Wafer indexing mechanism for processing modules

Abstract

A processing module for a processing module of a substrate processing system includes a vacuum chamber and a non-vacuum chamber. A substrate support is positioned in the vacuum chamber, configured to support a substrate entering the vacuum chamber, and coupled to the magnet. The metal component is further positioned to include a motor coil in the non-vacuum chamber. When the motor coil is energized, the motor coil and the magnet interact to generate a magnetic field, allowing the substrate support to rotate about the first axis and place the substrate in a desired position. A rotating wafer indexer for a processing module of a substrate processing system and a method of manufacturing a substrate indexer are also described.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 666,053, filed June 28, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure generally relates to the manufacture of semiconductor devices, and more specifically, to substrate indexing in a processing module during the manufacture of semiconductor devices. Background Technology

[0004] Conventional processing manufacturers have the capability to service six independent processing modules. In many conventional systems, four processing chambers can be bundled into a single processing module, allowing four wafers to be processed simultaneously within that module. However, for four chambers to operate within a single processing module, an indexing mechanism must be provided to receive wafers from a vacuum robot entering from the wafer transport chamber and to rotate it to place the wafers in a rear chamber that is not adjacent to the wafer transport chamber.

[0005] Typically, a wafer indexer is used within the bundled processing module for 180-degree rotational movement and linear movement along the Z-axis to pick up wafers and place them into the desired pedestal. A servo motor is usually located in the surrounding environment and is connected via a shaft and bearings that are hermetically sealed to a rotating arm within a vacuum chamber. This rotating arm enables the simultaneous lifting and rotation of four wafers.

[0006] In conventional systems, ferrofluid seals are used to hermetically seal the processing chamber to the drive mechanism for the rotary indexer. However, at the elevated temperatures where the processing module typically operates, these seals can leak, degas, and contaminate the chamber with oily substances that serve as carriers for the nanomagnetic particles that form the hermetically sealed layer. Therefore, there is a need to improve the wafer indexing mechanism for the processing module.

[0007] Any discussion set forth in this section (including discussions of problems and solutions) is included in this disclosure merely for the purpose of providing background to this disclosure and should not be construed as an admission that any or all of the discussions were known at the time the invention was made or otherwise constituted prior art. Summary of the Invention

[0008] A processing module for a substrate processing system is provided. The processing module includes a vacuum chamber, a magnet, a substrate support, and a motor coil. The magnet is disposed in the vacuum chamber. The substrate support is coupled to the magnet and configured to support the substrate. The motor coil is disposed in a non-vacuum environment and, when energized, interacts with the magnet to rotate a substrate indexer about a first axis.

[0009] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a second metal component. The second metal component can separate the motor coil and the magnet from each other.

[0010] In addition to one or more of the features described above, or as an alternative, another example of the processing module may include a second metal component comprising a cylindrical segment. The cylindrical segment may have a top cylindrical side, a circumferential side, and a cylindrical opening opposite the top cylindrical side defining an inner cylindrical segment and an outer cylindrical segment. The inner cylindrical segment of the second metal component may be exposed to a non-vacuum environment.

[0011] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a motor coil disposed along the circumferential side in an inner cylindrical section.

[0012] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a magnet disposed along the circumferential side in an outer cylindrical section.

[0013] In addition to one or more of the features described above, or as an alternative, another example of the processing module may include a second metal component comprising a Z-shaped section. The Z-shaped section may include a top Z-side exposed to the vacuum chamber and a bottom Z-side exposed to the non-vacuum environment.

[0014] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a cylindrical segment connected to a Z-shaped segment at a cylindrical opening.

[0015] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a first metal component. The first metal component may be connected to a second metal component via an O-ring.

[0016] In addition to one or more of the features described above, or as an alternative, another example of the processing module may include a first metal side of the first metal component exposed to a vacuum chamber, and a second metal side of the first metal component exposed to a non-vacuum environment.

[0017] In addition to one or more of the features described above, or as an alternative, another example of the processing module may include a substrate support comprising a third metal component. The third metal component may be coupled to a second metal component. The third metal component may be disposed within a vacuum chamber. The third metal component may be configured to rotate about a first axis.

[0018] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a magnet connected to a third metal component.

[0019] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a third metal component connected to a second metal component via one or more bearings.

