Air guiding cover for heat sink and UV-c device

Abstract

An air sterilization device (100) disposed within an HVAC duct (200) has an air guide hood (110) disposed on a surface of the HVAC duct (200), the air guide hood (110) having an inlet end (110a) and an outlet end (110b), the air guide hood (110) having a stent (111a, 112a) extending distally from the air guide hood (110); a UV light module (140), the UV light module (140) being fixed to the bracket (111a, 112a), the UV light module (140) having a temperature sensor; a heat sink (130) fixed to the UV light module (140) and close to the outlet end (110b); and a control board (142) in communication with the UV light module (140), the control board (142) having a microprocessor (302) in communication with the ambient temperature sensor (315) and a heat source temperature sensor (314) disposed proximate to the external heat source, the microprocessor (302) in communication with the temperature sensor of the UV light module (140).

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Patent Application No. 18 / 328,315, filed June 2, 2023, pursuant to Sections 4 and 8 of the Stockholm Act of the Paris Convention for the Protection of Industrial Property, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention generally relates to an apparatus arranged to fix a UV-C (ultraviolet) light module inside an HVAC (heating, ventilation and air conditioning) duct, wherein the apparatus is arranged to guide airflow within the duct through a heat sink device arranged on the UV light module. Background Technology

[0004] Indoor air filtration is well known in the field. In expensive filtration equipment, mechanical filtration, such as the use of filters, is typically employed. It is also known that UV wavelength light provides radiative filtration of air.

[0005] Unlike other air filtration systems that rely on HEPA (High-Efficiency Particulate Air) filters or similar devices to capture dust and other particles, UV air filtration uses state-of-the-art ultraviolet light technology to prevent viruses and other microorganisms from multiplying and infecting homes, offices, or other indoor spaces. Ultraviolet light disrupts the genetic material that controls the reproduction of these organisms, preventing them from multiplying. UV light can block these pathogenic microorganisms and prevent the spread of various diseases and other problems.

[0006] UV purification is most effective when microorganisms are exposed to UV light for extended periods. The longer viruses or other organisms are exposed to UV light, the greater the damage to their DNA and self-replication ability. There are three types of UV light: UV-A, UV-B, and UV-C—distinguished by their wavelengths. UV-A light has the longest wavelength, ranging from 315 to 400 nm. UV-C light has the shortest wavelength, ranging from 100 to 280 nm. Because UV-C light has the shortest wavelength, it also has the most energy of all UV light types. This means that UV-C light is most capable of destroying the genetic material within viruses and other microorganisms. It has been found that UV-C light at a specific wavelength of approximately 254 nm is effective in killing coronaviruses, such as SARS-CoV and MERS-CoV, as well as other viruses, such as H1N1 influenza—approximately 267 nm is the preferred wavelength for obtaining optimal results. UV light used for disinfection generates UV-C light with wavelengths in the range of approximately 250-280 nm. UV light in the range of approximately 250-280 nm is generally considered to be the UV-C range for sterilization.

[0007] In previous attempts to utilize UV treatment, a device was used to treat the air within the duct with a negative oxygen booster. The device included a baffle plate arranged to direct the incoming air flow in a direction proximate to the negative oxygen booster. A temperature sensor within the device was arranged to measure the temperature of the incoming air, and when the measured temperature was below a predetermined temperature, the negative oxygen booster was programmed to shut off. The negative oxygen booster also included a UV light device that illuminated water released from a water tank and into the incoming air through the air duct to treat the air before it exited the device.

[0008] In another attempt to use UV treatment, an air filtration / purification device generally includes a housing, where the housing is defined by an inlet end and an outlet end. A fan arranged to move air through the device is positioned proximate to the inlet end. A VOC (volatile organic compound) filtration device, a final particulate filtration device, and a humidifier are provided proximate to the outlet end. Within the device, at least one UV lamp is provided that aids in filtering the passing air.

[0009] UV wavelengths, particularly UV-C wavelengths emitted by LEDs, generate a significant amount of heat from their respective light source(s). Prolonged exposure to heat can degrade the performance of the light source (e.g., LED light source), such that the excess heat changes the wavelength of the light emitted therefrom and shortens the life of the light emitting device.

[0010] Accordingly, there has long been a need for a device that utilizes UV-C to treat air flowing through an HVAC device, where the device is further arranged to direct the air flow onto a heat sink device arranged over the UV-C light module, which is further arranged to measure the incoming air flow and selectively turn the UV-C light module on and off based on the measured variable to manage the heat of the UV-C device.

[0011] Further, there has long been a need for a UV-C light module that includes multiple individual heat sinks for managing the heat dissipation of individual UV-LED lamps.

[0012] Further, there has long been a need for a UV light air treatment device that can be installed into an existing HVAC structure with minimal components and minimal disruption to the existing structure. SUMMARY

[0013] The present invention is generally arranged to be installed into commercial and residential air duct systems to purify the air flowing through the air duct system. The present invention is intended to provide cleaner air via UV radiation with reduced required maintenance, thereby becoming a replacement, economic replacement, or supplement to typical air filtration systems or other air flow systems within established HVAC structures.

[0014] This invention broadly includes an air sterilization device arranged within an HVAC duct, comprising an air scoop disposed on the surface of the HVAC duct, the air scoop having an inlet end and an outlet end, and a support extending distally from the air scoop; a UV light module fixed to the support, the UV light module having a temperature sensor; a heat sink fixed to the UV light module and near the outlet end; and a control board communicating with the UV light module, the control board having a microprocessor communicating with an ambient temperature sensor and a heat source temperature sensor disposed on an external heat source, the microprocessor communicating with the temperature sensor of the UV light module.

[0015] The present invention also broadly includes a PCB board with a UV light module fixed thereon, the UV light module comprising a plurality of LED light modules, each of which is arranged to emit UV-C.

[0016] The heat sink of the present invention also includes a plurality of heat sinks arranged to extend beyond the UV light module. The plurality of heat sinks have upper and lower portions, wherein the upper and lower portions of the plurality of heat sinks are fixed to a bracket and are also arranged perpendicular to a pair of mounting surfaces of the bracket. The upper portions of the plurality of heat sinks are disposed within an air guide shroud, and the lower portions of the plurality of heat sinks extend beyond the outlet end of the air guide shroud.

[0017] The UV light module of the present invention also includes a plurality of individual heat sinks fixed to a PCB board, each of the plurality of individual heat sinks being arranged adjacent to each of the plurality of LED light modules, wherein each of the plurality of individual heat sinks includes a plurality of fins.

