A cleaning and drying device for circuit board processing

Abstract

This invention discloses a cleaning and drying device for circuit board processing, relating to the field of integrated circuit manufacturing technology. It includes: a tank, a main frame within the tank, a secondary frame snapped onto the main frame, an elastic mesh fixedly connected to the main frame, a main flipping frame rotatably connected to the upper part of the secondary frame, a main connecting cylinder rotatably connected to the main flipping frame, a secondary flipping frame rotatably connected to the lower part of the secondary frame, a secondary connecting cylinder rotatably connected to the secondary flipping frame, and an electrical connection mesh fixedly connected between the secondary connecting cylinder and the main connecting cylinder. This invention, by controlling the spacing between the elastic mesh and the electrical connection mesh, can maintain the electrical connection of the circuit board during electroplating and, during cleaning, increase the spacing between the elastic mesh and the electrical connection mesh, reducing obstruction to the circuit board surface and facilitating cleaning. Thus, it achieves thorough cleaning of the circuit board while removing the electroplating solution, eliminating the need for additional cleaning operations before the next process, simplifying the production process, and improving production efficiency.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a cleaning and drying apparatus for circuit board processing. Background Technology

[0002] Printed circuit boards (PCBs) enable the miniaturization of circuits and make their wiring structure clearer, playing a crucial role in the mass production of fixed circuits and the optimization of circuit layout. Based on the mechanical properties of the substrate, PCBs can be divided into two main categories: flexible boards and rigid boards. A typical production process for flexible PCBs includes processes such as material preparation, drilling, blackening treatment, electroplating, and dry film application. During electroplating, fixtures are used to fix the edges of the PCB to a frame to maintain its flatness and ensure electrical connection. The frame is then immersed in the electroplating solution for electroplating. After electroplating, a cleaning operation is required to remove residual electroplating solution components from the PCB. However, due to the presence of cleaning dead zones in the contact area between the fixture and the PCB, some residual components are difficult to completely remove. Therefore, an additional cleaning step must be added before proceeding to the dry film process. This process not only increases the complexity of the process but also reduces overall production efficiency. Summary of the Invention

[0003] This invention provides a cleaning and drying device for circuit board processing, which overcomes the shortcomings of complex circuit board production processes and low overall production efficiency.

[0004] Technical solution: A cleaning and drying device for circuit board processing, comprising: a tank, a drying module installed in the tank, a main frame disposed in the tank, a sub-frame snapped onto the main frame, an elastic mesh fixedly connected to the main frame, a main flipping frame rotatably connected to the upper part of the sub-frame, a main connecting cylinder rotatably connected to the main flipping frame, a limiting rod slidably connected to the sub-frame for limiting the main flipping frame, a sub-flipping frame rotatably connected to the lower part of the sub-frame, a torsion spring fixedly connected between the sub-flipping frame and the sub-frame, a sub-connecting cylinder rotatably connected to the sub-flipping frame, an electrical connection network fixedly connected between the sub-connecting cylinder and the main connecting cylinder, and an electrical connection component disposed on the sub-frame for electrically connecting the electrical connection network to the circuit board.

[0005] Furthermore, the electrical connection assembly includes: a support base and abutment balls, the number of the support base and the abutment balls are equal and there are several of each, the support base is disposed on the node of the elastic mesh, the abutment balls are fixed to the node of the electrical connection mesh, the nodes of the elastic mesh and the electrical connection mesh correspond one-to-one, and the support base and the abutment balls are used to jointly clamp the circuit board.

[0006] Furthermore, the tank is equipped with an electroplating tank and a cleaning tank. The tank is fixedly connected with multiple hanging plate frames and multiple hanging material frames. All the hanging plate frames and all the hanging material frames are staggered. The hanging plate frames and the hanging material frames are all located above the electroplating tank. The tank is equipped with multiple hanging plate frames. The hanging plate frames are located inside the cleaning tank. The hanging plate frames and the hanging plate frames are used to support the main frame.

[0007] Furthermore, uniformly distributed limiting ropes are fixed between the edge of the electrical interconnect and the sub-frame, and the limiting ropes are used to limit the circuit board between the elastic net and the electrical interconnect.

[0008] Furthermore, a shielding spring is fixed to the side of the abutting ball away from the adjacent support seat. The shielding spring is used to wrap the adjacent abutting ball together with the adjacent support seat and circuit board.