[0020] In addition to one or more of the features described above, or as an alternative, another example of the processing module may include one or more bearings and magnets that may be disposed on opposite sides of a third metal component.

[0021] In addition to one or more of the features described above, or as an alternative, another example of a processing module may include a motor coil excited by a source within the processing module.

[0022] In addition to one or more of the features described above, or as an alternative, other examples of the processing module may include a first metal component formed of at least one of aluminum, nickel, Hastelloy, ferrochrome, and titanium. A second metal component may be formed of at least one of aluminum, nickel, Hastelloy, ferrochrome, and titanium. A third metal component may be formed of at least one of aluminum, nickel, Hastelloy, ferrochrome, and titanium.

[0023] A wafer rotary indexer in a processing chamber includes a magnet, a motor coil, and a thin metal component. The magnet is disposed in a vacuum chamber. The motor coil is disposed in the atmospheric environment. The thin metal component hermetically separates the magnet and the motor, such that a magnetic field generated by the interaction between the magnet and the motor coil causes the wafer rotary indexer to rotate about a first axis.

[0024] A method is provided for manufacturing a substrate indexer for a processing module of a substrate processing system. The method includes setting a substrate support in a vacuum chamber, configured to support one or more substrates. The method further includes coupling a magnet to the substrate support, setting a motor coil in a non-vacuum chamber, and separating the magnet and the motor coil using a first metal component such that when the motor is energized, the motor coil and the magnet interact to rotate the substrate support about a first axis to a desired position.

[0025] In addition to one or more of the features described above, or as an alternative, other examples of the method may include placing a substrate support in a vacuum chamber, placing a second metal component in the vacuum chamber, and connecting a magnet to the second metal component.

[0026] In addition to one or more of the features described above, or as an alternative, another example of the method may include using one or more bearings to connect the first metal part to the second metal part.

[0027] In addition to one or more of the features described above, or as an alternative, another example of the method may include using an O-ring to connect a third metal component to a first metal component.

[0028] A wafer rotary indexer is provided in a processing chamber. The indexer includes a magnet disposed in a vacuum chamber. The indexer also includes a motor coil disposed in an atmospheric environment. Finally, the indexer includes a thin metal component that hermetically separates the magnet and the motor coil, such that a magnetic field generated by the interaction between the magnet and the motor coil causes the wafer rotary indexer to rotate about a first axis.

[0029] This disclosure is provided to present the chosen concepts in a simplified form. These concepts are further described in detail in the following examples of specific embodiments of this disclosure. This disclosure is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. Attached Figure Description

[0030] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than limit the invention.

[0031] Figure 1A A top view of a substrate processing system according to an embodiment described herein is shown;

[0032] Figure 1B The embodiments described herein include Figure 1A A top view of the processing module in the substrate processing system;

[0033] Figure 2 An embodiment according to the present document is shown. Figure 1B A cross-sectional view of the substrate indexer in the processing module;

[0034] Figure 3 An embodiment according to the present document is shown. Figure 2 Exploded view of the metal components of the substrate rotary indexer; and

[0035] Figure 4 A flowchart is shown of a method for forming an hermetically tight seal in a processing module of the substrate processing system in FIG1 according to an embodiment described herein.

[0036] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative dimensions of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the embodiments illustrated in this disclosure. Detailed Implementation

[0037] Reference will now be made to the accompanying drawings, wherein like reference numerals identify similar structural features or aspects disclosed herein. The systems and methods of the present invention can be used in semiconductor processing systems for manufacturing semiconductor devices, such as those used to deposit material layers during the manufacture of logic and memory devices using chemical vapor deposition (CVD) and atomic layer deposition (ALD) techniques; however, the invention is generally not limited to any particular semiconductor processing operation or the manufacture of any particular type of semiconductor device.