[0018] As described above, the main objective of this invention is to provide an air hygiene device that utilizes UV radiation.

[0019] Another object of the present invention is to provide an air hygiene device that includes minimal installation components within an existing HVAC system.

[0020] Another objective of this invention is to utilize a temperature comparison protocol to initiate the power-on or power-off function of the UV light module, wherein the protocol improves the lifespan of individual LEDs in the UV light module and provides efficient power consumption for the device, particularly the UV light module, in response to airflow in HVAC ducts or air channels.

[0021] Another object of the present invention is to provide a heat dissipation device that directs air flowing through an HVAC system into a radiator assembly.

[0022] Another object of the present invention is to provide a separate heat dissipation device disposed adjacent to the individual LED of the UV light module.

[0023] Another object of the present invention is to provide an air hygiene device with a fault detection protocol that is transmitted to an onboard microcontroller, i.e., a control module, which may be stored in the module or alternatively transmitted to an external device.

[0024] These and other objects, features, and advantages of the invention will become apparent from the accompanying drawings and claims, after reading the following detailed description of the invention. Attached Figure Description

[0025] Referring to the accompanying schematic diagrams, various embodiments are disclosed by way of example only, wherein corresponding reference numerals indicate corresponding parts, wherein:

[0026] FIG. 1A This is a 3D diagram of HVAC piping;

[0027] FIG. 1B This is a front view of the present invention;

[0028] FIG. 2A yes FIG. 1A A top view of the HVAC ductwork shown.

[0029] FIG. 2B It is roughly along FIG. 2A The cross-sectional view of the HVAC pipe taken by line 2B-2B shows the device of the present invention installed therein;

[0030] FIG. 3A This is a top perspective view of the UV-C air guiding hood device 100 of the present invention;

[0031] FIG. 3B This is a bottom perspective view of the UV-C air guiding hood device 100 of the present invention;

[0032] FIG. 4A This is a front view of the UV-C air guiding hood device 100 of the present invention;

[0033] FIG. 4B It is roughly along FIG. 4A A cross-sectional view of the UV-C air guide hood device 100 taken from line 4B-4B in the figure;

[0034] FIG. 5 This is an exploded view of the UV-C air guide hood device 100;

[0035] FIG. 6 It is taken from FIG. 5 A partial exploded view of the PCB board 142 is shown, and an enlarged view of the LED heat sink 161 is also shown.

[0036] FIG. 7A This is a 3D view of control module 150;

[0037] FIG. 7B yes FIG. 7A Side view;

[0038] FIG. 7C It is a 3D view of the control module 150 without the cover 152;

[0039] FIG. 8 This is a schematic diagram of the advanced circuit of the present invention;

[0040] FIG. 9 It is roughly along FIG. 2A The cross-sectional view of the HVAC duct taken by line 2B-2B in the figure shows the airflow path through HVAC duct 200.

[0041] FIG. 10 This is a high-level flowchart of the operation of this invention; and,

[0042] FIG. 11 It is roughly along FIG. 4A The cross-sectional view taken from line 4B-4B in the diagram. Detailed Implementation

[0043] First, it should be understood that the same reference numerals on different figures denote the same or similar structural elements. It should also be understood that the claims are not limited to the disclosed aspects.

[0044] Furthermore, it should be understood that this disclosure is not limited to the specific methods, materials, and modifications described, and therefore, variations are certainly possible. It should also be understood that the terminology used herein is for describing specific aspects only and is not intended to limit the scope of the claims. Therefore, those skilled in the art will understand that any suitable materials now known or hereafter developed may be used to form the invention and / or components thereof, as described herein.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should be understood that any methods, devices, or materials similar to or equivalent to those described, used, or employed herein may be used in the practice or testing of the exemplary embodiments.

[0046] It should be understood that the term "substantially" is synonymous with terms such as "almost," "very close," "approximately," "around," "approximately," "close to," "generally," "nearby," and "around," and these terms may be used interchangeably in the specification and claims. It should also be understood that the term "close to" is synonymous with terms such as "nearby," "near," "adjacent," "adjacent," "right next to," and "adjacent to," and these terms may be used interchangeably in the specification and claims.

[0047] It should be understood that, unless otherwise stated, the use of “or” in this application refers to a “non-exclusive” arrangement. For example, when saying “item x is A or B”, it can be understood that this may mean one of the following: (1) item x is only one or the other of A and B; (2) item x is both A and B. In other words, the word “or” is not used to define an “exclusive or” arrangement. For example, an “exclusive or” arrangement stating “item x is A or B” would require that x can only be one of A and B. Furthermore, as used herein, “and / or” is intended to be a grammatical conjunction used to indicate that one or more elements or conditions described may be included or present. For example, an apparatus including a first element, a second element, and / or a third element is intended to be interpreted as any of the following structural arrangements: an apparatus including a first element; an apparatus including a second element; an apparatus including a third element; an apparatus including a first element and a second element; an apparatus including a first element and a third element; an apparatus including a first element, a second element, and a third element; or an apparatus including a second element and a third element.

[0048] Furthermore, as used herein, the phrases “comprises at least one of” and “includes at least one of” combined with a system or element are intended to indicate that the system or element includes one or more of the elements listed following the phrase. For example, an apparatus comprising at least one of: a first element; a second element; and a third element is intended to be interpreted as any of the following structural arrangements: an apparatus comprising a first element; an apparatus comprising a second element; an apparatus comprising a third element; an apparatus comprising a first element and a second element; an apparatus comprising a first element and a third element; an apparatus comprising a first element, a second element, and a third element; or an apparatus comprising a second element and a third element. When “for at least one of:” or “one of:” is used herein, it is intended to mean a similar interpretation.

[0049] It should be understood that the illustrated embodiments are merely one of many possible embodiments of the claimed invention. It should also be understood that directional adjectives, such as “up,” “down,” “right,” “left,” and similar variations, will be interpreted in accordance with the corresponding drawings and are intended to be exemplary.

[0050] It should be noted that the terms “having,” “with,” “containing,” “comprising,” “containing,” “containing,” and “including” are intended to be interpreted as substantially synonymous with the terms “including” and / or “including.”

[0051] It should be understood that various aspects of the above disclosure, as well as other features and functions or alternatives thereof, may be combined into many other different systems or applications as needed. Those skilled in the art may then make various substitutions, modifications, variations, or improvements thereto that are not currently foreseen or anticipated, and these substitutions, modifications, variations, or improvements are also intended to be covered by the following claims.

