Chip mounter

Abstract

The application discloses a patch device for electronic component processing applied to the technical field of electronic component patching, and the patch device is characterized in that: according to the type of the electronic components on the circuit board to be patched, a corresponding number of patch assemblies are installed, and the patching area of the circuit board is correspondingly divided according to the installation position of the patch assembly; each patch assembly is responsible for patching the electronic components in the designated area thereof; after the patching of the electronic components of the type in the area is completed, the patch assembly is adjusted in rotation by using a steering motor to drive the station ring, the responsible area of the patch assembly is exchanged, and each patch assembly is responsible for completing all patching areas until the simultaneous patching processing of various electronic components is realized, thereby effectively improving the patching processing efficiency of the electronic components.

Description

Technical Field

[0001] This invention relates to the field of electronic component mounting technology, and in particular to a mounting apparatus for electronic component processing. Background Technology

[0002] Surface mount technology (SMT) generally refers to a technology that mounts tiny electronic components onto circuit boards. It also refers to the electronic components themselves, which are designed specifically for this process and have no leads or only short pins. An SMT machine is a device that uses a moving pick-and-place pen to accurately place electronic components onto a substrate. For example, Chinese patent CN217183731U discloses an SMT machine. However, existing SMT machines often have only one placement head, allowing only one electronic component to be placed at a time. For example, Chinese patent CN222967295U discloses an SMT device. Furthermore, some existing circuit boards contain multiple types of electronic components simultaneously, preventing simultaneous placement and impacting the efficiency of SMT operations. Summary of the Invention

[0003] The core of this invention lies in solving the problem of low efficiency in placing electronic components on circuit boards in the prior art by simultaneously performing placement operations on different types of electronic components using multiple sets of placement assemblies.

[0004] To solve the above problems, the present invention adopts the following technical solution.

[0005] A chip mounting device for electronic component processing includes a device platform and a horizontal displacement track fixedly connected to the top of the device platform. The movable end of the horizontal displacement track is fixedly connected to a worktable module and a feeding module in the middle and front of the chip mounting device platform. The chip mounting machine moves back and forth between the worktable module and the feeding module via the horizontal displacement track. A steering motor is slidably connected to the middle of the chip mounting machine via an electric rail. The output end of the steering motor is fixedly connected to a station ring. Multiple chip mounting assemblies are uniformly fixedly connected to the outer ring of the station ring.

[0006] The patch assembly includes an angle motor fixedly connected to the outer edge of the station ring and an angle swing arm fixedly connected to the output end of the angle motor. A telescopic arm is slidably connected to the bottom of the angle swing arm, and a patch pick-up pen is rotatably connected to one end of the telescopic arm near the axis of the station ring.

[0007] Furthermore, the feeding module includes a sliding rail fixed to the surface of the device platform and a feeder feeding assembly slidably connected to the top of the sliding rail.

[0008] Furthermore, the number of feeder components is the same as the number of surface mount components, and the feeder components are divided into two groups, left and right, with the feeding ends of the two groups of feeder components arranged in parallel and facing opposite directions.

[0009] Furthermore, the feeder feeding assembly has a feeding window at its feeding end, and a feeding conveyor belt is rotatably connected inside the feeder feeding assembly. The feeding conveyor belt transports electronic components to the bottom of the feeding window.

[0010] Furthermore, the feeder feeding assembly has an electric slide rail fixedly connected to the external feed end, and a telescopic cover is slidably connected to the top of the feed window. The movable end of the electric slide rail is fixedly connected to the telescopic cover.

[0011] Optionally, the inner ring of the work station ring is evenly provided with stop grooves, and the top of the patch suction pen is fitted with a pen cap sleeve, which is engaged with the stop groove.

[0012] Furthermore, a retaining ring is fixedly connected to the outer surface of the pen cap, and a hinge is fixedly connected to the middle of the stop groove. The retaining ring and the hinge engage vertically. A telescopic spring is fixedly connected between the top of the pen cap and the top of the adhesive pen holder.

[0013] Furthermore, an unlocking ring is rotatably connected to the top of the workstation ring, and an unlocking piece is fixedly connected to the inner ring of the unlocking ring. The unlocking piece contacts the top of the pen cap cylinder, and the top of the pen cap cylinder is spherically shaped.