[0038] As used herein, the term "substrate" can refer to any one or more underlying materials, including any one or more underlying materials that can be modified or on which devices, circuits, or films can be formed. A "substrate" can be continuous or discontinuous; rigid or flexible; solid or porous; and combinations thereof. A substrate can be in any form, such as powder, plate, or workpiece. Plate-shaped substrates can include wafers, such as wafers of various shapes and sizes. Wafer diameters can be 200 mm, 300 mm, or even 450 mm. A substrate can be formed from one or more semiconductor materials, including, by way of non-limiting example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0039] Figure 1A A top view of a substrate processing system 10 is shown. The substrate processing system 10 includes an Equipment Front End Module (EFEM), a Load Locking Module (LLM) 14, a Substrate Transfer Chamber (SHC) 12, and one or more processing modules 100. Generally, unprocessed substrates are accessed by the substrate processing system at an EFEM used for cassettes, such as wafers transported to the EFEM from a front-opening wafer cassette (FOUP). The EFEM includes a front-end robot configured to retrieve substrates from the cassette and prepare them for transport to the LLM 14. The transfer of substrates from the LLM 14 to the processing modules is handled by one or more robots 16 in the SHC 12.

[0040] In an exemplary embodiment, the substrate processing system 10 may include a plurality of processing modules, such as four or six processing modules 100, but the substrate processing system 10 may include fewer or more processing modules 100. Figure 1A In the example shown, the substrate processing system 10 includes four processing modules (100-1, 100-2, 100-3, 100-4). Furthermore, in an exemplary embodiment, the substrate processing system 10 may include a robot 16. The robot 16 may also include at least one arm with an end effector. The end effector is configured to support one or more substrates. The robot 16 accesses substrates from the LLM 14 and places the substrates onto a substrate support (e.g., base 114) in the processing module 100. In the example described herein, the robot 16 includes two arms, each with an end effector, such that two substrates can be transferred to the processing module 100 simultaneously.

[0041] Figure 1B A top view of an example processing module 100 included in a substrate processing system 10 is shown. The processing module 100 includes at least one base 114. Figure 1B In the example shown, the processing module 100 includes four bases 114-1, 114-2, 114-3, and 114-4. The processing module 100 receives a substrate from a robot 16 in the SHC via a gate valve 120.

[0042] exist Figure 1B In the example shown, two gate valves 120-1 and 120-2 connect the SHC (e.g., SHC12) to the processing module 100. Therefore, the end effector of robot 16 can move through gate valves 120-1 and 120-2 to transfer the substrate from SHC12 into the processing module 100 and place it on base 114. In the example discussed herein, robot 16 may place the substrate only on the two bases closest to gate valves 120-1 and 120-2. That is, due to the limited movement of the end effector through gate valves 120-1 and 120-2, the end effector of robot 16 is limited to placing the substrate on bases 114-3 and 114-4 only at a time.

[0043] To place the substrate on bases 114-1 and 114-2 (i.e., at base positions not close to gate valves 120-1 and 120-2), a rotation mechanism 112 is provided in the processing module 100. The processing module 100 includes three axes: x-axis 102, y-axis 104, and z-axis 106. The processing module 100 includes a substrate indexer 200 (e.g., a rotary wafer indexer including arms 118-1, 118-2, 118-3, and 118-4) having both rotational and linear motion. The rotation mechanism 112 allows the substrate indexer 200 to rotate 180 degrees along the z-axis. In an exemplary embodiment, the substrate indexer 200 includes, for example, linear motion in the z-direction. Therefore, the first set of two substrates can be placed on bases 114-3 and 114-4, and the rotation mechanism 112 can be used to rotate the substrate indexer 200 by 180 degrees, causing bases 114-1 and 114-2 to approach gate valves 120-1 and 120-2. Thus, after the 180-degree rotation, the second set of two substrates can be placed on bases 114-1 and 114-2 before the deposition process begins. Therefore, all four bases 114-1, 114-2, 114-3, and 114-4 in the processing module 100 are occupied by substrates for simultaneous processing.

[0044] The rotational movement of the substrate indexer 200 is accomplished using a motor coil 212 in one environment and a magnet 214 in a second environment, with the motor coil 212 and the magnet 214 separated by an airtight seal. Figure 2 A cross-sectional view of an example substrate indexer 200 in processing module 100 is shown. The substrate indexer 200 is configured to rotate a substrate (e.g., substrates 282-1 and 282-2, which may be wafers) about axis 230. The substrate indexer 200 includes a first environment 206 and a second environment 210. That is, the first environment 206 and the second environment 210 have different pressure environments. For example, the first environment 206 may be a high-pressure environment, and the second environment 210 may be a low-pressure environment, or vice versa. In an exemplary embodiment, the first environment 206 is an atmospheric (ATM pressure) environment. In an exemplary embodiment, the second environment 210 is a vacuum chamber.