[0052] Now refer to the attached diagram. The following description should be combined with... FIG. 1A and FIG. 2B To understand. FIG. 1A A perspective view of HVAC duct 200 is shown. FIG. 1B It shows FIG. 1A The diagram shows a front view of a heat pipe with a UV-C air guide shroud 100 attached therein. FIG. 2A A top view of an HVAC duct 200 to which a UV-C air guide hood device 100 is attached is shown, and FIG. 2B It is roughly along FIG. 2A The cross-sectional view of the pipe taken by line 2B-2B in the diagram.

[0053] although FIG. 1A-2B An HVAC duct 200 with a generally rectangular construction is shown, but it should be understood that the HVAC duct 200 may include a circular tubular construction, wherein the UV-C air guide hood device 100 may be adapted to include curvature to accommodate the curved construction of the HVAC duct. It should be noted that the illustration of the HVAC duct 200 is part of a larger HVAC ducting system, and ducts of other shapes are considered to be within the scope of the appended claims.

[0054] HVAC duct 200 typically consists of a top member 210, a first side member 211, a second side member 212, and a bottom member 213. HVAC duct 200 has an inlet end 214 and an outlet end 215. The inlet end 214 is defined as the end where air flows into the HVAC duct 200, and the outlet end 215 is defined as the end where air flows out of the HVAC duct 200. In other words, the inlet end 214 represents the inflow portion of the HVAC duct 200, i.e., the section of the HVAC duct system that is attached to or begins at an air source (e.g., heating, ventilation, and / or air conditioning), while the outlet end 215 represents the outflow portion of the HVAC duct 200, i.e., the section of the HVAC duct system that terminates at an outlet or vent.

[0055] In a preferred embodiment, the UV-C air guide hood device 100 is arranged to be detachably secured to the inner surface 210a of the top member 210 of the HVAC duct 200. In a preferred embodiment, the UV-C air guide hood device 100 is secured to the inner surface 210a via a plurality of screws. However, it should be understood that other detachable securing devices known in the art can be used to secure the device to the duct wall / top plate. The control module 150 of the UV-C air guide hood device 100 (e.g., FIG. 1B(As shown) is also arranged on the HVAC duct 200. The control module 150 may be detachably fixed to the inner surface 212a of the second side member 212, or detachably fixed to the outer surface 212b of the second side member 212, or may be disposed in the second side member 212 via a cut-through hole arranged therein to accommodate the control module 150.

[0056] like FIG. 2B As shown, the UV-C air guide hood device 100 is configured to branch the incoming air from the inlet end 214 between the inner surface 210a and the inner surface 213a, such that it is configured to separate the incoming airflow into an upper airflow UF and a lower airflow LF on the plane defined by B. Furthermore, a portion of the upper airflow UF is arranged to enter the UV-C air guide hood device 100 to be guided to the heat sink of the UV-C air guide hood device 100, which will be discussed further below.

[0057] The following description should be combined with FIG. 3A and FIG. 3B To understand. FIG. 3A This is a top perspective view of the UV-C air guide hood device 100, shown being removed from the HVAC duct 200, and FIG. 3B This is a bottom perspective view. The UV-C air guide hood device 100 typically includes an air guide hood 110, a heat sink 130, and a UV light module 140. The air guide hood 110 includes a first side plate 111 and a second side plate 112. The air guiding portion 113 of the air guide hood 110 is defined by three sections: a mounting portion 113a; a contour portion 113b; and an outlet portion 113c. The air guide hood 110 has two ends that specify the preferred orientation of the UV-C air guide hood device 100 when positioned in an HVAC duct 200, namely, an inlet end 110a and an outlet end 110b. The inlet end 110a is the end of the UV-C air guide hood device 100 arranged to receive or receive incoming air, while the outlet end 110b is the end of the UV-C air guide hood device 100 from which incoming air exits.

[0058] The air guide shroud 110 may be made of heat-resistant plastic, polymer, or molded plastic. Alternatively, the air guide shroud 110 may be made of various lightweight metals. In a preferred embodiment, the heat sink 130 may be made of aluminum. Alternatively, the heat sink 130 may be made of a copper-nickel combination, stainless steel (e.g., 316, 304, or other suitable types of stainless steel), copper, HeresiteP413-coated aluminum, electroplated aluminum, or other suitable steel alloys.

[0059] The following description should be combined with FIG. 4A and FIG. 4BTo understand. FIG. 4A This is a front view of the UV-C air guide hood device 100 removed from the HVAC duct 200, and FIG. 4B It is roughly along FIG. 4A The cross-sectional view is taken from line 4B-4B. The radiator 130 is arranged on the radiator mounting surface 121 of the mounting bracket 120, wherein the mounting bracket 120 is fixed to the air guide shroud 110 (e.g., FIG. 5 (As shown). The radiator 130 includes a plurality of fins 131, wherein the plurality of fins 131 include an upper portion 133 and a lower portion 134. The upper portion 133 of the plurality of fins 131 is arranged to be disposed within the air guide shroud 110, and the lower portion 134 of the plurality of fins 131 is arranged to extend outward from the outlet end 110b, i.e., the lower portion 134 is outside the air guide shroud 110. The plurality of fins 131 are preferably radiator fins, which are surfaces extending from the radiator 130 to increase the heat transfer rate from the UV-C air guide shroud device 100 by increasing convection. It should be understood that in alternative embodiments where increased heat transfer is required, the plurality of fins 131 may also include heat pipes, i.e., fully sealed passive two-phase heat transfer devices, which utilize the high heat of vaporization of the fluid contained within the heat pipe to achieve more efficient heat transfer. FIG. 4B As shown, a space may exist between the inner surface 113e and the multiple fins 131.

[0060] The air guide shroud 110 includes an air guide portion 113. The air guide portion 113 is arranged to guide incoming air into the air guide shroud 110 at an inlet end 110a, across multiple fins 131 of the radiator 130, and out through an outlet end 110b. The air guide portion 113 includes three parts: a mounting portion 113a; a profile portion 113b; and an outlet portion 113c. The mounting portion 113a is defined as an area of ​​the air guide shroud 110, which is detachably secured to the inner surface 210a of the top member 210 of the HVAC duct 200, such as... FIG. 1B and FIG. 2B As shown. Mounting portion 113a is incorporated into contour portion 113b, which bends mounting surface 113d and inner surface 113e into a generally downward configuration toward heat sink 130 and UV light module 140. Contour portion 113b is incorporated into outlet portion 113c, which terminates at outlet end 110b. Heat sink 130 and UV light module 140 are preferably arranged close to outlet portion 113c.