[0014] Compared with the prior art, the advantages of this invention are:

[0015] (1) This solution installs a corresponding number of surface mount components according to the type of electronic components on the circuit board to be mounted, and divides the area to be mounted on the circuit board according to the mounting position of the surface mount components. Each surface mount component is responsible for mounting electronic components in its designated area. After mounting of electronic components of this type in the area is completed, the positioning motor drives the station ring to rotate and adjust the surface mount components, thereby changing the area of ​​responsibility of the surface mount components until each surface mount component is responsible for completing all surface mount areas, realizing the simultaneous surface mount processing of multiple electronic components, and effectively improving the surface mount processing efficiency of electronic components.

[0016] (2) The present invention sets the feeding ends of the feeder feeding assembly in parallel and opposite directions, so that the feeding windows of the feeding ends of the feeder feeding assembly are relatively concentrated, which makes it easier for the surface mount assembly to pick up electronic components. After the surface mount assembly passes through the station ring to adjust the surface mount area, the feeder feeding assembly simultaneously slides on the sliding track to adjust the feeding distribution of the feeder feeding assembly accordingly, reducing the step of the station ring rotating to restore the position of the surface mount assembly, and effectively improving the efficiency of the surface mount assembly in picking up electronic components. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2This is a three-dimensional structural diagram of the steering motor, station ring, and patch assembly of the present invention;

[0019] Figure 3 This is a three-dimensional demonstration diagram of the patch assembly of the present invention, showing the division of the patch area.

[0020] Figure 4 This is a three-dimensional structural diagram of the feeding module of the present invention;

[0021] Figure 5 This is a three-dimensional structural diagram of the feeder assembly of the present invention;

[0022] Figure 6 This is a demonstration diagram illustrating the sliding adjustment of the telescopic sliding cover of the present invention;

[0023] Figure 7 This is a top-view three-dimensional structural diagram of the workstation ring of the present invention;

[0024] Figure 8 This is a three-dimensional structural diagram of the present invention, showing the patch suction pen and pen cap in a separate state;

[0025] Figure 9 This is a cross-sectional view of the positioning groove and pen cap cylinder of the present invention;

[0026] Figure 10 This is a top-view perspective structural diagram of the unlocking ring and unlocking piece of the present invention.

[0027] Explanation of the labels in the diagram:

[0028] 1. Device platform, 101. Horizontal displacement rail, 102. Placement machine body, 103. Workbench module, 104. Feeding module, 105. Steering motor, 106. Station ring, 2. Angle motor, 201. Angle swing arm, 202. Telescopic arm, 203. Placement pick-up pen, 3. Sliding rail, 301. Feeder feeding assembly, 302. Feeding window, 303. Feeding conveyor belt, 304. Electric slide rail, 305. Telescopic sliding cover, 4. Stop slot, 401. Pen cap cylinder, 402. Locking ring, 403. Locking hinge, 404. Telescopic spring, 405. Unlocking ring, 406. Unlocking piece. Detailed Implementation

[0029] The technical solutions will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0030] First implementation method:

[0031] Please see Figures 1 to 3A surface mount device for electronic component processing includes a platform 1 and a horizontal displacement track 101 fixedly connected to the top of the platform 1. A surface mount machine body 102 is fixedly connected to the movable end of the horizontal displacement track 101. A workbench module 103 and a feeding module 104 are located in the middle and front of the platform 1. The surface mount machine body 102 reciprocates between the workbench module 103 and the feeding module 104 via the horizontal displacement track 101. A steering motor 105 is slidably connected to the middle of the surface mount machine body 102 via an electric rail. A station ring 106 is fixedly connected to the output end of the steering motor 105. Multiple surface mount components are uniformly fixedly connected to the outer ring of the station ring 106. The chip assembly is installed with a corresponding number of chip assembly components according to the type of electronic components to be chipped. The chip assembly includes an angle motor 2 fixedly connected to the outer edge of the station ring 106 and an angle swing arm 201 fixedly connected to the output end of the angle motor 2. The bottom of the angle swing arm 201 is slidably connected to a telescopic arm 202. The angle swing arm 201 is used to adjust the direction angle, and the telescopic arm 202 is used to adjust the extension length to achieve the positioning of the chip. The end of the telescopic arm 202 near the axis of the station ring 106 is rotatably connected to a chip picker pen 203. The chip picker pen 203 is used to pick up the electronic components and press the electronic components onto the chip position on the circuit board.

[0032] During the surface mount technology (SMT) processing of electronic components, the circuit board to be mounted is fixedly placed on the workbench module 103. A corresponding number of mounting assemblies are installed according to the type and number of electronic components on the circuit board. The mounting area of ​​the circuit board is divided according to the mounting position of the mounting assemblies. Each mounting assembly is responsible for mounting electronic components in its designated area. After mounting of that type of electronic component in that area is completed, the steering motor 105 drives the station ring 106 to rotate and adjust the mounting assembly, thereby changing the area of ​​responsibility of the mounting assembly until each mounting assembly is responsible for completing all mounting areas. This enables simultaneous mounting of multiple electronic components and effectively improves the efficiency of electronic component mounting.