[0009] Furthermore, the elastic coefficient of the shielding element is less than that of the elastic net.

[0010] Furthermore, the thickness of the shielding element near the adjacent support is greater than the thickness of the rest.

[0011] Furthermore, the elastic net is composed of warp and weft strips. The weft strips of the elastic net are fixedly connected to the adjacent support bases, and the warp strips of the elastic net are limited by the adjacent support bases. Two locking rods are provided on the elastic net, and the two locking rods are jointly fixedly connected to equidistant support ropes. One of the locking rods is locked to the warp strips of the elastic net, and the other locking rod is used to lock to the electrical interconnection network.

[0012] Furthermore, the hanging plate frame is rotatably connected to the tank body, and the hanging plate frame is inclined relative to the vertical plane to create an angle of less than 90° between the circuit board and the horizontal plane. The tank body is fixedly connected to a liquid extraction pipe that communicates with the cleaning tank. A delivery pump is installed on the liquid extraction pipe. The liquid extraction pipe is connected to equidistantly distributed branch pipes. The branch pipes pass through the tank body and are located inside the cleaning tank. Equidistantly distributed water spray holes are provided on the upper side of the branch pipes located inside the cleaning tank.

[0013] Furthermore, the groove is equipped with a motor, the output shaft of which is collinear with the swing axis of the adjacent hanging plate frame, the output shaft of which is fixedly connected to the adjacent hanging plate frame, and all the hanging plate frames are hinged together by a connecting rod.

[0014] The present invention discloses the following technical effects: By controlling the spacing between the elastic mesh and the electrical interconnect, the present invention can maintain the electrical connection state of the circuit board during the electroplating process, and increase the spacing between the elastic mesh and the electrical interconnect during the cleaning of the circuit board, thereby reducing the obstruction of the circuit board surface and facilitating the cleaning of the circuit board. In this way, the circuit board is thoroughly cleaned while removing the electroplating solution, eliminating the need for additional cleaning operations before the next process, simplifying the production process, and improving production efficiency.

[0015] By relying on the shielding spring, support base and circuit board to shield the abutting ball, the abutting ball is separated from the electroplating solution, and copper ions in the electroplating solution are prevented from adhering to the surface of the abutting ball. In this way, the rate at which the plating layer adheres to the surface of the abutting ball is slowed down, and the resistance at the contact position between the abutting ball and the circuit board is kept stable.

[0016] The water in the cleaning tank flows from bottom to top using a delivery pump and branch pipes. The water jets in the branch pipes provide the initial velocity of the water flow, causing the water flow formed by the cleaning fluid to blow the circuit board upwards. This causes the circuit board to lose contact with the elastic mesh or electrical interconnection on its lower side, thus eliminating the obstruction on the side of the circuit board that is being washed by the water flow and improving the cleaning efficiency of the circuit board. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the hanging plate frame and the hanging material frame of the present invention;

[0019] Figure 3 This is a three-dimensional structural diagram of the sub-frame and electrical interconnection of the present invention;

[0020] Figure 4 This is an exploded view of the main frame, sub-frame, and snap-fit ​​rod of the present invention;

[0021] Figure 5 This is a three-dimensional structural cross-sectional view of the sub-frame and main connecting cylinder of the present invention;

[0022] Figure 6 This is a three-dimensional structural cross-sectional view of the sub-frame and sub-connecting cylinder of the present invention;

[0023] Figure 7 This is a three-dimensional structural diagram of the support base and the abutment ball of the present invention;

[0024] Figure 8 This is a three-dimensional structural diagram of the increased spacing between the elastic mesh and the electrical interconnection mesh of the present invention;

[0025] Figure 9 This is a three-dimensional structural diagram of the liquid extraction tube and connecting rod of the present invention.

[0026] In the diagram: 1. Tank body; 101. Electroplating tank; 102. Cleaning tank; 2. Drying module; 3. Main frame; 4. Sub-frame; 5. Elastic net; 6. Main flipping frame; 7. Main connecting cylinder; 8. Limiting rod; 9. Sub-flipping frame; 10. Torsion spring; 11. Sub-connecting cylinder; 12. Electrical connection network; 13. Support base; 14. Abutment ball; 15. Hanging plate frame; 16. Hanging rack; 17. Hanging plate frame; 18. Limiting rope; 19. Blocking spring; 20. Clip rod; 21. Support rope; 22. Liquid extraction pipe; 23. Transfer pump; 24. Branch pipe; 25. Motor; 26. Connecting rod. Detailed Implementation

[0027] To make the above features and advantages of the present invention more readily understood, specific embodiments are described below in conjunction with the accompanying drawings, but the present invention is not limited thereto.