[0061] like FIG. 11 As shown, the figure generally illustrates... FIG. 4B The alternative arrangement of the present invention shown specifically indicates that there is no space between the inner surface 113e and the plurality of fins 131.FIG. 4B The SPACE shown is an alternative arrangement often referred to as a "closed" arrangement. A closed arrangement results in increased air pressure near the front of the heatsink (i.e., the surface with the LEDs), leading to greater airflow through the heatsink or its multiple fins, thus improving the heatsink's temperature mitigation performance. Specifically, a closed arrangement prevents incoming air from bypassing multiple fins (such as the space between the fins and the inner surface of the air guide shroud) via the space between the fins and the inner surface of the air guide shroud. FIG. 4B As shown), this causes an increase in the pressure difference between the front of the heat sink (i.e., the surface near the LED) and the back of the heat sink, which increases the net airflow through the heat sink, resulting in a significant temperature drop at the LED junction (i.e., the UV light module 140).

[0062] FIG. 5 This is an exploded view of the UV-C air guide shroud assembly 100. The air guide shroud 110 includes a mounting bracket 111a for a first side plate 111 and a mounting bracket 112 for a second side plate 112, both extending from the respective side plates. The mounting brackets 111 and 112 are arranged to preferably engage the first mounting end 123 and the second mounting end 124 of the mounting plate 120 via screws; however, other acceptable mounting methods are also contemplated. A heat sink 130 is arranged on the heat sink mounting surface 121 of the mounting bracket 120 (e.g., ...). FIG. 4B As shown in the figure. The UV light module 140 is preferably fixed to the UV light module mounting surface 122, particularly the PCB board 142, by screws; however, other acceptable mounting methods are also possible. Arranged on the PCB board 142 are multiple LED heat sinks 160 and multiple UV LEDs 140, each having individual LEDs 141a, 141b, 141c, etc.

[0063] In a preferred embodiment, the plurality of LED heat sinks 160 are made of copper. Alternatively, the plurality of LED heat sinks 160 may be made of a copper-nickel combination, stainless steel (e.g., 316, 304 or other suitable stainless steel types), Heresite P413-coated aluminum, electroplated aluminum, aluminum or other suitable steel alloys.

[0064] Multiple UV LEDs 140 may comprise any suitable LED with a rated wavelength of approximately 270 nm to 280 nm. Possible LEDs may include single LEDs, on-board chip LEDs, or LED strips to form a complete LED light source. Examples of suitable LEDs are provided by International Lighting Technologies, part numbers: E275-3, E275-3-S, ILT-PWRTYLED.3W, E275-10, E275-10-S, E275-60-Strip, or ILT-PWR-12600P5. It should be understood that, in view of the appended claims, the above examples of LEDs are not intended to be limiting.

[0065] FIG. 6 It shows the source FIG. 5 A partial view of PCB board 142. FIG. 6 An enlarged view of the LED heat sink 161 is also shown. Multiple UV LEDs 140 and multiple LED heat sinks 160 are arranged on a mounting surface 142a of a PCB board 142. The mounting surface 142 includes multiple input terminals, input terminals 142b for the LED lights and input terminals 142c for the heat sinks. It should be understood that input terminals 142b and 142c communicate electronically and actively with the PCB board 142, wherein the PCB board 142 communicates electronically and actively with the control module 150 (e.g.,...). FIG. 7A-7C (As shown). Inputs 142b and 142c are arranged to receive LEDs and LED heat sinks. It should also be understood that input 142c can be arranged as a mounting location for multiple LED heat sinks 160 and can be in electronic and active communication with the PCB board 142 without such communication.

[0066] Individual LED heat sinks 161 in a plurality of LED heat sinks 160 are arranged such that they are connected to heat sinks 130 (e.g., LEDs 161 ... FIG. 5 (As shown) Together, they provide additional heat dissipation for the heat generated by the multiple UV LEDs 140 and from the incoming air traveling toward and through the HVAC duct 200. The individual LED heat sink 161 typically includes a base 163 and multiple fins 162. The multiple fins 162 are arranged to extend from the base 163. The multiple fins 162 are preferably heat sinks, which are surfaces extending from the individual LED heat sink 161 to increase the heat transfer rate by increasing convection. The mounting surface 164 of the base 163 is arranged to engage one of the input ends of the heat sink 142c on the PCB board 142, and the outer surface 165 of the base 163 is arranged opposite the mounting surface 164.

[0067] The following description should be combined with FIG. 7A to FIG. 7C To understand. FIG. 7A A perspective view of the control module 150 is shown. FIG. 7BA side view of the control module 150 is shown, and FIG. 7C A perspective view of the control module 150 without the cover 152 is shown. The control module 150 is arranged such that it receives power from an external power source and transmits the power to the UV light module 140. The UV-C air guide hood device 100 is arranged to be connected to a power source, preferably to an AC voltage source (VAC), and is also arranged to provide internal conversion to a DC voltage source (VAC-VDC) in addition to VAC bypass, so as to allow VAC current to power the components of the present invention in addition to VDC current. The control module 150 includes an inner cavity 153 within a body 151 sealed by the cover 152. Set within the inner cavity 153 is a control board 155, which is arranged to perform and control the UV-C air guide hood device 100 and external components, as described below. The control module 150 receives power from a power source 300 at a 2-pin connector 329, which will be converted by the power source 300 to VDC VAC. FIG. 7C The image also shows sensor board 301. FIG. 8 The sensor board 301 is shown in more detail below and discussed further.

[0068] FIG. 8 This is an advanced circuit diagram of the components of the UV-C air guide shroud device 100. Specifically, FIG. 8 The diagram illustrates a control module 150, a control board 155, a UV light module 140, a sensor board 301, and a power supply 300. The power supply 300 is preferably arranged to accept VAC and convert VAC current to VDC current. In a preferred embodiment, the power supply 300 accepts a minimum of approximately 120VAC at 60Hz, with a variation of approximately 10%. In an alternative embodiment, the power supply 300 will be able to have a universal input range to cover installations of the UV-C air guide hood device 100 in all areas, such as 90VAC to 277VAC at 60Hz and 50Hz. The power supply 300 preferably provides an output voltage of 24VDC + / - 5% under all load conditions. Depending on the wattage of the multiple UV LEDs 141, the output rated power of the power supply 300 can vary between 100W and 300W for multiple UV LEDs 141 with wattages ranging from approximately 75W to 225W. The control board 155 also includes a buck regulator 328, which is arranged to step down 24VDC to approximately 5VDC to provide 5VDC power to selected components within the control board 155 and / or the UV light module 140.