[0033] Please see Figures 4 to 6The feeding module 104 includes a sliding rail 3 fixed to the surface of the device platform 1 and a feeder feeding assembly 301 slidably connected to the top of the sliding rail 3. The number of feeder feeding assemblies 301 is the same as the number of surface mount assembly assemblies, and the feeder feeding assemblies 301 are divided into two groups, left and right. The feeding ends of the two groups of feeder feeding assemblies 301 are parallel and facing opposite directions, so that the feeding ends of the feeder feeding assemblies 301 are more concentrated, which facilitates the surface mount assembly to pick up electronic components. The feeding end of the feeder feeding assembly 301 has a feeding window 302. A feeding conveyor belt 303 is rotatably connected inside the feeder feeding assembly 301. Electronic components are transported to the bottom of the feeding window 302. The electronic components are arranged at equal intervals on the feeding conveyor belt 303, so that the electronic components are transported to the feeding window 302 in an orderly manner. The surface mount assembly picks up the electronic components from the feeding window 302. The feed end of the feeder assembly 301 is fixedly connected to an electric slide rail 304. The top of the feeding window 302 is slidably connected to a telescopic cover 305. The movable end of the electric slide rail 304 is fixedly connected to the telescopic cover 305. By sliding and adjusting the telescopic cover 305, the size of the feeding window 302 is adjusted to expose more electronic components, thereby supplying the same type of electronic components to multiple surface mount assemblies.

[0034] When arranging the feeding module 104, a corresponding number of feeder feeding assemblies 301 are installed according to the type of electronic components. The feeding conveyor belt 303 inside the feeder feeding assembly 301 transports the electronic components to the bottom of the feeding window 302. The placement pen 203 of the surface mount assembly picks up the electronic components from the feeding conveyor belt 303 through the feeding window 302. The feeding ends of the feeder feeding assemblies 301 are arranged parallel and facing opposite directions, so that the feeding windows 302 of the feeding ends of the feeder feeding assemblies 301 are relatively concentrated (because the surface mount assembly is distributed in a ring shape, the movable space of the placement pen 203 of the surface mount assembly is limited, if the feeder...). The feeder assembly 301 adopts a traditional side-by-side arrangement. The feeder assembly 301 at the left and right ends is inconvenient for the chip picker pen 203 to pick up electronic components. It is convenient for the chip picker assembly to pick up electronic components. After the chip picker assembly passes through the station ring 106 to rotate and adjust the chip area, the feeder assembly 301 simultaneously slides on the sliding track 3. The feeder assembly 301 that was originally feeding on the left side extends to the right side, and the feeder assembly 301 that was feeding on the right side extends to the left side. This reduces the step of the station ring 106 rotating to restore the position of the chip picker assembly, and effectively improves the efficiency of the chip picker assembly in picking up electronic components.

[0035] When the feeder assembly 301 simultaneously supplies the same type of electronic component to multiple surface mount assemblies (the number of such electronic components on the circuit board is relatively large), the telescopic cover 305 is further retracted by the electric slide rail 304, which increases the space of the feed window 302, exposes more electronic components, and facilitates multiple surface mount assemblies to pick up the same type of electronic component at the same time.

[0036] Second implementation method:

[0037] Compared to the first implementation, the main addition is a stop slot 4, the specific addition structure is as follows, and the rest of the structure is the same as the first implementation.

[0038] Please see Figures 7 to 10 The inner ring of the workstation ring 106 is evenly provided with stop grooves 4. The top of the patch suction pen 203 is fitted with a pen cap sleeve 401, which engages with the stop groove 4. This engagement of the pen cap sleeve 401 and the stop groove 4 limits the state of the patch suction pen 203, effectively improving the stability of the patch suction pen 203 in the stopped state. A retaining ring 402 is fixedly connected to the outer surface of the pen cap sleeve 401, and a retaining hinge 403 is fixedly connected to the middle of the stop groove 4. The retaining ring 402 and the retaining hinge 403 engage vertically. This engagement of the retaining ring 402 and the retaining hinge 403 effectively improves the stability of the pen cap sleeve 401 and the stop groove 4, effectively preventing... If the adhesive pen 203 accidentally detaches from the stop slot 4, a telescopic spring 404 is fixedly connected between the top of the inner part of the pen cap cylinder 401 and the top of the adhesive pen 203. The top of the station ring 106 is rotatably connected to the unlocking ring 405. The inner ring of the unlocking ring 405 is fixedly connected to the unlocking piece 406. The unlocking piece 406 contacts the top of the pen cap cylinder 401. The top of the pen cap cylinder 401 is spherical. By rotating the unlocking ring 405, the unlocking piece 406 is driven. The unlocking piece 406 contacts and presses the spherical top of the pen cap cylinder 401, causing the pen cap cylinder 401 to automatically descend, thereby automatically releasing the upper and lower latches of the locking ring 402 and the locking hinge 403.