[0045] Furthermore, the first environment 206 and the second environment 210 are separated by a metal segment. In an exemplary embodiment, the metal segment includes multiple metal components. Figure 2 As shown, a first metal component 222 is coupled to a second metal component 220. The first metal component 222 is positioned about an axis 230. In an exemplary embodiment, the first metal component 222 is coupled to the second metal component 220 via an O-ring 204. In an exemplary embodiment, the first metal component 222 is stationary. Furthermore, as... Figure 2 As shown, in an exemplary embodiment, the first metal component 222 is an L-shaped component positioned radially around the axis 230 (for example, the cross-section of the first metal component 222 may resemble the letter "L" and be described as "L-shaped").

[0046] In an exemplary embodiment, the second metal component 220 includes a Z-shaped segment 228 (e.g., the cross-section of the Z-shaped segment 228 may resemble the letter "Z" and be described as "Z-shaped") and a generally cylindrical segment 202. The second metal component 220 is radially positioned about an axis 230. In an exemplary embodiment, the second metal component 220 is stationary. In some examples, the second metal component 220 may hermetically separate the motor coil 212 and the magnet 214. In this regard, it is conceivable that the second metal component 220 may include the cylindrical segment 202 having a top cylindrical side 236t, a circumferential side 236c, and a cylindrical opening 232 axially opposite to the top cylindrical side 236t that defines the inner cylindrical segment 226i and the outer cylindrical segment 226e. In such an example, the inner cylindrical segment 226i may be exposed to a non-vacuum environment.

[0047] Cylindrical segment 202 includes a circumferential side 236c, a top cylindrical side 236t, and a cylindrical opening 232 instead of a bottom side to complete cylindrical segment 202. Cylindrical segment 202 may be formed about axis 230. Cylindrical segment 202 includes an inner cylindrical segment 226i and an outer cylindrical segment 226e. The cylindrical opening 232 in cylindrical segment 202 is formed such that the inner cylindrical segment 226i of cylindrical segment 202 is exposed to the first environment 206. Figure 2 As shown, the cylindrical opening 232 is connected to the Z-shaped section 228 (e.g., defined by the Z-shaped section 228). The cylindrical section 202 protrudes into the second environment 210 such that the top cylindrical side 236t and the circumferential side 236c are exposed to the second environment 210 on the outer cylindrical section 226e.

[0048] Cylindrical segment 202 forms a partition made of a thin metallic material. In an exemplary embodiment, the thin metallic material may be a non-magnetic material. In another exemplary embodiment, the thin metallic material may be made of a corrosion-resistant and / or oxidation-resistant metal, such as aluminum, nickel, Hastelloy, ferrochrome, or titanium. In an exemplary embodiment, the thin metallic material forming the cylindrical segment 202 is thinner than the width of the Z-shaped segment 228 of the second metal component 220, the first metal component 222, and the third metal component 218. In an exemplary embodiment, two or more of the cylindrical segment 202, the first metal component 222, the second metal component 220, and the third metal component 218 may have the same (e.g., substantially equal) dimensions or wall thickness.

[0049] Furthermore, in an exemplary embodiment, the substrate indexer 200 also includes a third metal component 218. The third metal component 218 is coupled to the Z-shaped segment 228 of the second metal component 220. In an exemplary embodiment, the third metal component 218 is coupled to the Z-shaped segment 228 of the second metal component 220 via one or more bearings 216. In an exemplary embodiment, the third metal component 218 is an inverted (e.g., inverted relative to gravity) L-shaped member. Figure 2 In the example shown, the third metal component 218 is entirely located within the second environment 210. That is, the third metal component 188 is only exposed to the second environment 210 and not to the first environment 206. Figure 2 As further shown, magnet 214 is directly connected to third metal component 218.

[0050] Temporarily transferred to Figure 3 , Figure 3 An exploded view of the third metal component 218 of the substrate indexer 200 is shown. Figure 3As shown, the third metal component 218 includes a vertically wider section 302 and a longer section 304. Furthermore, the third metal component 218 includes a top side 322, a first wide side 324, a second wide side 326, a first long side 332, a bottom side 334, and a second long side 336. The top side 322, the second wide side 326, and the bottom side 334 are parallel. Additionally, the first wide side 324, the first long side 332, and the second long side 336 are parallel. (As shown in...) Figure 3 As further shown, one or more bearings 216 are connected to the first long side 332, and magnet 214 is connected to the second long side 336.