[0069] In a preferred embodiment, the microcontroller 302 includes three (3) PWM (Pulse Width Modulation) generators 307, 308, and 309. The PWMs 307, 308, and 309 are connected to a low-pass filter 305, an alarm 313, and a low-pass filter 303, respectively.

[0070] In a preferred embodiment, microcontroller 302 may be an AVR® AVR32DA48, which includes an AVR® processor with a hardware multiplier, operating at up to 24 MHz, with 32 KB of Flash memory, 4 KB of SRAM, and 512 bytes of EEPROM, in a 48-pin package with TQFP and VQFN package options. It should also be understood that microcontroller 302 may include any alternative microcontroller capable of providing the functionality described herein.

[0071] In a preferred embodiment, the microcontroller 302 will include a dedicated communication interface via I2C 311 (I2C 311 to 14-pin connector 320 to 14-pin connector 321 to I2C 318 of PCB MCU 317) to the UV light module 140. It should also be understood that UART (Universal Asynchronous Receiver / Transmitter) 327 may be arranged to allow external communication from the microcontroller 302, for example, to an external computing device (such as a mobile phone). The PCB MCU 317 is primarily arranged to log faults associated with the multiple UVLEDs 141, which will be further discussed below, and which are communicated to the microcontroller 302. Depending on the specific fault encountered, an alarm 313 or an indicator 312, or both, will be activated. The indicator 312 is arranged to provide a visual alarm, such as an indicator light, and is connected to the PWM x3 310 of the microcontroller 302. In a preferred embodiment, the indicator 312 is arranged to display multiple colors associated with multiple different faults. Alarm 313 is configured to provide an audio alarm and is connected to PWM 308.

[0072] In a preferred embodiment, the PCB MCU 317 may be an AVR® ATtiny404 microcontroller, which includes an 8-bit AVR® processor with a hardware multiplier, operating at up to 20 MHz, and features 4 KB of Flash memory, 256B of SRAM, and 128 BEEPROM in a 14-pin package. It should also be understood that the PCB MCU 317 may include any alternative microcontroller capable of providing the functionality described herein.

[0073] An adjustable boost converter 304 is connected to a low-pass filter 303 and a PWM 309 of a microcontroller 302. The adjustable boost converter 304 is arranged to supply any voltage necessary to initiate drive current through the plurality of UV LEDs 141 until a maximum voltage is reached. The adjustable boost converter 304 is preferably arranged to have an approximate maximum output voltage of 60V ± 5%; however, it should be understood that this approximate maximum output voltage is merely exemplary, and possible alternatives in practice will be understood by those skilled in the art. The microcontroller 302 is arranged to control the output of the adjustable boost converter 304 to preferably maintain a minimum value of approximately 250mV as the minimum return voltage for the plurality of UV LEDs 141, thereby ensuring maximum efficiency and minimum heat generation from the linear current control 306; however, it should be understood that this approximate minimum return voltage is merely exemplary, and possible alternatives in practice will be understood by those skilled in the art.

[0074] A linear current controller 306 is connected to a low-pass filter 305 and a PWM 307 of a microcontroller 302. The linear current controller 306 is arranged to regulate the current in each of the multiple UV LEDs 141 to maintain high current accuracy in each individual LED and protect the individual LED. The PWM 307 of the microcontroller 302 is arranged to provide a single filtered PWM output to each linear current control circuit of the linear current controller 306, thereby driving each individual current control circuit with the same reference. The linear current controller 306 is arranged to keep the approximate LED current within 10mA of the reference input, where the reference input is programmably adjustable via the microcontroller 302.

[0075] A control board 155 within the control module 150 is arranged to control the current flowing through the UV light module 140 and is also arranged to provide an on / off protocol for the plurality of UV LEDs 141 of the UV light module 40 based on whether airflow of approximately 200 fpm or greater flows through the HVAC duct. The on / off protocol is primarily implemented via the microcontroller 302, which is determined by calculating approximate airflow based on transmitted temperature readings from NTC thermistors and resistors 314 (heat source temperature sensor and external heat source) and NTC thermistor 315 (ambient temperature sensor). In a preferred embodiment, the on / off protocol of the microcontroller 302 is arranged to turn on the plurality of UV LEDs 141 of the UV light module 140 when an airflow of approximately 200 fpm or greater is detected, and is arranged to turn off the plurality of UV LEDs 141 of the UV light module 40 when an airflow of approximately 175 fpm or less is detected.

[0076] Negative temperature coefficient (NTC) thermistors and resistors 314 and 315 are arranged on sensor board 301. Sensor board 301 is connected to control board 155 via 4-pin connectors 323 and 322, specifically, the 4-pin connectors are connected to the ADC x2 326 of microcontroller 302. 4-pin connectors 323 and 322 also connect NTC thermistors and resistors 314 and 315 to control board 155. NTC thermistor and resistor 314 are arranged such that the resistor will be used as a heat source, whereby the NTC thermistor will measure the heat emitted from it. NTC thermistor 315 is arranged to measure ambient temperature, and the measurement result is thereby transmitted to microcontroller 302 for comparison. By comparing the ambient temperature reading of the NTC thermistor 315 with the temperature readings of the NTC thermistor and resistor 314, the microcontroller 302 can determine whether airflow is present and thus initiate an on / off protocol. For example, when the temperature readings of 314 and 315 are close, airflow is present, while when the temperature readings of 314 and 315 are further apart, airflow is not present.

[0077] The UV light module 140 includes a PCB board 142 on which multiple UV LEDs 141 are arranged and connected. A control board 155 is connected to the PCB board 142 via 18-pin connectors 320 and 321. This arrangement allows the PCB board 142 to be easily replaced in case of damage. The 18-pin connector 320 is arranged to connect to the adjustable boost converter 304, the input ADC x12 324 (analog-to-digital converter) of the microcontroller 302, and the I2C 311 (internal integrated circuit) of the microcontroller 302, thereby connecting the above components to the UV light module 140. The PCB board 142 includes a PCB MCU 317, which includes an ADC 319 and an I2C 318. Specifically, I2C 318 is connected to 18-pin connector 321, 18-pin connector 321 is connected to 18-pin connector 320, and 18-pin connector 320 is connected to microcontroller 302 at I2C 311—connecting microcontroller 302 to PCB MCU 317 for communication relay. PCB 142 also includes NTC thermistor 316, which is arranged to provide microcontroller 302 with temperature readings of PCB 142 and / or multiple LEDs 141 for safety shutdown purposes.