[0039] When the patch assembly stops working, the patch pen 203 retracts into the stop groove 4. The state of the patch pen 203 is limited by the engagement between the pen cap 401 and the stop groove 4, which effectively improves the stability of the patch pen 203 in the stopped state. Furthermore, the upper and lower engagement of the locking ring 402 and the locking hinge 403 further improves the stability of the pen cap 401 and the stop groove 4. When it is necessary to start the patch assembly that has been stopped, the unlocking ring 405 rotates to drive the unlocking piece 406. The spherical top of the pen cap 401 is pressed down by the unlocking piece 406 and automatically releases the upper and lower engagement of the locking ring 402 and the locking hinge 403.

[0040] The above description is merely a preferred embodiment of the present invention; it encompasses all the protection scope of the present invention. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in the present invention, based on the technical solutions and improved concepts of the present invention, should be covered within the protection scope of the present invention.

Claims

1. A chip mounting apparatus for electronic component processing, comprising a platform (1) and a horizontal displacement track (101) fixedly connected to the top of the platform (1), wherein a chip mounting machine body (102) is fixedly connected to the movable end of the horizontal displacement track (101), characterized in that: The device platform (1) has a workbench module (103) and a feeding module (104) in the middle and front of the device platform (1). The chip mounter body (102) moves back and forth between the workbench module (103) and the feeding module (104) via a horizontal displacement rail (101). The middle of the chip mounter body (102) is connected to a steering motor (105) via an electric rail for lifting and sliding. The output end of the steering motor (105) is fixedly connected to a station ring (106). Multiple chip mounters are evenly fixedly connected to the outer ring of the station ring (106). The patch assembly includes an angle motor (2) fixedly connected to the outer edge of the station ring (106) and an angle swing arm (201) fixedly connected to the output end of the angle motor (2). The bottom of the angle swing arm (201) is slidably connected to a telescopic arm (202), and the end of the telescopic arm (202) near the axis of the station ring (106) is rotatably connected to a patch suction pen (203). The inner ring of the work station ring (106) is evenly provided with a stop groove (4). The top of the patch suction pen (203) is fitted with a pen cap cylinder (401). The pen cap cylinder (401) is engaged with the stop groove (4). A locking ring (402) is fixedly connected to the outer surface of the pen cap cylinder (401). A locking hinge (403) is fixedly connected to the middle of the stop groove (4). The locking ring (402) and the locking hinge (403) are engaged vertically. A telescopic spring (404) is fixedly connected between the inner top of the pen cap cylinder (401) and the top of the patch suction pen (203). An unlocking ring (405) is rotatably connected to the top of the work station ring (106). An unlocking piece (406) is fixedly connected to the inner ring of the unlocking ring (405). The unlocking piece (406) contacts the top of the pen cap cylinder (401). The top of the pen cap cylinder (401) is spherically shaped.

2. The surface mount device for electronic component processing according to claim 1, characterized in that: The feeding module (104) includes a sliding rail (3) fixed to the surface of the device platform (1) and a feeder feeding assembly (301) slidably connected to the top of the sliding rail (3).

3. The surface mount device for electronic component processing according to claim 2, characterized in that: The number of feeder components (301) is the same as the number of patch components, and the feeder components (301) are divided into two groups, left and right, with the feeding ends of the two groups of feeder components (301) arranged in parallel and facing opposite directions.

4. The surface mount device for electronic component processing according to claim 2, characterized in that: The feeder feeding assembly (301) has a feeding window (302) at its feeding end. The feeder feeding assembly (301) is internally connected to a feeding conveyor belt (303), which transmits electronic components to the bottom of the feeding window (302).

5. The surface mount device for electronic component processing according to claim 4, characterized in that: The feeder feeding assembly (301) has an electric slide rail (304) fixedly connected to the outside of the feeding end, and a telescopic cover (305) is slidably connected to the top of the feeding window (302). The movable end of the electric slide rail (304) is fixedly connected to the telescopic cover (305).

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