[0051] Back Figure 2 The substrate indexer 200 also includes a motor coil 212. The motor coil 212 is disposed in the first environment 206. In an exemplary embodiment, the motor coil 212 is disposed in an inner cylindrical section 226i. In another exemplary embodiment, the motor coil 212 is disposed along the circumferential side 236c. Figure 2 As further shown, magnet 214 is also disposed along the circumferential side 236c, but in the outer cylindrical section 226e (e.g., the outer cylindrical section). Therefore, motor coil 212 is disposed along the circumferential side 236c in the first environment 206, and magnet 214 is disposed along the circumferential side 236c in the second environment 210.

[0052] As in Figure 2 As further shown, motor coil 212 is connected to source 294. Motor coil 212 can be excited by controlling the current supplied by source 294. Source 294 can be inside or outside substrate indexer 200. When motor coil 212 is excited, motor coil 212 interacts with magnet 214 via a magnetic field generated by the current flowing through motor coil 212 (separated by a hermetically sealed section 202). This magnetic field allows third metal component 218 to rotate about axis 230.

[0053] Therefore, the wider section 302 of the third metal component 218 serves as the axis of rotation. For example... Figure 2 As further shown, the wider section 302 of the third metal component 218 is connected to the rotary support 280. The rotary support 280 is further connected to the rotary stage 284, and the rotary stage 284 is configured to support the substrate 282. Both the rotary support 280 and the rotary stage 284 are positioned radially about the axis 230. Therefore, when the third metal component 218 rotates about the axis 230, the rotary support 280 and the rotary stage 284 also rotate in the same direction as the third metal component 218. Thus, the substrate 282 can be supported by the rotary stage 284, and the rotary stage 284 also rotates.

[0054] As previously stated, the energy generated by motor coil 212 (i.e., the current supplied to motor coil 212) can be regulated by source 294. By controlling the current supplied to the motor coil, the rotation of the third metal component 218 (and therefore the substrate indexer 200) can be adjusted to the desired amount.

[0055] In an exemplary embodiment, when the substrate 282 is received in the processing module 100 (e.g., from SHC 12), the rotary stage 284 can support the substrate 282. The motor coil 212 can then be energized, causing rotation of the substrate support (e.g., the third metal component 218, the rotating support 280, and the rotary stage 284 supporting the substrate 282). After achieving the desired amount of rotation (e.g., when the substrate reaches the desired base position), the current supplied to the motor coil 212 is adjusted to stop the rotation. The substrate 282 can then be placed at the desired base position.

[0056] Therefore, by controlling the energy generated by the motor coil (e.g., the current supplied to the motor coil), the substrate indexer 200 can rotate to the desired amount. Figure 2 In the example shown, because magnet 214 is in a low-pressure (e.g., vacuum) environment, magnet 214 is protected from atmospheric contamination (e.g., hydrogen). In an exemplary embodiment, substrate indexer 200 also includes a printed circuit board (PCB) 208 connected along its circumferential side 236c. In an exemplary embodiment, the first metal component, the second metal component, and the third metal component are made of the same metallic material. In an exemplary embodiment, they are made of different materials.

[0057] Figure 4 A method 400 for manufacturing a substrate indexer for a processing module of a substrate processing system is illustrated. Method 400 includes disposing a substrate support in a vacuum chamber (e.g., vacuum chamber 210), as shown in block 402. Method 400 also includes coupling a magnet (e.g., magnet 214) to the substrate support, as shown in block 404. In an exemplary embodiment of method 400, disposing the magnet in the vacuum chamber further includes disposing a second metal component (e.g., a third metal component 218) in the vacuum chamber and coupling the magnet to the second metal component.

[0058] Method 400 further includes placing a motor coil (e.g., motor coil 212) in a non-vacuum chamber (e.g., an atmospheric environment), as shown in box 406. Method 400 also includes using a first metal component (e.g., a second metal component 220) to separate the magnet and the motor coil, such that when the motor coil is energized, the motor coil and the magnet interact to rotate the substrate support about a first axis (e.g., axis 230) to a desired position, as shown in box 408.