[0078] The microcontroller 302's ADC x3 325 (an analog-to-digital converter with three inputs) has three inputs arranged to monitor values ​​from a fault logging protocol of the microcontroller 302. The three inputs from the ADC x3 325 are +24V SENSE, VLED+ SENSE, and IOUT. The first input, +24V SENSE, is arranged to monitor power supply 300, specifically the main power supply from power supply 300 to control board 155. In a preferred embodiment, a target power range is programmed into the microcontroller 302, and if the +24V SENSE input of the ADC x3 325 detects incoming power outside the target range, the microcontroller 302 records the detection and determines whether to turn off multiple LEDs 141 based on the detected range. The second input, VLED+ SENSE, is arranged to monitor the output provided by the adjustable boost converter 304. The boost converter 304 is arranged to have a preselected output, such that if VLED+SENSE detects an output different from the preselected output, the microcontroller 302 can be programmed to turn off multiple LEDs 141 and / or trigger an alarm via indicator 312 and / or alarm 313. A third input IOUT is arranged to monitor the total current through the multiple LEDs 141. In a preferred embodiment, a target current range is programmed into the microcontroller 302, and if the IOUT input of the ADC x3 325 detects a current through the multiple LEDs 141 that is not within the target range, the microcontroller 302 will record the detection, determine which of the VRTN1-12 signals is out of range, and turn off that individual LED string.

[0079] FIG. 9 This invention is roughly along the FIG. 2AThe cross-sectional view taken by line 2B-2B in the figure specifically shows the airflow path through the HVAC duct 200 in which the UV-C air guide hood device 100 is installed. The incoming airflow IA originates from the inlet end 214 of the HVAC duct 200. The incoming airflow IA is treated by ultraviolet light UV emitted from the UV-C air guide hood device 100. The ultraviolet light UV emitted from the UV-C air guide hood device 100 treats the incoming airflow IA before it reaches the UV-C air guide hood device 100. Once the incoming airflow IA reaches the inlet end 110a of the UV-C air guide hood device 100, it is branched (B) into an upper airflow UF and a lower airflow LF. As described above, the UV-C air guide hood device 100 includes a mounting portion 113a, a contour portion 113b, and an outlet portion 113c of the air guide portion 113. The upper airflow UF of the inlet airflow IA, which has been treated with ultraviolet light (UV), serves two purposes. A portion of the inlet airflow IA passes through the mounting portion 113a, the contour portion 113b, and the outlet portion 113c of the air guide portion 113, guiding the treated inlet airflow IA across the radiator 130 to aid in the heat dissipation of the UV-C air guide hood device 100. The other portion of the inlet airflow IA passes directly through the lower fins of the radiator 130—also contributing to the heat dissipation of the UV-C air guide hood device 100. Both the upper treated airflow UTA and the lower treated airflow LTA continue to flow through the duct 200 towards the outlet end 215.

[0080] FIG. 10 This is a high-level flowchart of the on / off protocol of the UV-C air guide hood device 100. An external VAC power supply 300a sends VAC current to the power supply 300. The power supply 300 converts / rectifies the VAC current into VDC current, which powers the UV-C air guide hood device 100 and all control modules 150 (shown as powering the control board 155). FIG. 10A UV light module 140 and a PCB MCU 317 receiving VDC from a control board 155 are shown. Heater drive is sent from the control board 155 to an NTC thermistor and resistor 314, specifically to resistor 314a. Resistor 314a generates heat H1, which is detected by an NTC thermistor 314b and transmitted from the NTC thermistor and resistor 314 to the control board 155. An NTC thermistor 315 detects the heat / airflow temperature H2 of the incoming air from the HVAC system. The NTC thermistor 315 transmits the temperature reading of H2 to the control board 155. The control board 155 measures the difference between the NTC thermistor 315 and the NTC thermistor and resistor 314 to determine the presence of airflow in the HVAC duct; a smaller difference equals airflow, while a larger difference equals no airflow. The PCBMCU 317 also cross-communicates with the control board 155 for any fault conditions from the UV light module 140 or the control module 150, which are stored in the memory of the microcontroller of the control module 150.

[0081] Fault monitoring

[0082] The following description should be combined with FIG. 8 This involves understanding and monitoring faults recorded by the microcontroller 302 or the PCB MCU 317, or both.

[0083] If a single LED among the multiple LEDs 141 is open-circuited, a UV-C LED open-circuit fault occurs. If this fault is detected, a signal will be sent to the microcontroller 302, and the fault will be recorded in the memory of the microcontroller 302, and the fault will also be indicated via alarm gas 313 and indicator 312.

[0084] A UV-C LED short-circuit fault occurs if a single LED among the multiple LEDs 141 is short-circuited. If the fault is detected, a signal is sent to the microcontroller 302, and the fault is recorded in the memory of the microcontroller 302 and indicated by the alarm 313 and the indicator 312.

[0085] An LED current fault occurs if the current of a single LED among the multiple LEDs 141 deviates from the drive value by more than 10% for a duration exceeding approximately 100 ms. If the fault is detected, a signal is sent to the microcontroller 302, and the fault is recorded in the memory of the microcontroller 302 and indicated by the alarm 313 and the indicator 312.

[0086] If the output of boost converter 304 exceeds approximately 24V +5%, a boost converter failure will occur. If the failure is detected, a signal will be sent to microcontroller 302, and the failure will be recorded in the memory of microcontroller 302, and the failure will also be indicated via alarm 313 and indicator 312.

[0087] A high-voltage input fault will occur if the input voltage of the control board 155 is greater than approximately 24V +5%. If the fault is detected, a signal will be sent to the microcontroller 302, and the fault will be recorded in the memory of the microcontroller 302, and the fault will also be indicated via the alarm 313 and the indicator 312.

[0088] A low-voltage input fault occurs if the input voltage of the control board 155 is below approximately 24V -5%. If this fault is detected, a signal will be sent to the microcontroller 302, and the fault will be recorded in the memory of the microcontroller 302, and the fault will also be indicated via the alarm 313 and the indicator 312.

