassMap is identified by Glass ID and station Step ID, the wafer position is identified by row and column coordinates, and the wafer level is identified by Bin level. The GlassMap is merged with another GlassMap by setting GlassMap merging rules to generate new GlassMap information and store the information in a database.

7. The silicon-based OLED product map merging and yield control system of claim 2, wherein, The WaferMap merging rules include: dividing the Bin level into P, N and T levels, wherein P represents Good wafer, N represents Bad wafer, and T represents uncertain wafer; when all the merged wafers are P level, the merged wafer is P level; when one of the merged wafers is N level, the merged wafer is N level; and in other cases, the merged wafer is T level. In addition, the station information to be merged is configured according to products and stations, and when a new WaferMap is generated by manual rejudgment of a station, the merging logic is triggered to merge the WaferMap of the station with the WaferMap of the configured station. When the above-mentioned WaferMap and CPMap are merged, the Wafer ID and T7Code relationship are matched.

8. The silicon-based OLED product map merging and yield control system of claim 2, wherein, The Wafer batch yield calculation rules are: wherein, represents the sum of the number of grains of the grade P in the batch, represents the sum of the number of grains of the grade N in the batch, represents the sum of the number of grains of the grade T in the batch; And the calculation is triggered when the Wafer batch leaves the station.

9. The silicon-based OLED product map merging and yield control system of claim 2, wherein, The wafer yield control rule comprises: setting a target yield according to products and sites When the batch yield is greater than or equal to the target yield, the batch is in normal flow, and when the batch yield is less than the target yield, the batch is held.

10. The silicon-based OLED product map merging and yield control system of claim 3, wherein, The GlassMap merging rules, the Glass yield calculation rules and the Glass yield control rules are the same as the WaferMap merging rules, the Wafer yield calculation rules and the Wafer yield control rules, respectively.

11. The silicon-based OLED product map merging and yield control system of claim 4, wherein, The ODFMap merging rules include: when the Bin levels of the Wafer and Glass wafers are all P level, the merged wafer is P level; when one of the Bin levels of the Wafer and Glass wafers is N level, the merged wafer is N level; and in other cases, the merged wafer is T level.

12. The silicon-based OLED product map merging and yield control system of claim 4, wherein, The ODF yield calculation rules and the ODF yield control rules are the same as the Wafer yield calculation rules and the Wafer yield control rules, respectively.

13. A management method of a management system for the merging and yield control of silicon-based OLED products according to any one of claims 1-12, characterized in that, The Wafer merging and yield control method includes the following steps: S1: configuring the Wafer Map merging rules by product, including Bin level merging rules and station merging rules; and configuring the yield control benchmark by station; S2: importing the Wafer incoming CPMap, and the system analyzes the CPMap content and stores it in the database; S3: When a certain artificial re-judging site StepN generates a Wafer Map, record the Wafer Map information of the site in the database Find the site StepN-1 that needs to be merged through the site merging rule, find the corresponding Wafer Map through the Wafer ID and Step ID Merge, generate a new Wafer Merge Map, and record the merging Map information in the database That is: = + Wherein, "+" represents the meaning of merging, so a recursive merging scheme is formed, that is: = + + ... + + + S4: When the Wafer batch is outbound, check the Merge Map information of all Wafer in the batch; if all Wafer have corresponding Merge Map information, calculate the batch yield , otherwise, hold the batch and remind the staff to confirm; S5: Check the site management target yield If The batch is normal outbound, otherwise hold the batch and remind the staff to confirm.

14. The method of claim 13, wherein the method further comprises: The Glass Map merging and batch yield control method includes the following steps: S1: configuring the Glass Map merging rules by product, including Bin level merging rules and station merging rules; and configuring the yield control benchmark by station; S2: When a certain artificial re-trial site StepM generates a Glass Map, record the Glass Map information of the site in the database Find the site StepM-1 that needs to be merged through the site merging rule, find the corresponding Glass Map through the Glass ID and Step ID Perform merging, generate a new Glass Merge Map, and record the merging Glass Map information in the database That is: = + Wherein, "+" represents the meaning of merging; so a recursive merging scheme is also formed, that is: = + +...+ + S3: When Glass batch is outbound, check all the Merge Map information of the Glass in the batch; if all the Glass have corresponding Merge Map information, calculate the batch yield , otherwise, hold the batch and remind the staff to confirm; S4: Check the site management target yield If The batch is normal outbound, otherwise hold the batch and remind the staff to confirm.

15. The method of claim 13, wherein the method further comprises: The ODF Map merging and batch yield control method comprises the following steps: S1: merging rules and yield control benchmarks of ODF Map are configured through product configuration; S2: When a wafer is attached to a glass, the wafer ID and the glass ID are used to obtain a wafer merge map and a glass merge map, to merge the wafer merge map and the glass merge map, to generate a new ODF map, and to record the information in a database That is, = + Wherein, "+" represents the meaning of merging. S3: When the ODF batch is outbound, check the Map information of all ODFs in the batch; if all ODFs have corresponding Map information, calculate the batch yield , otherwise, hold the batch and remind the staff to confirm; S4: Check the site target yield If The batch is normal outbound, otherwise hold the batch and remind the staff to confirm.

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