[0059] In an exemplary embodiment, method 400 further includes using one or more bearings (e.g., bearing 216) to connect the first metal component to the second metal component. In an exemplary embodiment, method 400 further includes using an O-ring (e.g., O-ring 204) to connect a third metal component (e.g., the first metal component 222) to the first metal component.

[0060] Although this disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that this disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of the embodiments, as well as their obvious modifications and equivalents. Furthermore, while several variations of embodiments of this disclosure have been shown and described in detail, other modifications based on this disclosure and within its scope will be apparent to those skilled in the art. Various combinations or sub-combinations of specific features and aspects of the embodiments are also contemplated and will still fall within the scope of this disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined or substituted with each other to form variations of embodiments of this disclosure. Therefore, it is intended that the scope of this disclosure should not be limited to the specific embodiments described above.

[0061] The headings provided herein (if any) are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A process module of a substrate processing system, comprising: a vacuum chamber; a magnet disposed in the vacuum chamber; a substrate support coupled to the magnet and configured to support a substrate; and a motor coil disposed in a non-vacuum environment, wherein, when the motor coil is energized, the motor coil and the magnet interact to cause a wafer indexer to rotate about a first axis.

2. The process module of claim 1, further comprising a second metal component that hermetically separates the motor coil and the magnet. the second metal component includes a cylindrical segment having a top cylindrical side that defines an inner cylindrical segment and an outer cylindrical segment, a circumferential side, and a cylindrical opening opposite the top cylindrical side; 3. The process module of claim 2, wherein, and wherein the inner cylindrical segment is exposed to the non-vacuum environment. the motor coil is disposed in the inner cylindrical segment along the circumferential side.

4. The processing module of claim 3, wherein, the magnet is disposed in the outer cylindrical segment along the circumferential side.

5. The process module of claim 4, wherein, the second metal component includes a Z-shaped segment, wherein the Z-shaped segment includes a top Z-side exposed to the vacuum chamber and a bottom Z-side exposed to the non-vacuum environment.

6. The process module of claim 3, wherein, the cylindrical segment is coupled to the Z-shaped segment at the cylindrical opening.

7. The process module of claim 6, wherein, 8. The process module of claim 2, further comprising a first metal component coupled to the second metal component by an O-ring. a first metal side of the first metal component is exposed to the vacuum chamber and a second metal side of the first metal component is exposed to the non-vacuum environment.

9. The process module of claim 8, wherein, the substrate support includes a third metal component coupled to the second metal component, wherein the third metal component is disposed in the vacuum chamber, and wherein the third metal component is configured to rotate about the first axis.

10. The process module of claim 2 wherein, the magnet is coupled to the third metal component.

11. The process module of claim 10, wherein, the third metal component is coupled to the second metal component by one or more bearings.

12. The process module of claim 11, wherein, the one or more bearings and the magnet are disposed on opposite sides of the third metal component.

13. The process module of claim 12, wherein, the motor coil is energized by a source internal to the process module.

14. The process module of claim 1, wherein, the second metal component is composed of at least one of aluminum, nickel, hastelloy, inconel, and titanium.

15. The process module of claim 2 wherein, 16. A rotating wafer indexer for a process chamber of a substrate processing system, comprising: a magnet disposed in a vacuum chamber; a motor coil disposed in an atmospheric environment; and a thin metal component that hermetically separates the magnet and the motor coil such that a magnetic field generated by an interaction between the magnet and the motor coil causes the wafer rotational indexer to rotate about a first axis.

17. A method of manufacturing a substrate indexer for a process module of a substrate processing system, the method comprising: disposing a substrate support in a vacuum chamber, the substrate support configured to support one or more substrates; coupling a magnet to the substrate support; disposing a motor coil in a non-vacuum chamber; and separating the magnet and the motor coil using a second metal component such that, when the motor coil is energized, the motor coil and the magnet interact to cause the substrate support to rotate about a first axis to a desired position. disposing the substrate support in a vacuum chamber further comprises: disposing a third metal component in the vacuum chamber; and ​ 18. The method of claim 17, wherein, ​ ​ coupling the magnet with a third metal component.

19. The method of claim 18, further comprising coupling the third metal component with the second metal component using one or more bearings.

20. The method of claim 17, further comprising coupling the first metal component with the second metal component using an O-ring.

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