[0028] Example 1: This example provides a cleaning and drying device for circuit board processing to solve the problems of complex circuit board production processes and low overall production efficiency in the prior art.

[0029] See Figure 1 and Figure 2 A cleaning and drying device for circuit board processing includes: a tank 1, a drying module 2 installed in the tank 1, the drying module 2 being an existing device that can spray hot air downwards during use; an electroplating tank 101 and a cleaning tank 102 are respectively arranged in the left and right parts of the tank 1, both the electroplating tank 101 and the cleaning tank 102 are provided with liquid inlet pipes and liquid outlet pipes; two hanging plate frames 15 and three hanging material racks 16 are fixedly connected to the tank 1, all the hanging plate frames 15 and all the hanging material racks 16 are staggered, the hanging plate frames 15 and the hanging material racks 16 are all located above the electroplating tank 101, the hanging material racks 16 are used to hang electroplating consumables, the tank 1 is provided with three hanging plate frames 17, the hanging plate frames 17 are located in the cleaning tank 102, the hanging plate frames 15 and the hanging plate frames 17 are all used to build the main frame 3.

[0030] See Figure 1 and Figures 3 to 8 The tank 1 contains a main frame 3, which is snapped into a secondary frame 4. An elastic mesh 5, which can be made of fluororubber, is fixedly connected to the main frame 3. The upper part of the secondary frame 4 is rotatably connected to a main tilting frame 6 (see...). Figure 5The main rotating frame 6 can rotate up to 90° through the special shape of the round rod and the main rotating frame 6. The main rotating frame 6 is rotatably connected to the main connecting cylinder 7. The sub-frame 4 is slidably connected to the limiting rod 8 for limiting the main rotating frame 6. The lower part of the sub-frame 4 is rotatably connected to the sub-rotating frame 9. The sub-rotating frame 9 and the sub-frame 4 are fixedly connected to the torsion spring 10. The torsion spring 10 is always in a charged state, so that the sub-rotating frame 9 has a tendency to rotate forward. The sub-rotating frame 9 is rotatably connected to the sub-connecting cylinder 11. The sub-connecting cylinder 11 and the main connecting cylinder 7 are fixedly connected to the electrical network 12. The minimum distance between the central axis of the main connecting cylinder 7 and the swing axis of the main rotating frame 6 is equal to the minimum distance between the central axis of the sub-connecting cylinder 11 and the swing axis of the sub-rotating frame 9. The sub-frame 4 is provided with an electrical connection component for electrically connecting the electrical network 12 to the circuit board.

[0031] The above settings enable the circuit board to maintain its electrical connection during electroplating by controlling the spacing between the elastic mesh 5 and the electrical interconnect 12. Furthermore, by increasing the spacing between the elastic mesh 5 and the electrical interconnect 12 during circuit board cleaning, the circuit board surface is less obstructed, facilitating cleaning. This allows for thorough cleaning of the circuit board while removing the electroplating solution, eliminating the need for additional cleaning before the next process, simplifying the production process, and improving production efficiency.

[0032] See Figure 7 The electrical connection assembly includes: a support base 13 and an abutment ball 14. The number of nodes in the elastic net 5 and the electrical connection net 12 are equal and correspond one-to-one. The support base 13 and the abutment ball 14 are used to clamp the circuit board together. The number of support bases 13 and abutment balls 14 is equal to the number of nodes on the elastic net 5. The support base 13 is set on the node of the elastic net 5, and the abutment ball 14 is fixed to the node of the electrical connection net 12. The support base 13 is used to support the circuit board and provides stable support for the circuit board when the abutment ball 14 squeezes the circuit board. The circuit board is electrically connected to the adjacent hanging plate frame 15 through the abutment ball 14, the electrical connection net 12, the main connecting cylinder 7, the secondary connecting cylinder 11, the main flipping frame 6, the secondary flipping frame 9, the secondary frame 4, and the main frame 3.