[0089] An airflow detection fault occurs if the NTC thermistor 315 (ambient air thermometer) detects a temperature above approximately 85°C or below approximately -20°C. If this fault is detected, a signal is sent to the microcontroller 302, and the fault is recorded in the microcontroller 302's memory and indicated via alarm 313 and indicator 312. An airflow detection fault also refers to a situation where the temperature of the thermistor of the NTC thermistor and resistor 314 is approximately 10°C lower than the temperature detected by thermistor 315; in this case, the microcontroller 302 will communicate the fault, which will be recorded in the microcontroller 302's memory and indicated via alarm 313 and indicator 312.

[0090] If communication between the microcontroller 302 and the PCB MCU is lost, an external MCU communication failure will occur. If this failure is detected, the microcontroller 302 and / or the PCB MCU 317 will record the failure in their respective memories and also indicate the failure via alarm 313 and indicator 312.

[0091] If the NTC thermistor 316 detects a temperature higher than approximately 60°C, an LED bar over-temperature fault will occur. In this case, the microcontroller 302 will turn off multiple LEDs 141, and the microcontroller 302 and / or the PCB MCU 317 will record the fault in their respective memories, while also indicating the fault via the alarm 313 and the indicator 312.

[0092] Therefore, it can be seen that the objectives of the present invention have been effectively achieved, although modifications and changes to the present invention should be obvious to those skilled in the art, and these modifications are intended to remain within the spirit and scope of the claimed invention. It should also be understood that the foregoing description is illustrative of the invention and should not be considered limiting. Therefore, other embodiments of the invention are possible without departing from the spirit and scope of the invention.

[0093] Reference number

[0094] 100 UV-C Air Guiding Shield Device

[0095] 110 Air Guiding Cover

[0096] 110a Air guide hood 110 inlet end

[0097] 110b Air guide hood 110 outlet end

[0098] 111 First side plate of air guide shroud 110

[0099] 111a Mounting bracket for the first side plate 111

[0100] 112 The second side plate of the air guide shroud 110

[0101] 112a Mounting bracket for the second side plate 112

[0102] 113 Air guiding section of air guide shroud 110

[0103] 113a Mounting part of air guide section 113

[0104] 113b The outline of the air guide section 113

[0105] 113c Air guide section 113 outlet section

[0106] 113d Mounting surface of mounting part 113a

[0107] 113e Inner surface of air guide section 113

[0108] 120 Mounting Plate

[0109] 121 Mounting plate 120 radiator mounting surface

[0110] 122 Mounting plate 120 UV light module mounting surface

[0111] 123 Mounting plate 120 first mounting end

[0112] 124 Mounting plate 120 second mounting end

[0113] 130 air guide shroud 110 radiator

[0114] 131 Multiple fins of radiator 130

[0115] 132 Mounting surface of radiator 130

[0116] The upper part of multiple fins 133 and 131

[0117] The lower part of multiple fins 134 131

[0118] 140 Air Guide Shield 110 UV Light Module

[0119] More than 141 UV LEDs

[0120] 141a, 141b,… Individual UV LEDs

[0121] 142 UV light module 140 PCB board

[0122] 142a Mounting surface of PCB board 142

[0123] 142b is the input terminal for LED lights.

[0124] 142c is used for the input terminal of LED heat sinks.

[0125] 150 control module

[0126] 151 Main body of control module 150

[0127] 152 The cover of the main body 151

[0128] 153 The inner cavity of the main body 151

[0129] 155 Control Board

[0130] More than 160 LED heat sinks

[0131] 161 LED heat sinks in 160

[0132] 162 LED heat sink 161 multiple fins

[0133] 163 LED heat sink 161 base

[0134] 164 Mounting surface of base 163

[0135] 165 Outer surface of base 163

[0136] 200 HVAC duct

[0137] 210 Top component of pipe 200

[0138] 210a Inner surface of top member 210

[0139] 211 First side component of pipe 200

[0140] 212 Second side component of pipe 200

[0141] 212a Inner surface of the second side member 212

[0142] 212b Outer surface of the second side member 212

[0143] 213 Bottom component of pipe 200

[0144] 213a Inner surface of bottom member 213

[0145] 214 Inlet end of pipe 200

[0146] 215 Pipeline 200 outlet end

[0147] 300 power supply

[0148] 300A external VAC power supply

[0149] 301 Sensor Board

[0150] 302 microcontroller

[0151] 303 Low-pass filter

[0152] 304 Adjustable Boost Converter

[0153] 305 Low-pass Filter

[0154] 306 Linear Current Control

[0155] 307 Pulse Width Modulation (PWM) Signal Generator

[0156] 308 PWM

[0157] 309 PWM

[0158] 310 PWM x3

[0159] 311 Internal Integrated Circuit (I2C)

[0160] 312 indicator

[0161] 313 Alarm

[0162] 314 NTC Thermistors and Resistors

[0163] 314A resistor

[0164] 314b NTC thermistor

[0165] 315 NTC Thermistor

[0166] 316 NTC Thermistor

[0167] 317 PCB (Printed Circuit Board) MCU

[0168] 318 I2C

[0169] 319 Analog-to-Digital Converter (ADC)

[0170] 320 18-pin connector

[0171] 321 18-pin connector

[0172] 322 4-pin connector

[0173] 323 4-pin connector

[0174] 324 ADC x12

[0175] 325 ADC x3

[0176] 326 ADC x2

[0177] 327 Universal Asynchronous Receiver / Transmitter (UART)

[0178] 328 5V step-down regulator

[0179] 329 2-pin connector

[0180] B UV-C air guide hood device 100 branch plane

[0181] H1 heat

[0182] H2 heat / airflow temperature

[0183] IA enters the air

[0184] LF is the lower airflow from the incoming air in branch B.

[0185] LTA lower-level treated air

[0186] UF is the upper airflow from the incoming air in branch B.

[0187] UTA upper-processed air

[0188] UV light

Claims

1. An air sanitizing device arranged within an HVAC duct, comprising: an air directing shroud arranged on a surface of the HVAC duct, the air directing shroud having an inlet end and an outlet end, the air directing shroud having a bracket extending distally from the air directing shroud; a UV light module secured to the bracket, the UV light module having a temperature sensor; a heat sink secured to the UV light module and proximate to the outlet end; and, a control board in communication with the UV light module, the controller board having a microprocessor in communication with an ambient temperature sensor and a heat source temperature sensor proximate to an external heat source, the microprocessor in communication with the temperature sensor of the UV light module.

2. The air disinfection device arranged within the HVAC duct of claim 1, wherein, the UV light module is secured to a PCB (printed circuit board), the UV light module comprising a plurality of LED light modules, each of the plurality of LED light modules arranged to emit UV-C.