[0033] See Figures 4 to 6 A uniformly distributed limiting rope 18 is fixed between the edge of the electrical interconnect 12 and the sub-frame 4. The limiting rope 18 is used to limit the circuit board between the elastic mesh 5 and the electrical interconnect 12, and to prevent the circuit board from falling out of the gap between the sub-frame 4 and the electrical interconnect 12 when the distance between the elastic mesh 5 and the electrical interconnect 12 increases.

[0034] See Figure 7A blocking spring 19 is fixed to the front half of the abutment ball 14. The blocking spring 19 is made of closed-cell foam. The blocking spring 19, together with the adjacent support base 13 and circuit board, wraps the front half of the adjacent abutment ball 14. The state of the blocking spring 19 shown in the attached figure is the deformed state. In this state, the plane on the rear side of the blocking spring 19 intersects with the adjacent abutment ball 14. When the blocking spring 19 is not under force, the rear side of the blocking spring 19 is located behind the adjacent abutment ball 14, that is... The plane on the rear side of the shielding spring 19 does not intersect with the adjacent abutting ball 14; in the electrical connection channel composed of abutting ball 14, electrical network 12, main connecting cylinder 7, secondary connecting cylinder 11, main flipping frame 6, secondary flipping frame 9, secondary frame 4 and main frame 3, the remaining surfaces except for the electrical connection points of adjacent parts are coated with an insulating coating to reduce the adhesion of copper during the electroplating process; the elastic coefficient of the shielding spring 19 is less than the elastic coefficient of the elastic network 5 to ensure that the abutting ball 14 can contact the circuit board.

[0035] The above setup enables the shielding spring 19 to work together with the support base 13 and the circuit board to shield the contact ball 14, separating the contact ball 14 from the electroplating solution and preventing copper ions in the electroplating solution from adhering to the surface of the contact ball 14. This slows down the rate at which the plating layer adheres to the surface of the contact ball 14, thus maintaining the stability of the resistance at the contact position between the contact ball 14 and the circuit board.

[0036] See Figure 7 The thickness of the rear part of the shielding spring 19 is greater than the thickness of the rest of the part. This is to keep the shape of the rear part of the shielding spring 19 unchanged when it is compressed, so as to ensure good contact between the shielding spring 19 and the support base 13 or the circuit board, and improve the reliability of separating the abutment ball 14 from the electroplating solution.

[0037] Cleaning and drying process: Keep the sub-frame 4 flat and place the circuit board with black hole treatment on the upper surface of the electrical connection 12. The circuit board is in contact with the rear side of the shielding spring 19. Adjust the position of the circuit board so that the holes on the circuit board are misaligned with the shielding spring 19. Then move the main frame 3 to directly above the sub-frame 4 and then move it down until the main frame 3 and the sub-frame 4 are engaged. At this time, the circuit board is located between the elastic mesh 5 and the electrical connection 12.

[0038] As the main frame 3 moves closer to the sub-frame 4, the main frame 3 causes the elastic mesh 5 and the support base 13 to move downwards, reducing the distance between the support base 13 and the circuit board. Eventually, the support base 13 contacts the circuit board. As the main frame 3 continues to move downwards, the main frame 3, through the elastic mesh 5 and the support base 13, squeezes the circuit board downwards, causing the circuit board to squeeze the shielding spring 19 and deform the shielding spring 19 until the circuit board contacts the abutting ball 14. The abutting ball 14 and the adjacent support base 13 together clamp and fix the circuit board. At this point, neither the support base 13 nor the circuit board moves. As the main frame 3 continues to move downwards, the main frame 3 pulls the elastic mesh 5 to deform, and finally the main frame 3 and the sub-frame 4 are engaged, thus completing the fixation of the circuit board.