3. The air disinfection device arranged within the HVAC duct of claim 1, wherein, the heat sink further comprising: a plurality of fins arranged to extend beyond the UV light module, the plurality of fins having an upper portion and a lower portion, wherein the upper portion and the lower portion of the plurality of fins are secured to the bracket and further arranged perpendicular to a pair of mounting faces of the bracket, wherein the upper portion of the plurality of fins is disposed within the air directing shroud and the lower portion of the plurality of fins extends beyond the outlet end of the air directing shroud.

4. The air disinfection device arranged within the HVAC duct of claim 2, wherein, the UV light module further comprising a plurality of individual heat sinks secured to the PCB, each of the plurality of individual heat sinks disposed adjacent to each of the plurality of LED light modules.

5. The air disinfection device arranged within the HVAC duct of claim 1, wherein, the air directing shroud arranged to partially obstruct air passing through the duct and direct the obstructed air over the heat sink.

6. The air disinfection device arranged within the HVAC duct of claim 1, wherein, the microcontroller communicates to the UV light module to turn on when the temperatures collected by the ambient temperature sensor and the heat source temperature sensor are close in degrees.

7. The air disinfection device arranged within the HVAC duct of claim 6, wherein, the microcontroller communicates to the UV light module to turn off when the temperatures collected by the ambient temperature sensor and the heat source temperature sensor are far apart in degrees.

8. The air disinfection device arranged within the HVAC duct of claim 1, wherein, the control board housed in a control module, the control module arranged on the HVAC duct, the control module in electrical communication with an external power source, the control module in electrical communication with the UV light module.

9. An air sanitizing device arranged within an HVAC duct, comprising: an air directing shroud arranged on a surface of the HVAC duct, the air directing shroud having an inlet end and an outlet end, the air directing shroud having a bracket extending distally from the air directing shroud; a UV light module secured to the bracket, the UV light module having a temperature sensor; a heat sink secured to the UV light module and proximate to the outlet end; and, a control board in communication with the UV light module, the controller board having a microprocessor in communication with an ambient temperature sensor and a heat source temperature sensor proximate to an external heat source, the microprocessor in communication with the temperature sensor of the UV light module. a control board in communication with the UV light module, the control board having a microprocessor in communication with an ambient temperature sensor and a heat source temperature sensor disposed proximate an external heat source, the microprocessor in communication with the temperature sensor of the UV light module, wherein the air directing shroud is arranged to partially obstruct air passing through the duct and direct the obstructed air over the heat sink, wherein when the temperatures collected by the ambient temperature sensor and the heat source temperature sensor are close in degrees, the microcontroller communicates to the UV light module to turn on.

10. The air sanitization device arranged within the HVAC duct of claim 9, wherein the UV light module secured to a PCB (printed circuit board), the UV light module comprising a plurality of LED light modules, each of the plurality of LED light modules arranged to emit UV-C, wherein the air directing shroud is arranged to partially obstruct air passing through the duct and direct the obstructed air over the heat sink.

11. The air disinfection device arranged within the HVAC duct of claim 9, wherein, the heat sink further comprising: a plurality of fins arranged to extend beyond the UV light module, the plurality of fins having an upper portion and a lower portion, wherein the upper portion and the lower portion of the plurality of fins are secured to the bracket and further arranged perpendicular to a pair of mounting faces of the bracket, wherein the upper portion of the plurality of fins is disposed within the air directing shroud and the lower portion of the plurality of fins extends beyond the exit end of the air directing shroud.

12. The air disinfection device arranged within the HVAC duct of claim 10, wherein, the UV light module further comprising a plurality of individual heat sinks secured to the PCB, each of the plurality of individual heat sinks disposed adjacent to each of the plurality of LED light modules.

13. An air sanitization device arranged within an HVAC duct, comprising: an air directing shroud having an inlet end and an exit end, the air directing shroud having a bracket extending distally from the air directing shroud; a UV light module mounted on a PCB (printed circuit board), the PCB secured to the bracket, the UV light module having a temperature sensor, the UV light module having a plurality of individual heat sinks arranged thereon; a heat sink secured to the UV light module proximate the exit end; and a control board in communication with the UV light module, the control board having a microprocessor in communication with an ambient temperature sensor and a heat source temperature sensor disposed proximate an external heat source, the microprocessor in communication with the temperature sensor of the UV light module. the air directing shroud arranged on a surface of the HVAC duct.

14. The air disinfection device arranged within the HVAC duct of claim 13, wherein, the heat sink comprising a plurality of fins, a portion of the plurality of fins disposed within the air directing shroud and an opposing portion of the plurality of fins disposed outside of the exit end.

15. The air disinfection device arranged within the HVAC duct of claim 13, wherein, each of the plurality of individual heat sinks comprising a plurality of fins.

16. The air disinfection device arranged within the HVAC duct of claim 13, wherein, the UV light module further comprising a plurality of LED heat sinks secured to the PCB, each of the plurality of individual heat sinks disposed adjacent to each of the plurality of LED light modules.

17. The air disinfection device arranged within the HVAC duct of claim 15, wherein, the air directing shroud arranged on a surface of the HVAC duct. the heat sink comprising a plurality of fins, a portion of the plurality of fins disposed within the air directing shroud and an opposing portion of the plurality of fins disposed outside of the exit end. each of the plurality of individual heat sinks comprising a plurality of fins. the UV light module further comprising a plurality of LED heat sinks secured to the PCB, each of the plurality of individual heat sinks disposed adjacent to each of the plurality of LED light modules.

18. The air sanitization device disposed within the HVAC duct of claim 13, wherein when the temperatures collected by the ambient temperature sensor and the heat source temperature sensor are close in reading, the microcontroller communicates to the UV light module to turn on, wherein when the temperatures collected by the ambient temperature sensor and the heat source temperature sensor are far apart in degrees, the microcontroller communicates to the UV light module to turn off.

19. The air disinfection device arranged within the HVAC duct of claim 13, wherein, the control board is housed in a control module, the control module is disposed on the HVAC duct, the control module is in electrical communication with an external power source, the control module is in electrical communication with the UV light module.

20. A method of sanitizing air flow within an HVAC duct, comprising the steps of: exposing incoming air within the HVAC duct to UV light with the device of claim 1 ; branching the incoming air with an air directing shroud of the device; and, directing the branched air to a heat sink of the device with the air directing shroud.

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