[0039] Electroplating solution is injected into the electroplating tank 101, and the frame (hereinafter referred to as the frame, which is the whole consisting of the main frame 3 and all the parts on it) is erected on the hanging plate frame 15. Electroplating consumables are erected on the hanging material rack 16. At this time, the power is turned on and electroplating begins. After the electroplating is completed, the frame is removed from the electroplating tank 101, and the limiting rod 8 is pulled to release the limiting rod 8 from the adjacent main flipping frame 6. The auxiliary flipping frame 9 flips under the action of the torsion spring 10, so that the auxiliary flipping frame 9 pulls the main flipping frame 6 to flip together through the auxiliary connecting cylinder 11, the electrical network 12 and the main connecting cylinder 7. At 90°, the distance between the electrical interconnect 12 and the elastic mesh 5 increases, and the support base 13 and the abutment ball 14 lose contact with the circuit board, and the shape of the shielding spring 19 is restored; the frame is erected on the hanging plate frame 17, and cleaning fluid is injected into the cleaning tank 102. At this time, the circuit board is immersed in the cleaning fluid, and the electroplating solution is removed from the surface of the circuit board. After cleaning is completed, the cleaning fluid in the cleaning tank 102 is completely extracted, and the drying module 2 is turned on, so that the drying module 2 blows hot air onto the surface of the circuit board to dry the circuit board. Finally, the drying module 2 is stopped.

[0040] Example 2: This example is a further optimization based on Example 1 to provide the function of accommodating multiple circuit boards at the same time (the present invention takes the ability to process two circuit boards at the same time within a single frame as an example).

[0041] See Figure 3 , Figure 4 and Figure 7 The elastic net 5 is composed of warp and weft strips. The weft strips of the elastic net 5 are fixed to the adjacent support base 13, while the warp strips of the elastic net 5 are limited but not fixed by the adjacent support base 13. Two locking rods 20 are provided on the elastic net 5. The two locking rods 20 are fixed together with equidistantly distributed support ropes 21. One locking rod 20 is locked to the warp strip of the elastic net 5, and the other locking rod 20 is used to lock to the electrical connection network 12. The two circuit boards between the elastic net 5 and the electrical connection network 12 are separated by multiple support ropes 21 to prevent the two circuit boards from overlapping during the cleaning process. This increases the number of circuit boards that can be processed at one time and enhances practicality.

[0042] Example 3: This example is an optimization based on Example 2 to enhance the cleaning effect on the circuit board.

[0043] See Figure 9 The hanging frame 17 is rotatably connected to the tank 1, and the hanging frame 17 is inclined relative to the vertical plane to make the circuit board have an angle of less than 90° with the horizontal plane. The tank 1 is fixedly connected to the liquid extraction pipe 22, which is connected to the upper part of the cleaning tank 102. The liquid extraction pipe 22 is equipped with a delivery pump 23. The number of delivery pumps 23 is determined according to the shape of the liquid extraction pipe 22. In this invention, the number of delivery pumps 23 is two. The liquid extraction pipe 22 is connected to equidistantly distributed branch pipes 24. The branch pipes 24 are L-shaped and consist of a horizontal part and a vertical part. The horizontal part of the branch pipe 24 passes through the tank 1 and is located at the bottom of the cleaning tank 102. The upper side of the horizontal part of the branch pipe 24 is provided with equidistantly distributed water spray holes.

[0044] The above setup enables the water in the cleaning tank 102 to flow from bottom to top using the delivery pump 23 and the branch pipe 24, and uses the spray holes of the branch pipe 24 to give the water flow an initial velocity, so that the water flow formed by the cleaning liquid blows the circuit board upward, causing the circuit board to lose contact with the elastic mesh 5 or electrical interconnect 12 on its lower side. This eliminates the obstruction on the side of the circuit board that is being washed by the water flow, and improves the cleaning efficiency of the circuit board.

[0045] See Figure 1 and Figure 9 The tank 1 is equipped with a motor 25. The output shaft of the motor 25 is collinear with the swing axis of the adjacent hanging plate frame 17. The output shaft of the motor 25 is fixedly connected to the adjacent hanging plate frame 17. All hanging plate frames 17 are hinged together with a connecting rod 26. The motor 25 drives the hanging plate frame 17 to swing, thereby changing the tilt direction of the circuit board. In this way, the side of the water flow is switched to ensure the comprehensive cleaning of the circuit board.

[0046] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A cleaning and drying device for processing circuit boards, characterized in that it comprises: a groove body (1) provided with a drying module (2), a main frame (3) arranged in the groove body (1), a sub-frame (4) clamped to the main frame (3), an elastic net (5) fixed to the main frame (3), a main turnover frame (6) rotationally connected to the upper part of the sub-frame (4), a main connecting cylinder (7) rotationally connected to the main turnover frame (6), a limiting rod (8) slidingly connected to the sub-frame (4) for limiting the main turnover frame (6), a sub-turnover frame (9) rotationally connected to the lower part of the sub-frame (4), a torsional spring (10) fixed between the sub-turnover frame (9) and the sub-frame (4), a sub-connecting cylinder (11) rotationally connected to the sub-turnover frame (9), an electrically connected net (12) fixed between the sub-connecting cylinder (11) and the main connecting cylinder (7), and an electrically connected assembly arranged on the sub-frame (4) for electrically connecting the electrically connected net (12) and the circuit board. The electrically connected assembly comprises: a plurality of support seats (13) and a plurality of abutting balls (14), the support seats (13) and the abutting balls (14) are equal in number and are several in number, the support seats (13) are arranged at the nodes of the elastic net (5), the abutting balls (14) are fixed at the nodes of the electrically connected net (12), the nodes of the elastic net (5) and the electrically connected net (12) correspond one by one, and the support seats (13) and the abutting balls (14) are used for jointly clamping the circuit board.

2. The cleaning and drying apparatus for processing a wiring board according to claim 1, wherein The groove body (1) is provided with an electroplating tank (101) and a cleaning tank (102), the groove body (1) is fixed with a plurality of hanging plate racks (15) and a plurality of hanging material racks (16), all the hanging plate racks (15) and all the hanging material racks (16) are staggered, the hanging plate racks (15) and the hanging material racks (16) are located above the electroplating tank (101), the groove body (1) is provided with a plurality of hanging plate frames (17), the hanging plate frames (17) are located in the cleaning tank (102), and the hanging plate racks (15) and the hanging plate frames (17) are used for supporting the main frame (3). Uniformly distributed limiting ropes (18) are fixed between the edges of the electrically connected net (12) and the sub-frame (4), and the limiting ropes (18) are used for limiting the circuit board between the elastic net (5) and the electrically connected net (12).

3. A cleaning and drying apparatus for circuit board processing according to claim 1, characterized in that, The abutting ball (14) is fixed with a shielding elastic member (19) away from the side of the adjacent support seat (13), and the shielding elastic member (19) is used for wrapping the adjacent abutting ball (14) together with the adjacent support seat (13) and the circuit board.

4. The cleaning and drying apparatus for processing a wiring board according to claim 2, wherein The elastic coefficient of the shielding elastic member (19) is smaller than the elastic coefficient of the elastic net (5).

5. The cleaning and drying apparatus for processing a wiring board according to claim 2, wherein The thickness of the shielding elastic member (19) near the position of the adjacent support seat (13) is greater than the thickness of the remaining part.

6. The cleaning and drying apparatus for processing a wiring board according to claim 5, wherein ​ 7. A cleaning and drying apparatus for circuit board processing according to claim 5, characterized in that, ​ 8. The cleaning and drying apparatus for processing a wiring board according to claim 5, wherein The elastic net (5) is composed of warp and weft, the weft of the elastic net (5) is fixedly connected with the adjacent support seat (13), the warp of the elastic net (5) is limited by the adjacent support seat (13), two clamping rods (20) are arranged on the elastic net (5), the two clamping rods (20) are fixedly connected with equidistantly distributed support ropes (21), one of the clamping rods (20) is clamped with the warp of the elastic net (5), and the other clamping rod (20) is used for clamping with the electric network (12).

9. The cleaning and drying apparatus for processing a wiring board according to claim 3, wherein The hanging plate frame (17) is rotationally connected with the groove body (1), and the hanging plate frame (17) is in an inclined state compared with the vertical plane, so that an included angle between the circuit board and the horizontal plane is less than 90°, the groove body (1) is fixedly connected with a liquid pumping pipe (22) communicated with the cleaning groove (102), the liquid pumping pipe (22) is provided with a conveying pump (23), the liquid pumping pipe (22) is communicated with equidistantly distributed branch pipes (24), the branch pipes (24) pass through the groove body (1) and are located in the cleaning groove (102), and equidistantly distributed water injection holes are arranged on the upper side of the position of the branch pipes (24) in the cleaning groove (102).

10. A cleaning and drying apparatus for circuit board processing according to claim 9, characterized in that, The groove body (1) is provided with a motor (25), an output shaft of the motor (25) is collinear with an oscillation axis of the adjacent hanging plate frame (17), the output shaft of the motor (25) is fixedly connected with the adjacent hanging plate frame (17), and all the hanging plate frames (17) are hingedly connected with a connecting rod (26).

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